CN113613476A - Loop heat pipe for cooling airborne electronic equipment - Google Patents
Loop heat pipe for cooling airborne electronic equipment Download PDFInfo
- Publication number
- CN113613476A CN113613476A CN202111078863.7A CN202111078863A CN113613476A CN 113613476 A CN113613476 A CN 113613476A CN 202111078863 A CN202111078863 A CN 202111078863A CN 113613476 A CN113613476 A CN 113613476A
- Authority
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- China
- Prior art keywords
- electronic equipment
- cooling
- evaporator
- liquid
- heat pipe
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 36
- 239000007788 liquid Substances 0.000 claims abstract description 45
- 238000001704 evaporation Methods 0.000 claims abstract description 37
- 230000008020 evaporation Effects 0.000 claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims description 17
- 239000000446 fuel Substances 0.000 claims description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical group N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 4
- 230000009977 dual effect Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims description 2
- 238000004781 supercooling Methods 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a loop heat pipe for cooling airborne electronic equipment, and belongs to the field of cooling of airborne electronic equipment. The system comprises a condenser, a liquid compensator, a driving pump, a liquid header, an evaporation branch and a steam header which are sequentially connected and form a loop; the evaporation branch between the liquid header and the steam header is connected in parallel, and an evaporator is arranged between the evaporation branch and the liquid header on each evaporation branch. The invention can quickly take away the heat emitted by the electronic equipment, maintain the electronic equipment at a lower working temperature and ensure that the electronic equipment can stably and efficiently run.
Description
Technical Field
The invention relates to a loop heat pipe for cooling airborne electronic equipment, and belongs to the field of cooling of airborne electronic equipment.
Background
With the rapid development of aviation highly integrated circuit technology, the electronic device as an aviation payload has higher and higher performance, and meanwhile, the problems of energy consumption and heat dissipation are more and more prominent. The data shows that the electronic equipment heat load of the 3 rd generation of fighter F-15 is about 10kW magnitude, and the electronic equipment heat load of the 4 th generation of fighter F-22 reaches 50kW magnitude. In fact, the reliability of electronic devices is very sensitive to temperature, and at the level of 70-80 ℃, the reliability of electronic devices decreases by 5% for every 1 ℃ increase in temperature; over 55% of electronic devices fail due to excessive temperatures, and heat dissipation has become a bottleneck limiting the development of avionics. Aiming at the problem of the heat dissipation of the onboard high-power-density energy in the future, innovative technology must be sought to meet the requirement of the onboard electronic equipment on high heat-flow-density rapid heat dissipation.
In order to solve the problem of heat dissipation of high-power electronic equipment on an airplane in the future, the invention provides a loop heat pipe for cooling airborne electronic equipment, so that heat dissipated by the electronic equipment can be taken away quickly, the electronic equipment is kept at a lower working temperature, and the electronic equipment can operate stably and efficiently.
Disclosure of Invention
The invention aims to provide a loop heat pipe for cooling airborne electronic equipment, which transfers heat emitted by the airborne electronic equipment to cooling air or fuel oil heat sink so that the electronic equipment can stably and efficiently operate.
A loop heat pipe for cooling airborne electronic equipment comprises a condenser 1, a liquid compensator 2, a driving pump 3, a liquid header 4, an evaporation branch 5 and a steam header 6 which are sequentially connected and form a loop; wherein the evaporation branches 5 between the liquid header 4 and the vapor header 6 are connected in parallel, and on each evaporation branch 5, an evaporator 7 is arranged between the evaporation branches 5 and the liquid header 4.
Working medium in the loop heat pipe for cooling the airborne electronic equipment flows out of the condenser 1 under the dual actions of the capillary core in the evaporator 7 and the driving pump 3, and is distributed to each evaporation branch 5 after passing through the liquid compensator 2 and the liquid header 4. In each evaporation branch 5, the liquid working medium enters the evaporator 7 to absorb heat emitted by the electronic equipment and then is evaporated into a vapor state, and then enters the vapor header 6 to be mixed and then enters the condenser 1 through a pipeline. The heat is transferred to a cooling air or fuel heat sink 9 on the airplane in the condenser 1, and is condensed into liquid state again, and the next cycle is started.
The evaporation branches 5 of the loop heat pipe for cooling the onboard electronic equipment are not identical, and each evaporation branch 5 is used for absorbing heat emitted by one electronic equipment with larger heat dissipation power or a plurality of electronic equipment with smaller heat dissipation power and close physical positions. The evaporator 7 on each evaporation branch 5 is flexibly selected according to the structure of the electronic device corresponding to the branch, and the structure of the evaporator 7 is a structural form which can be tightly attached to the heat dissipation surface of the electronic device so as to effectively absorb the heat dissipation capacity of the electronic device, such as a circular tube type or a flat plate type. The pipeline of the evaporation branch 5 adopts a flexible connecting pipe, and the length of the pipeline is determined according to the position of the electronic equipment corresponding to the branch on the machine.
The loop heat pipe for cooling the airborne electronic equipment comprises a driving pump 3, and the driving pump is used for increasing driving force and improving the pressure of a liquid working medium in a liquid header 4, so that on one hand, the working medium entering an evaporator 7 on each evaporation branch 5 is still in a liquid state under the condition of large overload of the airplane in maneuvering flight and the like, and the phenomenon that the cooling capacity of the evaporator 7 is reduced or even loses efficacy due to the fact that the steam working medium flows back into the evaporator 7 is avoided; on the other hand, the phenomenon that the evaporator 7 is burnt out due to sudden rise of the heat productivity of the electronic equipment is prevented.
The loop heat pipe for cooling the airborne electronic equipment comprises a liquid compensator 2, and the liquid compensator has the functions of providing a certain supercooling degree for a liquid working medium entering a capillary core of an evaporator 7 under the condition that the performance of a condenser fluctuates, and preventing the heat in the evaporator 7 from being reversely conducted along the capillary core to cause steam to appear in the capillary core.
The circulating working medium in the loop heat pipe for cooling the airborne electronic equipment is ammonia, water, glycol aqueous solution or refrigerant and the like.
The invention has the beneficial effects that: the invention provides a loop heat pipe for cooling airborne electronic equipment, which is used for quickly taking away heat emitted by the electronic equipment, maintaining the electronic equipment at a lower working temperature and enabling the electronic equipment to stably and efficiently operate.
Drawings
Fig. 1 is a schematic diagram of the present invention. Wherein 1, a condenser; 2 a liquid compensator; 3 driving the pump; 4 liquid header; 5, an evaporation branch; 6, a steam header; 7 an evaporator; 8, heat dissipation capacity of the electronic equipment; 9 heat sink.
Fig. 2 is an arrangement a of the invention applied to an aircraft thermal management system.
Fig. 3 is an arrangement B of the invention applied to an aircraft thermal management system.
Detailed Description
As shown in fig. 1, a loop heat pipe for cooling an airborne electronic device is mainly composed of a condenser 1, a liquid compensator 2, a driving pump 3, a liquid header 4, a plurality of evaporation branches 5 connected in parallel, and a steam header 6. Wherein each evaporation branch 5 comprises an evaporator 7.
The circulating working medium in the loop heat pipe is water. The circulating working medium flows out of the liquid compensator 2 under the dual action of the driving pump 3 and the capillary cores in the evaporators 7, enters the liquid header 4 through the driving pump 3, and then flows out of the liquid header 4 to enter the plurality of evaporation branches 5 which are connected in parallel. On each evaporation branch 5, the liquid circulating working medium enters an evaporator 7 under the drive of capillary force, changes into a steam state after absorbing the heat dissipation capacity 8 of the electronic equipment, and then enters a steam header 6. The steam solar working medium flows out from the outlet of the steam header 6, enters the condenser 1 through a pipeline, releases heat and condenses to the cooling air or fuel heat sink 9 in the condenser, becomes liquid again, and flows out from the outlet of the condenser 1 to enter the liquid compensator 2 to start the next cycle.
The pipeline of each evaporation branch 5 is a flexible pipe, and the pipe length of the pipeline is determined according to the position of the electronic equipment to be cooled by the evaporation branch 5 on the machine. The evaporation branch 5 can cool one electronic device with larger heat dissipation power or a plurality of electronic devices with smaller heat dissipation power and close physical positions. The evaporator 7 on each evaporation branch 5 is flexibly selected according to the structure of the electronic equipment corresponding to the branch, and the structure of the evaporator 7 is a circular tube type.
The circulation working medium on each evaporation branch 5 flows mainly by the capillary force generated by the capillary core in the evaporator 7, the driving pump 2 mainly has the function of improving the pressure of the liquid working medium in the liquid header 4, on one hand, the working medium entering the evaporator 7 on each evaporation branch 5 is ensured to be still in a liquid state under the condition of large overload of the airplane during maneuvering flight and the like, and the phenomenon that the cooling capacity of the evaporator 7 is reduced or even loses efficacy due to the fact that the steam working medium flows back into the evaporator 7 is avoided; on the other hand, the phenomenon that the evaporator 7 is burnt out due to sudden rise of the heat productivity of the electronic equipment is prevented.
The steam working medium is condensed into liquid state again by releasing heat to the heat sink 9 in the condenser 1. The heat sink 9 can be either cooling air for the onboard environmental control system or onboard fuel. Loop heat pipes for on-board electronics cooling may have two arrangements in an aircraft thermal management system, depending on the heat sink. Fig. 2 shows an arrangement a using fuel as a final heat sink; fig. 3 shows an arrangement B using the cooling air of the environmental control system as the final heat sink.
Claims (5)
1. A loop heat pipe for cooling airborne electronic equipment is characterized by comprising a condenser (1), a liquid compensator (2), a driving pump (3), a liquid header (4), an evaporation branch (5) and a steam header (6) which are sequentially connected and form a loop; evaporation branches (5) between the liquid header (4) and the steam header (6) are connected in parallel, and an evaporator (7) is arranged between the liquid header (4) and the evaporation branches (5) on each evaporation branch (5);
working media in the loop heat pipe for cooling the airborne electronic equipment flow out of the condenser (1) under the dual actions of the capillary core in the evaporator (7) and the driving pump (3), and are distributed to each evaporation branch (5) after passing through the liquid compensator (2) and the liquid header (4); in each evaporation branch (5), the liquid working medium enters an evaporator (7) to absorb heat emitted by electronic equipment and then is evaporated into a vapor state, and then enters a vapor header (6) to be mixed and then enters a condenser (1) through a pipeline; transferring heat to a cooling air or fuel heat sink (9) on the airplane in the condenser (1), condensing the heat into liquid state again, and starting the next round of circulation;
the evaporation branches (5) of the loop heat pipe for cooling the airborne electronic equipment are not identical, and each evaporation branch (5) is used for absorbing heat emitted by one electronic equipment with larger heat dissipation power or a plurality of electronic equipment with smaller heat dissipation power and close physical positions; the evaporator (7) on each evaporation branch (5) is flexibly selected according to the structure of the electronic equipment corresponding to the branch, and the structure of the evaporator (7) is a structural form which can be tightly attached to the heat dissipation surface of the electronic equipment so as to effectively absorb the heat dissipation capacity of the electronic equipment; the pipeline of the evaporation branch (5) adopts a flexible connecting pipe, and the length of the pipeline is determined according to the position of the electronic equipment corresponding to the branch on the machine.
2. A loop heat pipe for cooling of on-board electronics according to claim 1, characterised in that the evaporator (7) is of circular tube or flat plate construction.
3. The loop heat pipe for cooling the airborne electronic equipment according to claim 1, wherein the loop heat pipe for cooling the airborne electronic equipment comprises a driving pump (3) which is used for increasing driving force and increasing the pressure of liquid working medium in the liquid header (4), so that on one hand, the working medium entering the evaporator (7) on each evaporation branch (5) is ensured to be still in a liquid state under the condition of large overload of maneuvering flight of the aircraft, and the phenomenon that the cooling capacity of the evaporator (7) is reduced or even fails due to the fact that the steam working medium flows back into the evaporator (7) is avoided; on the other hand, the phenomenon that the evaporator (7) is burnt out due to sudden rise of the heat productivity of the electronic equipment is prevented.
4. The loop heat pipe for cooling the on-board electronics according to claim 1, wherein the loop heat pipe for cooling the on-board electronics comprises a liquid compensator (2) for providing a degree of supercooling to the liquid working medium entering the wick of the evaporator (7) in case of condenser performance fluctuation, so as to prevent vapor from occurring in the wick due to heat conduction in the evaporator (7) in a reverse direction of the wick.
5. The loop heat pipe for cooling the onboard electronic equipment as claimed in claim 1, wherein the circulating working medium in the loop heat pipe for cooling the onboard electronic equipment is ammonia, water, glycol aqueous solution or refrigerant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111078863.7A CN113613476A (en) | 2021-09-15 | 2021-09-15 | Loop heat pipe for cooling airborne electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111078863.7A CN113613476A (en) | 2021-09-15 | 2021-09-15 | Loop heat pipe for cooling airborne electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113613476A true CN113613476A (en) | 2021-11-05 |
Family
ID=78310535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111078863.7A Pending CN113613476A (en) | 2021-09-15 | 2021-09-15 | Loop heat pipe for cooling airborne electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113613476A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006029672A (en) * | 2004-07-15 | 2006-02-02 | Japan Aerospace Exploration Agency | Heat transportation device using latent heat fluid loop |
| CN105115329A (en) * | 2015-08-14 | 2015-12-02 | 北京空间飞行器总体设计部 | High-efficient radiating system applicable to multiple point heat sources in small space |
| CN105916338A (en) * | 2015-02-19 | 2016-08-31 | 日立汽车系统株式会社 | Electronic Control Apparatus, Motor Control Apparatus And Electric Fluid Pump |
| CN110030860A (en) * | 2019-05-15 | 2019-07-19 | 北京航空航天大学 | A kind of double liquid storage device loop circuit heat pipes of double skirt types |
| CN212673923U (en) * | 2020-06-29 | 2021-03-09 | 中国航发商用航空发动机有限责任公司 | Pulsation loop heat pipe for heat dissipation of aircraft engine |
-
2021
- 2021-09-15 CN CN202111078863.7A patent/CN113613476A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006029672A (en) * | 2004-07-15 | 2006-02-02 | Japan Aerospace Exploration Agency | Heat transportation device using latent heat fluid loop |
| CN105916338A (en) * | 2015-02-19 | 2016-08-31 | 日立汽车系统株式会社 | Electronic Control Apparatus, Motor Control Apparatus And Electric Fluid Pump |
| CN105115329A (en) * | 2015-08-14 | 2015-12-02 | 北京空间飞行器总体设计部 | High-efficient radiating system applicable to multiple point heat sources in small space |
| CN110030860A (en) * | 2019-05-15 | 2019-07-19 | 北京航空航天大学 | A kind of double liquid storage device loop circuit heat pipes of double skirt types |
| CN212673923U (en) * | 2020-06-29 | 2021-03-09 | 中国航发商用航空发动机有限责任公司 | Pulsation loop heat pipe for heat dissipation of aircraft engine |
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