CN113613461B

CN113613461B - Heat dissipation film, manufacturing method thereof, punching tool, equipment and display device

Info

Publication number: CN113613461B
Application number: CN202110874868.4A
Authority: CN
Inventors: 张寒; 毕丹炀; 朴仁镐; 刘晓霞; 王康; 郝晓东; 路保福
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2021-07-30
Filing date: 2021-07-30
Publication date: 2023-08-11
Anticipated expiration: 2041-07-30
Also published as: CN113613461A

Abstract

The present disclosure relates to a heat dissipation film, a method of manufacturing the same, a punching tool, a device, and a display device, wherein the heat dissipation film includes: a first adhesive layer having a first through hole; the buffer layer is positioned on one side of the first bonding layer and is provided with a second through hole; the heat dissipation layer is positioned on one side of the buffer layer away from the first bonding layer and is provided with a third through hole; the wave absorbing layer is positioned on one side of the heat dissipation layer away from the first bonding layer and is provided with a fourth through hole; the central lines of the first through hole, the second through hole, the third through hole and the fourth through hole are overlapped, the sections along the extending direction of the central lines are provided with two hole edges, and a first included angle is formed between the two hole edges of the first through hole, the second through hole, the third through hole and the fourth through hole and the central line; the distance between the two hole edges of the first through hole is larger than the distance between the two hole edges of the fourth through hole; alternatively, the distance between the two hole edges of the first through hole is smaller than the distance between the two hole edges of the fourth through hole.

Description

Heat dissipation film, manufacturing method thereof, punching tool, equipment and display device

Technical Field

The disclosure relates to the technical field of manufacturing of display devices, in particular to a heat dissipation film, a manufacturing method thereof, a punching cutter, equipment and a display device.

Background

Currently, in the field of display device manufacturing technology, as shown in fig. 1 and 2, a heat dissipation film hole of a heat dissipation film is typically a through hole with smooth transition formed by punching. However, as shown in fig. 1, when the punching tool punches the through hole with smooth transition on the heat dissipation film, since the punching tool presses the hole in the punching direction, the hole is pressed, thereby causing the through hole to be protruded in the punching direction; meanwhile, as shown in fig. 2, when the punching tool returns in a direction opposite to the punching direction, it may cause backward extrusion of the through hole, thereby causing the through hole to bulge in a direction opposite to the punching direction.

In addition, since the heat dissipation film is attached to the backlight side of the display panel, when the heat dissipation film hole is protruded, a film mark phenomenon is formed on the display panel, thereby affecting the display effect of the display device.

It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

Disclosure of Invention

The present disclosure aims to provide a heat dissipation film capable of improving a display effect of a display device, a manufacturing method thereof, a punching tool, a device and a display device.

A first aspect of the present disclosure provides a heat dissipation film, comprising:

a first adhesive layer having a first through hole;

the buffer layer is positioned on one side of the first bonding layer and is provided with a second through hole;

the heat dissipation layer is positioned on one side of the buffer layer away from the first bonding layer and is provided with a third through hole;

the wave absorbing layer is positioned on one side of the heat dissipation layer away from the first bonding layer and is provided with a fourth through hole;

the central lines of the first through hole, the second through hole, the third through hole and the fourth through hole are overlapped, the sections along the extending direction of the central lines are provided with two hole edges, and a first included angle is formed between the two hole edges of the first through hole, the second through hole, the third through hole and the fourth through hole and the central line;

the distance between the two hole edges of the first through hole is larger than the distance between the two hole edges of the fourth through hole; alternatively, the distance between the two hole edges of the first through hole is smaller than the distance between the two hole edges of the fourth through hole.

In an exemplary embodiment of the present disclosure, a distance between two hole sides of the first through hole is greater than a distance between two hole sides of the fourth through hole, the two hole sides of the first through hole are respectively connected with the two hole sides of the second through hole, a distance between two hole sides of the third through hole is smaller than a distance between two hole sides of the second through hole, and the two hole sides of the third through hole are respectively connected with the two hole sides of the fourth through hole;

or, the distance between the two hole edges of the first through hole is smaller than the distance between the two hole edges of the fourth through hole, the two hole edges of the first through hole are respectively connected with the two hole edges of the second through hole, the distance between the two hole edges of the third through hole is larger than the distance between the two hole edges of the second through hole, and the two hole edges of the third through hole are respectively connected with the two hole edges of the fourth through hole.

In an exemplary embodiment of the present disclosure, the distance between the two hole sides of the first through hole is greater than the distance between the two hole sides of the second through hole, the distance between the two hole sides of the second through hole is greater than the distance between the two hole sides of the third through hole, and the distance between the two hole sides of the third through hole is greater than the distance between the two hole sides of the fourth through hole;

Or, the distance between the two hole edges of the first through hole is smaller than the distance between the two hole edges of the second through hole, the distance between the two hole edges of the second through hole is smaller than the distance between the two hole edges of the third through hole, and the distance between the two hole edges of the third through hole is smaller than the distance between the two hole edges of the fourth through hole.

In an exemplary embodiment of the present disclosure, the heat dissipation film further includes:

the protective layer is positioned on one side of the wave-absorbing layer far away from the first bonding layer and comprises a second bonding layer and a protective layer body;

the protective layer body is provided with a first area and a second area, the second area is arranged around the first area, and the projection of a fourth through hole on the protective layer is positioned in the first area; the second bonding layer is located in the second area and located at one side of the protective layer body, which is close to the wave absorbing layer.

A second aspect of the present disclosure provides a die cutting tool for manufacturing the heat dissipation film of any one of the above, the die cutting tool comprising:

a first cutter part corresponding to punching the first through hole;

a second cutter part corresponding to the second through hole;

A third cutter part corresponding to the third through hole;

a fourth cutter part corresponding to punching the fourth through hole;

the first knife part, the second knife part, the third knife part and the fourth knife part are provided with central lines, the sections along the extending direction of the central lines are provided with two knife edges, and the first included angles are formed between the two knife edges of the first knife part, the second knife part, the third knife part and the fourth knife part and the central lines;

the distance between the two knife edges of the first knife part is larger than the distance between the two knife edges of the fourth knife part; alternatively, the distance between the two knife edges of the first knife part is smaller than the distance between the two knife edges of the fourth knife part.

In an exemplary embodiment of the present disclosure, the second blade portion is connected to the first blade portion, the third blade portion is connected to a side of the second blade portion remote from the first blade portion, the fourth blade portion is connected to a side of the third blade portion remote from the first blade portion, and centerlines of the first, second, third, and fourth blade portions coincide;

the distance between the two knife edges of the first knife part is larger than the distance between the two knife edges of the fourth knife part, the two knife edges of the first knife part are respectively connected with the two knife edges of the second knife part, the distance between the two knife edges of the third knife part is smaller than the distance between the two knife edges of the second knife part, and the two knife edges of the third knife part are respectively connected with the two knife edges of the fourth knife part;

Or, the distance between the two knife edges of the first knife part is smaller than the distance between the two knife edges of the fourth knife part, the two knife edges of the first knife part are respectively connected with the two knife edges of the second knife part, the distance between the two knife edges of the third knife part is larger than the distance between the two knife edges of the second knife part, and the two knife edges of the third knife part are respectively connected with the two knife edges of the fourth knife part.

the distance between the two knife edges of the first knife part is larger than the distance between the two knife edges of the second knife part, the distance between the two knife edges of the second knife part is larger than the distance between the two knife edges of the third knife part, and the distance between the two knife edges of the third knife part is larger than the distance between the two knife edges of the fourth knife part;

Or, the distance between the two knife edges of the first knife part is smaller than the distance between the two knife edges of the second knife part, the distance between the two knife edges of the second knife part is smaller than the distance between the two knife edges of the third knife part, and the distance between the two knife edges of the third knife part is smaller than the distance between the two knife edges of the fourth knife part.

In an exemplary embodiment of the present disclosure, the first included angle has a value ranging from 0 ° to 8 °.

A third aspect of the present disclosure provides a die cutting apparatus comprising:

a base;

the punching tool is arranged on the base and is any one of the punching tools.

A fourth aspect of the present disclosure provides a method for manufacturing a heat dissipation film, the method for manufacturing a heat dissipation film applying the die cutting apparatus described above, the method for manufacturing a heat dissipation film comprising:

forming a first through hole on the first adhesive layer by using the first knife part;

forming a second through hole on the buffer layer by using the second knife part;

forming a third through hole on the heat dissipation layer by using the third knife part;

forming a fourth through hole on the wave-absorbing layer by using the fourth knife part;

The central lines of the first through hole, the second through hole, the third through hole and the fourth through hole are overlapped, the sections along the extending direction of the central lines are provided with two hole edges, and a first included angle is formed between the two hole edges of the first through hole, the second through hole, the third through hole and the fourth through hole and the central line; the distance between the two hole edges of the first through hole is larger than the distance between the two hole edges of the fourth through hole; alternatively, the distance between the two hole edges of the first through hole is smaller than the distance between the two hole edges of the fourth through hole.

A fifth aspect of the present disclosure provides a display device, comprising:

a display panel having a light-emitting side and a backlight side;

the heat dissipation film is any one of the heat dissipation films, and the heat dissipation film is located on the backlight side.

The technical scheme provided by the disclosure can achieve the following beneficial effects:

two hole edges of a first through hole, a second through hole, a third through hole and a fourth through hole in the heat dissipation film provided by the disclosure all have a first included angle with the center line. Thus, the inclination directions of the two hole sides of the first, second, third, and fourth through holes of the present disclosure are all the same.

In addition, the distance between two hole edges of the first through hole is larger than the distance between two hole edges of the fourth through hole, so that when the punching tool can punch in the direction from the first bonding layer to the wave-absorbing layer, the wave-absorbing layer can provide support for the first bonding layer, the buffer layer and the heat dissipation layer due to the fact that the fourth through hole is smaller than the first through hole, and the first bonding layer, the buffer layer and the heat dissipation layer are prevented from protruding in the direction from the first bonding layer to the wave-absorbing layer. Meanwhile, as the thickness of each film layer of the layered die cutting is smaller, no bulge is generated on one side of the wave absorbing layer in the process of die cutting each film layer.

Or, the distance between the two hole edges of the first through hole is smaller than the distance between the two hole edges of the fourth through hole, so that when the punching tool can punch in the direction from the wave absorbing layer to the first bonding layer, the first bonding layer can provide support for the buffer layer, the heat dissipation layer and the first bonding layer due to the fact that the first through hole is smaller than the fourth through hole, and the buffer layer, the heat dissipation layer and the first bonding layer are prevented from generating protrusions in the direction from the wave absorbing layer to the first bonding layer. Meanwhile, as the thickness of each film layer of the layered die cutting is smaller, no bulge is generated on one side of the first bonding layer in the process of die cutting each film layer.

Therefore, the heat dissipation film holes in the heat dissipation film provided by the disclosure do not generate protrusions, so that compared with the prior art, the heat dissipation film has no film printing phenomenon, and the display effect of the display device can be improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure. It will be apparent to those of ordinary skill in the art that the drawings in the following description are merely examples of the disclosure and that other drawings may be derived from them without undue effort.

FIGS. 1 and 2 show schematic structural diagrams of a prior art heat dissipation film;

fig. 3 illustrates a schematic structure of a heat dissipation film according to an exemplary embodiment of the present disclosure;

fig. 4 illustrates a schematic structure of a heat dissipation film according to another exemplary embodiment of the present disclosure;

fig. 5 illustrates a schematic structure of a heat dissipation film according to still another exemplary embodiment of the present disclosure;

Fig. 6 illustrates a schematic structure of a heat dissipation film according to still another exemplary embodiment of the present disclosure;

FIG. 7 illustrates a schematic structural view of a heat dissipation film with a support structure according to an exemplary embodiment of the present disclosure;

fig. 8 illustrates a schematic structure of a heat dissipation film with a support structure according to another exemplary embodiment of the present disclosure;

fig. 9 illustrates a schematic structure of a heat dissipation film with a protective layer according to another exemplary embodiment of the present disclosure;

fig. 10 shows a schematic structural view of a die cutting apparatus according to an exemplary embodiment of the present disclosure;

fig. 11 shows a schematic structural view of a die cutting apparatus according to another exemplary embodiment of the present disclosure;

fig. 12 shows a schematic structural view of a die cutting apparatus according to still another exemplary embodiment of the present disclosure;

13-16 illustrate schematic structural views of a die cutting apparatus in an exemplary embodiment according to the present disclosure;

fig. 17 shows a flow diagram of a method of manufacturing a heat dissipation film according to an exemplary embodiment of the present disclosure.

Reference numerals illustrate:

1. a first adhesive layer; 2. a buffer layer; 3. a heat dissipation layer; 4. a wave absorbing layer; 5. a protective layer; 6. a support structure; 7. punching a cutter; 8. a base; 9. a center line; 11. a first through hole; 21. a second through hole; 31. a third through hole; 41. a fourth through hole; 51. a first region; 52. a second region; 71. a first knife section; 72. a second knife section; 73. a third knife section; 74. and a fourth blade portion.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus detailed descriptions thereof will be omitted.

Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification for convenience only, such as in terms of the orientation of the examples described in the figures. It will be appreciated that if the device of the icon is flipped upside down, the recited "up" component will become the "down" component. When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

The terms "a," "an," "the," and "said" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. in addition to the listed elements/components/etc.; the terms "first" and "second" and the like are used merely as labels, and are not intended to limit the number of their objects.

The disclosure provides a heat dissipation film, in which the heat dissipation film holes do not generate protrusions, so that compared with the prior art, the heat dissipation film provided by the disclosure does not generate a film printing phenomenon, and the display effect of the display device can be remarkably improved. Specifically, as shown in fig. 3 to 9, the heat dissipation film provided by the present disclosure may include: a first adhesive layer 1, a buffer layer 2, a heat dissipation layer 3 and a wave absorbing layer 4.

The first adhesive layer 1 may be a mesh adhesive, and is used for adhering to the backlight side of the display panel. However, the heat dissipation film is not limited to this, and may be used for bonding with a display panel, or may be used for other devices requiring heat dissipation, and may be provided according to actual needs. The material of the first adhesive layer 1 may be PSA (Pressure Sensitive Adhesive ), and by forming the first adhesive layer 1 by PSA, the first adhesive layer 1 can obtain longer lasting adhesive force and stronger cohesive force, so that the adhesive effect is better. However, the first adhesive layer 1 is not limited thereto, and other materials may be used as long as they have adhesive force, which is within the scope of the present disclosure.

Further, the first adhesive layer 1 may have a first through hole 11, the first through hole 11 may penetrate through the entire first adhesive layer 1, and the cross-sectional shape of the first through hole 11 may be circular, but not limited thereto, the cross-sectional shape of the first through hole 11 may be other shapes, for example: square or triangle, etc., can be set according to actual needs. Meanwhile, the first through hole 11 may have two hole sides along an extending direction of the center line thereof, and the two hole sides of the first through hole 11 may each have a first included angle α with the center line thereof. In one embodiment of the present disclosure, the value range of the first included angle α may be 0 ° to 8 °, but is not limited thereto.

The buffer layer 2 may be located at one side of the first adhesive layer 1, and the buffer layer 2 is located at a side of the first adhesive layer 1 remote from the display panel when the first adhesive layer 1 is adhered to the backlight side of the display panel. For example, the material of the buffer layer 2 may be foam, but not limited thereto, and the buffer layer 2 may be other materials as long as the buffer effect is provided.

Further, the buffer layer 2 may have a second through hole 21, the second through hole 21 may penetrate through the entire buffer layer 2, and the cross-sectional shape of the second through hole 21 may be circular, but not limited thereto, the cross-sectional shape of the second through hole 21 may be other shapes, for example: square or triangle, etc., can be set according to actual needs. Meanwhile, the second through hole 21 may have two hole sides along the extending direction of the center line thereof, and both the two hole sides of the second through hole 21 may have the first included angle α between the center line thereof.

The heat dissipation layer 3 may be located at a side of the buffer layer 2 remote from the first adhesive layer 1. For example, the material of the heat dissipation layer 3 may be copper, and in particular, copper foil may be used. Copper has good heat dissipation effect and conductive effect. Thus, the present disclosure can lead out static electricity in the heat dissipation film while ensuring good heat dissipation effect thereof by forming the heat dissipation layer 3 using copper, thereby preventing static electricity from affecting the heat dissipation film itself and the display of the display panel. However, the heat dissipation layer 3 provided in the present disclosure may be made of other materials, as long as it has a heat dissipation effect, and may be selected according to actual needs.

Further, the heat dissipation layer 3 may have a third through hole 31, the third through hole 31 may penetrate through the entire heat dissipation layer 3, and the cross-sectional shape of the third through hole 31 may be circular, but not limited thereto, the cross-sectional shape of the third through hole 31 may also be other shapes, for example: square or triangle, etc., can be set according to actual needs. Meanwhile, the third through hole 31 may have two hole sides along the extending direction of the center line thereof, and the two hole sides of the third through hole 31 may also have the first included angle α between the center line thereof.

The wave-absorbing layer 4 may be located at a side of the heat dissipation layer 3 remote from the first adhesive layer 1. For example, the material of the wave-absorbing layer 4 may be a wave-absorbing material, and in particular may be ferrite. The present disclosure can provide a supporting effect for a heat dissipation film while absorbing interference electromagnetic waves by forming the wave absorbing layer 4 using ferrite. However, the wave-absorbing layer 4 may be made of other wave-absorbing materials, such as: graphene, carbon nanotubes, and the like, as long as they have an effect of absorbing electromagnetic waves.

Further, the wave-absorbing layer 4 may have a fourth through hole 41, the fourth through hole 41 may penetrate through the whole wave-absorbing layer 4, and the cross-sectional shape of the fourth through hole 41 may be circular, but not limited thereto, the cross-sectional shape of the fourth through hole 41 may be other shapes, for example: square or triangle, etc., can be set according to actual needs. Meanwhile, the fourth through hole 41 may have two hole sides along the extending direction of the center line thereof, and both the two hole sides of the fourth through hole 41 may have the first included angle α between the center line thereof.

In one embodiment of the present disclosure, the first through hole 11, the second through hole 21, the third through hole 31, and the fourth through hole 41 described above collectively constitute a heat dissipation film hole of the heat dissipation film. Also, in order to facilitate the manufacture of the heat dissipation film, the cross-sectional shapes of the first through hole 11, the second through hole 21, the third through hole 31, and the fourth through hole 41 may be the same. For example: the cross-sectional shapes of the first through hole 11, the second through hole 21, the third through hole 31, and the fourth through hole 41 may be circular. The cross-sectional shapes of the first through hole 11, the second through hole 21, the third through hole 31, and the fourth through hole 41 are the same, and refer to the cross-sectional shapes thereof being circular or square, and the like, and do not refer to the cross-sectional dimensions of each through hole being the same.

Further, the center lines of the first through hole 11, the second through hole 21, the third through hole 31, and the fourth through hole 41 coincide. It can be seen from the above that the cross sections of the first through hole 11, the second through hole 21, the third through hole 31 and the fourth through hole 41 along the extending direction of the center line thereof have two hole sides, and the first included angle α is formed between the two hole sides of the first through hole 11, the second through hole 21, the third through hole 31 and the fourth through hole 41 and the center line. Thus, the inclination directions of both hole sides of the first through hole 11, the second through hole 21, the third through hole 31, and the fourth through hole 41 provided by the present disclosure are the same.

In one embodiment of the present disclosure, the distance between the two hole sides of the first through hole 11 is greater than the distance between the two hole sides of the first through hole 11. It will be appreciated that the fourth through hole 41 is smaller than the first through hole 11. Thus, when the punching tool 7 can punch in the direction from the first adhesive layer 1 to the wave-absorbing layer 4, the wave-absorbing layer 4 will provide support for the first through hole 11 because the fourth through hole 41 is smaller than the first through hole 11, preventing the first through hole 11 from generating the wave-absorbing force from the first adhesive layer 1

The layer 4 is convex in direction. Meanwhile, since the thickness of the wave-absorbing layer 4 is small, the fourth through hole 41 is not raised in the punching process.

And, because each film layer can counteract and disperse the stress when the punching tool 7 returns, that is, when the punching tool 7 moves in the direction opposite to the punching direction, each through hole does not generate a bulge in the direction opposite to the punching direction.

In one embodiment of the present disclosure, as shown in fig. 4, the distance between the two hole edges of the first through hole 11 is greater than the distance between the two hole edges of the fourth through hole 41, and the two hole edges of the first through hole 11 are respectively connected with the two hole edges of the second through hole 21, the distance between the two hole edges of the third through hole 31 is smaller than the distance between the two hole edges of the second through hole 21, and the two hole edges of the third through hole 31 are respectively connected with the two hole edges of the fourth through hole 41.

Specifically, since the two hole sides of the first through hole 11 are respectively connected to the two hole sides of the second through hole 21, that is, the first through hole 11 and the second through hole 21 are smoothly transited. The two hole edges of the third through hole 31 are respectively connected with the two hole edges of the fourth through hole 41, that is, the third through hole 31 and the fourth through hole 41 are in smooth transition. And, the distance between the two hole sides of the first through hole 11 is larger than the distance between the two hole sides of the fourth through hole 41, and the distance between the two hole sides of the third through hole 31 is smaller than the distance between the two hole sides of the second through hole 21. Thus, the second through hole 21 and the third through hole 31 are stepped, so that when the punching tool 7 can punch in the direction from the first adhesive layer 1 to the wave-absorbing layer 4, the heat dissipation layer 3 and the wave-absorbing layer 4 can provide support for the first through hole 11 and the second through hole 21, and when the punching tool 7 punches the respective through holes, the friction force of the respective blade portions of the punching tool 7 during punching can also be reduced due to the reduction of the film thickness corresponding to each blade portion of the punching tool 7. Further, the present disclosure can prevent the first through hole 11 and the second through hole 21 from generating protrusions directed from the first adhesive layer 1 to the wave-absorbing layer 4. Meanwhile, since the thicknesses of the heat dissipation layer 3 and the wave absorbing layer 4 are also small, the third through holes 31 and the fourth through holes 41 are not raised in the punching process. Accordingly, the present application can significantly solve the problem of the protrusion caused by the punching of the punching tool 7 as shown in fig. 1 in the prior art by providing each through hole as the above-described structure.

In one embodiment of the present disclosure, as shown in fig. 3, the distance between the two hole sides of the first through hole 11 is greater than the distance between the two hole sides of the second through hole 21, the distance between the two hole sides of the second through hole 21 is greater than the distance between the two hole sides of the third through hole 31, and the distance between the two hole sides of the third through hole 31 is greater than the distance between the two hole sides of the fourth through hole 41. Thus, the first through hole 11 is larger than the second through hole 21, the second through hole 21 is larger than the third through hole 31, and the third through hole 31 is larger than the fourth through hole 41, so that the two adjacent through holes are stepped.

Therefore, when the punching blade 7 can be punched in the direction from the first adhesive layer 1 to the wave-absorbing layer 4, the buffer layer 2 can provide support for the first through hole 11, the heat dissipation layer 3 can provide support for the second through hole 21, and the wave-absorbing layer 4 can provide support for the third through hole 31, so that punching stress of the punching blade 7 is dispersed, and when the punching blade 7 punches each through hole, friction force of each blade of the punching blade 7 in punching can also be reduced due to the reduction of the film thickness corresponding to each blade of the punching blade 7. Further, the present disclosure can prevent the first through hole 11, the second through hole 21, and the third through hole 31 from generating protrusions directed in the direction of the wave-absorbing layer 4 by the first adhesive layer 1. Meanwhile, the thickness of the wave-absorbing layer 4 is smaller, so that no bulge is generated in the punching process of the wave-absorbing layer 4. Accordingly, the present application can significantly solve the problem of the protrusion caused by the punching of the punching tool 7 as shown in fig. 1 in the prior art by providing each through hole as the above-described structure.

In one embodiment of the present disclosure, the distance between the two hole edges of the first through hole 11 is greater than the distance between the two hole edges of the fourth through hole 41, and the two hole edges of the first through hole 11 are respectively connected with the two hole edges of the second through hole 21, the two hole edges of the third through hole 31 are respectively connected with the two hole edges of the second through hole 21, and the distance between the two hole edges of the third through hole 31 is greater than the distance between the two hole edges of the fourth through hole 41.

Specifically, since the two hole sides of the first through hole 11 are respectively connected to the two hole sides of the second through hole 21, the two hole sides of the third through hole 31 are respectively connected to the two hole sides of the second through hole 21, that is, the first through hole 11, the second through hole 21, and the third through hole 31 are smoothly transited. And, the distance between the two hole sides of the first through hole 11 is larger than the distance between the two hole sides of the fourth through hole 41, and the distance between the two hole sides of the first through hole 11 is larger than the distance between the two hole sides of the fourth through hole 41. Thus, the third through hole 31 and the fourth through hole 41 are stepped, so that when the punching tool 7 can punch in the direction from the first adhesive layer 1 to the wave-absorbing layer 4, the wave-absorbing layer 4 can provide support for the first through hole 11, the second through hole 21, and the third through hole 31, preventing the first through hole 11, the second through hole 21, and the third through hole 31 from generating protrusions from the first adhesive layer 1 to the wave-absorbing layer 4. Meanwhile, since the thickness of the wave-absorbing layer 4 is also small, no protrusion is generated in the process of punching the fourth through holes 41. Thus, the present application can remarkably solve the problem of the protrusion caused by the punching of the punching tool 7 as shown in fig. 1 in the prior art by providing each through hole as the structure.

In another embodiment of the present disclosure, the distance between the two hole sides of the first through hole 11 is smaller than the distance between the two hole sides of the first through hole 11. It will be appreciated that the fourth through hole 41 is larger than the first through hole 11. Thus, when the punching tool 7 can punch in the direction from the wave-absorbing layer 4 to the first adhesive layer 1, since the first through hole 11 is smaller than the fourth through hole 41, the first adhesive layer 1 will provide support for the fourth through hole 41, preventing the fourth through hole 41 from generating a bulge from the first adhesive layer 1 to the wave-absorbing layer 4. Meanwhile, since the thickness of the first adhesive layer 1 is small, the first through hole 11 is not raised during punching.

In one embodiment of the present disclosure, the distance between the two hole edges of the first through hole 11 is smaller than the distance between the two hole edges of the fourth through hole 41, and the two hole edges of the first through hole 11 are respectively connected with the two hole edges of the second through hole 21, the distance between the two hole edges of the third through hole 31 is larger than the distance between the two hole edges of the second through hole 21, and the two hole edges of the third through hole 31 are respectively connected with the two hole edges of the fourth through hole 41.

Specifically, since the two hole sides of the first through hole 11 are respectively connected to the two hole sides of the second through hole 21, that is, the first through hole 11 and the second through hole 21 are smoothly transited. The two hole edges of the third through hole 31 are respectively connected with the two hole edges of the fourth through hole 41, that is, the third through hole 31 and the fourth through hole 41 are in smooth transition. And, the distance between the two hole sides of the first through hole 11 is smaller than the distance between the two hole sides of the fourth through hole 41, and the distance between the two hole sides of the third through hole 31 is larger than the distance between the two hole sides of the second through hole 21. Thus, the second through hole 21 and the third through hole 31 are stepped, so that when the punching tool 7 can punch in the direction from the wave-absorbing layer 4 to the first adhesive layer 1, the first adhesive layer 1 and the buffer layer 2 can provide support for the fourth through hole 41 and the third through hole 31, preventing the fourth through hole 41 and the third through hole 31 from generating projections from the wave-absorbing layer 4 to the direction of the first adhesive layer 1. Meanwhile, since the thicknesses of the first adhesive layer 1 and the buffer layer 2 are also small, the first through holes 11 and the second through holes 21 are not raised in the punching process.

Also, when the punching blade 7 returns, the friction force of the first through hole 11, the second through hole 21, the third through hole 31, and the fourth through hole 41 against the punching blade 7 is small, so that the respective through holes do not generate protrusions in the opposite direction to the punching direction.

In one embodiment of the present disclosure, as shown in fig. 5, the distance between the two hole sides of the first through hole 11 is smaller than the distance between the two hole sides of the second through hole 21, the distance between the two hole sides of the second through hole 21 is smaller than the distance between the two hole sides of the third through hole 31, and the distance between the two hole sides of the third through hole 31 is smaller than the distance between the two hole sides of the fourth through hole 41. Thus, the first through hole 11 is smaller than the second through hole 21, the second through hole 21 is smaller than the third through hole 31, and the third through hole 31 is smaller than the fourth through hole 41, so that each of the two adjacent through holes is stepped and gradually decreases in a direction from the wave-absorbing layer 4 toward the first adhesive layer 1.

Therefore, when the punching blade 7 can be punched in the direction from the wave-absorbing layer 4 to the first adhesive layer 1, the heat dissipation layer 3 can provide support for the fourth through hole 41, the buffer layer 2 can provide support for the third through hole 31, and the first adhesive layer 1 can provide support for the second through hole 21, so that punching stress of the punching blade 7 is dispersed, and when the punching blade 7 punches each through hole, friction force of each blade of the punching blade 7 in punching can also be reduced due to the reduction of the film thickness corresponding to each blade of the punching blade 7. Further, the present disclosure can prevent the fourth through hole 41, the third through hole 31, and the second through hole 21 from generating protrusions directed in the direction of the first adhesive layer 1 by the wave-absorbing layer 4. Meanwhile, since the thickness of the first adhesive layer 1 is also small, no protrusion is generated in the process of punching the first adhesive layer 1. Thus, the present application can remarkably solve the problem of the protrusion as shown in fig. 2 caused by the return of the punching blade 7 in the prior art by providing each through hole as the above-described structure.

In addition to this, in the present embodiment, as shown in fig. 6, when the punching blade 7 punches in the direction from the first adhesive layer 1 toward the wave-absorbing layer 4, the first through hole 11, the second through hole 21, the third through hole 31, and the fourth through hole 41 may be formed in layers of film. That is, the first through hole 11 may now be formed on the first adhesive layer 1, the second through hole 21 may be formed on the buffer layer 2, the third through hole 31 may be formed on the heat dissipation layer 3, and the fourth through hole 41 may be formed on the wave-absorbing layer 4. The first through hole 11 is smaller than the second through hole 21, the second through hole 21 is smaller than the third through hole 31, and the third through hole 31 is smaller than the fourth through hole 41. After the through holes are formed in each layer, the layers can be sequentially attached together to form the heat dissipation film provided by the disclosure. The method can prevent the through holes from generating bulges in a layering mode.

In one embodiment of the present disclosure, the distance between the two hole sides of the first through hole 11 is smaller than the distance between the two hole sides of the fourth through hole 41, and the two hole sides of the second through hole 21 are respectively connected with the two hole sides of the third through hole 31, the two hole sides of the third through hole 31 are respectively connected with the two hole sides of the fourth through hole 41, and the distance between the two hole sides of the second through hole 21 is larger than the distance between the two hole sides of the first through hole 11.

Specifically, since the two hole sides of the second through hole 21 are respectively connected to the two hole sides of the third through hole 31, the two hole sides of the third through hole 31 are respectively connected to the two hole sides of the fourth through hole 41, that is, the second through hole 21, the third through hole 31 and the fourth through hole 41 are smoothly transited. And, the distance between the two hole sides of the first through hole 11 is smaller than the distance between the two hole sides of the fourth through hole 41, and the distance between the two hole sides of the second through hole 21 is larger than the distance between the two hole sides of the first through hole 11. Thus, the first through hole 11 and the second through hole 21 are stepped, so that when the punching tool 7 can punch in the direction from the wave-absorbing layer 4 to the first adhesive layer 1, the first adhesive layer 1 can provide support for the second through hole 21, the third through hole 31 and the fourth through hole 41, preventing the second through hole 21, the third through hole 31 and the fourth through hole 41 from generating protrusions from the wave-absorbing layer 4 to the direction of the first adhesive layer 1. Meanwhile, since the thickness of the first adhesive layer 1 is also small, the first through hole 11 is not raised during punching. Thus, the present application can remarkably solve the problem of the protrusion as shown in fig. 2 caused by the return of the punching blade 7 in the prior art by providing each through hole as the structure.

In one embodiment of the present disclosure, as shown in fig. 7 and 8, the heat dissipation film may further include a support structure 6, and the support structure 6 may be supported on a film layer corresponding to a lowermost through hole, and a problem of collapse of each through hole may be prevented by the support structure 6.

Further, the material constituting the support structure 6 may be polyethylene terephthalate, but is not limited thereto, and may be other materials. Also, the shape of the support structure 6 may be the same as the through holes described above, so that a better supporting force can be provided. And the width of the cross section of the support structure 6 in the direction of the central line thereof is larger than the distance between the two hole edges of the smallest through hole. For example: the width of the cross section of the support structure 6 in its central direction may be greater than 0.2mm compared to the distance between the two hole edges of the smallest through hole.

In one embodiment of the present disclosure, as shown in fig. 9, the heat dissipation film may further include a protective layer 5, the protective layer 5 may be located at a side of the wave-absorbing layer 4 remote from the first adhesive layer 1, and the protective layer 5 may include: a second adhesive layer (not shown in the drawings) and a protective layer body. Wherein the protective layer body may have a first region 51 and a second region 52, the second region 52 may be disposed around the first region 51, and the projection of the fourth through hole 41 on the protective layer 5 may be located within the first region 51. A second adhesive layer may be located in the second area 52 and on a side of the protective layer body close to the wave-absorbing layer 4. Accordingly, the present disclosure does not provide the second adhesive layer on the surface of the fourth through hole 41, so that it is possible to prevent the fourth through hole 41 from being damaged when the protective layer 5 is removed in a subsequent process.

Further, the protective layer 5 may be a release film, but is not limited thereto. Meanwhile, the size of the first region 51 is 0.1 to 0.2mm larger than the distance between the two hole sides of the fourth through hole 41 as compared with the distance between the two hole sides of the fourth through hole 41, but is not limited thereto.

As shown in fig. 10-16, a second aspect of the present disclosure provides a piercing tool 7. The punching tool 7 can be used for manufacturing the heat dissipation film described above. Therefore, the heat dissipation film holes in the heat dissipation film can not generate bulges, the film printing phenomenon can not occur, and the display effect of the display device can be obviously improved. Specifically, the piercing tool 7 may include: a first blade 71, a second blade 72, a third blade 73 and a fourth blade 74.

Wherein, the first knife portion 71 may correspond to punching the first through hole 11, the second knife portion 72 may correspond to punching the second through hole 21, the third knife portion 73 may correspond to punching the third through hole 31, and the fourth knife portion 74 may correspond to punching the fourth through hole 41. And the first, second, third and fourth blade portions 71, 72, 73 and 74 may each have a center line 9, and the cross sections of the first, second, third and fourth blade portions 71, 72, 73 and 74 along the extending direction of the center line 9 may each have two blade edges. Both edges of the first, second, third and fourth blade portions 71, 72, 73, 74 may have a first angle α with their centerlines 9. In one embodiment of the present disclosure, the value range of the first included angle α may be 0 ° to 8 °, but is not limited thereto.

Further, the cross-sectional shapes of the first, second, third and fourth blade portions 71, 72, 73 and 74 may be circular, but are not limited thereto, and the cross-sectional shapes of the first, second, third and fourth blade portions 71, 72, 73 and 74 may be other shapes, for example: square or triangle, etc., can be set according to actual needs. The cross-sectional shapes of the first blade portion 71, the second blade portion 72, the third blade portion 73, and the fourth blade portion 74 are the same as the cross-sectional shapes of the first through hole 11, the second through hole 21, the third through hole 31, and the fourth through hole 41.

The materials of the first blade portion 71, the second blade portion 72, the third blade portion 73 and the fourth blade portion 74 may be steel, but are not limited thereto, and may be other metal materials such as iron, which are all within the scope of the present disclosure.

In one embodiment of the present disclosure, the distance between the two knife edges of the first knife 71 is greater than the distance between the two knife edges of the fourth knife 74. It will be appreciated that the first blade portion 71 is larger than the fourth blade portion 74 so that the distance between the two hole sides of the first through hole 11 die-cut therefrom is larger than the distance between the two hole sides of the fourth through hole 41. And, it can be used for punching in a direction from the first adhesive layer 1 toward the wave-absorbing layer 4.

Further, as shown in fig. 11, the second blade portion 72 may be connected to the first blade portion 71, the third blade portion 73 may be connected to a side of the second blade portion 72 away from the first blade portion 71, the fourth blade portion 74 may be connected to a side of the third blade portion 73 away from the first blade portion 71, and the center lines 9 of the first blade portion 71, the second blade portion 72, the third blade portion 73, and the fourth blade portion 74 may overlap;

wherein, the distance between the two edges of the first blade portion 71 is greater than the distance between the two edges of the second blade portion 72, the two edges of the first blade portion 71 are respectively connected with the two edges of the second blade portion 72, the distance between the two edges of the third blade portion 73 is smaller than the distance between the two edges of the second blade portion 72, and the two edges of the third blade portion 73 are respectively connected with the two edges of the fourth blade portion 74.

It can be appreciated that the first and second blade portions 71, 72 of the present disclosure are smoothly transitioned, the third and fourth blade portions 73, 74 are smoothly transitioned, and the distance between the two blade edges of the first blade portion 71 is greater than the distance between the two blade edges of the fourth blade portion 74, and the distance between the two blade edges of the third blade portion 73 is less than the distance between the two blade edges of the second blade portion 72. Namely: the second blade 72 and the third blade 73 are stepped. Thus, when punching is performed in the direction from the first adhesive layer 1 to the wave-absorbing layer 4 by using the punching tool 7, the first through hole 11 and the second through hole 21 can be smoothly transited, the third through hole 31 and the fourth through hole 41 can be smoothly transited, and the distance between the two hole sides of the third through hole 31 is made smaller than the distance between the two hole sides of the second through hole 21, namely: the through holes as shown in fig. 4 may be formed, that is, the second through holes 21 and the third through holes 31 may be stepped therebetween.

In one embodiment of the present disclosure, as shown in fig. 10, the second blade portion 72 may be connected to the first blade portion 71, the third blade portion 73 may be connected to a side of the second blade portion 72 remote from the first blade portion 71, the fourth blade portion 74 may be connected to a side of the third blade portion 73 remote from the first blade portion 71, and the center lines 9 of the first, second, third, and fourth blade portions 71, 72, 73, 74 coincide;

wherein, the distance between the two edges of the first blade portion 71 is greater than the distance between the two edges of the second blade portion 72, the distance between the two edges of the second blade portion 72 is greater than the distance between the two edges of the third blade portion 73, and the distance between the two edges of the third blade portion 73 is greater than the distance between the two edges of the fourth blade portion 74.

As can be seen, the second blade 72 and the first blade 71 are stepped, the third blade 73 and the second blade 72 are stepped, and the fourth blade 74 and the third blade 73 are stepped. Thus, when punching is performed in the direction from the first adhesive layer 1 to the wave-absorbing layer 4 by the punching tool 7, the distance between the two hole sides of the first through hole 11 can be made larger than the distance between the two hole sides of the second through hole 21, the distance between the two hole sides of the second through hole 21 can be made larger than the distance between the two hole sides of the third through hole 31, and the distance between the two hole sides of the third through hole 31 can be made larger than the distance between the two hole sides of the fourth through hole 41, that is: the through holes shown in fig. 3 may be formed, that is, the first through hole 11 and the second through hole 21, the second through hole 21 and the third through hole 31, and the third through hole 31 and the fourth through hole 41 may be stepped. Further, the thickness of each layer cut by the cutter can be reduced by using the punching cutter 7, and the first angle α of the punching cutter can be reduced as compared with the conventional art, so that the protrusion of the through hole can be reduced.

In addition, in one embodiment of the present disclosure, the second blade portion 72 may be connected to the first blade portion 71, the third blade portion 73 may be connected to a side of the second blade portion 72 remote from the first blade portion 71, the fourth blade portion 74 may be connected to a side of the third blade portion 73 remote from the first blade portion 71, and the center lines 9 of the first, second, third, and fourth blade portions 71, 72, 73, 74 coincide;

wherein, the distance between the two edges of the first blade portion 71 is greater than the distance between the two edges of the fourth blade portion 74, the two edges of the first blade portion 71 are respectively connected with the two edges of the second blade portion 72, the two edges of the second blade portion 72 are respectively connected with the two edges of the third blade portion 73, and the distance between the two edges of the third blade portion 73 is greater than the distance between the two edges of the fourth blade portion 74.

It can be appreciated that the first, second and third blade portions 71, 72, 73 of the present disclosure are smoothly transitioned, and the distance between the two blade edges of the first blade portion 71 is greater than the distance between the two blade edges of the fourth blade portion 74, and the distance between the two blade edges of the third blade portion 73 is greater than the distance between the two blade edges of the fourth blade portion 74. Namely: the third blade 73 and the fourth blade 74 are stepped. Thus, when punching is performed in the direction from the first adhesive layer 1 to the wave-absorbing layer 4 by using the punching tool 7, the first through hole 11, the second through hole 21, and the third through hole 31 can be smoothly transitioned, and the distance between the two hole sides of the third through hole 31 can be made larger than the distance between the two hole sides of the fourth through hole 41, namely: the third through hole 31 and the fourth through hole 41 may be stepped therebetween.

In another embodiment of the present disclosure, the distance between the two knife edges of the first knife 71 is less than the distance between the two knife edges of the fourth knife 74. It will be appreciated that the first blade portion 71 is smaller than the fourth blade portion 74 such that the distance between the two hole sides of the first through hole 11 die-cut therefrom is smaller than the distance between the two hole sides of the fourth through hole 41. And can be used for punching in a direction directed from the wave-absorbing layer 4 to the first adhesive layer 1.

Further, the second blade portion 72 may be connected to the first blade portion 71, the third blade portion 73 may be connected to a side of the second blade portion 72 remote from the first blade portion 71, the fourth blade portion 74 may be connected to a side of the third blade portion 73 remote from the first blade portion 71, and the center lines 9 of the first blade portion 71, the second blade portion 72, the third blade portion 73, and the fourth blade portion 74 overlap;

the distance between the two edges of the first blade portion 71 is smaller than the distance between the two edges of the fourth blade portion 74, the two edges of the first blade portion 71 are respectively connected with the two edges of the second blade portion 72, the distance between the two edges of the third blade portion 73 is larger than the distance between the two edges of the second blade portion 72, and the two edges of the third blade portion 73 are respectively connected with the two edges of the fourth blade portion 74.

It can be appreciated that the first and second blade portions 71, 72 of the present disclosure are smoothly transitioned, the third and fourth blade portions 73, 74 are smoothly transitioned, and the distance between the two blade edges of the first blade portion 71 is smaller than the distance between the two blade edges of the fourth blade portion 74, and the distance between the two blade edges of the third blade portion 73 is greater than the distance between the two blade edges of the second blade portion 72. Namely: the second blade 72 and the third blade 73 are stepped. Thus, when punching is performed in the direction directed to the first adhesive layer 1 by the wave-absorbing layer 4 by using the punching tool 7, the first through hole 11 and the second through hole 21 can be smoothly transited, the third through hole 31 and the fourth through hole 41 can be smoothly transited, and the distance between the two hole sides of the third through hole 31 is made larger than the distance between the two hole sides of the second through hole 21, namely: the second through hole 21 and the third through hole 31 may be stepped therebetween.

In one embodiment of the present disclosure, as shown in fig. 12, the second blade portion 72 may be connected to the first blade portion 71, the third blade portion 73 may be connected to a side of the second blade portion 72 remote from the first blade portion 71, the fourth blade portion 74 may be connected to a side of the third blade portion 73 remote from the first blade portion 71, and the center lines 9 of the first, second, third, and fourth blade portions 71, 72, 73, 74 coincide;

Wherein, the distance between the two edges of the first blade portion 71 is smaller than the distance between the two edges of the second blade portion 72, the distance between the two edges of the second blade portion 72 is smaller than the distance between the two edges of the third blade portion 73, and the distance between the two edges of the third blade portion 73 is smaller than the distance between the two edges of the fourth blade portion 74.

As can be seen, the second blade 72 and the first blade 71 are stepped, the third blade 73 and the second blade 72 are stepped, and the fourth blade 74 and the third blade 73 are stepped. Thus, when punching is performed in the direction directed to the first adhesive layer 1 by the wave-absorbing layer 4 with this punching tool 7, it is possible to make the distance between the two hole sides of the first through hole 11 smaller than the distance between the two hole sides of the second through hole 21, make the distance between the two hole sides of the second through hole 21 smaller than the distance between the two hole sides of the third through hole 31, and make the distance between the two hole sides of the third through hole 31 smaller than the distance between the two hole sides of the fourth through hole 41, that is: the through holes shown in fig. 5 may be formed, that is, the first through hole 11 and the second through hole 21, the second through hole 21 and the third through hole 31, and the third through hole 31 and the fourth through hole 41 may be stepped. Further, the thickness of each layer cut by the cutter can be reduced by using the punching cutter 7, and the first angle α of the punching cutter can be reduced as compared with the conventional art, so that the protrusion of the through hole can be reduced.

the distance between the two edges of the first blade portion 71 is smaller than the distance between the two edges of the fourth blade portion 74, the two edges of the second blade portion 72 are respectively connected with the two edges of the third blade portion 73, the two edges of the third blade portion 73 are respectively connected with the two edges of the fourth blade portion 74, and the distance between the two edges of the second blade portion 72 is larger than the distance between the two edges of the first blade portion 71.

It can be appreciated that the third and fourth blade portions 73, 74 of the second blade portion 72 of the present disclosure are smoothly transitioned, and the distance between the two blade edges of the first blade portion 71 is smaller than the distance between the two blade edges of the fourth blade portion 74, and the distance between the two blade edges of the second blade portion 72 is greater than the distance between the two blade edges of the first blade portion 71. Namely: the first blade 71 and the second blade 72 are stepped. Thus, when punching is performed in the direction directed to the first adhesive layer 1 by the wave-absorbing layer 4 with this punching tool 7, it is possible to smoothly transition the second through hole 21, the third through hole 31, and the fourth through hole 41, and to make the distance between the two hole sides of the second through hole 21 larger than the distance between the two hole sides of the first through hole 11, that is: the second through hole 21 and the first through hole 11 may be stepped therebetween.

In addition to this, in one embodiment of the present disclosure, as shown in fig. 13 to 16, when the first, second, third and fourth blade portions 71, 72, 73 and 74 of the present disclosure are not connected to each other, that is, it is understood that the piercing tool 7 of the present disclosure has four blade portions separated from each other, each of which can be independently operated. Meanwhile, the distance between the two edges of the first blade portion 71 of the present disclosure is smaller than the distance between the two edges of the second blade portion 72, the distance between the two edges of the second blade portion 72 is smaller than the distance between the two edges of the third blade portion 73, and the distance between the two edges of the third blade portion 73 is smaller than the distance between the two edges of the fourth blade portion 74.

Thus, each through hole can be formed in a layered manner by the punching tool 7. For example: as shown in fig. 6, the first through hole 11 may be formed on the first adhesive layer 1 by the first blade portion 71, the second through hole 21 may be formed on the buffer layer 2 by the second blade portion 72, the third through hole 31 may be formed on the heat dissipation layer 3 by the third blade portion 73, and the fourth through hole 41 may be formed on the support layer by the fourth blade portion 74. Finally, each film layer is sequentially bonded again to form the heat dissipation film.

For convenience of illustration, the first included angle α is denoted as an included angle between the parallel line of the knife edge and the center line in fig. 10 to 12, which is the same as the included angle between the knife edge and the center line.

A third aspect of the present disclosure provides a die cutting apparatus, as shown in fig. 10-16, which may include: a base 8 and a punching tool 7, wherein the punching tool 7 may be mounted on the base 8, and the punching tool 7 may be the punching tool 7 described above. Further, the present disclosure may choose the mounting position of the punching tool 7 on the base 8 according to actual needs, which is within the scope of the present disclosure. Meanwhile, the punching device can be used for manufacturing the heat dissipation film. Therefore, the heat dissipation film holes in the heat dissipation film can not generate bulges, the film printing phenomenon can not occur, and the display effect of the display device can be obviously improved.

A fourth aspect of the present disclosure provides a method of manufacturing a heat dissipation film, which can apply the above-described die cutting apparatus. The heat dissipation film holes in the heat dissipation film manufactured by the manufacturing method of the heat dissipation film can not generate bulges and can not generate film printing phenomenon, so that the display effect of the display device can be obviously improved. As shown in fig. 17, the method of manufacturing the heat dissipation film may include:

step S10, forming a first through hole 11 on the first adhesive layer by using the first blade 71;

Step S20, forming a second through hole 21 on the buffer layer 2 by using the second blade 72;

step S30, forming a third through hole 31 in the heat dissipation layer 3 by using the third blade 73;

step S40, a fourth through hole 41 is formed in the wave-absorbing layer 4 by using a fourth blade 74.

Wherein the center lines 9 of the first through hole 11, the second through hole 21, the third through hole 31 and the fourth through hole 41 can be coincident, and the cross sections of the first through hole 11, the second through hole 21, the third through hole 31 and the fourth through hole 41 along the extending direction of the center lines 9 are provided with two hole edges, and a first included angle alpha is formed between the two hole edges of the first through hole 11, the second through hole 21, the third through hole 31 and the fourth through hole 41 and the center lines 9; and the distance between the two hole edges of the first through hole 11 is larger than the distance between the two hole edges of the fourth through hole 41; alternatively, the distance between the two hole sides of the first through hole 11 is smaller than the distance between the two hole sides of the fourth through hole 41.

The method for manufacturing the heat dissipation film provided by the present disclosure has been described in detail in the above embodiments, and thus, the detailed description in the above embodiments will not be repeated, and reference may be made to the detailed description in the above embodiments.

In a fifth aspect of the present disclosure, there is provided a display device, which may include: a display panel and a heat dissipation film. Wherein the display panel may have a light-emitting side and a backlight side. The heat dissipation film may be the above-described heat dissipation film, and the heat dissipation film may be located at the backlight side. As the heat dissipation film holes in the heat dissipation film can not generate bulges, the deformation of the display panel can not be caused, and the film printing phenomenon can not occur. Therefore, compared with the prior art, the display device provided by the disclosure has better display effect.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any adaptations, uses, or adaptations of the disclosure following the general principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims

1. A heat dissipation film, comprising:

a first adhesive layer having a first through hole;

The support structure is used for supporting the film layer corresponding to the lowest through hole;

the distance between the two hole edges of the first through hole is larger than the distance between the two hole edges of the fourth through hole; or, the distance between the two hole edges of the first through hole is smaller than the distance between the two hole edges of the fourth through hole; the width of the cross section of the support structure in the direction of the central line is larger than the distance between two hole edges of the smallest through hole;

the protective layer body is provided with a first area and a second area, the second area is arranged around the first area, the projection of the fourth through hole on the protective layer is positioned in the first area, and the size of the first area is larger than the distance between two hole edges of the fourth through hole; the second bonding layer is located in the second area and located at one side of the protective layer body, which is close to the wave absorbing layer.

2. The heat-dissipating film of claim 1 wherein,

the distance between the two hole edges of the first through hole is larger than the distance between the two hole edges of the fourth through hole, the two hole edges of the first through hole are respectively connected with the two hole edges of the second through hole, the distance between the two hole edges of the third through hole is smaller than the distance between the two hole edges of the second through hole, and the two hole edges of the third through hole are respectively connected with the two hole edges of the fourth through hole;

3. The heat-dissipating film of claim 1 wherein,

the distance between the two hole edges of the first through hole is larger than the distance between the two hole edges of the second through hole, the distance between the two hole edges of the second through hole is larger than the distance between the two hole edges of the third through hole, and the distance between the two hole edges of the third through hole is larger than the distance between the two hole edges of the fourth through hole;

4. A die cutting tool for manufacturing the heat dissipation film according to any one of the above claims 1 to 3, characterized by comprising:

a first cutter part corresponding to punching the first through hole;

a second cutter part corresponding to the second through hole;

a third cutter part corresponding to the third through hole;

a fourth cutter part corresponding to punching the fourth through hole;

5. The piercing tool as recited in claim 4, wherein the second blade portion is connected to the first blade portion, the third blade portion is connected to a side of the second blade portion remote from the first blade portion, the fourth blade portion is connected to a side of the third blade portion remote from the first blade portion, and centerlines of the first, second, third, and fourth blade portions coincide;

6. The piercing tool as recited in claim 4, wherein the second blade portion is connected to the first blade portion, the third blade portion is connected to a side of the second blade portion remote from the first blade portion, the fourth blade portion is connected to a side of the third blade portion remote from the first blade portion, and centerlines of the first, second, third, and fourth blade portions coincide;

7. The piercing tool as recited in claim 4, wherein the first included angle has a value in the range of 0 ° to 8 °.

8. A die cutting apparatus, comprising:

a base;

a blanking tool mounted to the base and being as claimed in any one of claims 4 to 7.

9. A method for manufacturing a heat dissipation film, wherein the method for manufacturing a heat dissipation film uses the die cutting apparatus according to claim 8, the method comprising:

10. A display device, comprising:

a display panel having a light-emitting side and a backlight side;

a heat dissipation film according to any one of claims 1 to 3, wherein the heat dissipation film is located on the backlight side.