CN113613389A - High-density via hole processing method capable of reducing cost - Google Patents

High-density via hole processing method capable of reducing cost Download PDF

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Publication number
CN113613389A
CN113613389A CN202110823473.1A CN202110823473A CN113613389A CN 113613389 A CN113613389 A CN 113613389A CN 202110823473 A CN202110823473 A CN 202110823473A CN 113613389 A CN113613389 A CN 113613389A
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CN
China
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plate
groove
movable
movable groove
block
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CN202110823473.1A
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Chinese (zh)
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CN113613389B (en
Inventor
沈健
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Yunjian Information Technology Co ltd
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Yunjian Information Technology Co ltd
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Publication of CN113613389A publication Critical patent/CN113613389A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The invention discloses a high-density via hole processing method capable of reducing cost, which comprises the following steps: a. firstly, drilling a through hole with an aperture A in a drilling stage of PCB processing; b. drilling a via hole with a certain depth and a certain aperture B by performing depth control drilling on two surfaces of the via hole; c. plating copper on the wall of the via hole; d. a through hole with the aperture C is drilled again at the position of the through hole, so that the copper sheet of the middle small hole section is ensured to be drilled, and the effect of open circuit of the upper and lower through holes is realized; compared with the HDI laser drilling process, the depth control drill is mature and simple, and the production cost of the PCB can be effectively reduced; originally, the space of one through hole can realize the design of different networks of two through holes, thereby improving the density of the through holes and fully utilizing the space on the PCB.

Description

High-density via hole processing method capable of reducing cost
Technical Field
The invention belongs to the technical field of PCB processing, and particularly relates to a high-density via hole processing method capable of reducing cost.
Background
The development of electronic products towards function completion and light, thin and small size directly leads to the formation of high-density design of PCB. Vias occupy a large portion of the PCB area, and are certainly an optimal direction to further increase the density of PCB designs. The existing PCB punching mode generally comprises an HDI technology and a deep micro-hole technology, but the HDI technology has large process difficulty and high PCB production cost, deep micro-holes need a deep copper plating process, the process difficulty is large, the PCB production cost is high, and the PCB is not suitable for large-scale production; meanwhile, due to the fact that the sizes of all the PCB boards are different, the common drilling equipment cannot meet the requirement of completing the drilling operation on the whole PCB board, the application range of the equipment is small, and multiple sets of equipment are needed to assist in the drilling operation.
Disclosure of Invention
The invention provides a high-density via hole processing method for reducing cost in order to overcome the defects of the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme: a high-density via hole processing method capable of reducing cost comprises the following steps:
a. firstly, drilling a through hole with an aperture A in a drilling stage of PCB processing;
b. drilling a via hole with a certain depth and a certain aperture B by performing depth control drilling on two surfaces of the via hole;
c. plating copper on the wall of the via hole;
d. a through hole with the aperture C is drilled again at the position of the through hole, so that the copper sheet of the middle small hole section is ensured to be drilled, and the effect of open circuit of the upper and lower through holes is realized;
the drilling machine comprises a mounting frame, a material loading box arranged on the mounting frame and a drill bit arranged above the material loading box, the mounting frame comprises a bottom plate, a vertical plate arranged on the bottom plate and a mounting plate arranged at the top of the vertical plate, an air cylinder is arranged at the bottom of the mounting plate, a piston rod of the air cylinder is provided with a motor, and the drill bit is arranged on an output shaft of the motor; a first movable groove is formed in the bottom plate, a first movable block is arranged in the first movable groove, a first connecting rod is arranged on the first movable block, a second movable groove is formed in the first connecting rod, a second movable block is arranged in the second movable groove, the material loading box is arranged on the second movable block, and the first connecting rod is perpendicular to the bottom plate; the vertical plate is provided with a cooling assembly matched with the drill bit; a first connecting shaft is arranged on an output shaft of the motor, a mounting groove is formed in the bottom of the first connecting shaft, a fourth connecting groove is formed in the top of the mounting groove, a connecting ring is arranged in the fourth connecting groove, an opening is formed in the side wall of the fourth connecting groove, a fifth driving wheel matched with the connecting ring is arranged in the opening, a seventh connecting block matched with the mounting groove is arranged at the top of the drill bit, a second connecting shaft matched with the fourth connecting groove is arranged at the top of the seventh connecting block, and the second connecting shaft and the connecting ring are matched through threads; when the PCB is in a drilling stage, the PCB is placed on a material carrying box, a first movable block and a second movable block move to drive the material carrying box to move, a drilling hole on the PCB is moved to a position below a drill bit, the drill bit is driven by an air cylinder to move downwards and abuts against the PCB, the drill bit is driven by a motor to rotate, and the drill bit drills a through hole on the PCB; after the first through hole is drilled out, the first movable block or the second movable block moves again, the next punching hole on the PCB moves to the position below the drill bit, and the drill bit descends again to punch a through hole on the PCB until the punching operation of the whole PCB is completed.
Compared with the HDI laser drilling process, the depth control drill is mature and simple, and the production cost of the PCB can be effectively reduced; the original through hole space can realize the design of different networks of two through holes, thereby improving the density of the through holes and fully utilizing the space on the PCB; the position of the PCB is adjusted by utilizing the movement of the first movable block and the second movable block, so that the punching operation can be completed at a plurality of different positions on the PCB, the hole density on the PCB is improved, and the flexibility of the punching machine is improved; the cooling assembly is used for cooling the drill bit, so that the influence of heating of the drill bit on the PCB after long-time work is avoided, the defective rate of the PCB in the processing process is reduced, and the production cost of the PCB is reduced; through the removal of first movable block and second movable block, do the adjustment to the position of PCB board, will need punch the position and remove to the drill bit below to do the operation of punching on whole PCB board, can accomplish the processing to the PCB board of multiple not unidimensional, effective lifting means application scope, further reduction PCB board's manufacturing cost.
The aperture A and the aperture B meet the condition that B is more than or equal to A + 8.
The aperture A, the aperture B and the aperture C satisfy that A +6 is more than or equal to C and less than or equal to B.
The first movable block is provided with a first connecting groove, the bottom of the first connecting rod is provided with a first connecting block, the bottom of the first connecting block is provided with a third movable groove, a second connecting block matched with the first connecting groove is arranged in the third movable groove, the bottom of the second connecting block is provided with a first limiting plate, the inner wall of the first connecting groove is provided with a fourth movable groove, a second connecting rod is arranged in the fourth movable groove, one end of the second connecting rod is provided with a second limiting plate, the other end of the second connecting rod is provided with a third limiting plate, and the inner wall of the first connecting groove is provided with a supporting component matched with the second limiting plate; when the first connecting rod is installed, the second connecting plate is located at a position close to the inner wall of the first connecting groove, the second connecting block is inserted into the first connecting groove, the first limiting plate moves to the bottom of the first connecting groove, the second connecting rod moves towards the inside of the first connecting groove, the second limiting plate abuts against the side wall of the second connecting block, the second limiting plate is fixed by the supporting component, and the first connecting rod is connected with the first movable block.
The fixing assembly comprises a first connecting plate hinged to the second limiting plate, a second connecting plate hinged to one end of the first connecting plate, a fourth limiting plate and a fifth limiting plate, and the fourth limiting plate and the fifth limiting plate are matched with the first connecting plate and the second connecting plate; one end of the second connecting plate is hinged to the inner wall of the first connecting groove; a fifth movable groove is formed in the inner wall of the first connecting groove, a third connecting plate is arranged in the fifth movable groove, the fourth limiting plate and the fifth limiting plate are arranged on the third connecting plate, and a first connecting spring is arranged on the third connecting plate; after the second connecting block is arranged in the first connecting groove, the second connecting rod drives the second limiting plate to move towards the middle of the first connecting groove, the second limiting plate drives the first connecting plate and the second connecting plate to rotate when moving, the second limiting plate abuts against the second connecting block, the third connecting plate drives the fourth limiting plate and the fifth limiting plate to enter the first connecting groove, the first connecting plate and the second connecting plate are located between the fourth limiting plate and the fifth limiting plate, the first connecting plate and the second connecting plate cannot rotate to fix the second limiting plate, and the first connecting rod is connected with the first movable block.
A first cavity is formed in the first movable block, and a first connecting cavity communicated with the fourth movable groove is formed in the bottom of the first cavity; a first push plate is arranged in the first cavity, a first supporting spring is arranged at the bottom of the first push plate, a first push rod is arranged at the top of the first push plate, a second connecting cavity communicated with the fifth movable groove is arranged on the side wall of the third movable groove, and the second connecting cavity is opened after the third limiting plate moves to one end of the fifth movable groove; a second cavity is formed in the bottom of the first connecting cavity, a second push plate is arranged in the second cavity, and a second supporting spring is arranged at the bottom of the second push plate; a sixth movable groove is formed in the side wall of the first connecting cavity, and a first baffle is arranged in the sixth movable groove; when the second connecting block is inserted into the first connecting groove, the first connecting block pushes the first push rod to move downwards, the first push rod drives the first push plate to move downwards, the first push plate pushes air in the first cavity to enter the fourth movable groove, the third limiting plate moves under the pushing of air pressure, after the third limiting plate moves to one end of the fourth movable groove, the second connecting cavity is opened, the air enters the fifth movable groove from the second connecting cavity, the air pressure pushes the third connecting plate to move, and the fourth limiting plate and the fifth limiting plate move to two sides of the first connecting plate and the second connecting plate respectively to complete the installation of the first connecting rod; when the first connecting rod is detached, the first baffle is pushed towards one end of the sixth movable groove, the first connecting cavity is communicated with the second cavity, the third limiting plate is pulled by the first connecting spring to move back, air in the fourth movable groove and air in the fifth movable groove enter the second cavity, the second limiting plate is moved away from the top of the first limiting plate, the second connecting block is taken out from the first connecting groove, and detachment of the first connecting rod is completed.
A seventh movable groove is formed in the inner wall of the sixth movable groove, a sealing plate matched with the seventh movable groove is arranged on the first baffle, and a first push block is arranged at one end of the first baffle; an eighth movable groove is formed in the side wall of the first cavity, a first transmission groove is formed in the side wall of the eighth movable groove, a ninth movable groove communicated with the sixth movable groove is formed in the bottom of the first transmission groove, two groups of rotating rollers are arranged in the eighth movable groove, a synchronous belt is wound on the two groups of rotating rollers, and a third push plate is arranged on the synchronous belt; a first driving wheel matched with the synchronous belt and a second driving wheel matched with the first driving wheel are arranged in the first driving groove, a second push rod matched with the second driving wheel is arranged in the ninth movable groove, a first sliding block is arranged at the bottom of the second push rod, a first sliding groove matched with the first sliding block is arranged at the bottom of the ninth movable groove, and a first reset spring is arranged on the first sliding block; when the first connecting rod is detached, the first baffle is pushed towards one end of the sixth movable groove, the second cavity is communicated with the first connecting cavity, the second connecting block is taken out of the first connecting groove after the second limiting plate moves, the first supporting spring pushes the first push plate to move upwards, the first push plate contacts with the third push plate when moving upwards, the third push plate drives the synchronous belt to rotate, the second driving wheel drives the second push rod to move, the second push rod pushes the first baffle to move into the first connecting cavity, the first baffle seals the second cavity, and resetting of the first baffle is completed.
A tenth movable groove is formed in the bottom of the second connecting block, a second pushing block is arranged in the tenth movable groove, and a second connecting spring is arranged on the second pushing block; a second sliding block is arranged on the second connecting block, and a second sliding groove matched with the second sliding block is arranged on the inner wall of the third movable groove; an eleventh movable groove communicated with the tenth movable groove is formed in the side wall of the second connecting block, a third connecting spring is arranged in the eleventh movable groove, and a fourth push plate is arranged at one end of the third connecting spring; a twelfth movable groove is formed in the inner wall of the third movable groove, a first limiting block matched with the eleventh movable groove is arranged in the twelfth movable groove, and a fourth connecting spring is arranged on the first limiting block; a thirteenth movable groove is formed in the side wall of the eleventh movable groove, a second limiting block is arranged in the thirteenth movable groove, and a limiting groove matched with the second limiting block is formed in the inner wall of the third movable groove; a fourteenth movable groove is formed in the second limiting block, a fifth push plate is arranged in the fourteenth movable groove, and a third supporting spring is arranged on the fifth push plate; when the second connecting block is not arranged in the first connecting groove, the first limiting block is inserted in the eleventh movable groove, when the second connecting block is inserted in the first connecting groove, the first limiting plate abuts against the bottom of the first connecting groove, the first connecting block is positioned above the first push rod at the moment, the second push block abuts against the bottom of the first connecting groove and then moves in the tenth movable groove, air in the tenth movable groove enters the eleventh movable groove, the fourth push plate moves towards the outer side of the eleventh movable groove, the fourth push plate pushes the first limiting block out of the eleventh movable groove, the fourth push plate moves to push the fifth push plate to move, the second limiting block abuts against the inner wall of the third movable groove, and the fifth push plate moves in the fourteenth movable groove; when the first connecting block is pushed to move downwards, the second connecting block moves towards the top of the third movable groove, the second limiting block moves to the side of the limiting groove, the second limiting block extends out of the thirteenth movable groove and is inserted into the limiting groove, and the first connecting block pushes the first push rod into the first cavity to complete the installation of the first connecting rod.
The material loading box is characterized in that a material loading platform is arranged on the inner wall of the material loading box, a fifteenth movable groove is formed in the inner wall of the material loading box, a movable plate is arranged in the fifteenth movable groove, a fourth supporting spring is arranged at the bottom of the movable plate, a sixteenth movable groove is formed in the movable plate, a fixed plate is arranged in the sixteenth movable groove, a plurality of first grooves and second grooves are formed in the fixed plate, a fifth connecting spring is arranged on the inner wall of each first groove, a third groove matched with the second groove is formed in the movable plate, a fourth connecting plate matched with the third groove is arranged in the fifteenth movable groove, a seventeenth movable groove is formed in the side wall of the fourth connecting plate, a sixth connecting spring is arranged in the seventeenth movable groove, a fifth connecting plate is arranged at one end of the sixth connecting spring, and a ratchet is arranged on the fifth connecting plate; a first movable cavity is arranged above the fifteenth movable groove, an eighteenth movable groove is arranged at the bottom of the first movable cavity, a sixth connecting plate is arranged in the first movable cavity, a seventh connecting spring is arranged at the top of the sixth connecting plate, and a sixth push plate is arranged at the bottom of the sixth connecting plate; after the PCB is placed on the material loading platform, the fifth connecting plate moves towards the seventeenth movable groove, the fixed plate extends out of the sixteenth movable groove, the fixed plate moves above the PCB, the sixth connecting plate drives the sixth push plate to move downwards, the sixth push plate pushes the movable plate to move downwards, the movable plate drives the fixed plate to move downwards together, the fixed plate presses on the PCB to fix the PCB on the material loading platform, and the placement of the PCB is completed; after the whole PCB board is punched, the seventh connecting spring pulls the sixth connecting plate to move upwards, the fourth supporting spring pushes the movable plate to move upwards, the fixed plate is pushed in the sixteenth movable groove, the fixed plate is fixed in the sixteenth movable groove after being contacted with the fifth connecting plate, and the PCB board is taken out from the material loading box and collected.
A connecting pipe is arranged on the side wall of the loading box, a third connecting rod penetrates through the connecting pipe, a sixth limiting plate is arranged at one end of the third connecting rod, a handle is arranged at the other end of the third connecting rod, an eighth connecting spring and a first connecting rope are arranged on the sixth limiting plate, and one end of the first connecting rope is connected with a fifth connecting plate; a fifth connecting block is arranged at the top of the connecting pipe, a second movable cavity communicated with the first movable cavity is arranged on the fifth connecting block, a second transmission groove communicated with the connecting pipe is arranged at the bottom of the second movable cavity, a third push block is arranged in the second movable cavity, a ninth connecting spring is arranged on the side wall of the third push block, and a third transmission wheel used for transmitting the third push block and the third connecting rod is arranged in the second transmission groove; the handle is provided with an adjusting button which controls the handle to turn; after the PCB is placed on the material loading table, a third connecting rod is pulled out of the connecting pipe, the fifth connecting plate is pulled by a first connecting rope to move into a seventeenth movable groove, the fifth connecting plate enters the seventeenth movable groove, a fixed plate extends out of a sixteenth movable groove, the third connecting rod is released, a handle is pushed, the handle drives the third connecting rod to rotate, a third driving wheel drives a third pushing block to move, air in a second movable cavity enters a first movable cavity to push the sixth connecting plate to move downwards, a sixth pushing plate pushes a movable plate to move downwards, and the fixed plate is pressed on the PCB to fix the PCB; after the completion of punching of PCB board, rotate adjustment button, the antiport handle, the second ejector pad is moved back, and first activity intracavity air backward flow is to the second activity intracavity, and the sixth push pedal up-motion promotes the fixed plate toward the sixteenth activity inslot, is fixed in the sixteenth activity inslot after the fixed plate contacts with the fifth connecting plate, takes out the PCB board from carrying the magazine-in, does the collection to the PCB board.
The invention has the following advantages: compared with the HDI laser drilling process, the depth control drill is mature and simple, and the production cost of the PCB can be effectively reduced; the original through hole space can realize the design of different networks of two through holes, thereby improving the density of the through holes and fully utilizing the space on the PCB; through the removal of first movable block and second movable block, do the adjustment to the position of PCB board, will need punch the position and remove to the drill bit below to do the operation of punching on whole PCB board, can accomplish the processing to the PCB board of multiple not unidimensional, effective lifting means application scope, further reduction PCB board's manufacturing cost.
Drawings
FIG. 1 is a schematic view of the process of the present invention.
Fig. 2 shows one of the finished products of the present invention.
Fig. 3 shows one of the finished products of the present invention.
Fig. 4 is a schematic view of the structure of the punch of the present invention.
Fig. 5 is a front view of the punch of the present invention.
Fig. 6 is a cross-sectional view taken along a-a in fig. 5.
Fig. 7 is an enlarged view of a portion a in fig. 6.
Fig. 8 is an enlarged view of fig. 6 at B.
Fig. 9 is a cross-sectional view taken along line B-B of fig. 5.
Fig. 10 is an enlarged view of fig. 9 at C.
Fig. 11 is an enlarged view of fig. 10 at D.
Fig. 12 is a cross-sectional view taken along line C-C of fig. 5.
Fig. 13 is an enlarged view of fig. 12 at E.
Fig. 14 is a cross-sectional view taken along line D-D in fig. 5.
Fig. 15 is an enlarged view of fig. 14 at F.
Fig. 16 is a cross-sectional view taken along line E-E of fig. 5.
Fig. 17 is an enlarged view at G in fig. 16.
Fig. 18 is a cross-sectional view taken along F-F in fig. 5.
Fig. 19 is an enlarged view of fig. 18 at H.
Fig. 20 is a cross-sectional view taken along G-G in fig. 5.
Fig. 21 is an enlarged view at I in fig. 20.
Fig. 22 is a cross-sectional view taken along H-H in fig. 5.
Fig. 23 is an enlarged view at J in fig. 22.
Fig. 24 is a cross-sectional view taken along line I-I of fig. 5.
Fig. 25 is an enlarged view at K in fig. 24.
Fig. 26 is a right side view of the punch of the present invention.
Fig. 27 is a cross-sectional view taken along J-J of fig. 26.
Fig. 28 is an enlarged view at L in fig. 27.
Fig. 29 is an enlarged view of fig. 27 at M.
Fig. 30 is an enlarged view of fig. 27 at N.
Fig. 31 is a cross-sectional view taken along line K-K of fig. 26.
Fig. 32 is an enlarged view at O in fig. 31.
Fig. 33 is a cross-sectional view taken along L-L of fig. 26.
Fig. 34 is an enlarged view at P in fig. 33.
Fig. 35 is a cross-sectional view taken along line M-M of fig. 26.
Fig. 36 is an enlarged view at Q in fig. 35.
Detailed Description
As shown in fig. 1, a method for processing high-density vias with reduced cost includes the following steps:
a. firstly, drilling a through hole with an aperture A in a drilling stage of PCB processing;
b. drilling a via hole with a certain depth and a certain aperture B (B is more than or equal to A +8) on two surfaces of the via hole by depth control drilling;
c. plating copper on the wall of the via hole;
d. drilling a through hole with a primary aperture C again at the position of the through hole, wherein C is more than or equal to A +6 and less than or equal to B, so as to ensure that a copper sheet of the middle small hole section is drilled, and realize the effect of open circuit of the upper through hole and the lower through hole;
the through hole produced in the mode is divided into an upper through hole and a lower through hole, and the two through holes can be designed to have different network properties; the through hole needs to meet the requirement of production, the aperture A is less than C and less than B, and the difference value of the three values has certain requirements according to different plate factories.
The sequence of the step a and the step n has no requirement, and the steps of drilling the hole in depth first and then drilling the through hole can also be realized.
The combined drill tool with the customized size is used for realizing the production of the stepped hole with the large upper part and the small lower part by one-time depth control drilling.
Whether the through holes are plugged or not is not limited, and the final result is not influenced.
The final drilling requirement is not required to be too strict, the copper in the hole on the single side of the finished hole is allowed to be damaged by the last drilling, the requirement is properly relaxed, the flexibility of the through hole can be increased, and the aim of the invention can also be achieved.
The relationship of the A, B and C apertures can be adjusted according to the capability of the plate mill.
Finished vias are also acceptable as shown in fig. 2-3.
As shown in fig. 3 to 36, the drilling in the steps a, b and d is completed on a drilling machine, the drilling machine includes a mounting frame, a carrier box 3 disposed on the mounting frame, and a drill bit 6 disposed above the carrier box 3, the mounting frame includes a bottom plate 1, a vertical plate 11 disposed on the bottom plate 1, and a mounting plate 12 disposed on the top of the vertical plate 11, a cylinder 13 is disposed at the bottom of the mounting plate 12, a motor 14 is disposed on a piston rod of the cylinder 13, and the drill bit 6 is disposed on an output shaft of the motor 14; a first movable groove is formed in the bottom plate 1, a first movable block 16 is arranged in the first movable groove, a first connecting rod 2 is arranged on the first movable block 16, a second movable groove is formed in the first connecting rod 2, a second movable block 22 is arranged in the second movable groove, the material loading box 3 is arranged on the second movable block 22, and the first connecting rod 2 is perpendicular to the bottom plate 1; a cooling component matched with the drill bit 6 is arranged on the vertical plate 11; when a PCB is drilled, the PCB is placed on a material carrying box 3, a first movable block 16 and a second movable block 22 move to drive the material carrying box 3 to move, a drilling hole on the PCB is moved to the position below a drill bit 6, the cylinder 13 drives the drill bit 6 to move downwards, the drill bit 6 abuts against the PCB, a motor 14 drives the drill bit 6 to rotate, and the drill bit 6 drills a through hole on the PCB; after the first through hole is drilled, the first movable block 16 or the second movable block 22 moves again, the next drilling hole on the PCB moves to the position below the drill bit 6, and the drill bit 6 descends again to drill the through hole on the PCB until the drilling operation of the whole PCB is completed.
As shown in fig. 8 and 30, a first connecting groove is formed in the first movable block 16, a first connecting block 22 is arranged at the bottom of the first connecting rod 2, a third movable groove is formed in the bottom of the first connecting block 22, a second connecting block 23 matched with the first connecting groove is arranged in the third movable groove, a first limiting plate 239 is arranged at the bottom of the second connecting block 23, a fourth movable groove is formed in the inner wall of the first connecting groove, a second connecting rod 168 is arranged in the fourth movable groove, a second limiting plate 1681 is arranged at one end of the second connecting rod 168, a third limiting plate 1682 is arranged at the other end of the second connecting rod 168, and a supporting component matched with the second limiting plate 1681 is arranged on the inner wall of the first connecting groove; when the first connecting rod 2 is installed, the second connecting plate 1684 is positioned at a position close to the inner wall of the first connecting groove, the second connecting block 23 is inserted into the first connecting groove, the first limiting plate 239 moves to the bottom of the first connecting groove, the second connecting rod 168 moves into the first connecting groove, the second limiting plate 1681 abuts against the side wall of the second connecting block 23, and the supporting component fixes the second limiting plate 1681 to complete the connection between the first connecting rod 2 and the first movable block 16; through the installation of the first movable block and the first connecting rod, the material carrying boxes can be replaced, and the material carrying boxes with different sizes can be replaced to process the PCB boards with different sizes, so that the application range of the perforating machine is enlarged.
As shown in fig. 30 and 34, the fixing assembly includes a first connecting plate 1683 hinged to the second limiting plate 1681, a second connecting plate 1684 hinged to one end of the first connecting plate 1683, and a fourth limiting plate 1692 and a fifth limiting plate 1693 cooperating with the first connecting plate 1683 and the second connecting plate 1684; one end of the second connecting plate 1684 is hinged on the inner wall of the first connecting groove; a fifth movable groove is formed in the inner wall of the first connecting groove, a third connecting plate 169 is arranged in the fifth movable groove, the fourth limiting plate 1692 and the fifth limiting plate 1693 are arranged on the third connecting plate 169, and a first connecting spring 1691 is arranged on the third connecting plate 169; after the second connecting block 23 is arranged in the first connecting groove, the second connecting rod 168 drives the second limiting plate 1681 to move towards the middle of the first connecting groove, the second limiting plate 1681 drives the first connecting plate 1683 and the second connecting plate 1684 to rotate when moving, after the second limiting plate 1681 abuts against the second connecting block 23, the third connecting plate 169 drives the fourth limiting plate 1692 and the fifth limiting plate 1693 to enter the first connecting groove, at this time, the first connecting plate 1683 and the second connecting plate 1684 are positioned between the fourth limiting plate 1692 and the fifth limiting plate 1693, the first connecting plate 1683 and the second connecting plate 1684 cannot rotate to fix the second limiting plate 1681, and the connection between the first connecting rod 2 and the first movable block 16 is completed; under the setting of fourth limiting plate and fifth limiting plate, make first connecting plate and the unable rotation of second connecting plate to play the fixed action to the second limiting plate, promote the fixed effect of second limiting plate to the second connecting block.
As shown in fig. 10 and 30, a first cavity is formed in the first movable block 16, and a first connection cavity communicated with the fourth movable groove is formed in the bottom of the first cavity; a first push plate 161 is arranged in the first cavity, a first support spring 1612 is arranged at the bottom of the first push plate 161, a first push rod 1611 is arranged at the top of the first push plate 161, a second connecting cavity communicated with the fifth movable groove is arranged on the side wall of the third movable groove, and when the third limiting plate 1682 moves to one end of the fifth movable groove, the second connecting cavity is opened; a second cavity is formed in the bottom of the first connecting cavity, a second push plate 162 is arranged in the second cavity, and a second supporting spring 1621 is arranged at the bottom of the second push plate 162; a sixth movable groove is formed in the side wall of the first connecting cavity, and a first baffle 163 is arranged in the sixth movable groove; when the second connecting block 23 is inserted into the first connecting groove, the first connecting block 22 pushes the first push rod 1611 to move downwards, the first push rod 1611 drives the first push plate 161 to move downwards, the first push plate 161 pushes air in the first cavity to enter the fourth movable groove, the third limiting plate 1682 moves under the push of air pressure, after the third limiting plate 1682 moves to one end of the fourth movable groove, the second connecting cavity is opened, air enters the fifth movable groove from the second connecting cavity, the third connecting plate 169 is pushed to move by the air pressure, the fourth limiting plate 1692 and the fifth limiting plate 1693 move to two sides of the first connecting plate 1683 and the second connecting plate 1684 respectively, and the installation of the first connecting rod 2 is completed; when the first connecting rod 2 is detached, the first baffle 163 is pushed to one end of the sixth movable groove, the first connecting cavity is communicated with the second cavity, the first connecting spring 1691 pulls the third limiting plate 1682 to move back, air in the fourth movable groove and the fifth movable groove enters the second cavity, the second limiting plate 1681 is moved away from the top of the first limiting plate 239, the second connecting block 23 is taken out from the first connecting groove, and detachment of the first connecting rod 2 is completed.
As shown in fig. 11 and 36, a seventh movable groove is disposed on an inner wall of the sixth movable groove, a sealing plate 1632 matched with the seventh movable groove is disposed on the first baffle 163, and a first pushing block 1631 is disposed at one end of the first baffle 163; the sealing plate is matched with the seventh movable groove, so that the first baffle can still seal the sixth movable groove after moving; an eighth movable groove is formed in the side wall of the first cavity, a first transmission groove is formed in the side wall of the eighth movable groove, a ninth movable groove communicated with the sixth movable groove is formed in the bottom of the first transmission groove, two groups of rotating rollers 164 are arranged in the eighth movable groove, a synchronous belt 1641 is wound on the two groups of rotating rollers 164, and a third push plate 1642 is arranged on the synchronous belt 1641; a first driving wheel 165 matched with the synchronous belt 1641 and a second driving wheel 166 matched with the first driving wheel 165 are arranged in the first driving groove, a second push rod 167 matched with the second driving wheel 166 is arranged in the ninth movable groove, a first sliding block 1671 is arranged at the bottom of the second push rod 167, a first sliding groove matched with the first sliding block 1671 is arranged at the bottom of the ninth movable groove, and a first reset spring is arranged on the first sliding block 1671; when dismantling head rod 2, promote first baffle 163 toward sixth activity groove one end, the second cavity communicates with each other with first connecting chamber, second limiting plate 1681 takes out second connecting block 23 from first connecting chamber after removing, first supporting spring 1612 promotes first push pedal 161 and up-moves, first push pedal 161 contacts with third push pedal 1642 during up-moving, third push pedal 1642 drives hold-in range 1641 and rotates, second drive wheel 166 drives second push rod 167 and removes, second push rod 167 promotes first baffle 163 and removes to first connecting chamber, first baffle 163 seals the second cavity, accomplish resetting of first baffle 163.
As shown in fig. 25 and 30, a tenth movable groove is formed in the bottom of the second connecting block 23, a second pushing block 232 is arranged in the tenth movable groove, and a second connecting spring 233 is arranged on the second pushing block 232; a second sliding block 231 is arranged on the second connecting block 23, and a second sliding groove matched with the second sliding block 231 is arranged on the inner wall of the third movable groove; an eleventh movable groove communicated with the tenth movable groove is formed in the side wall of the second connecting block 23, a third connecting spring 235 is arranged in the eleventh movable groove, and a fourth push plate 234 is arranged at one end of the third connecting spring 235; a twelfth movable groove is formed in the inner wall of the third movable groove, a first limiting block 221 matched with the eleventh movable groove is arranged in the twelfth movable groove, and a fourth connecting spring 222 is arranged on the first limiting block 221; a thirteenth movable groove is formed in the side wall of the eleventh movable groove, a second limiting block 236 is arranged in the thirteenth movable groove, and a limiting groove matched with the second limiting block 236 is formed in the inner wall of the third movable groove; a fourteenth movable groove is formed in the second limiting block 236, a fifth push plate 237 is arranged in the fourteenth movable groove, and a third supporting spring 238 is arranged on the fifth push plate 237; when the second connecting block 23 is not installed in the first connecting groove, the first limit block 221 is inserted into the eleventh movable groove, when the second connecting block 23 is inserted into the first connecting groove, the first limit plate 239 abuts against the bottom of the first connecting groove, at this time, the first connecting block 22 is located above the first push rod 1611, the second push block 232 abuts against the bottom of the first connecting groove and moves into the tenth movable groove, air in the tenth movable groove enters into the eleventh movable groove, the fourth push plate 234 moves towards the outer side of the eleventh movable groove, the fourth push plate 234 pushes the first limit block 221 out of the eleventh movable groove, the fourth push plate 234 moves to push the fifth push plate 237 to move, the second limit block 236 abuts against the inner wall of the third movable groove, and the fifth push plate 237 moves in the fourteenth movable groove; when the first connecting block 22 is pushed to move downwards, the second connecting block 23 moves towards the top of the third movable groove, after the second limiting block 236 moves to one side of the limiting groove, the second limiting block 236 extends out of the thirteenth movable groove and is inserted into the limiting groove, and at the moment, the first connecting block 22 pushes the first push rod 1611 into the first cavity to complete the installation of the first connecting rod 2; through the movement of the second connecting block in the third movable groove, the second limiting plate keeps in a static state when the second connecting block moves in the first connecting groove, and the first connecting block cannot move downwards due to the fact that the second limiting plate abuts against the side wall of the first limiting plate; the fourteenth movable groove and the fifth push plate are arranged to provide a space for the fourth push plate to move, so that the fifth push plate is prevented from blocking the fourth push plate to move in the eleventh movable groove.
As shown in fig. 4, 15, 23, and 29, the inner wall of the carrier box 3 is provided with a material loading platform 31, the inner wall of the carrier box 3 is provided with a fifteenth movable groove, the fifteenth movable groove is provided with a movable plate 33, the bottom of the movable plate 33 is provided with a fourth supporting spring, the movable plate 33 is provided with a sixteenth movable groove, the sixteenth movable groove is provided with a fixed plate 331, the fixed plate 331 is provided with a plurality of first grooves and second grooves, the inner wall of the first groove is provided with a fifth connecting spring 332, the movable plate 33 is provided with a third groove matched with the second groove, the fifteenth movable groove is provided with a fourth connecting plate 34 matched with the third groove, the side wall of the fourth connecting plate 34 is provided with a seventeenth movable groove, the seventeenth movable groove is provided with a sixth connecting spring 342, and one end of the sixth connecting spring 342 is provided with a fifth connecting plate 341, the fifth connecting plate 341 is provided with a ratchet; a first movable cavity is arranged above the fifteenth movable groove, an eighteenth movable groove is arranged at the bottom of the first movable cavity, a sixth connecting plate 35 is arranged in the first movable cavity, a seventh connecting spring is arranged at the top of the sixth connecting plate 35, and a sixth push plate 351 is arranged at the bottom of the sixth connecting plate; after the PCB is placed on the material loading platform 31, the fifth connecting plate 341 moves into the seventeenth movable groove, the fixing plate 331 extends out of the sixteenth movable groove, the fixing plate 331 moves above the PCB, the sixth connecting plate 35 drives the sixth pushing plate 351 to move downward, the sixth pushing plate 351 pushes the movable plate 33 to move downward, the movable plate 33 drives the fixing plate 331 to move downward together, the fixing plate 331 presses on the PCB to fix the PCB on the material loading platform 31, and the placement of the PCB is completed; after the whole PCB is punched, the seventh connecting spring pulls the sixth connecting plate 35 to move upwards, the fourth supporting spring pushes the movable plate 33 to move upwards, the fixed plate 331 is pushed into the sixteenth movable groove, the fixed plate 331 is fixed in the sixteenth movable groove after contacting with the fifth connecting plate 341, and the PCB is taken out from the material loading box 3 and collected.
As shown in fig. 17, 19 and 23, a connecting pipe 36 is arranged on the side wall of the carrier box 3, a third connecting rod 362 penetrates through the connecting pipe 36, a sixth limiting plate 366 is arranged at one end of the third connecting rod 362, a handle 367 is arranged at the other end of the third connecting rod, an eighth connecting spring 368 and a first connecting rope are arranged on the sixth limiting plate 366, and one end of the first connecting rope is connected to the fifth connecting plate 341; a fifth connecting block 361 is arranged at the top of the connecting pipe 36, a second movable cavity communicated with the first movable cavity is arranged on the fifth connecting block 361, a second transmission groove communicated with the connecting pipe 36 is arranged at the bottom of the second movable cavity, a third push block 363 is arranged in the second movable cavity, a ninth connecting spring 364 is arranged on the side wall of the third push block 363, and a third transmission wheel 365 for transmitting the third push block 363 and the third connecting rod 362 is arranged in the second transmission groove; an adjusting button is arranged on the handle 367 and controls the handle 367 to rotate; the structure of the adjusting button is the same as that of an adjusting knob of a socket wrench in the prior art; after the PCB is placed on the material loading table 31, the third connecting rod 362 is pulled out of the connecting pipe 36, the first connecting rope pulls the fifth connecting plate 341 to move into the seventeenth movable groove, the fifth connecting plate 341 enters the seventeenth movable groove, the fixing plate 331 extends out of the sixteenth movable groove, the third connecting rod 362 is released, the handle 367 is pushed, the handle 367 drives the third connecting rod 362 to rotate, the third driving wheel 365 drives the third push block 363 to move, air in the second movable cavity enters the first movable cavity to push the sixth connecting plate 35 to move downwards, the sixth push plate 351 pushes the movable plate 33 to move downwards, and the fixing plate 331 is pressed on the PCB to fix the PCB; after the completion of punching of PCB board, rotate adjustment button, reverse rotation handle 367, second ejector pad 232 moves back, and the intracavity air of first activity flows back to the second activity intracavity, and sixth push pedal 351 upward movement promotes fixed plate 331 toward the sixteenth activity inslot, and fixed plate 331 is fixed at the sixteenth activity inslot after contacting with fifth connecting plate 341, takes out the PCB board from carrying the magazine 3, does the collection to the PCB board.
As shown in fig. 21, 31, and 32, a nineteenth movable groove is formed in the first connecting rod, a supporting rod 24 is arranged in the nineteenth movable groove, a tenth connecting spring 245 is arranged at one end of the supporting rod, a third slider 244 is arranged on a side wall of the supporting rod, a third sliding groove matched with the third slider is formed in an inner wall of the nineteenth movable groove, a sixth connecting block 241 is arranged on the supporting rod, a third connecting groove matched with the sixth connecting block is formed in a side wall of the loading box, a twentieth movable groove and a fourth groove communicated with the twentieth movable groove are formed in the sixth connecting block, an eleventh connecting spring 2421 is arranged in the twentieth movable groove, a fourth pushing block 242 is arranged at one end of the eleventh connecting spring, a fixing block 243 is arranged in the fourth groove, a fourth slider is arranged on the fixing block, and a fourth sliding groove matched with the fourth slider is formed in an inner wall of the fourth groove; when the second movable block moves towards one end of the second movable groove, the third connecting groove moves to the sixth connecting block, the sixth connecting block is embedded into the third connecting groove, the fourth push block abuts against the inner wall of the third connecting groove, the fourth push block moves towards the twentieth movable groove, air in the twentieth movable groove enters the fourth groove to increase air pressure in the fourth groove, the fixed block moves towards the outside of the fourth groove, the fixed block abuts against the inner wall of the third connecting groove, the connection effect of the sixth connecting block and the third connecting groove is improved, the second movable block drives the supporting rod to move in the nineteenth movable groove when moving continuously, the length of the first connecting rod is increased by the supporting rod, the supporting effect on the material carrying box is improved, and vibration generated on the material carrying box when a PCB is drilled is reduced.
As shown in fig. 28, a first connecting shaft 15 is arranged on an output shaft of the motor, a mounting groove is arranged at the bottom of the first connecting shaft, a fourth connecting groove is arranged at the top of the mounting groove, a connecting ring 151 is arranged in the fourth connecting groove, an opening is arranged on the side wall of the fourth connecting groove, a fifth driving wheel 152 matched with the connecting ring is arranged in the opening, a seventh connecting block 61 matched with the mounting groove is arranged at the top of the drill bit, a second connecting shaft 62 matched with the fourth connecting groove is arranged at the top of the seventh connecting block, and the second connecting shaft and the connecting ring are matched through threads; when the drill bit is installed, the second connecting shaft is inserted into the fourth connecting groove, the fifth driving wheel is shifted, the fifth driving wheel drives the connecting ring to rotate, the connecting ring is rotated onto the second connecting shaft under the threaded fit, and the drill bit is fixed on the first connecting shaft; the seventh connecting block is matched with the mounting groove, plays the effect of stalling to the drill bit, avoids the relative first connecting axle of drill bit to rotate, guarantees the linkage effect of drill bit and first connecting axle.
As shown in fig. 6, 7 and 13, the cooling assembly includes a ring 5 sleeved on the first connecting shaft and a fourth connecting rod 51 arranged on the ring, a twenty-first movable groove matched with the fourth connecting rod is arranged on the vertical plate, an annular groove is arranged on the inner wall of the ring, and a convex ring matched with the annular groove is arranged on the side wall of the first connecting shaft; a third cavity is formed in the circular ring, a first water conveying cavity and a second water conveying cavity which are communicated with the third cavity are formed in the fourth connecting rod, the first water conveying cavity is arranged above the second water storage cavity, a twenty-second movable groove is formed in the bottom of the first water conveying cavity, a twenty-third movable groove is formed in the side wall of the twenty-second movable groove, a second baffle plate 52 is arranged in the twenty-second movable groove, a floating plate 521 is arranged on the side wall of the second baffle plate, and the floating plate penetrates through the third cavity; a twenty-third movable groove is formed in the top of the second water delivery cavity, a third baffle plate 53 is arranged in the twenty-third movable groove, and a twelfth connecting spring 531 is arranged at the top of the third baffle plate; a third movable cavity is arranged above the second water delivery cavity, a movable rod 54 is arranged in the third movable cavity, the middle part of the movable rod is rotatably connected to the inner wall of the third movable cavity, a fourth movable cavity is arranged at one end of the third movable cavity, a seventh connecting plate 541 is arranged at one end of the movable rod, a through hole is formed in the top of the fourth movable cavity, and a third push rod 17 matched with the through hole is arranged at the top of the twenty-first movable groove; one end of the movable rod is provided with a second connecting rope, and one end of the second connecting rope is fixedly connected to the top of the third baffle; the bottom of the bottom plate is provided with a water storage cavity 4, the first water delivery cavity and the second water delivery cavity are communicated with the water storage cavity through water pipes, a water pump is arranged in the water storage cavity, and the side wall of the water storage cavity is made of rubber; when the drill bit is used, the cylinder drives the drill bit to move upwards, the first connecting rod drives the circular ring to move upwards, the fourth connecting rod moves to a position, close to the top, of the twenty-first movable groove, the second water delivery cavity is closed by the third baffle at the moment, the first water delivery cavity is in an open state, clean water is injected into the first water delivery cavity by the water pump, water flows into the third cavity through the first water delivery cavity, the floating plate is pushed to move upwards after the liquid level in the third cavity rises until the first water delivery cavity is closed by the second baffle, the clean water is left in the third cavity to cool the circular ring, the circular ring absorbs heat transmitted on the first connecting shaft, and the drill bit is cooled; when the temperature of clean water in the third cavity rises to a specified temperature, the air cylinder starts the drill bit to move upwards, the fourth connecting rod moves to the top of the twenty-first movable groove, the third push rod is inserted into the through hole to push the seventh connecting plate to move downwards, the movable rod rotates to pull the second connecting rope to move, the second connecting rope pulls the third baffle plate to move upwards, water in the third cavity flows out through the second water delivery cavity after the second water delivery cavity is opened, after the water in the third cavity is discharged, the air cylinder drives the first connecting shaft to move downwards for a short distance, the third push rod extends out of the through hole, the third baffle plate moves downwards under the action of the twelfth connecting spring to seal the second water delivery cavity, at the moment, the first water delivery cavity is in an opened state, the water pump works to inject new clean water into the first water delivery cavity to fill the third cavity with clean water, and the cooling effect on the drill bit is guaranteed; through the setting in water storage chamber, do the absorption to the vibrations that produce on the puncher, avoid the puncher during operation to produce vibrations and cause the influence to puncher stability, guarantee the reliability that the puncher used.
The drawings in the application are only schematic and the specific dimensions thereof are subject to practical implementation.

Claims (10)

1. A high-density via hole processing method capable of reducing cost is characterized in that: the method comprises the following steps:
a. firstly, drilling a through hole with an aperture A in a drilling stage of PCB processing;
b. drilling a via hole with a certain depth and a certain aperture B by performing depth control drilling on two surfaces of the via hole;
c. plating copper on the wall of the via hole;
d. re-drilling a through hole with the primary aperture C at the position of the via hole, and drilling off the copper sheet of the middle small hole section to realize the effect of open circuit of the upper via hole and the lower via hole;
the drilling in the steps a, b and d is completed on a drilling machine, the drilling machine comprises a mounting frame, a carrier box (3) arranged on the mounting frame and a drill bit (6) arranged above the carrier box (3), the mounting frame comprises a bottom plate (1), a vertical plate (11) arranged on the bottom plate (1) and a mounting plate (12) arranged at the top of the vertical plate (11), an air cylinder (13) is arranged at the bottom of the mounting plate (12), a piston rod of the air cylinder (13) is provided with a motor (14), and the drill bit (6) is arranged on an output shaft of the motor (14); a first movable groove is formed in the bottom plate (1), a first movable block (16) is arranged in the first movable groove, a first connecting rod (2) is arranged on the first movable block (16), a second movable groove is formed in the first connecting rod (2), a second movable block (22) is arranged in the second movable groove, the material carrying box (3) is arranged on the second movable block (22), and the first connecting rod (2) is perpendicular to the bottom plate (1); a cooling component matched with the drill bit (6) is arranged on the vertical plate (11); a first connecting shaft (15) is arranged on an output shaft of the motor (14), an installation groove is formed in the bottom of the first connecting shaft (15), a fourth connecting groove is formed in the top of the installation groove, a connecting ring (151) is arranged in the fourth connecting groove, an opening is formed in the side wall of the fourth connecting groove, a fifth driving wheel (152) matched with the connecting ring (151) is arranged in the opening, a seventh connecting block (61) matched with the installation groove is arranged at the top of the drill bit (6), a second connecting shaft (62) matched with the fourth connecting groove is arranged at the top of the seventh connecting block (61), and the second connecting shaft (62) is matched with the connecting ring (151) through threads; when a PCB is drilled, the PCB is placed on a material loading box (3), a first movable block (16) and a second movable block (22) move to drive the material loading box (3) to move, a drilling hole on the PCB is moved to the position below a drill bit (6), an air cylinder (13) drives the drill bit (6) to move downwards, the drill bit (6) abuts against the PCB, a motor (14) drives the drill bit (6) to rotate, and the drill bit (6) drills a through hole on the PCB; after the first through hole is drilled, the first movable block (16) or the second movable block (22) moves again, the next drilling hole on the PCB moves to the position below the drill bit (6), and the drill bit (6) descends again to drill the through hole on the PCB until the drilling operation of the whole PCB is completed.
2. The method of claim 1, wherein the step of processing the high-density vias comprises: the aperture A and the aperture B meet the condition that B is more than or equal to A + 8.
3. The method of claim 1, wherein the step of processing the high-density vias comprises: the aperture A, the aperture B and the aperture C satisfy that A +6 is more than or equal to C and less than or equal to B.
4. The method of claim 1, wherein the step of processing the high-density vias comprises: a first connecting groove is formed in the first movable block (16), a first connecting block (22) is arranged at the bottom of the first connecting rod (2), a third movable groove is formed in the bottom of the first connecting block (22), a second connecting block (23) matched with the first connecting groove is arranged in the third movable groove, a first limiting plate (239) is arranged at the bottom of the second connecting block (23), a fourth movable groove is formed in the inner wall of the first connecting groove, a second connecting rod (168) is arranged in the fourth movable groove, a second limiting plate (1681) is arranged at one end of the second connecting rod (168), a third limiting plate (1682) is arranged at the other end of the second connecting rod, and a supporting component matched with the second limiting plate (1681) is arranged on the inner wall of the first connecting groove; when installation head rod (2), second connecting plate (1684) are in and are close to first connecting groove inner wall position department, first connecting block (23) are inserted to first connecting inslot, first limiting plate (239) remove to first connecting groove bottom, second connecting rod (168) are toward first connecting inslot removal, second limiting plate (1681) support on second connecting block (23) lateral wall, the fixed second limiting plate (1681) of supporting component, accomplish being connected of head rod (2) and first movable block (16).
5. The method of claim 4, wherein the step of processing the high-density vias comprises: the fixing component comprises a first connecting plate (1683) hinged to the second limiting plate (1681), a second connecting plate (1684) hinged to one end of the first connecting plate (1683), and a fourth limiting plate (1692) and a fifth limiting plate (1693) matched with the first connecting plate (1683) and the second connecting plate (1684); one end of the second connecting plate (1684) is hinged on the inner wall of the first connecting groove; a fifth movable groove is formed in the inner wall of the first connecting groove, a third connecting plate (169) is arranged in the fifth movable groove, the fourth limiting plate (1692) and the fifth limiting plate (1693) are arranged on the third connecting plate (169), and a first connecting spring (1691) is arranged on the third connecting plate (169); after the second connecting block (23) is arranged in the first connecting groove, the second connecting rod (168) drives the second limiting plate (1681) to move towards the middle of the first connecting groove, the second limiting plate (1681) drives the first connecting plate (1683) and the second connecting plate (1684) to rotate when moving, the second limiting plate (1681) abuts against the second connecting block (23), the third connecting plate (169) drives the fourth limiting plate (1692) and the fifth limiting plate (1693) to enter the first connecting groove, the first connecting plate (1683) and the second connecting plate (1684) are located between the fourth limiting plate (1692) and the fifth limiting plate (1693), the first connecting plate (1683) and the second connecting plate (1684) cannot rotate to fix the second limiting plate (1681), and the first connecting rod (2) and the first movable block (16) are connected.
6. The method of claim 5, wherein the step of processing the high-density vias comprises: a first cavity is arranged on the first movable block (16), and a first connecting cavity communicated with the fourth movable groove is arranged at the bottom of the first cavity; a first push plate (161) is arranged in the first cavity, a first supporting spring (1612) is arranged at the bottom of the first push plate (161), a first push rod (1611) is arranged at the top of the first push plate, a second connecting cavity communicated with the fifth movable groove is arranged on the side wall of the third movable groove, and the second connecting cavity is opened after the third limiting plate (1682) moves to one end of the fifth movable groove; a second cavity is formed in the bottom of the first connecting cavity, a second push plate (162) is arranged in the second cavity, and a second supporting spring (1621) is arranged at the bottom of the second push plate (162); a sixth movable groove is formed in the side wall of the first connecting cavity, and a first baffle (163) is arranged in the sixth movable groove; when the second connecting block (23) is inserted into the first connecting groove, the first connecting block (22) pushes the first push rod (1611) to move downwards, the first push rod (1611) drives the first push plate (161) to move downwards, the first push plate (161) pushes air in the first cavity to enter the fourth movable groove, the third limiting plate (1682) moves under the pushing of air pressure, after the third limiting plate (1682) moves to one end of the fourth movable groove, the second connecting cavity is opened, the air enters the fifth movable groove from the second connecting cavity, the third connecting plate (169) is pushed to move by the air pressure, the fourth limiting plate (1692) and the fifth limiting plate (1693) move to two sides of the first connecting plate (1683) and the second connecting plate (1684) respectively, and the installation of the first connecting rod (2) is completed; when the first connecting rod (2) is disassembled, a first baffle (163) is pushed to one end of the sixth movable groove, the first connecting cavity is communicated with the second cavity, the third limiting plate (1682) is pulled by the first connecting spring (1691) to move back, air in the fourth movable groove and air in the fifth movable groove enter the second cavity, the second limiting plate (1681) is moved away from the top of the first limiting plate (239), the second connecting block (23) is taken out from the first connecting groove, and the first connecting rod (2) is disassembled.
7. The method of claim 6, wherein the step of processing the high-density vias comprises: a seventh movable groove is formed in the inner wall of the sixth movable groove, a sealing plate (1632) matched with the seventh movable groove is arranged on the first baffle plate (163), and a first push block (1631) is arranged at one end of the first baffle plate (163); an eighth movable groove is formed in the side wall of the first cavity, a first transmission groove is formed in the side wall of the eighth movable groove, a ninth movable groove communicated with the sixth movable groove is formed in the bottom of the first transmission groove, two groups of rotating rollers (164) are arranged in the eighth movable groove, a synchronous belt (1641) is wound on the two groups of rotating rollers (164), and a third push plate (1642) is arranged on the synchronous belt (1641); a first driving wheel (165) matched with the synchronous belt (1641) and a second driving wheel (166) matched with the first driving wheel (165) are arranged in the first driving groove, a second push rod (167) matched with the second driving wheel (166) is arranged in the ninth movable groove, a first sliding block (1671) is arranged at the bottom of the second push rod (167), a first sliding groove matched with the first sliding block (1671) is arranged at the bottom of the ninth movable groove, and a first reset spring is arranged on the first sliding block (1671); when dismantling head rod (2), promote first baffle (163) toward sixth activity groove one end, the second cavity communicates with each other with first connecting chamber, second limiting plate (1681) remove back and take out second connecting block (23) from first connecting chamber, first supporting spring (1612) promote first push pedal (161) up-moving, first push pedal (161) up-moving time contacts with third push pedal (1642), third push pedal (1642) drive hold-in range (1641) and rotate, second drive wheel (166) drive second push rod (167) and move, second push rod (167) promote first baffle (163) and move to first connecting chamber, first baffle (163) seal the second cavity, accomplish the reseing of first baffle (163).
8. The method of claim 4, wherein the step of processing the high-density vias comprises: a tenth movable groove is formed in the bottom of the second connecting block (23), a second push block (232) is arranged in the tenth movable groove, and a second connecting spring (233) is arranged on the second push block (232); a second sliding block (231) is arranged on the second connecting block (23), and a second sliding groove matched with the second sliding block (231) is arranged on the inner wall of the third movable groove; an eleventh movable groove communicated with the tenth movable groove is formed in the side wall of the second connecting block (23), a third connecting spring (235) is arranged in the eleventh movable groove, and a fourth push plate (234) is arranged at one end of the third connecting spring (235); a twelfth movable groove is formed in the inner wall of the third movable groove, a first limiting block (221) matched with the eleventh movable groove is arranged in the twelfth movable groove, and a fourth connecting spring (222) is arranged on the first limiting block (221); a thirteenth movable groove is formed in the side wall of the eleventh movable groove, a second limiting block (236) is arranged in the thirteenth movable groove, and a limiting groove matched with the second limiting block (236) is formed in the inner wall of the third movable groove; a fourteenth movable groove is formed in the second limiting block (236), a fifth push plate (237) is arranged in the fourteenth movable groove, and a third supporting spring (238) is arranged on the fifth push plate (237); when the second connecting block (23) is not installed in the first connecting groove, the first limiting block (221) is inserted into the eleventh movable groove, when the second connecting block (23) is inserted into the first connecting groove, the first limiting plate (239) abuts against the bottom of the first connecting groove, the first connecting block (22) is located above the first push rod (1611), the second push block (232) abuts against the bottom of the first connecting groove and then moves into the tenth movable groove, air in the tenth movable groove enters the eleventh movable groove, the fourth push plate (234) moves towards the outer side of the eleventh movable groove, the fourth push plate (234) pushes the first limiting block (221) out of the eleventh movable groove, the fourth push plate (234) moves to push the fifth push plate (237) to move, the second limiting block (236) abuts against the inner wall of the third movable groove, and the fifth push plate (237) moves in the fourteenth movable groove; when the first connecting block (22) is pushed to move downwards, the second connecting block (23) moves towards the top of the third movable groove, the second limiting block (236) moves to the side of the first limiting groove, the second limiting block (236) extends out of the thirteenth movable groove and is inserted into the limiting groove, and at the moment, the first connecting block (22) pushes the first push rod (1611) into the first cavity to complete the installation of the first connecting rod (2).
9. The method of claim 1, wherein the step of processing the high-density vias comprises: the inner wall of the material carrying box (3) is provided with a material carrying platform (31), the inner wall of the material carrying box (3) is provided with a fifteenth movable groove, a movable plate (33) is arranged in the fifteenth movable groove, the bottom of the movable plate (33) is provided with a fourth supporting spring, the movable plate (33) is provided with a sixteenth movable groove, a fixed plate (331) is arranged in the sixteenth movable groove, the fixed plate (331) is provided with a plurality of first grooves and second grooves, the inner wall of the first groove is provided with a fifth connecting spring (332), the movable plate (33) is provided with a third groove matched with the second groove, the fifteenth movable groove is provided with a fourth connecting plate (34) matched with the third groove, the side wall of the fourth connecting plate (34) is provided with a seventeenth movable groove, and the seventeenth movable groove is provided with a sixth connecting spring (342), one end of the sixth connecting spring (342) is provided with a fifth connecting plate (341), and the fifth connecting plate (341) is provided with a ratchet; a first movable cavity is arranged above the fifteenth movable groove, an eighteenth movable groove is arranged at the bottom of the first movable cavity, a sixth connecting plate (35) is arranged in the first movable cavity, a seventh connecting spring is arranged at the top of the sixth connecting plate (35), and a sixth push plate (351) is arranged at the bottom of the sixth connecting plate; after the PCB is placed on the material loading platform (31), the fifth connecting plate (341) moves towards the seventeenth movable groove, the fixed plate (331) extends out of the sixteenth movable groove, the fixed plate (331) moves to the position above the PCB, the sixth connecting plate (35) drives the sixth pushing plate (351) to move downwards, the sixth pushing plate (351) pushes the movable plate (33) to move downwards, the movable plate (33) drives the fixed plate (331) to move downwards together, the fixed plate (331) presses on the PCB to fix the PCB on the material loading platform (31), and the placement of the PCB is completed; after the whole PCB punching is completed, the seventh connecting spring pulls the sixth connecting plate (35) to move upwards, the fourth supporting spring pushes the movable plate (33) to move upwards, the fixed plate (331) is pushed in the sixteenth movable groove, the fixed plate (331) is fixed in the sixteenth movable groove after being contacted with the fifth connecting plate (341), and the PCB is taken out from the material loading box (3) and collected.
10. The method of claim 9, wherein the step of processing the high-density vias comprises: a connecting pipe (36) is arranged on the side wall of the carrier box (3), a third connecting rod (362) penetrates through the connecting pipe (36), a sixth limiting plate (366) is arranged at one end of the third connecting rod (362), a handle (367) is arranged at the other end of the third connecting rod, an eighth connecting spring (368) and a first connecting rope are arranged on the sixth limiting plate (366), and one end of the first connecting rope is connected with the fifth connecting plate (341); a fifth connecting block (361) is arranged at the top of the connecting pipe (36), a second movable cavity communicated with the first movable cavity is arranged on the fifth connecting block (361), a second transmission groove communicated with the connecting pipe (36) is arranged at the bottom of the second movable cavity, a third push block (363) is arranged in the second movable cavity, a ninth connecting spring (364) is arranged on the side wall of the third push block (363), and a third transmission wheel (365) used for transmitting the third push block (363) and the third connecting rod (362) is arranged in the second transmission groove; an adjusting button is arranged on the handle (367), and the adjusting button controls the handle (367) to rotate; after the PCB is placed on the material loading platform (31), a third connecting rod (362) is pulled out of the connecting pipe (36), the fifth connecting plate (341) is pulled by a first connecting rope to move into a seventeenth movable groove, a rear fixing plate (331) extends out of a sixteenth movable groove after the fifth connecting plate (341) enters the seventeenth movable groove, the third connecting rod (362) is released to push a handle (367), the handle (367) drives the third connecting rod (362) to rotate, a third driving wheel (365) drives a third push block (363) to move, air in a second movable cavity enters a first movable cavity to push a sixth connecting plate (35) to move downwards, a sixth push plate (351) pushes a movable plate (33) to move downwards, and the fixing plate (331) is pressed on the PCB to fix the PCB; after the completion of punching of PCB board, rotate adjustment button, reverse rotation handle (367), second ejector pad (232) move back, in the second activity intracavity air backward flow to the second activity intracavity, sixth push pedal (351) up motion, toward sixteenth activity inslot promotion fixed plate (331), fixed plate (331) are fixed in the sixteenth activity inslot after with fifth connecting plate (341) contact, take out the PCB board from carrying in magazine (3), do the collection to the PCB board.
CN202110823473.1A 2021-07-21 2021-07-21 High-density via hole processing method capable of reducing cost Active CN113613389B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7337537B1 (en) * 2003-09-22 2008-03-04 Alcatel Lucent Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board
CN103298259A (en) * 2012-02-22 2013-09-11 深南电路有限公司 Drilling technology eliminating high-speed backboard noise
CN111633734A (en) * 2020-05-26 2020-09-08 陈慧明 Foamed plastic machining punching equipment and operation method thereof
CN112399717A (en) * 2020-10-21 2021-02-23 郑州竹蜻蜓电子科技有限公司 A exempt from type of shutting down engraving device for production of integrated circuit board
CN213591805U (en) * 2020-09-30 2021-07-02 苏州工业园区盛善发精密机械有限公司 Drilling clamp of plastic mold blank convenient to adjust

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7337537B1 (en) * 2003-09-22 2008-03-04 Alcatel Lucent Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board
CN103298259A (en) * 2012-02-22 2013-09-11 深南电路有限公司 Drilling technology eliminating high-speed backboard noise
CN111633734A (en) * 2020-05-26 2020-09-08 陈慧明 Foamed plastic machining punching equipment and operation method thereof
CN213591805U (en) * 2020-09-30 2021-07-02 苏州工业园区盛善发精密机械有限公司 Drilling clamp of plastic mold blank convenient to adjust
CN112399717A (en) * 2020-10-21 2021-02-23 郑州竹蜻蜓电子科技有限公司 A exempt from type of shutting down engraving device for production of integrated circuit board

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