CN113612014B - Electronic equipment - Google Patents

Electronic equipment Download PDF

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Publication number
CN113612014B
CN113612014B CN202110872633.1A CN202110872633A CN113612014B CN 113612014 B CN113612014 B CN 113612014B CN 202110872633 A CN202110872633 A CN 202110872633A CN 113612014 B CN113612014 B CN 113612014B
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CN
China
Prior art keywords
signal connector
antenna
heat dissipation
cavity
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110872633.1A
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Chinese (zh)
Other versions
CN113612014A (en
Inventor
管飞云
周耀辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
Original Assignee
Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Priority to CN202110872633.1A priority Critical patent/CN113612014B/en
Publication of CN113612014A publication Critical patent/CN113612014A/en
Application granted granted Critical
Publication of CN113612014B publication Critical patent/CN113612014B/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The application discloses electronic equipment, which comprises a shell, a first antenna, a second antenna and a heat dissipation piece, wherein the heat dissipation piece, the first antenna and the second antenna are all arranged in the shell, a cavity is arranged in the heat dissipation piece, the heat dissipation piece is provided with a first signal connector and a second signal connector, the first signal connector is in communication connection with the second signal connector, the first signal connector is connected with the first antenna, and the second signal connector is connected with the second antenna. In the electronic equipment, the first antenna and the second antenna realize communication connection through the first signal connector and the second signal connector which are arranged on the heat dissipation piece, so that the reduction of signal radio frequency performance caused by long-distance transmission is avoided, meanwhile, the occupation of wiring to the space inside the electronic equipment can be reduced, the fixing piece is not required to be additionally arranged, and the cost and the structural complexity are reduced.

Description

Electronic equipment
Technical Field
The application belongs to the technical field of electronic equipment, and particularly relates to electronic equipment.
Background
In the related art, an electronic device such as a mobile phone is internally provided with a battery and a plurality of antenna units, taking two antenna units as an example, one of the two antenna units is located at the top of the mobile phone, the other antenna unit is located at the bottom of the mobile phone, the two antenna units are communicated by virtue of a wire, the battery in the mobile phone occupies a large space, the wire is required to avoid the battery, the wire is required to be routed to be long, the fixing piece is required to be additionally arranged for fixing, the cost is high, and the signal transmission effect is reduced after the communication distance is prolonged.
Disclosure of Invention
The application aims to provide electronic equipment which is used for solving the problems of high cost and poor transmission effect caused by connection of electronic elements in the electronic equipment.
In order to solve the technical problems, the application is realized as follows:
the embodiment of the application provides electronic equipment, which comprises a shell, a first antenna, a second antenna and a heat dissipation piece, wherein the heat dissipation piece, the first antenna and the second antenna are all arranged in the shell, a cavity is arranged in the heat dissipation piece, the heat dissipation piece is provided with a first signal connector and a second signal connector, the first signal connector is in communication connection with the second signal connector, the first signal connector is connected with the first antenna, and the second signal connector is connected with the second antenna.
According to the electronic device provided by the embodiment of the application, the first ends of the first signal connector and the second signal connector are protruded outside the heat dissipation piece, and the second ends of the first signal connector and the second signal connector are located in the cavity to transmit waveguide signals.
According to the electronic equipment provided by the embodiment of the application, the cavity wall of the cavity is provided with the mounting hole, and the first signal connector and the second signal connector are respectively inserted into one mounting hole.
According to the electronic device provided by the embodiment of the application, the first signal connector and the second signal connector both comprise the probe and the dielectric layer, the dielectric layer is provided with the through hole, the first end of the probe is inserted into the through hole, and the second end of the probe is inserted into the cavity.
According to the electronic equipment provided by the embodiment of the application, the heat dissipation piece comprises the cover plate and the bottom plate, the bottom plate is provided with the groove, the cover plate is fixedly connected with the bottom plate and seals the groove to form the cavity, and the first signal connector and the second signal connector are both arranged on the cover plate.
According to the electronic device provided by the embodiment of the application, the first signal connector and the second signal connector are distributed at intervals along the length direction of the heat dissipation element.
According to the electronic device provided by the embodiment of the application, the cable is arranged in the cavity, the first end of the cable is connected with the first signal connector, and the second end of the cable is connected with the second signal connector.
According to the electronic equipment provided by the embodiment of the application, the cable and the heat dissipation piece are integrally formed.
According to the electronic equipment provided by the embodiment of the application, the cable comprises an inner core and a dielectric layer, and the dielectric layer is coated outside the inner core.
According to the electronic equipment provided by the embodiment of the application, the heat dissipation piece is a copper plate.
In the embodiment of the application, the first antenna and the second antenna are in communication connection through the first signal connector and the second signal connector which are arranged on the heat dissipation piece, so that the signal radio frequency performance is prevented from being reduced due to long-distance transmission, meanwhile, the occupation of wiring on the space inside the electronic equipment can be reduced, a fixing piece is not required to be additionally arranged, and the cost and the structural complexity are reduced.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic diagram of an internal structure of an electronic device according to an embodiment of the present application;
FIG. 2 is an exploded view of a heat sink according to an embodiment of the present application;
FIG. 3 is a schematic view of the cover plate shown in FIG. 2 from another perspective;
fig. 4 is a schematic structural diagram of the first signal connector or the second signal connector shown in fig. 2;
FIG. 5 is a schematic structural view of a heat dissipating member according to another embodiment of the present application;
FIG. 6 is a schematic diagram of a cable according to the present application;
fig. 7 is another schematic structural view of the cable provided by the present application.
Reference numerals:
10. a housing; 20. a heat sink; 21. a first signal connector; 22. a second signal connector; 201. a cover plate; 202. a bottom plate; 203. a groove; 204. screw holes; 30. a first antenna; 40. a second antenna; 41. a dielectric layer; 42. a probe; 43. an inner core; 44. a shielding layer; 45. a protective layer; 100. and a battery.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.
The following describes a specific structure of an electronic device according to an embodiment of the present application with reference to fig. 1 to 7.
As shown in fig. 1, 2 and 5, the electronic device provided by the embodiment of the application includes a housing 10, a heat dissipation element 20, a first antenna 30 and a second antenna 40, where the heat dissipation element 20, the first antenna 30 and the second antenna 40 are all installed in the housing 10. A cavity is provided in the heat sink 20. As shown in fig. 2 and 4, the heat sink 20 is provided with a first signal connector 21 and a second signal connector 22, and the first signal connector 21 and the second signal connector 22 are in communication connection. The first signal connector 21 is connected to the first antenna 30, and the second signal connector 22 is connected to the second antenna 40.
The first antenna 30 and the second antenna 40 are mounted at different positions within the housing 10, and communication connection is achieved by means of the heat sink 20 provided with a cavity.
Taking an electronic device as a mobile phone, as shown in fig. 1, a first antenna 30 and a second antenna 40 are installed in the mobile phone, the first antenna 30 is installed at the top of the mobile phone, the second antenna 40 is installed at the bottom of the mobile phone, and the first antenna 30 and the second antenna 40 are separated by a battery 100. A heat sink 20 is installed in the case 10 for discharging heat of the battery 100. The first signal connector 21 on the heat sink 20 is connected to the first antenna 30, and the second signal connector 22 on the heat sink 20 is connected to the second antenna 40. In the conventional electronic device, the first antenna 30 and the second antenna 40 are connected through a wire, and the wire needs to bypass the battery 100, thereby resulting in a longer wire length and reduced radio frequency performance of the antenna. According to the electronic equipment provided by the embodiment of the application, the communication between the first antenna 30 and the second antenna 40 is realized by the first signal connector 21 and the second signal connector 22 which are arranged on the heat dissipation piece 20, so that the space occupation is reduced, and the radio frequency performance reduction caused by long-distance transmission can be avoided. In addition, the overlong lead wire needs a special fixing structure for fixing, and the cost is high. According to the electronic equipment provided by the embodiment of the application, the communication connection between the first antenna 30 and the second antenna 40 is realized through the heat dissipation piece 20, a fixed structure is not required to be additionally arranged, the cost is saved, the aperture occupied by a traditional lead can be vacated, the available space of the battery 100 is increased, and the possibility is provided for improving the cruising ability of the electronic equipment.
The first signal connector 21 and the second signal connector 22 may be signal connectors having the same structure and size, or may be signal connectors having different structures and sizes. Other signal connectors may be further disposed on the heat dissipation element 20, that is, the number of signal connectors disposed on the heat dissipation element 20 may be set according to actual needs, so as to implement communication connection between multiple antennas or other electronic components in the housing 10, which is not specifically limited in this embodiment of the present application.
When the electronic equipment provided by the application is used, the first antenna 30 and the second antenna 40 are in communication connection through the first signal connector 21 and the second signal connector 22 which are arranged on the heat dissipation piece 20, so that the reduction of signal radio frequency performance caused by long-distance transmission is avoided, meanwhile, the occupation of wiring on the space inside the electronic equipment can be reduced, a fixing piece is not required to be additionally arranged, and the cost and the structural complexity are reduced.
In some embodiments of the present application, the first ends of the first signal connector 21 and the second signal connector 22 are protruded outside the heat dissipation member 20, and the second ends of the first signal connector 21 and the second signal connector 22 are located in the cavity to transmit the waveguide signal.
The cavity is formed by butt joint of split structures or by a cavity in the empty shell. The cavity is used for transmitting millimeter wave signals. The first signal connector 21 and the second signal connector 22 are mounted on the cavity wall of the cavity as input and output ends of the waveguide signal. For example, the first signal connector 21 is used for transmitting the radio frequency signal output by the first antenna 30 into the cavity, and the corresponding signal connector is in the form of a signal excitation probe, and the waveguide is transmitted forward through the cavity, and the signal is transmitted to the second antenna 40 through the second signal connector 22.
In the electronic device provided by the embodiment of the application, the heat dissipation element 20 has a heat dissipation function and a waveguide transmission function, and the first signal connector 21 and the second signal connector 22 serve as the output end and the input end of waveguide signals to realize signal transmission between the first antenna 30 and the second antenna 40. In some embodiments of the present application, the wall of the cavity is provided with a mounting hole, and the first signal connector 21 and the second signal connector 22 are respectively inserted into one mounting hole.
The first signal connector 21 and the second signal connector 22 are separate connectors for inputting and outputting signals, and are directly inserted into the mounting hole formed in the cavity wall. The mounting holes provide mounting locations for the first signal connector 21 and the second signal connector 22. Optionally, the first signal connector 21 and the second signal connector 22 are arranged at opposite ends of the cavity along the length direction, so as to realize signal transmission between the antennas at a longer distance. The first ends of the first signal connector 21 and the second signal connector 22 protrude outside the heat sink 20 so as to be connected to the corresponding antenna, and the second ends of the first signal connector 21 and the second signal connector 22 are located in the cavity so as to excite an electromagnetic field in the cavity or couple the electromagnetic field from the cavity to the outside of the cavity.
According to the electronic equipment provided by the embodiment of the application, the heat dissipation piece 20 and the waveguide are combined together to realize signal transmission and heat dissipation, so that the cost is saved, meanwhile, the millimeter wave frequency band can be transmitted, and the transmission quality of high-frequency signals is improved.
Specifically, the first signal connector 21 and the second signal connector 22 each include a probe 42 and a dielectric layer 41, the dielectric layer 41 is provided with a through hole, a first end of the probe 42 is inserted into the through hole, and a second end of the probe 42 is inserted into the cavity.
As shown in fig. 4, the dielectric layer 41 is cylindrical, and has a through hole therein, so that the probe 42 can be conveniently installed and used for signal transmission. As shown in fig. 3, the probe 42 extends out of the cavity for outputting a waveguide signal from the cavity or inputting an external signal into the cavity, and the dielectric layer 41 isolates the probe 42 from the heat sink 20.
In some embodiments, the heat sink 20 includes a cover 201 and a base 202. As shown in fig. 2, the base plate 202 is provided with a recess 203. The cover 201 is fixedly connected with the bottom plate 202 and seals the groove 203 to form a cavity, and the first signal connector 21 and the second signal connector 22 are both arranged on the cover 201.
In some embodiments of the present application, the bottom plate 202 is provided with a square groove 203, and the cover plate 201 is welded to the bottom plate 202. In still other embodiments of the present application, the bottom plate 202 is provided with a clamping hole, and the cover plate 201 is provided with a protrusion, and the protrusion is clamped in the clamping hole to fasten the bottom plate 202 and the cover plate 201 together. The first signal connector 21 and the second signal connector 22 are provided on the cover 201 or at the bottom of the groove 203 for installation. As shown in fig. 2 and 3, in still other embodiments of the present application, the bottom plate 202 is provided with a groove 203, the bottom plate 202 is provided with a plurality of screw holes 204 around the groove 203, the cover plate 201 is also provided with screw holes 204 corresponding to the screw holes on the bottom plate 202, and screws pass through the screw holes 204 correspondingly provided on the cover plate 201 and the bottom plate 202 to fix the two together. It will be appreciated that the side of the cover 201 facing the bottom plate 202 may be a flat plate or a plate provided with a groove, where the groove is correspondingly communicated with the groove 203 to form a cavity.
According to the heat dissipation piece 20 provided by the embodiment of the application, the bottom plate 202 is provided with the groove 203, and the groove 203 is sealed after the cover plate 201 is fixed on the bottom plate 202, so that a cavity is formed, and the split type structural design is convenient to assemble.
In some specific embodiments, the first signal connectors 21 and the second signal connectors 22 are arranged at intervals along the length direction of the heat dissipation element 20.
As shown in fig. 2, one of the first signal connector 21 and the second signal connector 22 is used for inputting signals, and the other is used for outputting signals, thereby achieving signal communication between the first antenna 30 and the second antenna 40.
In some embodiments of the application, as shown in fig. 5, a cable is mounted within the cavity. The first end of the cable is connected to the first signal connector 21 and the second end of the cable is connected to the second signal connector 22.
In some embodiments of the present application, as shown in fig. 6, the cable includes an inner core 43, a dielectric layer 41, a shielding layer 44, and a protective layer 45, where the inner core 43, the dielectric layer 41, the shielding layer 44, and the protective layer 45 are sequentially disposed from inside to outside. The cable is fixedly connected to the heat sink 20. In still other embodiments of the present application, as shown in fig. 7, the cable includes an inner core 43 and a dielectric layer 41, the dielectric layer 41 is coated on the inner core 43, and the heat sink 20 is used as a protective layer 45 and a shielding layer 44 of the inner core 43, so that the shielding layer 44 is omitted, the cable structure is simplified, and the cost is reduced.
The electronic equipment provided by the embodiment is provided with the cable arranged in the cavity, so that the cable and the heat dissipation piece 20 are combined together, the fixed wiring of the fixing piece is not required to be arranged specially, and the internal space of the electronic equipment is saved. In addition, the heat dissipation member 20 can be directly arranged in parallel with the battery 100, and the cable directly passes through the heat dissipation member 20 without bypassing the battery 100, so that the wiring length is reduced, and the signal quality is improved.
In some embodiments, the cable is integrally formed with the heat sink 20 to facilitate assembly. It should be noted that, the heat dissipation element 20 may be an integral structure or a separate structure where the cover plate 201 and the base plate 202 are fixedly connected. For example, the heat dissipation element 20 includes a bottom plate 202 and a cover plate 201, a hole is formed in the cover plate 201, a wire slot is formed in the bottom plate 202, the wire slot is communicated with the hole to form a cavity after the cover plate 201 is connected with the bottom plate 202, a cable is accommodated in the cavity, and an end portion of the cable extends out of the hole in the cover plate 201.
Specifically, the cable includes an inner core 43 and a dielectric layer 41, and the dielectric layer 41 is coated outside the inner core 43.
In the electronic device provided by the embodiment of the application, the cable is only provided with the inner core 43 and the dielectric layer 41, and the heat dissipation part 20 is used as the shielding layer 44 and the protective layer 45 of the cable, so that compared with the traditional cable structure, the electronic device has low cost.
Optionally, the heat dissipation element 20 is a copper plate, and has good heat dissipation. Of course, the heat dissipation element 20 may be made of other metals such as tungsten, which is not limited in particular.
The electronic device disclosed in the embodiment of the application can be a mobile phone, a single-lens reflex camera, a monitoring camera and the like, and of course, the electronic device disclosed in the embodiment of the application can also be other kinds of electronic devices, and the embodiment of the application does not specifically limit the specific kind of electronic devices.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims (9)

1. The electronic equipment is characterized by comprising a shell, a first antenna, a second antenna and a heat dissipation piece, wherein the heat dissipation piece, the first antenna and the second antenna are all installed in the shell, a cavity is arranged in the heat dissipation piece, the heat dissipation piece is provided with a first signal connector and a second signal connector, the first signal connector is in communication connection with the second signal connector, the first signal connector is connected with the first antenna, and the second signal connector is connected with the second antenna; the cavity wall of the cavity is provided with a mounting hole, and the first signal connector and the second signal connector are respectively inserted into one mounting hole.
2. The electronic device of claim 1, wherein first ends of the first signal connector and the second signal connector are protruding from the heat sink, and second ends of the first signal connector and the second signal connector are located in the cavity to transmit waveguide signals.
3. The electronic device of claim 2, wherein the first signal connector and the second signal connector each comprise a probe and a dielectric layer, the dielectric layer is provided with a through hole, a first end of the probe is inserted into the through hole, and a second end of the probe is inserted into the cavity.
4. The electronic device of claim 2, wherein the heat sink comprises a cover plate and a base plate, the base plate is provided with a groove, the cover plate is fixedly connected with the base plate and seals the groove to form the cavity, and the first signal connector and the second signal connector are both arranged on the cover plate.
5. The electronic device of claim 2, wherein the first signal connector and the second signal connector are disposed at intervals along a length direction of the heat sink.
6. The electronic device of claim 1, wherein a cable is mounted in the cavity, a first end of the cable is connected to the first signal connector, and a second end of the cable is connected to the second signal connector.
7. The electronic device of claim 6, wherein the cable is integrally formed with the heat sink.
8. The electronic device of claim 6, wherein the cable comprises an inner core and a dielectric layer, the dielectric layer being wrapped around the inner core.
9. The electronic device of any one of claims 1 to 8, wherein the heat sink is a copper plate.
CN202110872633.1A 2021-07-30 2021-07-30 Electronic equipment Active CN113612014B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110872633.1A CN113612014B (en) 2021-07-30 2021-07-30 Electronic equipment

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Application Number Priority Date Filing Date Title
CN202110872633.1A CN113612014B (en) 2021-07-30 2021-07-30 Electronic equipment

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CN113612014A CN113612014A (en) 2021-11-05
CN113612014B true CN113612014B (en) 2023-11-24

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2060572C1 (en) * 1993-05-18 1996-05-20 Скляр Леонид Михайлович Waveguide power system of phased antenna array
CN109462011A (en) * 2018-11-16 2019-03-12 四川大学 A kind of radar antenna and radar antenna array based on 3D printing technique
CN209626424U (en) * 2019-04-01 2019-11-12 京信通信技术(广州)有限公司 Antenna equipment
WO2020176167A1 (en) * 2019-02-28 2020-09-03 Apple Inc. Electronic devices with probe-fed dielectric resonator antennas

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6975267B2 (en) * 2003-02-05 2005-12-13 Northrop Grumman Corporation Low profile active electronically scanned antenna (AESA) for Ka-band radar systems

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2060572C1 (en) * 1993-05-18 1996-05-20 Скляр Леонид Михайлович Waveguide power system of phased antenna array
CN109462011A (en) * 2018-11-16 2019-03-12 四川大学 A kind of radar antenna and radar antenna array based on 3D printing technique
WO2020176167A1 (en) * 2019-02-28 2020-09-03 Apple Inc. Electronic devices with probe-fed dielectric resonator antennas
CN209626424U (en) * 2019-04-01 2019-11-12 京信通信技术(广州)有限公司 Antenna equipment

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