CN113611810B - OLED packaging method and OLED packaging structure - Google Patents

OLED packaging method and OLED packaging structure Download PDF

Info

Publication number
CN113611810B
CN113611810B CN202110816702.7A CN202110816702A CN113611810B CN 113611810 B CN113611810 B CN 113611810B CN 202110816702 A CN202110816702 A CN 202110816702A CN 113611810 B CN113611810 B CN 113611810B
Authority
CN
China
Prior art keywords
oled
packaging
fluorine
cover plate
filling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110816702.7A
Other languages
Chinese (zh)
Other versions
CN113611810A (en
Inventor
黄辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL Huaxing Photoelectric Technology Co Ltd
Original Assignee
TCL Huaxing Photoelectric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TCL Huaxing Photoelectric Technology Co Ltd filed Critical TCL Huaxing Photoelectric Technology Co Ltd
Priority to CN202110816702.7A priority Critical patent/CN113611810B/en
Publication of CN113611810A publication Critical patent/CN113611810A/en
Application granted granted Critical
Publication of CN113611810B publication Critical patent/CN113611810B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Abstract

The application provides an OLED packaging method and an OLED packaging structure. The OLED packaging method comprises the steps of providing an OLED substrate and a packaging cover plate; coating a plurality of filling adhesives on the packaging cover plate; vacuum depositing an organic silicon precursor on the upper surface of the packaging cover plate among the filling glues; introducing a fluorine plasma treatment gas into the organosilicon precursor to form a fluorine-containing organic thin film; and utilizing packaging glue to relatively attach the packaging cover plate and the OLED substrate.

Description

OLED packaging method and OLED packaging structure
Technical Field
The present disclosure relates to the field of display technologies, and more particularly, to a method for packaging an Organic Light Emitting Diode (OLED) and an OLED package structure.
Background
At present, an Organic Light Emitting Diode (OLED) flexible display is more and more produced due to its flexibility, thinness, and self-luminescence. The structure is more and more carried out by adopting a film packaging mode at present, but because a film packaging film layer is thinner and stress between film layers exists, the water and oxygen blocking capability does not reach the required effect, in order to enhance the packaging effect, the cover plate packaging is adopted to package and strengthen the OLED flexible display at present, and UV frame glue and a drying agent are added to further isolate water vapor.
As shown in fig. 1, a conventional packaging method of an OLED flexible display generally includes coating a water-oxygen absorbing material (fill adhesive) 12 on a packaging glass cover plate 11 in advance, and coating a UV adhesive 14 around the packaging glass cover plate 11 as a sealant 14 for adhering to a substrate 17 and blocking water and oxygen, wherein an OLED device layer 16 is further disposed on an upper surface of the substrate 17; and a thin film encapsulation layer 15 overlying the OLED device layer 16. Because the OLED material has very high water oxygen sensitivity, factors such as improper selection of glue materials, non-uniformity of glue coating, non-uniformity of film thickness of thin film packaging and the like can influence the service life of the device differently, and the blocking effect is reduced.
Disclosure of Invention
The present application is directed to an OLED packaging method, in which a plurality of filling gels (fill gels) are coated on a package cover plate, an organic silicon precursor is deposited, and the organic silicon precursor is treated with a fluorine-containing plasma gas, so that a fluorine-containing organic thin film layer is formed on the package cover plate between the filling gels. Due to the addition of the fluorine ions, the hydrophobicity of the film is further enhanced, and the invasion of water and oxygen can be well controlled, so that the effect of a layer of isolation wall is formed, the barrier property is improved, the display quality of the OLED is improved, and the service life of the OLED is prolonged.
Another objective of the present application is to provide an OLED packaging structure, in which a plurality of filling adhesives (fill adhesive) are disposed on the packaging cover plate, so that the hydrophobicity of the film is further enhanced by using the fluorine ions, and the invasion of water and oxygen can be well controlled, thereby forming the effect of a layer of partition wall, improving the barrier property, further improving the display quality of the OLED, and prolonging the life of the OLED.
In order to achieve the above object, the present application first provides an OLED packaging method, including providing an OLED substrate and a packaging cover plate, wherein an Organic Light Emitting Diode (OLED) layer and a thin film packaging layer covering the OLED layer are disposed on an upper surface of the OLED substrate, and the packaging method further includes the following steps:
step 1, coating a plurality of filling adhesives on the upper surface of the packaging cover plate;
step 2, depositing an organic silicon precursor on the upper surface of the packaging cover plate among the filling adhesives in a vacuum manner;
step 3, introducing fluorine plasma treatment gas into the organic silicon precursor to form a fluorine-containing organic film;
step 4, coating packaging glue on the periphery of the upper surface of the packaging cover plate;
step 5, relatively attaching the packaging cover plate and the OLED substrate; and
and 6, irradiating the packaging adhesive by using a UV light source to cure the packaging adhesive.
In some embodiments of the present application, the method for encapsulating an OLED further includes, after the step 3 of introducing a fluorine plasma treatment gas into the organic silicon precursor: fluorine ions are collected on the surfaces of the plurality of filled gels.
In some embodiments of the present application, there is provided a method for encapsulating an OLED, wherein the organic silicon precursor includes Tetraethoxysilane (TEOS).
In some embodiments of the present application, the method for encapsulating an OLED includes a step of forming a fluorine plasma processing gas including one or more of the following: carbon tetrafluoride (CF)4) Gas, nitrogen trifluoride (NF)3) Gas, and silicon tetrafluoride(SiF4) A gas.
In some embodiments of the present disclosure, the thickness of the plurality of filling gels ranges from 5 to 100 μm.
In some embodiments of the present disclosure, the thickness of the fluorine-containing organic thin film ranges from 5 to 20 μm, and is less than or equal to the thickness of the plurality of filling gels.
The application also provides Organic Light Emitting Diode (OLED) packaging structure, including the OLED base plate and sealed connect in encapsulation apron on the OLED base plate, wherein OLED base plate upper surface disposes Organic Light Emitting Diode (OLED) layer and covers film encapsulation layer on the OLED layer, its characterized in that the OLED base plate reaches between the encapsulation apron, OLED packaging structure still includes:
the filling adhesives are arranged on the surface, facing the OLED substrate, of the packaging cover plate; and
the fluorine-containing organic thin film is arranged on the surface, facing the OLED substrate, of the packaging cover plate among the filling adhesives.
In some embodiments of the present application, there is provided an OLED encapsulation structure, further comprising fluorine ions collected on the surfaces of the plurality of filling gels.
In some embodiments of the present disclosure, the material of the plurality of filling gels includes organic matter and/or calcium oxide, and the thickness of the plurality of filling gels ranges from 5 to 100 μm.
In some embodiments of the present application, there is provided an OLED encapsulation structure, wherein the material of the fluorine-containing organic thin film includes a fluorine-containing organosilicon compound; and the thickness of the fluorine-containing organic thin film ranges from 5 to 20 micrometers and is less than or equal to the thickness of the filling glue.
The packaging method of the OLED has the advantages that the organic silicon precursor is deposited after the plurality of filling glues are coated on the packaging cover plate, the organic silicon precursor is treated by the fluorine-containing plasma gas, so that the fluorine-containing organic thin film layer is formed on the packaging cover plate among the filling glues, and fluorine ions are gathered on the surfaces of the filling glues. Due to the addition of fluorine ions, the hydrophobicity of the film is further enhanced, the effect of water and oxygen separation is improved, and the water and oxygen cannot be adsorbed on the surface of the packaging cover plate, residual water and steam can be well removed in the packaging process, so that the packaging cover plate can be well matched with a film layer of the film packaging of the OLED, the bonding performance between the film layers is improved, the display quality of the OLED is improved, and the service life of the OLED is prolonged. The utility model provides an OLED packaging structure, through dispose a plurality of filling glues (fill glues) on the encapsulation apron, and utilize fluorine-containing organic thin layer cladding at a plurality of filling glue surfaces, thereby utilize the fluorine ion to make the hydrophobicity of film obtain further enhancement, the invasion to water oxygen can obtain fine control, thereby form the effect of one deck division wall, promote the separation performance, and the encapsulation apron has better matching degree with the rete of OLED's film encapsulation, can improve the associativity between the rete, and then improve OLED's display quality, the life-span of extension OLED.
Drawings
For a better understanding of the nature and technical content of the present application, reference should be made to the following detailed description and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the present application.
FIG. 1 is a schematic cross-sectional view of a conventional OLED flexible display;
fig. 2 is a flowchart of an OLED encapsulation method according to an embodiment of the present application;
fig. 3 is a top view of a structure in step 1 of an encapsulation method of an OLED provided in an embodiment of the present application;
fig. 4 is a schematic cross-sectional view of a structure in step 1 of an encapsulation method of an OLED provided in an embodiment of the present application;
fig. 5 is a top view of a structure in step 2 of an encapsulation method of an OLED provided in an embodiment of the present application;
FIG. 6 is a schematic cross-sectional view of a structure in step 2 of an OLED packaging method according to an embodiment of the present application;
FIG. 7 is a schematic cross-sectional view of a structure in step 3 of an OLED packaging method according to an embodiment of the present application;
fig. 8 is a top view of a structure in step 4 of an encapsulation method of an OLED provided in an embodiment of the present application;
fig. 9 is a schematic cross-sectional view of a structure in step 4 of an encapsulation method of an OLED provided in an embodiment of the present application;
fig. 10 is a schematic cross-sectional view of the structure in step 5 and step 6 of the method for encapsulating an OLED according to the embodiment of the present application, that is, a schematic cross-sectional view of the OLED encapsulation structure of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The application provides an OLED packaging method, which comprises the steps of coating a plurality of filling glues on a packaging cover plate, depositing an organic silicon precursor, treating the organic silicon precursor with fluorine-containing plasma gas, forming a fluorine-containing organic thin film layer on the packaging cover plate among the filling glues, and collecting fluorine ions on the surfaces of the filling glues. Due to the addition of the fluorine ions, the hydrophobicity of the film is further enhanced, and the invasion of water and oxygen can be well controlled, so that the effect of a layer of partition wall is formed, the barrier property is improved, the display quality of the OLED is improved, and the service life of the OLED is prolonged.
Referring to fig. 2 to 10, fig. 2 is a flowchart illustrating an OLED packaging method according to an embodiment of the present disclosure; fig. 3 to 10 are schematic top view or side cross-sectional views of structures in step 1 to step 6 of an OLED encapsulation method according to an embodiment of the present application. As shown in fig. 2 to 10, the present application provides an OLED packaging method, which includes providing an OLED substrate 70 and a packaging cover plate 10, wherein an Organic Light Emitting Diode (OLED) layer 60 and a thin film packaging layer 50 covering the OLED layer 60 are disposed on an upper surface of the OLED substrate 70, and the packaging method further includes the following steps:
step 1, coating a plurality of filling adhesives 20 on the upper surface of the package cover plate 10, as shown in fig. 3 and 4;
step 2, vacuum depositing an organic silicon precursor 30 on the upper surface of the package cover plate 10 between the filling adhesives 20, as shown in fig. 5 and 6;
step 3, introducing a fluorine plasma treatment gas into the organosilicon precursor 30 to form a fluorine-containing organic thin film 30', as shown in fig. 7;
step 4, coating packaging glue 40 on the periphery of the upper surface of the packaging cover plate 10, as shown in fig. 8 and 9;
step 5, relatively attaching the encapsulation cover plate 10 and the OLED substrate 70, as shown in fig. 10;
and 6, irradiating the packaging adhesive 40 by using a UV light source to cure the packaging adhesive, as shown in FIG. 10.
Specifically, in the encapsulation method of the OLED provided in some embodiments of the present application, the encapsulation cover plate 10 may be a glass plate or a metal plate, and preferably, the encapsulation cover plate 3 is a glass plate.
In step 1 of the encapsulation method of the OLED provided by some embodiments of the present application, the material of the plurality of filling gels includes a water-absorbing material, such as a transparent desiccant, and the plurality of filling gels function to improve the strength of the OLED encapsulation structure and delay the entry rate of moisture. Specifically, in the encapsulation method of the OLED provided in some embodiments of the present application, the material of the plurality of fillers may include organic matter and/or calcium oxide, and preferably, the material of the plurality of fillers is calcium oxide.
In step 1 of the encapsulation method of the OLED provided in some embodiments of the present application, the coating manner of the plurality of filling glues 20 may include: spraying, spin coating, printing. Preferably, the coating manner of the filling glues 20 is spraying, and the particle size of the filling glue can be better controlled by adopting a spraying method, so that a plurality of filling glues with preset particle sizes are obtained, and the particle sizes are consistent. Specifically, the particle size of the filling adhesive is 1-50 microns.
Specifically, in step 2 of the method for encapsulating an OLED provided in some embodiments of the present application, the organic silicon precursor 30 may include Tetraethoxysilane (TEOS), TEOS/SiH4Or a combination of the foregoing.
According to some embodiments of the present application, after the step 3 of introducing the fluorine plasma treatment gas into the organic silicon precursor 30, the method for encapsulating an OLED further includes: fluorine ions are collected on the surfaces of the plurality of filling gels 20. Specifically, in step 3 of the method for encapsulating an OLED provided in some embodiments of the present application, the fluorine plasma processing gas includes a group consisting of one or more of the following: carbon tetrafluoride (CF)4) Gas, nitrogen trifluoride (NF)3) Gas, and silicon tetrafluoride (SiF)4) A gas. Preferably, the fluorine plasma processing gas is silicon tetrafluoride (SiF)4) A gas.
In step 3 of the encapsulation method of the OLED provided in the embodiment of the present application, fluorine ions may be anchored on the surfaces of the plurality of filling gels 20 in the form of weak links. In detail, the fluorine ions are gathered on the particle surfaces of the plurality of filled gels 20 due to the attraction between charges, are tightly connected with the particles of the plurality of filled gels 20 without displacement, belong to the directional arrangement of selective specific positions, enable the fluorine ion concentration in the fluorine-containing organic thin film 30' close to the particle surfaces of the plurality of filled gels 20 to be particularly high, and the fluorine ions are combined with other peripheral particles, gradually enter the upper and lower surfaces of the plurality of filled gels 20 in an invasive manner, and finally coat the whole surfaces of the plurality of filled gels 20 to form the fluorine ion shell. As shown in FIG. 7, due to fluorine ion (F)+) The hydrophobicity of the filling glue 20 is further enhanced, and the invasion of water and oxygen can be well controlled, so that the effect of a layer of partition wall is formed, and the water and oxygen barrier property is improved.
In step 3 of the encapsulation method of the OLED provided in the embodiments of the present application, mainly by ionizing out single-ion charged fluorine ions (F)+) The flow rate of the fluorine ion treatment gas can be 1 to 30lpmThe operation time range of introducing the fluorine plasma treatment gas is 30 seconds to 5 minutes, the operation temperature range is 0 ℃ to 100 ℃, and the operation power range is 100 KW to 300 KW. Preferably, the fluorine plasma treatment gas is introduced for an operation time in a range of 1 to 3 minutes, preferably 1 to 2 minutes, at an operation temperature in a range of 20 to 70 degrees celsius, preferably 50 degrees celsius, and at an operation power in a range of 150 to 250KW, preferably 180 KW.
In one embodiment, the fluorine plasma processing gas is introduced for an operating time of about 2 minutes, at an operating temperature of about 50 degrees, and at an operating power of about 180 KW.
The quality of the fluorine-containing organic thin film 30' is dependent upon the operating time, operating temperature, operating pressure, and operating power ranges over which the fluorine plasma processing gas is introduced, and the selection of specific operating parameters may depend upon the power-determined temperature, and if outside the ranges provided in the above-described embodiments of the present application, the reaction between the fluorine plasma and the organosilicon precursor 30 may be incomplete; when the range of the operation parameter is smaller than the above range, the surfaces of the plurality of filling glues 20 are not surrounded by fluorine of the effective area; when the range of the operation parameter is larger than the above range, the material properties of the surfaces themselves of the plurality of potting adhesives 20 may be changed abruptly.
In some embodiments of the present disclosure, the thickness of the plurality of filling gels ranges from 5 to 100 μm. Preferably, the plurality of fillers has a thickness in the range of 10 to 50 microns, preferably 30 microns. In one embodiment, the plurality of underfill materials have a thickness of 10 microns.
In some embodiments of the present disclosure, the organic film 30' may be a fluorine-containing polyorganosiloxane film, such as pdms (polydimethylsiloxane). The thickness of the fluorine-containing organic thin film 30' ranges from 5 to 20 micrometers, and is less than or equal to the thickness of the plurality of the filling glues 20. Preferably, the fluorine-containing organic thin film has a thickness ranging from 1 to 5 μm. In one embodiment, the plurality of underfill materials have a thickness of 3 microns. Since the film thickness of the fluorine-containing organic thin film 30' is not higher than the thickness of the plurality of the filling adhesives 20, the plurality of the filling adhesives 20 can be smoothly spread during the lamination. Specifically, the ratio of the thickness of the fluorine-containing organic film 30 'to the thickness of the plurality of filling adhesives 20 is preferably 0.3 to 0.8, and if the thickness of the fluorine-containing organic film 30' is too high, the lamination is affected, and if the thickness of the fluorine-containing organic film is too low, the target waterproof effect may not be satisfied.
In some embodiments of the present application, the operations of step 4 to step 6 are finally performed, wherein the packaging adhesive 40 may be a UV adhesive. It should be noted that, in some embodiments of the present application, the steps 4 to 6 are performed in an environment where the pressure is from vacuum to one atmosphere or less.
In summary, in the OLED packaging method of the present application, after a plurality of filling gels (fill gels) are coated on the packaging cover plate, an organic silicon precursor is deposited and treated with a fluorine-containing plasma gas, so that a fluorine-containing organic thin film layer is formed on the packaging cover plate between the filling gels, and fluorine ions are collected on the surfaces of the filling gels. Due to the addition of fluorine ions, the hydrophobicity of the film is further enhanced, the effect of blocking water and oxygen is improved, and the water and oxygen cannot be adsorbed on the surface of the packaging cover plate, so that residual water and vapor can be well removed in the packaging process, the packaging cover plate can be well matched with a film layer of the film packaging of the OLED (the film packaging of the substrate is also an organic film), the bonding property between the film layers is improved, the display quality of the OLED is improved, and the service life of the OLED is prolonged.
The application still provides an OLED packaging structure, in this OLED packaging structure, through dispose a plurality of filling glues (fill glues) on the encapsulation apron, and form fluorine-containing organic thin layer on the encapsulation apron between a plurality of filling glues, and at the surface gathering fluorine ion of a plurality of filling glues, utilize fluorine ion to make the hydrophobicity of film obtain further enhancement from this, the invasion to water oxygen can obtain fine control, thereby form the effect of one deck division wall, promote the separation performance, and then improve OLED's display quality, prolong OLED's life-span.
With continued reference to fig. 7-10, wherein fig. 8 and 9 are provided to more clearly illustrate certain steps of the present invention, the fluorine ions collected on the surfaces of the plurality of underfill are omitted for simplicity, and the actual fluorine ion collection is as shown in fig. 7. On the basis of the above-mentioned OLED packaging method, the present application further provides an OLED packaging structure 100, which includes an OLED substrate 70 and a packaging cover plate 10 hermetically connected to the OLED substrate 70, wherein an Organic Light Emitting Diode (OLED) layer 60 and a thin film packaging layer 50 covering the OLED layer are disposed on the upper surface of the OLED substrate; further, between the OLED substrate 70 and the encapsulating cover plate 10, the OLED encapsulating structure 100 further includes a plurality of filling glues 20 disposed on a surface of the encapsulating cover plate 10 facing the OLED substrate 70; and a fluorine-containing organic thin film 30' is disposed on the surface of the encapsulation cover plate 10 facing the OLED substrate 70.
Specifically, the OLED encapsulation structure provided by the embodiment of the present application further includes fluorine ions collected on the surfaces of the plurality of underfill.
In the OLED encapsulation structure provided in the present application, the structure and material of each film layer are substantially the same as those in the OLED encapsulation method, and details can refer to the related description of the OLED encapsulation method, and are not repeated herein.
To sum up, the OLED packaging structure of this application, through dispose a plurality of filling glues (fill glues) on the encapsulation apron, and form fluorine-containing organic thin layer on the encapsulation apron between a plurality of filling glues, and at a plurality of surface gathering fluorine ions of filling glue, utilize fluorine ion to make the hydrophobicity of film obtain further enhancement from this, can obtain fine control to the invasion of water oxygen, thereby form the effect of one deck division wall, promote the barrier properties, and the encapsulation apron has better matching degree with the film encapsulation's of OLED rete, can improve the associativity between the rete, and then improve OLED's display quality, prolong OLED's life-span.
The above description of the embodiments is only for assisting understanding of the technical solutions and the core ideas thereof; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims (8)

1. An Organic Light Emitting Diode (OLED) packaging method includes providing an OLED substrate and a packaging cover plate, wherein an Organic Light Emitting Diode (OLED) layer and a thin film packaging layer covering the OLED layer are disposed on the upper surface of the OLED substrate, and the packaging method further includes the following steps:
step 1, coating a plurality of filling adhesives on the upper surface of the packaging cover plate;
step 2, depositing an organic silicon precursor on the upper surface of the packaging cover plate among the filling adhesives in a vacuum manner;
step 3, introducing fluorine plasma treatment gas into the organic silicon precursor to form a fluorine-containing organic film, wherein fluorine ions are gathered on the surfaces of the filling adhesives;
step 4, coating packaging glue on the periphery of the upper surface of the packaging cover plate;
step 5, relatively attaching the packaging cover plate and the OLED substrate; and
and 6, irradiating the packaging adhesive by using a UV light source to cure the packaging adhesive.
2. The method of encapsulating an OLED according to claim 1, wherein the organosilicon precursor comprises Tetraethoxysilane (TEOS).
3. The method of encapsulating an OLED according to claim 1, wherein the fluorine plasma processing gas includes a group consisting of one or more of: carbon tetrafluoride (CF)4) Gas, nitrogen trifluoride (NF)3) Gas, and silicon tetrafluoride (SiF)4) A gas.
4. The method of claim 1, wherein the plurality of underfill has a thickness in a range of 5 to 100 μm.
5. The method for encapsulating an OLED according to claim 1, wherein the thickness of the fluorine-containing organic thin film is in a range from 5 to 20 μm and is less than or equal to the thickness of the plurality of the underfill.
6. An Organic Light Emitting Diode (OLED) package structure, comprising an OLED substrate and a package cover plate hermetically connected to the OLED substrate, wherein an Organic Light Emitting Diode (OLED) layer and a thin film package layer covering the OLED layer are disposed on the upper surface of the OLED substrate, the OLED package structure further comprising:
the filling adhesives are arranged on the surface, facing the OLED substrate, of the packaging cover plate;
fluorine ions collected on the surfaces of the plurality of filled gels; and
the fluorine-containing organic thin film is arranged on the surface, facing the OLED substrate, of the packaging cover plate among the filling adhesives.
7. The OLED package structure of claim 6, wherein the material of the plurality of fillers comprises organic and/or calcium oxide, and the thickness of the plurality of fillers ranges from 5 to 100 μm.
8. The OLED encapsulation structure of claim 6, wherein the material of the fluorine-containing organic thin film comprises a fluorine-containing organosilicon compound; and the thickness of the fluorine-containing organic thin film ranges from 5 to 20 micrometers and is less than or equal to the thickness of the filling glue.
CN202110816702.7A 2021-07-20 2021-07-20 OLED packaging method and OLED packaging structure Active CN113611810B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110816702.7A CN113611810B (en) 2021-07-20 2021-07-20 OLED packaging method and OLED packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110816702.7A CN113611810B (en) 2021-07-20 2021-07-20 OLED packaging method and OLED packaging structure

Publications (2)

Publication Number Publication Date
CN113611810A CN113611810A (en) 2021-11-05
CN113611810B true CN113611810B (en) 2022-07-12

Family

ID=78337951

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110816702.7A Active CN113611810B (en) 2021-07-20 2021-07-20 OLED packaging method and OLED packaging structure

Country Status (1)

Country Link
CN (1) CN113611810B (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104505466A (en) * 2014-12-04 2015-04-08 深圳市华星光电技术有限公司 OLED (Organic Light Emitting Diode) packaging structure and method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10275682A (en) * 1997-02-03 1998-10-13 Nec Corp Organic el element
CN103490019B (en) * 2013-09-29 2016-02-17 京东方科技集团股份有限公司 The encapsulating structure of organic electroluminescence device and method for packing, display unit
US20190109300A1 (en) * 2017-10-10 2019-04-11 Applied Materials, Inc. Planarizing hmdso buffer layer with chemical vapor deposition
CN110911583B (en) * 2019-11-28 2022-07-01 京东方科技集团股份有限公司 Organic light-emitting display cover plate, manufacturing method and display device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104505466A (en) * 2014-12-04 2015-04-08 深圳市华星光电技术有限公司 OLED (Organic Light Emitting Diode) packaging structure and method

Also Published As

Publication number Publication date
CN113611810A (en) 2021-11-05

Similar Documents

Publication Publication Date Title
TWI420722B (en) Device with encapsulation unit
CN103875090B (en) Packaging part for organic electronic device
US20110097533A1 (en) Thin film encapsulation method
WO2016086538A1 (en) Oled encapsulation structure and oled encapsulation method
CN1992371A (en) Organic light emiting device and method of manufacturing the same
TWI632829B (en) Organic electronic device, organic electroluminescent device, and methods for protecting and manufacturing it
CN101106178A (en) Encapsulation for organic device
WO2016115777A1 (en) Oled encapsulation method and oled encapsulation structure
WO2016086535A1 (en) Oled packaging structure and packaging method therefor
CN108987602B (en) Packaging structure of organic electroluminescent device and manufacturing method
CN1409390A (en) Seal structure used for high wet sensitive electronic device element and its producing method
KR20140026647A (en) Encapsulation structure for an opto-electronic component, and method for encapsulating an optoelectronic component
US20060128042A1 (en) Method for encapsulating at least one organic light-emitting (OLED) device and OLED device
US8530928B2 (en) Encapsulated optoelectronic component and method for the production thereof
US20170358699A1 (en) Photovoltaic module with improved moisture protection layer
WO2015180232A1 (en) Oled substrate packaging method and oled structure
KR100626005B1 (en) Organic electroluminescence display
CN113611810B (en) OLED packaging method and OLED packaging structure
CN110416430B (en) Display panel and display device
KR102013730B1 (en) Encapsulation Methods for LED Lighting Applications
WO2021082047A1 (en) Packaging method and packaging structure for display panel
US20110293895A1 (en) Composite material for the protection of h2o sensitive devices based on surface functionalized nanozeolites dispersed in a polymeric matrix
EP0751699A2 (en) Method and device for sealing of a thin film electroluminescent device
KR20140147615A (en) Semiconductor device and method for manufacutring the same
CN109962149B (en) Packaging film, preparation method thereof and photoelectric device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant