CN113611649A - Wafer conveying device - Google Patents
Wafer conveying device Download PDFInfo
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- CN113611649A CN113611649A CN202111180210.XA CN202111180210A CN113611649A CN 113611649 A CN113611649 A CN 113611649A CN 202111180210 A CN202111180210 A CN 202111180210A CN 113611649 A CN113611649 A CN 113611649A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a wafer conveying device which comprises a first mechanical arm and a second mechanical arm, wherein the first mechanical arm is used for conveying a wafer to the second mechanical arm from a first preset position, and the second mechanical arm is used for conveying the wafer to a second preset position; the first mechanical arm comprises two first clamping parts which are oppositely arranged and used for clamping a first position of the wafer, wherein the first position is the middle part of the wafer when the wafer is vertically placed; the second mechanical arm comprises two second clamping parts which are oppositely arranged and used for clamping a second position of the wafer to be clamped, wherein the second position is the lower half part of the wafer when the wafer is vertically placed; the wafer conveying device further comprises a driving structure which is used for controlling the two first clamping parts to move and/or controlling the two second clamping parts to move, so that the two first clamping parts clamp the wafer and move between the two second clamping parts, and the two second clamping parts clamp the second position of the wafer. And the pollution to related equipment is avoided by adopting a segmented transmission mode.
Description
Technical Field
The invention relates to the technical field of wafer transportation, in particular to a wafer transportation device.
Background
After the wafer is subjected to mechanical processing such as slicing and grinding, a damaged layer with a certain depth is formed on the surface of the wafer due to stress generated by the mechanical processing, and generally, a crystal region of the mechanical damage is dozens of microns, so that a large amount of metal impurities can be adsorbed, and the damaged layer is difficult to remove by cleaning. Chemical corrosion (acid corrosion or alkali corrosion) is generally adopted to thin and eliminate a damaged layer on the surface, and meanwhile, the surface of the wafer can be cleaned, the polishing efficiency is improved, and the internal stress of the wafer is eliminated. The chemical reagent commonly used for alkaline corrosion is KOH or NaOH, wherein the concentration of KOH solution is between 30 and 40 percent, and the corrosion reaction temperature is between 80 and 90 ℃. Before the wafer is subjected to the etching process, the wafer to be processed needs to be clamped from a material box of a feeding platform through a mechanical arm, the mechanical arm transports the wafer to be processed to a liquid medicine tank, the wafer to be processed is clamped again after the mechanical arm is contacted with liquid medicine, water or the liquid medicine is brought to a feeding area, the feeding platform and the material box are polluted, both alkaline liquid medicine and acidic liquid medicine have corrosivity, the pollution to the edge of the wafer is caused, the processing quality of the wafer is reduced, and meanwhile, the influence on the body of an operator is caused.
Disclosure of Invention
In order to solve the technical problems, the invention provides a wafer conveying device which solves the problems that a feeding table and a to-be-treated working procedure area are polluted and workers are harmed because only one mechanical arm reciprocates back and forth in the wafer conveying process.
In order to achieve the purpose, the embodiment of the invention adopts the technical scheme that: a wafer conveying device comprises a first mechanical arm and a second mechanical arm, wherein the first mechanical arm is used for conveying a wafer from a first preset position to the second mechanical arm, and the second mechanical arm is used for conveying the wafer to a second preset position;
the first mechanical arm comprises two first clamping parts which are oppositely arranged and used for clamping a first position of a wafer, wherein the first position is the middle part of the wafer when the wafer is vertically placed;
the second mechanical arm comprises two second clamping parts which are oppositely arranged and used for clamping a second position of the wafer to be clamped, wherein the second position is the lower half part of the wafer when the wafer is vertically placed;
the wafer conveying device further comprises a driving structure, and the driving structure is used for controlling the two first clamping parts which clamp the wafer to move and/or controlling the two second clamping parts to move, so that the two first clamping parts clamp the wafer and move between the two second clamping parts, and the two second clamping parts clamp the wafer at the second position.
Optionally, the two first clamping portions include a first sub-clamping portion and a second sub-clamping portion, the first sub-clamping portion includes a first clamping rod extending along a first direction, and a plurality of first clamping grooves are formed in one side of the first clamping rod facing the second sub-clamping portion along the first direction;
the second sub-clamping part comprises a second clamping rod extending along a first direction, and one side, facing the first sub-clamping part, of the second clamping rod is provided with a plurality of second clamping grooves along the first direction; the plurality of first clamping grooves and the plurality of second clamping grooves correspond to each other one by one to clamp the plurality of wafers.
Optionally, the driving structure includes a first driving unit, and the first driving unit includes:
the clamping device comprises a first clamping rod, a second clamping rod, a first supporting rod and a second supporting rod, wherein the first supporting rod and the second supporting rod are arranged in parallel, the first supporting rod and the second supporting rod are respectively arranged at two ends of the first clamping rod, and the first supporting rod and the first clamping rod are arranged vertically;
the third supporting rod and the fourth supporting rod are arranged in parallel, the third supporting rod and the fourth supporting rod are respectively arranged at two ends of the second clamping rod, and the third supporting rod and the second clamping rod are arranged vertically;
the first connecting rod is perpendicular to the first supporting rod and perpendicular to the first clamping rod, the first connecting rod is provided with a first end and a second end along the extending direction of the first connecting rod, the first end is connected with the first supporting rod, the second end is connected with the third supporting rod, the second connecting rod is provided with a third end and a fourth end along the extending direction of the second connecting rod, the third end is connected with the second supporting rod, and the fourth end is connected with the fourth supporting rod;
the end face of one end of the first transmission shaft is fixedly connected with the middle part of the first connecting rod through a first connecting piece, the first connecting piece is arranged in a mode of deviating from the axial center of the first transmission shaft, the middle part of the second connecting rod is connected with the middle part of the first transmission shaft through a second connecting piece, and the axial center line of the first connecting rod and the axial center line of the second connecting rod are located on the same plane;
the first rotation driving part is used for driving the first transmission shaft to rotate so as to drive the two first clamping parts to move oppositely or reversely, so that the wafer is clamped or loosened.
Optionally, the driving structure further includes a second driving unit, and the second driving unit includes:
the first lifting driving part is connected with the first rotating driving part and used for controlling the first transmission shaft to move up and down so as to drive the two first clamping parts to move up and down;
the first horizontal driving part is connected with the first lifting driving part and used for controlling the first rotating driving part to move in the horizontal direction so as to drive the two first clamping parts to move in the horizontal direction;
the first lifting driving part is matched with the first horizontal driving part so as to control the two first clamping parts to move between the two second clamping parts.
Optionally, the lifting device further comprises a first protection box, and the first rotation driving part and the first lifting driving part are accommodated in the first protection box.
Optionally, the protection device further comprises a second protection box, an opening at one end of the second protection box is communicated with an opening at one end of the first protection box, and a part of the first transmission shaft is accommodated in the second protection box.
Optionally, the wafer clamping device further comprises an alignment structure, wherein the alignment structure is arranged on the first transmission shaft and used for detecting whether the wafer clamped between the two first clamping portions deviates or not.
Optionally, the two second clamping portions include a third sub-clamping portion and a fourth sub-clamping portion, the third sub-clamping portion includes a third clamping rod extending along a first direction, and a plurality of third clamping grooves are formed in one side of the third clamping rod facing the third sub-clamping portion along the first direction;
the fourth sub-clamping part comprises a fourth clamping rod extending along a first direction, and a plurality of fourth clamping grooves are formed in one side, facing the fourth sub-clamping part, of the fourth clamping rod along the first direction; the plurality of third clamping grooves and the plurality of fourth clamping grooves correspond to each other one by one to clamp the plurality of wafers.
Optionally, the driving structure further includes a third driving unit, and the third driving unit includes:
the fifth supporting rod and the sixth supporting rod are arranged in parallel, the fifth supporting rod and the sixth supporting rod are respectively arranged at two ends of the third clamping rod, and the fifth supporting rod and the third clamping rod are arranged vertically;
the seventh supporting rod and the eighth supporting rod are arranged in parallel, the seventh supporting rod and the eighth supporting rod are respectively arranged at two ends of the fourth clamping rod, and the seventh supporting rod and the fourth clamping rod are vertically arranged;
the third connecting rod is perpendicular to the seventh supporting rod and perpendicular to the third clamping rod, the third connecting rod is provided with a fifth end and a sixth end along the extending direction of the third connecting rod, the fifth end is connected with the fifth supporting rod, the sixth end is connected with the seventh supporting rod, the fourth connecting rod is provided with a seventh end and an eighth end along the extending direction of the fourth connecting rod, the seventh end is connected with the sixth supporting rod, and the eighth end is connected with the eighth supporting rod;
the end face of one end of the second transmission shaft is fixedly connected with the middle part of the third connecting rod through a third connecting piece, the third connecting piece is arranged in a mode of deviating from the axial center of the second transmission shaft, the fourth connecting rod is connected to the middle part of the second transmission shaft through a fourth connecting piece, and the axial center line of the third connecting rod and the axial center line of the fourth connecting rod are located on the same plane;
and the second rotation driving part is used for driving the second transmission shaft to rotate so as to drive the two second clamping parts to move oppositely or reversely, so that the wafer is clamped or loosened.
Optionally, the driving structure further includes a fourth driving unit, and the fourth driving unit includes:
the second lifting driving part is connected with the second rotating driving part and is used for controlling the second transmission shaft to move up and down so as to drive the two second clamping parts to move up and down;
the second horizontal driving part is connected with the second lifting driving part and used for controlling the second rotary driving part to move in the horizontal direction so as to drive the two second clamping parts to move in the horizontal direction;
the second lifting driving part is matched with the second horizontal driving part to control the two second clamping parts to move to a second preset position.
Optionally, the protection device further comprises a third protection box, and the second rotation driving part and the second lifting driving part are accommodated in the third protection box.
Optionally, the protection device further comprises a fourth protection box, an opening at one end of the fourth protection box is communicated with an opening at one end of the third protection box, and part of the second transmission shaft is accommodated in the fourth protection box.
The invention has the beneficial effects that: the wafer to be processed is moved between the first preset position and the second preset position through the first mechanical arm and the second mechanical arm, the first mechanical arm only clamps and clamps the wafer located at the first preset position, the wafer is transported to the second mechanical arm, then the wafer is transmitted to the second preset position through the second mechanical arm, and the wafer is prevented from directly returning to the first preset position from the second preset position in a segmented transmission mode, and the residual materials at the second preset position are brought to the first preset position, so that pollution to related equipment at the first preset position is avoided, and safety is improved.
Drawings
FIG. 1 is a first schematic view of a wafer transportation device according to an embodiment of the present invention;
FIG. 2 is a second schematic structural view of a wafer transportation device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a wafer transportation device according to an embodiment of the invention.
100 wafers, 11 first clamping parts; 101 a first connecting rod; 102 connection point; 103 a first support bar; 104 a second support bar; 105 a first clamping bar; 106 a third support bar; 107 a fourth support bar; 108 a second gripping shank; 12 a first drive shaft; 13 a first elevation driving part; 14 a first protective box; 3 a second protection box; 121 an image acquisition unit; 21 a second clamping part; 201 a third connecting rod; 203 a fifth support bar; 204 a sixth support bar; 205 a third clamping bar; 206 seventh support bar; 207 an eighth support bar; 208 a fourth clamping bar; 22 a second drive shaft; 202 connection location; 23 a second lifting driving part; 24 a third protective box; 4 fourth protective box.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, only for the purpose of facilitating description of the present invention and simplifying description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1-3, the present embodiment provides a wafer transportation apparatus, which includes a first robot arm and a second robot arm, wherein the first robot arm is configured to transport a wafer from a first predetermined position to the second robot arm, and the second robot arm is configured to transport the wafer to a second predetermined position;
the first mechanical arm comprises two first clamping parts 11 which are oppositely arranged and used for clamping a first position of the wafer 100, wherein the first position is the middle part of the wafer 100 when the wafer 100 is vertically placed;
the second mechanical arm comprises two second clamping parts 21 which are oppositely arranged and used for clamping a second position of the wafer 100 to be clamped, wherein the second position is the lower half part of the wafer 100 when the wafer 100 is vertically placed;
the wafer transportation device further comprises a driving structure for controlling the two first clamping parts 11 clamping the wafer to move and/or controlling the two second clamping parts 21 to move, so that the two first clamping parts 11 clamping the wafer move to between the two second clamping parts 21, and the two second clamping parts 21 are clamped at the second position of the wafer 100.
The wafer 100 to be processed is moved between the first preset position and the second preset position through the first mechanical arm and the second mechanical arm, the first mechanical arm only clamps and clamps the wafer located at the first preset position, the wafer is transported to the second mechanical arm, then the second mechanical arm transmits the wafer to the second preset position, and the wafer is prevented from directly returning to the first preset position from the second preset position in a segmented transmission mode, and the residual material of the second preset position is brought to the first preset position, so that pollution to related equipment of the first preset position is avoided, and safety is improved.
Compared with a single mechanical arm transmission mode, the sectional type transmission mode improves the wafer transmission efficiency.
The first preset position and the second preset position can be set according to actual operating environments, for example, the first preset position can be a feeding table, the second preset position is a liquid medicine tank containing corrosive liquid medicine (acidic or alkaline), dry-wet separation can be achieved by adopting the technical scheme, the first mechanical arm is transmitted between the first preset position and the second mechanical arm, and the second mechanical arm is transmitted between the first mechanical arm and the second preset position.
It should be noted that, in the transmission process, the first mechanical arm and the second mechanical arm do not contact with each other, so as to prevent the first mechanical arm from being contaminated.
The specific structural form of the first clamping portion 11 may be various, and the specific structural form of the first clamping portion 11 in the present embodiment is described below, and for convenience of description, two first clamping portions are named as a first sub-clamping portion and a second sub-clamping portion, respectively.
In some embodiments of the present embodiment, the two first clamping portions 11 include a first sub-clamping portion and a second sub-clamping portion, the first sub-clamping portion includes a first clamping rod 105 extending along a first direction (refer to an X direction in fig. 2), and a side of the first clamping rod 105 facing the second sub-clamping portion has a plurality of first clamping grooves formed along the first direction;
the second sub-clamping part comprises a second clamping rod 108 extending along a first direction, and a plurality of second clamping grooves are formed in one side, facing the first sub-clamping part, of the second clamping rod 108 along the first direction; the plurality of first card slots and the plurality of second card slots correspond to each other one by one to hold the plurality of wafers 100.
The first direction is perpendicular to the surface of the wafer when the wafer is vertically placed, the first clamping grooves and the corresponding second clamping grooves jointly bear one wafer, the number of the first clamping grooves on the first clamping rod 105 can be set according to actual needs, and the second clamping grooves and the first clamping grooves are in one-to-one correspondence to clamp the wafer.
In some implementations of this embodiment, the drive structure includes a first drive unit including:
the first supporting rod 103 and the second supporting rod 104 are arranged in parallel, the first supporting rod 103 and the second supporting rod 104 are respectively arranged at two ends of the first clamping rod 105, and the first supporting rod 103 and the first clamping rod 105 are arranged vertically;
a third supporting rod 106 and a fourth supporting rod 107 which are arranged in parallel, wherein the third supporting rod 106 and the fourth supporting rod 107 are respectively arranged at two ends of the second clamping rod 108, and the third supporting rod 106 and the second clamping rod 108 are arranged vertically;
a first connecting rod 101 and a second connecting rod arranged in parallel, wherein the first connecting rod 101 is perpendicular to the first supporting rod 103, the first connecting rod 101 is perpendicular to the first clamping rod 105, the first connecting rod 101 has a first end and a second end along the extending direction thereof, the first end is connected to the first supporting rod 103, the second end is connected to the third supporting rod 106, the second connecting rod has a third end and a fourth end along the extending direction thereof, the third end is connected to the second supporting rod 104, and the fourth end is connected to the fourth supporting rod 107;
a first transmission shaft 12, wherein the end face of one end of the first transmission shaft 12 is fixedly connected with the middle part of the first connecting rod 101 through a first connecting piece, the first connecting piece is arranged to deviate from the axial center of the first transmission shaft 12, the middle part of the second connecting rod is connected with the middle part of the first transmission shaft 12 through a second connecting piece, and the axial center line of the first connecting rod 101 and the axial center line of the second connecting rod are positioned on the same plane; the first rotation driving part is used for driving the first transmission shaft 12 to rotate so as to drive the two first clamping parts 11 to move oppositely or reversely, so as to clamp or release the wafer.
The connection position of the first connection piece on the first transmission shaft 12 deviates from the axial center of the first transmission shaft 12, referring to the connection point 102 in fig. 1, the connection point 102 is located on the right side of the axial center, when the first transmission shaft 12 rotates clockwise, the two first clamping portions 11 move back to back, and when the first transmission shaft 12 rotates counterclockwise, the two first clamping portions 11 move in opposite directions to clamp a silicon wafer.
The rotation angle (clockwise rotation or counterclockwise rotation) of the first transmission shaft 12 is 15-30 degrees, but not limited thereto.
The first connecting rod 101 is fixed to an end face of one end of the first transmission shaft 12, the second connecting rod is fixed to a middle portion of the first transmission shaft 12, in some embodiments, a groove is formed in a circumferential surface of the first transmission shaft 12 to accommodate the second connecting rod, and the second connecting piece is arranged on two opposite side walls of the groove along an axial direction of the first transmission shaft 12.
In this embodiment, the connection between the first transmission shaft 12 and the first connection rod 101 is a point connection, the first connection member includes a fixing bolt, the connection between the first transmission shaft 12 and the second connection rod is a point connection, the second connection member includes a fixing bolt, and the first transmission shaft 12 rotates to enable the first clamping rod 105 and the second clamping rod 108 to move toward or away from each other, so as to clamp or loosen a wafer.
In some implementations of this embodiment, the drive structure further includes a second drive unit, the second drive unit including:
the first lifting driving part 13 is connected with the first rotating driving part and is used for controlling the first transmission shaft 12 to move up and down so as to drive the two first clamping parts 11 to move up and down;
the first horizontal driving part is connected with the first lifting driving part 13 and used for controlling the first rotating driving part to move in the horizontal direction so as to drive the two first clamping parts 11 to move in the horizontal direction;
the first lifting driving part 13 is matched with the first horizontal driving part to control the two first clamping parts 11 to move between the two second clamping parts 21.
When the first robot arm clamps the wafer 100, two of the first clamping portions 11 are clamped at a first position of the wafer 100, when the second robot arm clamps the wafer, two of the second clamping portions 21 are clamped at a second position of the wafer 100, the first robot arm and the second robot arm clamp the wafer 100, and the wafer 100 is held in a vertical direction, that is, the first robot arm and the second robot arm are both clamped at a side surface of the wafer 100, and the first position is higher than the second position, for example, the first position is located at the middle part of the wafer 100, and the second position is located at the lower half part of the wafer 100, so that the two of the first clamping portions 11 clamping the wafer 100 move to between the two of the second clamping portions 21, the two of the first clamping portions 11 move downward, or the two of the second clamping portions 21 move toward each other to be clamped at the second position of the wafer 100, at this time, the two first clamping portions 11 move back to each other to release the wafer 100, and the second robot arm clamps the wafer 100 and moves to a second predetermined position, such as a liquid chemical tank, for etching.
It should be noted that the first lifting driving portion 13 may include an air cylinder, and the first horizontal driving portion may include a slide rail, but is not limited thereto.
In some embodiments of the present invention, the wafer transportation apparatus further includes a first protection box 14, and the first rotation driving part and the first elevation driving part are accommodated in the first protection box 14.
In some embodiments of the present invention, the wafer transportation apparatus further includes a second protection box 3, an opening of one end of the second protection box 3 is communicated with an opening of one end of the first protection box 14, and a portion of the first transmission shaft 12 is accommodated in the second protection box 3.
In some embodiments of the present invention, the wafer clamping device further includes an alignment structure, disposed on the first transmission shaft 12, for detecting whether the wafer clamped between the two first clamping portions 11 is shifted.
Referring to fig. 2, in some embodiments, the alignment structure includes an image acquiring unit 121 configured to acquire an image of a wafer clamped between two first clamping units 11, and analyze the image to determine whether the wafer has a deviation or a tilt.
The specific structural form of the second clamping portion 21 may be various, the structural form of the second clamping portion 21 in the present embodiment is described below, and for convenience of description, two of the second clamping portions 21 are named as a third sub-clamping portion and a fourth sub-clamping portion, respectively.
In some embodiments of this embodiment, the two second clamping portions 21 include a third sub-clamping portion and a fourth sub-clamping portion, the third sub-clamping portion includes a third clamping rod 205 extending along a first direction, and a side of the third clamping rod 205 facing the third sub-clamping portion is opened with a plurality of third slots along the first direction;
the fourth sub-clamping part comprises a fourth clamping rod 208 extending along a first direction, and a plurality of fourth clamping grooves are formed in one side, facing the fourth sub-clamping part, of the fourth clamping rod 208 along the first direction; the plurality of third clamping grooves and the plurality of fourth clamping grooves correspond to each other one by one to clamp the plurality of wafers.
In some implementations of this embodiment, the driving structure further includes a third driving unit, the third driving unit including:
the fifth supporting rod 203 and the sixth supporting rod 204 are arranged in parallel, the fifth supporting rod 203 and the sixth supporting rod 204 are respectively arranged at two ends of the third clamping rod 205, and the fifth supporting rod 203 and the third clamping rod 205 are arranged vertically;
a seventh supporting rod 206 and an eighth supporting rod 207 which are arranged in parallel, wherein the seventh supporting rod 206 and the eighth supporting rod 207 are respectively arranged at two ends of the fourth clamping rod 208, and the seventh supporting rod 206 and the fourth clamping rod 208 are arranged vertically;
a third connecting rod 201 and a fourth connecting rod arranged in parallel, wherein the third connecting rod 201 is perpendicular to the seventh supporting rod 206, the third connecting rod 201 is perpendicular to the third clamping rod 205, the third connecting rod 201 has a fifth end and a sixth end along the extending direction thereof, the fifth end is connected to the fifth supporting rod 203, the sixth end is connected to the seventh supporting rod 206, the fourth connecting rod has a seventh end and an eighth end along the extending direction thereof, the seventh end is connected to the sixth supporting rod 204, and the eighth end is connected to the eighth supporting rod 207;
the end face of one end of the second transmission shaft 22 is fixedly connected with the middle part of the third connecting rod through a third connecting piece, the third connecting piece is arranged in a mode of deviating from the axial center of the second transmission shaft 22, the fourth connecting rod is connected to the middle part of the second transmission shaft 22 through a fourth connecting piece, and the axial center line of the third connecting rod and the axial center line of the fourth connecting rod are located on the same plane; the second rotation driving portion is used for driving the second transmission shaft 22 to rotate so as to drive the two second clamping portions 21 to move oppositely or reversely, so as to clamp the wafer or loosen the wafer.
It should be noted that, in order to ensure that the two first clamping portions 11 smoothly transfer the wafer to the two second clamping portions 21, clamping areas of the two second clamping portions 21 are located at one end far away from the second transmission shaft 22, in a direction perpendicular to the second transmission shaft 22, and a distance between the clamping area and the second transmission shaft 22 is greater than a length of the two first clamping portions 11, so as to ensure that a space between the two second clamping portions 21 can accommodate the two first clamping portions 11.
The connecting position of the third connecting member on the second transmission shaft 22 deviates from the axial center of the second transmission shaft 22, referring to the connecting position 202 in fig. 1, the connecting position 202 is located on the right side of the axial center, when the second transmission shaft 22 rotates clockwise, the two second clamping portions 21 move back to back, and when the second transmission shaft 22 rotates counterclockwise, the two second clamping portions 21 move in opposite directions to clamp a silicon wafer.
The rotation angle (clockwise rotation or counterclockwise rotation) of the second transmission shaft 22 is 15-30 degrees, but not limited thereto.
The third connecting rod 201 is fixed to the end face of one end of the second transmission shaft 22, the fourth connecting rod is fixed to the middle of the second transmission shaft 22, in some embodiments, a groove is formed in the circumferential surface of the second transmission shaft 22 to accommodate the fourth connecting rod, and the fourth connecting member is arranged on two opposite side walls of the groove along the axial direction of the second transmission shaft 22.
In this embodiment, the connection between the second transmission shaft 22 and the third connecting rod 201 is a point connection and is eccentrically disposed, referring to fig. 1, the connection position 202 is located on the right side of the axial center, the third connecting member includes a fixing bolt, the second transmission shaft 22 rotates to drive the third connecting rod to rotate through the fixing bolt, the connection between the second transmission shaft 22 and the fourth connecting rod is also a point connection, the fourth connecting member includes a fixing bolt, and the second transmission shaft 22 rotates, so that the third clamping rod 205 and the fourth clamping rod 208 move toward or away from each other to clamp or loosen a wafer.
It should be noted that the specific structural forms of the first support bar 103, the second support bar 104, the third support bar 106 and the fourth support bar 107 can be various, can be in a curved shape or a strip-shaped structure, etc., the specific structural forms of the fifth supporting rod 203, the sixth supporting rod 204, the seventh supporting rod 206 and the eighth supporting rod 207 can be various, may be a curved shape, a strip-shaped structure, etc., as long as it is realized that two first clamping parts 11 can pass through between two second clamping parts 21, that is, the first support bar 103, the second support bar 104, the third support bar 106, and the fourth support bar 107 may pass through between the fifth support bar 203 and the sixth support bar 204, and between the seventh support bar 206 and the eighth support bar 207 in the extending direction of the first clamping bar 105.
In some implementations of this embodiment, the driving structure further includes a fourth driving unit, and the fourth driving unit includes:
the second lifting driving part 23 is connected with the second rotating driving part and is used for controlling the second transmission shaft 22 to move up and down so as to drive the two second clamping parts 21 to move up and down;
the second horizontal driving part is connected with the second lifting driving part 23 and is used for controlling the second rotating driving part to move in the horizontal direction so as to drive the two second clamping parts 21 to move in the horizontal direction;
the second lifting driving portion 23 is matched with the second horizontal driving portion to control the two second clamping portions 21 to move to a second preset position.
The second horizontal driving portion and the second lifting driving portion 23 are configured to move the wafer to a second predetermined position and move the wafer out of the second predetermined position.
The second lifting driving part 23 may include an air cylinder, and the second horizontal driving part may include a slide rail, but is not limited thereto.
In some embodiments of the present invention, the wafer transportation apparatus further includes a third protection box 24, and the second rotation driving part and the second elevation driving part are accommodated in the third protection box 24.
In some embodiments of the present embodiment, the protection device further includes a fourth protection box 4, an opening at one end of the fourth protection box 4 is communicated with an opening at one end of the third protection box 24, and a part of the second transmission shaft 22 is accommodated in the fourth protection box 4.
The fourth protection box 4 and the second protection box 3 may be integrated into a whole, but not limited thereto.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (12)
1. The wafer conveying device is characterized by comprising a first mechanical arm and a second mechanical arm, wherein the first mechanical arm is used for conveying a wafer from a first preset position to the second mechanical arm, and the second mechanical arm is used for conveying the wafer to a second preset position;
the first mechanical arm comprises two first clamping parts which are oppositely arranged and used for clamping a first position of a wafer, wherein the first position is the middle part of the wafer when the wafer is vertically placed;
the second mechanical arm comprises two second clamping parts which are oppositely arranged and used for clamping a second position of the wafer to be clamped, wherein the second position is the lower half part of the wafer when the wafer is vertically placed;
the wafer conveying device further comprises a driving structure, and the driving structure is used for controlling the two first clamping parts which clamp the wafer to move and/or controlling the two second clamping parts to move, so that the two first clamping parts clamp the wafer and move between the two second clamping parts, and the two second clamping parts clamp the wafer at the second position.
2. The wafer transportation device according to claim 1, wherein the two first clamping portions comprise a first sub-clamping portion and a second sub-clamping portion, the first sub-clamping portion comprises a first clamping rod extending along a first direction, and a plurality of first clamping grooves are formed in one side of the first clamping rod facing the second sub-clamping portion along the first direction;
the second sub-clamping part comprises a second clamping rod extending along a first direction, and one side, facing the first sub-clamping part, of the second clamping rod is provided with a plurality of second clamping grooves along the first direction; the plurality of first clamping grooves and the plurality of second clamping grooves correspond to each other one by one to clamp the plurality of wafers.
3. The wafer transport device of claim 1, wherein the drive structure comprises a first drive unit comprising:
the clamping device comprises a first clamping rod, a second clamping rod, a first supporting rod and a second supporting rod, wherein the first supporting rod and the second supporting rod are arranged in parallel, the first supporting rod and the second supporting rod are respectively arranged at two ends of the first clamping rod, and the first supporting rod and the first clamping rod are arranged vertically;
the third supporting rod and the fourth supporting rod are arranged in parallel, the third supporting rod and the fourth supporting rod are respectively arranged at two ends of the second clamping rod, and the third supporting rod and the second clamping rod are arranged vertically;
the first connecting rod is perpendicular to the first supporting rod and perpendicular to the first clamping rod, the first connecting rod is provided with a first end and a second end along the extending direction of the first connecting rod, the first end is connected with the first supporting rod, the second end is connected with the third supporting rod, the second connecting rod is provided with a third end and a fourth end along the extending direction of the second connecting rod, the third end is connected with the second supporting rod, and the fourth end is connected with the fourth supporting rod;
the end face of one end of the first transmission shaft is fixedly connected with the middle part of the first connecting rod through a first connecting piece, the first connecting piece is arranged in a mode of deviating from the axial center of the first transmission shaft, the middle part of the second connecting rod is connected with the middle part of the first transmission shaft through a second connecting piece, and the axial center line of the first connecting rod and the axial center line of the second connecting rod are located on the same plane;
the first rotation driving part is used for driving the first transmission shaft to rotate so as to drive the two first clamping parts to move oppositely or reversely, so that the wafer is clamped or loosened.
4. The wafer transport device of claim 3, wherein the drive structure further comprises a second drive unit, the second drive unit comprising:
the first lifting driving part is connected with the first rotating driving part and used for controlling the first transmission shaft to move up and down so as to drive the two first clamping parts to move up and down;
the first horizontal driving part is connected with the first lifting driving part and used for controlling the first rotating driving part to move in the horizontal direction so as to drive the two first clamping parts to move in the horizontal direction;
the first lifting driving part is matched with the first horizontal driving part so as to control the two first clamping parts to move between the two second clamping parts.
5. The wafer transport apparatus according to claim 4, further comprising a first protection box, wherein the first rotation driving part and the first elevation driving part are accommodated in the first protection box.
6. The wafer transport apparatus of claim 5, further comprising a second protective box having an opening at one end in communication with an opening at one end of the first protective box, wherein a portion of the first transmission shaft is received in the second protective box.
7. The wafer transportation device as claimed in claim 4, further comprising an alignment structure disposed on the first transmission shaft for detecting whether the wafer clamped between the two first clamping portions is shifted.
8. The wafer transportation device according to claim 1, wherein the two second clamping portions comprise a third sub-clamping portion and a fourth sub-clamping portion, the third sub-clamping portion comprises a third clamping rod extending along a first direction, and a plurality of third clamping grooves are formed in one side of the third clamping rod facing the third sub-clamping portion along the first direction;
the fourth sub-clamping part comprises a fourth clamping rod extending along a first direction, and a plurality of fourth clamping grooves are formed in one side, facing the fourth sub-clamping part, of the fourth clamping rod along the first direction; the plurality of third clamping grooves and the plurality of fourth clamping grooves correspond to each other one by one to clamp the plurality of wafers.
9. The wafer transport device of claim 8, wherein the drive structure further comprises a third drive unit, the third drive unit comprising:
the fifth supporting rod and the sixth supporting rod are arranged in parallel, the fifth supporting rod and the sixth supporting rod are respectively arranged at two ends of the third clamping rod, and the fifth supporting rod and the third clamping rod are arranged vertically;
the seventh supporting rod and the eighth supporting rod are arranged in parallel, the seventh supporting rod and the eighth supporting rod are respectively arranged at two ends of the fourth clamping rod, and the seventh supporting rod and the fourth clamping rod are vertically arranged;
the third connecting rod is perpendicular to the seventh supporting rod and perpendicular to the third clamping rod, the third connecting rod is provided with a fifth end and a sixth end along the extending direction of the third connecting rod, the fifth end is connected with the fifth supporting rod, the sixth end is connected with the seventh supporting rod, the fourth connecting rod is provided with a seventh end and an eighth end along the extending direction of the fourth connecting rod, the seventh end is connected with the sixth supporting rod, and the eighth end is connected with the eighth supporting rod;
the end face of one end of the second transmission shaft is fixedly connected with the middle part of the third connecting rod through a third connecting piece, the third connecting piece is arranged in a mode of deviating from the axial center of the second transmission shaft, the fourth connecting rod is connected to the middle part of the second transmission shaft through a fourth connecting piece, and the axial center line of the third connecting rod and the axial center line of the fourth connecting rod are located on the same plane;
and the second rotation driving part is used for driving the second transmission shaft to rotate so as to drive the two second clamping parts to move oppositely or reversely, so that the wafer is clamped or loosened.
10. The wafer transport device of claim 9, wherein the drive structure further comprises a fourth drive unit, the fourth drive unit comprising:
the second lifting driving part is connected with the second rotating driving part and is used for controlling the second transmission shaft to move up and down so as to drive the two second clamping parts to move up and down;
the second horizontal driving part is connected with the second lifting driving part and used for controlling the second rotary driving part to move in the horizontal direction so as to drive the two second clamping parts to move in the horizontal direction;
the second lifting driving part is matched with the second horizontal driving part to control the two second clamping parts to move to a second preset position.
11. The wafer transport apparatus of claim 10, further comprising a third protection box, wherein the second rotation driving part and the second elevation driving part are accommodated in the third protection box.
12. The wafer transport apparatus of claim 11, further comprising a fourth protective box having an opening at one end in communication with an opening at one end of the third protective box, wherein a portion of the second drive shaft is received in the fourth protective box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111180210.XA CN113611649A (en) | 2021-10-11 | 2021-10-11 | Wafer conveying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111180210.XA CN113611649A (en) | 2021-10-11 | 2021-10-11 | Wafer conveying device |
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| CN113611649A true CN113611649A (en) | 2021-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111180210.XA Pending CN113611649A (en) | 2021-10-11 | 2021-10-11 | Wafer conveying device |
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| JPH09226721A (en) * | 1996-02-21 | 1997-09-02 | Nec Yamagata Ltd | Box conveyer |
| CN110155721A (en) * | 2019-06-06 | 2019-08-23 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Transmission machine arm |
| CN209766388U (en) * | 2019-06-25 | 2019-12-10 | 开悦微电子科技(永清)有限公司 | Mechanical arm for efficient wafer transmission |
| CN110809506A (en) * | 2018-08-29 | 2020-02-18 | 深圳市大疆创新科技有限公司 | Clamping device and movable machine |
| CN112786481A (en) * | 2019-11-01 | 2021-05-11 | 弘塑科技股份有限公司 | Wafer wet processing workstation |
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2021
- 2021-10-11 CN CN202111180210.XA patent/CN113611649A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH09226721A (en) * | 1996-02-21 | 1997-09-02 | Nec Yamagata Ltd | Box conveyer |
| US5983479A (en) * | 1996-02-21 | 1999-11-16 | Nec Corporation | Apparatus and method of automatically removing a wafer carrier from a container |
| CN110809506A (en) * | 2018-08-29 | 2020-02-18 | 深圳市大疆创新科技有限公司 | Clamping device and movable machine |
| CN110155721A (en) * | 2019-06-06 | 2019-08-23 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Transmission machine arm |
| CN209766388U (en) * | 2019-06-25 | 2019-12-10 | 开悦微电子科技(永清)有限公司 | Mechanical arm for efficient wafer transmission |
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Application publication date: 20211105 |