CN113608304A - Preparation method and device applied to light emitting device - Google Patents
Preparation method and device applied to light emitting device Download PDFInfo
- Publication number
- CN113608304A CN113608304A CN202110726012.2A CN202110726012A CN113608304A CN 113608304 A CN113608304 A CN 113608304A CN 202110726012 A CN202110726012 A CN 202110726012A CN 113608304 A CN113608304 A CN 113608304A
- Authority
- CN
- China
- Prior art keywords
- value
- lens
- light emitting
- emitting chip
- distance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 230000003287 optical effect Effects 0.000 claims abstract description 52
- 239000000919 ceramic Substances 0.000 claims abstract description 50
- 229910052751 metal Inorganic materials 0.000 claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 40
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 22
- 238000005259 measurement Methods 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 12
- 230000005496 eutectics Effects 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 16
- 230000008878 coupling Effects 0.000 abstract description 14
- 238000010168 coupling process Methods 0.000 abstract description 14
- 238000005859 coupling reaction Methods 0.000 abstract description 14
- 238000004891 communication Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 230000002708 enhancing effect Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a preparation method and a device applied to a light emitting device, belonging to the technical field of optical communication, wherein a lens is passively pasted on a ceramic substrate, and the central position of the lens and the light outlet position of a light emitting chip are measured to measure a first distance value; judging whether the first distance value is within a first qualified value range; if so, measuring the working distance between the light emitting chip and the lens, and measuring a second distance value; judging whether the second distance value is within a second qualified value range; if so, bonding and fixing the metal substrate and the PCBA; bonding the bonding pad on the PCBA and the corresponding pin in the light emitting chip to electrically connect the PCBA and the light emitting chip; measuring the output value of the optical power in the adapter to measure the output value of the optical power; if the output value is judged to be in the third qualified value range; the adapter is welded to the metal base plate by laser. The invention achieves the technical effects of reducing the occurrence of lens coupling dislocation and enhancing the reliability of packaging.
Description
Technical Field
The invention belongs to the technical field of optical communication, and particularly relates to a preparation method and a device applied to a light emitting device.
Background
With the rapid increase of the demand of communication rate, the construction of communication technology and data center is developing at a high speed. The optical module is used as an electro-optical/optical-optical interface for optical communication interconnection, and steps from a single channel of 25Gbps to a single channel of 100 Gbps. The structure of single channel light emitting device mainly has coaxial TO type, small-size BOX type, hard mouthful COB type, tail optical fiber COB type, and hard mouthful COB type is the structure scheme of present mainstream. Currently, in the existing optical communication technology, the packaging process for a hard-port COB single-channel transmitter is usually to directly and actively couple a lens after a chip laser is attached and a fiber adapter is laser-welded. However, in the process, the requirement on the precision of lens coupling is too high, the lens running proportion is high, and the four-quadrant performance, the test repeatability and the reliability performance caused by the lens running are relatively poor. Then, in the process of packaging the COB type with the hard port, the lens coupling dislocation is easy to occur, the packaging reliability is poor,
as described above, the conventional optical communication technology has a problem that lens coupling dislocation is likely to occur and reliability of the package is poor.
Disclosure of Invention
The invention aims to solve the technical problems that lens coupling dislocation is easy to occur and the packaging reliability is poor.
In order to solve the above technical problems, the present invention provides a method for manufacturing a light emitting device, the method comprising: s1, mounting the lens on the ceramic substrate in a passive mode, and measuring the center position of the lens and the light outlet position of the light emitting chip to measure a first distance value, wherein the first distance value is the distance value between the center position of the lens and the light outlet position of the light emitting chip; s2, judging whether the first distance value is in a first qualified value range according to the measured first distance value and a preset first qualified value range; s3, if yes, measuring the working distance between the light emitting chip and the lens to measure a second distance value, wherein the second distance value is the working distance value between the light emitting chip and the lens; s4, judging whether the second distance value is in a second qualified value range according to the measured second distance value and a preset second qualified value range; s5, if yes, the metal substrate and the PCBA are adhered and fixed; s6, bonding the pad on the PCBA and the corresponding pin in the light emitting chip to electrically connect the PCBA and the light emitting chip; s7, measuring the output value of the optical power in the adapter to measure the output value of the optical power; s8, judging whether the output value is in a third qualified value range according to the output value and the preset third qualified value range; and S9, if yes, welding the adapter to the metal substrate through laser to prepare the finished light emitting device.
Further, the passive mounting of the lens on the ceramic substrate further comprises: obtaining a ceramic substrate with a metal substrate attached, and attaching a light emitting chip to the ceramic substrate.
Further, the mounting the light emitting chip on the ceramic substrate includes: and carrying out eutectic bonding on the light emitting chip and the chip substrate, and mounting the bonded chip substrate on the ceramic substrate.
Further, the determining whether the output value is within a third acceptable value range according to the output value and a preset third acceptable value range further includes: if not, measuring the height of the surface of the light emitting chip and the surface of the ceramic substrate by adopting high-precision quadratic element to measure a first height value, wherein the first height value is the distance value between the surface of the light emitting chip and the surface of the ceramic substrate; measuring the height from the upper surface of the lens to the surface of the ceramic substrate by adopting a high-precision quadratic element to measure a second height value, wherein the second height value is a spacing value from the upper surface of the lens to the surface of the ceramic substrate; measuring the height from the spherical surface of the lens to the upper surface of the lens by adopting a high-precision quadratic element to measure a third height value, wherein the third height value is a distance value from the spherical surface of the lens to the upper surface of the lens; calculating a height deviation value of the center of the light emitting chip and the lens according to the first height value, the second height value and the third height value; wherein the first height value is H1, the second height value is H2, and the third height value is H3, the height deviation value is Z1, Z1 ═ H1- (H2-H3); measuring the distance between the spherical surface of the lens and the side edge of the lens by adopting a high-precision quadratic element to measure a first measured value, wherein the first measured value is the distance value between the spherical surface of the lens and the side edge of the lens; measuring the transverse distance between the side edge of the lens and the light-emitting strip of the light-emitting chip by adopting a high-precision quadratic element to measure a second measured value, wherein the second measured value is the transverse distance value between the side edge of the lens and the light-emitting strip of the light-emitting chip; calculating a lateral deviation value according to the first measurement value and the second measurement value; wherein the first measurement value is W1, the second measurement value is W2, and the lateral offset value is Z2, and Z2 is W1-W2.
Further, judging whether the height deviation value is within the first qualified value range or not according to the obtained height deviation value; if not, the lens is disassembled and then the step S1 is returned to; or judging whether the lateral deviation value is within the second qualified value range according to the calculated lateral deviation value; if not, the lens is disassembled and the process returns to step S1.
Further, measuring the axial distance between the light emitting point of the light emitting chip and the lens by adopting a high-precision quadratic element to measure an axial distance value; judging whether the axial distance value is within a preset axial qualified value range or not according to the axial distance value and the preset axial qualified value range; if not, the lens is disassembled and the process returns to step S1.
Further, the measuring the output value of the optical power in the adapter comprises: and measuring the output value of the optical power in the adapter by an optical power meter.
Further, the measuring the central position of the lens and the light outlet position of the light emitting chip includes: the center position of the lens and the position of the light outlet of the light emitting chip are measured by a camera parallel to the direction of the light path in the light emitting chip.
Further, the measuring the working distance between the light emitting chip and the lens includes: and measuring the working distance between the light emitting chip and the lens by a camera perpendicular to the direction of the light path in the light emitting chip.
According to still another aspect of the present invention, there is also provided a manufacturing apparatus applied to a light emitting device, characterized in that the apparatus comprises: the mounting measurement module is used for passively mounting the lens on the ceramic substrate, and measuring the central position of the lens and the light outlet position of the light emitting chip to measure a first distance value, wherein the first distance value is the distance value between the central position of the lens and the light outlet position of the light emitting chip; the first judgment module is used for judging whether the first distance value is within a first qualified value range or not according to the measured first distance value and a preset first qualified value range; the working distance measuring module is used for measuring the working distance between the light emitting chip and the lens if the working distance is greater than the working distance between the light emitting chip and the lens, so as to measure a second distance value, wherein the second distance value is the working distance value between the light emitting chip and the lens; the second judgment module is used for judging whether the second distance value is within a second qualified value range according to the measured second distance value and a preset second qualified value range; the bonding module is used for bonding and fixing the metal substrate and the PCBA if the metal substrate and the PCBA are in the same state; the bonding module is used for bonding a bonding pad on the PCBA and a corresponding pin in the light emitting chip so as to electrically connect the PCBA and the light emitting chip; the optical power measuring module is used for measuring the output value of the optical power in the adapter so as to measure the output value of the optical power; the third judging module is used for judging whether the output value is in a third qualified value range according to the output value and the preset third qualified value range; and the welding module is used for welding the adapter to the metal substrate through laser if the adapter is used for manufacturing a finished product light emitting device.
Has the advantages that:
the invention provides a preparation method applied to a light emitting device, which is characterized in that a lens is passively pasted on a ceramic substrate, and the central position of the lens and the light outlet position of a light emitting chip are measured to obtain a first distance value, wherein the first distance value is the distance value between the central position of the lens and the light outlet position of the light emitting chip. And judging whether the first distance value is within the first qualified value range or not according to the measured first distance value and a preset first qualified value range. And if so, measuring the working distance between the light emitting chip and the lens to measure a second distance value, wherein the second distance value is the working distance value between the light emitting chip and the lens. And judging whether the second distance value is within the second qualified value range according to the measured second distance value and a preset second qualified value range. If so, the metal substrate and the PCBA are bonded and fixed. And bonding the bonding pads on the PCBA and corresponding pins in the light emitting chip to electrically connect the PCBA and the light emitting chip. And measuring the output value of the optical power in the adapter to measure the output value of the optical power. And judging whether the output value is in the third qualified value range or not according to the output value and the preset third qualified value range. If so, the adapter is laser welded to the metal substrate to produce a finished light emitting device. Therefore, the requirement on the precision of lens coupling is reduced in the process of packaging the COB type with the hard port, the condition that the lens coupling is deviated can be reduced, and the packaging reliability is enhanced. Therefore, the technical effects of reducing the occurrence of lens coupling dislocation and enhancing the reliability of packaging are achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a flowchart of a manufacturing method applied to a light emitting device according to an embodiment of the present invention;
fig. 2 is a structural view of a manufacturing apparatus for a light emitting device according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a manufacturing method applied to a light emitting device according to an embodiment of the present invention.
Detailed Description
The invention discloses a preparation method applied to a light emitting device, which is characterized in that a lens 1 is passively pasted on a ceramic substrate 6, and the central position of the lens 1 and the light outlet position of a light emitting chip 2 are measured to measure a first distance value, wherein the first distance value is the distance value between the central position of the lens 1 and the light outlet position of the light emitting chip 2. And judging whether the first distance value is within the first qualified value range or not according to the measured first distance value and a preset first qualified value range. If yes, measuring the working distance between the light emitting chip 2 and the lens 1 to measure a second distance value, wherein the second distance value is the working distance value between the light emitting chip 2 and the lens 1. And judging whether the second distance value is within the second qualified value range according to the measured second distance value and a preset second qualified value range. If so, the metal substrate 5 and the PCBA7 are adhesively fixed. The pads on the PCBA7 and the corresponding leads in the light emitting chip 2 are bonded to electrically connect the PCBA7 and the light emitting chip 2. And measuring the output value of the optical power in the adapter to measure the output value of the optical power. And judging whether the output value is in the third qualified value range or not according to the output value and the preset third qualified value range. If so, the adapter is laser welded to the metal substrate 5 to produce a finished light emitting device. Therefore, the coupling precision requirement of the lens 1 is reduced in the process of packaging the COB type with the hard opening, the condition that the lens 1 is coupled and dislocated can be reduced, and the packaging reliability is enhanced. Therefore, the technical effects of reducing the occurrence of coupling dislocation of the lens 1 and enhancing the reliability of packaging are achieved.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention; the "and/or" keyword referred to in this embodiment represents sum or two cases, in other words, a and/or B mentioned in the embodiment of the present invention represents two cases of a and B, A or B, and describes three states where a and B exist, such as a and/or B, which represents: only A does not include B; only B does not include A; including A and B.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments. Spatially relative terms, such as "below," "above," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "lower" would then be oriented "upper" other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Also, in embodiments of the invention where an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used in the embodiments of the present invention are for illustrative purposes only and are not intended to limit the present invention.
Example one
Referring to fig. 1 and fig. 3, fig. 1 is a flowchart illustrating a manufacturing method for a light emitting device according to an embodiment of the present invention, and fig. 3 is a schematic diagram illustrating a manufacturing method for a light emitting device according to an embodiment of the present invention. The preparation method applied to the light emitting device provided by the embodiment of the invention comprises the following steps:
step S1, the lens is attached to the ceramic substrate in a passive mode, the central position of the lens 1 and the light outlet position of the light emitting chip are measured, and a first distance value is measured and is the distance value between the central position of the lens and the light outlet position of the light emitting chip;
before the passive mounting of the lens 1 on the ceramic substrate 6, the method may further include: a ceramic substrate 6 with a metal substrate 5 attached thereto is obtained, and a light emitting chip 2 is attached to the ceramic substrate 6. The light emitting chip 2 and the chip substrate 3 may be eutectic bonded, and the bonded chip substrate 3 may be mounted on the ceramic substrate 6. Wherein the center position of the lens 1 and the light exit position of the light emitting chip 2 can be measured by a camera parallel to the light path direction in the light emitting chip 2.
Specifically, for example, in the light emitting device package portion in the single-wave single-channel optical module of 100Gbps FR1/DR1, the ceramic substrate 6 may be attached to the metal substrate 5 in an L-shape by adhesive, the light emitting chip 2 and the chip substrate 3 may be eutectic-bonded, and the bonded chip substrate 3 may be attached to the ceramic substrate 6. Then with lens 1 passive dress to ceramic substrate 6 on, the realization is fixed the position of lens 1, can adopt ultraviolet glue or silver thick liquid to bond fixedly between lens 1 and the ceramic substrate 6, the distance of the center of the chip 2 of sending light and ceramic substrate 6 and lens 1 and the distance of ceramic substrate 6 can be equal, the clearance height range between lens 1 and the ceramic substrate 6 can be between (10 ~ 40) um. The center position of the lens 1 and the light exit position of the chip are measured, for example, by a camera parallel to the direction of the light path in the light emitting chip 2, and the first measured distance value is the distance value between the center position of the lens 1 and the light exit position of the light emitting chip 2. The first distance value for comparison determination with the first acceptable value range is then provided in step S2 described below.
Step S2, determining whether the first distance value is within a first acceptable value range according to the measured first distance value and a preset first acceptable value range;
specifically, after the first pitch value is measured in step S1, it is determined whether the distance between the center position of the lens 1 and the light exit position of the chip is within a preset first acceptable range, which may be (0 ± 15) um, based on the measured result (i.e., the first pitch value). That is, it is determined whether the measured first pitch value is within (0 ± 15) um, and when the first pitch value is 0, the center of the lens 1 and the light exit of the chip are overlapped to the same point. In the determination as to whether or not the first pitch value is within the first acceptable value range, the obtained determination result may be used in step S3 described below.
Step S3, if yes, measuring a working distance between the light emitting chip and the lens to measure a second distance value, where the second distance value is the working distance value between the light emitting chip and the lens;
the working distance of the light emitting chip 2 and the lens 1 can be measured by a camera perpendicular to the direction of the light path in the light emitting chip 2.
Specifically, after determining whether the first pitch value is within the first acceptable range in step S2, if the first pitch value is within the first acceptable range, the working distance between the chip and the lens 1 may be measured by using a camera perpendicular to the optical path direction in the light emitting chip 2, and the second pitch value, which is the value of the pitch between the chip and the lens 1, may be measured. The second distance value thus measured is supplied to step S4 described below for determining whether the second distance value is within the second acceptable value range.
Step S4, determining whether the second distance value is within a second acceptable value range according to the measured second distance value and a preset second acceptable value range;
specifically, after the second distance value is measured in step S3, the measured second distance value may be compared with a second qualified value range, and it is determined whether the measured second distance value is within the second qualified value range, where the second qualified range may be ± 20um different from the theoretical working distance, that is, if the theoretical working distance is D, the second qualified range is (D ± 20) um. After the measured second pitch value and the second acceptable value range are compared, the obtained determination result is supplied to step S5 described below to determine whether or not to adhesively fix the metal substrate 5 and the PCBA 7.
Step S5, if yes, the metal substrate and the PCBA are adhered and fixed;
specifically, after the second pitch value is compared with the second acceptable value range in step S4, if the second pitch value is within the second acceptable value range, the metal substrate 5 and the PCBA7 may be adhesively fixed by glue. The PCBA7 thus adhesively fixed to the metal substrate 5 is supplied to step S6 described below, and bonding of the pads on the PCBA7 and the corresponding leads in the light emitting chip 2 is achieved.
Step S6, bonding the pad on the PCBA and the corresponding lead in the light emitting chip to electrically connect the PCBA and the light emitting chip;
specifically, after the metal substrate 5 and the PCBA7 are fixed by gluing in step S5, the pads on the PCBA7 and the corresponding leads in the optical chip may be bonded to each other, so as to electrically connect the PCBA7 and the light emitting chip 2. As shown in fig. 3, mounting the ceramic substrate 6 on the metal substrate 5 in this way, mounting the chip substrate 3, the light-emitting chip 2, and the lens 1 on the ceramic substrate 6, and mounting the metal substrate 5 onto the PCBA7 provides the metal substrate 5 to which a mount adapter (i.e., a fiber adapter) can be soldered in step S7 described below.
Step S7, measuring the output value of the optical power in the adapter to measure the output value of the optical power;
the output value of the optical power in the adapter can be measured by an optical power meter.
Specifically, the output value of the optical power is measured by the optical power meter by adjusting the position of the ferrule of the optical fiber adapter on the metal substrate 5 in the above step S6. When the output value of the optical power measured by the optical power meter is the maximum value, in the following step S8, the output value of the optical power at this time is compared with a preset third acceptable value range (i.e., an acceptable value range established according to the actual process requirements of the finished product).
Step S8, judging whether the output value is in the third qualified value range according to the output value and the preset third qualified value range;
specifically, after the output value of the optical power is detected in step S7, the output value is compared with a preset third acceptable value range according to the detected output value, and it is determined whether the output value is within the third acceptable value range. In this way, step S8 provides the result of determining whether the output value is within the third acceptable value range in step S9 described below, and selects whether or not to solder the adapter to the metal substrate 5 based on the result of the determination.
And step S9, if yes, welding the adapter to the metal substrate through laser to prepare a finished light emitting device.
Specifically, when it is determined that the output value is within the third acceptable value range, the optical fiber adapter may be welded to the metal substrate 5 by laser light to manufacture a finished product according to the steps S1 to S8. After power is supplied to the light emitting chip 2 through the PCBA7, in the process of adjusting the position of the adapter pin, the change of the output value of the optical power in the adapter is monitored by the optical power meter, when the output value of the optical power reaches the maximum value, the adapter and the tube shell which is the L-shaped metal substrate 5 are welded and fixed in a laser welding mode, so that the adapter is finally positioned, and qualified light emitting device finished products meeting requirements are manufactured.
In addition, the determining whether the output value is within a third acceptable value range according to the output value and a preset third acceptable value range may further include: if not, measuring the heights of the surface of the light emitting chip 2 and the surface of the ceramic substrate 6 by adopting high-precision quadratic element to measure a first height value, wherein the first height value is a distance value between the surface of the light emitting chip 2 and the surface of the ceramic substrate 6; measuring the height from the upper surface of the lens 1 to the surface of the ceramic substrate 6 by using a high-precision quadratic element to measure a second height value, wherein the second height value is a distance value from the upper surface of the lens 1 to the surface of the ceramic substrate 6; measuring the height from the spherical surface of the lens 1 to the upper surface of the lens 1 by adopting a high-precision quadratic element to measure a third height value, wherein the third height value is a distance value from the spherical surface of the lens 1 to the upper surface of the lens 1; calculating a height deviation value of the center of the light emitting chip 2 and the lens 1 according to the first height value, the second height value and the third height value; wherein the first height value is H1, the second height value is H2, and the third height value is H3, the height deviation value is Z1, Z1 ═ H1- (H2-H3); measuring the distance between the spherical surface of the lens 1 and the side edge of the lens 1 by adopting a high-precision quadratic element to measure a first measured value, wherein the first measured value is the distance value between the spherical surface of the lens 1 and the side edge of the lens 1; measuring the transverse distance between the side edge of the lens 1 and the light-emitting strip of the light-emitting chip 2 by using a high-precision quadratic element to measure a second measured value, wherein the second measured value is the transverse distance value between the side edge of the lens 1 and the light-emitting strip of the light-emitting chip 2; calculating a lateral deviation value according to the first measurement value and the second measurement value; wherein the first measurement value is W1, the second measurement value is W2, and the lateral offset value is Z2, and Z2 is W1-W2. Judging whether the height deviation value is within the first qualified value range or not according to the obtained height deviation value; if not, the step returns to the step S1 after the lens 1 is disassembled; or judging whether the lateral deviation value is within the second qualified value range according to the calculated lateral deviation value; if not, the process returns to step S1 after the lens 1 is removed. In addition, the axial distance between the light emitting point of the light emitting chip 2 and the lens 1 can be measured by adopting a high-precision quadratic element so as to measure an axial distance value; judging whether the axial distance value is within a preset axial qualified value range or not according to the axial distance value and the preset axial qualified value range; if not, the process returns to step S1 after the lens 1 is removed.
Specifically, the height from the surface of the light emitting chip 2 to the surface of the ceramic substrate 6 (i.e., a first height value) may be measured in a high-precision quadratic manner, and then the height from the upper surface of the lens 1 to the surface of the ceramic substrate 6 (i.e., a second height value), the height from the spherical surface of the lens 1 to the upper surface of the lens 1 (i.e., a third height value), the distance from the spherical surface of the lens 1 to the side of the sphere of the lens 1 (i.e., a first measurement value), and the lateral distance from the side of the lens 1 to the light emitting bar of the chip (i.e., a second measurement value) may be measured, where if the first height value is H1, the second height value is H2, the third height value is H3, and the height deviation value (i.e., the height deviation value between the light emitting chip 2 and the center of the lens 1) is Z1, then Z1 is H1- (H2-H3); the transverse deviation value is Z2, and then Z2 is W1-W2; when it is determined that Z1 is not within the first acceptable value range, it reflects that the center position of lens 1 and the light exit position of the chip are not acceptable. When it is determined that Z2 is not within the second acceptable value range, it also indicates that the center position of lens 1 and the light exit position of the chip are not satisfactory. At this time, the lens 1 may be disassembled, and the disassembled lens 1 is mounted on the ceramic substrate 6, and the central position of the lens 1 and the light exit position of the light emitting chip 2 are measured again, that is, the above steps S1 to S9 are repeated after the lens 1 is disassembled. The axial distance value between the light emitting point of the light emitting chip 2 and the lens 1 can be measured in a high-precision quadratic element mode, if the axial distance value is not within a preset axial qualified value range (namely, an axial qualified value range made according to actual finished product process requirements), the working distance between the chip and the lens 1 is unqualified, the lens 1 can be disassembled at the moment, the disassembled lens 1 is installed on the passive mounting ceramic substrate 6, the central position of the lens 1 and the light outlet position of the light emitting chip 2 are measured again, and the steps S1 to S9 are repeated after the lens 1 is disassembled.
The invention provides a preparation method applied to a light emitting device, which is characterized in that a lens 1 is passively pasted on a ceramic substrate 6, and the central position of the lens 1 and the light outlet position of a light emitting chip 2 are measured to measure a first distance value, wherein the first distance value is the distance value between the central position of the lens 1 and the light outlet position of the light emitting chip 2. And judging whether the first distance value is within the first qualified value range or not according to the measured first distance value and a preset first qualified value range. If yes, measuring the working distance between the light emitting chip 2 and the lens 1 to measure a second distance value, wherein the second distance value is the working distance value between the light emitting chip 2 and the lens 1. And judging whether the second distance value is within the second qualified value range according to the measured second distance value and a preset second qualified value range. If so, the metal substrate 5 and the PCBA7 are adhesively fixed. The pads on the PCBA7 and the corresponding leads in the light emitting chip 2 are bonded to electrically connect the PCBA7 and the light emitting chip 2. And measuring the output value of the optical power in the adapter to measure the output value of the optical power. And judging whether the output value is in the third qualified value range or not according to the output value and the preset third qualified value range. If so, the adapter is laser welded to the metal substrate 5 to produce a finished light emitting device. Therefore, the coupling precision requirement of the lens 1 is reduced in the process of packaging the COB type with the hard opening, the condition that the lens 1 is coupled and dislocated can be reduced, and the packaging reliability is enhanced. Therefore, the technical effects of reducing the occurrence of coupling dislocation of the lens 1 and enhancing the reliability of packaging are achieved.
In order to describe the manufacturing apparatus for a light emitting device in detail, the above embodiments describe the manufacturing method for a light emitting device in detail, and based on the same inventive concept, the present application also provides a manufacturing apparatus for a light emitting device, as detailed in embodiment two.
Example two
Referring to fig. 2, fig. 2 is a structural diagram of a manufacturing apparatus for a light emitting device according to an embodiment of the present invention, and a second embodiment of the present invention provides a manufacturing apparatus for a light emitting device, including:
the mounting measurement module is used for passively mounting the lens 1 on the ceramic substrate 6, and measuring the central position of the lens 1 and the light outlet position of the light emitting chip 2 to measure a first distance value, wherein the first distance value is the distance value between the central position of the lens 1 and the light outlet position of the light emitting chip 2;
the first judgment module is used for judging whether the first distance value is within a first qualified value range or not according to the measured first distance value and a preset first qualified value range;
the working distance measuring module is used for measuring the working distance between the light emitting chip 2 and the lens 1 if the working distance is the working distance between the light emitting chip 2 and the lens 1 so as to measure a second distance value, and the second distance value is the working distance value between the light emitting chip 2 and the lens 1;
the second judgment module is used for judging whether the second distance value is within a second qualified value range according to the measured second distance value and a preset second qualified value range;
the bonding module is used for bonding and fixing the metal substrate 5 and the PCBA7 if the metal substrate 5 and the PCBA7 are in the same state;
a bonding module for bonding pads on the PCBA7 and corresponding leads in the light emitting chip 2 to electrically connect the PCBA7 and the light emitting chip 2;
the optical power measuring module is used for measuring the output value of the optical power in the adapter so as to measure the output value of the optical power;
the third judging module is used for judging whether the output value is in a third qualified value range according to the output value and the preset third qualified value range;
and the welding module is used for welding the adapter to the metal substrate 5 through laser if the adapter is used for manufacturing a finished light emitting device.
The invention provides a preparation device applied to a light emitting device, wherein a lens 1 is passively pasted on a ceramic substrate 6 through a pasting measurement module, and the central position of the lens 1 and the light outlet position of a light emitting chip 2 are measured to measure a first distance value, wherein the first distance value is the distance value between the central position of the lens 1 and the light outlet position of the light emitting chip 2. The first judgment module judges whether the first distance value is within a first qualified value range according to the measured first distance value and a preset first qualified value range. And if so, the working distance measuring module measures the working distance between the light emitting chip 2 and the lens 1 to measure a second distance value, wherein the second distance value is the working distance value between the light emitting chip 2 and the lens 1. And the second judging module judges whether the second distance value is within a second qualified value range according to the measured second distance value and a preset second qualified value range. If the number is "yes", the metal substrate 5 and the PCBA7 are fixed by adhesion. A bonding module bonds pads on the PCBA7 and corresponding leads in the light emitting chip 2 to electrically connect the PCBA7 and the light emitting chip 2. The optical power measuring module measures the output value of the optical power in the adapter to measure the output value of the optical power. And the third judging module judges whether the output value is in a third qualified value range according to the output value and a preset third qualified value range. And if the welding module is yes, welding the adapter to the metal substrate 5 through laser to prepare a finished light emitting device. Therefore, the coupling precision requirement of the lens 1 is reduced in the process of packaging the COB type with the hard opening, the condition that the lens 1 is coupled and dislocated can be reduced, and the packaging reliability is enhanced. Therefore, the technical effects of reducing the occurrence of coupling dislocation of the lens 1 and enhancing the reliability of packaging are achieved.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (10)
1. A method of fabricating a light emitting device, the method comprising:
s1, mounting the lens on the ceramic substrate in a passive mode, and measuring the center position of the lens and the light outlet position of the light emitting chip to measure a first distance value, wherein the first distance value is the distance value between the center position of the lens and the light outlet position of the light emitting chip;
s2, judging whether the first distance value is in a first qualified value range according to the measured first distance value and a preset first qualified value range;
s3, if yes, measuring the working distance between the light emitting chip and the lens to measure a second distance value, wherein the second distance value is the working distance value between the light emitting chip and the lens;
s4, judging whether the second distance value is in a second qualified value range according to the measured second distance value and a preset second qualified value range;
s5, if yes, the metal substrate and the PCBA are adhered and fixed;
s6, bonding the pad on the PCBA and the corresponding pin in the light emitting chip to electrically connect the PCBA and the light emitting chip;
s7, measuring the output value of the optical power in the adapter to measure the output value of the optical power;
s8, judging whether the output value is in a third qualified value range according to the output value and the preset third qualified value range;
and S9, if yes, welding the adapter to the metal substrate through laser to prepare the finished light emitting device.
2. The method of claim 1, wherein the passively mounting the lens onto the ceramic substrate further comprises:
obtaining a ceramic substrate with a metal substrate attached, and attaching a light emitting chip to the ceramic substrate.
3. The fabrication method applied to a light emitting device according to claim 2, wherein the attaching the light emitting chip to the ceramic substrate comprises:
and carrying out eutectic bonding on the light emitting chip and the chip substrate, and mounting the bonded chip substrate on the ceramic substrate.
4. The method of claim 1, wherein determining whether the output value is within a third acceptable value range according to the output value and a preset third acceptable value range further comprises:
if not, measuring the height of the surface of the light emitting chip and the surface of the ceramic substrate by adopting high-precision quadratic element to measure a first height value, wherein the first height value is the distance value between the surface of the light emitting chip and the surface of the ceramic substrate;
measuring the height from the upper surface of the lens to the surface of the ceramic substrate by adopting a high-precision quadratic element to measure a second height value, wherein the second height value is a spacing value from the upper surface of the lens to the surface of the ceramic substrate;
measuring the height from the spherical surface of the lens to the upper surface of the lens by adopting a high-precision quadratic element to measure a third height value, wherein the third height value is a distance value from the spherical surface of the lens to the upper surface of the lens;
calculating a height deviation value of the center of the light emitting chip and the lens according to the first height value, the second height value and the third height value; wherein the first height value is H1, the second height value is H2, and the third height value is H3, the height deviation value is Z1, Z1 ═ H1- (H2-H3);
measuring the distance between the spherical surface of the lens and the side edge of the lens by adopting a high-precision quadratic element to measure a first measured value, wherein the first measured value is the distance value between the spherical surface of the lens and the side edge of the lens;
measuring the transverse distance between the side edge of the lens and the light-emitting strip of the light-emitting chip by adopting a high-precision quadratic element to measure a second measured value, wherein the second measured value is the transverse distance value between the side edge of the lens and the light-emitting strip of the light-emitting chip;
calculating a lateral deviation value according to the first measurement value and the second measurement value; wherein the first measurement value is W1, the second measurement value is W2, and the lateral offset value is Z2, and Z2 is W1-W2.
5. The manufacturing method applied to a light emitting device according to claim 4, wherein:
judging whether the height deviation value is within the first qualified value range or not according to the obtained height deviation value;
if not, the lens is disassembled and then the step S1 is returned to;
or judging whether the lateral deviation value is within the second qualified value range according to the calculated lateral deviation value;
if not, the lens is disassembled and the process returns to step S1.
6. The manufacturing method applied to a light emitting device according to claim 1, wherein:
measuring the axial distance between the light emitting point of the light emitting chip and the lens by adopting a high-precision quadratic element to measure an axial distance value;
judging whether the axial distance value is within a preset axial qualified value range or not according to the axial distance value and the preset axial qualified value range;
if not, the lens is disassembled and the process returns to step S1.
7. The method of claim 1, wherein measuring the output of optical power in the adapter comprises:
and measuring the output value of the optical power in the adapter by an optical power meter.
8. The manufacturing method applied to a light emitting device according to claim 1, wherein the measuring the central position of the lens and the light exit position of the light emitting chip comprises:
the center position of the lens and the position of the light outlet of the light emitting chip are measured by a camera parallel to the direction of the light path in the light emitting chip.
9. The method of claim 1, wherein measuring the working distance between the light emitting chip and the lens comprises:
and measuring the working distance between the light emitting chip and the lens by a camera perpendicular to the direction of the light path in the light emitting chip.
10. A manufacturing apparatus for a light emitting device, the apparatus comprising:
the mounting measurement module is used for passively mounting the lens on the ceramic substrate, and measuring the central position of the lens and the light outlet position of the light emitting chip to measure a first distance value, wherein the first distance value is the distance value between the central position of the lens and the light outlet position of the light emitting chip;
the first judgment module is used for judging whether the first distance value is within a first qualified value range or not according to the measured first distance value and a preset first qualified value range;
the working distance measuring module is used for measuring the working distance between the light emitting chip and the lens if the working distance is greater than the working distance between the light emitting chip and the lens, so as to measure a second distance value, wherein the second distance value is the working distance value between the light emitting chip and the lens;
the second judgment module is used for judging whether the second distance value is within a second qualified value range according to the measured second distance value and a preset second qualified value range;
the bonding module is used for bonding and fixing the metal substrate and the PCBA if the metal substrate and the PCBA are in the same state;
the bonding module is used for bonding a bonding pad on the PCBA and a corresponding pin in the light emitting chip so as to electrically connect the PCBA and the light emitting chip;
the optical power measuring module is used for measuring the output value of the optical power in the adapter so as to measure the output value of the optical power;
the third judging module is used for judging whether the output value is in a third qualified value range according to the output value and the preset third qualified value range;
and the welding module is used for welding the adapter to the metal substrate through laser if the adapter is used for manufacturing a finished product light emitting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110726012.2A CN113608304A (en) | 2021-06-29 | 2021-06-29 | Preparation method and device applied to light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110726012.2A CN113608304A (en) | 2021-06-29 | 2021-06-29 | Preparation method and device applied to light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113608304A true CN113608304A (en) | 2021-11-05 |
Family
ID=78336936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110726012.2A Pending CN113608304A (en) | 2021-06-29 | 2021-06-29 | Preparation method and device applied to light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113608304A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117283171A (en) * | 2023-11-02 | 2023-12-26 | 成都储翰科技股份有限公司 | BOSA structure welding positioning monitoring method, system and storage medium |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108828728A (en) * | 2018-06-07 | 2018-11-16 | 深圳市极致兴通科技有限公司 | A kind of fixing means and light emission component of passive optical lens |
| CN210605097U (en) * | 2019-08-20 | 2020-05-22 | 广东海信宽带科技有限公司 | Automatic light coupling machine |
-
2021
- 2021-06-29 CN CN202110726012.2A patent/CN113608304A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108828728A (en) * | 2018-06-07 | 2018-11-16 | 深圳市极致兴通科技有限公司 | A kind of fixing means and light emission component of passive optical lens |
| CN210605097U (en) * | 2019-08-20 | 2020-05-22 | 广东海信宽带科技有限公司 | Automatic light coupling machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117283171A (en) * | 2023-11-02 | 2023-12-26 | 成都储翰科技股份有限公司 | BOSA structure welding positioning monitoring method, system and storage medium |
| CN117283171B (en) * | 2023-11-02 | 2024-05-14 | 成都储翰科技股份有限公司 | BOSA structure welding positioning monitoring method, system and storage medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5265025B2 (en) | Optical coupling structure and optical transceiver module | |
| US7255493B2 (en) | Optical semiconductor module and its manufacturing method | |
| US5854867A (en) | Optical module having lenses aligned on lens-positioning V-groove and fabrication method thereof | |
| US8027553B2 (en) | Connected body and optical transceiver module | |
| US7153042B2 (en) | Optic device | |
| EP2413171A1 (en) | Laterally coupled optical fiber component and processing method thereof | |
| US20110080657A1 (en) | Optical module | |
| US20090180732A1 (en) | Junction Structure Between Optical Element and Substrate, Optical Transmission/Receiving Module, and Method of Manufacturing the Optical Module | |
| JP2010237642A (en) | Optical coupling structure and optical transmission and reception module | |
| JP5094636B2 (en) | Package for optoelectric wiring | |
| CN113608304A (en) | Preparation method and device applied to light emitting device | |
| JP5256082B2 (en) | Optical coupling structure and optical transceiver module | |
| JP2012128233A (en) | Optical module and mounting method thereof | |
| TWI507752B (en) | Optical element package | |
| JPH0951108A (en) | Light reception light emitting element module and its manufacturing method | |
| JP2005017684A (en) | Optical module and method for manufacturing the same | |
| US20130307005A1 (en) | Low Cost Surface Mount Packaging Structure for Semiconductor Optical Device and Packaging Method Therefor | |
| CN114204408B (en) | Refrigerating TO with integrated SOA and PIN and manufacturing method thereof | |
| JPH09148623A (en) | Light receiving/emitting element mounting method | |
| JP2001177177A (en) | Package for housing optical semiconductor element | |
| JPH1138244A (en) | Optical module | |
| EP1365268B1 (en) | Butt joined opto-electronic assembly having a dielectric stand-off substrate with a coplanar electrical transmission structure formed thereon | |
| CN116088111A (en) | Light coupling method of light emission sub-module | |
| WO2019086953A1 (en) | Wafer-level optoelectronic packaging | |
| TW557381B (en) | Ceramic optical sub-assembly for optoelectronic modules |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211105 |