CN113604781A - Magnetron sputtering platform capable of self-adapting to target material temperature - Google Patents
Magnetron sputtering platform capable of self-adapting to target material temperature Download PDFInfo
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- CN113604781A CN113604781A CN202110787225.6A CN202110787225A CN113604781A CN 113604781 A CN113604781 A CN 113604781A CN 202110787225 A CN202110787225 A CN 202110787225A CN 113604781 A CN113604781 A CN 113604781A
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- sputtering
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- 239000013077 target material Substances 0.000 title claims abstract description 26
- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 20
- 238000004544 sputter deposition Methods 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 45
- 230000007246 mechanism Effects 0.000 claims description 27
- 238000001816 cooling Methods 0.000 claims description 26
- 239000000110 cooling liquid Substances 0.000 claims description 22
- 230000003044 adaptive effect Effects 0.000 claims description 6
- 210000001503 joint Anatomy 0.000 claims description 5
- 230000003116 impacting effect Effects 0.000 claims description 3
- 230000006978 adaptation Effects 0.000 claims description 2
- 238000010849 ion bombardment Methods 0.000 abstract description 8
- 238000005728 strengthening Methods 0.000 abstract 1
- 230000009471 action Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 239000002826 coolant Substances 0.000 description 8
- 238000005477 sputtering target Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000008602 contraction Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010891 electric arc Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a magnetron sputtering platform capable of self-adapting to the temperature of a target material, which relates to the technical field of magnetron sputtering platforms and comprises a machine body, wherein a sputtering box is fixedly connected to the upper surface of the machine body, a shielding cover is fixedly connected to the inner wall of the sputtering box, a rotating motor is arranged on the inner wall of the sputtering box, a substrate is arranged on the inner wall of the shielding cover, the target material is arranged on the surface of the substrate, two vacuum air suction pipes are fixedly communicated inside the machine body, opposite surfaces of the two vacuum air suction pipes are fixedly communicated with two sides of the sputtering box, a metal cylinder is fixedly connected to the upper surface of the substrate, a piston I is connected to the inner wall of the metal cylinder in a sliding manner, and expansion liquid is arranged inside the metal cylinder. And the strengthening of the ion bombardment force causes the substrate structure to collapse, thereby affecting the quality.
Description
Technical Field
The invention relates to the technical field of magnetron sputtering tables, in particular to a magnetron sputtering table capable of self-adapting to the temperature of a target.
Background
In semiconductor manufacturing processes, magnetron sputtering stations are required in order to strengthen and impart different functions to substrates.
When the magnetron sputtering platform carries out ion bombardment, an electric arc can be generated, the electric arc can damage the surface of a target to generate a fragmentation phenomenon, the heat of the target can not be led out even if the temperature is increased, in addition, the material of the target is fragile, the target is easy to blacken and oxidize, the target is further cracked, along with the increase of power, the bombardment effect is stronger, the surface defect of the film and the residual stress in the film are larger, the residual stress extends along the loose crack in the film, the surface defect of the substrate is increased, the internal structure defect of the film is caused, the quality of the substrate is further reduced, and the substrate can not be used.
Disclosure of Invention
The invention aims to provide a magnetron sputtering platform capable of self-adapting to the temperature of a target, which has the effects of cooling the surface of the target and self-adapting to the ion bombardment strength, and solves the problems that the target is relatively fragile in material and cannot be cooled in time, so that the target is blackened and oxidized and cracked, and the substrate structure is collapsed due to the enhancement of the ion bombardment acting force, so that the quality is influenced.
In order to achieve the purpose, the invention provides the following technical scheme: a magnetron sputtering platform capable of adapting to the temperature of a target material self comprises a machine body, wherein a sputtering box is fixedly connected to the upper surface of the machine body, a shielding cover is fixedly connected to the inner wall of the sputtering box, a rotating motor is installed on the inner wall of the sputtering box, a substrate is installed on the inner wall of the shielding cover, the target material is installed on the surface of the substrate, two vacuum suction pipes are fixedly communicated inside the machine body, opposite surfaces of the two vacuum suction pipes are fixedly communicated with two sides of the sputtering box, a metal cylinder is fixedly connected to the upper surface of the substrate, a first piston is connected to the inner wall of the metal cylinder in a sliding manner, expansion liquid is filled inside the metal cylinder, a first through hole is formed in the upper surface of the metal cylinder, a piston rod is connected to the inner wall of the first through hole in a sliding manner, the lower end of the piston rod is fixedly connected to the upper surface of the first piston, and a rack bar is fixedly connected to the upper end of the piston rod, the upper surface of the sputtering box is also provided with a cooling mechanism driven by the rack row, and further comprises an adaptive mechanism for adapting to the strength of an ion source in the sputtering box, the surface of the target is fixedly connected with a water bag, and the device further comprises a reinforced cooling mechanism for impacting the water bag and generating surging of cooling liquid in the water bag.
Optionally, a fixed plate is fixedly connected to the upper surface of the sputtering box, a first rotating shaft and a second rotating shaft are rotatably connected to the front dead axle of the fixed plate, a second connecting rod is fixedly connected to the surface of the first rotating shaft, a first connecting rod is fixedly connected to the surface of the second connecting rod, a spring is fixedly connected to the surface of the first connecting rod, the end of the spring is fixedly connected to the front of the fixed plate, a gear is fixedly connected to the surface of the second rotating shaft, a third connecting rod is fixedly connected to the surface of the second rotating shaft, the gear is meshed with the rack bar, a piston cylinder is fixedly connected to the upper surface of the sputtering box, a second piston is slidably connected to the inner wall of the piston cylinder, a second through hole is formed in the lower surface of the piston cylinder, a U-shaped piston rod is slidably connected to the inner wall of the second through hole, and one end of the U-shaped piston rod is fixedly connected to the lower surface of the second piston, the cooling device comprises a piston cylinder, a cooling component and a linkage mechanism, wherein cooling liquid is filled in the piston cylinder, the surface of the piston cylinder is fixedly connected with a refrigerator, the cooling component is used for cooling the surface of a target material, and the linkage mechanism is used for driving the piston II to move.
Optionally, the link gear includes butt piece one and butt piece two, the last fixed surface of sputtering the case is connected with slide bar one, the surface sliding of slide bar one adjusts there is the lagging, butt piece one with the equal fixed connection of butt piece two is in the left side of lagging, the other end of U type piston rod with the fixed surface of lagging is connected.
Optionally, the cooling component includes a pipeline, one end of the pipeline is fixedly communicated with the lower surface of the piston cylinder, and the other end of the pipeline is fixedly communicated with the left side of the water bag.
Optionally, the adaptation mechanism includes two memory springs, the upper surface of the machine body is fixedly connected with two second sliding rods, the surfaces of the two second sliding rods are jointly sleeved with a supporting plate, the upper ends of the two memory springs are fixedly connected with the lower surface of the supporting plate, and the lower ends of the two memory springs are fixedly connected with the upper surface of the machine body.
Optionally, the first through hole is matched with the piston rod, and the second through hole is matched with the piston cylinder.
Optionally, the inner wall dead axle of sputtering case rotates and is connected with pivot three and pivot four, the fixed surface of pivot three is connected with gear one, the fixed surface of pivot four is connected with gear two and incomplete gear, the last fixed surface of backup pad is connected with the rack row, the rack row with gear two-phase meshing, gear one with incomplete gear intermittent type nature meshing, through-hole three has been seted up on the surface of shield cover, the inner wall fixedly connected with fixed block of through-hole three, the spout has been seted up on the surface of fixed block, the inner wall sliding connection of spout has the slider, the front of slider with the front of gear one articulates jointly has connecting rod four, the right side intercommunication of water pocket has the water pocket extension, the upper end of slider is provided with and is used for raising the mechanism of raising of water pocket extension.
Optionally, the lifting mechanism comprises a fifth connecting rod, the lower end of the fifth connecting rod is fixedly connected with the upper surface of the sliding block, and the upper end of the fifth connecting rod is fixedly connected with the abutting block.
Compared with the prior art, the invention has the following beneficial effects:
firstly, through physical impact of an ion source, the surface of a target material is continuously heated, high-temperature molecules contact the surface of a metal cylinder, expansion liquid begins to expand after being heated, a rack row is driven to move upwards, cooling liquid in a piston cylinder is driven to be pumped into a pipeline through the upward movement of the rack row and enters a water bag to cool the target material, the cooling liquid is stopped in the water bag through the time that a sleeve block moves to the lower part of a slide rod for stopping, the target material can be fully cooled, the sleeve block moves to the upper part of the slide rod I, the cooling liquid is pumped into the piston cylinder, and cooling is carried out under the action of a refrigerator.
The temperature in the sputtering box rises along with the continuous increase of the sputtering power, the memory spring senses the rise of the temperature and starts to contract, the support plate is driven to move downwards through the contraction of the memory spring, the distance between the substrate and the sputtering target material is continuously increased, the strength of the high-strength ion source when the substrate is bombarded again is reduced, the temperature in the sputtering box is gradually reduced along with the gradual completion of sputtering, the memory spring is gradually extended to the initial length, the distance between the substrate and the sputtering target material is gradually increased, and the effect of automatically adapting to and automatically adjusting the ion bombardment strength can be realized.
Three, move down through the backup pad, drive the slider and move the uppermost stagnation of stroke in the spout of fixed block, through shifting up of slider, drive butt piece butt water pocket extension, raise it, thereby make the coolant liquid in the water pocket extension raised, make its backward flow to the water pocket in, the coolant liquid in the water pocket can produce the wave because of the pouring of coolant liquid in the water pocket extension, thereby make the more abundant contact of coolant liquid and target contact surface, improve refrigerated effect.
Drawings
FIG. 1 is a front cross-sectional view of the structure of the present invention;
FIG. 2 is an enlarged view of the structure of FIG. 1 at A in accordance with the present invention;
FIG. 3 is an enlarged view of the structure of FIG. 2 at B in accordance with the present invention;
FIG. 4 is an isometric view of a structure of the present invention;
FIG. 5 is an enlarged view of the structure of FIG. 1 at C according to the present invention;
FIG. 6 is a front view of the structure of the shield, the third rotating shaft, the first gear, the fourth rotating shaft, the second gear, the incomplete gear, the fourth connecting rod, the fixed block and the sliding block.
In the figure: 1. a body; 2. a sputtering box; 3. a shield case; 4. a rotating electric machine; 5. a substrate; 6. a target material; 7. a vacuum suction duct; 8. an expansion liquid; 9. a first piston; 10. a piston rod; 11. a rack row; 12. a fixing plate; 13. a first rotating shaft; 14. a first connecting rod; 15. a second connecting rod; 16. a spring; 17. a second rotating shaft; 18. a gear; 19. a third connecting rod; 20. a first sliding rod; 21. sleeving blocks; 22. a first abutting block; 23. a second abutting block; 24. a U-shaped piston rod; 25. a piston cylinder; 26. a second piston; 27. a pipeline; 28. a water bladder; 29. a support plate; 30. a second sliding rod; 31. a memory spring; 32. a refrigerator; 71. a metal cylinder; 33. a rotating shaft III; 34. a first gear; 35. a rotating shaft IV; 36. a second gear; 37. an incomplete gear; 38. a rack row; 39. a connecting rod IV; 40. a fixed block; 41. a slider; 42. a connecting rod V; 43. a butting block; 281. a water bag extension section.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 6, the present invention provides a technical solution: a magnetron sputtering platform capable of self-adapting to the temperature of a target material comprises a machine body 1, wherein a sputtering box 2 is fixedly connected to the upper surface of the machine body 1, a shielding cover 3 is fixedly connected to the inner wall of the sputtering box 2, a rotating motor 4 is installed on the inner wall of the sputtering box 2, a substrate 5 is installed on the inner wall of the shielding cover 3, the target material 6 is installed on the surface of the substrate 5, two vacuum suction pipes 7 are fixedly communicated with the inside of the machine body 1, opposite surfaces of the two vacuum suction pipes 7 are fixedly communicated with two sides of the sputtering box 2, a metal cylinder 71 is fixedly connected to the upper surface of the substrate 5, a piston I9 is slidably connected to the inner wall of the metal cylinder 71, an expansion liquid 8 is contained in the metal cylinder 71, a through hole I is formed in the upper surface of the metal cylinder 71, a piston rod 10 is slidably connected to the inner wall of the through hole I, the lower end of the piston rod 10 is fixedly connected to the upper surface of the piston I9, a rack row 11 is fixedly connected to the upper end of the piston rod 10, the upper surface of the sputtering box 2 is also provided with a cooling mechanism driven by the rack bar 11, and further comprises an adaptive mechanism for adapting the strength of an ion source in the sputtering box 2, the surface of the target 6 is fixedly connected with a water bag 28, and the sputtering box further comprises a reinforced cooling mechanism for impacting the water bag 28 and generating sloshing of cooling liquid in the water bag 28, the surface of the target 6 is continuously heated through physical impact of the ion source, high-temperature molecules contact the surface of the metal cylinder 71 along with the temperature separation and the temperature rise of gas at the moment, then the expansion liquid 8 begins to expand after being heated by utilizing the principle of thermal expansion and cold contraction of the expansion liquid 8 on a hot gas source, the piston I9 is driven to move upwards, the piston rod 10 is driven to move upwards through the upward movement of the piston rod 10, the rack bar 11 is driven to move upwards through the upward movement of the rack bar 11, and the target 6 can be fully cooled under the action of the refrigeration mechanism, along with the continuous increase of the sputtering power, the temperature in the sputtering box 2 rises, and the space between the substrate and the sputtering target 6 can be gradually increased under the action of the adaptive mechanism, so that the effect of automatically adapting and automatically adjusting the ion bombardment strength can be realized.
Further, the upper surface of the sputtering box 2 is fixedly connected with a fixing plate 12, the front fixed shaft of the fixing plate 12 is rotatably connected with a first rotating shaft 13 and a second rotating shaft 17, the surface of the first rotating shaft 13 is fixedly connected with a second connecting rod 15, the surface of the second connecting rod 15 is fixedly connected with a first connecting rod 14, the surface of the first connecting rod 14 is fixedly connected with a spring 16, the end part of the spring 16 is fixedly connected with the front of the fixing plate 12, the surface of the second rotating shaft 17 is fixedly connected with a gear 18, the surface of the second rotating shaft 17 is fixedly connected with a third connecting rod 19, the gear 18 is meshed with the rack bar 11, the upper surface of the sputtering box 2 is fixedly connected with a piston cylinder 25, the inner wall of the piston cylinder 25 is slidably connected with a second piston 26, the lower surface of the piston cylinder 25 is provided with a second through hole, the inner wall of the second through hole is slidably connected with a U-shaped piston rod 24, one end of the U-shaped piston rod 24 is fixedly connected with the lower surface of the second piston 26, the interior of the piston cylinder 25 is filled with cooling liquid, the surface of the piston cylinder 25 is fixedly connected with a refrigerator 32, the surface of the piston cylinder 25 also comprises a cooling part for cooling the surface of the target 6, the surface of the piston cylinder 25 also comprises a linkage mechanism for driving the second piston 26 to move, the gear 18 is driven to rotate clockwise by the upward movement of the rack row 11, the second rotating shaft 17 is driven to rotate by the rotation of the gear 18, the third connecting rod 19 is driven to rotate clockwise by the clockwise rotation of the second rotating shaft 17, the U-shaped piston rod 24 is driven to reciprocate up and down by the rotation of the third connecting rod 19, the U-shaped piston rod 24 is stopped for a period of time after the U-shaped piston rod 24 moves down, the cooling liquid in the piston cylinder 25 is driven to be sent to the cooling part and enters the water sac 28 to cool the target 6, and is stopped in the cooling part by the U-shaped piston rod 24, so that the cooling liquid can be stopped in the cooling part, and the target 6 can be sufficiently cooled,
further, the linkage mechanism comprises a first abutting block 22 and a second abutting block 23, the upper surface of the sputtering box 2 is fixedly connected with a first sliding rod 20, the surface of the first sliding rod 20 is adjusted to be provided with a sleeve block 21 in a sliding manner, the first abutting block 22 and the second abutting block 23 are both fixedly connected to the left side of the sleeve block 21, the other end of the U-shaped piston rod 24 is fixedly connected with the surface of the sleeve block 21, the first abutting block 22 abuts against the first abutting block 22 through rotation of a third connecting rod 19, the first abutting block 22 is driven to move downwards, the sleeve block 21 is driven to move downwards through downward movement of the first abutting block 22, the third connecting rod 19 does not abut against the first abutting block 22 any more through continuous rotation of a second rotating shaft 17, at the moment, the sleeve block 21 is free from any external force, namely, no movement occurs, when the third connecting rod 19 rotates to the surface of the first connecting rod 14, the first connecting rod 14 is driven to rotate anticlockwise through abutting against the surface of the first connecting rod 14, the connecting rod II 15 is driven to rotate anticlockwise, the connecting rod II 15 is enabled to abut against the abutting block II 23 by anticlockwise rotation of the connecting rod II 15, the sleeve block 21 is driven to move upwards by abutting against the abutting block II 23, the connecting rod III 19 is driven to reset under the action of the spring 16 when not abutting against the surface of the connecting rod I14 any more after rotating, the sleeve block 21 can be driven to move upwards again after being stopped for a dead end time after moving downwards by continuous rotation of the connecting rod III 19, the cooling liquid in the piston cylinder 25 is driven to be pumped into a cooling part by the action of the U-shaped piston rod 24 through the movement of the sleeve block 21, the target material 6 is cooled, the sleeve block 21 moves to be stopped below the sliding rod I20 for a dead time, the cooling liquid is stopped in the cooling part, the target material 6 can be sufficiently cooled, and moves to be above the sliding rod I20 through the sleeve block 21, so that the cooling fluid is drawn into the piston cylinder 25 and cooled by the refrigerator 32.
Further, the cooling component comprises a pipeline 27, one end of the pipeline 27 is fixedly communicated with the lower surface of the piston cylinder 25, the other end of the pipeline 27 is fixedly communicated with the left side of the water bag 28, and under the action of the U-shaped piston rod 24, the cooling liquid in the piston cylinder 25 is driven to be pumped into the pipeline 27 and enter the water bag 28 to cool the target 6.
Further, the adaptive mechanism comprises two memory springs 31, the upper surface of the machine body 1 is fixedly connected with two sliding rods two 30, the surfaces of the two sliding rods two 30 are sleeved with the supporting plate 29 together, the upper ends of the two memory springs 31 are fixedly connected with the lower surface of the supporting plate 29, the lower ends of the two memory springs 31 are fixedly connected with the upper surface of the machine body 1, along with the continuous increase of sputtering power, the temperature in the sputtering box 2 rises, the memory springs 31 sense the rise of temperature and start to shrink, the supporting plate 29 is driven to move downwards through the shrinkage of the memory springs 31, through the downward movement of the supporting plate 29, in the moving process, the distance between the substrate and the sputtering target 6 is continuously increased, so that the strength when the high-strength ion source bombards the substrate is reduced, along with the gradual completion of sputtering, the temperature in the sputtering box 2 is gradually reduced, and the memory springs 31 are gradually extended to the initial length, the distance between the substrate and the sputtering target 6 is gradually increased, and the effect of automatically adapting and automatically adjusting the ion bombardment intensity can be realized.
Furthermore, the first through hole is matched with the piston rod 10, the second through hole is matched with the piston cylinder 25, the first through hole is matched with the piston rod 10, and the second through hole is matched with the piston cylinder 25, so that the whole mechanism is more stable in operation.
Further, a third rotating shaft 33 and a fourth rotating shaft 35 are rotatably connected to the inner wall of the sputtering box 2 in a fixed-axis manner, a first gear 34 is fixedly connected to the surface of the third rotating shaft 33, a second gear 36 and an incomplete gear 37 are fixedly connected to the surface of the fourth rotating shaft 35, a rack row 38 is fixedly connected to the upper surface of the support plate 29, the rack row 38 is meshed with the second gear 36, the first gear 34 is intermittently meshed with the incomplete gear 37, a third through hole is formed in the surface of the shielding cover 3, a fixing block 40 is fixedly connected to the inner wall of the third through hole, a sliding groove is formed in the surface of the fixing block 40, a sliding block 41 is slidably connected to the inner wall of the sliding groove, a fourth connecting rod 39 is hinged to the front surface of the first gear 34 and the front surface of the sliding block 41, a water bag extension 281 is communicated to the right side of the water bag 28, a lifting mechanism for lifting the water bag extension 281 is arranged at the upper end of the sliding block 41, and the rack row 38 is driven to move downwards through the downward movement of the support plate 29, the gear II 36 is driven to rotate by the downward movement of the rack row 38, the rotating shaft IV 35 is driven to rotate by the rotation of the gear II 36, the incomplete gear 37 is driven to rotate by the rotation of the rotating shaft IV 35, the gear I34 is driven to intermittently rotate by the rotation of the gear I34, the connecting rod IV 39 is driven to intermittently move, the sliding block 41 is driven to move in the sliding groove of the fixed block 40 to stop at the uppermost end of the stroke by the intermittent movement of the connecting rod IV 39, the stopping time is the process that the arc surface of the incomplete gear 37 rotates to the tooth surface, the sliding block 41 is driven to move downward by the continuous rotation of the incomplete gear 37, the cooling liquid in the water bag extension segment 281 is lifted by the process that the sliding block 41 stops at one end after moving upward, the cooling liquid in the water bag extension segment 281 is enabled to flow back to the water bag 28 under the action of the lifting mechanism, the cooling liquid in the water bag 28 is filled by the cooling liquid in the water bag extension segment 281, the wave is generated, so that the contact surface of the cooling liquid and the target 6 is more fully contacted, and the cooling effect is improved.
Further, raise the mechanism and include connecting rod five 42, the lower extreme of connecting rod five 42 and the last fixed surface of slider 41 are connected, and the upper end fixedly connected with butt block 43 of connecting rod five 42 through shifting up of slider 41, drives connecting rod five 42 and shifts up, through shifting up of connecting rod five 42, drives butt block 43 striking water pocket extension 281 to make it raise a take the altitude.
The working principle is as follows: when the magnetron sputtering table capable of self-adapting to the temperature of the target material is used, through physical impact of an ion source, the surface of the target material 6 is continuously heated, at the moment, along with the separation of the temperature and the heating of gas, high-temperature molecules contact the surface of the metal cylinder 71, then, by utilizing the principle that expansion liquid 8 expands with heat and contracts with cold to a hot gas source, the expansion liquid 8 begins to expand after being heated, the first piston 9 is driven to move upwards, the piston rod 10 is driven to move upwards through the upward movement of the piston rod 10, the rack row 11 is driven to move upwards, the gear 18 is driven to rotate clockwise through the upward movement of the rack row 11, the second rotating shaft 17 is driven to rotate through the rotation of the second rotating shaft 17, the third connecting rod 19 is driven to rotate clockwise, the first abutting block 22 is abutted through the rotation of the third connecting rod 19, the first abutting block 22 is driven to move downwards, and the first abutting block 22 moves downwards, the sleeve block 21 is driven to move downwards, the connecting rod III 19 is not abutted against the abutting block I22 through the continuous rotation of the rotating shaft II 17, at the moment, the sleeve block 21 is not subjected to any external force, namely, does not move, until the connecting rod III 19 rotates to the surface of the connecting rod I14, the connecting rod I14 is driven to rotate anticlockwise through the abutting against the surface of the connecting rod I14, the connecting rod II 15 is driven to rotate anticlockwise through the rotation of the connecting rod I14, the connecting rod II 15 is enabled to abut against the abutting block II 23 through the anticlockwise rotation of the connecting rod II 15, the sleeve block 21 is driven to move upwards through the abutting against the abutting block II 23, when the connecting rod III 19 rotates to be not abutted against the surface of the connecting rod I14, the connecting rod II 15 is driven to reset under the action of the spring 16, the abutting against the abutting block II 23 is not avoided, the sleeve block 21 can be driven to move upwards again within the dead time after moving downwards through the continuous rotation of the connecting rod III 19, through the movement of the sleeve block 21, under the action of the U-shaped piston rod 24, the cooling liquid in the piston cylinder 25 is driven to be pumped into the pipeline 27 and enter the water bag 28 to cool the target 6, the cooling liquid is enabled to be stagnated in the water bag 28 through the time that the sleeve block 21 moves to be stagnant below the first slide rod 20, the target 6 can be sufficiently cooled, the sleeve block 21 moves to be above the first slide rod 20, and the cooling liquid is pumped into the piston cylinder 25 and is cooled under the action of the refrigerator 32;
along with the continuous increase of sputtering power, the temperature in the sputtering box 2 rises, the memory spring 31 senses the rise of the temperature and starts to contract, the support plate 29 is driven to move downwards through the contraction of the memory spring 31, the distance between the substrate and the sputtering target 6 is continuously increased in the moving process, the force of the high-strength ion source for bombarding the substrate again is reduced, along with the gradual completion of sputtering, the temperature in the sputtering box 2 is gradually reduced, the memory spring 31 gradually extends to the initial length, the distance between the substrate and the sputtering target 6 is gradually increased, and the effect of automatically adapting to and automatically adjusting the ion bombardment strength can be realized;
the rack row 38 is driven to move downwards by the downward movement of the supporting plate 29, the gear second 36 is driven to rotate by the downward movement of the rack row 38, the rotating shaft fourth 35 is driven to rotate by the rotation of the gear second 36, the incomplete gear 37 is driven to rotate by the rotation of the rotating shaft fourth 35, the gear first 34 is driven to intermittently rotate by the rotation of the incomplete gear 37, the connecting rod fourth 39 is driven to intermittently move by the intermittent rotation of the gear first 34, the sliding block 41 is driven to move in the sliding groove of the fixed block 40 to the uppermost end of the stroke to be stopped by the intermittent movement of the connecting rod fourth 39, the stopping time is the process that the arc surface of the incomplete gear 37 rotates to the tooth surface, the sliding block 41 is driven to move downwards by the continuous rotation of the incomplete gear 37, the process that the sliding block 41 stops for one end time after moving upwards is used for driving the connecting rod fifth 42 to move upwards, and the connecting rod fifth 42 moves upwards, drive butt joint piece 43 butt water pocket extension 281, raise it to make the coolant liquid in the water pocket extension 281 be raised, make its backward flow to in the water pocket 28, the coolant liquid in the water pocket 28 can produce the wave because of the pouring into of coolant liquid in the water pocket extension 281, thereby makes coolant liquid and 6 contact surfaces of target more abundant contacts, improves refrigerated effect.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a but magnetron sputtering platform of self-adaptation target temperature, includes organism (1), its characterized in that: the upper surface of the machine body (1) is fixedly connected with a sputtering box (2), the inner wall of the sputtering box (2) is fixedly connected with a shielding cover (3), the inner wall of the sputtering box (2) is provided with a rotating motor (4), the inner wall of the shielding cover (3) is provided with a substrate (5), the surface of the substrate (5) is provided with a target (6), the interior of the machine body (1) is fixedly communicated with two vacuum suction pipes (7), opposite surfaces of the two vacuum suction pipes (7) are fixedly communicated with two sides of the sputtering box (2), the upper surface of the substrate (5) is fixedly connected with a metal cylinder (71), the inner wall of the metal cylinder (71) is slidably connected with a piston I (9), the interior of the metal cylinder (71) is provided with an expansion liquid (8), the upper surface of the metal cylinder (71) is provided with a through hole I, and the inner wall of the through hole I is slidably connected with a piston rod (10), the lower end of the piston rod (10) is fixedly connected with the upper surface of the first piston (9), the upper end of the piston rod (10) is fixedly connected with a rack bar (11), the upper surface of the sputtering box (2) is further provided with a cooling mechanism driven by the rack bar (11), the sputtering device further comprises an adaptive mechanism which is adaptive to the strength of an ion source in the sputtering box (2), the surface of the target (6) is fixedly connected with a water bag (28), and the sputtering device further comprises a reinforced cooling mechanism which is used for impacting the water bag (28) and is used for enabling cooling liquid in the water bag (28) to generate surging.
2. The magnetron sputtering table capable of self-adapting to the temperature of the target material according to claim 1, wherein: the upper surface of the sputtering box (2) is fixedly connected with a fixing plate (12), the front dead axle of the fixing plate (12) is rotatably connected with a first rotating shaft (13) and a second rotating shaft (17), the surface of the first rotating shaft (13) is fixedly connected with a second connecting rod (15), the surface of the second connecting rod (15) is fixedly connected with a first connecting rod (14), the surface of the first connecting rod (14) is fixedly connected with a spring (16), the end part of the spring (16) is fixedly connected with the front of the fixing plate (12), the surface of the second rotating shaft (17) is fixedly connected with a gear (18), the surface of the second rotating shaft (17) is fixedly connected with a third connecting rod (19), the gear (18) is meshed with the rack bar (11), the upper surface of the sputtering box (2) is fixedly connected with a piston cylinder (25), and the inner wall of the piston cylinder (25) is slidably connected with a second piston (26), the lower surface of the piston cylinder (25) is provided with a second through hole, the inner wall of the second through hole is connected with a U-shaped piston rod (24) in a sliding mode, one end of the U-shaped piston rod (24) is fixedly connected with the lower surface of the second piston (26), cooling liquid is filled in the piston cylinder (25), the surface of the piston cylinder (25) is fixedly connected with a refrigerator (32), the cooling device further comprises a cooling part used for cooling the surface of the target material (6), and the linkage mechanism is used for driving the second piston (26) to move.
3. The magnetron sputtering table capable of self-adapting to the temperature of the target material according to claim 2, wherein: the link gear includes butt joint piece one (22) and butt joint piece two (23), the last fixed surface of sputtering case (2) is connected with slide bar one (20), the surface sliding of slide bar one (20) is adjusted there is pocket piece (21), butt joint piece one (22) with the equal fixed connection of butt joint piece two (23) is in the left side of pocket piece (21), the other end of U type piston rod (24) with the fixed surface of pocket piece (21) is connected.
4. The magnetron sputtering table capable of self-adapting to the temperature of the target material according to claim 3, wherein: the cooling part comprises a pipeline (27), one end of the pipeline (27) is fixedly communicated with the lower surface of the piston cylinder (25), and the other end of the pipeline (27) is fixedly communicated with the left side of the water bag (28).
5. The magnetron sputtering station capable of self-adapting the temperature of the target according to any one of claims 2, 3 or 4, wherein: the adaptation mechanism comprises two memory springs (31), the upper surface of the machine body (1) is fixedly connected with two second sliding rods (30), the surfaces of the second sliding rods (30) are jointly sleeved with a supporting plate (29), the upper ends of the two memory springs (31) are fixedly connected with the lower surface of the supporting plate (29), and the lower ends of the two memory springs (31) are fixedly connected with the upper surface of the machine body (1).
6. The magnetron sputtering table capable of self-adapting to the temperature of the target material according to claim 2, wherein: the first through hole is matched with the piston rod (10), and the second through hole is matched with the piston cylinder (25).
7. The magnetron sputtering table capable of self-adapting to the temperature of the target material according to claim 1, wherein: the inner wall dead axle of sputter case (2) rotates and is connected with pivot three (33) and pivot four (35), the fixed surface of pivot three (33) is connected with gear one (34), the fixed surface of pivot four (35) is connected with gear two (36) and incomplete gear (37), the last fixed surface of backup pad (29) is connected with rack row (38), rack row (38) with gear two (36) mesh mutually, gear one (34) with incomplete gear (37) intermittent type nature meshing, through-hole three has been seted up on the surface of shield cover (3), the inner wall fixedly connected with fixed block (40) of through-hole three, the spout has been seted up on the surface of fixed block (40), the inner wall sliding connection of spout has slider (41), the front of slider (41) with the front of gear one (34) articulates jointly has connecting rod four (39), the right side of the water bag (28) is communicated with a water bag extension section (281), and the upper end of the sliding block (41) is provided with a lifting mechanism for lifting the water bag extension section (281).
8. The magnetron sputtering table capable of self-adapting to the temperature of the target material according to claim 7, wherein: the lifting mechanism comprises a connecting rod five (42), the lower end of the connecting rod five (42) is fixedly connected with the upper surface of the sliding block (41), and the upper end of the connecting rod five (42) is fixedly connected with a butting block (43).
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114214598A (en) * | 2021-12-23 | 2022-03-22 | 江苏籽硕科技有限公司 | Ion beam sputtering deposition equipment with high film preparation uniformity |
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| CN110983271A (en) * | 2019-12-10 | 2020-04-10 | 王涛 | Magnetron sputtering platform |
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| US4414086A (en) * | 1982-11-05 | 1983-11-08 | Varian Associates, Inc. | Magnetic targets for use in sputter coating apparatus |
| US5171415A (en) * | 1990-12-21 | 1992-12-15 | Novellus Systems, Inc. | Cooling method and apparatus for magnetron sputtering |
| US6402912B1 (en) * | 2000-11-09 | 2002-06-11 | Honeywell International Inc. | Sputtering target assembly |
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