CN113601600A - Convenient collecting device of semiconductor waste material - Google Patents
Convenient collecting device of semiconductor waste material Download PDFInfo
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- CN113601600A CN113601600A CN202110898915.9A CN202110898915A CN113601600A CN 113601600 A CN113601600 A CN 113601600A CN 202110898915 A CN202110898915 A CN 202110898915A CN 113601600 A CN113601600 A CN 113601600A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
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Abstract
The invention relates to convenient waste collecting equipment, in particular to convenient semiconductor waste collecting equipment. The technical problem to be solved is as follows: the semiconductor waste convenient collecting equipment is convenient to collect and high in collecting efficiency. The technical scheme of the invention is as follows: the utility model provides a convenient collecting device of semiconductor waste material, includes base, slewing mechanism, pushing equipment, bracing piece and places the pole, is equipped with slewing mechanism on the base, is equipped with pushing equipment on the slewing mechanism part, and the base both sides equal symmetry is equipped with the bracing piece, is equipped with between bracing piece one side and places the pole. According to the semiconductor waste bag, the semiconductor waste collected by the bag can be prevented from being too loose, so that the internal space of the bag is prevented from being wasted through the matching of the rotating mechanism, the quantitative assembly and the knocking assembly.
Description
Technical Field
The invention relates to convenient waste collecting equipment, in particular to convenient semiconductor waste collecting equipment.
Background
The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors are widely used in the fields of consumer electronics, communication systems, medical instruments, and the like. For example, a diode is a device manufactured by using a semiconductor, in a production process, after plastic encapsulation, the periphery of the semiconductor needs to be cut and shaped to meet use requirements according to needs, and waste materials after cutting generally contain plastic components and part of metal scraps. The semiconductor waste material after the cutting is generally cleaned by the help of cleaning tools in the later stage of people, and is put into the bag little by the help of the shovel for collection, so the collection is more tedious, and the collection efficiency is lower.
Therefore, a semiconductor waste collecting device which is convenient to collect and high in collecting efficiency needs to be developed.
Disclosure of Invention
In order to overcome the defects that people collect by means of a shovel, the collection is more complicated and the collection efficiency is lower, the technical problems to be solved are as follows: the semiconductor waste convenient collecting equipment is convenient to collect and high in collecting efficiency.
The technical scheme of the invention is as follows: a semiconductor waste convenient collecting device comprises:
the base is provided with the rotating mechanism, the rotating mechanism parts are provided with the pushing mechanism, the two sides of the base are symmetrically provided with the supporting rods, and the placing rod is arranged between one sides of the supporting rods.
According to a preferred technical scheme, the rotating mechanism comprises a shell, a fixing rod, a motor, a spiral rod and a discharging groove, the shell is arranged on the base, a discharging hole is formed in one side of the shell, the fixing rod is arranged on one side of the shell, the motor is arranged on the fixing rod, the spiral rod is connected to an output shaft of the motor in a rotating mode and is connected with one side of the base, the spiral rod is located on one side of the shell, and the discharging groove is formed in the shell.
As a preferable technical scheme of the invention, the material pushing mechanism comprises a first guide rod, a first spring, a first baffle, a second spring, a push plate, a special-shaped block and a third spring, wherein the first guide rod is arranged on one side of the shell and connected with one side of the base, the first baffle is arranged on one side of the shell in a sliding manner, the second spring is symmetrically arranged on the first baffle, the push plate is arranged on one side of the first guide rod in a sliding manner and positioned on one side of the shell, the push plate is connected with the shell in a sliding manner, the first spring is connected between the push plate and one side of the first guide rod, the special-shaped block is arranged on the push plate in a sliding manner and contacted with the spiral rod, and the third spring is connected between one side of the special-shaped block and the push plate.
The invention also comprises a switch assembly, wherein the switch assembly comprises a rotating handle, a first rotating shaft, a first gear, a second baffle, a fixed plate, a first rack, a second rack, a first torsion spring and a second gear, the fixed plate is arranged on one side of the blanking groove, the rotating handle is rotatably connected to the fixed plate, the second gear is arranged on the rotating handle, the first torsion spring is connected between the second gear and one side of the fixed plate, the first rotating shaft is symmetrically and rotatably arranged on the fixed plate, the first gear is arranged on each first rotating shaft, the second baffle is connected to each first rotating shaft, the first rack is slidably arranged on one side of the fixed plate, the first rack is matched with the first gear on one side of the second gear and the first gear on one side of the fixed plate, the second rack is slidably arranged on one side of the fixed plate, and the second rack is matched with the first gear on one side of the second gear and the first gear on one side of the fixed plate.
As a preferable technical scheme, the quantitative measuring device further comprises a quantitative component, wherein the quantitative component comprises a placing plate, a second guide rod, a fourth spring, a first sliding rod, a third guide rod and a fifth spring, the second guide rod is symmetrically arranged on two sides of the base, the placing plate is slidably arranged between one sides of the second guide rods, the fourth spring is symmetrically arranged on two sides of the placing plate, the fourth spring is connected with the base, the third guide rod is symmetrically arranged on the shell, the first sliding rod is slidably arranged between the third guide rods, one side of the placing plate is matched with the first sliding rod, the first sliding rod is matched with the special-shaped block, the fifth spring is symmetrically arranged on the first sliding rod, and one side of the fifth spring is connected with the shell.
As a preferable technical scheme, the spring type spring power transmission device further comprises a knocking component, the knocking component comprises a first belt pulley, a second rotating shaft, a second belt, a fourth guide rod, a sliding plate, sixth springs and a cam, the second rotating shaft is rotatably arranged on one side of the base, the first belt pulley is arranged on the second rotating shaft and the spiral rod, the second belt is wound between the first belt pulleys, the fourth guide rod is symmetrically arranged on the base, the sliding plate is slidably connected between one sides of the fourth guide rods, the two sixth springs are connected between one sides of the sliding plate and the base, and the cam is arranged on the second rotating shaft.
As a preferable technical scheme, the novel LED lamp further comprises a buckle assembly, the buckle assembly comprises a second sliding rod, a fifth guide rod and a seventh spring, the fifth guide rod is arranged on the shell, the second sliding rod is movably arranged on the fifth guide rod, the seventh spring is connected between one side of the second sliding rod and the shell, the second sliding rod is matched with the second baffle on one side, and one side of the second sliding rod is matched with the first sliding rod.
As a preferred technical scheme, the device also comprises a clamping assembly, wherein the clamping assembly comprises fixed blocks, clamping blocks and second torsion springs, the fixed blocks are symmetrically arranged on two sides of the placing rod, the clamping blocks are rotatably arranged on the fixed blocks, and the second torsion springs are connected between two sides of the clamping blocks and the placing rod.
Has the advantages that: 1. according to the semiconductor waste bag, the semiconductor waste collected by the bag can be prevented from being too loose, so that the internal space of the bag is prevented from being wasted through the matching of the rotating mechanism, the quantitative assembly and the knocking assembly.
2. Through the cooperation between switch module, ration subassembly and the buckle subassembly for people need not manual control switch module, so alright save people's time.
3. Through being equipped with clamping component for the sack can prevent that the sack from droing when collecting the waste material.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic perspective view of the lifting mechanism of the present invention.
Fig. 3 is a schematic perspective view of the fastening mechanism of the present invention.
Fig. 4 is an enlarged perspective view of the present invention a.
Fig. 5 is a schematic partial perspective view of the fastening mechanism of the present invention.
Fig. 6 is a schematic perspective view of the switch assembly of the present invention.
Fig. 7 is an enlarged perspective view of the present invention B.
Fig. 8 is a schematic perspective view of a dosing assembly according to the present invention.
FIG. 9 is a perspective view of the knocking assembly according to the present invention.
Fig. 10 is a schematic perspective view of the buckle assembly of the present invention.
Fig. 11 is a perspective view of the clamping assembly of the present invention.
Labeled as: 1-base, 2-rotating mechanism, 21-shell, 22-fixed bar, 23-motor, 24-screw bar, 25-blanking groove, 3-pushing mechanism, 31-first guide bar, 32-first spring, 33-first baffle, 34-second spring, 35-push plate, 36-special-shaped block, 37-third spring, 4-support bar, 5-placing bar, 6-switch component, 61-rotating handle, 62-first rotating shaft, 63-first gear, 64-second baffle, 65-fixed plate, 66-first rack, 67-second rack, 68-first torsion spring, 69-second gear, 7-quantifying component, 71-placing plate, 72-second guide bar, 73-fourth spring, 74-first sliding bar, 75-third guide bar, 76-fifth spring, 8-knocking component, 81-first belt pulley, 82-second rotating shaft, 83-second belt, 84-fourth guide bar, 85-sliding plate, 86-sixth spring, 87-cam, 9-buckle component, 91-second sliding bar, 92-fifth guide bar, 93-seventh spring, 10-clamping component, 101-fixed block, 102-clamping block, and 103-second torsion spring.
Detailed Description
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Example 1
The utility model provides a convenient collecting device of semiconductor waste material, as shown in figure 1, figure 2, figure 3, figure 4 and figure 5, including base 1, slewing mechanism 2, pushing equipment 3, bracing piece 4 and place pole 5, the base 1 top is equipped with slewing mechanism 2, is equipped with pushing equipment 3 on the slewing mechanism 2 part, and the left and right sides of base 1 top front side all front and back symmetry is equipped with bracing piece 4, is equipped with between 4 upper portions of bracing piece and places pole 5.
The pushing mechanism 3 comprises a first guide rod 31, a first spring 32, a first baffle 33, a second spring 34, a pushing plate 35, a special-shaped block 36 and a third spring 37, the first guide rod 31 is arranged on the left rear side of the shell 21, the bottom of the first guide rod 31 is connected with the left front side of the base 1, the first baffle 33 is arranged on the rear lower side inside the shell 21 in a sliding manner, the second spring 34 is arranged on the bottom of the first baffle 33 in a bilateral symmetry manner, the pushing plate 35 is arranged on the lower side of the first guide rod 31 in a sliding manner, the pushing plate 35 is located inside the shell 21, the pushing plate 35 is connected with the shell 21 in a sliding manner, the first spring 32 is connected between the rear side of the top of the pushing plate 35 and the upper portion of the first guide rod 31, the special-shaped block 36 is arranged on the inner side of the left lower side of the pushing plate 35 in a sliding manner, the special-shaped block 36 is in contact with the screw rod 24, and the third spring 37 is connected between the rear side of the special-shaped block 36 and the pushing plate 35.
When people need to collect semiconductor waste, the equipment can be used, people sleeve the bag on the placing rod 5, then clamp the bag tightly by the aid of the clamp to prevent the bag from falling off, then pour the semiconductor waste into the shell 21 from the feed opening to enable the semiconductor waste mixed with the semiconductor to fall onto the push plate 35, start the motor 23, drive the screw rod 24 to rotate by the output shaft of the motor 23, drive the special-shaped block 36 and the push plate 35 to move upwards by the rotation of the screw rod 24, at the moment, the first spring 32 is compressed, the push plate 35 drives the semiconductor waste to move upwards, at the moment, the second spring 34 in an initial state stretches to drive the first baffle 33 to move upwards to block the feed opening and prevent the semiconductor waste from continuously falling down, after the push plate 35 drives the semiconductor waste to move upwards to be incapable of continuously moving, the semiconductor waste on the push plate 35 slides into the feed opening 25, and the semiconductor waste falls into the bag from the feed opening 25, after the semiconductor waste material on push pedal 35 totally landing to the feed chute 25 in, simultaneously, first spring 32 resets, drive push pedal 35 and heterotypic piece 36 and reset, push pedal 35 down move to with first baffle 33 contact, it resets to drive first baffle 33 down to move, drive second spring 34 and reset, make the semiconductor waste material continue down landing to push pedal 35 on, repeat this action, so alright reduce the manpower, need not alone to hold up the sack, alone pour the semiconductor waste material toward in the sack, semiconductor waste material collection finishes, close motor 23.
Example 2
On the basis of embodiment 1, as shown in fig. 1, 6, 7, 8, 9, 10 and 11, the present invention further includes a switch assembly 6, the switch assembly 6 includes a rotating handle 61, a first rotating shaft 62, a first gear 63, a second baffle 64, a fixed plate 65, a first rack 66, a second rack 67, a first torsion spring 68 and a second gear 69, the fixed plate 65 is disposed at the rear side of the bottom of the lower trough 25, the rotating handle 61 is rotatably connected to the middle of the fixed plate 65, the second gear 69 is disposed at the middle of the rotating handle 61, the first torsion spring 68 is connected between the bottom of the second gear 69 and the fixed plate 65, the first rotating shaft 62 is rotatably disposed at the front side inside the fixed plate 65, the first gear 63 is disposed at the lower side of the first rotating shaft 62, the second baffle 64 is connected to the upper portion of the first rotating shaft 62, the first rack 66 is slidably disposed at the right side inside the fixed plate 65, the first rack 66 is engaged with the first gear 63 at the rear side and the right side of the second gear 69, the fixed plate 65 is internally provided with a second rack 67 on the front side in a sliding manner, the second rack 67 being engaged with the first gear 63 on the front side and left side of the second gear 69.
When the semiconductor waste material slides into the blanking groove 25 through the push plate 35, the rotating handle 61 is manually rotated by people, the rotating handle 61 drives the second gear 69 to rotate, at the moment, the first torsion spring 68 deforms, the second gear 69 rotates to drive the first rack 66 and the second rack 67 to move, and further drive the first gear 63 to rotate, the first gear 63 drives the first rotating shaft 62 to rotate, and further drives the second baffle 64 to rotate, so that the second baffle 64 no longer blocks the bottom of the blanking groove 25, the semiconductor waste material in the blanking groove 25 falls down into the bag, when a certain amount of semiconductor waste material is loaded into the bag, the people release the rotating handle 61, at the moment, the first torsion spring 68 resets to drive the rotating handle 61 and the second gear 69 to reversely reset, the second gear 69 drives the first rack 66 and the second rack 67 to reset, and further drive the first gear 63, the first rotating shaft 62 and the second baffle 64 to reversely reset, thus, people can control the amount of the semiconductor falling down according to the residual space in the bag.
The quantitative component 7 is further included, the quantitative component 7 comprises a placing plate 71, a second guide rod 72, a fourth spring 73, a first sliding rod 74, a third guide rod 75 and a fifth spring 76, the second guide rod 72 is symmetrically arranged on the front and back of the left and right sides of the front side of the top of the base 1, the placing plate 71 is slidably arranged between the upper portions of the second guide rods 72, the fourth spring 73 is symmetrically arranged on the front and back of the left and right sides of the bottom of the placing plate 71, the bottom of the fourth spring 73 is connected with the base 1, the third guide rod 75 is symmetrically arranged on the upper and lower sides of the left front side of the shell 21, the first sliding rod 74 is slidably arranged between the third guide rods 75, the left back side of the placing plate 71 is matched with the first sliding rod 74, the first sliding rod 74 is matched with the special-shaped block 36, the fifth spring 76 is symmetrically arranged on the upper and lower side of the right side of the first sliding rod 74, and the right side of the fifth spring 76 is connected with the shell 21.
People sleeve the bag on the placing rod 5, the bottom of the bag is positioned at the top of the placing plate 71, the screw rod 24 rotates to drive the special-shaped block 36 to move upwards, the push plate 35 and the semiconductor waste are driven to move upwards, the waste enters the blanking groove 25 and then enters the bag through the blanking groove 25, when the semiconductor waste in the bag is more and more, the placing plate 71 slowly moves downwards, the fourth spring 73 is compressed, the placing plate 71 moves downwards to drive the first sliding rod 74 to move towards the right side, the fifth spring 76 is compressed, the first sliding rod 74 moves towards the right side to drive the special-shaped block 36 to move towards the right side, the third spring 37 is compressed, the special-shaped block 36 is separated from the screw rod 24, the special-shaped block 36 moves downwards to reset at the moment, the push plate 35 is driven to move downwards to reset, the push plate 35 drives the semiconductor waste to move downwards to reset, and thus, the excessive collection of the semiconductor waste in the bag can be prevented, the bag mouth cannot be folded, people take the bag filled with the semiconductor waste, the fourth spring 73 resets at the moment, the placing plate 71 is driven to reset, the placing plate 71 is separated from the first sliding rod 74, the fifth spring 76 resets at the moment, the first sliding rod 74 is driven to reset, the first sliding rod 74 is separated from the special-shaped block 36, the third spring 37 resets at the moment, the special-shaped block 36 is driven to reset, and the special-shaped block 36 is enabled to be in contact with the spiral rod 24 again.
Still including knocking subassembly 8, it is including first belt pulley 81 to knock subassembly 8, second axis of rotation 82, the second belt 83, fourth guide arm 84, sliding plate 85, sixth spring 86 and cam 87, base 1 top left side front side is rotated and is equipped with second axis of rotation 82, second axis of rotation 82 middle part and hob 24 lower part all are equipped with first belt pulley 81, around having connect second belt 83 between the first belt pulley 81, base 1 inside left side front and back symmetry is equipped with fourth guide arm 84, sliding connection has sliding plate 85 between the fourth guide arm 84 right side, be connected with two sixth spring 86 between sliding plate 85 downside and the base 1, second axis of rotation 82 upper portion is equipped with cam 87.
When the screw rod 24 rotates, drive first belt pulley 81 and second belt 83 and rotate, and then drive second axis of rotation 82 and rotate, second axis of rotation 82 drives cam 87 and rotates, when cam 87 rotates to contact with sliding plate 85, drive sliding plate 85 and move to the left, sixth spring 86 is compressed this moment, when cam 87 rotates to separate with sliding plate 85, sixth spring 86 resets this moment, drive sliding plate 85 resets, repeat this action, make sliding plate 85 strike constantly and place board 71, strike the vibrations that place board 71 produced and drive the sack and shake, so, alright prevent that the semiconductor waste material that the sack was collected is too loose, lead to the sack inner space to be wasted.
Still including buckle assembly 9, buckle assembly 9 is including second slide bar 91, fifth guide arm 92 and seventh spring 93, and shell 21 left front side upper portion is equipped with fifth guide arm 92, and the movable second slide bar 91 that is equipped with on the fifth guide arm 92, is connected with seventh spring 93 between second slide bar 91 right rear side and the shell 21, and second slide bar 91 front side and left second baffle 64 cooperation, second slide bar 91 rear side and first slide bar 74 cooperation.
When the left second baffle plate 64 rotates to contact with the second sliding rod 91, the left second baffle plate 64 drives the second sliding rod 91 to rotate, at this time, the seventh spring 93 deforms, when the left second baffle 64 rotates to be separated from the second sliding rod 91, the seventh spring 93 is reset at the moment, drives the second sliding rod 91 to reset, so that the second sliding rod 91 blocks the left second baffle 64, when the first sliding rod 74 moves to the right, the first sliding rod 74 drives the second sliding rod 91 to move to the right, at this time, the seventh spring 93 is compressed, so that the second sliding rod 91 does not block the left second baffle plate 64 any more, the left second baffle plate 64 and the parts above reset to block the blanking groove 25, thus people do not need to control the left second baffle plate 64 and the parts above manually, when the first sliding rod 74 is reset, the seventh spring 93 is reset at this time, and drives the second sliding rod 91 to reset.
Still including clamping component 10, clamping component 10 is equipped with fixed block 101 including fixed block 101, clamp splice 102 and second torsion spring 103, places the pole 5 left and right sides symmetry, and the inside equal rotary type of fixed block 101 is equipped with clamp splice 102, clamp splice 102 around both sides all with place and be connected with second torsion spring 103 between the pole 5.
People open clamp splice 102 manually, and second torsion spring 103 takes place deformation this moment, and people put the sack on placing pole 5, loosen clamp splice 102, and second torsion spring 103 resets, drives clamp splice 102 and resets for clamp splice 102 cliies the sack, prevents that the sack from droing when collecting semiconductor waste material.
While the disclosure has been described with respect to a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that various other embodiments can be devised which do not depart from the scope of the invention as disclosed herein. Accordingly, the scope of the invention should be limited only by the attached claims.
Claims (8)
1. The utility model provides a convenient collecting device of semiconductor waste material, its characterized in that, including base (1), slewing mechanism (2), pushing equipment (3), bracing piece (4) and place pole (5), be equipped with slewing mechanism (2) on base (1), be equipped with pushing equipment (3) on slewing mechanism (2) part, base (1) both sides all symmetry is equipped with bracing piece (4), is connected with between bracing piece (4) one end of keeping away from base (1) one side and places pole (5).
2. The convenient semiconductor waste collecting device according to claim 1, wherein the rotating mechanism (2) comprises a housing (21), a fixing rod (22), a motor (23), a screw rod (24) and a discharging groove (25), the housing (21) is arranged on the base (1), a discharging opening is formed in one side of the housing (21), the fixing rod (22) is arranged on the side wall of the housing (21), the motor (23) is arranged on the fixing rod (22), the screw rod (24) is rotatably connected to the base (1) close to one side of the housing (21), an output shaft of the motor (23) is connected with the screw rod (24) through a coupling, and the discharging groove (25) is formed in the housing (21).
3. The semiconductor waste convenient collection device according to claim 2, wherein the pushing mechanism (3) comprises a first guide rod (31), a first spring (32), a first baffle (33), a second spring (34), a push plate (35), a special-shaped block (36) and a third spring (37), the first guide rod (31) is connected between the side wall of the housing (21) and the top of the base (1), the first baffle (33) is slidably arranged on the inner wall of the housing (21), the second spring (34) is connected between both sides of the bottom of the first baffle (33) and both sides of the top of the base (1), the push plate (35) is slidably arranged on the first guide rod (31) near one side of the base (1), the push plate (35) is located inside the housing (21), the push plate (35) is slidably connected with the housing (21), the first spring (32) is connected between one side of the push plate (35) and the first guide rod (31) near one side of the fixing rod (22), the push plate (35) is provided with a special-shaped block (36) in a sliding mode, the special-shaped block (36) is in contact with the screw rod (24), and a third spring (37) is connected between one side of the special-shaped block (36) and the push plate (35).
4. The semiconductor waste convenient collection device according to claim 3, further comprising a switch assembly (6), wherein the switch assembly (6) comprises a rotating handle (61), a first rotating shaft (62), a first gear (63), a second baffle (64), a fixing plate (65), a first rack (66), a second rack (67), a first torsion spring (68) and a second gear (69), the fixing plate (65) is arranged at one side of the bottom of the discharging groove (25) close to the shell (21), the rotating handle (61) is rotatably connected to the fixing plate (65), the second gear (69) is arranged on the rotating handle (61), the first torsion spring (68) is connected between one side of the second gear (69) and the fixing plate (65) far away from one side of the discharging groove (25), the first rotating shaft (62) is symmetrically and rotatably arranged between one side of the fixing plate (65) far away from the shell (21) and the bottom of the discharging groove (25) close to the shell (21), keep away from first axis of rotation (62) one side of unloading groove (25) and all be equipped with first gear (63), be close to first axis of rotation (62) one side of unloading groove (25) and all be connected with second baffle (64), the one side slidingtype that is close to shell (21) on fixed plate (65) is equipped with first rack (66), the one side slidingtype of keeping away from shell (21) on fixed plate (65) is equipped with second rack (67).
5. The semiconductor waste convenient collection device according to claim 4, further comprising a quantitative assembly (7), wherein the quantitative assembly (7) comprises a placing plate (71), a second guide rod (72), a fourth spring (73), a first sliding rod (74), a third guide rod (75) and a fifth spring (76), the second guide rod (72) is symmetrically arranged on both sides of the top of the base (1) close to the side wall of the housing (21), the placing plate (71) is slidably arranged between the sides of the second guide rod (72) far away from the base (1), the fourth spring (73) is symmetrically arranged between both sides of the bottom of the placing plate (71) and the top of the base (1), the third guide rod (75) is symmetrically arranged on the side wall of the housing (21), the first sliding rod (74) is slidably arranged between the third guide rods (75) far away from one side of the housing (21), one side of the placing plate (71) close to the housing (21) is matched with one side of the first sliding rod (74) close to the base (1), one side of the first sliding rod (74) close to the base (1) is matched with one side of the special-shaped block (36) far away from the screw rod (24), and fifth springs (76) are symmetrically arranged between one side of the first sliding rod (74) and the side wall of the shell (21).
6. The semiconductor waste convenient collecting device according to claim 5, further comprising a knocking component (8), wherein the knocking component (8) comprises a first belt pulley (81), a second rotating shaft (82), a second belt (83), a fourth guide rod (84), a sliding plate (85), a sixth spring (86) and a cam (87), the second rotating shaft (82) is rotatably arranged on one side of the top of the base (1), the first belt pulleys (81) are respectively arranged on one side of the second rotating shaft (82) and one side of the spiral rod (24) close to the base (1), the second belt (83) is wound between the two first belt pulleys (81), the fourth guide rod (84) is symmetrically arranged on one side of the inside of the base (1) close to the second rotating shaft (82), the sliding plate (85) is slidably connected between one side of the fourth guide rod (84) close to the second rotating shaft (82), two sixth springs (86) are connected between one side of the sliding plate (85) and the base (1), and a cam (87) is arranged on one side, far away from the base (1), of the second rotating shaft (82).
7. The convenient semiconductor waste collecting device according to claim 6, further comprising a buckle assembly (9), wherein the buckle assembly (9) comprises a second sliding rod (91), a fifth guide rod (92) and a seventh spring (93), the side wall of the housing (21) is provided with the fifth guide rod (92), the fifth guide rod (92) is movably provided with the second sliding rod (91), the seventh spring (93) is connected between one side of the second sliding rod (91) and the side wall of the housing (21), one side of the second sliding rod (91) is matched with the adjacent second baffle (64), and one side of the second sliding rod (91) is matched with one side of the first sliding rod (74).
8. The convenient semiconductor waste collecting device according to claim 7, further comprising a clamping assembly (10), wherein the clamping assembly (10) comprises a fixing block (101), clamping blocks (102) and second torsion springs (103), the fixing block (101) is symmetrically arranged on two sides of the outer portion of the placing rod (5), the clamping blocks (102) are rotatably arranged on the fixing block (101), and the second torsion springs (103) are connected between two sides of the clamping blocks (102) and the placing rod (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110898915.9A CN113601600A (en) | 2021-08-06 | 2021-08-06 | Convenient collecting device of semiconductor waste material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110898915.9A CN113601600A (en) | 2021-08-06 | 2021-08-06 | Convenient collecting device of semiconductor waste material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113601600A true CN113601600A (en) | 2021-11-05 |
Family
ID=78307289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110898915.9A Withdrawn CN113601600A (en) | 2021-08-06 | 2021-08-06 | Convenient collecting device of semiconductor waste material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113601600A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114438695A (en) * | 2022-01-20 | 2022-05-06 | 刘则隆 | Fiber quilt surface pompon clean-up equipment |
| CN114438695B (en) * | 2022-01-20 | 2024-06-04 | 南京诺葳尔环保科技有限公司 | Fiber quilt surface hair bulb cleaning equipment |
-
2021
- 2021-08-06 CN CN202110898915.9A patent/CN113601600A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114438695A (en) * | 2022-01-20 | 2022-05-06 | 刘则隆 | Fiber quilt surface pompon clean-up equipment |
| CN114438695B (en) * | 2022-01-20 | 2024-06-04 | 南京诺葳尔环保科技有限公司 | Fiber quilt surface hair bulb cleaning equipment |
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Application publication date: 20211105 |