CN113601314A - Wafer disc rounding device for chip - Google Patents

Wafer disc rounding device for chip Download PDF

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Publication number
CN113601314A
CN113601314A CN202110939117.6A CN202110939117A CN113601314A CN 113601314 A CN113601314 A CN 113601314A CN 202110939117 A CN202110939117 A CN 202110939117A CN 113601314 A CN113601314 A CN 113601314A
Authority
CN
China
Prior art keywords
pushing
plate
driving
rotating
transverse moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202110939117.6A
Other languages
Chinese (zh)
Inventor
李健儿
李学良
冯永
马晓洁
唐毅
敬毅
谢雷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan Hongxinwei Technology Co ltd
Original Assignee
Sichuan Hongxinwei Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan Hongxinwei Technology Co ltd filed Critical Sichuan Hongxinwei Technology Co ltd
Priority to CN202110939117.6A priority Critical patent/CN113601314A/en
Publication of CN113601314A publication Critical patent/CN113601314A/en
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Abstract

A wafer disk rounding device for chips, comprising: the control cabinet comprises a cabinet body, wherein the lower end of the cabinet body is provided with a pair of adjusting components, and the adjusting components are used for supporting the lower end of the cabinet body and adjusting the balance degree; the transfer assembly is arranged at one end of the control cabinet and comprises a transverse moving mechanism, the transverse moving mechanism is provided with a front pushing mechanism, the front pushing mechanism is provided with a lifting mechanism, the lifting mechanism is provided with a rotating mechanism, the rotating mechanism is provided with a suction clamping mechanism, and the placement assembly is arranged on the control cabinet; and the rounding unit is arranged at the other end of the control cabinet and comprises a pair of clamping components, and a rounding mechanism is arranged between the clamping components. The wafer disc grinding device is convenient for wafer disc grinding operation during wafer disc machining, is convenient for stable and accurate wafer disc transfer during the wafer disc grinding operation, is convenient for wafer disc clamping, is convenient for driving the wafer disc to rotate, obviously improves the wafer disc grinding automation degree, improves the wafer disc grinding efficiency and the wafer disc grinding quality, and has strong practicability.

Description

Wafer disc rounding device for chip
Technical Field
The invention relates to the technical field related to semiconductor chip processing, in particular to a wafer disc rounding device for chips.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon.
A generally common silicon wafer production process includes: silicon extraction and purification, monocrystalline silicon growth and wafer forming, wherein the silicon purification is a first procedure, the sand and stone raw material is put into an electric arc furnace with a carbon source and the temperature of more than two thousand ℃, reduction reaction is carried out at high temperature to obtain metallurgical-grade silicon, then the crushed metallurgical-grade silicon is reacted with gaseous hydrogen chloride to generate liquid silane, and then high-purity polycrystalline silicon is obtained through distillation and chemical reduction processes. Generally used is the czochralski method, in which high purity polycrystalline silicon is placed in a quartz crucible and heated continuously with an externally surrounding graphite heater, maintained at a temperature of about one thousand or more degrees celsius, the atmosphere in the furnace being typically an inert gas to melt the polycrystalline silicon without undesirable chemical reactions. To form single crystal silicon, it is also necessary to control the orientation of the crystal, the crucible being rotated with the polysilicon melt, a seed crystal being immersed therein, and the seed crystal being carried by the pull rod in a counter-rotation while being slowly and vertically pulled upwardly from the silicon melt. The molten polysilicon adheres to the bottom end of the seed crystal and grows continuously in the direction of the seed crystal lattice arrangement. After the crystal growth by the Czochralski method, the single crystal rod is cut according to a proper size, then ground, polished by a chemical mechanical polishing process, and subjected to rounding operation on the outer arc wall of the wafer disc in order to facilitate later-stage processing, thinning and film coating operations, and the wafer disc can be conveniently processed or positioned during chip processing through the rounding operation of the wafer disc.
Present wafer disc is in carrying out the rounding operation, there is the lower operation of degree of automation comparatively more extensive, the concrete expression carries out the transfer of wafer disc for adding man-made mode that shifts, present rounding device causes the rounding quality relatively poor owing to the instability of dress individual device at the rounding in-process simultaneously, inconvenient centre gripping that carries out the wafer disc and drive the wafer disc rotation at the rounding in-process simultaneously, and the mode of horizontal rounding is adopted mostly to current rounding device, this kind of mode is because the wafer disc is placed for the formula of lying, thereby cause the influence to the terminal surface of wafer disc easily when rotating, the quality of wafer disc has been reduced.
Disclosure of Invention
The invention provides a wafer disc rounding device for chips, which is used for solving the defects of the prior art, and is convenient for carrying out the rounding operation of a wafer disc when the wafer disc is processed, the wafer disc is convenient to stably and accurately transfer in the rounding operation, the wafer disc is convenient to clamp and conveniently drives the wafer disc to rotate, the automation degree of the wafer disc rounding is obviously improved, the wafer disc rounding efficiency is improved, the wafer disc rounding quality is improved, and the wafer disc rounding device has strong practicability.
In order to achieve the purpose of the invention, the following technology is adopted:
a wafer disk rounding device for chips, comprising:
the control cabinet comprises a cabinet body, wherein the lower end of the cabinet body is provided with a pair of adjusting components, and the adjusting components are used for supporting the lower end of the cabinet body and adjusting the balance degree;
the transfer assembly is arranged at one end of the control cabinet and comprises a transverse moving mechanism, the transverse moving mechanism is provided with a front pushing mechanism, the front pushing mechanism is provided with a lifting mechanism, the lifting mechanism is provided with a rotating mechanism, the rotating mechanism is provided with a suction clamping mechanism, the moving direction of the transverse moving mechanism is parallel to the width direction of the control cabinet, the transverse moving mechanism is used for driving the front pushing mechanism to move along the moving direction of the front pushing mechanism, the moving direction of the front pushing mechanism is parallel to the length direction of the control cabinet, the front pushing mechanism is used for adjusting the distance between the lifting mechanism and the transverse moving mechanism, the lifting mechanism is used for adjusting the height of the rotating mechanism, and the rotating mechanism is used for driving the suction clamping mechanism to rotate so as to adjust the posture of clamping a wafer by the suction clamping mechanism;
the placing component is arranged on the control cabinet;
the rounding unit is arranged at the other end of the control cabinet and comprises a pair of clamping components, a rounding mechanism is arranged between the clamping components, and the clamping components are used for clamping the wafer disc and driving the wafer disc to rotate so as to enable the rounding mechanism to grind and polish the arc wall of the wafer disc;
the transfer assembly is used for transferring the wafer disks so as to enable the wafer disks to move from the placing assembly to the rounding unit, the placing assembly is used for placing a plurality of wafer disks, and the rounding unit is used for grinding and polishing the arc walls of the wafer disks.
Furthermore, the cabinet body comprises a box body, opening and closing doors are hinged to two opposite sides of the box body, the opening and closing doors are provided with handles, and a flat plate is arranged at the upper end of the box body;
the adjusting part is including installing in the outer mechanism that props of box lower extreme, and outer mechanism that props all is equipped with a pair of slip component, and the both ends that prop the mechanism outward all are equipped with the end and transfer the mechanism, and the end transfer all is equipped with adjustment mechanism, props the interval that the mechanism is used for adjusting between adjustment mechanism and the box outward, and the end is transferred the mechanism and is used for adjusting the interval between the adjustment mechanism, and adjustment mechanism is used for the regulation of box equilibrium degree.
Furthermore, the outer supporting mechanism comprises a pair of lower extending seats arranged at the lower end of the box body, outer extending rods penetrate through the lower extending seats, inner fixing plates are arranged at the inner side ends of the outer extending rods, outer supporting inner plates are arranged on the inner fixing plates, rotating seats are arranged at the middle positions of the outer supporting inner plates, outer supporting lead screws are arranged on the rotating seats, outer supporting adjusting seats are arranged on the outer supporting lead screws, the outer supporting adjusting seats are arranged at the lower end of the box body and located between the lower extending seats, first rotating caps are arranged at the outer side ends of the outer supporting lead screws, and outer fixing plates are arranged at the outer side ends of the outer extending rods;
the sliding component comprises a sliding rotary seat arranged at the lower end of the downward extending seat, the sliding rotary seat is rotatably provided with a sliding seat, and the sliding seat is provided with a sliding wheel;
the end adjusting mechanism comprises end adjusting rectangular columns arranged on the external fixing plate, end adjusting inserting columns penetrate through two ends of each end adjusting rectangular column, inserting slots are formed in the upper walls of the end adjusting inserting columns in an equally spaced array along the length direction of each end adjusting rectangular column, mounting bottom plates are arranged on the upper walls of two ends of each end adjusting rectangular column, each mounting bottom plate is provided with four spring pins extending upwards, lower pressing plates penetrate through the spring pins at the same ends, springs are sleeved at the upper ends of the spring pins, the lower pressing plates are located at the lower ends of the springs, penetrating rods penetrate through the geometric center of each lower pressing plate, end limiting discs are arranged at the upper ends and the lower ends of the penetrating rods, rotating heads are arranged on the end limiting discs at the upper ends in an upwards extending mode, rectangular inserting plates are arranged on the end limiting discs at the lower ends in a downwards extending mode, and when the lower ends of the rectangular inserting plates are inserted into the inserting slots, the end adjusting inserting columns are locked;
the adjusting mechanism comprises an adjusting block arranged at the outer end of the end adjusting insertion column, a first mounting plate is arranged at the upper end of the adjusting block, an adjusting screw cylinder is arranged in the first mounting plate in an upward extending mode, an adjusting screw rod is arranged in the adjusting screw cylinder, a second rotating cap is arranged at the upper end of the adjusting screw rod, and a supporting base plate is arranged at the lower end of the adjusting screw rod.
Further, the transverse moving mechanism comprises a transverse moving installation bottom plate arranged on the flat plate, a pair of upward extending columns are arranged at two ends of the transverse moving installation bottom plate in an upward extending mode, an eighth installation plate is arranged at the upper end of each upward extending column, a second installation plate is arranged at the upper end of each eighth installation plate, a transverse moving vertical plate is arranged on each second installation plate, a transverse moving bearing seat is arranged at one end of each transverse moving vertical plate, a transverse moving motor is arranged on each transverse moving bearing seat, an output shaft of each transverse moving motor is connected with a transverse moving driving wheel, a first transmission belt is sleeved on each transverse moving driving wheel, each transverse moving driving wheel is arranged at one end of each first transmission belt, a transverse moving driven wheel is arranged at the other end of each transverse moving vertical plate, first transverse moving bearing seats are arranged at two ends of each transverse moving vertical plate, transverse moving rotating rods penetrate through the first transverse moving bearing seats, each transverse moving driven wheel is arranged on one transverse moving rotating rod, transverse moving rotating wheels are respectively provided with transverse moving rotating wheels, and second bearing seats are arranged at the other ends of the transverse moving rotating wheels, the second transverse bearing seats are all provided with T-shaped connecting plates, the inner side ends of the T-shaped connecting plates are all provided with third mounting plates, the third mounting plates are all mounted on transverse vertical plates, a transverse rotating wheel sleeve is provided with a moving belt, the moving belt is provided with a fixed concave part, the lower side of the fixed concave part is provided with a folded mounting plate, the folded mounting plate is provided with a plurality of inclined supporting plates, the folded mounting plate is provided with a transverse inner penetrating plate, the transverse inner penetrating plate penetrates through the transverse vertical plates, the other end of the transverse inner penetrating plate is provided with a transverse inner plate, the upper side and the lower side of the transverse inner plate are both provided with a pair of transverse folded guide plates, the transverse folded guide plates are both mounted on the transverse vertical plates, the transverse inner plate is provided with an outward extending bottom plate, the outward extending bottom plate is provided with a pair of connecting support rods in an upward extending manner, the upper ends of the connecting support rods are provided with transverse mounting tables, the upper ends of the transverse mounting tables are provided with transverse supporting guide seats, the upper end of the transverse moving vertical plate is provided with a transverse moving guide part, the upper end of the transverse moving guide part is provided with an isosceles trapezoid groove, and the lower end of the transverse moving support guide seat is arranged in the isosceles trapezoid groove.
Further, the front pushing mechanism comprises a first front pushing driving bearing seat arranged on the lower side of the outer side end of the transverse moving base plate, a front pushing middle connecting plate is arranged at the lower end of the first front pushing driving bearing seat, a second front pushing driving bearing seat is arranged at the other end of the front pushing middle connecting plate, a front pushing motor is arranged on the second front pushing driving bearing seat, an output shaft of the front pushing motor is connected with a front pushing driving wheel, a front pushing driving belt is sleeved on the front pushing driving wheel, the front pushing driving wheel is arranged at one end of the front pushing driving belt, a front pushing driven wheel is arranged at the other end of the front pushing driving belt, a front pushing screw cylinder is arranged in the front pushing driven wheel, a front pushing bearing seat is arranged at the inner side end of the front pushing screw cylinder, the front pushing bearing seats are arranged on the transverse moving base plate, a pair of first convex seats is respectively arranged on two sides of the front pushing bearing seats, a fifth mounting plate is arranged at the other end of the transverse moving base plate, a pair of upward extending support plates is arranged on the fifth mounting plate, a pair of upward extending support plates is respectively arranged on the outer wall of the second convex seats, all install the guide cylinder between the first evagination seat that is located the homonymy and the second evagination seat, it pushes away the screw rod to be equipped with forward in the preceding spiral shell section of thick bamboo, and the other end that pushes away the screw rod is equipped with forward and pushes away the end plate, and the third evagination seat is all installed to the both sides that push away the end plate forward, and the guide arm is all worn in the guide cylinder to forward pushing away all installed to the third evagination seat.
Furthermore, the lifting mechanism comprises a lifting back plate arranged on the front push end plate, lifting bearing seats are arranged at the upper end and the lower end of the lifting back plate, four lifting guide rods are arranged between the lifting bearing seats, a lifting motor is arranged on the lifting bearing seat at the upper end, an output shaft of the lifting motor is connected with a lifting lead screw, the lifting lead screw is provided with a lifting seat, and the lifting guide rods penetrate through the lifting seat;
the rotating mechanism comprises a rotating driving bearing seat arranged at one end of the lifting seat, a rotating driving motor is arranged on the rotating driving bearing seat, an output shaft of the rotating driving motor is connected with a rotating driving wheel, a rotating driving belt is sleeved on the rotating driving wheel, the rotating driving wheel is located at one end of the rotating driving belt, the other end of the rotating driving belt is provided with a rotating driven wheel, the lifting seat is arranged at the inner side end of the rotating driven wheel, a fixed outer plate is arranged at the outer side end of the rotating driven wheel, an upper plate is arranged at the upper end of the fixed outer plate, and the other end of the upper plate is arranged on the lifting seat.
Further, inhale and press from both sides mechanism including connecting in rotating from the rotation backplate of driving wheel outside end, rotate the both ends of backplate and all install a pair of centre gripping cylinder, the expansion end of centre gripping cylinder all installs the movable sleeve, the root of movable sleeve is equipped with the guide rail, the guide rail is installed in rotating the backplate, the movable sleeve all installs a book shape splint, the lower extreme of book shape splint all is equipped with the suction nozzle, the upper end of book shape splint all is equipped with the connecting pipe, the connecting pipe is connected in the suction nozzle.
Further, place the subassembly including installing in dull and stereotyped a pair of folding shape PMKD that is parallel to each other, the inner wall of folding shape PMKD all is equipped with places the baffle, places to be equipped with between the baffle and places the bottom plate, places the bottom plate and upwards is equipped with to extend the piece, goes up to extend the upper end of piece and is equipped with the arc and places the piece, and the arc is placed the inner arc wall of piece and is offered along its axial and place the arc groove with being equidistant array.
Furthermore, the clamping assembly comprises a pushing mechanism, and a driving mechanism is arranged at the other end of the pushing mechanism;
the pushing mechanism comprises a pushing installation platform arranged on a flat plate, installation wing plates are arranged on two sides of the lower end of the pushing installation platform, a pair of pushing connection columns are arranged on the pushing installation platform in an upward extending mode, a sixth installation plate is arranged at the upper end of each pushing connection column, a pushing bearing seat is arranged on the sixth installation plate, a pushing driving bearing seat is arranged on each pushing connection column, a pushing driving motor is arranged on each pushing driving bearing seat, an output shaft of each pushing driving motor is connected with a pushing driving wheel, a pushing driving belt is sleeved on each pushing driving wheel, each pushing driving wheel is located at one end of each pushing driving belt, a pushing driven wheel is arranged at the other end of each pushing driving belt, a pushing screw cylinder is arranged in each pushing driven wheel, the inner side end of each pushing screw cylinder is arranged on each pushing bearing seat, a pushing screw rod is arranged in each pushing screw cylinder, a pushing end plate is arranged at the inner side end of each pushing screw rod, a pushing rectangular plate is arranged on each pushing plate, and a pair of extending guide pillars are arranged on the upper ends of the pushing rectangular plates in an outward extending mode, an upper extension guide plate penetrates through the overhanging guide pillar, and the lower end of the upper extension guide plate is arranged on the pushing bearing seat;
drive mechanism and including installing in four connection scutches that promote four angles of rectangular plate, the other end of connecting the scute is installed and is driven the commentaries on classics fixed plate, the geometric centre of driving the commentaries on classics fixed plate puts the department and has worn the commentaries on classics pole, the both ends of driving the commentaries on classics pole all are equipped with and drive the outer dish, the outer arc wall that drives the outer dish all is equipped with spacing wheel with the circumference array, spacing wheel all is located and drives the commentaries on classics fixed plate, drive the upper end of changeing fixed plate and install and drive the commentaries on classics bearing frame, drive the commentaries on classics motor installed to drive the pivot bearing frame, the output shaft that drives the commentaries on classics motor has and drives the commentaries on classics drive wheel, it has to drive the commentaries on classics from the driving wheel to drive the meshing, it installs in the outer dish that is located inboard to drive from the commentaries on classics, the commentaries on classics from driving wheel installs the centre gripping dish, the inner wall of centre gripping dish is equipped with soft rubber layer.
Further, the rounding mechanism comprises a pair of fixed legs arranged on a flat plate, a pair of arc plates are arranged at the upper ends of the fixed legs, the arc plates are provided with mounting circular truncated cones in an equally spaced array mode, a rounding wheel is arranged between each pair of mounting circular truncated cones, a rounding ring groove is formed in each rounding wheel, and rounding flannelette is arranged at the bottom of each rounding ring groove.
The technical scheme has the advantages that:
the wafer disc grinding device is convenient for wafer disc grinding operation during wafer disc machining, is convenient for stable and accurate wafer disc transfer during the wafer disc grinding operation, is convenient for wafer disc clamping, is convenient for driving the wafer disc to rotate, obviously improves the wafer disc grinding automation degree, improves the wafer disc grinding efficiency and the wafer disc grinding quality, and has strong practicability.
Drawings
Fig. 1 shows a first isometric view of one of the embodiments.
FIG. 2 shows a second isometric view of one of the embodiments.
FIG. 3 shows a third isometric view of one embodiment.
Figure 4 shows a fourth axis view of one of the embodiments.
Fig. 5 shows a fifth, pictorial view of one embodiment thereof.
Fig. 6 shows an enlarged view at a in fig. 2.
Fig. 7 shows an enlarged view at B in fig. 2.
Fig. 8 shows an enlarged view at C in fig. 2.
Fig. 9 shows an enlarged view at D in fig. 3.
Fig. 10 shows an enlarged view at E in fig. 3.
Fig. 11 shows an enlarged view at F in fig. 3.
Fig. 12 shows an enlarged view at G in fig. 4.
Fig. 13 shows an enlarged view at H in fig. 4.
Fig. 14 shows an enlarged view at I in fig. 4.
Fig. 15 shows an enlarged view at J in fig. 4.
Fig. 16 shows an enlarged view at K in fig. 5.
Fig. 17 shows an enlarged view at L in fig. 5.
Reference numerals:
control cabinet-1, cabinet body-10, adjusting component-11, box body-100, opening and closing door-101, handle-102, flat plate-103, lower extension seat-110, sliding rotation seat-1100, sliding seat-1101, sliding wheel-1102, outer extension rod-111, inner fixing plate-1110, outer fixing plate-1111, outer support inner plate-112, rotating seat-113, outer support screw rod-114, outer support adjusting seat-115, first rotating cap-116, end adjusting rectangular column-117, end adjusting inserted column-118, slot-1180, adjusting block-1181, first installing plate-1182, adjusting screw cylinder-1183, adjusting screw rod-1184, second rotating cap-1185, supporting chassis-1186, installing bottom plate-119, spring pin-1190, lower pressing plate-1191, a spring-1192, an end limit disc-1193, a rotating head-1194 and a rectangular inserting plate-1195;
a transfer component-2, a transverse moving mechanism-20, a forward pushing mechanism-21, a lifting mechanism-22, a rotating mechanism-23, a suction clamping mechanism-24, a transverse moving installation bottom plate-200, an upward extending column-201, an eighth installation plate-202, a second installation plate-203, a transverse moving vertical plate-204, a transverse moving bearing seat-205, a transverse moving motor-206, a transverse moving driving wheel-207, a first driving belt-208, a transverse moving driven wheel-209, a first transverse moving bearing seat-2090, a transverse moving rotating rod-2091, a third installation plate-2092, a T-shaped connecting plate-2093, a second transverse moving bearing seat-2094, a transverse moving rotating wheel-2095, a moving belt-2096, a fixed concave part-2097, a folded installation plate-2098, an inclined supporting plate-2099 and a transverse moving inner penetrating plate-20990, a transverse folded guide plate-20991, an outward extending bottom plate-20992, a connecting strut-20993, a transverse mounting table-20994, a transverse bottom plate-20995, a transverse guide piece-20996, an isosceles trapezoid groove-20997, a transverse support guide seat-20998, a first forward driving bearing seat-210, a forward pushing middle connecting plate-211, a second forward driving bearing seat-212, a forward pushing motor-213, a forward pushing driving wheel-214, a forward pushing transmission belt-215, a forward pushing driven wheel-216, a forward pushing screw-217, a forward pushing screw rod-218, a forward pushing bearing seat-219, a first outward convex seat-2190, a guide cylinder-2191, a fifth mounting plate-2192, an upward extending support plate-2193, a second outward convex seat-2194, a forward pushing end plate-2195, a third outward convex seat-2196 and a forward pushing guide rod-2197, a lifting bearing seat-220, a lifting guide rod-221, a lifting motor-222, a lifting screw rod-223, a lifting seat-224, a lifting back plate-225, a rotary driving bearing seat-230, a rotary driving motor-231, a rotary driving wheel-232, a rotary driving belt-233, an upper connecting plate-234, a fixed outer plate-235, a rotary back plate-240, a guide rail-241, a clamping cylinder-242, a movable sleeve-243, a folded clamping plate-244 and a connecting pipe-245;
a placing component-3, a folded fixing bottom plate-30, a placing guide plate-31, a placing bottom plate-32, an upper extending block-33, an arc-shaped placing piece-34 and an arc-shaped groove-35;
a rounding unit-4, a clamping component-40, a rounding mechanism-41, a pushing installation table-400, a pushing connection column-401, a sixth installation plate-402, a pushing drive bearing seat-403, a pushing drive motor-404, a pushing drive wheel-405, a pushing transmission belt-406, a pushing driven wheel-407, a pushing bearing seat-408, a pushing screw cylinder-409, a pushing screw-4090, a pushing end plate-4091, a pushing rectangular plate-4092, an outward extending guide post-4093, an upward extending guide plate-4094, a connecting angle plate-4095, a driving and rotating fixing plate-4096, a driving and rotating outer disc-4097, a limiting wheel-4098, a driving and rotating shaft-4099, a driving and rotating motor-40990, a driving and rotating drive wheel-40991, a driving driven wheel-40992, a clamping disc-40993, the device comprises a fixed leg-410, an arc plate-411, a mounting round table-412, a rounding wheel-414 and a rounding ring groove-415.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in when used, and are only used for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
The terms "parallel", "perpendicular", etc. do not require that the components be absolutely parallel or perpendicular, but may be slightly inclined. For example, "parallel" merely means that the directions are more parallel relative to "perpendicular," and does not mean that the structures are necessarily perfectly parallel, but may be slightly tilted.
Furthermore, the terms "substantially", and the like are intended to indicate that the relative terms are not necessarily strictly required, but may have some deviation. For example: "substantially equal" does not mean absolute equality, but because absolute equality is difficult to achieve in actual production and operation, certain deviations generally exist. Thus, in addition to absolute equality, "substantially equal" also includes the above-described case where there is some deviation. In this case, unless otherwise specified, terms such as "substantially", and the like are used in a similar manner to those described above.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1 to 17, a wafer disk rounding device for chips is composed of a control cabinet 1, a transfer unit 2, a placement unit 3, and a rounding unit 4. Wherein, transfer assembly 2 locates the one end of switch board 1, places subassembly 3 and locates switch board 1, and rounding unit 4 locates the other end of switch board 1. The transfer assembly 2 is used for transferring wafer disks so as to move the wafer disks from the placing assembly 3 to the rounding unit 4, the placing assembly 3 is used for placing a plurality of wafer disks, and the rounding unit 4 is used for polishing operation of arc walls of the wafer disks.
The control cabinet 1 mainly comprises a cabinet body 10, the cabinet body 10 is provided with a pair of adjusting components 11 at the lower end, and the adjusting components 11 are used for supporting the lower end of the cabinet body 10 and adjusting the balance degree.
The transfer assembly 2 is mainly composed of a transverse moving mechanism 20, the transverse moving mechanism 20 is provided with a front pushing mechanism 21, the front pushing mechanism 21 is provided with a lifting mechanism 22, the lifting mechanism 22 is provided with a rotating mechanism 23, the rotating mechanism 23 is provided with a suction clamping mechanism 24, the moving direction of the transverse moving mechanism 20 is parallel to the width direction of the control cabinet 1, the transverse moving mechanism 20 is used for driving the front pushing mechanism 21 to move along the moving direction, the moving direction of the front pushing mechanism 21 is parallel to the length direction of the control cabinet 1, the front pushing mechanism 21 is used for adjusting the distance between the lifting mechanism 22 and the transverse moving mechanism 20, the lifting mechanism 22 is used for adjusting the height of the rotating mechanism 23, and the rotating mechanism 23 is used for driving the suction clamping mechanism 24 to rotate so as to adjust the posture of clamping the wafer by the suction clamping mechanism 24.
The rounding unit 4 is mainly composed of a pair of clamping assemblies 40, a rounding mechanism 41 is arranged between the clamping assemblies 40, and the clamping assemblies 40 are used for clamping the wafer disc and driving the wafer disc to rotate, so that the rounding mechanism 41 grinds and polishes the arc wall of the wafer disc.
Specifically, the above-mentioned cabinet 10 includes a box 100, opening/closing doors 101 are hinged to opposite sides of the box 100, the opening/closing doors 101 are provided with handles 102, and a flat plate 103 is provided at an upper end of the box 100.
Specifically, the above-mentioned adjusting assembly 11 includes an outer supporting mechanism installed at the lower end of the box 100, the outer supporting mechanism is provided with a pair of sliding members, both ends of the outer supporting mechanism are provided with end adjusting mechanisms, the end adjusting mechanisms are provided with adjusting mechanisms, the outer supporting mechanism is used for adjusting the distance between the adjusting mechanism and the box 100, the end adjusting mechanism is used for adjusting the distance between the adjusting mechanisms, and the adjusting mechanism is used for adjusting the balance degree of the box 100.
The outer supporting mechanism comprises a pair of lower extending seats 110 installed at the lower end of the box body 100, outer extending rods 111 penetrate through the lower extending seats 110, inner fixing plates 1110 are arranged at the inner side ends of the outer extending rods 111, outer supporting inner plates 112 are installed on the inner fixing plates 1110, rotating seats 113 are installed at the middle positions of the outer supporting inner plates 112, outer supporting lead screws 114 are arranged on the rotating seats 113, outer supporting adjusting seats 115 are arranged on the outer supporting lead screws 114, the outer supporting adjusting seats 115 are installed at the lower end of the box body 100 and located between the lower extending seats 110, first rotating caps 116 are arranged at the outer side ends of the outer supporting lead screws 114, and outer fixing plates 1111 are arranged at the outer side ends of the outer extending rods 111.
The sliding member includes a sliding rotary base 1100 mounted at the lower end of the downward-extending base 110, the sliding rotary base 1100 is rotatably provided with a sliding base 1101, and the sliding base 1101 is provided with a sliding wheel 1102.
Wherein, the end adjusting mechanism comprises an end adjusting rectangular column 117 arranged on the outer fixing plate 1111, the two ends of the end adjusting rectangular column 117 are both provided with an end adjusting inserting column 118, the upper wall of the end adjusting inserting column 118 is formed with slots 1180 in an equally spaced array along the length direction, the upper walls of the two ends of the end adjusting rectangular column 117 are both provided with an installation bottom plate 119, each installation bottom plate 119 is provided with four spring pins 1190 extending upwards, the spring pins 1190 at the same end are both provided with a lower pressing plate 1191, the upper end of the spring pins 1190 are both sleeved with springs 1192, the lower pressing plate 1191 is arranged at the lower end of the springs 1192, the geometric center of each lower pressing plate 1191 is provided with a penetrating rod, the upper end and the lower end of each penetrating rod are both provided with end limiting discs 1193, the end limiting discs 1193 at the upper end are both provided with a rotating head 1194 extending upwards, the end limiting discs 1193 at the lower end are both provided with rectangular inserting plates 1195 extending downwards, when the lower ends of the rectangular insertion plates 1195 are inserted into the insertion slots 1180, the locking device is used for locking the end adjustment insertion columns 118.
The adjusting mechanism comprises an adjusting block 1181 installed at the outer side end of the end adjusting insertion column 118, a first installing plate 1182 is installed at the upper end of the adjusting block 1181, an adjusting screw tube 1183 is arranged on the first installing plate 1182 in an upward extending manner, an adjusting screw rod 1184 is arranged in the adjusting screw tube 1183, a second rotating cap 1185 is arranged at the upper end of the adjusting screw rod 1184, and a supporting chassis 1186 is arranged at the lower end of the adjusting screw rod 1184.
Specifically, the above-mentioned traverse mechanism 20 includes a traverse mounting base plate 200 mounted on the flat plate 103, a pair of upward extending posts 201 are provided at both ends of the traverse mounting base plate 200 in an upward extending manner, an eighth mounting plate 202 is provided at the upper end of each upward extending post 201, a second mounting plate 203 is provided at the upper end of each eighth mounting plate 202, a traverse riser 204 is provided at the second mounting plate 203, a traverse bearing seat 205 is provided at one end of the traverse riser 204, a traverse motor 206 is provided at the traverse bearing seat 205, a traverse driving wheel 207 is connected to an output shaft of the traverse motor 206, a first driving belt 208 is sleeved on the traverse driving wheel 207, the traverse driving wheel 207 is provided at one end of the first driving belt 208, a traverse driven pulley 209 is provided at the other end of the first driving belt 208, a first traverse bearing seat 2090 is provided at both ends of the traverse riser 204, a traverse lever 2091 is penetrated in the first traverse bearing seat 2090, one traverse lever 2091 is provided in the driven pulley 209, a transverse moving rotating wheel 2095 is arranged at the other end of each transverse moving rotating rod 2091, a second transverse moving bearing seat 2094 is arranged at the other end of each transverse moving rotating wheel 2095, a T-shaped connecting plate 2093 is arranged on each second transverse moving bearing seat 2094, a third mounting plate 2092 is arranged at the inner side end of each T-shaped connecting plate 2093, the third mounting plates 2092 are arranged on transverse moving vertical plates 204, a moving belt 2096 is sleeved on each transverse moving rotating wheel 2095, a fixed concave part 2097 is arranged on each moving belt 2096, a folded mounting plate 2098 is arranged at the lower side of each fixed concave part 2097, a plurality of inclined supporting plates 2099 are arranged on each folded mounting plate 2098, a transverse moving inner penetrating plate 20990 is arranged on each folded mounting plate 2098, a transverse moving inner penetrating plate 20990 penetrates through each transverse moving vertical plate 204, a transverse moving inner penetrating plate 20990 is arranged at the other end of each transverse moving inner plate, a pair of transverse moving folded guide plates 20991 are arranged at the upper side and the lower side of each transverse moving inner plate 20991 is arranged on each transverse moving inner plate 204, an outward extending bottom plate 20992, the overhanging bottom plate 20992 is provided with a pair of connecting supporting rods 20993 extending upwards, the upper ends of the connecting supporting rods 20993 are provided with a transverse moving installation platform 20994, the upper end of a transverse moving installation platform 20994 is provided with a transverse moving bottom plate 20995, the lower wall of the transverse moving bottom plate 20995 is provided with a transverse moving support guide seat 20998, the upper end of a transverse moving vertical plate 204 is provided with a transverse moving guide part 20996, the upper end of the transverse moving guide part 20996 is formed with an isosceles trapezoid groove 20997, and the lower end of the transverse moving support guide seat 20998 is provided with an isosceles trapezoid groove 20997.
Specifically, the aforementioned forward-pushing mechanism 21 includes a first forward-pushing driving bearing seat 210 mounted on the lower side of the outer end of the traverse bottom plate 20995, a forward-pushing middle connecting plate 211 is mounted on the lower end of the first forward-pushing driving bearing seat 210, a second forward-pushing driving bearing seat 212 is mounted on the other end of the forward-pushing middle connecting plate 211, a forward-pushing motor 213 is mounted on the second forward-pushing driving bearing seat 212, an output shaft of the forward-pushing motor 213 is connected to a forward-pushing driving wheel 214, the forward-pushing driving wheel 214 is sleeved with a forward-pushing transmission belt 215, the forward-pushing driving wheel 214 is mounted on one end of the forward-pushing transmission belt 215, the other end of the forward-pushing transmission belt 215 is provided with a forward-pushing driven wheel 216, a forward-pushing screw cylinder 217 is disposed in the forward-pushing driven wheel 216, a forward-pushing bearing seat 219 is disposed on the inner end of the forward-pushing screw cylinder 217, the forward-pushing bearing seat 219 is mounted on the traverse bottom plate 20995, a pair of first outwardly-protruding seats 2190 is mounted on both sides of the forward-pushing bearing seat 219, a fifth mounting plate 209192 is mounted on the other end of the traverse bottom plate 20995, a pair of upper extension support plates 2193 is installed on the fifth installation plate 2192 in an upward extending mode, second outer convex seats 2194 are installed on the outer walls of the upper extension support plates 2193, guide cylinders 2191 are installed between the first outer convex seats 2190 and the second outer convex seats 2194 on the same side, forward-pushing screws 218 are arranged in the forward-pushing screws 217, forward-pushing end plates 2195 are arranged at the other ends of the forward-pushing screws 218, third outer convex seats 2196 are installed on the two sides of the forward-pushing end plates 2195, forward-pushing rods 2197 are installed on the third outer convex seats 2196, and the forward-pushing rods 2197 penetrate through the guide cylinders 2191.
Specifically, the above-mentioned lifting mechanism 22 includes a lifting back plate 225 mounted on the forward-pushing end plate 2195, lifting bearing seats 220 are mounted at both upper and lower ends of the lifting back plate 225, four lifting guide rods 221 are disposed between the lifting bearing seats 220, a lifting motor 222 is mounted on the lifting bearing seat 220 at the upper end, an output shaft of the lifting motor 222 is connected to a lifting screw 223, a lifting seat 224 is disposed on the lifting screw 223, and the lifting guide rods 221 penetrate through the lifting seat 224.
Specifically, the above-mentioned rotating mechanism 23 includes a rotating driving bearing block 230 mounted at one end of the lifting seat 224, the rotating driving bearing block 230 is mounted with a rotating driving motor 231, an output shaft of the rotating driving motor 231 is connected with a rotating driving wheel 232, the rotating driving wheel 232 is sleeved with a rotating transmission belt 233, the rotating driving wheel 232 is located at one end of the rotating transmission belt 233, the other end of the rotating transmission belt 233 is provided with a rotating driven wheel, an inner end of the rotating driven wheel is disposed on the lifting seat 224, an outer end of the rotating driven wheel is provided with a fixed outer plate 235, an upper end of the fixed outer plate 235 is provided with an upper plate 234, and the other end of the upper plate 234 is mounted on the lifting seat 224.
Specifically, the suction and clamping mechanism 24 mentioned above includes a rotating back plate 240 connected to the outer end of the rotating driven wheel, a pair of clamping cylinders 242 are mounted at both ends of the rotating back plate 240, movable sleeves 243 are mounted at the movable ends of the clamping cylinders 242, guide rails 241 are disposed at the roots of the movable sleeves 243, the guide rails 241 are mounted on the rotating back plate 240, folded clamping plates 244 are mounted at the movable sleeves 243, suction nozzles are disposed at the lower ends of the folded clamping plates 244, connecting pipes 245 are disposed at the upper ends of the folded clamping plates 244, and the connecting pipes 245 are connected to the suction nozzles.
Specifically, the above-mentioned subassembly 3 of placing is including installing in a pair of folding PMKD 30 that is parallel to each other of dull and stereotyped 103, and folding PMKD 30's inner wall all is equipped with places the baffle 31, places and is equipped with between the baffle 31 and places the bottom plate 32, places bottom plate 32 and upwards extends to be equipped with and prolongs piece 33, and the upper end of upwards prolonging piece 33 is equipped with the arc and places a 34, and the arc is placed the inner arc wall that piece 34 was placed to the arc and is offered along its axial and place arc groove 35 with being equidistant array.
Specifically, the above-mentioned clamping assembly 40 includes a pushing mechanism, and the other end of the pushing mechanism is provided with a driving mechanism.
Wherein, the pushing mechanism comprises a pushing installation platform 400 arranged on the flat plate 103, both sides of the lower end of the pushing installation platform 400 are provided with installation wing plates 4000, the pushing installation platform 400 is provided with a pair of pushing connection columns 401 extending upwards, the upper end of each pushing connection column 401 is provided with a sixth installation plate 402, the sixth installation plate 402 is provided with a pushing bearing seat 408, the pushing connection columns 401 are provided with pushing drive bearing seats 403, the pushing drive bearing seats 403 are provided with pushing drive motors 404, the output shafts of the pushing drive motors 404 are connected with pushing drive wheels 405, the pushing drive wheels 405 are sleeved with pushing transmission belts 406, the pushing drive wheels 405 are positioned at one ends of the pushing transmission belts 406, the other ends of the pushing transmission belts 406 are provided with pushing driven wheels 407, pushing screw barrels 409 are arranged in the pushing driven wheels 407, the inner ends of the pushing screw barrels 409 are arranged on the pushing bearing seats 408, and pushing screw rods 4090 are arranged in the pushing screw barrels 409, the inner side end of the push screw 4090 is provided with a push end plate 4091, the push end plate 4091 is provided with a push rectangular plate 4092, the upper end of the push rectangular plate 4092 is provided with a pair of outward extending guide posts 4093 in an outward extending manner, the outward extending guide posts 4093 are penetrated with an upward extending guide plate 4094, and the lower end of the upward extending guide plate 4094 is arranged on the push bearing block 408.
The driving and rotating mechanism comprises four connecting angle plates 4095 arranged at four corners of a pushing rectangular plate 4092, the other end of each connecting angle plate 4095 is provided with a driving and rotating fixing plate 4096, a driving and rotating rod penetrates through the geometric center of the driving and rotating fixing plate 4096, two ends of each driving and rotating rod are respectively provided with a driving and rotating outer disc 4097, the outer arc walls of the driving and rotating outer discs 4097 are respectively provided with a limiting wheel 4098 in a circumferential array manner, the limiting wheels 4098 are respectively arranged on the driving and rotating fixing plate 4096, the upper end of each driving and rotating fixing plate 4096 is provided with a driving and rotating shaft bearing 4099, the driving and rotating shaft bearing 4099 is provided with a driving and rotating motor 40990, the output shaft of the driving and rotating motor 40990 is connected with a driving and rotating driving wheel 40991, the driving and rotating driving wheel 40992 is engaged with a driving and rotating driven wheel 40992, the driving and rotating driven wheel 40992 is arranged on the driving and rotating outer disc 4097 positioned at the inner side, the driving and rotating driven wheel 40992 is provided with a clamping disc 40993, and the inner wall of the clamping disc 40993 is provided with a soft rubber layer.
Specifically, the rounding mechanism 41 includes a pair of fixed legs 410 mounted on the plate 103, a pair of arc plates 411 are mounted at the upper ends of the fixed legs 410, the arc plates 411 are respectively provided with mounting circular truncated cones 412 in an equally spaced array, a rounding wheel 414 is mounted between each pair of mounting circular truncated cones 412, a rounding ring groove is formed on the rounding wheel 414, and a rounding flannel is disposed at the bottom of the rounding ring groove.
The device is mainly based on a plurality of problems existing in the common prior art, and the wafer disc rounding operation is conveniently carried out through the control cabinet 1, the transfer assembly 2, the placing assembly 3 and the rounding unit 4. Wherein switch board 1 plays the effect of stable support for whole device to the convenience is adjusted the adjustment to the equilibrium degree of whole device, thereby stability when guaranteeing the wafer disc rounding operation has improved the rounding effect. The transfer assembly 2 is convenient for transferring the wafer disc, has excellent flexibility, improves the automation degree of wafer disc transfer, and can stably and accurately transfer the wafer disc from the placing assembly 3 to the rounding unit 4 or transfer the wafer disc finished with rounding out from the rounding unit 4. Place subassembly 3 and conveniently carry out placing of a plurality of brilliant discs to conveniently carry out getting of brilliant disc and use, conveniently simultaneously the rounding accomplishes placing of brilliant disc. The rounding unit 4 is convenient for rounding the wafer disc, so that the wafer disc can be conveniently vertically clamped in the rounding process, the wafer disc can be conveniently driven to rotate, the wafer disc can be simultaneously rounded when rotating, and the rounding efficiency and the rounding quality of the wafer disc are remarkably improved.
In a specific rounding operation, the transverse moving mechanism 20, the forward pushing mechanism 21 and the lifting mechanism 22 are used for transferring the suction clamping mechanism 24 to a position right above one of the wafer disks of the placing component 3, then the lifting mechanism 22 is used for adjusting the height of the suction clamping mechanism 24, then the suction clamping mechanism 24 is used for clamping the wafer disk, after the wafer disk is clamped, the transverse moving mechanism 20 and the forward pushing mechanism 21 are used for driving the suction clamping mechanism 24 to move, the wafer disk is transferred to the rounding mechanism 41, during the placing, the rotating mechanism 23 is used for adjusting the posture of the wafer disk, so that the wafer disk placed on the rounding mechanism 41 is in a vertical state, after the placing is completed, the driving mechanism is driven by the pushing mechanism to move towards the two sides of the wafer disk until the driving mechanism finishes clamping of the wafer disk, then the driving mechanism is started, and the wafer disk is driven by the driving mechanism to rotate, when the wafer disc rotates, the outer arc wall of the wafer disc is subjected to rounding operation by the rounding mechanism 41, and after rounding is completed, the wafer disc is transferred onto the placing component 3 or other placing parts by the transverse moving mechanism 20, the forward pushing mechanism 21, the lifting mechanism 22 and the suction clamping mechanism 24. The operation can obviously improve the wafer disc rounding efficiency and the rounding automation degree.
In particular, the cabinet 10 provides a protective case with a protective effect for the placement of the control switches and some pneumatic elements.
Specifically, when the adjusting assembly 11 supports the cabinet 10 and adjusts the balance of the cabinet 10, the distance between the adjusting mechanism and the cabinet 10 is adjusted by the external supporting mechanism, so as to expand the supporting range of the adjusting mechanism and further improve the supporting stability, and the end adjusting mechanism can adjust the distance between the two adjusting mechanisms, and correspondingly, also in order to expand the supporting range of the lower end and improve the supporting stability, this design mode mainly focuses on or considers that the center of gravity of the whole device may shift due to different weights of the components of other necessary components arranged at the upper end of the cabinet 10, and the shift of the center of gravity mainly reflects that the whole device may shake to different degrees during working and processing, and the rounding of the wafer disc is an operation with higher precision requirement, thus directly affecting the rounding operation, and when the effective supporting area of the lower end is increased, the influence can be obviously reduced or reduced, and the arrangement of the sliding component is convenient for carrying operation of the whole device, and simultaneously improves the carrying flexibility.
When the adjusting mechanism is adjusted by the outer support mechanism, the first rotating cap 116 rotates the outer support screw 114, the outer support screw 114 rotates to drive the outer support inner plate 112 to move, the outer support inner plate 112 moves to drive the outer extension rod 111 to move outwards, and the outer extension rod 111 moves to drive the end adjusting rectangular column 117 to move, so that the adjustment of the adjusting mechanism is completed.
Wherein the sliding rotary seat 1100 in the sliding member facilitates the sliding wheel 1102 to rotate around the axial direction thereof, and the sliding wheel 1102 facilitates the transfer of the whole device.
When the distance between the adjusting mechanisms in the end adjusting mechanism is adjusted, the lower pressing plate 1191 is pulled upwards, the rectangular inserting plate 1195 is pulled out of the slot 1180, then the rectangular inserting plate 1195 is rotated through the rotating head 1194, so that the rectangular inserting plate 1195 is located at the upper end of the mounting bottom plate 119, then the position of the adjusting block 1181 is adjusted, and after the adjustment is completed, the rectangular inserting plate 1195 is rotated, so that the rectangular inserting plate 1195 is inserted into the slot 1180, and the position of the adjusting block 1181 is locked.
When the adjusting mechanism adjusts the horizontal and height of the whole device, the second rotating cap 1185 rotates the adjusting screw 1184, and the rotation of the adjusting screw 1184 adjusts the height or balance of the whole device.
Specifically, when the traversing mechanism 20 adjusts the position of the forward pushing mechanism 21, the traversing motor 206 is activated, the traversing driving wheel 207 is driven by the traversing motor 206 to rotate, the rotation of the traversing driving wheel 207 drives the rotation of the traversing driven wheel 209 through the first transmission belt 208, the rotation of the traversing driven wheel 209 drives one of the traversing rotating wheels 2095 to rotate, the rotation of the traversing rotating wheel 2095 drives the moving belt 2096 to rotate, the moving belt 2096 drives the fixed concave 2097 to move during the operation, the movement of the fixed concave 2097 drives the traversing bottom plate 20995 to move, and the movement of the traversing bottom plate 20995 drives the forward pushing mechanism 21 to move. Wherein sideslip fold guide plate 20991 plays the effect of direction to the motion of sideslip inner panel to make through this kind of spacing direction remove area 2096 and can not receive the pulling down force, thereby ensure the stability and the flexibility of sideslip bottom plate 20995 motion, corresponding also improved the controllability. Wherein in order to further guide the movement stability of the transverse moving bottom plate 20995 and to improve the supporting force to the transverse moving bottom plate 20995, a transverse moving guide 20996 is provided, an isosceles trapezoid groove 20997 is provided at the transverse moving guide 20996, and a transverse moving support guide 20998 provided at the transverse moving bottom plate 20995 is provided in the isosceles trapezoid groove 20997.
Specifically, when the forward-push mechanism 21 adjusts the position of the lifting mechanism 22, the forward-push motor 213 is activated, the forward-push driving wheel 214 is driven by the forward-push motor 213 to rotate, the rotation of the forward-push driving wheel 214 drives the forward-push driven wheel 216 to rotate through the forward-push driving belt 215, the rotation of the forward-push driven wheel 216 drives the forward-push screw cylinder 217 to rotate, and the rotation of the forward-push screw cylinder 217 causes the forward-push screw rod 218 to move along the axial direction of the derivation rod 2197 in the guidance direction of the derivation rod 2197, so as to achieve the purpose of adjusting the position of the lifting mechanism 22, wherein the arrangement of the guide cylinder 2191 can ensure the stability of the guidance of the forward derivation rod 2197, and the movement mode is responsive to the speed block, and is convenient to control, and the movement precision is high.
Specifically, when the lifting mechanism 22 drives the rotating mechanism 23 to perform lifting movement, the lifting motor 222 is started, the lifting screw 223 is driven by the lifting motor 222 to rotate, and the rotation of the lifting screw 223 drives the lifting base 224 to move along the axial direction of the lifting guide rod 221, so as to finally complete the adjustment of the position of the rotating mechanism 23. The stability and the accuracy of the position adjusting mode are due to the traditional cylinder adjusting mode, and the stability is strong during adjusting.
Specifically, when the rotating mechanism 23 drives the suction clamping mechanism 24 to rotate, the rotating driving motor 231 is started, the rotating driving wheel 232 is driven by the rotating driving motor 231 to rotate, the rotating driving wheel 232 rotates to rotate the driven wheel through the rotating transmission belt 233, and the rotating driven wheel rotates to drive the rotating backboard 240 to rotate, wherein the rotating angle of the rotating backboard 240 is conveniently controlled, so that corresponding teeth are arranged on the inner wall of the rotating transmission belt 233. The rotation mode is high in adjusting speed, and can accurately adjust any angle, so that the placing precision of the wafer disc is improved.
Specifically, when the wafer disc is clamped by the clamping mechanism 24, the folded clamping plate 244 is driven by the clamping cylinder 242 to approach each other, when a certain gap is formed between the folded clamping plate 244 and the two sides of the wafer disc, the suction device sucks air into the suction nozzle through the connecting pipe 245, the pressure in the space between the suction nozzle and the wafer disc is smaller than the external pressure, and finally the wafer disc is stably adsorbed on the folded clamping plate 244.
Specifically, place subassembly 3 when carrying out placing of brilliant disc, for convenient the material loading or the unloading operation that carry out many brilliant discs wholely, consequently set up two and extended dull and stereotyped 103 place baffle 31, place arc groove 35 simultaneously and can make two adjacent brilliant discs separate each other to the convenience carries out the centre gripping to the wafer dish, avoids taking place the friction between two brilliant discs simultaneously, and causes the influence to the quality of brilliant disc.
Specifically, when the pushing mechanism drives the driving mechanism to move and clamps the wafer disc through the driving mechanism, the driving motor 404 is pushed, the driving wheel 405 is pushed to rotate under the driving of the driving motor 404, the rotation of the driving wheel 405 is pushed to drive the driven wheel 407 to rotate through the pushing transmission belt 406, the rotation of the driven wheel 407 is pushed to drive the pushing screw barrel 409 to rotate, the rotation of the pushing screw barrel 409 drives the pushing screw 4090 to move under the guiding of the outward extending guide post 4093, the position of the driving mechanism is adjusted by the movement of the pushing screw 4090, and finally the wafer disc is clamped through the driving mechanism.
Specifically, when the driving mechanism drives the crystal disc to rotate, the driving motor 40990 is started, the driving wheel 40991 is driven by the driving motor 40990 to rotate, the driving wheel 40991 is driven to rotate by the driving wheel 40991, the driving wheel 40992 is driven to rotate by the driving wheel 40992, the clamping disc 40993 is driven to rotate by the driving wheel 40992, the crystal disc is driven to rotate by the clamping disc 40993, the spacing wheel 4098 is arranged for ensuring the stability of the rotation of the clamping disc 40993, the friction force between the crystal disc and the clamping disc 40993 is increased, the rounding efficiency of the crystal disc is increased, and therefore, a soft rubber layer is arranged on the inner wall of the clamping disc 40993.
Specifically, when the rounding mechanism 41 rounds, the wafer disc driven by the driving mechanism to rotate will contact with the lint in the rounding ring groove 415 of the rounding wheel 414, and the lint is coated or adhered with the polishing paste, and the wafer disc will finally complete the rounding operation by the polishing paste.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and it is apparent that those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (10)

1. A wafer disk rounding device for chips is characterized by comprising:
the control cabinet (1) comprises a cabinet body (10), wherein the lower end of the cabinet body (10) is provided with a pair of adjusting components (11), and the adjusting components (11) are used for supporting the lower end of the cabinet body (10) and adjusting the balance degree;
the transfer assembly (2) is arranged at one end of the control cabinet (1) and comprises a transverse moving mechanism (20), the transverse moving mechanism (20) is provided with a front pushing mechanism (21), the front pushing mechanism (21) is provided with a lifting mechanism (22), the lifting mechanism (22) is provided with a rotating mechanism (23), the rotating mechanism (23) is provided with a suction clamping mechanism (24), the moving direction of the transverse moving mechanism (20) is parallel to the width direction of the control cabinet (1), the transverse moving mechanism (20) is used for driving the front pushing mechanism (21) to move along the moving direction, the moving direction of the front pushing mechanism (21) is parallel to the length direction of the control cabinet (1), the front pushing mechanism (21) is used for adjusting the distance between the lifting mechanism (22) and the transverse moving mechanism (20), the lifting mechanism (22) is used for adjusting the height of the rotating mechanism (23), and the rotating mechanism (23) is used for driving the suction clamping mechanism (24) to rotate so as to adjust the posture of a wafer clamped by the suction clamping mechanism (24);
the placing component (3) is arranged on the control cabinet (1);
the rounding unit (4) is arranged at the other end of the control cabinet (1) and comprises a pair of clamping components (40), a rounding mechanism (41) is arranged between the clamping components (40), and the clamping components (40) are used for clamping a wafer disc and driving the wafer disc to rotate so that the rounding mechanism (41) grinds and polishes the arc wall of the wafer disc;
the transfer assembly (2) is used for transferring the wafer disks so as to enable the wafer disks to move from the placing assembly (3) to the rounding unit (4), the placing assembly (3) is used for placing a plurality of wafer disks, and the rounding unit (4) is used for grinding and polishing the arc walls of the wafer disks.
2. The wafer disk rounding device for chips according to claim 1, characterized in that:
the cabinet body (10) comprises a cabinet body (100), opening and closing doors (101) are hinged to two opposite sides of the cabinet body (100), handles (102) are arranged on the opening and closing doors (101), and a flat plate (103) is arranged at the upper end of the cabinet body (100);
adjusting part (11) is including installing in the outer mechanism that props of box (100) lower extreme, and outer mechanism that props all is equipped with a pair of slip component, and the both ends that prop the mechanism outward all are equipped with the end and transfer the mechanism, and the end is transferred the mechanism and all is equipped with adjustment mechanism, props the mechanism outward and is used for adjusting the interval between adjustment mechanism and box (100), and the end is transferred the mechanism and is used for adjusting the interval between the adjustment mechanism, and adjustment mechanism is used for the regulation of box (100) equilibrium degree.
3. The wafer disk rounding device for chips according to claim 2, characterized in that:
the outer supporting mechanism comprises a pair of lower extending seats (110) arranged at the lower end of the box body (100), outer extending rods (111) penetrate through the lower extending seats (110), inner fixing plates (1110) are arranged at the inner side ends of the outer extending rods (111), outer supporting inner plates (112) are arranged on the inner fixing plates (1110), rotating seats (113) are arranged at the middle positions of the outer supporting inner plates (112), outer supporting screw rods (114) are arranged on the rotating seats (113), outer supporting adjusting seats (115) are arranged on the outer supporting screw rods (114), the outer supporting adjusting seats (115) are arranged at the lower end of the box body (100) and located between the lower extending seats (110), first rotating caps (116) are arranged at the outer side ends of the outer supporting screw rods (114), and outer fixing plates (1111) are arranged at the outer side ends of the outer extending rods (111);
the sliding component comprises a sliding rotary seat (1100) arranged at the lower end of the downward extending seat (110), the sliding rotary seat (1100) is rotatably provided with a sliding seat (1101), and the sliding seat (1101) is provided with a sliding wheel (1102);
the end adjusting mechanism comprises end adjusting rectangular columns (117) arranged on an outer fixing plate (1111), end adjusting inserting columns (118) penetrate through two ends of each end adjusting rectangular column (117), slots (1180) are formed in the upper wall of each end adjusting inserting column (118) in an equally spaced array along the length direction of the end adjusting rectangular column, mounting bottom plates (119) are arranged on the upper walls of two ends of each end adjusting rectangular column (117), four spring pins (1190) extend upwards from each mounting bottom plate (119), lower pressing plates (1191) penetrate through the spring pins (1190) at the same end, springs (1192) are sleeved on the upper ends of the spring pins (1190), the lower pressing plates (1191) are arranged at the lower ends of the springs (1192), penetrating rods penetrate through the geometric center positions of each lower pressing plate (1191), end limiting discs (1193) are arranged at the upper ends and the lower ends of each penetrating rod, rotating heads (1194) are arranged on the end limiting discs (1193) at the upper ends in an upwards extending mode, inserting plates (1195) are arranged on the end limiting discs (1193) in a downwards extending mode, when the lower ends of the rectangular insertion plates (1195) are inserted into the insertion grooves (1180), the rectangular insertion plates are used for locking the end adjusting insertion columns (118);
the adjusting mechanism comprises an adjusting block (1181) arranged at the outer side end of the end adjusting insertion column (118), a first mounting plate (1182) is installed at the upper end of the adjusting block (1181), an adjusting screw cylinder (1183) is arranged on the first mounting plate (1182) in an upward extending mode, an adjusting screw rod (1184) is arranged in the adjusting screw cylinder (1183), a second rotating cap (1185) is arranged at the upper end of the adjusting screw rod (1184), and a supporting chassis (1186) is arranged at the lower end of the adjusting screw rod (1184).
4. The wafer disc rounding device for chips as claimed in claim 2, wherein the traverse mechanism (20) includes a traverse mounting base plate (200) mounted on the plate (103), both ends of the traverse mounting base plate (200) are provided with a pair of upward extending posts (201) extending upward, the upper ends of the upward extending posts (201) are provided with eighth mounting plates (202), the upper ends of the eighth mounting plates (202) are provided with second mounting plates (203), the second mounting plates (203) are provided with traverse risers (204), one ends of the traverse risers (204) are provided with traverse bearing seats (205), the traverse bearing seats (205) are provided with traverse motors (206), output shafts of the traverse motors (206) are connected with traverse driving wheels (207), the traverse driving wheels (207) are sleeved with first driving belts (208), the traverse driving wheels (207) are provided at one ends of the first driving belts (208), the other ends of the first driving belts (208) are provided with traverse driven wheels (209), the two ends of a transverse moving vertical plate (204) are respectively provided with a first transverse moving bearing seat (2090), a transverse moving rotating rod (2091) penetrates through the first transverse moving bearing seat (2090), a transverse moving driven wheel (209) is arranged on one transverse moving rotating rod (2091), transverse moving rotating wheels (2095) are arranged at the other ends of the transverse moving rotating rods (2091), second transverse moving bearing seats (2094) are arranged at the other ends of the transverse moving rotating wheels (2095), T-shaped connecting plates (2093) are arranged on the second transverse moving bearing seats (2094), third mounting plates (2092) are arranged at the inner side ends of the T-shaped connecting plates (2093), the third mounting plates (2092) are respectively arranged on the transverse moving vertical plate (204), a moving belt (2096) is sleeved on the transverse moving rotating wheels (2095), a fixed concave part (2097) is arranged on the lower side of the fixed concave part (2097), folded mounting plates (2098) are respectively provided with a plurality of inclined supporting plates (2099), the transverse moving inner penetrating plate (20990) is installed on the folded installation plate (2098), the transverse moving inner penetrating plate (20990) penetrates through the transverse moving vertical plate (204), a transverse moving inner plate is arranged at the other end of the transverse moving inner penetrating plate (20990), a pair of transverse moving folded guide plates (20991) are arranged on the upper side and the lower side of the transverse moving inner plate, the transverse moving folded guide plates (20991) are installed on the transverse moving vertical plate (204), an outward extending bottom plate (20992) is arranged on the transverse moving inner plate in an outward extending mode, a pair of connecting supporting rods (20993) are arranged on the outward extending bottom plate (20992) in an upward extending mode, a transverse moving installation platform (20994) is installed at the upper end of the connecting supporting rods (20993), a transverse moving bottom plate (20995) is installed at the upper end of the transverse moving installation platform (20994), a transverse moving supporting guide seat (20998) is installed at the lower wall of the transverse moving bottom plate (20995), an isosceles trapezoid groove (20997) is formed at the upper end of the transverse moving vertical plate (204), and an isosceles trapezoid groove (20997) is formed at the lower end of the transverse moving supporting guide seat (20998).
5. The wafer disc rounding device for the chip as claimed in claim 4, wherein the pushing mechanism (21) includes a first pushing driving bearing seat (210) installed at a lower side of an outer end of the traverse base plate (20995), a pushing middle connecting plate (211) is installed at a lower end of the first pushing driving bearing seat (210), a second pushing driving bearing seat (212) is installed at the other end of the pushing middle connecting plate (211), a pushing motor (213) is installed at the second pushing driving bearing seat (212), an output shaft of the pushing motor (213) is connected with a pushing driving wheel (214), the pushing driving wheel (214) is sleeved with a pushing driving belt (215), the pushing driving wheel (214) is installed at one end of the pushing driving belt (215), a pushing driven wheel (216) is installed at the other end of the pushing driving belt (215), a pushing screw cylinder (217) is installed in the pushing driven wheel (216), a pushing screw cylinder (219) is installed at an inner end of the pushing screw cylinder (217), the front-pushing bearing seat (219) is installed on a transverse moving bottom plate (20995), a pair of first outer convex seats (2190) are installed on two sides of the front-pushing bearing seat (219), a fifth installation plate (2192) is installed at the other end of the transverse moving bottom plate (20995), a pair of upper extension support plates (2193) are installed on the fifth installation plate (2192) in an upward extending mode, second outer convex seats (2194) are installed on the outer walls of the upper extension support plates (2193), guide cylinders (2191) are installed between the first outer convex seats (2190) and the second outer convex seats (2194) on the same side, front-pushing screw rods (218) are arranged in the front-pushing screw cylinders (217), front-pushing end plates (2195) are arranged at the other ends of the front-pushing screw rods (218), third outer convex seats (2196) are installed on two sides of the front-pushing end plates (2195), front-pushing guide rods (2197) are installed on the third outer convex seats (2196), and the front-pushing guide rods (2197) are all penetrated through the guide cylinders (2191).
6. The wafer disk rounding device for chips according to claim 5, characterized in that:
the lifting mechanism (22) comprises a lifting back plate (225) arranged on a front push end plate (2195), lifting bearing seats (220) are arranged at the upper end and the lower end of the lifting back plate (225), four lifting guide rods (221) are arranged between the lifting bearing seats (220), a lifting motor (222) is arranged on the lifting bearing seat (220) at the upper end, an output shaft of the lifting motor (222) is connected with a lifting lead screw (223), a lifting seat (224) is arranged on the lifting lead screw (223), and the lifting guide rods (221) penetrate through the lifting seat (224);
slewing mechanism (23) are including installing in rotation drive bearing seat (230) of going up and down seat (224) one end, rotation drive motor (231) are installed to rotation drive bearing seat (230), the output shaft that rotates drive motor (231) has rotation drive wheel (232), rotation drive wheel (232) cover is equipped with rotation drive belt (233), rotation drive wheel (232) are located the one end of rotation drive belt (233), the other end of rotation drive belt (233) is equipped with the rotation and follows the wheel, the seat (224) goes up and down is located to the medial extremity that rotates from the wheel, the outside end that rotates from the wheel is equipped with fixed planking (235), fixed planking (235) upper end is equipped with upper plate (234), the other end of connecting upper plate (234) is installed in seat (224) goes up and down.
7. The wafer disc rounding device for the chip as claimed in claim 6, wherein the suction clamp mechanism (24) includes a rotating back plate (240) connected to an outer end of the rotating driven wheel, a pair of clamping cylinders (242) are installed at both ends of the rotating back plate (240), movable sleeves (243) are installed at movable ends of the clamping cylinders (242), guide rails (241) are installed at roots of the movable sleeves (243), the guide rails (241) are installed on the rotating back plate (240), folded clamp plates (244) are installed on the movable sleeves (243), suction nozzles are installed at lower ends of the folded clamp plates (244), connecting pipes (245) are installed at upper ends of the folded clamp plates (244), and the connecting pipes (245) are connected to the suction nozzles.
8. The wafer disc grinding device for the chips as claimed in claim 2, wherein the placing component (3) comprises a pair of mutually parallel zigzag fixing bottom plates (30) arranged on the flat plate (103), the inner walls of the zigzag fixing bottom plates (30) are provided with placing guide plates (31), a placing bottom plate (32) is arranged between the placing guide plates (31), the placing bottom plate (32) is provided with an upward extending block (33) in an upward extending manner, the upper end of the upward extending block (33) is provided with an arc placing piece (34), and the inner arc wall of the arc placing piece (34) is provided with placing arc grooves (35) in an equally spaced array along the axial direction.
9. The wafer disc rounding device for chips as claimed in claim 2, wherein the chucking assembly (40) includes a pushing mechanism, and a driving mechanism is provided at the other end of the pushing mechanism;
the pushing mechanism comprises a pushing installation platform (400) arranged on a flat plate (103), installation wing plates (4000) are arranged on two sides of the lower end of the pushing installation platform (400), a pair of pushing connection columns (401) are installed on the pushing installation platform (400) in an upward extending mode, a sixth installation plate (402) is arranged at the upper ends of the pushing connection columns (401), pushing bearing seats (408) are installed on the sixth installation plate (402), pushing driving bearing seats (403) are installed on the pushing connection columns (401), pushing driving motors (404) are installed on the pushing driving bearing seats (403), pushing driving wheels (405) are connected to output shafts of the pushing driving motors (404), pushing driving belts (406) are sleeved on the pushing driving wheels (405), the pushing driving wheels (405) are located at one ends of the pushing driving belts (406), pushing driven wheels (407) are arranged at the other ends of the pushing driving belts (406), pushing screw barrels (409) are arranged in the pushing driven wheels (407), the inner side end of the pushing screw cylinder (409) is arranged on a pushing bearing seat (408), a pushing screw rod (4090) is arranged in the pushing screw cylinder (409), a pushing end plate (4091) is arranged at the inner side end of the pushing screw rod (4090), a pushing rectangular plate (4092) is installed on the pushing end plate (4091), a pair of outward extending guide pillars (4093) is installed at the upper end of the pushing rectangular plate (4092) in an outward extending mode, an upward extending guide plate (4094) penetrates through the outward extending guide pillars (4093), and the lower end of the upward extending guide plate (4094) is installed on the pushing bearing seat (408);
the driving and rotating mechanism comprises four connecting angle plates (4095) arranged at four corners of a pushing rectangular plate (4092), a driving and rotating fixing plate (4096) is arranged at the other end of each connecting angle plate (4095), driving and rotating rods penetrate through the geometric center positions of the driving and rotating fixing plates (4096), driving and rotating outer disks (4097) are arranged at two ends of each driving and rotating rod, limiting wheels (4098) are arranged on the outer arc walls of the driving and rotating outer disks (4097) in a circumferential array manner, the limiting wheels (4098) are arranged on the driving and rotating fixing plates (4096), driving and rotating bearing seats (4099) are arranged at the upper ends of the driving and rotating fixing plates (4096), driving and rotating motors (40990) are arranged on the driving and rotating bearing seats (4099), output shafts of the driving and rotating motors (90) are connected with driving and rotating driving wheels (40991), the driving and rotating driving wheels (40992) are meshed with driving and rotating driven wheels (40992), the driving and rotating driven wheels (40992) are arranged on the driving and rotating outer disks (4097) positioned on the inner side of the driving and rotating bearing seats (40992), and rotating driven wheels (40993) are arranged on the driving and rotating driven wheels (40992), the inner wall of the clamping disc (40993) is provided with a soft rubber layer.
10. The wafer disc rounding device for the chip according to claim 9, wherein the rounding mechanism (41) comprises a pair of fixed legs (410) mounted on the plate (103), a pair of arc plates (411) are mounted at upper ends of the fixed legs (410), the arc plates (411) are respectively provided with mounting circular truncated cones (412) in an equally spaced array, a rounding wheel (414) is mounted between each pair of mounting circular truncated cones (412), a rounding ring groove (415) is formed on each rounding wheel (414), and rounding flannelette is arranged at the bottom of each rounding ring groove (415).
CN202110939117.6A 2021-08-16 2021-08-16 Wafer disc rounding device for chip Withdrawn CN113601314A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110939117.6A CN113601314A (en) 2021-08-16 2021-08-16 Wafer disc rounding device for chip

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Application Number Priority Date Filing Date Title
CN202110939117.6A CN113601314A (en) 2021-08-16 2021-08-16 Wafer disc rounding device for chip

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CN113601314A true CN113601314A (en) 2021-11-05

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115258288A (en) * 2022-08-10 2022-11-01 四川康特能药业有限公司 Filling and packaging device
CN115295476A (en) * 2022-10-08 2022-11-04 四川洪芯微科技有限公司 Chip demoulding device

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US5117590A (en) * 1988-08-12 1992-06-02 Shin-Etsu Handotai Co., Ltd. Method of automatically chamfering a wafer and apparatus therefor
US20040000326A1 (en) * 2000-03-29 2004-01-01 Ziemins Uldis A. Wafer edge cleaning utilizing polish pad material
CN206445639U (en) * 2017-02-09 2017-08-29 上饶市恒泰光学设备制造有限公司 A kind of lens aligner
CN209304254U (en) * 2018-12-26 2019-08-27 深圳佳利创科技有限公司 A kind of automatic round roller for grinding optical optical filter
CN213615751U (en) * 2020-09-10 2021-07-06 成都航天通宇通信技术有限公司 Thick grinding device in Ka frequency channel waveguide slot antenna border
CN113246004A (en) * 2021-06-08 2021-08-13 四川上特科技有限公司 Wafer end surface finish grinding device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5117590A (en) * 1988-08-12 1992-06-02 Shin-Etsu Handotai Co., Ltd. Method of automatically chamfering a wafer and apparatus therefor
US20040000326A1 (en) * 2000-03-29 2004-01-01 Ziemins Uldis A. Wafer edge cleaning utilizing polish pad material
CN206445639U (en) * 2017-02-09 2017-08-29 上饶市恒泰光学设备制造有限公司 A kind of lens aligner
CN209304254U (en) * 2018-12-26 2019-08-27 深圳佳利创科技有限公司 A kind of automatic round roller for grinding optical optical filter
CN213615751U (en) * 2020-09-10 2021-07-06 成都航天通宇通信技术有限公司 Thick grinding device in Ka frequency channel waveguide slot antenna border
CN113246004A (en) * 2021-06-08 2021-08-13 四川上特科技有限公司 Wafer end surface finish grinding device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115258288A (en) * 2022-08-10 2022-11-01 四川康特能药业有限公司 Filling and packaging device
CN115258288B (en) * 2022-08-10 2023-08-22 四川康特能药业有限公司 Filling and packaging device
CN115295476A (en) * 2022-10-08 2022-11-04 四川洪芯微科技有限公司 Chip demoulding device
CN115295476B (en) * 2022-10-08 2023-01-10 四川洪芯微科技有限公司 Chip demoulding device

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Application publication date: 20211105