CN113589906B - Computer hardware heat dissipation mechanism - Google Patents
Computer hardware heat dissipation mechanism Download PDFInfo
- Publication number
- CN113589906B CN113589906B CN202110970192.9A CN202110970192A CN113589906B CN 113589906 B CN113589906 B CN 113589906B CN 202110970192 A CN202110970192 A CN 202110970192A CN 113589906 B CN113589906 B CN 113589906B
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- China
- Prior art keywords
- cooling pipe
- pipe fitting
- cooling
- computer hardware
- heat dissipation
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- 230000007246 mechanism Effects 0.000 title claims abstract description 18
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 16
- 238000001816 cooling Methods 0.000 claims abstract description 67
- 238000006073 displacement reaction Methods 0.000 claims abstract description 14
- 239000000428 dust Substances 0.000 abstract description 21
- 238000007664 blowing Methods 0.000 abstract description 6
- 238000005057 refrigeration Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a computer hardware heat dissipation mechanism, which is characterized in that a limit frame is adopted to slidingly mount a cooling pipe fitting, and a blower and a suction fan are mounted in the cooling pipe fitting, so that the refrigeration and dust removal of hardware in a case are realized; according to the invention, the rotating structure is arranged to cooperate with the clamping jaw to adjust the angle of the cooling pipe fitting, so that the function switching between blowing and induced draft is realized, the cooling and dust removal of computer hardware are performed, the displacement device is arranged to adjust the height of the cooling pipe fitting, and the upper rack and the lower rack are arranged to adjust the horizontal position of the cooling pipe fitting, so that the heat dissipation can be performed at all positions in the computer case; the application provides a computer hardware cooling mechanism sets up the heat sink that can multidirectional removal in quick-witted incasement portion, cools down and dust removal work to the hardware to utilize the brush hair to sweep dust before the dust removal, improve computer hardware's life.
Description
Technical Field
The invention relates to the technical field of computer auxiliary devices, in particular to a computer hardware heat dissipation mechanism.
Background
Hardware (english name Hardware) is a short term for computer Hardware, and refers to a generic term for various physical devices in a computer system, which are composed of electronic, mechanical, and optoelectronic elements. The physical devices form an organic whole according to the requirements of the system structure to provide a material basis for the operation of computer software. The function of the hardware is to input and store programs and data, and to execute programs to process the data into a form that can be utilized.
However, a large amount of heat is inevitably generated in the use process of the electronic equipment, when the calculation or processing amount of the computer is large, the heat productivity of a main board or other hardware of the computer is also increased, and the heat is mutually transferred in each hardware, so that the temperature of the whole computer is increased, and the aging of electronic devices in the computer is accelerated. If the overheat temperature can cause the computer to be blocked, even the mainboard can be burnt, the service life of the computer is seriously influenced, certain economic loss is caused, and potential safety hazards exist.
Traditional computer hardware all adopts the mode that sets up the fan in quick-witted incasement to carry out the cooling work in the host computer, because the fan of rotation in-process is circular, shows that all can exist the cooling dead angle at quick-witted incasement under the prerequisite of removing fan or fixed fan, and the dust processing on hardware surface can't be carried out to traditional fan cooling mode, and the existence of dust makes the hardware unable in time dispel the heat to accelerate the damage process, consequently the cooling effect of traditional means is not good.
To above-mentioned problem, this application provides a computer hardware cooling mechanism, sets up the heat sink that can multidirectional removal in quick-witted incasement portion, cools down and dust removal work to the hardware to utilize the brush hair to sweep dust before the dust removal, improve computer hardware's life.
Disclosure of Invention
The invention aims to provide a computer hardware heat dissipation mechanism, wherein a cooling device capable of moving in multiple directions is arranged in a case, so that cooling and dust removal work is performed on hardware, dust is scraped by utilizing bristles before dust removal, and the service life of the computer hardware is prolonged.
The invention provides a computer hardware heat dissipation mechanism, comprising:
the cooling device is arranged inside the computer case; the cooling pipe fitting comprises a limiting frame, wherein a first square groove and a through groove are respectively formed in the front surface and the top of the limiting frame along the length direction, a plurality of cooling pipe fittings penetrate through the first square groove and the through groove in sequence, the cooling pipe fittings are slidably mounted in the limiting frame, the back of the limiting frame is connected with a sleeve, a first motor is arranged in the sleeve, the first motor is rotationally connected with a rotating shaft, and the first motor is electrically connected with a control end;
the clamping device is clamped outside the rotating shaft, and the other end of the clamping device is connected with the moving plate;
the displacement device is in threaded connection in the screw hole of the movable plate, a second motor is arranged, the second motor is electrically connected with the control end and drives the displacement device to rotate, and the movable plate is driven to move along the vertical direction.
Further, the cooling pipe fitting is a corner pipe fitting, one end of the cooling pipe fitting is located in the first square groove, the other end of the cooling pipe fitting is located in the through groove, a blower and a suction fan are respectively arranged at the pipe orifice of the cooling pipe fitting, a filter screen is arranged at the pipe orifice of the suction fan and brush hair is arranged at the pipe orifice of the blower.
Further, one end of the brush hair is connected with the pipe orifice of the cooling pipe fitting.
Further, a plurality of gears are arranged on the inner wall of the limiting frame, an upper rack is meshed with the upper portion of each gear, a lower rack is meshed with the lower portion of each gear, the upper rack and the lower rack are respectively connected with a cooling pipe fitting, any one of the gears is electrically connected with a third motor, and the third motor is electrically connected with a control end.
Further, the clamping device comprises clamping jaws, the clamping jaws are clamped outside the rotating shaft, the back of each clamping jaw is connected with a limiting piece, each limiting piece is arranged between two clamping pieces, and the two clamping pieces are connected with the moving plate.
Further, a threaded hole is formed in the surface of the movable plate, and the screw rod is in threaded connection with the threaded hole.
Further, the displacement device comprises a screw rod which is vertically arranged, the top and the bottom of the screw rod are connected with the inner wall of the computer case through a mounting plate, and a second motor is arranged between the mounting plate and the screw rod.
Compared with the prior art, the invention has the following remarkable advantages:
the invention provides a computer hardware heat dissipation mechanism, which is characterized in that a third motor is arranged to control a cooling pipe fitting to slide in a limiting frame, so that the horizontal adjustment of a cooling position is realized, a blower and a suction fan are arranged in the cooling pipe fitting, a rotating shaft is controlled through the rotation of the first motor, the positions of a blowing port and a suction port of the cooling pipe fitting are adjusted, and the functions of blowing, cooling, sucking and blowing dust are performed on hardware; meanwhile, due to the change of the position of the air port, the brush hair is contacted with the hardware to clean dust, so that the functions of refrigerating and removing dust of the hardware in the case are realized; according to the invention, the displacement device is arranged to adjust the height of the cooling pipe fitting, so that all parts in the computer case can be cooled and radiated, and the existence of cooling dead angles is avoided; the application provides a computer hardware cooling mechanism sets up the heat sink that can multidirectional removal in quick-witted incasement portion, cools down and dust removal work to the hardware to utilize the brush hair to sweep dust before the dust removal, improve computer hardware's life.
Drawings
FIG. 1 is a diagram showing the overall structure of a heat dissipation mechanism according to an embodiment of the present invention;
FIG. 2 is a block diagram of a cooling device according to an embodiment of the present invention;
FIG. 3 is a diagram of a cooling pipe fitting according to an embodiment of the present invention;
FIG. 4 is a gear mounting block diagram provided by an embodiment of the present invention;
fig. 5 is a block diagram of a limiting frame according to an embodiment of the present invention;
FIG. 6 is a block diagram of a clamping device according to an embodiment of the present invention;
fig. 7 is a structural diagram of a displacement device according to an embodiment of the present invention.
Description of the drawings: 1-cooling device, 2-clamping device, 3-displacement device, 101-cooling pipe fitting, 102-limiting frame, 103-sleeve, 104-rotating shaft, 1011-blower, 1012-suction fan, 1013-filter screen, 1014-bristle, 1021-gear, 1022-upper rack, 1023-lower rack, 201-clamping jaw, 202-limiting piece, 203-clamping piece, 204-moving plate, 301-screw, 302-mounting plate.
Detailed Description
The following description of the embodiments of the present invention, taken in conjunction with the accompanying drawings, will clearly and completely describe the embodiments of the present invention, and it is evident that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
Referring to fig. 1-7, the present invention provides a computer hardware heat dissipation mechanism, comprising:
the cooling device 1 is arranged inside the computer case; as shown in fig. 1 and fig. 5, the cooling device 1 includes a limiting frame 102, a first square groove and a through groove are respectively formed in the front and top of the limiting frame 102 along the length direction, a plurality of cooling pipes 101 pass through the first square groove and the through groove in sequence, the cooling pipes 101 are slidably mounted in the limiting frame 102, the cooling pipes 101 slide in the limiting frame 102 to realize the change of cooling parts, the through groove is used for limiting the sliding motion, the back of the limiting frame 102 is connected with a sleeve 103, a first motor is arranged in the sleeve 103, the first motor is rotationally connected with a rotating shaft 104, the first motor is electrically connected with a control end and is used for driving the limiting frame 102 to rotate around the rotating shaft 104, up-down sweeping of the cooling positions is realized, the cooling positions are convenient to be subjected to the matching change of air suction and air blowing, bristles 1014 are mounted at the pipe orifices of the air blowers 1011, one ends of the bristles 1014 are connected with the pipe orifices of the cooling pipes 101, the bottoms of the bristles 1014 are sagged due to gravity when the cooling pipes 101 rotate, and dirt is swept from the surface of hardware.
Referring to fig. 3, the cooling pipe fitting 101 is a corner pipe fitting, one end of the cooling pipe fitting 101 is located in a first square groove, the other end of the cooling pipe fitting 101 is located in a through groove, a blower 1011 and a suction fan 1012 are respectively arranged at the pipe orifice of the cooling pipe fitting 101, the blower 1011 is used for cooling computer hardware, the suction fan 1012 is used for sucking dust on the surface of the hardware, the service life of the hardware is prolonged, a filter screen 1013 is arranged at the pipe orifice of the suction fan 1012 and close to the pipe orifice of the suction fan 1012, the sucked dust is isolated at the filter screen 1013, and the filter screen is replaced to realize self-cleaning of the device. The pipe orifice close to the blower is connected with a gas collecting hopper, so that the pressure of blown gas is increased, and the cooling effect of the air flow is enhanced.
Example 1
Referring to fig. 4, a plurality of gears 1021 are mounted on the inner wall of the limiting frame 102, any one gear 1021 is actively rotated under the control of a motor, other gears are driven gears, an upper rack 1022 is meshed with the upper side of the gear 1021, a lower rack 1023 is meshed with the lower side of the gear 1021, the upper rack 1022 and the lower rack 1023 are respectively connected with the cooling pipe 101, any one gear 1021 is electrically connected with a third motor, the third motor is electrically connected with a control end, the third motor controls the driving gear to rotate, and due to the action of transmission, the upper rack 1022 and the lower rack 1023 are driven to move, so that the clamping devices 2 connected with the upper rack 1022 and the lower rack 1023 are respectively driven to move, a plurality of horizontal movements of the limiting frame 102 are realized, and further, the temperature reduction positions are respectively changed.
Example 2
Referring to fig. 6, a clamping device 2 is clamped outside the rotating shaft 104, and the other end of the clamping device 2 is connected with a moving plate 204;
the clamping device 2 comprises a clamping jaw 201, the clamping jaw 201 comprises two clamping pieces, a rotating structure is clamped in the clamping jaw 201, the back of the clamping jaw 201 is connected with a limiting piece 202, the limiting piece 202 is arranged between the two clamping pieces 203, the clamping device 2 can be adjusted by adjusting the relative positions of the limiting piece 202 and the clamping pieces 203, and the two clamping pieces 203 are connected with a moving plate 204.
Referring to fig. 7, the displacement device 3 is screwed in a screw hole of the moving plate 204, and a second motor is provided, and is electrically connected with the control end to drive the displacement device 3 to rotate and drive the moving plate 204 to move along the vertical direction;
the displacement device 3 comprises a screw 301 which is vertically arranged, the top and the bottom of the screw 301 are connected with the inner wall of the computer case through a mounting plate 302, a second motor is arranged between the mounting plate 302 and the screw 301, and the second motor is started to drive the screw 301 to rotate, so that the moving plate 204 moves up and down.
The surface of the moving plate 204 is provided with a threaded hole, and the screw 301 is screwed into the threaded hole.
Example 3
The rotating structure comprises a sleeve 103, the sleeve 103 is rotatably arranged outside a rotating shaft 104, and the pipe wall of the sleeve 103 is connected with a limiting frame 102. The clamping device 2 is clamped outside the rotating shaft 104, and the sleeve 103 and the rotating shaft 104 relatively rotate, so that the angle adjustment of the whole cooling device 1 is realized.
Example 4
An infrared temperature image acquisition device is arranged in a pipe orifice close to the blower 1011 and is used for acquiring an infrared image of the inside of the whole case;
acquiring physical image information of hardware in the case, carrying out matching fusion with an infrared temperature image of the same visual angle, extracting characteristic points of the physical image and the infrared temperature image, and carrying out coordinate matching of the characteristic points;
the over-temperature part and the coordinates thereof in the infrared temperature image are analyzed, and the accurate fusion of the two images is realized, so that the over-temperature position is positioned according to the infrared image, the cooling device 1, the clamping device 2 and the displacement device 3 are controlled to cooperate to perform positioning and cooling, and the air blowing port and the air suction port are enabled to work circularly.
The method for matching and fusing the physical image information and the infrared temperature image comprises the following steps:
acquiring an infrared temperature image and a physical image of the same visual angle;
extracting characteristic points of the infrared temperature image and the physical image, and carrying out position coordinate registration on the same characteristic points of the infrared temperature image and the physical image;
performing color space conversion on the infrared temperature image and the real object image to respectively obtain a brightness component, a tone component and a saturation component of the infrared temperature image and the real object image;
and fusing the brightness component, the tone component and the saturation component of the two components, and performing color space inverse conversion to obtain a color fused image. Different temperature dividing values are obtained according to the color difference, and the over-temperature area is judged according to the preset value.
The foregoing disclosure is merely illustrative of some embodiments of the invention, but the embodiments are not limited thereto and variations within the scope of the invention will be apparent to those skilled in the art.
Claims (6)
1. A computer hardware heat dissipation mechanism, comprising:
the cooling device (1) is arranged inside the computer case; the cooling pipe fitting cooling device comprises a limiting frame (102), wherein a first square groove and a through groove are respectively formed in the front surface and the top of the limiting frame (102) along the length direction, a plurality of cooling pipe fittings (101) penetrate through the first square groove and the through groove in sequence, the cooling pipe fittings are slidably mounted in the limiting frame (102), a sleeve (103) is connected to the back of the limiting frame (102), a first motor is arranged in the sleeve (103), the first motor is rotationally connected with a rotating shaft (104), and the first motor is electrically connected with a control end;
the clamping device (2) is clamped outside the rotating shaft (104), and the other end of the clamping device (2) is connected with the moving plate (204);
the displacement device (3) is in threaded connection with the screw hole of the moving plate (204); the displacement device (3) comprises a screw rod (301) which is vertically arranged, the top and the bottom of the screw rod (301) are connected with the inner wall of the computer case through a mounting plate (302), and a second motor is arranged between the mounting plate (302) and the screw rod (301); the second motor is electrically connected with the control end and drives the displacement device (3) to rotate and drive the moving plate (204) to move along the vertical direction.
2. The heat dissipation mechanism of computer hardware as set forth in claim 1, wherein the cooling pipe fitting (101) is a corner pipe fitting, one end of the cooling pipe fitting (101) is located in the first square groove, the other end of the cooling pipe fitting (101) is located in the through groove, a blower (1011) and a suction fan (1012) are respectively disposed at a pipe orifice of the cooling pipe fitting (101), a filter screen (1013) is disposed at a pipe orifice close to the suction fan (1012), and bristles (1014) are mounted at a pipe orifice close to the blower (1011).
3. A computer hardware heat dissipation mechanism as defined in claim 2 wherein one end of said bristles (1014) is connected to the mouth of said cooling tube (101).
4. The heat dissipation mechanism for computer hardware as defined in claim 2, wherein a plurality of gears (1021) are installed on the inner wall of the limiting frame (102), an upper rack (1022) is meshed above the gears (1021), a lower rack (1023) is meshed below the gears (1021), the upper rack (1022) and the lower rack (1023) are respectively connected with the cooling pipe (101), any one of the gears (1021) is electrically connected with a third motor, and the third motor is electrically connected with the control end.
5. A computer hardware heat dissipation mechanism according to claim 1, wherein the clamping device (2) comprises clamping jaws (201), the clamping jaws (201) are clamped outside the rotating shaft (104), the back of the clamping jaws (201) is connected with a limiting piece (202), the limiting piece (202) is installed between two clamping pieces (203), and the two clamping pieces (203) are connected with a moving plate (204).
6. A computer hardware heat dissipation mechanism as defined in claim 5, wherein a threaded hole is provided on a surface of the movable plate (204), and the screw (301) is screwed into the threaded hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110970192.9A CN113589906B (en) | 2021-08-23 | 2021-08-23 | Computer hardware heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110970192.9A CN113589906B (en) | 2021-08-23 | 2021-08-23 | Computer hardware heat dissipation mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113589906A CN113589906A (en) | 2021-11-02 |
| CN113589906B true CN113589906B (en) | 2024-04-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110970192.9A Active CN113589906B (en) | 2021-08-23 | 2021-08-23 | Computer hardware heat dissipation mechanism |
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| Country | Link |
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| CN (1) | CN113589906B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008159925A (en) * | 2006-12-25 | 2008-07-10 | Toshiba Corp | Electronic apparatus |
| CN211403376U (en) * | 2020-04-14 | 2020-09-01 | 河北科技学院 | Computer radiator |
| CN211454467U (en) * | 2020-03-03 | 2020-09-08 | 成都师范学院 | Computer machine case dust collector |
| CN211878539U (en) * | 2020-06-02 | 2020-11-06 | 邓政 | Computer machine case dust collector |
| CN213210934U (en) * | 2020-11-20 | 2021-05-14 | 陈青花 | Computer machine case heat dissipation air current guiding device |
-
2021
- 2021-08-23 CN CN202110970192.9A patent/CN113589906B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008159925A (en) * | 2006-12-25 | 2008-07-10 | Toshiba Corp | Electronic apparatus |
| CN211454467U (en) * | 2020-03-03 | 2020-09-08 | 成都师范学院 | Computer machine case dust collector |
| CN211403376U (en) * | 2020-04-14 | 2020-09-01 | 河北科技学院 | Computer radiator |
| CN211878539U (en) * | 2020-06-02 | 2020-11-06 | 邓政 | Computer machine case dust collector |
| CN213210934U (en) * | 2020-11-20 | 2021-05-14 | 陈青花 | Computer machine case heat dissipation air current guiding device |
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| Publication number | Publication date |
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| CN113589906A (en) | 2021-11-02 |
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