CN113583607A - Protective adhesive composition, display panel preparation method and display panel - Google Patents
Protective adhesive composition, display panel preparation method and display panel Download PDFInfo
- Publication number
- CN113583607A CN113583607A CN202110993621.4A CN202110993621A CN113583607A CN 113583607 A CN113583607 A CN 113583607A CN 202110993621 A CN202110993621 A CN 202110993621A CN 113583607 A CN113583607 A CN 113583607A
- Authority
- CN
- China
- Prior art keywords
- protective
- composition
- display panel
- protective adhesive
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 179
- 239000000853 adhesive Substances 0.000 title claims abstract description 111
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 111
- 239000000203 mixture Substances 0.000 title claims abstract description 103
- 238000002360 preparation method Methods 0.000 title abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 34
- 239000000178 monomer Substances 0.000 claims abstract description 24
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 18
- 238000005452 bending Methods 0.000 claims description 75
- 238000000034 method Methods 0.000 claims description 17
- 238000001723 curing Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000007639 printing Methods 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 8
- 238000000016 photochemical curing Methods 0.000 claims description 6
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 4
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 claims description 4
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 claims description 4
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 claims description 4
- MADNRAFNQOYQEW-UHFFFAOYSA-N 2-methyl-4-(6-prop-2-enoyloxyhexoxy)benzoic acid Chemical compound CC1=CC(OCCCCCCOC(=O)C=C)=CC=C1C(O)=O MADNRAFNQOYQEW-UHFFFAOYSA-N 0.000 claims description 4
- ILQMZWNFHVWTII-UHFFFAOYSA-N 4-(5-prop-2-enoyloxypentoxy)benzoic acid Chemical compound OC(=O)C1=CC=C(OCCCCCOC(=O)C=C)C=C1 ILQMZWNFHVWTII-UHFFFAOYSA-N 0.000 claims description 4
- FLPSQLAEXYKMGQ-UHFFFAOYSA-N 4-(6-prop-2-enoyloxyhexoxy)benzoic acid Chemical compound OC(=O)C1=CC=C(OCCCCCCOC(=O)C=C)C=C1 FLPSQLAEXYKMGQ-UHFFFAOYSA-N 0.000 claims description 4
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 4
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 claims description 4
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 4
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 claims description 4
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 4
- 229940119545 isobornyl methacrylate Drugs 0.000 claims description 4
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 abstract description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 5
- 239000001301 oxygen Substances 0.000 abstract description 5
- 229910052760 oxygen Inorganic materials 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 230000000903 blocking effect Effects 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 238000004132 cross linking Methods 0.000 abstract description 3
- 238000007711 solidification Methods 0.000 abstract description 3
- 230000008023 solidification Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 3
- 238000010146 3D printing Methods 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000006552 photochemical reaction Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000002390 rotary evaporation Methods 0.000 description 2
- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035772 mutation Effects 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
- C09J167/06—Unsaturated polyesters having carbon-to-carbon unsaturation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application provides a protective adhesive composition, a preparation method of a display panel and the display panel. The protective glue composition comprises 30-50% of oligomer, 30-50% of monomer, 10-30% of carboxylic acid mesogen and 4-10% of photoinitiator. When the composition of the protective adhesive provided by the application is subjected to polymerization reaction, the photoinitiator initiates monomer polymerization, the carboxylic acid mesogen generates supermolecule cross-linking reaction, and the polymerization and solidification of the composition of the protective adhesive are completed in a short time. The protective adhesive formed after the protective adhesive composition is cured has the function of preventing scratches and can also play a role in blocking water and oxygen.
Description
Technical Field
The application relates to the field of display, in particular to a protective adhesive composition, a display panel preparation method and a display panel.
Background
With the higher requirements of people on display devices, the frame of the display screen is smaller and smaller, so that better visual experience is obtained. At present, the narrow-frame technology is developed to reversely bend a connecting area between a display area and a driving circuit board, and the connecting area is bent to the back of a display screen, so that a narrower or even frameless display screen is obtained. The connection zone is called the kink zone. Usually, a protective adhesive is required to be arranged above the film layer in the bending region. The protective glue has the functions of protecting the film layer, preventing scratches and the like, and also has the function of reducing the risk of cracks and even fracture failure of the circuit during bending.
When the protective paste is formed, it may cause the starting position of the bending region to be free from the protective paste or the protective paste to be applied to the display region. The non-protection glue at the bending starting position can cause the stress mutation during bending, so that the position is easy to have a bevel, and the circuit is directly failed. The protective glue applied to the display area will affect the display effect at the edge of the display area. Therefore, it is desirable to provide a protective adhesive composition to achieve a narrow frame or no frame of the display panel.
Disclosure of Invention
The application provides a protective adhesive composition, a display panel and a preparation method thereof, so as to realize narrow frame or no frame of the display panel.
The application provides a protective glue composition, which comprises 30-50% of oligomer, 30-50% of monomer, 10-30% of carboxylic acid mesogen and 4-10% of photoinitiator.
In some embodiments, the oligomer comprises one or more of an epoxy acrylate, a urethane acrylate, a polyether acrylate, a polyester acrylate, or an acrylic resin.
In some embodiments, the monomer comprises one or more of isobornyl acrylate, isobornyl methacrylate, hydroxyethyl methacrylate, tripropylene glycol diacrylate, 1, 6-hexanediol diacrylate, diethylene glycol diacrylate, neopentyl glycol diacrylate, trimethylolpropane triacrylate, or pentaerythritol triacrylate.
In some embodiments, the carboxylic acid mesogen comprises one or more of 4- ((6- (acryloyloxy) hexyl) oxy) benzoic acid, 4- ((6- (acryloyloxy) hexyl) oxy) -2-methylbenzoic acid, 4- ((5- (acryloyloxy) pentyl) oxy) benzoic acid, or 4- (3- (acryloyloxypropoxy)) benzoic acid.
In some embodiments, the photoinitiator comprises one or more of phenylbis (2,4, 6-trimethylbenzoyl) phosphine oxide, 1-hydroxy-cyclohexyl-phenyl-methanone, or 2, 2-dimethoxy-2-phenylacetophenone.
The application provides a preparation method of a display panel, which comprises the following steps:
providing a display panel, wherein the display panel is provided with a bending area;
printing and curing the composition of the protective adhesive at the bending area to form the protective adhesive, wherein the composition of the protective adhesive comprises the composition of the protective adhesive as described above.
In some embodiments, the printing and curing the composition of the protective paste at the inflection zone to form the protective paste comprises:
establishing a 3D model of the protective glue in the bending area;
coating the composition of the protective adhesive on the bending area;
and carrying out photocuring on the composition of the protective adhesive in the bending area according to the 3D model to form the protective adhesive.
In some embodiments, the printing and curing the composition of the protective paste at the bending region to form the protective paste further comprises:
and removing the uncured composition of the protective adhesive.
In some embodiments, the starting position of the protective glue is the starting position of the bending region, and the ending position of the protective glue is the ending position of the bending region.
In some embodiments, the protective glue has a thickness of 5 to 150 microns.
The application provides a display panel, which is prepared by adopting the preparation method of the display panel.
The application provides a protective adhesive composition, a preparation method of a display panel and the display panel. The protective glue composition comprises 30-50% of oligomer, 30-50% of monomer, 10-30% of carboxylic acid mesogen and 4-10% of photoinitiator. When the composition of the protective adhesive is subjected to polymerization reaction, the photoinitiator initiates monomer polymerization, the carboxylic acid mesogen generates supermolecule cross-linking reaction, and the polymerization and solidification of the composition of the protective adhesive are completed in a short time. The protective adhesive formed after the protective adhesive composition is cured has the function of preventing scratches and can also play a role in blocking water and oxygen.
Drawings
In order to more clearly illustrate the technical solutions in the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a flowchart of a first embodiment of a method for manufacturing a display panel provided in the present application.
Fig. 2 is a schematic structural diagram of a display panel to be formed with a protective paste according to an embodiment of the present disclosure.
Fig. 3 is a schematic structural diagram of a display panel after forming a protective adhesive according to an embodiment of the present disclosure.
Fig. 4 is a flowchart of a second embodiment of a method for manufacturing a display panel provided in the present application.
Fig. 5 is a schematic structural diagram of a display panel after forming a protective adhesive according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The present application provides a composition of protective adhesive, which is described in detail with reference to the following specific examples.
The protective glue composition comprises 30-50% of oligomer, 30-50% of monomer, 10-30% of carboxylic acid mesogen and 4-10% of photoinitiator. The composition of the protective glue is cured to form the protective glue. Oligomers and monomers are the main components of the composition of the protective gum. The composition of the protective adhesive provided by the application can be used as a raw material for two-photon polymerization 3D printing.
Specifically, the molar ratio of the oligomer in the composition of the protective gel may be 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49% or 50%. The molar proportion of monomers in the composition of the protective glue may be 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49% or 50%. The molar proportion of carboxylic acid mesogens in the composition of the protective colloid may be 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29% or 30%. The molar proportion of photoinitiator in the composition of the protective gel may be 4%, 5%, 6%, 7%, 8%, 9% or 10%.
According to the application, the molar ratio of oligomer in the composition of the protective adhesive is controlled to be 30-50%, the molar ratio of monomer is 30-50%, the molar ratio of carboxylic acid mesogen is 10-30%, the molar ratio of photoinitiator is 4-10%, and the viscosity and the adhesive force of the composition of the protective adhesive are controlled to be in a proper range, so that the protective adhesive formed after the composition of the protective adhesive is cured has excellent performance.
When the composition of the protective adhesive provided by the application is subjected to polymerization reaction, the photoinitiator initiates monomer polymerization, the carboxylic acid mesogen generates supermolecule cross-linking reaction, and the polymerization and solidification of the composition of the protective adhesive are completed in a short time. The protective adhesive formed after the protective adhesive composition is cured has the function of preventing scratches and can also play a role in blocking water and oxygen.
In some embodiments, the oligomer comprises one or more of an epoxy acrylate, a urethane acrylate, a polyether acrylate, a polyester acrylate, or an acrylic resin.
The oligomer is one of the largest components in the composition of the protective gum. The oligomer is the matrix resin of the protective gum composition and is the basic backbone of the protective gum that constitutes the cured product. The oligomer can control the hardness, flexibility, adhesive force and aging resistance of the protective adhesive of the cured product. The oligomer provided by the application has small relative molecular mass and low viscosity, and can realize high-speed curing, so that the performance of the formed protective adhesive can be improved.
In some embodiments, the monomer comprises one or more of isobornyl acrylate, isobornyl methacrylate, hydroxyethyl methacrylate, tripropylene glycol diacrylate, 1, 6-hexanediol diacrylate, diethylene glycol diacrylate, neopentyl glycol diacrylate, trimethylolpropane triacrylate, or pentaerythritol triacrylate.
The monomer is a polymerizable monomer. The polymerizable monomer is one of the largest components in the composition of the protective gum. The polymerizable monomer provided by the application is an acrylic polymerizable monomer. The acrylic polymerizable monomer has the characteristics of high transparency, good chemical stability, good weather resistance and the like, so that the performance of the formed protective adhesive can be improved.
In some embodiments, the carboxylic acid mesogen comprises one or more of 4- ((6- (acryloyloxy) hexyl) oxy) benzoic acid, 4- ((6- (acryloyloxy) hexyl) oxy) -2-methylbenzoic acid, 4- ((5- (acryloyloxy) pentyl) oxy) benzoic acid, or 4- (3- (acryloyloxypropoxy)) benzoic acid.
Mesogens are nanoparticle superstructures that are self-assembled from nanocrystals in a crystallographically ordered manner. The carboxylic acid mesogen has a carboxyl functional group. Therefore, hydrogen bonds can be formed between the mesogenic molecules of the carboxylic acid. The hydrogen bonds act as supramolecular cross-linkers upon polymerization of the protective gel, thereby increasing the rate of polymerization curing of the composition of the protective gel.
In some embodiments, the photoinitiator comprises one or more of phenylbis (2,4, 6-trimethylbenzoyl) phosphine oxide, 1-hydroxy-cyclohexyl-phenyl-methanone, or 2, 2-dimethoxy-2-phenylacetophenone.
The photoinitiator can directly initiate two-photon photopolymerization, and acrylic polymer monomers in the composition of the protective adhesive can be completely crosslinked and cured in a short time, so that the polymerization curing rate of the composition of the protective adhesive is improved.
The application also provides a preparation method of the protective adhesive composition. Under the yellow light environment, 30 to 50 percent of oligomer, 30 to 50 percent of monomer, 10 to 30 percent of carboxylic acid mesogen and 4 to 10 percent of photoinitiator are dissolved in solvent and evenly stirred. And heating and rotary-evaporating the uniformly mixed solution by using a rotary evaporator to remove the solvent, and standing for 24 hours to obtain the protective adhesive composition. Wherein the heating rotary evaporation temperature is 40-60 ℃. Specifically, the heating temperature of the rotary evaporation may be 40 degrees celsius, 45 degrees celsius, 50 degrees celsius, 55 degrees celsius, or 60 degrees celsius.
Specifically, the molar ratio of the oligomer in the composition of the protective gel may be 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49% or 50%. The molar proportion of monomers in the composition of the protective glue may be 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49% or 50%. The molar proportion of carboxylic acid mesogens in the composition of the protective colloid may be 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29% or 30%. The molar proportion of photoinitiator in the composition of the protective gel may be 4%, 5%, 6%, 7%, 8%, 9% or 10%.
In some embodiments, the solvent comprises one or more of tetrahydrofuran, dichloromethane, or chlorobenzene.
In some embodiments, the oligomer comprises one or more of an epoxy acrylate, a urethane acrylate, a polyether acrylate, a polyester acrylate, or an acrylic resin.
In some embodiments, the monomer comprises one or more of isobornyl acrylate, isobornyl methacrylate, hydroxyethyl methacrylate, tripropylene glycol diacrylate, 1, 6-hexanediol diacrylate, diethylene glycol diacrylate, neopentyl glycol diacrylate, trimethylolpropane triacrylate, or pentaerythritol triacrylate.
In some embodiments, the carboxylic acid mesogen comprises one or more of 4- ((6- (acryloyloxy) hexyl) oxy) benzoic acid, 4- ((6- (acryloyloxy) hexyl) oxy) -2-methylbenzoic acid, 4- ((5- (acryloyloxy) pentyl) oxy) benzoic acid, or 4- (3- (acryloyloxypropoxy)) benzoic acid.
In some embodiments, the photoinitiator comprises one or more of phenylbis (2,4, 6-trimethylbenzoyl) phosphine oxide, 1-hydroxy-cyclohexyl-phenyl-methanone, or 2, 2-dimethoxy-2-phenylacetophenone.
The preparation method of the protective adhesive composition is simple to operate.
Referring to fig. 1-3, fig. 1 is a flowchart illustrating a method for manufacturing a display panel according to a first embodiment of the present disclosure. Fig. 2 is a schematic structural diagram of a display panel to be formed with a protective paste according to an embodiment of the present disclosure. Fig. 3 is a schematic structural diagram of a display panel after forming a protective adhesive according to an embodiment of the present disclosure.
Step B10: providing a display panel, wherein the display panel is provided with a bending area.
Referring to fig. 2, the display panel 100 includes a driving circuit layer 20, a light emitting functional layer 30, and a thin film encapsulation layer 40 sequentially stacked on a substrate 10.
The substrate 10 may be a glass substrate or a flexible substrate. The material of the substrate 10 is not limited herein. The driving circuit layer 20 includes a plurality of thin film transistors. The thin film transistor includes an active layer, a gate insulating layer, a gate electrode, an interlayer dielectric layer, a source electrode, a drain electrode, and a passivation layer. The light emitting function layer 30 includes a plurality of light emitting cells. The light emitting unit includes an anode layer, a light emitting layer, and a cathode layer sequentially stacked. The thin film encapsulation layer 40 may be formed of a laminate of an inorganic encapsulation layer-an organic encapsulation layer-an inorganic encapsulation layer.
The display panel 100 further includes a display area 100a, a bending area 100b, and a binding area 100 c. The bending region 100b is located between the display region 100a and the binding region 100 c. The driver chip 50 and the flexible circuit board 60 are bonded to the bonding region 100 c. The bending region 100b is provided with a metal trace (not shown).
Step B20: printing and curing the composition of the protective adhesive at the bending area to form the protective adhesive, wherein the composition of the protective adhesive comprises the composition of the protective adhesive as described above.
Referring to fig. 3, the composition of the protective adhesive is printed and cured in the bending area 100b to form the protective adhesive 70. The starting position of the protective adhesive 70 is the starting position of the bending region 100 b. The end position of the protective adhesive 70 is the end position of the bending region 100 b. The protective adhesive 70 covers the metal traces in the bending region 100b to protect the metal traces in the bending region 100b, so as to reduce the risk of breaking the metal traces in the subsequent bending process and disperse the stress on the metal traces.
3D printing principle: is a program for converting the appearance of an object to be printed into a controllable motion platform or a printing nozzle through computer modeling. And controlling a printing system by a computer to perform layered manufacturing and layer-by-layer superposition to obtain a target three-dimensional product.
According to the preparation method of the display panel, the protective adhesive 70 is formed by printing and curing the protective adhesive composition on the bending area 100b, the protective adhesive 70 can be formed in the bending area 100b, and the protective adhesive 70 covers the metal wires of the bending area 100b to protect the metal wires of the bending area 100b, so that the risk of breaking the metal wires in a subsequent bending process is reduced, and the stress on the metal wires is dispersed.
In some embodiments, printing and curing the composition of the protective gel at the inflection zone to form the protective gel comprises:
step B21: and establishing a 3D model of the protective glue in the bending area.
A 3D model of the protective glue in the bending zone 100b is drawn by a computer. The starting position of the 3D model is the starting position of the bending region 100 b. The end position of the 3D model is the end position of the inflection region 100 b.
Step B22: and coating the composition of the protective adhesive on the bending area.
The composition of the protective paste is applied to the bending region 100b to provide a printed raw material for printing. The coating precision does not need to be controlled when the composition of the protective adhesive is coated. But it is necessary to ensure that the entire bending region 100b is covered with the composition of the protective paste and the film thickness uniformity is good. The coating can be performed by various coating methods such as slit coating, spin coating, or dot coating.
In some embodiments, the thickness of the composition of the coated protective gel is from 5 microns to 150 microns.
Specifically, the thickness of the composition of the coated protective gel may be 5 micrometers, 10 micrometers, 20 micrometers, 30 micrometers, 40 micrometers, 50 micrometers, 60 micrometers, 70 micrometers, 80 micrometers, 90 micrometers, 100 micrometers, 110 micrometers, 120 micrometers, 130 micrometers, 140 micrometers, or 150 micrometers.
The protective adhesive formed after the composition of the coated protective adhesive is polymerized and cured can protect the metal wiring, and when the composition of the coated protective adhesive is too thin, the protective adhesive formed after curing can not protect the metal wiring. When the thickness of the coated protective adhesive composition is too thick, the protective adhesive formed by curing is too thick, which is not favorable for preparing a display panel with a narrow frame or without a frame. Therefore, the thickness of the composition of the protective adhesive coated by the protective adhesive is controlled to be 5-150 micrometers, and the preparation of the narrow-frame or frameless display panel is facilitated on the premise that the metal wiring is not corroded by water and oxygen.
Step B23: and carrying out photocuring on the composition of the protective adhesive in the bending area according to the 3D model to form the protective adhesive.
And forming the protective adhesive 70 by photocuring the protective adhesive composition in the bending region by using laser or femtosecond laser according to the 3D model. The application adopts femtosecond laser to photo-cure the composition of the protective adhesive in the bending region to form the protective adhesive 70, which cannot be limited. Specifically, the 3D model to be photocured is converted into a control code to control the computer, so that the computer can control the laser to move according to the 3D model designed in advance, and the composition of the protective adhesive at the corresponding position is polymerized and cured to form the protective adhesive 70, so that the composition of the protective adhesive at the bending region 100b is polymerized and cured to form the protective adhesive 70 according to the designed 3D model.
Femtosecond is a measuring unit for measuring time. A femtosecond laser is a laser that operates in a pulsed fashion. The femtosecond laser has the characteristics of extremely short duration, high instantaneous power, small focused diameter and the like. The two-photon polymerization 3D printing adopting the femtosecond laser as a light source can manufacture a nanoscale three-dimensional structure with any shape and high resolution.
In some embodiments, the femtosecond laser has a pulse width of 50 femtoseconds to 200 femtoseconds.
Specifically, the pulse width of the femtosecond laser may be 50 femtoseconds, 60 femtoseconds, 70 femtoseconds, 80 femtoseconds, 90 femtoseconds, 100 femtoseconds, 110 femtoseconds, 120 femtoseconds, 130 femtoseconds, 140 femtoseconds, or 150 femtoseconds.
The femtosecond laser has small scattering and high penetration rate in a medium. This application is 50 femtoseconds to 200 femtoseconds through the pulse width of control femto second laser, can improve the precision that the protection was glued and is printed.
In some embodiments, after printing and curing the composition of the protective paste in the bending area to form the protective paste, the method further comprises:
step B30: and removing the uncured composition of the protective adhesive.
In the printing process, the composition of the protective adhesive can generate two-photon absorption at a focus with high photon intensity, so that the composition of the liquid protective adhesive is initiated to polymerize and solidify, and a three-dimensional structure with any shape can be processed by controlling the position distribution of a solidified area in space. Only controlling the intensity of the incident light to ensure that the intensity of the incident light in the area outside the focus is not enough to generate the two-photon absorption effect, and only generating the two-photon absorption at the focus to generate the photochemical reaction. I.e. the photochemical reaction can be limited to a very small area near the focal point, while the rest of the beam path is hardly affected. And moving the focus according to the designed path, and processing a three-dimensional structure with a specified shape in the protective adhesive. While the areas not scanned by the laser protect the glue composition from polymerization curing. The composition of the protective gum that is not polymerized cured is then removed.
In some embodiments, the solvent of the composition for removing the uncured protective gum includes one or both of isopropyl alcohol or ethyl alcohol.
Isopropanol and ethanol are both environmentally friendly solvents and are easily removed. According to the application, the composition of the uncured protective adhesive is removed by using isopropanol or ethanol, and then the cured protective adhesive is air-dried, so that the protective adhesive with uniform film thickness and good precision is obtained in the bending area, and meanwhile, the composition of the protective adhesive in other areas is ensured to be not available.
In some embodiments, the starting position of the protection adhesive 70 is the starting position of the bending region 100b, and the ending position of the protection adhesive 70 is the ending position of the bending region 100 b.
When the starting position of the bending region 100b is not provided with the protective adhesive 70, the more uniform starting point of the protective adhesive 70 during bending is a stress discontinuity point, so that the bending region 100b does not present a regular arc shape after bending. In addition, the bending starting position has no protective glue 70 or the stepped area is subjected to corner folding, which may cause the metal routing to fail. This application is through the initial position that 70 was glued in the control protection for the initial position of bending zone 100b, and 70 is glued in the protection the termination position for bending zone 100 b's terminal position, can improve bending zone 100b and form the position accuracy that 70 was glued in the protection, avoids gluing 70 because of the protection and coating to the display area 100a edge, influences the display area 100a edge display effect, can also avoid simultaneously causing the metal to walk the line inefficacy because of 70 deletions are glued in the protection.
In some embodiments, the thickness of the protective gel 70 is 5 to 150 microns.
Specifically, the thickness of the protective adhesive 70 may be 5 micrometers, 10 micrometers, 20 micrometers, 30 micrometers, 40 micrometers, 50 micrometers, 60 micrometers, 70 micrometers, 80 micrometers, 90 micrometers, 100 micrometers, 110 micrometers, 120 micrometers, 130 micrometers, 140 micrometers, or 150 micrometers.
When the thickness of the protective adhesive 70 is too thin, the protective adhesive 70 cannot protect the metal traces. When the thickness of the protective adhesive 70 is too thick, it is not favorable to manufacture the display panel 100 with a narrow frame or without a frame. Therefore, the thickness of the protective adhesive 70 is controlled to be 5 micrometers to 150 micrometers, so that the narrow-frame or frameless display panel 100 can be prepared on the premise that the metal wiring is not corroded by water and oxygen.
Referring to fig. 4, fig. 4 is a flowchart illustrating a second embodiment of a method for manufacturing a display panel according to the present application.
Step B101: providing a display panel, wherein the display panel is provided with a bending area.
Step B102: and coating a protective glue composition on the bending area, wherein the protective glue composition comprises the protective glue composition.
Step B103: and establishing a 3D model of the protective glue in the bending area.
Step B104: and photocuring the composition of the protective adhesive in the bending area according to the 3D model to form the protective adhesive.
Step B105: and removing the uncured composition of the protective adhesive.
The difference between the method for manufacturing a display panel provided in the second embodiment of the present application and the method for manufacturing a display panel provided in the first embodiment is that the method for manufacturing a display panel provided in the second embodiment uses a method of coating a composition of a protective adhesive and then building a 3D model of the protective adhesive in a bending region.
According to the preparation method of the display panel, the composition of the protective glue is coated on the bending area, the 3D model of the protective glue on the bending area is established, and then the protective glue is formed by photocuring the composition of the protective glue on the bending area according to the 3D model, so that the precision of forming the protective glue in the bending area can be improved, and the product yield of the display panel is improved. In addition, the preparation of a narrow-frame or frameless display panel is facilitated.
Referring to fig. 5, fig. 5 is a schematic view of a second structure of the display panel coated with the protective adhesive according to the embodiment of the present application.
The application provides a display panel, and the display panel prepared by adopting the preparation method of the display panel provided by any one of the embodiments. The display panel 100 includes a display area 100a, a bending area 100b, and a binding area 100 c. The bending region 100b is located between the display region 100a and the binding region 100 c. The bending region 100b is provided with a protective adhesive 70. The bending area 100b is bent to form a bending radius r.
In some embodiments, the bend radius r of the display panel 100 is 0.05 microns to 0.2 microns.
Specifically, the bending radius r of the display panel 100 may be 0.05 micrometers, 0.1 micrometers, 0.15 micrometers, or 0.2 micrometers.
The bending radius r of the display panel 100 is controlled to be 0.05-0.2 microns, so that the narrow-frame or frameless display panel 100 can be prepared conveniently.
In summary, although the embodiments of the present application are described in detail above, the above-mentioned embodiments are not intended to limit the present application, and it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present application.
Claims (11)
1. The protective glue composition is characterized by comprising 30-50% of oligomer, 30-50% of monomer, 10-30% of carboxylic acid mesogen and 4-10% of photoinitiator.
2. The protective paste composition of claim 1 wherein the oligomer comprises one or more of an epoxy acrylate, a urethane acrylate, a polyether acrylate, a polyester acrylate, or an acrylic resin.
3. The composition of claim 1, wherein the monomer comprises one or more of isobornyl acrylate, isobornyl methacrylate, hydroxyethyl methacrylate, tripropylene glycol diacrylate, 1, 6-hexanediol diacrylate, diethylene glycol diacrylate, neopentyl glycol diacrylate, trimethylolpropane triacrylate, or pentaerythritol triacrylate.
4. The protective gum composition of claim 1, wherein the carboxylic acid mesogen comprises one or more of 4- ((6- (acryloyloxy) hexyl) oxy) benzoic acid, 4- ((6- (acryloyloxy) hexyl) oxy) -2-methylbenzoic acid, 4- ((5- (acryloyloxy) pentyl) oxy) benzoic acid, or 4- (3- (acryloyloxypropoxy)) benzoic acid.
5. The protective adhesive composition of claim 1, wherein the photoinitiator comprises one or more of phenyl bis (2,4, 6-trimethylbenzoyl) phosphine oxide, 1-hydroxy-cyclohexyl-phenyl ketone, or 2, 2-dimethoxy-2-phenyl acetophenone.
6. A method for manufacturing a display panel, comprising:
providing a display panel, wherein the display panel is provided with a bending area;
printing and curing the composition of the protective glue at the inflection zone to form the protective glue, the composition of the protective glue comprising the composition of the protective glue according to any one of claims 1 to 5.
7. The method for manufacturing a display panel according to claim 6, wherein the printing and curing the composition of the protective paste at the bending area to form the protective paste comprises:
establishing a 3D model of the protective glue in the bending area;
coating the composition of the protective adhesive on the bending area;
and carrying out photocuring on the composition of the protective adhesive in the bending area according to the 3D model to form the protective adhesive.
8. The method for manufacturing a display panel according to claim 6, further comprising, after the step of printing and curing the composition of the protective paste at the bending region to form the protective paste:
and removing the uncured composition of the protective adhesive.
9. The method for manufacturing a display panel according to claim 6, wherein a starting position of the protective adhesive is a starting position of the bending region, and an ending position of the protective adhesive is an ending position of the bending region.
10. The method for manufacturing a display panel according to claim 6, wherein the thickness of the protective paste is 5 to 150 μm.
11. A display panel produced by the production method for a display panel according to any one of claims 6 to 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110993621.4A CN113583607A (en) | 2021-08-27 | 2021-08-27 | Protective adhesive composition, display panel preparation method and display panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110993621.4A CN113583607A (en) | 2021-08-27 | 2021-08-27 | Protective adhesive composition, display panel preparation method and display panel |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113583607A true CN113583607A (en) | 2021-11-02 |
Family
ID=78239726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110993621.4A Pending CN113583607A (en) | 2021-08-27 | 2021-08-27 | Protective adhesive composition, display panel preparation method and display panel |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113583607A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5078910A (en) * | 1989-06-20 | 1992-01-07 | Edison Polymer Innovation Corp. | Polimerization of liquid crystalline monomers |
CN105637056A (en) * | 2013-08-08 | 2016-06-01 | 东友精细化工有限公司 | Adhesive composition and composite polarizing plate using same |
CN108922981A (en) * | 2018-07-19 | 2018-11-30 | 上海天马微电子有限公司 | Display panel and display device |
CN110804397A (en) * | 2019-11-27 | 2020-02-18 | 上海金門量子科技有限公司 | Liquid optical transparent adhesive and preparation method thereof |
-
2021
- 2021-08-27 CN CN202110993621.4A patent/CN113583607A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5078910A (en) * | 1989-06-20 | 1992-01-07 | Edison Polymer Innovation Corp. | Polimerization of liquid crystalline monomers |
CN105637056A (en) * | 2013-08-08 | 2016-06-01 | 东友精细化工有限公司 | Adhesive composition and composite polarizing plate using same |
CN108922981A (en) * | 2018-07-19 | 2018-11-30 | 上海天马微电子有限公司 | Display panel and display device |
CN110804397A (en) * | 2019-11-27 | 2020-02-18 | 上海金門量子科技有限公司 | Liquid optical transparent adhesive and preparation method thereof |
Non-Patent Citations (1)
Title |
---|
董丽红: ""两亲分子在纳米技术领域中的应用"", vol. 1, 吉林大学出版社, pages: 242 * |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102345819B1 (en) | Anisotropic conductive film and manufacturing method therefor | |
JP5684460B2 (en) | Cationic polymerizable resin composition and cured product thereof | |
JP6372542B2 (en) | Method for producing anisotropic conductive film and anisotropic conductive film | |
KR101845081B1 (en) | Composition for window film, flexible window film prepared using the same and flexible display apparatus comprising the same | |
JP5457078B2 (en) | Cationic polymerizable resin composition and cured product thereof | |
KR102021630B1 (en) | Base with transparent conductive film and touch panel | |
CN104335269B (en) | The manufacturing method of image display device, resin distributor | |
CN105219167B (en) | It is a kind of to have conductive film made of the alcohol radical nano silver wire ink of conductive filler | |
CN104838292B (en) | Anisotropic optical film | |
KR20160066679A (en) | Composition for window film, flexible window film prepared using the same and flexible display apparatus comprising the same | |
TWI447159B (en) | A photohardenable resin composition having shading and adhesion, and a hardened product thereof | |
JP5011804B2 (en) | Circuit connection material, connection body and circuit member connection method | |
CN1646593A (en) | Actinic radiation hardenable resin composition and hardening product thereof | |
JP2009138116A (en) | Cation-polymerizable resin composition and cured material thereof | |
WO2019218702A1 (en) | Visible light curing adhesive and preparation method thereof | |
TW201300434A (en) | Resin composition for optical waveguide, dry film, optical waveguide, and photoelectric composite wiring board using same | |
WO2015137008A1 (en) | Anisotropic conductive adhesive, method for producing connector and method for connecting electronic component | |
WO2006057298A1 (en) | Polymerizable composition | |
CN113583607A (en) | Protective adhesive composition, display panel preparation method and display panel | |
CN1795215A (en) | Curing resin composition, optical component and optical waveguide | |
CN1367219A (en) | Anisotropic conductive adhesive and its UV light solidification method | |
JP4766131B2 (en) | Fabrication method of waveguide element | |
CN107001865A (en) | The connection method of photocuring class anisotropically conducting adhesive, the manufacture method of connector and electronic unit | |
JP2015109358A (en) | Method for manufacturing connection structure and anisotropic conductive film | |
JP2019008396A (en) | Capacitance touch panel |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211102 |
|
RJ01 | Rejection of invention patent application after publication |