CN113579399A - Diode circuit board processing is with some tin device - Google Patents
Diode circuit board processing is with some tin device Download PDFInfo
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- CN113579399A CN113579399A CN202110965140.2A CN202110965140A CN113579399A CN 113579399 A CN113579399 A CN 113579399A CN 202110965140 A CN202110965140 A CN 202110965140A CN 113579399 A CN113579399 A CN 113579399A
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- frame
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- circuit board
- diode circuit
- fan
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/10—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
- B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
- B01D53/0407—Constructional details of adsorbing systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F11/00—Cutting wire
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/047—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2253/00—Adsorbents used in seperation treatment of gases and vapours
- B01D2253/10—Inorganic adsorbents
- B01D2253/102—Carbon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2259/00—Type of treatment
- B01D2259/40—Further details for adsorption processes and devices
- B01D2259/40083—Regeneration of adsorbents in processes other than pressure or temperature swing adsorption
- B01D2259/40084—Regeneration of adsorbents in processes other than pressure or temperature swing adsorption by exchanging used adsorbents with fresh adsorbents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a tin dotting device for processing a diode circuit board, which comprises a device body, a rotating shaft, a second motor and an outer cover frame, wherein the first motor is arranged in the device body and is connected with a transmission shaft through a first bevel gear set, the upper end of the transmission shaft penetrates through the device body and is connected with the processing frame, the rotating shaft is rotatably connected to the side wall of the processing frame, the inner end of the rotating shaft is connected with a supporting frame, an electric telescopic rod penetrates through the side wall of the supporting frame, the inner end of the electric telescopic rod is connected with a clamping plate, the outer cover frame is arranged at the upper end of the device body and is arranged at the outer side of the processing frame, and a processing box is arranged at the upper end of the outer cover frame. This diode circuit board processing is with some tin device, the arm on right side and hydraulic pressure are cut and are sheared diode stitch on the circuit board down, can blow the stitch after cuting through the jet-propelled pipe of high pressure and scatter, fall into the collection box through the vent groove and concentrate in and collect, will collect the box and slide from the processing frame and take out, can handle the stitch.
Description
Technical Field
The invention relates to the technical field related to diode circuit board processing, in particular to a tin dotting device for processing a diode circuit board.
Background
The circuit board needs to pass through soldering tin mode with electronic components such as diode and weld on the circuit board in production and processing process, soldering tin generally processes through artifical spot welding or mechanical spot welding mode, artifical spot soldering efficiency is too low, although mechanical soldering tin is efficient, because the circuit board need carry out soldering tin to two-sided, most circuit board processing soldering tin device is put the circuit board and is carried out soldering tin on the processing platform, the upset is still carried out comparatively inconveniently through the manual work, need a diode circuit board processing to solve above-mentioned problem with some tin device now.
Disclosure of Invention
The invention aims to provide a solder dispensing device for processing a diode circuit board, which solves the problem that most circuit board processing and soldering devices are inconvenient to turn or manually solder the circuit board on a processing table because the circuit board needs to be soldered on two sides.
In order to achieve the purpose, the invention provides the following technical scheme: a tin dispensing device for processing a diode circuit board comprises a device body, a rotating shaft, a second motor and a housing frame,
a first motor is arranged in the device body and is connected with a transmission shaft through a first bevel gear set, and the upper end of the transmission shaft penetrates through the device body and is connected with the processing frame;
the rotating shaft is rotatably connected to the side wall of the processing frame, the inner end of the rotating shaft is connected with the supporting frame, the side wall of the supporting frame is provided with an electric telescopic rod in a penetrating mode, and the inner end of the electric telescopic rod is connected with the clamping plate;
the outer cover frame is arranged at the upper end of the device body, the outer cover frame is arranged outside the processing frame, and a processing box is arranged at the upper end of the outer cover frame.
Preferably, the first motor, the first bevel gear set, the transmission shaft and the processing frame form a rotating mechanism, and two supporting frames are symmetrically arranged on the left center line and the right center line of the processing frame.
Through adopting above-mentioned technical scheme, braced frame can be used to the centre gripping of circuit board and fix.
Preferably, the processing frame is including collecting box and opening groove, and processing frame inner wall has the collection box through spout sliding connection, and the opening groove has been seted up to the processing frame upper end simultaneously.
By adopting the technical scheme, the collecting box can be used for collecting diode pins cut off from the welded circuit board.
Preferably, the support frame comprises a holding tank, a first fan and an air blowing pipe, the holding tank is arranged in the support frame, the first fan is arranged in the holding tank and connected with the air blowing pipe, and meanwhile the air blowing pipe is far away from the first fan and penetrates through the inner wall of the support frame.
Through adopting above-mentioned technical scheme, can be to the circuit board cooling behind the soldering tin under first fan and gas blow pipe effect, help soldering tin rapid solidification.
Preferably, telescopic machanism is constituteed to electric telescopic handle and splint, and two splint set up about a braced frame front and back central line symmetry, and every splint inner wall is provided with the rubber pad simultaneously.
Through adopting above-mentioned technical scheme, can play certain protection effect to the circuit board of centre gripping under the effect of rubber pad, avoid the clamping face impaired.
Preferably, the second motor is arranged at the upper end of the processing frame and is connected with the rotating shaft on the inner side through a second bevel gear set, and meanwhile, the second motor, the rotating shaft, the second bevel gear set and the supporting frame form a rotating mechanism.
By adopting the technical scheme, the supporting frame can be overturned through the rotating shaft, and the tin soldering can be carried out on the two sides of the circuit board.
Preferably, the through opening grooves are arranged in two groups, and the two groups of through opening grooves are symmetrically arranged around the front central line and the rear central line of the processing frame.
Through adopting above-mentioned technical scheme, the convenient stitch after cuting of opening groove drops in the collection box.
Preferably, the outer cover frame includes that arm, soldering tin mechanism, hydraulic pressure are cut and the high-pressure jet pipe, and the outer cover frame inner wall is provided with the arm, and left the arm is connected with soldering tin mechanism, and the arm on right side is cut with the hydraulic pressure and is connected, outer cover frame rear side is run through and is provided with the high-pressure jet pipe.
Through adopting above-mentioned technical scheme, can cut the pin on the diode circuit board after the soldering tin under arm and the hydraulic pressure shearing action on right side.
Preferably, handle the case including second fan, straw, spacing arm-tie, bolt, filter screen and active carbon adsorption net, and handle the case front side and be provided with the second fan, the second fan is connected with the straw, and the straw is kept away from second fan one end and is run through dustcoat frame upper end, spacing arm-tie passes through the bolt thread and installs on handling the case right side, and is provided with filter screen and active carbon adsorption net on the left of the spacing arm-tie, the filter screen setting is in the below with active carbon adsorption net, and filter screen and active carbon adsorption net all run through the setting and handle the incasement.
Through adopting above-mentioned technical scheme, can filter the absorption to the flue gas of inhaling through filter screen and active carbon adsorption net, reduce the influence to the environment.
Compared with the prior art, the invention has the beneficial effects that: the tin dotting device for processing the diode circuit board,
(1) the circuit board can be clamped and fixed in the supporting frame for soldering tin processing by pushing the clamping plate through the electric telescopic rod, and the circuit board can be cooled through the first fan and the air blowing pipe after soldering tin, so that the soldering tin can be rapidly cooled and solidified;
(2) the supporting frame can be driven to turn over under the action of the second motor, the second bevel gear set and the rotating shaft, so that the two sides of the circuit board can be conveniently subjected to soldering tin processing, the circuit board does not need to be manually turned over, the processing frame is driven to rotate under the action of the first motor, the first bevel gear set and the rotating shaft, the position of the circuit board subjected to soldering tin can be adjusted, and the diode pins on the circuit board can be cut;
(3) the pins of the diodes on the circuit board are sheared under the action of the mechanical arm on the right side and the hydraulic shear, the sheared pins can be blown out through the high-pressure air injection pipe, fall into the collection box through the opening groove for centralized collection, the collection box is drawn out from the processing frame in a sliding mode, and the pins can be processed;
(4) can inhale the flue gas that the soldering tin process produced to the processing incasement under second fan and straw effect, through filter screen and active carbon adsorption net filtration adsorption treatment, reduce the influence of flue gas to surrounding environment, dismantle the bolt, the spacing arm-tie of accessible takes out filter screen and active carbon adsorption net from handling the incasement and maintains or change.
Drawings
FIG. 1 is a schematic front sectional view of the present invention;
FIG. 2 is a schematic top view of the cross-sectional structure of the present invention;
FIG. 3 is a schematic top sectional view of a support frame according to the present invention;
FIG. 4 is an enlarged view of the structure at A in FIG. 3 according to the present invention;
FIG. 5 is a schematic view of the configuration of the insufflation tube and support frame of the present invention;
FIG. 6 is a schematic view showing the internal structure of the treatment tank of the present invention.
In the figure: 1. the device body, 2, first motor, 3, first bevel gear group, 4, the transmission shaft, 5, the processing frame, 501, collect the box, 502, the opening groove, 6, the pivot, 7, braced frame, 701, the holding tank, 702, first fan, 703, the gas blow pipe, 8, electric telescopic handle, 9, splint, 10, second bevel gear group, 11, the second motor, 12, the dustcoat frame, 1201, the arm, 1202, soldering tin mechanism, 1203, the hydraulic pressure is cut, 1204, the high-pressure jet pipe, 13, handle the case, 1301, the second fan, 1302, the straw, 1303, spacing arm-tie, 1304, the bolt, 1305, the filter screen, 1306, the active carbon adsorption net.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a tin dispensing device for processing a diode circuit board is characterized in that a first motor 2 is arranged in a device body 1, the first motor 2 is connected with a transmission shaft 4 through a first bevel gear set 3, the upper end of the transmission shaft 4 penetrates through the device body 1 to be connected with a processing frame 5, the first motor 2, the first bevel gear set 3, the transmission shaft 4 and the processing frame 5 form a rotating mechanism, two supporting frames 7 are symmetrically arranged on the left center line and the right center line of the processing frame 5, the first motor 2 and the first bevel gear set 3 are driven by the transmission shaft 4 to rotate with the processing frame 5, pin shearing is conveniently carried out after tin soldering of a circuit board, the processing frame 5 comprises a collecting box 501 and an opening groove 502, the inner wall of the processing frame 5 is connected with the collecting box 501 in a sliding mode through a sliding groove, the opening groove 502 is formed in the upper end of the processing frame 5, the collecting box 501 is drawn out of the processing frame 5 through the sliding groove, and collected pin waste is conveniently processed, the two groups of through-hole grooves 502 are arranged, the two groups of through-hole grooves 502 are symmetrically arranged about the front central line and the rear central line of the processing frame 5, the through-hole grooves 502 are convenient for the sheared pins to fall down, the rotating shaft 6 is rotatably connected to the side wall of the processing frame 5, the inner end of the rotating shaft 6 is connected with the supporting frame 7, the supporting frame 7 comprises an accommodating groove 701, a first fan 702 and an air blowing pipe 703, the accommodating groove 701 is arranged in the supporting frame 7, the first fan 702 is arranged in the accommodating groove 701, the first fan 702 is connected with the air blowing pipe 703, meanwhile, the air blowing pipe 703 is far away from the first fan 702 and penetrates through the inner wall of the supporting frame 7, the circuit board after soldering can be cooled under the action of the first fan 702 and the air blowing pipe 703, the soldering tin solidification is facilitated, the electric telescopic rod 8 is arranged on the side wall of the supporting frame 7 in a penetrating manner, the inner end of the electric telescopic rod 8 is connected with the clamping plate 9, the electric telescopic rod 8 and the clamping plate 9 form a telescopic mechanism, two clamping plates 9 are symmetrically arranged about the front and rear central lines of a supporting frame 7, a rubber pad is arranged on the inner wall of each clamping plate 9, circuit boards with different sizes can be stably clamped under the action of an electric telescopic rod 8 and the clamping plates 9, a second motor 11 is arranged at the upper end of a processing frame 5, the second motor 11 is connected with a rotating shaft 6 on the inner side through a second bevel gear set 10, the second motor 11, the rotating shaft 6, the second bevel gear set 10 and the supporting frame 7 form a rotating mechanism, the supporting frame 7 can be driven to turn over under the action of the second motor 11, the rotating shaft 6 and the second bevel gear set 10, double-sided tin soldering of the circuit boards is facilitated, an outer cover frame 12 is arranged at the upper end of an apparatus body 1, the outer cover frame 12 is arranged on the outer side of the processing frame 5, a processing box 13 is arranged at the upper end of the outer cover frame 12, the outer cover frame 12 comprises a mechanical arm 1201, a tin soldering mechanism 1202, a hydraulic shear 1203 and a high-pressure gas injection pipe 1204, the mechanical arm 1201 is arranged on the inner wall of the outer cover frame 12, the mechanical arm 1201 on the left side is connected with the soldering tin mechanism 1202, the mechanical arm 1201 on the right side is connected with the hydraulic shear 1203, the high-pressure jet pipe 1204 is arranged on the rear side of the outer cover frame 12 in a penetrating manner, the sheared pins can be blown out under the action of the high-pressure jet pipe 1204, the treatment box 13 comprises a second fan 1301, a suction pipe 1302, a limiting pull plate 1303, a bolt 1304, a filter screen 1305 and an activated carbon adsorption net 1306, the second fan 1301 is arranged on the front side of the treatment box 13, the second fan 1301 is connected with the suction pipe 1302, one end, far away from the second fan 1301, of the suction pipe 1302 penetrates through the upper end of the outer cover frame 12, the limiting pull plate 1303 is arranged on the right side of the treatment box 13 through the threads of the bolt 1304, the filter screen 1305 and the activated carbon adsorption net 1306 are arranged on the left side of the limiting pull plate 1303, the filter screen 1305 and the activated carbon adsorption net 1306 are arranged below the filter screen 1305 and the activated carbon adsorption net 1306 are arranged in the treatment box 13 in a penetrating manner, the bolts 1304 are disassembled, and the filter screen 1305 and the activated carbon adsorption screen 1306 are drawn out for maintenance or replacement through the limiting pulling plate 1303.
The working principle is as follows: when the diode circuit board processing tin dotting device is used, a power supply is switched on, a circuit board is placed in the left supporting frame 7, the clamping plate 9 is pushed by the movable telescopic rod 8 to clamp and fix the circuit board, the circuit board and the diodes can be subjected to tin soldering processing under the action of the left mechanical arm 1201 and the tin soldering mechanism 1202, smoke generated in the tin soldering process is sucked into the processing box 13 under the action of the second fan 1301 and the suction pipe 1302, the smoke is filtered and adsorbed by the filter screen 1305 and the activated carbon adsorption screen 1306, the supporting frame 7 can be driven to turn over under the action of the second motor 11, the second bevel gear set 10 and the rotating shaft 6, the circuit board can be soldered on the other side of the circuit board, the circuit board can be clamped in the right supporting frame 7 during the tin soldering processing, after the tin soldering is finished, the processing frame 5 is driven to rotate by the first motor 2, the first bevel gear set 3 and the transmission shaft 4, so that the position of the circuit board after the tin soldering is adjusted, the left pins of the diodes can be cut under the action of the mechanical arm 1201 and the hydraulic shear 1203 on the right side, the high-pressure gas injection pipe 1204 is connected with an external air compressor, high-pressure gas can be sprayed out to blow the cut pins into the collecting box 501 through the through-hole groove 502 for collection, the collecting box 501 can be slidingly extracted from the processing frame 5 for cleaning the inside of the collecting box, the bolt 1304 is disassembled, the filter screen 1305 and the activated carbon adsorption net 1306 can be extracted from the processing box 13 through the limiting pulling plate 1303 for maintenance or replacement, and the content which is not described in detail in the specification belongs to the prior art which is well known by persons skilled in the art.
The terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for simplicity of description only and are not intended to indicate or imply that the referenced devices or elements must be in a particular orientation, constructed and operative in a particular orientation, and are not to be considered limiting of the claimed invention.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (9)
1. The utility model provides a diode circuit board processing is with some tin device, includes the device body (1), pivot (6), second motor (11) and dustcoat frame (12), its characterized in that:
a first motor (2) is arranged in the device body (1), the first motor (2) is connected with a transmission shaft (4) through a first bevel gear set (3), and the upper end of the transmission shaft (4) penetrates through the device body (1) and is connected with a processing frame (5);
the rotating shaft (6) is rotatably connected to the side wall of the processing frame (5), the inner end of the rotating shaft (6) is connected with the supporting frame (7), the side wall of the supporting frame (7) is provided with an electric telescopic rod (8) in a penetrating mode, and the inner end of the electric telescopic rod (8) is connected with the clamping plate (9);
the outer cover frame (12) is arranged at the upper end of the device body (1), the outer cover frame (12) is arranged on the outer side of the processing frame (5), and a processing box (13) is arranged at the upper end of the outer cover frame (12).
2. The diode circuit board processing tin dotting device as claimed in claim 1, wherein: a rotating mechanism is composed of the first motor (2), the first bevel gear set (3), the transmission shaft (4) and the processing frame (5), and two supporting frames (7) are symmetrically arranged on the processing frame (5) along the left and right central lines.
3. The diode circuit board processing tin dotting device as claimed in claim 1, wherein: processing frame (5) are including collecting box (501) and opening groove (502), and processing frame (5) inner wall has collection box (501) through spout sliding connection, and opening groove (502) have been seted up to processing frame (5) upper end simultaneously.
4. The diode circuit board processing tin dotting device as claimed in claim 1, wherein: the supporting frame (7) comprises an accommodating groove (701), a first fan (702) and an air blowing pipe (703), the accommodating groove (701) is arranged in the supporting frame (7), the first fan (702) is arranged in the accommodating groove (701), the first fan (702) is connected with the air blowing pipe (703), and the air blowing pipe (703) is far away from the first fan (702) and penetrates through the inner wall of the supporting frame (7).
5. The diode circuit board processing tin dotting device as claimed in claim 1, wherein: electric telescopic handle (8) and splint (9) constitute telescopic machanism, and two splint (9) are around a braced frame (7) central line symmetry setting, and every splint (9) inner wall is provided with the rubber pad simultaneously.
6. The diode circuit board processing tin dotting device as claimed in claim 1, wherein: the second motor (11) is arranged at the upper end of the processing frame (5), the second motor (11) is connected with the inner side rotating shaft (6) through a second bevel gear set (10), and meanwhile, the second motor (11), the rotating shaft (6), the second bevel gear set (10) and the supporting frame (7) form a rotating mechanism.
7. The diode circuit board processing tin dotting device as claimed in claim 3, wherein: the two sets of through-hole grooves (502) are arranged, and the two sets of through-hole grooves (502) are symmetrically arranged around the front and rear central lines of the processing frame (5).
8. The diode circuit board processing tin dotting device as claimed in claim 1, wherein: the outer cover frame (12) comprises a mechanical arm (1201), a soldering tin mechanism (1202), a hydraulic shear (1203) and a high-pressure gas ejector pipe (1204), the mechanical arm (1201) is arranged on the inner wall of the outer cover frame (12), the mechanical arm (1201) on the left side is connected with the soldering tin mechanism (1202), the mechanical arm (1201) on the right side is connected with the hydraulic shear (1203), and the high-pressure gas ejector pipe (1204) penetrates through the rear side of the outer cover frame (12).
9. The diode circuit board processing tin dotting device as claimed in claim 1, wherein: the treatment box (13) comprises a second fan (1301), a suction pipe (1302), a limiting pulling plate (1303), a bolt (1304), a filter screen (1305) and an activated carbon adsorption net (1306), the second fan (1301) is arranged on the front side of the treatment box (13), the second fan (1301) is connected with the suction pipe (1302), one end, far away from the second fan (1301), of the suction pipe (1302 penetrates through the upper end of the housing frame (12), the limiting pulling plate (1303) is installed on the right side of the treatment box (13) through the bolt (1304) in a threaded mode, the left side of the limiting pulling plate (1303) is provided with the filter screen (1305) and the activated carbon adsorption net (1306), the filter screen (1305) is arranged below the activated carbon adsorption net (1306), and the filter screen (1305) and the activated carbon adsorption net (1306) both penetrate through the treatment box (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110965140.2A CN113579399B (en) | 2021-08-23 | 2021-08-23 | Diode circuit board processing is with some tin device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110965140.2A CN113579399B (en) | 2021-08-23 | 2021-08-23 | Diode circuit board processing is with some tin device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113579399A true CN113579399A (en) | 2021-11-02 |
| CN113579399B CN113579399B (en) | 2022-12-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110965140.2A Active CN113579399B (en) | 2021-08-23 | 2021-08-23 | Diode circuit board processing is with some tin device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113909624A (en) * | 2021-12-08 | 2022-01-11 | 浙江连成环保科技有限公司 | Automatic soldering tin pin shearing device |
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| CN113909624B (en) * | 2021-12-08 | 2022-04-26 | 浙江连成环保科技有限公司 | Automatic soldering tin pin shearing device |
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| CN113579399B (en) | 2022-12-13 |
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