CN113568073A - Electronic device, thermal comfort detection method, detection device, and storage medium - Google Patents

Electronic device, thermal comfort detection method, detection device, and storage medium Download PDF

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Publication number
CN113568073A
CN113568073A CN202110852872.0A CN202110852872A CN113568073A CN 113568073 A CN113568073 A CN 113568073A CN 202110852872 A CN202110852872 A CN 202110852872A CN 113568073 A CN113568073 A CN 113568073A
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temperature
electronic equipment
electronic device
humidity
acquiring
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CN113568073B (en
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陈欣
崔英云
姜华文
程傲
颜龙平
朱义为
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01WMETEOROLOGY
    • G01W1/00Meteorology
    • G01W1/17Catathermometers for measuring "cooling value" related either to weather conditions or to comfort of other human environment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02ATECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A90/00Technologies having an indirect contribution to adaptation to climate change
    • Y02A90/10Information and communication technologies [ICT] supporting adaptation to climate change, e.g. for weather forecasting or climate simulation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The application provides an electronic device, a thermal comfort detection method, a detection device and a storage medium; the detection method comprises the following steps: acquiring the internal temperature of the electronic equipment; calculating to obtain the external temperature of the electronic equipment by using a normalization method; acquiring the external humidity of the electronic equipment; and calculating the wet bulb temperature index of the environment where the electronic equipment is located by using a wet bulb fitting method. According to the thermal comfort detection method provided by the embodiment of the application, the temperature and humidity information measured by the electronic equipment is converted into the index of the thermal comfort of the human body by utilizing the heat dissipation similarity relation between the electronic equipment and the thermal sensing organ of the human body, the preliminary temperature and humidity data are obtained by utilizing the temperature and humidity sensors arranged in the electronic equipment, and then the wet bulb temperature index of the environment where the electronic equipment (namely the human body) is located is obtained through a fitting algorithm, so that the method has the characteristics of simple structure of the required sensor and accurate calculation; the method greatly facilitates the user to obtain real-time and accurate thermal comfort evaluation information of the environment where the user is located.

Description

Electronic device, thermal comfort detection method, detection device, and storage medium
Technical Field
The invention relates to the technical field of an environmental thermal comfort detection method based on electronic equipment, in particular to electronic equipment, a thermal comfort detection method, a detection device and a storage medium.
Background
The Wet black Bulb Temperature WBGT (Wet Bulb-Global Temperature) is a basic parameter for comprehensively evaluating the heat load of the human body basic working environment, and the unit is centigrade for evaluating the average heat conformity of the environment to the human body. The method is calculated by adopting natural wet bulb temperature (tnw) and black bulb temperature (tg), air dry bulb temperature (ta) is measured under the open air condition, and WBGT index is calculated according to (1) and formula (2):
-absence of solar radiation indoors and outdoors:
WGBT=0.7tnw+0.3tg----------------------(1)
outdoor with solar radiation
WGBT=0.7tnw+0.2tg+0.1ta-------------(2)
The measurement of the WBGT is based on a measurement method of meteorological parameters, wherein the measurement method comprises meteorological parameters such as natural wet bulb temperature, black bulb temperature, air temperature, solar radiation illumination and the like; through regression calculation, a calculation formula for associating the WBGT with the parameters can be obtained.
At present, electronic equipment such as mobile phones and tablet computers mainly obtain somatosensory temperature and human comfort level indexes through built-in weather APP of the electronic equipment. The weather APP acquires weather data of an area where the electronic equipment is located through weather monitoring equipment (a temperature and humidity sensor, an anemoscope and the like), acquires various weather indexes, calculates a WGBT index, and synchronizes information to the electronic equipment through a network.
Data provided by weather-like APPs are acquired based on weather testing equipment, feedback is WBGT index of an outdoor typical area, and the WBGT index cannot reflect WGBT index under indoor and other environmental conditions (environments where users really are located, such as offices, homes and the like).
Disclosure of Invention
In a first aspect, embodiments of the present application provide various thermal comfort detection methods, where the detection method includes:
acquiring the internal temperature of the electronic equipment;
calculating to obtain the external temperature of the electronic equipment by using a normalization method;
acquiring the external humidity of the electronic equipment;
and calculating the wet bulb temperature index of the environment where the electronic equipment is located by using a wet bulb fitting method.
In a second aspect, an embodiment of the present application provides an electronic device, where the electronic device includes a control circuit board, and a temperature sensor and a humidity sensor that are respectively connected to the control circuit board; the electronic equipment detects the wet bulb temperature index of the environment where the electronic equipment is located through the detection method in any one of the above embodiments.
In a third aspect, an embodiment of the present application provides another electronic device, where the electronic device includes:
the first acquisition module is used for acquiring the internal temperature of the electronic equipment;
the computing module is used for computing the external temperature of the electronic equipment by utilizing a normalization method;
the second acquisition module is used for acquiring the external humidity of the electronic equipment;
and the fitting module is used for calculating and obtaining the wet bulb temperature index of the environment where the electronic equipment is located by utilizing a wet bulb fitting method.
In a fourth aspect, the present application provides a further thermal comfort detection apparatus, which includes a processor and a memory, where the memory stores program data, and the processor is configured to execute the program data to implement the detection method according to any one of the foregoing embodiments.
In addition, an embodiment of the present application further provides a computer storage medium, in which program data is stored, and when the program data is executed by the processor, the program data is used to implement the detection method according to any one of the above embodiments.
According to the thermal comfort detection method provided by the embodiment of the application, the temperature and humidity information measured by the electronic equipment is converted into the index of the thermal comfort of the human body by utilizing the heat dissipation similarity relation between the electronic equipment and the thermal sensing organ of the human body, the preliminary temperature and humidity data are obtained by utilizing the temperature and humidity sensors arranged in the electronic equipment, and then the wet bulb temperature index of the environment where the electronic equipment (namely the human body) is located is obtained through a fitting algorithm, so that the method has the characteristics of simple structure of the required sensor and accurate calculation; the method greatly facilitates the user to obtain real-time and accurate thermal comfort evaluation information of the environment where the user is located.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic block flow diagram of an embodiment of a thermal comfort detection method of the present application;
FIG. 2 is a schematic block flow diagram of another embodiment of a thermal comfort detection method of the present application;
FIG. 3 is a block schematic flow diagram of one embodiment of acquiring an external humidity of an electronic device;
figure 4 is a schematic diagram of a psychrometric chart;
FIG. 5 is a schematic block flow chart diagram of yet another embodiment of the thermal comfort detection method of the present application;
FIG. 6 is a schematic block flow diagram of another embodiment of acquiring an external humidity of an electronic device;
FIG. 7 is a schematic block flow diagram of yet another embodiment of a thermal comfort detection method of the present application;
FIG. 8 is a schematic block flow diagram of yet another embodiment for acquiring an external humidity of an electronic device;
FIG. 9 is a schematic structural diagram of an embodiment of an electronic device of the present application;
FIG. 10 is a block diagram illustrating the structural components of an embodiment of the electronic device of the present application;
FIG. 11 is a block diagram of an embodiment of an electronic device of the present application;
FIG. 12 is a block diagram of an electronic device according to another embodiment of the present application;
FIG. 13 is a schematic structural diagram of an embodiment of a thermal comfort detection apparatus provided herein;
fig. 14 is a schematic structural diagram of a computer storage medium provided in an embodiment of the present application.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be noted that the following examples are only illustrative of the present invention, and do not limit the scope of the present invention. Likewise, the following examples are only some but not all examples of the present invention, and all other examples obtained by those skilled in the art without any inventive step are within the scope of the present invention.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.
The heat exchange of the electronic equipment is mainly divided into two parts, namely radiation and convection; the infrared emissivity of the surface of the shell of the current electronic equipment is 0.88-0.92, and the characteristic length of the size of the mobile phone is 0.12-0.16m in the calculation of convective heat transfer; the heat dissipation of the human body is divided into three parts, namely evaporation heat exchange, convection and radiation; the infrared surface heating rate of human skin is 0.97, and the characteristic length of main exposed parts (hands and heads) of the human body is 0.1-0.2m in the calculation of convective heat transfer; evaporative heat dissipation of the human body is temperature & relative temperature dependent; the larger the difference between the water vapor partial pressure on the surface of the human body and the water vapor partial pressure of air is, the stronger the heat dissipation is; the partial pressure of water vapor on the surface of the human body is approximately unchanged, so that the evaporation and heat dissipation of the human body can be related to the external temperature and humidity; under the condition of not considering other condition factors, the temperature and humidity of air are acquired by using the temperature and humidity sensor, and evaporation heat exchange of a human body is calculated.
Therefore, the electronic equipment and the human body in the same environment have similar heat dissipation environments; in other words, the heat exchange condition of the electronic equipment can be converted into the heat dissipation condition sensed by the human body; the technical scheme in the embodiment of the application is that a sensor arranged in the electronic equipment is used, and the WBGT index of the area where the electronic equipment is located is obtained in real time by algorithm calculation under the condition that complex weather test equipment is not needed.
Referring to fig. 1, fig. 1 is a schematic block diagram of a flow chart of an embodiment of a thermal comfort detection method of the present application; the thermal comfort detection method in the embodiment of the application is based on the fact that the electronic equipment is provided with a temperature sensor and a humidity sensor. The electronic device may include a mobile phone, a tablet computer, a notebook computer, a wearable device or a structure separated from a mobile communication device, and is a wet black ball thermometer directly integrating a temperature sensor and a humidity sensor into a compact type.
Arrangement in relation to sensors
In the conventional technology, temperature and humidity sensors are arranged in part of electronic equipment, but the temperature and humidity sensors are positioned in the electronic equipment, and are influenced by the power consumption of the equipment, the index values of the temperature and humidity sensors cannot feed back the temperature and humidity of an electronic equipment area, and the index values and the WBGT index are not associated, so that the influence of the environment where a human body is located cannot be reflected. At present, the mobile communication equipment is compact in structural design and layout, narrow in internal space, dustproof and waterproof in part of machine types and in a sealing state. The sensor cannot accurately acquire the required temperature and humidity information.
In the electronic device structure in the embodiment of the present application, the temperature sensor of the power consumption device is set as follows: for the temperature sensor, in addition to the temperature sensor of each power consumption device (such as a main board (processor), a camera, a loudspeaker, a vibration motor and the like), the temperature sensor is arranged in an area of 5mm around the device so as to monitor the power consumption condition of the device; temperature sensor of mainboard: 1-2 temperature sensors are distributed in a region far away from other heating devices on the mainboard and used for monitoring the temperature of a cold region of the mainboard (but the cold region of the mainboard is still in a hot region in the equipment); cold zone temperature sensor: the temperature sensor is disposed in the PCB (generally, a sub-board) with the lowest temperature of the electronic device or in an area communicating with the outside to reflect the relative temperature of the outside of the electronic device. The arrangement mode of the humidity sensor is as follows: the humidity sensor is arranged at a position capable of communicating with the outside air (such as a channel of a microphone or a loudspeaker, a SIM card socket and the like), and a temperature sensor is arranged in a region close to the humidity sensor for temperature correction.
The thermal comfort detection method in the present embodiment includes, but is not limited to, the following steps. It should be noted that the terms "comprises" and "comprising," and any variations thereof, in the embodiments of the present application, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.
Step S101, acquiring the internal temperature of the electronic equipment.
In this step, the detection may be obtained by a temperature sensor provided inside the electronic device.
And S102, calculating the external temperature of the electronic equipment by using a normalization method.
Where the external temperature is the normalized weighted black & dry bulb temperature.
In step S102, the external temperature of the electronic device is calculated by using the normalization method, wherein the external temperature needs to satisfy the formula (the internal temperature of the electronic device is influenced by the internal power consumption and the external heat dissipation condition; the internal temperature T of the electronic device, the power consumption q of the mobile device and the external temperature TambientIn the following relationship):
Figure BDA0003183096270000061
wherein, TambientExpressed as the ambient temperature, T as the internal temperature of the electronic device, q as the power consumption of the electronic device, and k, n, c are constants associated with the heat dissipation structure of the electronic device. The k, n, and c constants are determined according to the material, heat dissipation efficiency, internal space layout, and the like of the electronic device, and it is generally considered that these parameters are determinable fixed values after the factory structure of the electronic device is determined.
Figure BDA0003183096270000062
Expressed as a derivative over time.
Step S103, acquiring the external humidity of the electronic equipment.
In this step, the external humidity of the electronic device may be directly measured by a sensor.
And step S104, calculating the wet bulb temperature index of the environment where the electronic equipment is located by using a wet bulb fitting method.
After the aforementioned temperature information is obtained, regression fitting is performed to obtain factors for each input parameter. In the step of calculating the wet bulb temperature index of the environment where the electronic equipment is located by using a wet bulb fitting method, the formula is satisfied:
WBGT=k1Tambient+k2Hambient+ c, wherein, TambientExpressed as ambient temperature, k1、k2Expressed as a fitting coefficient, c is a constant associated with the heat dissipating structure of the electronic device.
According to the thermal comfort detection method provided by the embodiment of the application, the temperature and humidity information measured by the electronic equipment is converted into the index of the thermal comfort of the human body by utilizing the heat dissipation similarity relation between the electronic equipment and the thermal sensing organ of the human body, the preliminary temperature and humidity data are obtained by utilizing the temperature and humidity sensors arranged in the electronic equipment, and then the wet bulb temperature index of the environment where the electronic equipment (namely the human body) is located is obtained through a fitting algorithm, so that the method has the characteristics of simple structure of the required sensor and accurate calculation; the method greatly facilitates the user to obtain real-time and accurate thermal comfort evaluation information of the environment where the user is located.
Referring to fig. 2, fig. 2 is a schematic block diagram of a flow chart of another embodiment of a thermal comfort detection method according to the present application; the thermal comfort detection method in the present embodiment includes, but is not limited to, the following steps.
In step S201, the internal temperature of the electronic device is acquired.
In this step, the detection may be obtained by a temperature sensor provided inside the electronic device.
Step S202, calculating the external temperature of the electronic equipment by using a normalization method.
Where the external temperature is the normalized weighted black & dry bulb temperature.
In step S202, the formula (the temperature inside the electronic device is subject to its internal power consumption) is satisfied in the step of calculating the external temperature of the electronic device by using the normalization methodAnd the effects of external heat dissipation conditions; temperature T inside electronic device, power consumption q of mobile device and external temperature TambientIn the following relationship):
Figure BDA0003183096270000071
wherein, TambientExpressed as the ambient temperature, T as the internal temperature of the electronic device, q as the power consumption of the electronic device, and k, n, c are constants associated with the heat dissipation structure of the electronic device. The k, n, and c constants are determined according to the material, heat dissipation efficiency, internal space layout, and the like of the electronic device, and it is generally considered that these parameters are determinable fixed values after the factory structure of the electronic device is determined.
Figure BDA0003183096270000072
Expressed as a derivative over time.
In step S203, the external humidity of the electronic device is acquired.
In step S203, the step of acquiring the external humidity of the electronic device may specifically include the following steps. Referring to fig. 3, fig. 3 is a schematic block diagram illustrating a flow of an embodiment of acquiring the external humidity of the electronic device.
In step S301, values of external temperature and humidity of the electronic device are obtained by using a temperature sensor and a humidity sensor provided in the electronic device.
In this step, the values of the external temperature and humidity of the electronic device are mainly obtained by using a humidity sensor disposed at a position communicating with the external air (such as a channel of a microphone or a speaker, a SIM card socket, and the like) and a temperature sensor disposed in close proximity to the humidity sensor.
And step S302, acquiring the absolute moisture content of the environment where the electronic equipment is located through the psychrometric chart.
In step S302, how to obtain the absolute moisture content of the environment where the electronic device is located by using the psychrometric chart according to the obtained values of the external temperature and the humidity of the electronic device is within the understanding range of those skilled in the art, and the description thereof is omitted here. Referring to fig. 4, fig. 4 is a schematic diagram of a psychrometric chart.
And step S204, calculating by using a wet bulb fitting method to obtain a wet bulb temperature index of the environment where the electronic equipment is located.
After the aforementioned temperature information is obtained, regression fitting is performed to obtain factors for each input parameter. In the step of calculating the wet bulb temperature index of the environment where the electronic equipment is located by using a wet bulb fitting method, the formula is satisfied:
WBGT=k1Tambient+k2Hambient+ c, wherein, TambientExpressed as ambient temperature, k1、k2Expressed as a fitting coefficient, c is a constant associated with the heat dissipating structure of the electronic device.
According to the thermal comfort detection method provided by the embodiment of the application, the temperature and humidity information measured by the electronic equipment is converted into the index of the thermal comfort of the human body by utilizing the heat dissipation similarity relation between the electronic equipment and the thermal sensing organ of the human body, the preliminary temperature and humidity data are obtained by utilizing the temperature and humidity sensors arranged in the electronic equipment, and then the wet bulb temperature index of the environment where the electronic equipment (namely the human body) is located is obtained through a fitting algorithm, so that the method has the characteristics of simple structure of the required sensor and accurate calculation; the method greatly facilitates the user to obtain real-time and accurate thermal comfort evaluation information of the environment where the user is located.
The traditional test equipment needs to be provided with equipment such as a black-bulb thermometer, a dry-bulb thermometer, a wet-bulb thermometer, a hygrothermograph, an anemometer and an illuminometer, belongs to expensive meteorological equipment, and cannot be used and applied on mobile communication equipment. The temperature fitting algorithm is adopted, so that the heat dissipation condition of the external heat dissipation environment can be output according to the temperature parameter inside the mobile equipment; and the temperature sensor does not need to be directly exposed to the air, so that various calculation errors can be eliminated.
In addition, the detection method in this embodiment obtains the absolute moisture content of the environment where the electronic device is located by using the obtained external temperature and humidity values of the electronic device and the psychrometric chart, can ensure that the detected humidity is accurate, and is more suitable for the calculation process of the wet bulb fitting method.
Referring to fig. 5, fig. 5 is a schematic block diagram of a flow chart of another embodiment of the thermal comfort detection method of the present application; the thermal comfort detection method in the present embodiment includes, but is not limited to, the following steps.
Step S501, an internal temperature of the electronic device is acquired.
In this step, the detection may be obtained by a temperature sensor provided inside the electronic device.
Step S502, calculating the external temperature of the electronic equipment by using a normalization method.
Where the external temperature is the normalized weighted black & dry bulb temperature. It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present application are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In step S502, the external temperature of the electronic device is calculated by using the normalization method, wherein the external temperature needs to satisfy the formula (the internal temperature of the electronic device is influenced by the internal power consumption and the external heat dissipation condition; the internal temperature T of the electronic device, the power consumption q of the mobile device and the external temperature TambientIn the following relationship):
Figure BDA0003183096270000091
wherein, TambientExpressed as the ambient temperature, T as the internal temperature of the electronic device, q as the power consumption of the electronic device, and k, n, c are constants associated with the heat dissipation structure of the electronic device. The k, n, and c constants are determined according to the material, heat dissipation efficiency, internal space layout, and the like of the electronic device, and it is generally considered that these parameters are determinable fixed values after the factory structure of the electronic device is determined.
Figure BDA0003183096270000092
Expressed as a derivative over time.
In step S503, the external humidity of the electronic device is acquired.
In step S503, the step of acquiring the external humidity of the electronic device may specifically include the following steps. Referring to fig. 6, fig. 6 is a schematic block diagram illustrating a flow of another embodiment for obtaining the external humidity of the electronic device.
In step S601, the temperature sensor and the humidity sensor provided in the electronic device are used to obtain the external temperature and humidity values of the electronic device.
In this step, the values of the external temperature and humidity of the electronic device are mainly obtained by using a humidity sensor disposed at a position communicating with the external air (such as a channel of a microphone or a speaker, a SIM card socket, and the like) and a temperature sensor disposed in close proximity to the humidity sensor.
And step S602, acquiring the dew point temperature by utilizing an enthalpy map according to the acquired values of the external temperature and the humidity of the electronic equipment.
In step S603, the absolute moisture content at the dew point temperature is obtained from the dew point temperature.
In step S602 and step S603, how to obtain the dew point temperature by using the psychrometric chart according to the obtained values of the external temperature and the humidity of the electronic device, and obtain the absolute moisture content at the dew point temperature by using the dew point temperature are within the understanding range of those skilled in the art, and are not described herein again. Please refer to figure 4 for a psychrometric chart.
Step S504, a wet bulb temperature index of the environment where the electronic equipment is located is calculated and obtained by using a wet bulb fitting method.
After the aforementioned temperature information is obtained, regression fitting is performed to obtain factors for each input parameter. In the step of calculating the wet bulb temperature index of the environment where the electronic equipment is located by using a wet bulb fitting method, the formula is satisfied:
WBGT=k1Tambient+k2Hambient+ c, wherein, TambientExpressed as ambient temperature, k1、k2Expressed as a fitting coefficient, c is a constant associated with the heat dissipating structure of the electronic device.
Referring to fig. 7, fig. 7 is a schematic block diagram of a flow chart of a thermal comfort detection method according to another embodiment of the present application; the thermal comfort detection method in the present embodiment includes, but is not limited to, the following steps.
In step S701, the internal temperature of the electronic device is acquired.
In this step, the detection may be obtained by a temperature sensor provided inside the electronic device.
Step S702, calculating the external temperature of the electronic equipment by using a normalization method.
Where the external temperature is the normalized weighted black & dry bulb temperature.
In step S702, the external temperature of the electronic device is calculated by using the normalization method, wherein the external temperature needs to satisfy the formula (the internal temperature of the electronic device is influenced by the internal power consumption and the external heat dissipation condition; the internal temperature T of the electronic device, the power consumption q of the mobile device and the external temperature TambientIn the following relationship):
Figure BDA0003183096270000111
wherein, TambientExpressed as the ambient temperature, T as the internal temperature of the electronic device, q as the power consumption of the electronic device, and k, n, c are constants associated with the heat dissipation structure of the electronic device. The k, n, and c constants are determined according to the material, heat dissipation efficiency, internal space layout, and the like of the electronic device, and it is generally considered that these parameters are determinable fixed values after the factory structure of the electronic device is determined.
Figure BDA0003183096270000112
Expressed as a derivative over time.
In step S703, the external humidity of the electronic device is acquired.
In step S703, the step of acquiring the external humidity of the electronic device may specifically include the following steps. Referring to fig. 8, fig. 8 is a schematic block diagram illustrating a flow of another embodiment for acquiring the external humidity of the electronic device.
Step S801, obtaining the position information of the current electronic device by using the positioning function of the electronic device.
Step S802, acquiring humidity of the position of the electronic equipment through a network according to the position information of the electronic equipment.
In step S801 and step S802, the electronic device may be provided with a positioning unit, and the humidity sensor may also obtain the relative humidity of the area as an input through a network based on a positioning function such as GPS or beidou system. The humidity information of the position where the electronic equipment is located is obtained under the condition that no hardware equipment is added.
Step S704, calculating a wet bulb temperature index of an environment where the electronic device is located by using a wet bulb fitting method.
After the aforementioned temperature information is obtained, regression fitting is performed to obtain factors for each input parameter. In the step of calculating the wet bulb temperature index of the environment where the electronic equipment is located by using a wet bulb fitting method, the formula is satisfied:
WBGT=k1Tambient+k2Hambient+ c, wherein, TambientExpressed as ambient temperature, k1、k2Expressed as a fitting coefficient, c is a constant associated with the heat dissipating structure of the electronic device.
Compared with the foregoing embodiment, the detection method in this embodiment may utilize a positioning function of a GPS or a beidou system on the electronic device, and acquire the relative humidity of the area through a network as an input. The humidity information of the position where the electronic equipment is located is obtained under the condition that no hardware equipment is added, and the method for obtaining the humidity is simpler.
Optionally, an electronic device is further provided in an embodiment of the present application, please refer to fig. 9, and fig. 9 is a schematic structural diagram of an embodiment of the electronic device in the present application. The electronic device can be a mobile phone, a tablet computer, a notebook computer, a wearable device or a structure separated from a mobile communication device, and is a wet black ball thermometer directly integrating a temperature sensor and a humidity sensor into a compact type. The embodiment of the present application takes an electronic device as an example of a mobile phone structure. It should be noted that the terms "first", "second" and "third" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
The electronic device 10 in this embodiment includes a housing 100, a display 200, a control circuit board 300, and a temperature sensor 400 and a humidity sensor 500 respectively connected to the control circuit board 300. The housing 100 and the display 200 may form an accommodating space, and the control circuit board 300, the temperature sensor 400, and the humidity sensor 500 may be disposed in the accommodating space. For the specific arrangement positions of the temperature sensor 400 and the humidity sensor 500, please refer to the related description of the foregoing embodiments, which is not repeated herein. The electronic device detects the wet bulb temperature index of the environment where the electronic device is located by using the detection method in the embodiment, so as to obtain the thermal comfort level of the environment where the user is located.
Referring to fig. 10, fig. 10 is a block diagram illustrating a structural composition of an embodiment of an electronic device according to the present application, where the electronic device may be a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like, and the embodiment illustrates a mobile phone as an example. The electronic device 10 may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., the display screen 200 in the above embodiment), a sensor 950 (specifically, the temperature sensor 400 and the humidity sensor 500 in the above embodiment may be included), an audio circuit 960, a wifi module 970, a processor 980 (which may be the control circuit board 300 in the above embodiment), a power supply 990, and the like. Wherein the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected with the processor 980; power supply 990 is operable to provide power to the entire electronic device 10.
Specifically, the RF circuit 910 is used for transmitting and receiving signals; the memory 920 is used for storing data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941; the sensor 950 includes a temperature sensor, a humidity sensor, an infrared sensor, a laser sensor, etc., a distance sensor for detecting a user approach signal, a distance signal, etc.; a speaker 961 and a microphone 962 are connected to the processor 980 through the audio circuit 960 for emitting and receiving sound signals; the wifi module 970 is used for receiving and transmitting wifi signals, and the processor 980 is used for processing data information of the electronic device. For specific structural features of the electronic device, please refer to the related description of the above embodiments, and detailed descriptions thereof will not be provided herein.
Referring to fig. 11, fig. 11 is a schematic block diagram of an embodiment of an electronic device according to the present application, where the electronic device includes a first obtaining module 710, a calculating module 720, a second obtaining module 730, and a fitting module 740. The first obtaining module 710 is configured to obtain an internal temperature of an electronic device; the calculating module 720 is used for calculating the external temperature of the electronic device by using a normalization method; the second obtaining module 730 is configured to obtain an external humidity of the electronic device; the fitting module 740 is configured to calculate a wet bulb temperature index of an environment where the electronic device is located by using a wet bulb fitting method.
Referring to fig. 12, fig. 12 is a schematic block diagram of an electronic device according to another embodiment of the present disclosure, where the electronic device includes a first obtaining module 710, a calculating module 720, a second obtaining module 730, a fitting module 740, and a positioning module 750. The first obtaining module 710 is configured to obtain an internal temperature of an electronic device; the calculating module 720 is used for calculating the external temperature of the electronic device by using a normalization method; the second obtaining module 730 is configured to obtain an external humidity of the electronic device; the fitting module 740 is configured to calculate a wet bulb temperature index of an environment where the electronic device is located by using a wet bulb fitting method; the positioning module 750 is used for acquiring the position information of the electronic device.
In the electronic equipment in the embodiment, the temperature and humidity information measured by the electronic equipment is converted into the human body thermal comfort level index by utilizing the heat dissipation similarity relation between the electronic equipment and the human body thermal sensing organ, preliminary temperature and humidity data are obtained by utilizing a temperature and humidity sensor arranged in the electronic equipment, and then a wet bulb temperature index of the environment where the electronic equipment (namely the human body) is located is obtained through a fitting algorithm, so that the electronic equipment has the characteristics of simple structure and accurate calculation of the required sensor; the method greatly facilitates the user to obtain real-time and accurate thermal comfort evaluation information of the environment where the user is located.
Referring to fig. 13, fig. 13 is a schematic structural diagram of an embodiment of a thermal comfort detection apparatus 80 provided in the present application, where the thermal comfort detection apparatus 80 includes a processor 81 and a memory 82 connected to each other, the memory 82 is used for storing program data, and the processor 81 is used for executing the program data to implement the following method:
acquiring the internal temperature of the electronic equipment;
calculating to obtain the external temperature of the electronic equipment by using a normalization method;
acquiring the external humidity of the electronic equipment;
and calculating the wet bulb temperature index of the environment where the electronic equipment is located by using a wet bulb fitting method.
Optionally, in the step of calculating the external temperature of the electronic device by using a normalization method, a formula is satisfied:
Figure BDA0003183096270000141
wherein, TambientExpressed as the ambient temperature, T as the internal temperature of the electronic device, q as the power consumption of the electronic device, and k, n, c are constants associated with the heat dissipation structure of the electronic device.
Optionally, in the step of calculating the wet bulb temperature index of the environment where the electronic device is located by using a wet bulb fitting method, the formula is satisfied:
WDGT=k1Tambient+k2Hambient+ c, wherein, TambientExpressed as ambient temperature, k1、k2Expressed as a fitting coefficient, c is a constant associated with the heat dissipating structure of the electronic device.
Optionally, the step of acquiring the external humidity of the electronic device specifically includes: acquiring the numerical values of the external temperature and the external humidity of the electronic equipment by utilizing a temperature sensor and a humidity sensor which are arranged on the electronic equipment; and acquiring the absolute moisture content of the environment where the electronic equipment is located through the psychrometric chart.
Optionally, the step of obtaining the absolute moisture content of the environment where the electronic device is located through the psychrometric chart includes: and acquiring the dew point temperature by using an enthalpy-humidity diagram according to the acquired values of the external temperature and the humidity of the electronic equipment, and acquiring the absolute moisture content at the dew point temperature through the dew point temperature.
Optionally, the step of acquiring the external humidity of the electronic device includes: the method comprises the steps of obtaining the current position information of the electronic equipment by utilizing the positioning function of the electronic equipment, and obtaining the humidity of the position of the electronic equipment according to the position information of the electronic equipment and through a network.
Optionally, the step of acquiring the internal temperature of the electronic device is obtained by a temperature sensor arranged inside the electronic device. For details of the above steps, reference is made to the related description of the foregoing embodiments, and details are not described here.
Referring to fig. 14, fig. 14 is a schematic structural diagram of a computer storage medium according to an embodiment of the present application, where the computer storage medium 90 stores program data 91, and the program data 91, when executed by a processor, is used to implement the following method:
acquiring the internal temperature of the electronic equipment;
calculating to obtain the external temperature of the electronic equipment by using a normalization method;
acquiring the external humidity of the electronic equipment;
and calculating the wet bulb temperature index of the environment where the electronic equipment is located by using a wet bulb fitting method.
For details of the above steps, reference is made to the related description of the foregoing embodiments, and details are not described here.
In the several embodiments provided in the present application, it should be understood that the disclosed method and apparatus may be implemented in other manners. For example, the above-described device embodiments are merely illustrative, and for example, the division of the modules or units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the embodiment.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated units in the other embodiments described above may be stored in a computer-readable storage medium if they are implemented in the form of software functional units and sold or used as separate products. Based on such understanding, the technical solution of the present application may be substantially implemented or contributed by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, a network device, or the like) or a processor (processor) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
The above description is only a part of the embodiments of the present invention, and not intended to limit the scope of the present invention, and all equivalent devices or equivalent processes performed by the present invention through the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A method of detecting thermal comfort, the method comprising:
acquiring the internal temperature of the electronic equipment;
calculating to obtain the external temperature of the electronic equipment by using a normalization method;
acquiring the external humidity of the electronic equipment;
and calculating the wet bulb temperature index of the environment where the electronic equipment is located by using a wet bulb fitting method.
2. The method according to claim 1, wherein the step of calculating the external temperature of the electronic device by using the normalization method satisfies a formula:
Figure FDA0003183096260000011
wherein, TambientExpressed as the ambient temperature, T as the internal temperature of the electronic device, q as the power consumption of the electronic device, and k, n, c are constants associated with the heat dissipation structure of the electronic device.
3. The detection method according to claim 1, wherein in the step of calculating the wet bulb temperature index of the environment where the electronic device is located by using a wet bulb fitting method, the formula is satisfied: WDGT ═ k1Tambient+k2IIambient+ c, wherein, TambientExpressed as ambient temperature, k1、k2Expressed as a fitting coefficient, c is a constant associated with the heat dissipating structure of the electronic device.
4. The method according to claim 1, wherein the step of obtaining the external humidity of the electronic device specifically comprises: acquiring the numerical values of the external temperature and the external humidity of the electronic equipment by utilizing a temperature sensor and a humidity sensor which are arranged on the electronic equipment; and acquiring the absolute moisture content of the environment where the electronic equipment is located through the psychrometric chart.
5. The detection method according to claim 4, wherein the step of obtaining the absolute moisture content of the environment in which the electronic equipment is located through the psychrometric chart comprises: and acquiring the dew point temperature by using an enthalpy-humidity diagram according to the acquired values of the external temperature and the humidity of the electronic equipment, and acquiring the absolute moisture content at the dew point temperature through the dew point temperature.
6. The method according to claim 1, wherein the step of acquiring the external humidity of the electronic device comprises: the method comprises the steps of obtaining the current position information of the electronic equipment by utilizing the positioning function of the electronic equipment, and obtaining the humidity of the position of the electronic equipment according to the position information of the electronic equipment and through a network.
7. An electronic device is characterized by comprising a control circuit board, and a temperature sensor and a humidity sensor which are respectively connected with the control circuit board; the electronic device detects the wet bulb temperature index of the environment in which the electronic device is located by the detection method according to any one of claims 1 to 6.
8. An electronic device, characterized in that the electronic device comprises:
the first acquisition module is used for acquiring the internal temperature of the electronic equipment;
the computing module is used for computing the external temperature of the electronic equipment by utilizing a normalization method;
the second acquisition module is used for acquiring the external humidity of the electronic equipment;
and the fitting module is used for calculating and obtaining the wet bulb temperature index of the environment where the electronic equipment is located by utilizing a wet bulb fitting method.
9. A device for detecting thermal comfort, characterized in that it comprises a processor and a memory, in which program data are stored, the processor being adapted to execute the program data to carry out the detection method according to any one of claims 1 to 6.
10. A computer storage medium, characterized in that the computer storage medium has stored therein program data which, when executed by the processor, is adapted to carry out the detection method according to any one of claims 1-6.
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