CN113566536A

CN113566536A - Semiconductor processing is with even drying device

Info

Publication number: CN113566536A
Application number: CN202111103043.9A
Authority: CN
Inventors: 秦小军
Original assignee: Nantong Xunteng Precision Equipment Co ltd
Current assignee: Nantong Xunteng Precision Equipment Co ltd
Priority date: 2021-09-18
Filing date: 2021-09-18
Publication date: 2021-10-29

Abstract

The invention relates to the technical field of semiconductor processing, and discloses a uniform drying device for semiconductor processing, which comprises a drying box body and a supporting structure fixedly arranged at the lower end of the drying box body, wherein a control panel is fixedly arranged on one side of the drying box body, a connecting shaft is connected with a rotating shaft through a belt, the connecting shaft can rotate through the cooperation of the belt when a driving motor works, the connecting shaft penetrates through a mounting plate, a gear B is arranged at one end of the mounting plate, a shaft lever is arranged on one side of the mounting plate, a gear C is arranged on the outer side of one end of the shaft lever, the gear B is meshed with the gear C, the motion direction of the gear B is opposite to that of the gear C, the gear C is meshed and connected with a tooth socket B arranged at the lower end of a linkage plate, so that the linkage plate can move towards the opposite direction of a bearing plate, when the bearing plate moves to be flush with an opening of the drying box body, a dust suction hood at the lower end of the linkage plate is positioned above the left end of the bearing plate, facilitating subsequent dust collection.

Description

Semiconductor processing is with even drying device

Technical Field

The invention relates to the technical field of semiconductor processing, in particular to a uniform drying device for semiconductor processing.

Background

The semiconductor is a substance with conductivity between an insulator and a conductor, and the conductivity of the semiconductor is easy to control and can be used as an element material for information processing. Semiconductors are very important from the viewpoint of technological or economic development. The core elements of many electronic products, such as computers, mobile phones, and digital recorders, utilize the conductivity change of semiconductors to process information. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential of various semiconductor materials in commercial applications, and semiconductor substances exist in various forms, solid, liquid, gas, plasma, etc.

At present, need carry out drying process to it after the semiconductor wafer processing is clean, current drying device is when using, need place its surface with the semiconductor wafer again after pulling out a section distance with the loading board manually usually to the follow-up drying process that carries out, it is comparatively loaded down with trivial details to operate like this, need the manual work to promote always, and placing the in-process that removes with the semiconductor, do not carry out the structure of dust absorption to the semiconductor surface, the dust easily glues on its surface, influences subsequent processing, the result of use is not good.

To above problem, improved current device, provided an even drying device for semiconductor processing.

Disclosure of Invention

The invention aims to provide a uniform drying device for processing semiconductors, wherein when the uniform drying device is not used, a gear A and a tooth socket A are meshed and connected at the center of an auxiliary plate, a driving motor is started to work at the moment, a rotating shaft and the gear A are driven to rotate clockwise, a bearing plate can move towards the outer side of a drying box body through the matching of the gear A and the tooth socket A until the right end of the bearing plate is flush with the opening of the drying box body, an inner groove is formed in the surface of the bearing plate, an operator can place a semiconductor in the inner groove, the driving motor drives the rotating shaft and the gear A to rotate reversely at the moment, the bearing plate drives the semiconductor to move into the drying box body, so that the subsequent processing treatment is facilitated, the pushing is not required all the time, the manual burden is reduced, and the problems in the background technology are solved.

In order to achieve the purpose, the invention provides the following technical scheme: a uniform drying device for semiconductor processing comprises a drying box body and a supporting structure fixedly installed at the lower end of the drying box body, wherein a control panel is fixedly installed on one side of the drying box body;

the sideslip structure is including setting up the driving motor in the stoving box outside and the pivot of being connected with the driving motor output, and the pivot runs through one side of stoving box to cup joint the installation with gear A, the loading board is installed to gear A's upper end, and the link piece is all installed at the both ends of loading board.

Furthermore, the inside groove has been seted up to the inside of loading board, and inside groove internally mounted has the heating member, and the water tank is still installed to the inside of inside groove, and two sets of slider A are installed to the lower extreme of loading board, and the steam passageway is installed to one side of water tank, and the inner wall of steam passageway is installed and is linked up the piece, and the fan blade is still installed to one side of linking up the piece, and the fan blade passes through connecting axostylus axostyle movable mounting in one side of linking up the piece, and the other end of connecting axostylus axostyle runs through the steam passageway to be connected with anchor clamps, the upper end of steam passageway is provided with the blast pipe.

Furthermore, the connecting pieces comprise auxiliary plates arranged on two sides of the bearing plate and tooth grooves A uniformly formed in the upper ends of the auxiliary plates, the tooth grooves A are connected with the gears A in a meshed mode, two groups of connecting pieces are arranged, and the two groups of connecting pieces are symmetrically arranged relative to the transverse center line of the bearing plate.

Further, the drying box body comprises a box door and a sliding groove arranged on the upper inner wall and the lower inner wall of the drying box body, the box door is hinged to be installed on one side of the drying box body, the sliding groove is matched with the sliding block A, and a sealing ring is installed at the upper end of the drying box body.

Further, bearing structure includes the base of fixed mounting at the lower extreme of stoving box and sets up the removal wheel at the base lower extreme, and the mounting bracket is installed to one side of base, and driving motor is installed to the upper end of mounting bracket.

Further, linkage structure cup joints the belt in the connecting axle outside including the connecting axle and the activity that run through stoving box one side, is connected by the belt between connecting axle and the pivot, and the connecting axle still runs through the mounting panel, and the outside of connecting axle has cup jointed gear B, and the mounting panel is installed through the bolt with stoving box inner wall, and one side of mounting panel is provided with the axostylus axostyle, and gear C has been cup jointed to the one end that the mounting panel was kept away from to the axostylus axostyle, gear B and gear C intermeshing, gear C's diameter is greater than gear B's diameter.

Further, the stoving subassembly includes the bottom plate of fixed mounting in the stoving box outside and sets up the air heater in the bottom plate upper end, and the one end and the defeated tuber pipe of air heater are linked together, and defeated tuber pipe runs through the stoving box, and is linked together with the collection wind chamber of installing in the inside of stoving box, and the internally mounted in collection wind chamber has the flow equalizing board, and one side in collection wind chamber still evenly is provided with the nozzle.

Furthermore, the cleaning assembly comprises a linkage plate and a connecting block arranged at the upper end of the linkage plate, a sliding block B is installed at the upper end of the connecting block, a dust collecting chamber is installed at the upper end of the linkage plate, a telescopic pipe is arranged at one end of the dust collecting chamber, penetrates through the linkage plate and is connected with the dust hood, an electric push rod is further installed at the upper end of the dust hood, the upper end of the electric push rod is connected with the linkage plate, a tooth groove B is arranged on the bottom surface of the linkage plate, and the tooth groove B is meshed with a gear C.

Furthermore, a partition board is fixedly mounted inside the dust collecting chamber, a suction fan is arranged on one side of the partition board, one end of the suction fan is connected with the suction pipe, the other end of the suction pipe penetrates through the partition board, a filter screen is mounted on one side of the partition board, an exhaust pipe is arranged on the other end of the suction fan, penetrates through the dust collecting chamber and the drying box body, and is arranged on the inner side of the sealing ring.

Further, gear B moves in the opposite direction to gear C.

Compared with the prior art, the invention has the beneficial effects that:

1. the invention provides a uniform drying device for semiconductor processing, wherein one side of a base is provided with a mounting rack, the upper end of the mounting rack is provided with a driving motor, the output end of the driving motor is connected with a rotating shaft, the other end of the rotating shaft penetrates through a drying box body and is sleeved with a gear A, two sides of a bearing plate are respectively provided with an auxiliary plate, the upper end of the auxiliary plate is provided with a tooth socket A, the tooth socket A is meshed with the gear A and is arranged at the center of the auxiliary plate, when the uniform drying device is not used, the gear A is meshed with the tooth socket A and is connected with the tooth socket A, the driving motor is started to work at the moment, the rotating shaft and the gear A are driven to rotate clockwise, the bearing plate can move towards the outer side of the drying box body through the matching of the gear A and the tooth socket A until the right end of the bearing plate is flush with the opening of the drying box body, meanwhile, the upper end of the bearing plate is provided with a steam passage, and a clamp is arranged at one side of the steam passage, the semiconductor wafer can be clamped tightly through the clamp that sets up by operating personnel, makes driving motor drive pivot and gear A reversal this moment, can drive the semiconductor wafer with the loading board and remove to the stoving incasement in to follow-up processing need not the manual work and promotes always, alleviates artifical burden.

2. The invention provides a uniform drying device for semiconductor processing, wherein a connecting shaft penetrates through one side of a drying box body, a belt is movably sleeved on the outer side of the connecting shaft, the connecting shaft is connected with a rotating shaft through the belt, when a driving motor works, the connecting shaft can be rotated through the matching of the belt, a mounting plate is fixedly mounted on the inner wall of the drying box body through bolts, the connecting shaft penetrates through the mounting plate, one end of the mounting plate is also provided with a shaft lever, the outer side of one end of the shaft lever is provided with a gear C, the gear B is meshed with the gear C, the gear C can be rotated while the connecting shaft rotates, the motion directions of the gear B and the gear C are opposite, the gear C is meshed and connected with a tooth groove B arranged at the lower end of a linkage plate, so that the linkage plate can move towards the opposite direction of a bearing plate, and a slide block B mounted at the upper end of the linkage plate through a connecting block can stably slide in a chute, when the right end of the bearing plate moves to be flush with the opening of the drying box body, the dust hood at the lower end of the linkage plate is located above the left end of the bearing plate, and an operator can enable the lower end of the linkage plate to be provided with an electric push rod through a switch to push the dust hood to move downwards, so that subsequent dust collection is facilitated.

3. According to the uniform drying device for semiconductor processing, the dust collecting chamber is mounted at the upper end of the linkage plate, the partition plate is mounted inside the dust collecting chamber, the suction fan is located on the left side of the partition plate, one end of the suction fan is connected with the suction pipe, the suction pipe penetrates through the partition plate, the filter screen is arranged on one side of the partition plate, the other end of the suction fan is connected with the exhaust pipe, the dust hood is connected with the dust collecting chamber through the telescopic pipe, the exhaust pipe is of a telescopic structure, the suction fan is started to work at the moment, the diameter of the gear C is larger than that of the gear B through the matching of the suction pipe, the telescopic pipe and the dust hood, the gear B is consistent with the gear A in structure, dust on the surface of a semiconductor can be adsorbed conveniently, the dust can be stagnated in the cavity on the right side of the partition plate, and the dust removing effect is good.

4. The invention provides a uniform drying device for semiconductor processing, wherein a heating element is uniformly arranged in an inner groove, the heating element is externally connected with a power supply, one side of the heating element is provided with a water tank, when the dust collection on the surface of a semiconductor is finished, the heating element is enabled to work by utilizing a switch, the water tank can be heated, the temperature in the water tank is continuously raised, water in the water tank can be evaporated into high-temperature steam, the high-temperature steam can flow along a steam passage, the fan blade is movably arranged on one side of a connecting block through a connecting shaft rod, the high-temperature steam can impact the fan blade and can enable the fan blade to rotate, namely, the heat in the high-temperature steam can be converted into mechanical energy for rotating the fan blade, so that a clamp can be rotated, a semiconductor wafer can be clamped through the clamp, the semiconductor wafer can be rotated and the moisture adhered to the surface of the semiconductor wafer can be centrifuged at the same time, the feasible more even that is heated, avoid the single face to be heated for a long time and influence the quality of semiconductor wafer, install the bottom plate in the outside of stoving box simultaneously, air heater fixed mounting is in the upper end of bottom plate, the air heater is connected through defeated tuber pipe and the inside collection wind chamber of stoving box, open the air heater work, utilize defeated tuber pipe to carry hot-blastly, and be equipped with the flow equalizing plate in the inside in collection wind chamber, the surface in collection wind chamber evenly is provided with the nozzle, make hot-blastly can evenly follow the nozzle blowout, the stoving subassembly is provided with two sets ofly, two sets of collection wind chambers set up relatively, the supplementary inside temperature of stoving box that increases, the use of being convenient for stoving.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a diagram illustrating the motion state of the driving motor according to the present invention;

FIG. 3 is a schematic view of a linkage structure according to the present invention;

FIG. 4 is a schematic diagram of a mounting plate structure according to the present invention;

FIG. 5 is a schematic view of the dust collecting chamber of the present invention;

FIG. 6 is an enlarged view taken at A in FIG. 3 according to the present invention;

FIG. 7 is a schematic view of a connector structure according to the present invention;

FIG. 8 is a schematic structural view of a part of the carrier plate according to the present invention;

FIG. 9 is a schematic diagram of a structure of a carrier plate according to the present invention.

In the figure: 1. drying the box body; 11. a box door; 12. a chute; 13. a seal ring; 2. a support structure; 21. a base; 22. a moving wheel; 23. a mounting frame; 3. a control panel; 4. a drying assembly; 41. a base plate; 42. a hot air blower; 43. a wind delivery pipe; 44. a wind collecting cavity; 45. a flow equalizing plate; 46. a nozzle; 5. a traversing structure; 51. a drive motor; 52. a rotating shaft; 53. a gear A; 54. a carrier plate; 541. an inner tank; 542. a heating member; 543. a water tank; 544. a slide block A; 545. a steam passage; 546. a joining block; 547. a fan blade; 548. a clamp; 549. an exhaust pipe; 55. a joining member; 551. an auxiliary plate; 552. a tooth socket A; 6. a linkage structure; 61. a connecting shaft; 62. a belt; 63. mounting a plate; 64. a bolt; 65. a gear B; 66. a shaft lever; 67. a gear C; 7. cleaning the assembly; 71. a linkage plate; 72. connecting blocks; 73. a slide block B; 74. a dust collecting chamber; 741. a partition plate; 742. a suction fan; 743. an air suction pipe; 744. an exhaust duct; 745. filtering with a screen; 75. a telescopic pipe; 76. a dust hood; 77. an electric push rod; 78. a tooth socket B.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 and 2, an even drying device for semiconductor processing comprises a drying box body 1 and a supporting structure 2 fixedly installed at the lower end of the drying box body 1, wherein a control panel 3 is fixedly installed at one side of the drying box body 1, a drying assembly 4 is installed at one side of the drying box body 1, a transverse moving structure 5 is arranged at one side of the drying assembly 4, a linkage structure 6 is installed at the upper end of the transverse moving structure 5, and a cleaning assembly 7 is also installed inside the drying box body 1; used for cleaning the surface of the semiconductor.

Referring to fig. 3, 7, 8 and 9, the traverse structure 5 includes a driving motor 51 disposed outside the drying box 1 and a rotating shaft 52 connected to an output end of the driving motor 51, the rotating shaft 52 penetrates through one side of the drying box 1 and is mounted in a sleeved manner with a gear a53, a bearing plate 54 is mounted at an upper end of the gear a53, and two ends of the bearing plate 54 are both mounted with a connecting piece 55; when the drying oven is not used, the gear A53 is meshed with the tooth socket A552 and connected with the center of the auxiliary plate 551, at this time, the driving motor 51 is started to work, the rotating shaft 52 and the gear A53 are enabled to rotate clockwise, the bearing plate 54 can move towards the outer side of the drying oven body 1 through the matching of the gear A53 and the tooth socket A552 until the right end of the bearing plate 54 is flush with the opening of the drying oven body 1, meanwhile, the steam passage 545 is installed at the upper end of the bearing plate 54, the clamp 548 is installed at one side of the steam passage 545, an operator can clamp a semiconductor wafer through the arranged clamp 548, at this time, the driving motor 51 drives the rotating shaft 52 and the gear A53 to rotate reversely, the bearing plate 54 can drive the semiconductor to move into the drying oven body 1, so that subsequent processing can be carried out, manual pushing is not needed, and the manual burden is reduced.

An inner groove 541 is formed in the bearing plate 54, a heating element 542 is arranged in the inner groove 541, a water tank 543 is further arranged in the inner groove 541, two sets of sliders A544 are arranged at the lower end of the bearing plate 54, a steam passage 545 is arranged on one side of the water tank 543, a connecting block 546 is arranged on the inner wall of the steam passage 545, a fan blade 547 is further arranged on one side of the connecting block 546, the fan blade 547 is movably arranged on one side of the connecting block 546 through a connecting shaft rod, the other end of the connecting shaft rod penetrates through the steam passage 545 and is connected with a clamp 548, and an exhaust pipe 549 is arranged at the upper end of the steam passage 545; the connecting pieces 55 comprise auxiliary plates 551 arranged on two sides of the bearing plate 54 and tooth sockets A552 uniformly arranged at the upper ends of the auxiliary plates 551, the tooth sockets A552 are meshed with the gear A53, two groups of connecting pieces 55 are arranged, and the two groups of connecting pieces 55 are symmetrically arranged about the transverse center line of the bearing plate 54; after the dust collection of the surface of the semiconductor is finished, the heating element 542 works by utilizing the switch, the water tank 543 can be heated, water in the water tank 543 can be evaporated into high-temperature steam, the high-temperature steam can flow along the steam passage 545, the fan blade 547 is movably arranged on one side of the connecting block 546 through the connecting shaft rod, the high-temperature steam can impact the fan blade 547 and can rotate the fan blade 547, namely, heat in the high-temperature steam can be converted into mechanical energy for rotating the fan blade 547, further, the clamp 548 can be rotated, the semiconductor wafer is clamped through the clamp 548, so that the semiconductor wafer can be rotated, the moisture adhered to the surface of the semiconductor wafer is centrifuged while the semiconductor wafer is rotated, the heating is more uniform, and the influence on the quality of the semiconductor wafer caused by long-time heating of a single surface is avoided.

Referring to fig. 1 and 2, the drying box 1 includes a box door 11 and a chute 12 disposed on the upper and lower inner walls of the drying box 1, the box door 11 is hinged to one side of the drying box 1, the chute 12 is matched with a slide block a544, and a sealing ring 13 is mounted on the upper end of the drying box 1; the supporting structure 2 comprises a base 21 fixedly installed at the lower end of the drying box body 1 and a moving wheel 22 arranged at the lower end of the base 21, an installation frame 23 is installed at one side of the base 21, a driving motor 51 is installed at the upper end of the installation frame 23, and the installation frame 23 is used for supporting the driving motor 51.

Referring to fig. 3 and 4, the linkage structure 6 includes a connecting shaft 61 penetrating through one side of the drying box 1 and a belt 62 movably sleeved on the outer side of the connecting shaft 61, the connecting shaft 61 is connected with the rotating shaft 52 by the belt 62, the connecting shaft 61 further penetrates through an installation plate 63, a gear B65 is sleeved on the outer side of the connecting shaft 61, the installation plate 63 is installed on the inner wall of the drying box 1 through a bolt 64, a shaft lever 66 is arranged on one side of the installation plate 63, a gear C67 is sleeved on one end of the shaft lever 66 far away from the installation plate 63, the gear B65 is engaged with the gear C67, and the diameter of the gear C67 is larger than that of the gear B65; gear B65 moves in the opposite direction of gear C67; when the driving motor 51 works, the connecting shaft 61 can be rotated by the cooperation of the belt 62, the gear C67 can be rotated while the connecting shaft 61 is rotated, the motion direction of the gear B65 is opposite to that of the gear C67, the gear C67 is meshed with a tooth groove B78 arranged at the lower end of the linkage plate 71, so that the linkage plate 71 can move in the direction opposite to that of the bearing plate 54, at the moment, the sliding block B73 arranged at the upper end of the linkage plate 71 through the connecting block 72 can stably slide in the sliding groove 12, when the right end of the bearing plate 54 moves to be flush with the opening of the drying box body 1, the dust hood 76 at the lower end of the linkage plate 71 is positioned above the left end of the bearing plate 54, and an operator can use the switch to enable the lower end of the linkage plate 71 to be provided with the electric push rod 77 to push the dust hood 76 to move downwards, so as to facilitate subsequent dust collection.

Referring to fig. 2 and 5, the drying assembly 4 includes a bottom plate 41 fixedly installed outside the drying box 1 and an air heater 42 installed at the upper end of the bottom plate 41, one end of the air heater 42 is communicated with an air delivery pipe 43, the air delivery pipe 43 penetrates through the drying box 1 and is communicated with an air collection chamber 44 installed inside the drying box 1, a flow equalization plate 45 is installed inside the air collection chamber 44, and nozzles 46 are evenly arranged at one side of the air collection chamber 44; open air heater 42 work, utilize defeated tuber pipe 43 to carry hot-blastly, and be equipped with flow equalizing plate 45 in the inside of collection wind chamber 44, the surface in collection wind chamber 44 evenly is provided with nozzle 46 for hot-blastly can evenly be followed nozzle 46 blowout, stoving subassembly 4 is provided with two sets ofly, and two sets of collection wind chambers 44 set up relatively, and the supplementary inside temperature that increases stoving box 1 is convenient for dry and use.

Referring to fig. 3, 5 and 6, the cleaning assembly 7 comprises a linkage plate 71 and a connecting block 72 arranged at the upper end of the linkage plate 71, a sliding block B73 is installed at the upper end of the connecting block 72, a dust collecting chamber 74 is installed at the upper end of the linkage plate 71, an extension pipe 75 is arranged at one end of the dust collecting chamber 74, the extension pipe 75 penetrates through the linkage plate 71 and is connected with a dust hood 76, an electric push rod 77 is also installed at the upper end of the dust hood 76, the upper end of the electric push rod 77 is connected with the linkage plate 71, a toothed groove B78 is arranged at the bottom surface of the linkage plate 71, and the toothed groove B78 is meshed with a gear C67; a partition plate 741 is fixedly installed inside the dust collection chamber 74, a suction fan 742 is arranged on one side of the partition plate 741, one end of the suction fan 742 is connected with a suction pipe 743, the other end of the suction pipe 743 penetrates through the partition plate 741, a filter screen 745 is installed on one side of the partition plate 741, an exhaust pipe 744 is arranged on the other end of the suction fan 742, and the exhaust pipe 744 penetrates through the dust collection chamber 74 and the drying box 1 and is arranged on the inner side of the sealing ring 13; and the exhaust pipe 744 is a telescopic structure, at this time, the suction fan 742 is started to work, through the matching of the exhaust pipe 743, the telescopic pipe 75 and the dust hood 76, the diameter of the gear C67 is larger than that of the gear B65, the gear B65 and the gear A53 are consistent in structure, so that dust on the surface of the semiconductor can be adsorbed conveniently, the dust can be stagnated in the cavity on the right side of the partition 741, and the dust removal effect is good.

The working principle is as follows: when the drying oven is not used, the gear A53 is engaged with the tooth socket A552 and connected with the center of the auxiliary plate 551, at this time, the driving motor 51 is started to work, so that the rotating shaft 52 and the gear A53 rotate clockwise, the bearing plate 54 can move towards the outer side of the drying oven body 1 through the matching of the gear A53 and the tooth socket A552 until the right end of the bearing plate 54 is flush with the opening of the drying oven body 1, the upper end of the bearing plate 54 is provided with a steam passage 545, a clamp 548 is arranged at one side of the steam passage 545, an operator can clamp the semiconductor wafer through the arranged clamp 548, at this time, the driving motor 51 drives the rotating shaft 52 and the gear A53 to rotate reversely, the bearing plate 54 can drive the semiconductor to move into the drying oven body 1 for subsequent processing, when the driving motor 51 works, the connecting shaft 61 can rotate through the matching of the belt 62, the gear C67 can rotate while the connecting shaft 61 rotates, the gear B65 and the gear C67 move in opposite directions, the gear C67 is engaged with a toothed groove B78 arranged at the lower end of the linkage plate 71, so that the linkage plate 71 can move in the opposite direction to the bearing plate 54, at the moment, a slider B73 arranged at the upper end of the linkage plate 71 through a connecting block 72 can slide in the sliding groove 12 smoothly, when the right end of the bearing plate 54 moves to be flush with the opening of the drying box body 1, a dust hood 76 at the lower end of the linkage plate 71 is positioned above the left end of the bearing plate 54, an operator can enable the lower end of the linkage plate 71 to be provided with an electric push rod 77 to push the dust hood 76 to move downwards by using a switch, so as to facilitate subsequent dust collection, a dust collection chamber 74 is arranged at the upper end of the linkage plate 71, a partition plate 741 is arranged inside the dust collection chamber 74, a suction fan 742 is positioned at the left side of the partition plate 741, one end of the suction fan 742 is connected with a suction pipe 743, the suction pipe 743 penetrates through the partition plate 741, and a filter screen 745 is arranged at one side of the partition plate 741, the other end of the suction fan 742 is connected with an exhaust pipe 744, the dust hood 76 is connected with the dust collection chamber 74 through an extension pipe 75, the exhaust pipe 744 is of a telescopic structure, the suction fan 742 is started to work at the moment, the diameter of the gear C67 is larger than that of the gear B65 through the matching of the suction pipe 743, the extension pipe 75 and the dust hood 76, the gear B65 is consistent with the gear A53 in structure, so that dust on the surface of a semiconductor can be adsorbed conveniently, the dust can be stagnated in a cavity on the right side of the partition 741, heating elements 542 are uniformly arranged inside the inner groove 541, the heating elements 542 are externally connected with a power supply, after the dust collection on the surface of the semiconductor is finished, the heating elements 542 work through a switch, the water tank 543 can be heated, the temperature inside the water tank 543 can be continuously raised, water in the water tank 543 can be evaporated into high-temperature steam, the high-temperature steam can flow along the steam passage 545, the fan blades 547 are movably arranged on one side of the connecting block 546, the high-temperature steam can impact the fan blade 547, the fan blade 547 can rotate, namely, the heat in the high-temperature steam can be converted into mechanical energy for rotating the fan blade 547, and further, the clamp 548 can rotate, the semiconductor wafer can be clamped by the clamp 548, so that the semiconductor wafer can rotate, the moisture adhered to the surface of the semiconductor wafer is centrifuged while the semiconductor wafer rotates, so that the semiconductor wafer is heated more uniformly, the influence on the quality of the semiconductor wafer caused by long-time heating of a single surface is avoided, meanwhile, the bottom plate 41 is installed on the outer side of the drying box body 1, the hot air blower 42 is fixedly installed at the upper end of the bottom plate 41, the hot air blower 42 is connected with the air collecting cavity 44 inside the drying box body 1 through the air conveying pipe 43, the hot air blower 42 is started to work, the hot air is conveyed through the air conveying pipe 43, the flow equalizing plate 45 is arranged inside the air collecting cavity 44, the nozzles 46 are uniformly arranged on the surface of the air collecting cavity 44, so that the hot air can be uniformly sprayed out from the nozzles 46, the drying component 4 is provided with two sets, and two sets of air collecting cavities 44 are arranged oppositely, so that the temperature inside the drying box body 1 is increased in an auxiliary manner, and the drying is convenient.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.

Claims

1. The utility model provides an even drying device is used in semiconductor processing, includes stoving box (1) and fixed mounting in bearing structure (2) of stoving box (1) lower extreme, one side of stoving box (1) is fixed mounting still has control panel (3), its characterized in that: a drying assembly (4) is installed on one side of the drying box body (1), a transverse moving structure (5) is arranged on one side of the drying assembly (4), a linkage structure (6) is installed at the upper end of the transverse moving structure (5), and a cleaning assembly (7) is further installed inside the drying box body (1);

the transverse moving structure (5) comprises a driving motor (51) arranged on the outer side of the drying box body (1) and a rotating shaft (52) connected with the output end of the driving motor (51), the rotating shaft (52) penetrates through one side of the drying box body (1) and is sleeved with a gear A (53), a bearing plate (54) is installed at the upper end of the gear A (53), and connecting pieces (55) are installed at two ends of the bearing plate (54);

an inner groove (541) is formed in the bearing plate (54), a heating element (542) is installed in the inner groove (541), a water tank (543) is further installed in the inner groove (541), two sets of sliding blocks A (544) are installed at the lower end of the bearing plate (54), a steam passage (545) is installed on one side of the water tank (543), a connecting block (546) is installed on the inner wall of the steam passage (545), fan blades (547) are further installed on one side of the connecting block (546), the fan blades (547) are movably installed on one side of the connecting block (546) through a connecting shaft rod, the other end of the connecting shaft rod penetrates through the steam passage (545) and is connected with a clamp (548), and an exhaust pipe (549) is arranged at the upper end of the steam passage (545);

the connecting piece (55) comprises auxiliary plates (551) arranged on two sides of the bearing plate (54) and tooth sockets A (552) uniformly arranged at the upper end of the auxiliary plates (551), the tooth sockets A (552) are meshed and connected with the gear A (53), two groups of connecting pieces (55) are arranged, and the two groups of connecting pieces (55) are symmetrically arranged relative to the transverse center line of the bearing plate (54).

2. The uniform drying apparatus for semiconductor processing according to claim 1, wherein: the drying box body (1) comprises a box door (11) and a sliding groove (12) arranged on the upper inner wall and the lower inner wall of the drying box body (1), the box door (11) is hinged to be installed on one side of the drying box body (1), the sliding groove (12) is matched with a sliding block A (544), and a sealing ring (13) is installed at the upper end of the drying box body (1).

3. The uniform drying apparatus for semiconductor processing according to claim 2, wherein: the supporting structure (2) comprises a base (21) fixedly mounted at the lower end of the drying box body (1) and a moving wheel (22) arranged at the lower end of the base (21), an installation frame (23) is mounted on one side of the base (21), and a driving motor (51) is mounted at the upper end of the installation frame (23).

4. The uniform drying apparatus for semiconductor processing according to claim 3, wherein: linkage structure (6) including connecting axle (61) and the activity that runs through stoving box (1) one side cup joints belt (62) in connecting axle (61) outside, be connected by belt (62) between connecting axle (61) and pivot (52), connecting axle (61) still runs through mounting panel (63), and gear B (65) have been cup jointed in the outside of connecting axle (61), mounting panel (63) are installed through bolt (64) with stoving box (1) inner wall, one side of mounting panel (63) is provided with axostylus axostyle (66), gear C (67) has been cup jointed to the one end that mounting panel (63) were kept away from in axostylus axostyle (66), gear B (65) and gear C (67) intermeshing, the diameter of gear C (67) is greater than the diameter of gear B (65).

5. The uniform drying apparatus for semiconductor processing according to claim 1, wherein: the drying assembly (4) comprises a bottom plate (41) fixedly mounted on the outer side of the drying box body (1) and an air heater (42) arranged at the upper end of the bottom plate (41), one end of the air heater (42) is communicated with an air conveying pipe (43), the air conveying pipe (43) penetrates through the drying box body (1) and is communicated with an air collecting cavity (44) mounted inside the drying box body (1), a flow equalizing plate (45) is mounted inside the air collecting cavity (44), and a nozzle (46) is further uniformly arranged on one side of the air collecting cavity (44).

6. The uniform drying apparatus for semiconductor processing according to claim 4, wherein: the cleaning assembly (7) comprises a linkage plate (71) and a connecting block (72) arranged at the upper end of the linkage plate (71), a sliding block B (73) is installed at the upper end of the connecting block (72), a dust collecting chamber (74) is installed at the upper end of the linkage plate (71), an expansion pipe (75) is arranged at one end of the dust collecting chamber (74), the expansion pipe (75) penetrates through the linkage plate (71) and is connected with a dust hood (76), an electric push rod (77) is further installed at the upper end of the dust hood (76), the upper end of the electric push rod (77) is connected with the linkage plate (71), a tooth groove B (78) is arranged on the bottom surface of the linkage plate (71), and the tooth groove B (78) is meshed with a gear C (67).

7. The uniform drying apparatus for semiconductor processing according to claim 6, wherein: a partition board (741) is fixedly mounted inside the dust collection chamber (74), a suction fan (742) is arranged on one side of the partition board (741), one end of the suction fan (742) is connected with a suction pipe (743), the other end of the suction pipe (743) penetrates through the partition board (741), a filter screen (745) is mounted on one side of the partition board (741), an exhaust pipe (744) is arranged on the other end of the suction fan (742), and the exhaust pipe (744) penetrates through the dust collection chamber (74) and the drying box body (1) and is arranged on the inner side of the sealing ring (13).

8. The uniform drying apparatus for semiconductor processing according to claim 4, wherein: gear B (65) moves in the opposite direction to gear C (67).