CN113555455B - Flat panel detector substrate, manufacturing method, flat panel detector and image pickup apparatus - Google Patents
Flat panel detector substrate, manufacturing method, flat panel detector and image pickup apparatus Download PDFInfo
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- CN113555455B CN113555455B CN202110827213.1A CN202110827213A CN113555455B CN 113555455 B CN113555455 B CN 113555455B CN 202110827213 A CN202110827213 A CN 202110827213A CN 113555455 B CN113555455 B CN 113555455B
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- 239000000758 substrate Substances 0.000 title claims abstract description 121
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000945 filler Substances 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims description 26
- 239000010410 layer Substances 0.000 claims description 22
- 230000001154 acute effect Effects 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 abstract description 14
- 238000001514 detection method Methods 0.000 abstract description 11
- 239000002245 particle Substances 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- MCVAAHQLXUXWLC-UHFFFAOYSA-N [O-2].[O-2].[S-2].[Gd+3].[Gd+3] Chemical compound [O-2].[O-2].[S-2].[Gd+3].[Gd+3] MCVAAHQLXUXWLC-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Chemical compound [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- -1 perovskite Chemical compound 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02322—Optical elements or arrangements associated with the device comprising luminescent members, e.g. fluorescent sheets upon the device
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Measurement Of Radiation (AREA)
Abstract
The invention discloses a flat panel detector substrate, a manufacturing method, a flat panel detector and image pickup equipment, wherein the flat panel detector substrate comprises the following components: a substrate; the scintillator films are spliced and attached to the surface of the substrate; and the filler of the scintillator material is filled in the splicing gaps among the plurality of scintillator films. The invention can also receive high-energy particles or rays at the splice gap and convert the high-energy particles or rays into visible light, thereby effectively solving the problem of poor imaging quality caused by the splice gap, improving the quality of products and further improving the detection accuracy of the flat panel detector and the camera equipment.
Description
Technical Field
The present invention relates to the field of electronic technologies, and in particular, to a flat panel detector substrate, a manufacturing method thereof, a flat panel detector, and an image capturing apparatus.
Background
The flat panel detector has the characteristic of emitting light after absorbing high-energy particles or rays by the scintillator, and is widely applied to the radiation detection fields of medical treatment, safety, nondestructive detection and the like.
The existing scintillator processing modes on the flat panel detector substrate mainly comprise an attaching mode and an evaporation mode, the evaporation mode is difficult to realize for a flat panel detector with a large size, and the size of an attached scintillator film is limited by equipment, so that the processing can only be performed by adopting a mode of splicing and attaching a plurality of scintillator films.
However, gaps often exist at the positions where the scintillator films are spliced, which may lead to poor imaging quality of the flat panel detector.
Disclosure of Invention
The present invention has been made in view of the above-described problems, and has as its object to provide a flat panel detector substrate, a method of manufacturing the same, a flat panel detector, and an image pickup apparatus that overcome or at least partially solve the above-described problems.
In a first aspect, a flat panel detector substrate is provided, comprising:
a substrate;
the scintillator films are spliced and attached to the surface of the substrate;
and the filler of the scintillator material is filled in the splicing gaps among the plurality of scintillator films.
Optionally, the width of the splice gap increases in a direction away from the substrate.
Optionally, an included angle between a spliced side surface of any one of the plurality of scintillator films and a bottom surface of the scintillator film is an acute angle, wherein the spliced side surface is a side surface of the scintillator film opposite to the spliced side surfaces of other scintillator films, and the bottom surface is a surface of the scintillator film attached to the substrate.
Optionally, the acute angle is 75 ° to 85 °.
Optionally, the spliced side surface of any one of the plurality of scintillator films is an arc surface, the bending direction of the arc surface faces or faces away from the bottom surface of the scintillator film, the spliced side surface is a side surface of the scintillator film opposite to the spliced side surfaces of other scintillator films, and the bottom surface is a surface of the scintillator film attached to the substrate.
Optionally, the substrate is provided with a pixel array; the width of the splicing gap is larger than or equal to the width of at least one pixel.
Optionally, the filler is in the form of a liquid or powder.
Optionally, the flat panel detector substrate includes: an adhesive layer disposed between the plurality of scintillator films and the substrate to adhere the plurality of scintillator films to the substrate; and the packaging layer covers the plurality of scintillator films so as to isolate the damage of the external environment to the plurality of scintillator films.
In a second aspect, there is provided a method for manufacturing a flat panel detector substrate, including:
splicing and attaching a plurality of scintillator films on a substrate;
and filling the splicing gaps among the plurality of scintillator films by adopting fillers made of scintillator materials.
Optionally, before the splicing and attaching the plurality of scintillator films on the substrate, the method further includes: and processing the spliced side surfaces of the plurality of scintillator films, so that after the plurality of scintillator films are spliced and attached to the substrate, the width of the formed spliced gap increases gradually along the direction away from the substrate, wherein the spliced side surfaces are the side surfaces of the scintillator films opposite to other scintillator films to be spliced.
Optionally, before the splicing and attaching the plurality of scintillator films on the substrate, the method further includes: and processing the spliced side surfaces of the plurality of scintillator films to enable an included angle between the spliced side surface of any one scintillator film and the bottom surface of the scintillator film to be an acute angle, wherein the spliced side surface is a side surface of the scintillator film opposite to the other scintillator films to be spliced, and the bottom surface is a surface of the scintillator film to be attached to the substrate.
Optionally, before the splicing and attaching the plurality of scintillator films on the substrate, the method further includes: and processing the spliced side surfaces of the plurality of scintillator films, wherein the spliced side surface of any one scintillator film is arc-shaped, the bending direction of the arc surface faces or faces away from the bottom surface of the scintillator film, the spliced side surface is the side surface of the scintillator film opposite to the other scintillator films to be spliced, and the bottom surface is the surface of the scintillator film to be attached to the substrate.
Optionally, the filling material made of scintillator material fills the splice gap between the plurality of scintillator films, and includes: filling the splicing gaps among the scintillator films by adopting a filler made of a scintillator material in a liquid or powder form.
Optionally, the splicing and attaching a plurality of scintillator films on the substrate comprises; forming an adhesive layer on the substrate; splicing and attaching the plurality of scintillator films to the adhesive layer; after the filler made of the scintillator material is used for filling the splicing gaps among the plurality of scintillator films, the method further comprises the following steps: and the plurality of scintillator films are covered and encapsulated by adopting an encapsulation layer so as to isolate the damage of the external environment to the plurality of scintillator films.
In a third aspect, a flat panel detector is provided, comprising the flat panel detector substrate according to any one of the first aspects.
In a fourth aspect, there is provided an image pickup apparatus including the flat panel detector described in the third aspect.
The technical scheme provided by the embodiment of the invention has at least the following technical effects or advantages:
according to the flat panel detector substrate, the manufacturing method, the flat panel detector and the image pickup device, after the plurality of scintillator films are spliced and attached on the substrate, the splicing gaps among the plurality of scintillator films are filled with the filler made of the scintillator material, so that high-energy particles or rays can be received at the splicing gaps and converted into visible light, the problem of poor imaging quality caused by the splicing gaps is effectively solved, the product image quality is improved, and the detection accuracy of the flat panel detector and the image pickup device is further improved.
The foregoing description is only an overview of the present invention, and is intended to be implemented in accordance with the teachings of the present invention in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present invention more readily apparent.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
FIG. 1 is a cross-sectional view of a flat panel detector substrate in accordance with an embodiment of the present invention;
FIG. 2a is a top view of a flat panel detector substrate according to an embodiment of the present invention;
FIG. 2b is a top view of a flat panel detector substrate according to an embodiment of the present invention;
FIG. 2c is a top view of a flat panel detector substrate according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an alignment mark according to an embodiment of the present invention;
FIG. 4 is a cross-sectional view of a splice side surface with an arc shape in accordance with an embodiment of the present invention;
FIG. 5 is a second cross-sectional view of a splice side having an arc shape according to an embodiment of the present invention;
FIG. 6 is a flowchart of a method for fabricating a flat panel detector substrate according to an embodiment of the present invention;
FIG. 7 is a schematic view of a method for fabricating a flat panel detector substrate according to an embodiment of the present invention;
FIG. 8 is a second process diagram of a method for fabricating a flat panel detector substrate according to an embodiment of the present invention;
FIG. 9 is a block diagram of a flat panel detector in an embodiment of the invention;
fig. 10 is a block diagram of an image pickup apparatus in the embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings.
Various structural schematic diagrams according to embodiments of the present disclosure are shown in the drawings. The figures are not drawn to scale, wherein certain details are exaggerated for clarity of presentation and may have been omitted. The shapes of the various regions, layers and relative sizes, positional relationships between them shown in the drawings are merely exemplary, may in practice deviate due to manufacturing tolerances or technical limitations, and one skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present therebetween. In addition, if one layer/element is located "on" another layer/element in one orientation, that layer/element may be located "under" the other layer/element when the orientation is turned. In the context of the present disclosure, similar or identical components may be indicated by identical or similar reference numerals.
In order to better understand the above technical solutions, the following detailed description will be made with reference to specific embodiments, and it should be understood that specific features in the embodiments and examples of the disclosure are detailed descriptions of the technical solutions of the present application, and not limit the technical solutions of the present application, and technical features in the embodiments and examples of the present application may be combined with each other without conflict.
Referring to fig. 1, fig. 2a, fig. 2b, and fig. 2c, fig. 1 is a cross-sectional view of a flat panel detector substrate 100 according to an embodiment of the present invention, and fig. 2a to 2c are top views of the flat panel detector substrate 100 according to an embodiment of the present invention, where the flat panel detector substrate includes:
a substrate 1;
a plurality of scintillator films 2, wherein the scintillator films 2 are spliced and attached to the surface of the substrate 1;
and the filler 3 made of scintillator materials, wherein the filler 3 made of scintillator materials is filled in the splicing gaps among the plurality of scintillator films 2.
In an alternative embodiment, the substrate 1 may be a glass substrate, a plastic substrate, a semiconductor substrate, or the like, which is not limited herein. The substrate 1 may have a transistor layer formed thereon or a driving circuit structure integrated thereon.
The scintillator film 2 is a film prepared by processing a scintillator material in a film-forming device through the existing deposition or compression film-forming process. The thickness of the scintillator film 2 is usually 0.3 to 0.7mm, and the scintillator material used may be gadolinium oxysulfide, perovskite, cesium iodide, or the like, and is not limited thereto.
As shown in fig. 1, an adhesive layer 4 having an adhesive property may also be provided between the plurality of scintillator films 2 and the substrate 1 to increase the degree of adhesion securement between the scintillator films 2 and the substrate 1, so that the plurality of scintillator films 2 can be firmly adhered to the substrate 1. The material of the adhesive layer 4 may be, but is not limited to, solid transparent optical adhesive (Optically Clear Adhesive, OCA), ultraviolet curable resin (Optically Clear Resin, OCR), or the like.
In order to meet the demand of a large-sized flat panel detector, a plurality of scintillator films 2 need to be attached to the surface of the substrate 1 in a spliced manner. However, due to the accuracy of the attaching apparatus and the cutting accuracy of the scintillator film 2 raw material (there is often a curvature at the edge of the scintillator film 2 raw material after cutting), as shown in fig. 1 and fig. 2a to 2c, there is often a splice gap of 0.05 to 0.3mm width between two adjacent scintillator films 2. Fig. 2a to 2c show the shape of a splice gap formed by splicing three scintillator films 2 with different cutting radians. Specifically, as shown in fig. 1, 4 and 5, a pixel array (each dotted line grid represents a column of pixel array in the figure) is disposed on the substrate 1, and the width of the stitching slit is greater than or equal to the width of at least one pixel, so that at least one column of pixels at the stitching slit is uncovered by the scintillator film 2, and therefore, the visible light converted by the scintillator is not received, and the stitching slit area becomes an area incapable of normal imaging. As shown in fig. 2a to 2c, the square grid array in the effective sensing area 201 on the substrate 1 represents the pixel array, and it can be seen that the maximum width of the splice gap can reach about 3 pixels, which results in that a gap area incapable of sensing rays or high-energy particles exists in the effective sensing area 201, and adversely affects the sensing image quality.
In order to improve the alignment accuracy of attaching a plurality of scintillator films 2, as shown in fig. 2a, an alignment mark 301 shown in fig. 3 may be disposed at a position to be spliced, and a scale may be disposed on the alignment mark 301 to reduce a splice gap as much as possible.
The application adopts the filler 3 of scintillator material to fill in the concatenation gap between many scintillator membranes 2 to also exist the scintillator that can respond to ray or high energy particle in the concatenation gap, and then all regions in the effective response region 201 all can inductive imaging, have effectively improved the formation of image quality, and then improve the detection accuracy. The form of the filler 3 may be liquid or powder, so as to fully fill the splicing gap. The scintillator material of the filler 3 may be gadolinium oxysulfide, perovskite, cesium iodide, or the like, and is not limited thereto. In an alternative embodiment, the scintillator material of the filler 3 may be set to be the same as that of the scintillator film 2, so that the sensing capability of the splice gap area is similar to that of the scintillator film area, and uniformity of imaging quality is ensured.
In an alternative embodiment, as shown in fig. 1, 4 and 5, it is also possible to provide that the width of the splice gap increases in a direction away from the substrate 1, in order to facilitate a sufficient filling of the filling 3. In the specific implementation process, there may be various ways to realize the gradual increase of the width of the splice seam along the direction away from the substrate 1, and the following two examples are listed:
first, as shown in fig. 1, an included angle a between a spliced side 21 of any one scintillator film 2 of the plurality of scintillator films 2 and a bottom surface 22 of the scintillator film 2 is set to be an acute angle, where the spliced side 21 is a side opposite to the spliced side of the scintillator film 2 and other scintillator films (i.e., a side where an edge of the scintillator film 2 adjacent to the other scintillator films is located), and the bottom surface 22 is a surface where the scintillator film is attached to the substrate 1 (or faces the substrate 1). That is, the width of the splice gap formed by two adjacent scintillator films 2 increases in a direction away from the substrate 1, that is, the cross section of the splice gap has a pattern of an inverted trapezoid or an inverted triangle, etc., with a lower narrow upper wide.
Specifically, when the setting of above-mentioned acute angle makes the filler 3 that adopts the scintillator material fill the concatenation gap, the filler 3 flows into or infiltrates this concatenation gap more easily to make the filling to the concatenation gap more abundant, with the residual of reducing the air in the concatenation gap, make the concatenation gap region after filling have similar response performance with the upper surface region of scintillator membrane 2, and then reduce the difference in the picture quality gray scale that the upper surface region of concatenation gap region and scintillator membrane 2 produced in the response, improve the effect of product imaging, finally improve performances such as detection accuracy.
In an alternative embodiment, the angle a between the spliced side 21 of the scintillator film 2 and the bottom 22 of the scintillator film 2 may be set to 75 ° to 85 °. On the one hand, the influence on a normal sensing area caused by overlarge angles can be avoided, on the other hand, gaps with large upper parts and small lower parts are provided for full filling of the filler 3, and on the other hand, the process complexity of simplifying edge processing is considered.
Second, as shown in fig. 4 and 5, a spliced side 21 of any one scintillator film 2 of the plurality of scintillator films 2 may be provided as an arc surface, and a bending direction of the arc surface faces or faces away from a bottom surface 22 of the scintillator film 2, where the spliced side 21 is a side of the scintillator film 2 opposite to the spliced side of other scintillator films 2, and the bottom surface 22 is a surface of the scintillator film 2 attached to the substrate 1. The bottom surface 22 of the scintillator film 2 in the bending direction is an arc surface in which the joint side surface 21 is recessed obliquely downward with respect to the bottom surface 22, that is, an arc in which an arc-shaped sectional line of the joint side surface 21 in the sectional view is recessed obliquely downward with respect to the bottom surface 22 as seen in the sectional view shown in fig. 4. The bottom surface 22 facing away from the scintillator film 2 in the bending direction is an arc surface in which the joint side surface 21 protrudes obliquely upward with respect to the bottom surface 22, that is, an arc in which an arc-shaped sectional line of the joint side surface 21 in the sectional view protrudes obliquely upward with respect to the bottom surface 22 as seen in the sectional view shown in fig. 5. Specifically, as shown in fig. 4, the splicing side surface 21 may be processed into an arc surface with a concave arc, or as shown in fig. 5, the splicing side surface 21 may be processed into an arc surface with a convex arc, and the width of the splicing gap may be increased in a direction away from the substrate 1. Thus, compared with the acute angle type splicing side surface 21 in the first type, when the filling material 3 is filled later, the dropping of the powdery filling material or the flowing of the liquid filling material is smaller, the filling efficiency is higher, the gas at the included angle between the scintillator film 2 and the substrate 1 is easier to be discharged, the difference of the splicing gap area and the upper surface area of the scintillator film 2 on the induced image quality gray level is further reduced, the imaging effect of the product is improved, and finally the detection accuracy and other performances are improved.
Of course, the manner in which the width of the splice gap is increased in the direction away from the substrate is not limited to the above two, and is not limited thereto, and is not listed here.
As shown in fig. 1, an encapsulation layer 5 may be disposed on the plurality of scintillator films 2, and the encapsulation layer 5 covers the scintillator films 2 filled with the filler 3 to isolate the scintillator films 2 from damage caused by external environments such as moisture, impurity particles, and the like, and also fix and protect the filler 3. The encapsulation layer 5 may be an Al film or a SiC film, which is not limited herein.
Based on the same inventive concept, the embodiment of the present invention further provides a method for manufacturing the flat panel detector substrate 100, referring to fig. 6, fig. 6 is a flowchart of a method for manufacturing a flat panel detector substrate according to an embodiment of the present invention, including:
step S601, splicing and attaching a plurality of scintillator films 2 on a substrate 1;
step S602, filling the splice gaps between the plurality of scintillator films 2 with the filler 3 made of scintillator material.
The following details of the implementation process steps of this embodiment are described in conjunction with fig. 7-8:
the substrate 1 is provided, and the substrate 1 may be a glass substrate, a plastic substrate, a semiconductor substrate, or the like, and is not limited thereto. The substrate 1 may have a transistor layer formed thereon or a driving circuit structure integrated thereon.
As shown in fig. 7, step S601 is performed to splice and attach a plurality of scintillator films 2 on the substrate 1. In an alternative embodiment, the adhesive bonding layer 4 may be formed on the substrate 1 by spin coating or deposition, and then the plurality of scintillator films 2 may be spliced and attached to the bonding layer 4 by using a splicing device, or the bottom surfaces of the plurality of scintillator films 2 may be coated with an adhesive, and then the bottom surfaces of the plurality of scintillator films 2 may be spliced and attached to the substrate 1 by using a splicing device, which is not limited herein.
In an alternative embodiment, before step S601 is performed, the spliced side 21 of the scintillator film 2 may be processed, so that after a plurality of scintillator films 2 are spliced and attached to the substrate 1, the width of the formed splicing gap increases in a direction away from the substrate 1, where the spliced side 21 is a side opposite to the side where the scintillator film 2 is to be spliced with other scintillator films 2. The width of the splice seam may be increased in a direction away from the substrate 1 in a variety of ways, two examples of which are listed below:
first, the spliced side surface 21 of the scintillator film 2 is processed, so that an included angle a between the spliced side surface 21 of any one scintillator film 2 and the bottom surface 22 of the scintillator film 2 is an acute angle, wherein the spliced side surface is a side surface of the scintillator film 2 opposite to other scintillator films to be spliced, and the bottom surface is a surface of the scintillator film 2 to be attached to the substrate 1. The specific processing method may be to cut the spliced side 21 of the scintillator film 2 by tilting a cutter, or to grind the spliced side 21 of the scintillator film 2 by tilting a grinder, which is not limited herein.
Specifically, by forming the acute angle a by processing the spliced side surface 21, the width of the splice gap formed by two adjacent scintillator films 2 after splicing is increased in a direction away from the substrate 1, that is, the cross section of the splice gap is made to be a pattern of an inverted trapezoid or an inverted triangle, etc. with a narrow lower side and a wide upper side. In such a subsequent filling process, the filler 3 more easily flows into or permeates into the splice gap, so that the splice gap is filled more fully, the air residue in the splice gap is reduced, the filled splice gap area and the upper surface area of the scintillator film 2 have similar induction performance, the difference of induced image quality gray scale is reduced, the imaging effect of a product is improved, and finally the detection accuracy and other performances are improved.
In an alternative embodiment, before step S601 is performed, the spliced side 21 of the scintillator film 2 may be processed to an angle a between 75 ° and 85 ° with the bottom 22 of the scintillator film 2, so as to avoid the influence on the normal sensing area caused by the excessive angle, and ensure sufficient filling and simplify the process complexity.
Second, the spliced side surfaces 21 of the plurality of scintillator films 2 are processed, so that the spliced side surface 21 of any one scintillator film 2 is arc-shaped as shown in fig. 4 and 5, and the bending direction of the arc surface faces or faces away from the bottom surface 22 of the scintillator film 2, wherein the spliced side surface 21 is the side surface of the scintillator film 2 opposite to the side surface of the other scintillator films 2 to be spliced, and the bottom surface 22 is the surface of the scintillator film 2 to be attached to the substrate 1.
Specifically, as shown in fig. 4, the spliced side surface 21 may be processed into an arc surface with a concave arc by a polishing process, or as shown in fig. 5, the spliced side surface 21 may be processed into an arc surface with a convex arc by a polishing process. Therefore, when the filler 3 is filled later, the dropping of the powdery filler or the flowing of the liquid filler is smaller in resistance, the filling efficiency is higher, the gas between the scintillator film 2 and the substrate 1 is easier to discharge, the difference of the splicing gap area and the upper surface area of the scintillator film 2 in the induced image quality gray scale is further reduced, the imaging effect of the product is improved, and finally the detection accuracy and other performances are improved.
Of course, the manner in which the width of the splice gap is increased in the direction away from the substrate is not limited to the above two, and is not limited thereto, and is not listed here.
As shown in fig. 8, after the splice attachment of the scintillator films 2 is completed, step S602 is performed to fill the splice gaps between the plurality of scintillator films 2 with the filler 3 of the scintillator material. Specifically, the splice gap may be filled with the filler 2 of the scintillator material in the form of liquid or powder so as to sufficiently fill the splice gap.
As shown in fig. 1, after filling the filler 3, the packaging layer 5 is used to cover and package the plurality of scintillator films 2, so as to isolate the scintillator films 2 from the damage of the external environment such as water vapor, impurity particles and the like, and also fix and protect the filler 3.
The method for manufacturing the flat panel detector substrate according to the embodiment of the present invention is a method for manufacturing the flat panel detector substrate according to the embodiment of the present invention, and the specific implementation manner of the method is described in the process of introducing the flat panel detector substrate, so that based on the flat panel detector substrate according to the embodiment of the present invention, a person skilled in the art can understand specific steps and variations of the method for manufacturing the flat panel detector substrate, and therefore, the description thereof is omitted herein. All methods for preparing the flat panel detector substrate according to the embodiments of the present invention are within the scope of the present invention.
Based on the same inventive concept, an embodiment of the present invention further provides a flat panel detector 200, as shown in fig. 9, which is a structural diagram of the flat panel detector 200 in the embodiment of the present invention, including: the flat panel detector substrate 100 provided by the embodiment of the invention. Because this flat panel detector base plate adopts the filler of scintillator material to fill the concatenation gap between many scintillator films to make concatenation gap department also can receive high-energy particle or ray, turn into visible light, effectively solved the poor problem of formation of image quality that concatenation gap leads to, improved product image quality, and then improved flat panel detector's detection accuracy.
Based on the same inventive concept, an embodiment of the present invention further provides an image capturing apparatus, as shown in fig. 10, which is a structural diagram of the image capturing apparatus in the embodiment of the present invention, including: the flat panel detector 200 is provided in an embodiment of the present invention. Because the substrate of the flat panel detector 200 adopts the filler made of scintillator material to fill the splicing gaps among the plurality of scintillator films, the high-energy particles or rays can be received at the splicing gaps and converted into visible light, the problem of poor imaging quality caused by the splicing gaps is effectively solved, and the imaging quality of the imaging equipment is improved.
The technical scheme provided by the embodiment of the invention has at least the following technical effects or advantages:
according to the flat panel detector substrate, the manufacturing method, the flat panel detector and the image pickup device, after the plurality of scintillator films are spliced and attached on the substrate, the splicing gaps among the plurality of scintillator films are filled with the filler made of the scintillator material, so that high-energy particles or rays can be received at the splicing gaps and converted into visible light, the problem of poor imaging quality caused by the splicing gaps is effectively solved, the product image quality is improved, and the detection accuracy of the flat panel detector and the image pickup device is further improved.
In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Similarly, it should be appreciated that in the foregoing description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects. However, the disclosed method should not be construed as reflecting the intention that: i.e., the claimed invention requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The use of the words first, second, third, etc. do not denote any order. These words may be interpreted as names.
Claims (14)
1. A flat panel detector substrate, comprising:
a substrate;
the scintillator films are spliced and attached to the surface of the substrate; the splicing side surface of any one of the scintillator films is an arc surface, and the bending direction of the arc surface faces or faces away from the bottom surface of the scintillator film;
the filler of the scintillator material fills a splicing gap between the plurality of scintillator films, and the width of the splicing gap increases gradually along the direction away from the substrate; the material of the filler of the scintillator material is the same as that of the scintillator film.
2. The flat panel detector substrate as claimed in claim 1, wherein:
the included angle between the spliced side surface of any one of the scintillator films and the bottom surface of the scintillator film is an acute angle, wherein the spliced side surface is the side surface of the scintillator film opposite to the spliced side surfaces of other scintillator films, and the bottom surface is the surface of the scintillator film attached to the substrate.
3. The flat panel detector substrate as claimed in claim 2, wherein:
the acute angle is 75-85 degrees.
4. The flat panel detector substrate as claimed in claim 1, wherein:
the spliced side surface is a side surface of the scintillator film opposite to the spliced side surfaces of other scintillator films, and the bottom surface is a surface of the scintillator film attached to the substrate.
5. The flat panel detector substrate as claimed in claim 1, wherein:
the substrate is provided with a pixel array; the width of the splicing gap is larger than or equal to the width of at least one pixel.
6. The flat panel detector substrate as claimed in claim 1, wherein:
the filler is in the form of liquid or powder.
7. The flat panel detector substrate as claimed in any one of claims 1 to 6, further comprising:
an adhesive layer disposed between the plurality of scintillator films and the substrate to adhere the plurality of scintillator films to the substrate;
and the packaging layer covers the plurality of scintillator films so as to isolate the damage of the external environment to the plurality of scintillator films.
8. A method of manufacturing a flat panel detector substrate, comprising:
processing the spliced side surfaces of the plurality of scintillator films, and gradually increasing the width of the formed spliced gap along the direction away from the substrate after the plurality of scintillator films are spliced and attached to the substrate, wherein the spliced side surfaces are the side surfaces of the scintillator films opposite to other scintillator films to be spliced;
processing the spliced side surfaces of the plurality of scintillator films, so that the spliced side surface of any scintillator film is arc-shaped, and the bending direction of the arc surface faces or faces away from the bottom surface of the scintillator film;
splicing and attaching a plurality of scintillator films on a substrate;
and filling the splicing gaps among the plurality of scintillator films by adopting fillers made of scintillator materials, wherein the materials of the fillers made of the scintillator materials are the same as the materials of the scintillator films.
9. The method of manufacturing of claim 8, further comprising, before the attaching of the plurality of scintillator films to the substrate by splicing:
and processing the spliced side surfaces of the plurality of scintillator films to enable an included angle between the spliced side surface of any one scintillator film and the bottom surface of the scintillator film to be an acute angle, wherein the spliced side surface is a side surface of the scintillator film opposite to the other scintillator films to be spliced, and the bottom surface is a surface of the scintillator film to be attached to the substrate.
10. The method of manufacturing of claim 8, further comprising, before the attaching of the plurality of scintillator films to the substrate by splicing:
and processing the spliced side surfaces of the plurality of scintillator films, wherein the spliced side surfaces are opposite to the side surfaces of the scintillator films to be spliced with other scintillator films, and the bottom surface is the surface of the scintillator film to be attached to the substrate.
11. The method of manufacturing according to claim 8, wherein filling the splice gap between the plurality of scintillator films with the filler of scintillator material comprises:
filling the splicing gaps among the scintillator films by adopting a filler made of a scintillator material in a liquid or powder form.
12. The manufacturing method according to any one of claims 8 to 11, characterized in that:
the splicing and attaching of a plurality of scintillator films on a substrate comprises the following steps of; forming an adhesive layer on the substrate; splicing and attaching the plurality of scintillator films to the adhesive layer;
after the filler made of the scintillator material is used for filling the splicing gaps among the plurality of scintillator films, the method further comprises the following steps: and the plurality of scintillator films are covered and encapsulated by adopting an encapsulation layer so as to isolate the damage of the external environment to the plurality of scintillator films.
13. A flat panel detector comprising a flat panel detector substrate according to any one of claims 1 to 7.
14. An image pickup apparatus comprising the flat panel detector according to claim 13.
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| JP2009065200A (en) * | 2008-11-18 | 2009-03-26 | Hamamatsu Photonics Kk | Radiation detector |
| CN106154302A (en) * | 2015-03-24 | 2016-11-23 | 中国科学院上海硅酸盐研究所 | A kind of ray detection flat panel detector scintillator panel and preparation method thereof |
| CN207123619U (en) * | 2017-07-28 | 2018-03-20 | 厦门中烁光电科技有限公司 | A kind of scintillation crystal array |
| CN111480095A (en) * | 2017-12-11 | 2020-07-31 | 皇家飞利浦有限公司 | Multi-layered pixelated scintillator with increased fill factor |
| CN111948696A (en) * | 2020-08-13 | 2020-11-17 | 京东方科技集团股份有限公司 | Ray detector substrate, ray detector and ray detection method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2016188857A (en) * | 2015-03-27 | 2016-11-04 | コニカミノルタ株式会社 | Scintillator panel, radiation detector, and method for forming the scintillator panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009065200A (en) * | 2008-11-18 | 2009-03-26 | Hamamatsu Photonics Kk | Radiation detector |
| CN106154302A (en) * | 2015-03-24 | 2016-11-23 | 中国科学院上海硅酸盐研究所 | A kind of ray detection flat panel detector scintillator panel and preparation method thereof |
| CN207123619U (en) * | 2017-07-28 | 2018-03-20 | 厦门中烁光电科技有限公司 | A kind of scintillation crystal array |
| CN111480095A (en) * | 2017-12-11 | 2020-07-31 | 皇家飞利浦有限公司 | Multi-layered pixelated scintillator with increased fill factor |
| CN111948696A (en) * | 2020-08-13 | 2020-11-17 | 京东方科技集团股份有限公司 | Ray detector substrate, ray detector and ray detection method |
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