CN113549234B - Production process of hydrophobic polyimide film - Google Patents
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- CN113549234B CN113549234B CN202110831433.1A CN202110831433A CN113549234B CN 113549234 B CN113549234 B CN 113549234B CN 202110831433 A CN202110831433 A CN 202110831433A CN 113549234 B CN113549234 B CN 113549234B
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 41
- 230000002209 hydrophobic effect Effects 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000178 monomer Substances 0.000 claims abstract description 38
- 150000004985 diamines Chemical class 0.000 claims abstract description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 72
- 238000006243 chemical reaction Methods 0.000 claims description 46
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-dimethylformamide Substances CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 35
- 239000003054 catalyst Substances 0.000 claims description 35
- UYEMGAFJOZZIFP-UHFFFAOYSA-N 3,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC(O)=C1 UYEMGAFJOZZIFP-UHFFFAOYSA-N 0.000 claims description 22
- LPNBBFKOUUSUDB-UHFFFAOYSA-N p-toluic acid Chemical compound CC1=CC=C(C(O)=O)C=C1 LPNBBFKOUUSUDB-UHFFFAOYSA-N 0.000 claims description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 20
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 20
- 238000003756 stirring Methods 0.000 claims description 20
- FYSNRJHAOHDILO-UHFFFAOYSA-N thionyl chloride Chemical compound ClS(Cl)=O FYSNRJHAOHDILO-UHFFFAOYSA-N 0.000 claims description 20
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 18
- 238000010992 reflux Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims description 12
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 11
- HQROXDLWVGFPDE-UHFFFAOYSA-N 1-chloro-4-nitro-2-(trifluoromethyl)benzene Chemical compound [O-][N+](=O)C1=CC=C(Cl)C(C(F)(F)F)=C1 HQROXDLWVGFPDE-UHFFFAOYSA-N 0.000 claims description 11
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 11
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 claims description 11
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 10
- 239000008367 deionised water Substances 0.000 claims description 10
- 229910021641 deionized water Inorganic materials 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 239000012286 potassium permanganate Substances 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 10
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium on carbon Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 9
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- LMDZBCPBFSXMTL-UHFFFAOYSA-N 1-Ethyl-3-(3-dimethylaminopropyl)carbodiimide Substances CCN=C=NCCCN(C)C LMDZBCPBFSXMTL-UHFFFAOYSA-N 0.000 claims description 5
- FPQQSJJWHUJYPU-UHFFFAOYSA-N 3-(dimethylamino)propyliminomethylidene-ethylazanium;chloride Chemical compound Cl.CCN=C=NCCCN(C)C FPQQSJJWHUJYPU-UHFFFAOYSA-N 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- NPZTUJOABDZTLV-UHFFFAOYSA-N hydroxybenzotriazole Substances O=C1C=CC=C2NNN=C12 NPZTUJOABDZTLV-UHFFFAOYSA-N 0.000 claims description 5
- XVMSFILGAMDHEY-UHFFFAOYSA-N 6-(4-aminophenyl)sulfonylpyridin-3-amine Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=N1 XVMSFILGAMDHEY-UHFFFAOYSA-N 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 abstract description 8
- 229920000642 polymer Polymers 0.000 abstract description 4
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- -1 siloxane chain Chemical group 0.000 abstract description 2
- 239000013081 microcrystal Substances 0.000 abstract 3
- 125000004185 ester group Chemical group 0.000 abstract 1
- 239000012466 permeate Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 7
- HWAQOZGATRIYQG-UHFFFAOYSA-N 4-sulfobenzoic acid Chemical compound OC(=O)C1=CC=C(S(O)(=O)=O)C=C1 HWAQOZGATRIYQG-UHFFFAOYSA-N 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical class [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 239000012074 organic phase Substances 0.000 description 4
- 150000001263 acyl chlorides Chemical class 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- GPXCORHXFPYJEH-UHFFFAOYSA-N 3-[[3-aminopropyl(dimethyl)silyl]oxy-dimethylsilyl]propan-1-amine Chemical compound NCCC[Si](C)(C)O[Si](C)(C)CCCN GPXCORHXFPYJEH-UHFFFAOYSA-N 0.000 description 1
- UDQLIWBWHVOIIF-UHFFFAOYSA-N 3-phenylbenzene-1,2-diamine Chemical compound NC1=CC=CC(C=2C=CC=CC=2)=C1N UDQLIWBWHVOIIF-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 125000006615 aromatic heterocyclic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
- C07F7/1872—Preparation; Treatments not provided for in C07F7/20
- C07F7/1892—Preparation; Treatments not provided for in C07F7/20 by reactions not provided for in C07F7/1876 - C07F7/1888
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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Abstract
The invention discloses a production process of a hydrophobic polyimide film, which belongs to the technical field of preparation of modified polyimide films, and comprises the following steps: preparing a diamine monomer A; diamine monomer A reacts with dianhydride monomer to prepare polyamic acid solution; imidizing to obtain a polyimide film; the diamine monomer A is prepared, so that the prepared polyimide has a C-F bond and a siloxane chain with excellent hydrophobic performance, the middle of the diamine monomer A is provided with an ester group, the structural symmetry degree of the diamine monomer A is higher, a polymer can locally form microcrystals, due to the existence of the local microcrystals, water molecules diffuse and are blocked in the polymer, when the water molecules encounter the local microcrystals of the high molecular chain, the inner high molecular chain segments of a crystalline structure are tightly piled up, so that the water molecules cannot permeate and diffuse, the progress of the water molecules is blocked finally, and the hydrophobic performance of the film is further improved.
Description
Technical Field
The invention relates to the technical field of preparation of modified polyimide films, in particular to a production process of a hydrophobic polyimide film.
Background
Polyimide is one of organic high molecular materials with optimal comprehensive performance, and has excellent performances of high strength, low dielectric, high modulus, high temperature resistance, radiation resistance and the like, and has been paid attention to and application. Among aromatic heterocyclic polymer materials, aromatic polyimide materials are representative of high-performance polymer materials due to the characteristics of excellent heat resistance stability, radiation resistance, excellent mechanical properties, lower dielectric properties, processability and the like, and are widely applied to high-tech fields such as aviation, aerospace, microelectronics and the like.
Although the polyimide has higher chemical stability, the polyimide known at present still can absorb certain moisture, so that the problems of metal corrosion, package rupture, film and metal adhesion failure, dielectric property reduction and the like are caused, and the dielectric property is obviously reduced due to the water absorption of the polyimide, so that the polyimide is limited to be further applied to the field of rapidly-developed electronic products.
Disclosure of Invention
The invention aims to provide a production process of a hydrophobic polyimide film, which is used for solving the technical problems that the existing polyimide film has certain water absorption and the application range of the existing polyimide film is limited.
The aim of the invention can be achieved by the following technical scheme:
a production process of a hydrophobic polyimide film comprises the following steps:
step S1: adding p-methylbenzoic acid and p-methylphenol into a flask, then adding p-toluenesulfonic acid and toluene, reacting for 4-5 hours at the temperature of 115-120 ℃, after the reaction, cooling the reaction product to 70 ℃, transferring into a separating funnel, adding a saturated sodium chloride aqueous solution at the temperature of 70 ℃, standing for 30min for layering after oscillating, adding an organic phase into the flask, distilling under reduced pressure to remove toluene, and filtering to obtain an intermediate 1; the dosage ratio of the p-methylbenzoic acid to the p-methylphenol to the p-sulfobenzoic acid to the toluene is 0.05mol:0.05mol:1.8g:45mL;
the reaction process is as follows:
step S2: adding the intermediate 1 and deionized water into a flask, refluxing, adding potassium permanganate, and carrying out reflux reaction for 3 hours to obtain an intermediate 2; then adding the intermediate 2 and deionized water into a flask, dropwise adding DMF and thionyl chloride, and carrying out reflux reaction for 2 hours to obtain an intermediate 3; the dosage mole ratio of the intermediate 1 to the potassium permanganate is 1:1, the dosage ratio of the intermediate 2 to DMF to thionyl chloride is 1mol:0.5mL:2.1mol;
the reaction process is as follows:
step S3: adding 3, 5-dihydroxybenzoic acid and DMF into a flask, then adding aminopropyl triethoxysilane, then adding a catalyst, and stirring at 30 ℃ for reaction for 2 hours to prepare an intermediate 4; the dosage ratio of the 3, 5-dihydroxybenzoic acid, DMF, aminopropyl triethoxysilane and the catalyst is 0.1mol:100mL:0.11mol:0.5g of catalyst, wherein the catalyst is EDCI/HOBt with the mol ratio of 1:1;
the reaction process is as follows:
step S4: adding the intermediate 4, 2-chloro-5-nitrobenzotrifluoride and toluene into a flask, heating to 80 ℃, and stirring for reaction for 3 hours to obtain an intermediate 5; the dosage ratio of the intermediate 4, the 2-chloro-5-nitrobenzotrifluoride to the toluene is 2mmol:2mmol:10mL;
the reaction process is as follows:
step S5: adding the intermediate 3, the intermediate 5, tetrahydrofuran and pyridine into a flask, introducing nitrogen for protection, stirring at the temperature of 0-5 ℃ for reaction for 3 hours, and obtaining an intermediate 6 after the reaction is finished; the dosage ratio of the intermediate 3 to the intermediate 5 to the tetrahydrofuran to the pyridine is 1mmol:1mmol:10mL:1mmol;
the reaction process is as follows:
step S6: adding the intermediate 6, a 10% Pd/C catalyst and 1, 4-dioxane into a flask, introducing hydrogen while stirring, then reacting for 30-32h at 38 ℃, removing the catalyst and the solvent after the reaction is finished, and recrystallizing by using absolute ethyl alcohol to obtain a diamine monomer A; the dosage ratio of the intermediate 6, the 10% Pd/C catalyst and the 1, 4-dioxane is 0.03mol:1.3g:300mL;
the reaction process is as follows:
step S7: adding diamine monomer A and DMF into a flask, then adding 3,3', 4' -benzophenone tetracarboxylic dianhydride, reacting for 24 hours at the temperature of 5 ℃ to obtain a polyamic acid solution, then coating the polyamic acid solution on a glass plate, drying in vacuum at the temperature of 60 ℃ to remove a solvent, then introducing nitrogen, heating to 140-150 ℃, and keeping for 1 hour to obtain a polyimide film; the dosage ratio of the diamine monomer A, DMF to the 3,3', 4' -benzophenone tetracarboxylic dianhydride is as follows: 1mmol:5mL:1mmol;
the reaction process is as follows:
the invention provides a production process of a hydrophobic polyimide film. Compared with the prior art, the method has the following beneficial effects: the invention prepares a polyimide film, firstly prepares a diamine monomer A, then reacts diamine monomer A and dianhydride monomer 3,3', 4' -benzophenone tetracarboxylic dianhydride to prepare polyamide acid solution, then imidizes to prepare polyimide film, wherein diamine monomer A firstly reacts with p-methyl phenol by p-methylbenzoic acid to prepare intermediate 1, then oxidizes methyl at two ends of intermediate 1 to form carboxyl, then acylates to convert carboxyl into acyl chloride, then prepares intermediate 3, then reacts with amino of aminopropyl triethoxy silane and carboxyl of 3, 5-dihydroxybenzoic acid to prepare intermediate 4, then reacts with active chlorine of 2-chloro-5-nitrobenzotrifluoride to prepare intermediate 5, then reacts with acyl chloride at two ends of intermediate 5 to prepare intermediate 6, converts nitro of intermediate 6 into amino under the action of catalyst to prepare diamine monomer A, the two ends of diamine monomer A are provided with amino groups to be converted into acyl chloride groups, and the amino groups can be adsorbed with water molecules of water molecules, and the molecular structure can not be absorbed by partial crystalline structure of the microcrystalline is reduced, and the molecular structure is blocked by water molecules, and the molecular structure is high, the molecular structure is blocked by the molecular structure is high, and the molecular structure is blocked by the microcrystalline structure of the microcrystalline molecule, at the same time, the molecular structure is blocked by the molecular structure is high, and the molecular structure is blocked by the molecular structure is formed, the introduction of siloxane chain can reduce the glass transition temperature of the polymer, provide good thermal stability, ultraviolet stability and tolerance in severe environment, and simultaneously reduce the water absorbability of the polymer, in addition, diamine monomer A also has high electronegativity C-F bond, fluorine atom is difficult to be used as electron donor to form hydrogen bond with hydrogen in water molecule, and further improve the hydrophobicity of the prepared polyimide.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Preparing a diamine monomer A, wherein the diamine monomer A is prepared by the following steps:
step S1: adding p-methylbenzoic acid and p-methylphenol into a flask, then adding p-toluenesulfonic acid and toluene, reacting for 4 hours at the temperature of 115 ℃, after the reaction, cooling the reaction product to 70 ℃, transferring into a separating funnel, adding a saturated sodium chloride aqueous solution at the temperature of 70 ℃, standing for 30min for layering after shaking, adding an organic phase into the flask, distilling under reduced pressure to remove toluene, and filtering to obtain an intermediate 1; the dosage ratio of the p-methylbenzoic acid to the p-methylphenol to the p-sulfobenzoic acid to the toluene is 0.05mol:0.05mol:1.8g:45mL;
step S2: adding the intermediate 1 and deionized water into a flask, refluxing, adding potassium permanganate, and carrying out reflux reaction for 3 hours to obtain an intermediate 2; then adding the intermediate 2 and deionized water into a flask, dropwise adding DMF and thionyl chloride, and carrying out reflux reaction for 2 hours to obtain an intermediate 3; the dosage mole ratio of the intermediate 1 to the potassium permanganate is 1:1, the dosage ratio of the intermediate 2 to DMF to thionyl chloride is 1mol:0.5mL:2.1mol;
step S3: adding 3, 5-dihydroxybenzoic acid and DMF into a flask, then adding aminopropyl triethoxysilane, then adding a catalyst, and stirring at 30 ℃ for reaction for 2 hours to prepare an intermediate 4; the dosage ratio of the 3, 5-dihydroxybenzoic acid, DMF, aminopropyl triethoxysilane and the catalyst is 0.1mol:100mL:0.11mol:0.5g of catalyst, wherein the catalyst is EDCI/HOBt with the mol ratio of 1:1;
step S4: adding the intermediate 4, 2-chloro-5-nitrobenzotrifluoride and toluene into a flask, heating to 80 ℃, and stirring for reaction for 3 hours to obtain an intermediate 5; the dosage ratio of the intermediate 4, the 2-chloro-5-nitrobenzotrifluoride to the toluene is 2mmol:2mmol:10mL;
step S5: adding the intermediate 3, the intermediate 5, tetrahydrofuran and pyridine into a flask, introducing nitrogen for protection, stirring at the temperature of 0 ℃ for reaction for 3 hours, and obtaining an intermediate 6 after the reaction is finished; the dosage ratio of the intermediate 3 to the intermediate 5 to the tetrahydrofuran to the pyridine is 1mmol:1mmol:10mL:1mmol;
step S6: adding the intermediate 6, a 10% Pd/C catalyst and 1, 4-dioxane into a flask, introducing hydrogen while stirring, then reacting for 30 hours at the temperature of 38 ℃, removing the catalyst and the solvent after the reaction is finished, and recrystallizing by using absolute ethyl alcohol to obtain a diamine monomer A; the dosage ratio of the intermediate 6, the 10% Pd/C catalyst and the 1, 4-dioxane is 0.03mol:1.3g:300mL.
Example 2
Preparing a diamine monomer A, wherein the diamine monomer A is prepared by the following steps:
step S1: adding p-methylbenzoic acid and p-methylphenol into a flask, then adding p-toluenesulfonic acid and toluene, reacting for 4.5 hours at the temperature of 117.5 ℃, after the reaction, cooling the reaction product to 70 ℃, transferring into a separating funnel, adding a saturated sodium chloride aqueous solution at the temperature of 70 ℃, standing for 30min for layering after oscillating, adding an organic phase into the flask, distilling under reduced pressure to remove toluene, and filtering to obtain an intermediate 1; the dosage ratio of the p-methylbenzoic acid to the p-methylphenol to the p-sulfobenzoic acid to the toluene is 0.05mol:0.05mol:1.8g:45mL;
step S2: adding the intermediate 1 and deionized water into a flask, refluxing, adding potassium permanganate, and carrying out reflux reaction for 3 hours to obtain an intermediate 2; then adding the intermediate 2 and deionized water into a flask, dropwise adding DMF and thionyl chloride, and carrying out reflux reaction for 2 hours to obtain an intermediate 3; the dosage mole ratio of the intermediate 1 to the potassium permanganate is 1:1, the dosage ratio of the intermediate 2 to DMF to thionyl chloride is 1mol:0.5mL:2.1mol;
step S3: adding 3, 5-dihydroxybenzoic acid and DMF into a flask, then adding aminopropyl triethoxysilane, then adding a catalyst, and stirring at 30 ℃ for reaction for 2 hours to prepare an intermediate 4; the dosage ratio of the 3, 5-dihydroxybenzoic acid, DMF, aminopropyl triethoxysilane and the catalyst is 0.1mol:100mL:0.11mol:0.5g of catalyst, wherein the catalyst is EDCI/HOBt with the mol ratio of 1:1;
step S4: adding the intermediate 4, 2-chloro-5-nitrobenzotrifluoride and toluene into a flask, heating to 80 ℃, and stirring for reaction for 3 hours to obtain an intermediate 5; the dosage ratio of the intermediate 4, the 2-chloro-5-nitrobenzotrifluoride to the toluene is 2mmol:2mmol:10mL;
step S5: adding the intermediate 3, the intermediate 5, tetrahydrofuran and pyridine into a flask, introducing nitrogen for protection, stirring at the temperature of 3 ℃ for reaction for 3 hours, and obtaining an intermediate 6 after the reaction is finished; the dosage ratio of the intermediate 3 to the intermediate 5 to the tetrahydrofuran to the pyridine is 1mmol:1mmol:10mL:1mmol;
step S6: adding the intermediate 6, a 10% Pd/C catalyst and 1, 4-dioxane into a flask, introducing hydrogen while stirring, then reacting for 31 hours at 38 ℃, removing the catalyst and the solvent after the reaction is finished, and recrystallizing by using absolute ethyl alcohol to obtain a diamine monomer A; the dosage ratio of the intermediate 6, the 10% Pd/C catalyst and the 1, 4-dioxane is 0.03mol:1.3g:300mL.
Example 3
Preparing a diamine monomer A, wherein the diamine monomer A is prepared by the following steps:
step S1: adding p-methylbenzoic acid and p-methylphenol into a flask, then adding p-toluenesulfonic acid and toluene, reacting for 5 hours at the temperature of 120 ℃, after the reaction, cooling the reaction product to 70 ℃, transferring into a separating funnel, adding a saturated sodium chloride aqueous solution at the temperature of 70 ℃, standing for 30min for layering after shaking, adding an organic phase into the flask, distilling under reduced pressure to remove toluene, and filtering to obtain an intermediate 1; the dosage ratio of the p-methylbenzoic acid to the p-methylphenol to the p-sulfobenzoic acid to the toluene is 0.05mol:0.05mol:1.8g:45mL;
step S2: adding the intermediate 1 and deionized water into a flask, refluxing, adding potassium permanganate, and carrying out reflux reaction for 3 hours to obtain an intermediate 2; then adding the intermediate 2 and deionized water into a flask, dropwise adding DMF and thionyl chloride, and carrying out reflux reaction for 2 hours to obtain an intermediate 3; the dosage mole ratio of the intermediate 1 to the potassium permanganate is 1:1, the dosage ratio of the intermediate 2 to DMF to thionyl chloride is 1mol:0.5mL:2.1mol;
step S3: adding 3, 5-dihydroxybenzoic acid and DMF into a flask, then adding aminopropyl triethoxysilane, then adding a catalyst, and stirring at 30 ℃ for reaction for 2 hours to prepare an intermediate 4; the dosage ratio of the 3, 5-dihydroxybenzoic acid, DMF, aminopropyl triethoxysilane and the catalyst is 0.1mol:100mL:0.11mol:0.5g of catalyst, wherein the catalyst is EDCI/HOBt with the mol ratio of 1:1;
step S4: adding the intermediate 4, 2-chloro-5-nitrobenzotrifluoride and toluene into a flask, heating to 80 ℃, and stirring for reaction for 3 hours to obtain an intermediate 5; the dosage ratio of the intermediate 4, the 2-chloro-5-nitrobenzotrifluoride to the toluene is 2mmol:2mmol:10mL;
step S5: adding the intermediate 3, the intermediate 5, tetrahydrofuran and pyridine into a flask, introducing nitrogen for protection, stirring at the temperature of 5 ℃ for reaction for 3 hours, and obtaining an intermediate 6 after the reaction is finished; the dosage ratio of the intermediate 3 to the intermediate 5 to the tetrahydrofuran to the pyridine is 1mmol:1mmol:10mL:1mmol;
step S6: adding the intermediate 6, a 10% Pd/C catalyst and 1, 4-dioxane into a flask, introducing hydrogen while stirring, then reacting for 32 hours at the temperature of 38 ℃, removing the catalyst and the solvent after the reaction is finished, and recrystallizing by using absolute ethyl alcohol to obtain a diamine monomer A; the dosage ratio of the intermediate 6, the 10% Pd/C catalyst and the 1, 4-dioxane is 0.03mol:1.3g:300mL.
Example 4
Preparing a hydrophobic polyimide film, wherein the hydrophobic polyimide film is specifically prepared by the following steps:
adding diamine monomer A prepared in example 2 and DMF into a flask, then adding 3,3', 4' -benzophenone tetracarboxylic dianhydride, reacting for 24 hours at the temperature of 5 ℃ to obtain a polyamic acid solution, then coating the polyamic acid solution on a glass plate, drying in vacuum at the temperature of 60 ℃ to remove the solvent, then introducing nitrogen and heating to 140 ℃, and keeping for 1 hour to prepare a polyimide film; the dosage ratio of the diamine monomer A, DMF to the 3,3', 4' -benzophenone tetracarboxylic dianhydride is as follows: 1mmol:5mL:1mmol.
Example 5
Preparing a hydrophobic polyimide film, wherein the hydrophobic polyimide film is specifically prepared by the following steps:
adding diamine monomer A prepared in example 2 and DMF into a flask, then adding 3,3', 4' -benzophenone tetracarboxylic dianhydride, reacting for 24 hours at the temperature of 5 ℃ to obtain a polyamic acid solution, then coating the polyamic acid solution on a glass plate, drying in vacuum at the temperature of 60 ℃ to remove the solvent, then introducing nitrogen and heating to 145 ℃, and keeping for 1 hour to prepare a polyimide film; the dosage ratio of the diamine monomer A, DMF to the 3,3', 4' -benzophenone tetracarboxylic dianhydride is as follows: 1mmol:5mL:1mmol.
Example 6
Preparing a hydrophobic polyimide film, wherein the hydrophobic polyimide film is specifically prepared by the following steps:
adding diamine monomer A prepared in example 2 and DMF into a flask, then adding 3,3', 4' -benzophenone tetracarboxylic dianhydride, reacting for 24 hours at the temperature of 5 ℃ to obtain a polyamic acid solution, then coating the polyamic acid solution on a glass plate, drying in vacuum at the temperature of 60 ℃ to remove the solvent, then introducing nitrogen and heating to 150 ℃, and keeping for 1 hour to prepare a polyimide film; the dosage ratio of the diamine monomer A, DMF to the 3,3', 4' -benzophenone tetracarboxylic dianhydride is as follows: 1mmol:5mL:1mmol.
Comparative example 1: 4,4' -diaminodiphenyl sulfone was used as diamine monomer compared to example 5.
Comparative example 2: compared to example 5, hexafluoromethyl biphenyl diamine was used as diamine monomer.
Comparative example 3: in contrast to example 5, 1, 3-bis (3-aminopropyl) tetramethyldisiloxane was used as diamine monomer.
Performance tests were conducted on examples 4-6 and comparative examples 1-3, and the results obtained are shown in the following table:
the tensile strength and elongation at break were measured with reference to GB13022-91, and the hydrophobicity was judged by measuring the contact angle, and the results are shown in the following table:
tensile Strength (MPa) | Elongation at break (%) | Contact angle | |
Example 4 | 181 | 49 | 153° |
Example 5 | 180 | 49 | 154° |
Example 6 | 182 | 50 | 151° |
Comparative example 1 | 126 | 40 | 45° |
Comparative example 2 | 131 | 42 | 70° |
Comparative example 3 | 132 | 43 | 82° |
From the above table, it is clear that examples 4-6 have good mechanical properties and hydrophobic properties.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The production process of the hydrophobic polyimide film is characterized by comprising the following steps of:
adding diamine monomer A and DMF into a flask, then adding 3,3', 4' -benzophenone tetracarboxylic dianhydride, reacting for 24 hours at the temperature of 5 ℃ to obtain a polyamic acid solution, then coating the polyamic acid solution on a glass plate, drying in vacuum at the temperature of 60 ℃ to remove a solvent, then introducing nitrogen, heating to 140-150 ℃, and keeping for 1 hour to obtain a polyimide film;
diamine monomer A is prepared by the following steps:
step S1: adding p-methylbenzoic acid and p-methylphenol into a flask, then adding p-toluenesulfonic acid and toluene, and reacting for 4-5h at 115-120 ℃ to prepare an intermediate 1;
step S2: adding the intermediate 1 and deionized water into a flask, refluxing, adding potassium permanganate, and carrying out reflux reaction for 3 hours to obtain an intermediate 2; then adding the intermediate 2 and deionized water into a flask, dropwise adding DMF and thionyl chloride, and carrying out reflux reaction for 2 hours to obtain an intermediate 3;
step S3: adding 3, 5-dihydroxybenzoic acid and DMF into a flask, then adding aminopropyl triethoxysilane, then adding a catalyst, and stirring at 30 ℃ for reaction for 2 hours to prepare an intermediate 4;
step S4: adding the intermediate 4, 2-chloro-5-nitrobenzotrifluoride and toluene into a flask, heating to 80 ℃, and stirring for reaction for 3 hours to obtain an intermediate 5;
step S5: adding the intermediate 3, the intermediate 5, tetrahydrofuran and pyridine into a flask, introducing nitrogen for protection, stirring at the temperature of 0-5 ℃ for reaction for 3 hours, and obtaining an intermediate 6 after the reaction is finished;
step S6: adding the intermediate 6, 10% Pd/C catalyst and 1, 4-dioxane into a flask, introducing hydrogen while stirring, then reacting for 30-32h at 38 ℃, removing the catalyst and the solvent after the reaction is finished, and recrystallizing by using absolute ethyl alcohol to obtain the diamine monomer A.
2. The process for producing a hydrophobic polyimide film according to claim 1, wherein the diamine monomer A, DMF, 3', 4' -benzophenone tetracarboxylic dianhydride is used in an amount ratio of: 1mmol:5mL:1mmol.
3. The process for producing a hydrophobic polyimide film according to claim 1, wherein the dosage ratio of p-methylbenzoic acid, p-methylphenol, p-toluenesulfonic acid and toluene in step S1 is 0.05mol:0.05mol:1.8g:45mL.
4. The process for producing a hydrophobic polyimide film according to claim 1, wherein the molar ratio of the intermediate 1 to the potassium permanganate in step S2 is 1:1, the dosage ratio of the intermediate 2 to DMF to thionyl chloride is 1mol:0.5mL:2.1mol.
5. The process for producing a hydrophobic polyimide film according to claim 1, wherein the 3, 5-dihydroxybenzoic acid, DMF, aminopropyl triethoxysilane, and catalyst in step S3 are used in an amount ratio of 0.1mol:100mL:0.11mol:0.5g of catalyst, the molar ratio of EDCI/HOBt is 1:1.
6. The process for producing a hydrophobic polyimide film according to claim 1, wherein the intermediate 4, 2-chloro-5-nitrobenzotrifluoride and toluene in the step S4 are used in an amount ratio of 2mmol:2mmol:10mL.
7. The process for producing a hydrophobic polyimide film according to claim 1, wherein the ratio of the amounts of intermediate 3, intermediate 5, tetrahydrofuran and pyridine in step S5 is 1mmol:1mmol:10mL:1mmol.
8. The process for producing a hydrophobic polyimide film according to claim 1, wherein the intermediate 6, 10% pd/C catalyst, 1, 4-dioxane are used in the step S6 in an amount ratio of 0.03mol:1.3g:300mL.
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US5340888A (en) * | 1988-12-22 | 1994-08-23 | Borden Inc. | Phenolic resin composition |
CN108017786A (en) * | 2017-12-24 | 2018-05-11 | 桂林理工大学 | The method that Kapton is prepared using benzophenone tetracarboxylic dianhydride |
CN108102094A (en) * | 2017-12-24 | 2018-06-01 | 桂林理工大学 | The method that Kapton is prepared using hexafluorodianhydride (6FDA) |
WO2020175838A1 (en) * | 2019-02-28 | 2020-09-03 | 주식회사 엘지화학 | Diamine compound, and polyimide precursor and polyimide film using same |
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US5340888A (en) * | 1988-12-22 | 1994-08-23 | Borden Inc. | Phenolic resin composition |
CN108017786A (en) * | 2017-12-24 | 2018-05-11 | 桂林理工大学 | The method that Kapton is prepared using benzophenone tetracarboxylic dianhydride |
CN108102094A (en) * | 2017-12-24 | 2018-06-01 | 桂林理工大学 | The method that Kapton is prepared using hexafluorodianhydride (6FDA) |
WO2020175838A1 (en) * | 2019-02-28 | 2020-09-03 | 주식회사 엘지화학 | Diamine compound, and polyimide precursor and polyimide film using same |
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