CN113543622A

CN113543622A - Laminating processing agency of modularization electron paster combination

Info

Publication number: CN113543622A
Application number: CN202110937736.1A
Authority: CN
Inventors: 王志敏; 黄丽凤; 丁晓飞
Original assignee: Rugao Dachang Electronics Co Ltd
Current assignee: Rugao Dachang Electronics Co Ltd
Priority date: 2021-08-16
Filing date: 2021-08-16
Publication date: 2021-10-22

Abstract

The invention relates to the field of electronic patches and discloses a laminating processing mechanism of a modularized electronic patch combination, which comprises a box body, a clamping mechanism and a laminating mechanism, wherein the clamping mechanism and the laminating mechanism are both positioned in the box body, and the laminating mechanism is positioned right above the clamping mechanism; the interior of the box body is divided into a driving cabin and a clamping cabin by a transversely arranged cabin dividing plate, and the clamping cabin is positioned above the driving cabin; the clamping mechanism comprises a driving motor, a first bevel gear, fixing columns, a second bevel gear and a clamping block, the bottom of the driving motor is connected with the bottom of the inner wall of the driving bin, one end of an output shaft of the driving motor penetrates through the bin dividing plate and extends to the inside of the clamping bin, one end of the output shaft of the driving motor at the bottom of the first bevel gear is connected, and the number of the fixing columns is two. Through fixture's setting, can be quick fix the PCB board, improve the paster degree of accuracy of paster processing mechanism, avoid the problem of paster failure.

Description

Laminating processing agency of modularization electron paster combination

Technical Field

The invention relates to the technical field of electronic patches, in particular to a laminating and processing mechanism of a modularized electronic patch combination.

Background

Modular electronic placement machines, also called "placement machines" and "Surface Mount systems" (Surface Mount systems), are arranged in production lines behind dispensing machines or screen printers and are a device that accurately places Surface mounted components on PCB pads by moving a placement head. The method is divided into manual operation and full-automatic operation.

The full-automatic chip mounter is used for realizing full-automatic component mounting at high speed and high precision, and is the most critical and complex equipment in the whole SMT production. Chip mounters are main devices in SMT production lines, have been developed from early low-speed mechanical chip mounters to high-speed optical centering chip mounters, and have been developed towards multifunctional and flexible connection modularization.

The inside laminating processing mechanism that includes of current chip mounter, laminating processing mechanism contain fixed establishment and chip mounter, have and cooperate the chip mounter by fixed establishment to carry out the paster, and PCB panel carries out the paster by the chip mounter after fixed by fixed establishment again, and current fixed establishment's fixed effect is not good, and the PCB board rocks easily when leading to the paster to lead to the paster to fail.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a laminating and processing mechanism of a modularized electronic patch combination, which solves the problem of adhesive dispensing failure caused by poor fixing effect of the laminating and processing mechanism in the prior art.

A laminating processing mechanism of a modularized electronic paster combination comprises a box body, a clamping mechanism and a laminating mechanism, wherein the clamping mechanism and the laminating mechanism are both positioned in the box body, and the laminating mechanism is positioned right above the clamping mechanism;

the interior of the box body is divided into a driving cabin and a clamping cabin by the transversely arranged cabin dividing plate, and the clamping cabin is positioned above the driving cabin;

the clamping mechanism comprises a driving motor, a first bevel gear, fixing columns, a second bevel gear and a clamping block, wherein the bottom of the driving motor is connected with the bottom of the inner wall of the driving bin, one end of an output shaft of the driving motor penetrates through the bin dividing plate and extends into the clamping bin, one end of the output shaft of the driving motor is connected with the bottom of the first bevel gear, the number of the fixing columns is two, the bottom ends of the two fixing columns are connected with the top surface of the bin dividing plate, the outer side walls of the two fixing columns are rotatably sleeved with the second bevel gears, the outer side walls of the two second bevel gears are meshed with each other, the first bevel gear is meshed with one of the second bevel gears, and the clamping block is mounted on the two second bevel gears.

Preferably, the warehouse separating plate is provided with an object placing plate, and the object placing plate is positioned between the two clamping blocks.

Preferably, the laminating mechanism comprises a driving frame and a chip mounter main body, the driving frame is installed in the clamping bin, the chip mounter main body is installed on the driving frame, and the chip mounter main body is located right above the object placing plate.

Preferably, the bottom of one side of the box body is movably provided with an access door, and the main body of the chip mounter is provided with a plurality of radiating ports.

Preferably, the top of the front end face of the box body is movably provided with an observation door, and the front end face of the observation door is fixedly provided with an observation window.

Preferably, the bottom surface of the box body is rectangular, and four corners of the bottom surface of the box body are connected with rolling wheels.

Compared with the prior art, the invention has the following beneficial effects: through fixture's setting, driving motor opens and lets driving motor carry out clockwise rotation with drive output shaft, driving motor drives a second bevel gear rotation through first bevel gear, two second bevel gear meshing's relation leads to two second bevel gears all to rotate on the fixed column, the clamp splice of connecting on two second bevel gears will be close to gradually, driving motor's output shaft stop rotating after two clamp splices clip PCB, can be quick fix the PCB board like this, improve the paster degree of accuracy of paster processing mechanism.

Drawings

FIG. 1 is a schematic view of the internal structure of the housing of the chip mounter according to the present invention;

fig. 2 is an enlarged schematic view of the position a of the chip mounter according to the present invention;

fig. 3 is a schematic top view of a clamping mechanism of the chip mounter according to the present invention;

fig. 4 is a schematic front view of a chip mounter according to the present invention. (ii) a

FIG. 5 is a schematic side view of a chip mounter according to the present invention

In the figure: 1. a box body; 2. a bin dividing plate; 3. a drive motor; 4. a first bevel gear; 5. fixing a column; 6. a second bevel gear; 7. a clamping block; 8. a storage plate; 9. a driving frame; 10. a chip mounter main body; 11. an access door; 12. a heat dissipation port; 13. a rolling wheel; 14. an observation door; 15. and (4) an observation window.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, a bonding mechanism of a modular electronic patch assembly includes a case 1, a clamping mechanism and a bonding mechanism, wherein the clamping mechanism and the bonding mechanism are both located inside the case 1, and the bonding mechanism is located right above the clamping mechanism;

the interior of the box body 1 is divided into a driving bin and a clamping bin by a bin dividing plate 2 which is transversely arranged, and the clamping bin is positioned above the driving bin;

the clamping mechanism comprises a driving motor 3, a first bevel gear 4, fixing columns 5, second bevel gears 6 and clamping blocks 7, the bottom of the driving motor 3 is connected with the bottom of the inner wall of a driving bin, one end of an output shaft of the driving motor 3 penetrates through the bin dividing plate 2 and extends to the inside of the clamping bin, one end of an output shaft of the driving motor 3 at the bottom of the first bevel gear 4 is connected with one end of the output shaft of the driving motor 3, the number of the fixing columns 5 is two, the bottom ends of the two fixing columns 5 are connected with the top surface of the bin dividing plate 2, the outer side walls of the two fixing columns 5 are rotatably sleeved with the second bevel gears 6, the outer side walls of the two second bevel gears 6 are meshed, the first bevel gear 4 is meshed with one of the second bevel gears 6, and the clamping blocks 7 are mounted on the two second bevel gears 6.

Wherein, divide the installation on the storehouse board 2 to put thing board 8, put thing board 8 and be located between two clamping piece 7, its effect is put the PCB board on putting thing board 8.

The attaching mechanism comprises a driving frame 9 and a chip mounter main body 10, the driving frame 9 is installed inside the clamping bin, the chip mounter main body 10 is installed on the driving frame 9, the chip mounter main body 10 is located right above the object placing plate 8, and the chip mounter main body 10 is used for mounting the PCB.

Wherein, the bottom movable mounting of box 1 one side has access door 11, has seted up a plurality of thermovents 12 on the chip mounter main part 10, and its effect is that a plurality of thermovents 12 improve drive storehouse air flow nature.

Wherein, the top movable mounting of the preceding terminal surface of box 1 has observation door 14, and the preceding terminal surface fixed mounting of observation door 14 has observation window 15, and its effect is that observation window 15 can observe the paster state.

The bottom surface of the box body 1 is rectangular, and the four corners of the bottom surface of the box body 1 are connected with rolling wheels 13, so that the box body 1 can be conveniently moved.

During operation, open observation door 14, place the PCB board that needs the paster on putting thing board 8, later with observation door 14 closing, open access door 11 and open driving motor 3 and let driving motor 3 carry out clockwise rotation with drive output shaft, driving motor 3 drives a second bevel gear 6 through first bevel gear 4 and rotates, the relation of two second bevel gear 6 meshing leads to two second bevel gears 6 all to rotate on fixed column 5, the clamp 7 of connecting on two second bevel gears 6 will be close to gradually, drive motor 3's output shaft stops rotatoryly after two clamp 7 clip PCB, later carry out the paster to the PCB board by chip mounter main part 10, paster process accessible observation window 15 observes. After success, the driving motor 3 is controlled to rotate anticlockwise, and the clamping block 7 can release the PCB.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a laminating processing agency of modularization electronic paster combination which characterized in that: the box body (1), the clamping mechanism and the laminating mechanism are both positioned in the box body (1), and the laminating mechanism is positioned right above the clamping mechanism;

the interior of the box body (1) is divided into a driving bin and a clamping bin by the bin dividing plate (2) which is transversely arranged, and the clamping bin is positioned above the driving bin;

the clamping mechanism comprises a driving motor (3), a first bevel gear (4), two fixing columns (5), a second bevel gear (6) and a clamping block (7), the bottom of the driving motor (3) is connected with the bottom of the inner wall of the driving bin, one end of an output shaft of the driving motor (3) penetrates through the bin dividing plate (2) and extends to the inside of the clamping bin, one end of an output shaft of the driving motor (3) is connected with the bottom of the first bevel gear (4), the number of the fixing columns (5) is two, the bottom ends of the two fixing columns (5) are connected with the top surface of the bin dividing plate (2), the outer side walls of the two fixing columns (5) are rotatably sleeved with the second bevel gear (6), the outer side walls of the two second bevel gears (6) are meshed, the first bevel gear (4) is meshed with one of the second bevel gears (6), the two second bevel gears (6) are provided with the clamping blocks (7).

2. The attachment mechanism of claim 1, wherein: the storage plate (8) is arranged on the bin dividing plate (2), and the storage plate (8) is positioned between the two clamping blocks (7).

3. The attachment mechanism of claim 2, wherein: laminating mechanism includes driving frame (9) and chip mounter main part (10), driving frame (9) install in the inside in clamping chamber, chip mounter main part (10) install in on driving frame (9), chip mounter main part (10) are located put thing board (8) directly over.

4. The attachment mechanism of claim 1, wherein: the bottom movable mounting of box (1) one side has access door (11), a plurality of thermovents (12) have been seted up on chip mounter main part (10).

5. The attachment mechanism of claim 1, wherein: the top movable mounting of terminal surface has observation door (14) before box (1), the preceding terminal surface fixed mounting of observation door (14) has observation window (15).

6. The attachment mechanism of claim 1, wherein: the bottom surface of the box body (1) is rectangular, and four corners of the bottom surface of the box body (1) are connected with rolling wheels (13).