CN113536628A - Welding spot return loss prediction method and device, readable storage medium and electronic equipment - Google Patents
Welding spot return loss prediction method and device, readable storage medium and electronic equipment Download PDFInfo
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Abstract
The invention discloses a welding spot return loss prediction method, a welding spot return loss prediction device, a computer readable storage medium and electronic equipment, wherein a corresponding original three-dimensional model is established for a packaging product to be predicted, and a plurality of different three-dimensional models to be simulated are generated according to the determined welding spot return loss associated factors and the original three-dimensional model; simulating a plurality of different three-dimensional models to be simulated under the same simulation condition, determining corresponding welding spot return loss values, and then determining primary and secondary relations and interactive relations of the welding spot return loss associated factors according to the welding spot return loss values and the corresponding welding spot return loss associated factor values; predicting the welding spot return loss of the packaged product according to the welding spot return loss associated factor value, the primary and secondary relations, the interactive relation and the corresponding welding spot return loss value; the method can reduce the number of groups of simulation and experiment, obtain relatively accurate welding spot return loss results through prediction, and efficiently and conveniently realize the signal integrity test of the packaged products.
Description
Technical Field
The invention relates to the field of microelectronic packaging, in particular to a method and a device for predicting return loss of a welding spot, a readable storage medium and electronic equipment.
Background
With the rapid development of internet-of-things electronic products such as intelligent wearing and vehicle-mounted devices, embedded chips are more and more widely applied. In order to achieve higher integration, the number of transistors per unit volume of an embedded chip is also increasing exponentially, and in order to achieve miniaturization requirements, miniaturization of the embedded chip volume is also being pursued while satisfying the same function. In order to meet the requirement of smaller volume, the embedded chip is required to have smaller packaging area ratio and improve packaging density. However, in high-density packaging, the chips are closely connected, and high-density interconnection can generate signal crosstalk and delay, so that the signal quality is deteriorated, and the electronic product is failed. Therefore, the integration and miniaturization of the packaged product are restricted by the signal quality, which becomes an urgent problem to be solved in the package design. Therefore, before the production of products, the simulation test of the signal quality of the chip package has become an indispensable part, and the optimization of the structural parameters of the products according to the simulation test result has become a new way of managing the signal integrity of the packaged products.
However, the conventional simulation test mode is to design the product structure first and then perform the signal integrity test, so that not only the actual product for testing needs to be designed and produced, but also the produced actual product needs to be tested manually, which results in a great deal of waste of manpower and material resources.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the method and the device for predicting the return loss of the welding spot, the readable storage medium and the electronic equipment are provided, and the signal integrity test of a packaged product can be efficiently and conveniently realized.
In order to solve the technical problems, the invention adopts a technical scheme that:
a welding spot return loss prediction method comprises the following steps:
establishing an original three-dimensional model of a corresponding packaged product according to the packaged product three-dimensional model establishing request;
receiving a request for selecting related factors of return loss of welding spots, and determining the related factors of return loss of the welding spots;
generating a plurality of different three-dimensional models to be simulated according to the determined welding spot return loss associated factors and the original three-dimensional model;
simulating the plurality of different three-dimensional models to be simulated in a preset simulation environment, and determining corresponding welding spot return loss values;
determining primary and secondary relations and an interactive relation of the welding spot return loss associated factors according to the welding spot return loss values and the corresponding welding spot return loss associated factor values;
and predicting the welding spot return loss of the packaged product according to the welding spot return loss associated factor value, the primary and secondary relations, the interactive relation and the corresponding welding spot return loss value.
In order to solve the technical problem, the invention adopts another technical scheme as follows:
a solder joint return loss prediction apparatus, comprising:
the three-dimensional model establishing module is used for establishing an original three-dimensional model of the corresponding packaged product according to the packaged product three-dimensional model establishing request;
a simulation module to:
receiving a request for selecting related factors of return loss of welding spots, and determining the related factors of return loss of the welding spots;
generating a plurality of different three-dimensional models to be simulated according to the determined welding spot return loss associated factors and the original three-dimensional model;
simulating the plurality of different three-dimensional models to be simulated in a preset simulation environment, and determining corresponding welding spot return loss values;
a prediction module to:
determining primary and secondary relations and an interactive relation of the welding spot return loss associated factors according to the welding spot return loss values and the corresponding welding spot return loss associated factor values;
and predicting the welding spot return loss of the packaged product according to the welding spot return loss associated factor value, the primary and secondary relations, the interactive relation and the corresponding welding spot return loss value.
In order to solve the technical problem, the invention adopts another technical scheme as follows:
a computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the above-mentioned method for predicting the return loss of a solder joint.
In order to solve the technical problem, the invention adopts another technical scheme as follows:
an electronic device comprises a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the steps of the welding spot return loss prediction method when executing the computer program.
The invention has the beneficial effects that: establishing a corresponding original three-dimensional model for a to-be-predicted packaging product, and generating a plurality of different to-be-simulated three-dimensional models according to the determined welding spot return loss associated factors and the original three-dimensional model; simulating a plurality of different three-dimensional models to be simulated under the same simulation condition, determining corresponding welding spot return loss values, and then determining primary and secondary relations and interactive relations of the welding spot return loss associated factors according to the welding spot return loss values and the corresponding welding spot return loss associated factor values; predicting the welding spot return loss of the packaged product according to the welding spot return loss associated factor value, the primary and secondary relations, the interactive relation and the corresponding welding spot return loss value; the method has the advantages that a plurality of different to-be-simulated three-dimensional models are generated based on the determined welding spot return loss associated factors, the number of groups of simulation and experiment can be reduced, relatively accurate welding spot return loss results are obtained through prediction, signal integrity test of the packaged products can be efficiently and conveniently realized, the signal integrity of the packaged products can be pre-researched in advance through prediction, the failure risk of the packaged products in packaging design is reduced, and the reliability of the packaged products is improved.
Drawings
FIG. 1 is a flowchart illustrating steps of a method for predicting a return loss of a solder joint according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a welding spot return loss prediction apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a three-dimensional model of a weld spot according to an embodiment of the invention;
fig. 5 is a schematic three-dimensional model of an eMCP packaged product according to an embodiment of the present invention;
FIG. 6 is a diagram of a simulation environment according to an embodiment of the present invention;
FIG. 7 is a graph of the return loss of a solder joint under 1-10GHz in a standard case of the embodiment of the present invention;
FIG. 8 is a diagram illustrating the fitting result of the prediction formula to the actual value according to an embodiment of the present invention;
FIG. 9 is a graph of the return loss of the solder joint at 1-10GHz for the solder joint of the optimal combination of the embodiments of the present invention.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1, an embodiment of the present invention provides a method for predicting a return loss of a solder joint, including:
establishing an original three-dimensional model of a corresponding packaged product according to the packaged product three-dimensional model establishing request;
receiving a request for selecting related factors of return loss of welding spots, and determining the related factors of return loss of the welding spots;
generating a plurality of different three-dimensional models to be simulated according to the determined welding spot return loss associated factors and the original three-dimensional model;
simulating the plurality of different three-dimensional models to be simulated in a preset simulation environment, and determining corresponding welding spot return loss values;
determining primary and secondary relations and an interactive relation of the welding spot return loss associated factors according to the welding spot return loss values and the corresponding welding spot return loss associated factor values;
and predicting the welding spot return loss of the packaged product according to the welding spot return loss associated factor value, the primary and secondary relations, the interactive relation and the corresponding welding spot return loss value.
From the above description, the beneficial effects of the present invention are: establishing a corresponding original three-dimensional model for a to-be-predicted packaging product, and generating a plurality of different to-be-simulated three-dimensional models according to the determined welding spot return loss associated factors and the original three-dimensional model; simulating a plurality of different three-dimensional models to be simulated under the same simulation condition, determining corresponding welding spot return loss values, and then determining primary and secondary relations and interactive relations of the welding spot return loss associated factors according to the welding spot return loss values and the corresponding welding spot return loss associated factor values; predicting the welding spot return loss of the packaged product according to the welding spot return loss associated factor value, the primary and secondary relations, the interactive relation and the corresponding welding spot return loss value; the method has the advantages that a plurality of different to-be-simulated three-dimensional models are generated based on the determined welding spot return loss associated factors, the number of groups of simulation and experiment can be reduced, relatively accurate welding spot return loss results are obtained through prediction, signal integrity test of the packaged products can be efficiently and conveniently realized, the signal integrity of the packaged products can be pre-researched in advance through prediction, the failure risk of the packaged products in packaging design is reduced, and the reliability of the packaged products is improved.
Further, before performing the simulation, the method further comprises the following steps:
and building a corresponding simulation environment according to the simulation environment building request to serve as the preset simulation environment.
Further, the building of the corresponding simulation environment includes:
setting lumped ports above and below a welding point of the three-dimensional model to be simulated;
establishing an air box with a preset size, wherein the three-dimensional model to be simulated is arranged in the air box;
and setting a radiation boundary condition for the three-dimensional model to be simulated.
According to the description, a unified simulation environment is established, a plurality of different three-dimensional models to be simulated are simulated in the unified simulation environment, and the conditions of the three-dimensional models to be simulated are kept consistent except for different welding spot return loss related factors, so that the accuracy and the reliability of a simulation result are ensured.
Further, the simulating in the preset simulation environment, and determining the corresponding welding spot return loss value includes:
arranging the three-dimensional model to be simulated in the air box, carrying out grid division on the three-dimensional model to be simulated, and starting simulation calculation;
and judging whether a convergence condition is reached, if so, carrying out frequency sweep setting on the three-dimensional model to be simulated to obtain a curve graph of welding spot return loss changing along with frequency.
According to the description, when the simulation is carried out, the grid division is carried out on the three-dimensional model to be simulated, and the frequency sweep setting is carried out when the convergence condition is reached, so that the curve graph of the return loss of the welding spot along with the change of the frequency is obtained, the return loss values of the welding spot under different frequencies can be obtained from the curve graph, the accuracy of the obtained return loss value of the welding spot is ensured, and the flexibility of obtaining the return loss value of the welding spot is improved.
Further, the generating a plurality of different three-dimensional models to be simulated according to the determined welding spot return loss correlation factor and the original three-dimensional model includes:
generating a plurality of corresponding different welding spot return loss associated factor values aiming at each welding spot return loss associated factor;
generating a plurality of groups of different welding spot structural parameters by an orthogonal test method according to a plurality of different welding spot return loss associated factor values corresponding to each welding spot return loss associated factor;
and generating a plurality of corresponding different three-dimensional models to be simulated according to the plurality of groups of different welding spot structural parameters and the original three-dimensional model.
According to the description, a plurality of different values are generated according to the return loss correlation factor of each welding spot, and a plurality of groups of different welding spot structural parameters are generated through an orthogonal experiment method, so that a plurality of different models to be simulated are correspondingly generated, the simulation is performed through the orthogonal experiment method, the experiment times are greatly reduced, the optimization result is easier to obtain, and the test efficiency is improved.
Further, the determining the primary and secondary relationships and the interactive relationship of the welding spot return loss associated factors according to the welding spot return loss value and the corresponding welding spot return loss associated factor value includes:
and inputting the welding spot return loss value into an orthogonal design table constructed according to the welding spot return loss associated factors, and respectively carrying out range analysis and variance analysis to determine primary and secondary relations and an interactive relation of the welding spot return loss associated factors.
According to the above description, the welding spot return loss values obtained through simulation are input into the orthogonal design table constructed by the corresponding welding spot return loss associated factor values, range analysis and variance analysis are respectively carried out, and the primary and secondary relations and the interaction relation among the welding spot return loss associated factors can be conveniently and accurately determined.
Further, predicting the solder joint return loss of the packaged product according to the solder joint return loss associated factor value, the primary and secondary relationships, the interactive relationship and the corresponding solder joint return loss value includes:
establishing a prediction model between the welding spot return loss of the packaged product and the welding spot structural parameters by fitting according to the welding spot return loss associated factor value, the primary and secondary relations, the interactive relation and the corresponding welding spot return loss value;
and predicting the return loss of the welding spots of the packaged product according to the prediction model.
According to the description, the prediction model between the welding spot return loss and the welding spot structural parameters of the packaged product is established through fitting, the welding spot return loss is predicted according to the prediction model, the welding spot return loss correlation factor value corresponding to the welding spot structural parameters and the corresponding welding spot return loss value are considered in the fitting process, and the primary and secondary relations and the interactive relation among the welding spot return loss correlation factors are also considered, so that the accuracy of the established prediction model can be ensured, and the accuracy and the reliability of the welding spot return loss prediction are improved.
Referring to fig. 2, another embodiment of the present invention provides a welding spot return loss prediction apparatus, including:
the three-dimensional model establishing module is used for establishing an original three-dimensional model of the corresponding packaged product according to the packaged product three-dimensional model establishing request;
a simulation module to:
receiving a request for selecting related factors of return loss of welding spots, and determining the related factors of return loss of the welding spots;
generating a plurality of different three-dimensional models to be simulated according to the determined welding spot return loss associated factors and the original three-dimensional model;
simulating the plurality of different three-dimensional models to be simulated in a preset simulation environment, and determining corresponding welding spot return loss values;
a prediction module to:
determining primary and secondary relations and an interactive relation of the welding spot return loss associated factors according to the welding spot return loss values and the corresponding welding spot return loss associated factor values;
and predicting the welding spot return loss of the packaged product according to the welding spot return loss associated factor value, the primary and secondary relations, the interactive relation and the corresponding welding spot return loss value.
Another embodiment of the present invention provides a computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, implements the steps of the above-mentioned method for predicting the return loss of a solder joint.
Referring to fig. 3, another embodiment of the present invention provides an electronic device, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method for predicting the return loss of solder joint when executing the computer program.
The welding spot return loss prediction method, the device, the computer readable storage medium and the electronic equipment can be applied to welding spot return loss prediction of various packaging products, realize signal integrity test by using the welding spot return loss prediction, and are particularly suitable for signal integrity problems in embedded chip packaging in microelectronic packaging technology, such as: the following description of the embedded Multi-Chip Package (eMCP) and the like is made by way of specific embodiments:
example one
Referring to fig. 1, a method for predicting a return loss of a solder joint includes the steps of:
s1, establishing an original three-dimensional model of the corresponding packaged product according to the packaged product three-dimensional model establishing request;
in this embodiment, an eMCP packaged product is established, and when specifically established, a three-dimensional model of a solder joint is established by using three-dimensional drawing software, as shown in fig. 4, a BGA (Ball Grid Array Package) solder joint is in a drum shape, a material is set to be a solder, which includes solder joint structural parameters such as solder joint diameter, solder joint height, and the like, a solder joint three-dimensional model is established according to the set solder joint structural parameters, and then a three-dimensional model of the eMCP packaged product is established, a model structure diagram of which is shown in fig. 5, in the initially established three-dimensional model in this embodiment, the solder joint diameter is 0.25mm, the solder joint height is 0.26mm, the solder joints are 0.23mm, the number of the solder joints is 136, the distance between the solder joints is 0.5mm, and each solder joint is located below a substrate;
s2, receiving a request for selecting related factors of return loss of welding spots, and determining the related factors of return loss of welding spots;
the key factors influencing the return loss of the welding spot of the packaged product can be selected through confidence calculation and used as the relevant factors of the return loss of the welding spot, for example, the factors influencing the return loss of the welding spot include: calculating the confidence coefficient of each factor respectively according to the diameter, height, space and height of the welding point, and selecting the factor with the confidence coefficient larger than a preset threshold value as the relevant factor of the return loss of the welding point, for example, the confidence coefficient can be selected to be 90%;
s3, generating a plurality of different three-dimensional models to be simulated according to the determined welding spot return loss correlation factors and the original three-dimensional model;
different level values can be selected for each welding spot return loss correlation factor, a plurality of groups of different welding spot structural parameters are formed through combination of the different level values, a plurality of established original three-dimensional models are adjusted according to the different welding spot structural parameters, and the specific structure of each welding spot in the original three-dimensional models is adjusted, so that a plurality of to-be-simulated three-dimensional models with different welding spot structures are generated;
s4, simulating the multiple different three-dimensional models to be simulated in a preset simulation environment, and determining corresponding welding spot return loss values;
after the three-dimensional model to be simulated is generated, the construction of a simulation environment is also included before the simulation, specifically:
building a corresponding simulation environment according to the simulation environment building request to serve as the preset simulation environment;
the building of the corresponding simulation environment comprises the following steps:
setting lumped ports above and below a welding point of the three-dimensional model to be simulated;
establishing an air box with a preset size, wherein the three-dimensional model to be simulated is arranged in the air box;
setting a radiation boundary condition for the three-dimensional model to be simulated;
as shown in fig. 6, which is an eMCP solder point electromagnetic simulation diagram under a standard condition, wherein there are two BGA solder points, one is a signal BGA solder point, the other is a ground BGA solder point, a distance between two BGA solder point ports is 0.55mm, an air box is established, the size of the air box is 1.4mm × 0.4mm × 0.4mm, the two solder points are placed in the air box, lumped ports are established at upper and lower ends between the two BGA solder points, and a solution type is a mode driving solution;
when electromagnetic simulation is carried out, setting boundary conditions as radiation boundary conditions, arranging the three-dimensional model to be simulated in the air box, carrying out grid division on the three-dimensional model to be simulated, and starting simulation calculation;
when electromagnetic simulation is performed, boundary conditions applied by each to-be-simulated three-dimensional model are kept consistent, and the working frequencies of welding points are kept consistent, for example, all the welding points work at 3.2 GHz;
judging whether a convergence condition is met, if so, performing frequency sweep setting on the three-dimensional model to be simulated to obtain a curve graph of welding spot return loss along with frequency change, wherein the curve graph of the welding spot return loss of the welding spot under the standard condition is shown in FIG. 7, and can be obtained through the graph 7, wherein the return loss is-26.94 dB at 3.2GHz and-17.23 dB at 10 GHz;
s5, determining primary and secondary relations and interactive relations of the welding spot return loss associated factors according to the welding spot return loss values and the corresponding welding spot return loss associated factor values;
and S6, predicting the welding spot return loss of the packaged product according to the welding spot return loss associated factor value, the primary and secondary relations, the interactive relation and the corresponding welding spot return loss value.
Example two
The embodiment further defines how to generate a plurality of different three-dimensional models to be simulated according to the determined welding spot return loss correlation factor and the original three-dimensional model, specifically:
s31, generating a plurality of corresponding different welding spot return loss associated factor values aiming at each welding spot return loss associated factor;
in this embodiment, the selected welding spot return loss related factors include: the diameter of the welding spot, the diameter of the welding pad and the height of the welding spot;
three level values are respectively selected for each welding spot return loss associated factor, specifically, random selection can be performed within a preset range, and the factor level table determined in the embodiment is shown in table 1:
TABLE 1 factor level table
S32, generating a plurality of groups of different welding spot structure parameters by an orthogonal test method according to a plurality of different welding spot return loss associated factor values corresponding to each welding spot return loss associated factor;
specifically, three groups of simulation tests are designed through an orthogonal test method, 9 groups of test combinations are correspondingly established, and each test combination corresponds to one welding spot structural parameter;
s33, generating a plurality of corresponding different three-dimensional models to be simulated according to the plurality of groups of different welding spot structural parameters and the original three-dimensional model;
specifically, the welding spot structure in the original three-dimensional model is correspondingly modified according to the welding spot structure parameters corresponding to each experimental combination, so that the corresponding three-dimensional model to be simulated is generated.
EXAMPLE III
The embodiment further defines how to predict the solder joint return loss of the packaged product on the basis of the second embodiment, specifically:
after nine different to-be-simulated three-dimensional models are determined, nine groups of eMCP to-be-simulated three-dimensional models with different welding spot structural parameters are placed in the same simulation environment for electromagnetic simulation, and a welding spot return loss value corresponding to each to-be-simulated three-dimensional model after simulation is calculated and obtained, as shown in table 2:
table 29 structural parameters and welding spot return loss values corresponding to experiments
| Height of solder joint | Diameter of welding spot | Pad diameter | Return loss S11(dB) | |
| Experiment 1 | 0.18 | 0.3 | 0.22 | -31.8 |
| |
0.18 | 0.35 | 0.26 | -36.47 |
| |
0.18 | 0.4 | 0.3 | -31.39 |
| Experiment 4 | 0.23 | 0.3 | 0.26 | -21.39 |
| |
0.23 | 0.35 | 0.3 | -28.56 |
| |
0.23 | 0.4 | 0.22 | -23.24 |
| |
0.28 | 0.3 | 0.3 | -26.85 |
| |
0.28 | 0.35 | 0.22 | -31.74 |
| Experiment 9 | 0.28 | 0.4 | 0.26 | -30.05 |
Inputting the welding spot return loss value into an orthogonal design table constructed according to the welding spot return loss associated factors, respectively carrying out range analysis and variance analysis, and determining primary and secondary relations and an interactive relation of the welding spot return loss associated factors;
the range analysis results are shown in table 3:
TABLE 3 results of range analysis
| Horizontal mean value | Pad diameter | Diameter of welding spot | Height of solder joint |
| Mean value 1 | -33.22 | -26.927 | -28.927 |
| Mean value 2 | -24.397 | -32.257 | -29.303 |
| Mean value 3 | -29.547 | -28.227 | -28.933 |
| Extreme difference R | 8.823 | 5.577 | 0.376 |
| Range ordering | 1 | 2 | 3 |
As can be seen from the range analysis result in table 3, the return loss associated factors of each welding point are as follows, from major to minor: the diameter of the pad is larger than the diameter of the welding spot and larger than the height of the welding spot, so that the diameter of the pad is the most critical factor influencing welding spot return loss S11 of an eMMC packaging product, the diameter of the welding spot is the diameter of the welding spot, and the height of the welding spot is the last factor, so that the diameter design of the pad is particularly important in subsequent packaging design, the signal transmission performance of the eMMC packaging product is improved, and the reliability of the product is improved;
the results of the anova are shown in table 4:
TABLE 4 analysis of variance results
| Factors of the fact | Sum of squares of deviation | Degree of freedom | F ratio | Critical value of F | Significance of |
| Pad diameter | 117.867 | 2 | 19.763 | 19 | Is remarkably large |
| Diameter of welding spot | 49.732 | 2 | 8.339 | 19 | In significance of |
| Height of solder joint | 0.279 | 2 | 0.047 | 19 | Is not significant |
As can be seen from the results of the analysis of variance in Table 4, in the aspect of significance, the pad diameter significance is the largest, the significance of the solder joint diameter is general, and the significance of the solder joint height is very small;
establishing a prediction model between the welding spot return loss of the packaged product and the welding spot structural parameters by fitting according to the welding spot return loss associated factor value, the primary and secondary relations, the interactive relation and the corresponding welding spot return loss value;
predicting the welding spot return loss of the packaged product according to the prediction model;
the method comprises the steps of establishing a prediction formula between welding spot structural parameters and return loss S11 of a welding spot by adopting fitting software Istopt, taking the diameter (x1) of the welding spot, the diameter (x2) of a bonding pad and the height (x3) of the welding spot as variables by adopting a global universal optimization algorithm, responding to the return loss y of the welding spot, and considering primary and secondary relations and interactive relations among all welding spot return loss correlation factors to obtain a fitting equation as follows:
y＝-2892.0016*x12+1959.9984*x22-319.7942*x32-708.0032*x1*x2+243.3373*x2*x3-96.6627*x1*x3+1644.8542*x1-1289.8258*x2+81.1489*x3
in the fitting process, each item in the fitting equation and the coefficient of each item can be adjusted through the primary and secondary relations and the interactive relation among the related factors of the return loss of each welding point, and if the primary and secondary ranks are arranged at the front positions and the related factors of the return loss of the welding point are more significant, the basic principle of setting the coefficient and the item is that the influence on the return loss of the welding point is greater than that on the related factors of the return loss of other welding points.
FIG. 8 is a graph showing the results of fitting the predicted formula to the actual values.
In the signal quality analysis of the eMCP packaged product, an orthogonal design experiment is adopted, key factors influencing the diameter of a welding spot can be known through the experiment, the optimal combination in the range determined by all the factors can be obtained, a more effective solution is provided for product design, the product is pre-researched in advance, the time to market of the product is shortened, and the trial and error cost of the process is reduced;
FIG. 9 is a graph of the return loss of the solder joint at 1-10GHz for the optimally combined solder joints.
Example four
Referring to fig. 2, a welding spot return loss predicting apparatus includes:
the three-dimensional model establishing module is used for establishing an original three-dimensional model of the corresponding packaged product according to the packaged product three-dimensional model establishing request;
a simulation module to:
receiving a request for selecting related factors of return loss of welding spots, and determining the related factors of return loss of the welding spots;
generating a plurality of different three-dimensional models to be simulated according to the determined welding spot return loss associated factors and the original three-dimensional model;
simulating the plurality of different three-dimensional models to be simulated in a preset simulation environment, and determining corresponding welding spot return loss values;
a prediction module to:
determining primary and secondary relations and an interactive relation of the welding spot return loss associated factors according to the welding spot return loss values and the corresponding welding spot return loss associated factor values;
and predicting the welding spot return loss of the packaged product according to the welding spot return loss associated factor value, the primary and secondary relations, the interactive relation and the corresponding welding spot return loss value.
EXAMPLE five
A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, implements each step in a method for predicting a return loss of a solder joint according to any one of the first to third embodiments.
EXAMPLE six
Referring to fig. 3, an electronic device includes a memory, a processor, and a computer program stored in the memory and executable on the processor, where the processor executes the computer program to implement the steps of the method for predicting the return loss of a solder joint according to any one of the first to third embodiments.
In summary, the method, the apparatus, the computer-readable storage medium and the electronic device for predicting the solder joint return loss provided by the present invention select the solder joint return loss related factors affecting the packaged product: selecting a plurality of horizontal values for each factor, establishing a plurality of corresponding experimental combinations by an orthogonal experimental method, establishing a corresponding simulated three-dimensional model for each experimental combination, performing electromagnetic simulation on all the simulated three-dimensional models in the same simulation environment to obtain the return loss value of the welding point of the chip in each experimental group, inputting the experimental result into an orthogonal experimental table, performing range analysis and variance analysis, determining the primary and secondary relations and the interactive relation among all the return loss associated factors of the welding point, establishing a relation model between the structural parameter value of the welding point of the experimental result parameter and the corresponding return loss value of the welding point by using a fitting tool, predicting the return loss of the welding point of a packaged product according to the established relation model, selecting key factors and performing orthogonal relation, avoiding performing a repetitive test, and designing the orthogonal table, the extreme difference analysis and the variance analysis are carried out, a relatively accurate experimental value can be obtained, the electromagnetic simulation is adopted to replace actual operation, the cost is greatly reduced, the signal integrity test of the packaged product can be efficiently and conveniently realized, the signal integrity of the packaged product can be pre-researched in advance through prediction, the failure risk of the packaged product in the packaging design is reduced, and the reliability of the packaged product is improved.
In the above embodiments provided in the present application, it should be understood that the disclosed method, apparatus, computer-readable storage medium, and electronic device may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the modules is only one logical division, and other divisions may be realized in practice, for example, a plurality of components or modules may be combined or integrated into another apparatus, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or components or modules, and may be in an electrical, mechanical or other form.
The components described as separate parts may or may not be physically separate, and parts displayed as components may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network modules. Some or all of the components can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional modules in the embodiments of the present invention may be integrated into one processing module, or each component may exist alone physically, or two or more modules are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode.
The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
It should be noted that, for the sake of simplicity, the above-mentioned method embodiments are described as a series of acts or combinations, but those skilled in the art should understand that the present invention is not limited by the described order of acts, as some steps may be performed in other orders or simultaneously according to the present invention. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred and that no acts or modules are necessarily required of the invention.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (10)
1. A welding spot return loss prediction method is characterized by comprising the following steps:
establishing an original three-dimensional model of a corresponding packaged product according to the packaged product three-dimensional model establishing request;
receiving a request for selecting related factors of return loss of welding spots, and determining the related factors of return loss of the welding spots;
generating a plurality of different three-dimensional models to be simulated according to the determined welding spot return loss associated factors and the original three-dimensional model;
simulating the plurality of different three-dimensional models to be simulated in a preset simulation environment, and determining corresponding welding spot return loss values;
determining primary and secondary relations and an interactive relation of the welding spot return loss associated factors according to the welding spot return loss values and the corresponding welding spot return loss associated factor values;
and predicting the welding spot return loss of the packaged product according to the welding spot return loss associated factor value, the primary and secondary relations, the interactive relation and the corresponding welding spot return loss value.
2. The method of claim 1, further comprising the steps of, before performing the simulation:
and building a corresponding simulation environment according to the simulation environment building request to serve as the preset simulation environment.
3. The method according to claim 2, wherein the building a corresponding simulation environment comprises:
setting lumped ports above and below a welding point of the three-dimensional model to be simulated;
establishing an air box with a preset size, wherein the three-dimensional model to be simulated is arranged in the air box;
and setting a radiation boundary condition for the three-dimensional model to be simulated.
4. The method of claim 3, wherein the simulation is performed in a preset simulation environment, and determining the corresponding return loss value of the solder joint comprises:
arranging the three-dimensional model to be simulated in the air box, carrying out grid division on the three-dimensional model to be simulated, and starting simulation calculation;
and judging whether a convergence condition is reached, if so, carrying out frequency sweep setting on the three-dimensional model to be simulated to obtain a curve graph of welding spot return loss changing along with frequency.
5. The method for predicting weld return loss according to any one of claims 1 to 4, wherein the generating a plurality of different three-dimensional models to be simulated according to the determined factors related to the weld return loss and the original three-dimensional model comprises:
generating a plurality of corresponding different welding spot return loss associated factor values aiming at each welding spot return loss associated factor;
generating a plurality of groups of different welding spot structural parameters by an orthogonal test method according to a plurality of different welding spot return loss associated factor values corresponding to each welding spot return loss associated factor;
and generating a plurality of corresponding different three-dimensional models to be simulated according to the plurality of groups of different welding spot structural parameters and the original three-dimensional model.
6. The method according to any one of claims 1 to 4, wherein the determining the primary and secondary relationships and the interaction relationship of the welding spot return loss correlation factors according to the welding spot return loss values and the corresponding welding spot return loss correlation factor values comprises:
and inputting the welding spot return loss value into an orthogonal design table constructed according to the welding spot return loss associated factors, and respectively carrying out range analysis and variance analysis to determine primary and secondary relations and an interactive relation of the welding spot return loss associated factors.
7. The method according to any one of claims 1 to 4, wherein the predicting the solder joint return loss of the packaged product according to the solder joint return loss related factor value, the primary and secondary relationships, the interactive relationship and the corresponding solder joint return loss value comprises:
establishing a prediction model between the welding spot return loss of the packaged product and the welding spot structural parameters by fitting according to the welding spot return loss associated factor value, the primary and secondary relations, the interactive relation and the corresponding welding spot return loss value;
and predicting the return loss of the welding spots of the packaged product according to the prediction model.
8. A solder joint return loss prediction apparatus, comprising:
the three-dimensional model establishing module is used for establishing an original three-dimensional model of the corresponding packaged product according to the packaged product three-dimensional model establishing request;
a simulation module to:
receiving a request for selecting related factors of return loss of welding spots, and determining the related factors of return loss of the welding spots;
generating a plurality of different three-dimensional models to be simulated according to the determined welding spot return loss associated factors and the original three-dimensional model;
simulating the plurality of different three-dimensional models to be simulated in a preset simulation environment, and determining corresponding welding spot return loss values;
a prediction module to:
determining primary and secondary relations and an interactive relation of the welding spot return loss associated factors according to the welding spot return loss values and the corresponding welding spot return loss associated factor values;
and predicting the welding spot return loss of the packaged product according to the welding spot return loss associated factor value, the primary and secondary relations, the interactive relation and the corresponding welding spot return loss value.
9. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of a method for weld return loss prediction according to any one of claims 1 to 7.
10. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the steps of a method for weld return loss prediction according to any one of claims 1-7 when executing the computer program.
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