CN113533956A - Adhesion detection circuit and method - Google Patents
Adhesion detection circuit and method Download PDFInfo
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- CN113533956A CN113533956A CN202110920731.8A CN202110920731A CN113533956A CN 113533956 A CN113533956 A CN 113533956A CN 202110920731 A CN202110920731 A CN 202110920731A CN 113533956 A CN113533956 A CN 113533956A
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- 238000001514 detection method Methods 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004891 communication Methods 0.000 claims abstract description 71
- 238000005485 electric heating Methods 0.000 claims abstract description 38
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 230000003287 optical effect Effects 0.000 claims description 45
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- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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Abstract
The application provides an adhesion detection circuit and method, and relates to the technical field of heating control. The adhesion detection circuit is electrically connected with a main path, and the main path comprises a live wire and a zero line; the adhesion detection circuit comprises an MCU, a relay assembly, a communication module, a switch module, a one-way conduction module and an electric heating module, wherein the MCU is respectively and electrically connected with the relay assembly, the communication module and the switch module; the MCU is used for communicating with a device to be communicated through the communication module; MCU is used for when control relay subassembly and switch module all break off, carries out the adhesion through communication module to relay subassembly and detects. The adhesion detection circuit and the method provided by the invention have the effect of realizing the starting and stopping of the electric heating function with low cost.
Description
Technical Field
The invention relates to the technical field of heating control, in particular to an adhesion detection circuit and method.
Background
The auxiliary electric heating function is frequently used on the existing air conditioner device, and the starting and stopping modes of the electric heating function commonly used in the prior art are basically two types, wherein one type is realized by adopting two relays to respectively control the on-off of an alternating current live wire and an alternating current zero line, and the other type is realized by adopting a single relay control plus a relay adhesion protection circuit.
However, the two relays are used for respectively controlling the on-off of the alternating current live wire and the alternating current zero line to realize the electric heating start-stop function, a relay with a large current load is needed, and the cost of the relay is high. And the adoption of the mode of single relay control increases the circuit complexity and the cost of the adhesion detection circuit is higher.
In conclusion, the problem that the starting and stopping cost of the electric heating function is high in the prior art exists.
Disclosure of Invention
The application aims to provide an adhesion detection circuit and method to solve the problem that the starting and stopping cost of an electric heating function is high in the prior art.
In order to solve the above problems, in one aspect, the present invention provides an adhesion detection circuit, which is electrically connected to a main path, the main path including a live line and a zero line; the adhesion detection circuit comprises an MCU, a relay assembly, a communication module, a switch module, a one-way conduction module and an electric heating module, wherein the MCU is respectively and electrically connected with the relay assembly, the communication module and the switch module, the electric heating module and the relay assembly are connected in series between the live wire and the zero line, the switch module is also respectively and electrically connected with the live wire and the communication module, and the one-way conduction module is respectively and electrically connected with the relay assembly and the communication module; the MCU is used for communicating with a device to be communicated through the communication module; and the MCU is used for detecting the adhesion of the relay assembly through the communication module when the relay assembly is controlled to be disconnected with the switch module.
Because the adhesion detection circuitry that this application provided only needs to adopt a relay subassembly, therefore its cost has obtained effective control to, when carrying out the adhesion and detecting, adopt communication module and MCU complex mode to detect, and because communication module is MCU and treats the intermediate module between the communication device, belong to existing module in the circuit, consequently can not increase extra cost, the start-stop of the realization electrical heating function of low cost.
Optionally, the unidirectional conduction module includes a first diode, an anode of the first diode is electrically connected to the relay assembly and the electric heating module, respectively, and a cathode of the first diode is electrically connected to the communication module and the switch module, respectively.
Optionally, the switch module includes a first optical coupler, a first optical coupler control circuit and a second diode, the first optical coupler respectively with the live wire, the first optical coupler control circuit, the positive pole of the second diode and the drive power supply are electrically connected, the first optical coupler control circuit with the MCU is electrically connected, the negative pole of the second diode with the communication module is electrically connected.
Optionally, the communication module includes a signal transmitting loop and a signal receiving loop, the signal transmitting loop is electrically connected to the MCU, the switch module, the one-way conduction module, and the signal receiving loop is electrically connected to the MCU; wherein the content of the first and second substances,
the MCU is used for controlling the relay assembly and the switch module to be disconnected, and after the signal sending loop is closed, when the signal receiving loop receives a signal, the adhesion fault of the relay assembly is determined.
Optionally, the signal transmission return circuit includes second opto-coupler, first resistance, second resistance and triode, the first end of second opto-coupler with respectively with switch module the unidirectional conduction module electricity is connected, the second end of second opto-coupler with the signal reception return circuit electricity is connected, the third end of second opto-coupler passes through first resistance is connected with a drive power supply electricity, the fourth end of second opto-coupler with the collecting electrode electricity of triode is connected, the projecting pole ground connection of triode, the base of triode passes through the second resistance with the MCU electricity is connected.
Optionally, the signal receiving circuit includes a third optical coupler and a third resistor, a first end of the third optical coupler is electrically connected to a driving power supply, a second end of the third optical coupler is electrically connected to the MCU through the third resistor, a third end of the third optical coupler is electrically connected to the signal transmitting circuit, and a fourth end of the third optical coupler is electrically connected to the communication device.
On the other hand, an embodiment of the present application further provides an adhesion detection method, which is applied to the MCU of the adhesion detection circuit described above, where the method includes:
when a starting-up instruction is received, the switch module is controlled to be switched off;
when a signal is received through the communication module, determining that the relay assembly has an adhesion fault;
and when the communication module does not receive a signal, controlling the switch module to be closed.
Optionally, the communication module includes a signal sending circuit and a signal receiving circuit, and before the step of controlling the switch module to be turned off when the power-on command is received, the method further includes:
when the power is on, controlling the signal sending loop to be conducted;
when a signal is received through the communication module, determining that the relay assembly has an adhesion fault;
and when the communication module does not receive a signal, controlling the switch module to be closed.
Optionally, the method further comprises:
and when the starting-up instruction is not received, entering a standby state and controlling the switch module to be switched off until the starting-up instruction is received.
Optionally, after the step of controlling the switch module to close, the method further comprises:
when a heating instruction is received, the relay assembly is controlled to be closed so as to drive the electric heating module to be started.
Drawings
Fig. 1 is a circuit diagram of a first electric heating control circuit in the prior art.
Fig. 2 is a circuit diagram of a second prior art electric heating control circuit.
Fig. 3 is a block diagram of an adhesion detection circuit according to an embodiment of the present application.
Fig. 4 is a circuit diagram of an adhesion detection circuit according to an embodiment of the present application.
Fig. 5 is a flowchart of an adhesion detection method according to an embodiment of the present application.
Description of reference numerals:
100-adhesion detection circuit; 110-MCU; 120-a relay assembly; 130-a communication module; 131-a signal transmission loop; 132-a signal receiving loop; 140-a switch module; 150-unidirectional conducting module; 160-an electric heating module; o1-first optocoupler; o2-second optocoupler; o3-third optocoupler; d1 — first diode; d2 — second diode; r1 — first resistance; r2 — second resistance; r3-third resistance.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
As described in the background art, the start and stop modes of the electric heating function commonly used at present are basically classified into two types:
the first type is realized by using two relays to respectively control the on-off of the ac live wire and the ac zero wire, for example, referring to fig. 1, the electric heating module is electrically connected with the live wire and the zero wire through the two relays.
In the use process, when the MCU controls the two relays to be conducted, the electric heating module works; when the MCU controls any relay to be disconnected, the electric heating module stops working.
Because this control mode has used double-circuit relay, and double-circuit relay's mode needs the great relay of electric current load, and then leads to the relay cost higher, has increased manufacturing cost.
The second type is that the control of electric heating is realized by adopting single relay control and a relay adhesion protection circuit. For example, referring to fig. 2, in the drawing, only one relay is arranged on the live wire, but since the relay adhesion fault may occur in the single relay manner, the relay adhesion protection circuit needs to be added, on this basis, the complexity of the circuit is increased, and the cost of the relay adhesion protection circuit is higher, so the production cost is also increased.
In conclusion, no matter which implementation mode is adopted, the problem that the starting and stopping cost of the electric heating function is high exists.
In view of this, in order to solve the above problem, the present application provides an adhesion detection circuit, which achieves the purpose of saving cost by providing a relay assembly and using a communication module to realize the way of relay adhesion failure.
The sticking detection circuit provided by the present application is exemplified below:
as an alternative implementation, please refer to fig. 3, the adhesion detection circuit 100 is electrically connected to a main circuit, which includes a live line and a zero line; the adhesion detection circuit 100 comprises an MCU110, a relay assembly 120, a communication module 130, a switch module 140, a one-way conduction module 150 and an electric heating module 160, wherein the MCU110 is respectively and electrically connected with the relay assembly 120, the communication module 130 and the switch module 140, the electric heating module 160 and the relay assembly 120 are connected in series between a live wire and a zero wire, the switch module 140 is also respectively and electrically connected with the live wire and the communication module 130, and the one-way conduction module 150 is respectively and electrically connected with the relay assembly 120 and the communication module 130; the MCU110 is configured to communicate with a device to be communicated via the communication module 130; the MCU110 is configured to perform adhesion detection on the relay assembly 120 through the communication module 130 when the relay assembly 120 and the switch module 140 are both controlled to be disconnected.
It should be noted that the relay assembly 120 and the electric heating module 160 are connected in series between the live wire and the neutral wire, so that the MCU110 can control the operation of the electric heating module 160 by controlling the closing of the relay assembly 120. Alternatively, the electric heating module 160 may be a heating wire, which generates a large amount of heat when turned on.
The circuit provided by the application only comprises one relay assembly 120, so that the effect of reducing the cost can be achieved. Since it is necessary to detect whether the relay assembly 120 is adhered, the present application utilizes the communication module 130 to determine whether the relay assembly is adhered. Because the MCU110 and the device to be communicated in the circuit need to be connected through the communication module 130, that is, the communication module 130 is the original module in the circuit, the adhesion detection of the components of the relay is realized through the communication module 130, and thus, no extra cost is required to be added, and the cost of the whole circuit is reduced.
It should be noted that, optionally, the relay assembly 120 includes a relay and a relay control circuit, wherein the relay is connected in series with the electric heating module 160 and between the live wire and the zero wire, the relay control circuit is electrically connected with the relay and the MCU110, that is, when the MCU110 needs to control the electric heating module 160 to work, the relay control circuit can be controlled to work, and then the effect of the work of the controlled electric heating module 160 is achieved. The adhesion described in the present application means that when the MCU110 controls the relay control circuit to be disconnected, the contact switch is still in a closed state due to the adhesion of the contact switch in the relay.
In addition, the switch module 140 is used for connecting the communication module 130 with the live wire, and when the circuit normally works, the MCU110 needs to be connected with the device to be communicated, so that the switch module 140 needs to be controlled to be closed, so that the communication module 130 can take power from the live wire. When the adhesion detection with the relay assembly 120 is required, the switch module 140 is turned off to avoid affecting the detection structure.
The one-way conduction module 150 can prevent the electric heating module 160 from being conducted by the circuit in which the switch module 140 is located when the relay assembly 120 is turned off and the bonding failure does not occur.
As an implementation manner, the unidirectional conducting module 150 may be a first diode D1, an anode of the first diode D1 is electrically connected to the relay module 120 and the electric heating module 160, respectively, and a cathode of the first diode D1 is electrically connected to the communication module 130 and the switch module 140, respectively.
Through setting up first diode D1 for when carrying out the adhesion and detecting, can realize the adhesion through the return circuit that first diode D1 was located and detect, simultaneously, when relay assembly 120 disconnection, in order to realize the normal work of communication module 130, need control switch module 140 and keep the closed state, the phenomenon that can not appear leading electric heating module 160 to switch on through the return circuit that switch and second diode D2 were located this moment.
Optionally, the switch module 140 includes a first optical coupler, a first optical coupler control circuit, and a second diode D2, where the first optical coupler is electrically connected to the live wire, the first optical coupler control circuit, and the anode of the second diode D2 and the driving power supply, the first optical coupler control circuit is electrically connected to the MCU110, and the cathode of the second diode D2 is electrically connected to the communication module 130.
The first optical coupler O1 includes a light emitting diode and a light receiving device, such as a photo transistor, a photo resistor, etc., wherein the anode of the light emitting diode is electrically connected to the driving power supply, the cathode of the light emitting diode is electrically connected to the optical coupling control circuit, and when the MCU110 sends a control signal to control the conduction of the optical coupling control circuit, the light emitting diode emits light, and the light receiving device is conducted, so that the communication module 130 is connected to the live wire through the light receiving device and the second diode D2.
In the present application, the magnitude of the driving power supply is not limited to a large one, and the driving power supply may be, for example, a 5V power supply. It should be further noted that, by providing the second diode D2, it can be ensured that the detection result is not affected by the switch module 140 when performing adhesion detection.
As an implementation manner, please refer to fig. 4, the communication module 130 includes a signal transmitting circuit 131 and a signal receiving circuit 132, the signal transmitting circuit 131 is electrically connected to the MCU110, the switch module 140, the unidirectional conducting module and the signal receiving circuit 132, and the signal receiving circuit 132 is electrically connected to the MCU 110; the MCU110 is configured to determine that the relay assembly 120 has an adhesion fault when the signal receiving circuit 132 receives a signal after the relay assembly 120 and the switch module 140 are both controlled to be open and the signal transmitting circuit 131 is closed.
Optionally, the signal transmitting circuit 131 includes a second optical coupler O2, a first resistor R1, a second resistor R2 and a triode, a first end of the second optical coupler O2 is electrically connected with the switch module 140 and the unidirectional conducting module 150, a second end of the second optical coupler O2 is electrically connected with the signal receiving circuit 132, a third end of the second optical coupler O2 is electrically connected with a driving power supply through the first resistor R1, a fourth end of the second optical coupler O2 is electrically connected with a collector of the triode, an emitter of the triode is grounded, and a base of the triode is electrically connected with the MCU110 through the second resistor R2.
The second optocoupler O2 includes a light emitting diode and a light receiving triode, the first end of the second optocoupler is a collector of the light receiving triode, the second end of the second optocoupler is an emitter of the light receiving triode, the third end of the second optocoupler is an anode of the light emitting diode, and the fourth end of the second optocoupler is a cathode of the light emitting diode. Optionally, an NPN transistor is adopted in the present application, and on this basis, when adhesion detection is required, the MCU110 outputs a high level to the signal transmitting circuit 131 on the basis of controlling the switch module 140 to be turned off, so that the transistor is turned on, and then the second optocoupler O2 is turned on, so that the signal receiving circuit 132 is turned on.
Certainly, in order to ensure the normal operation of the communication module 130, the signal transmitting circuit 131 may further include other devices, for example, an RC filtering component is included to filter the voltage input to the second optocoupler O2, or a voltage regulator is further included, an anode of the voltage regulator is connected to the neutral line, and a cathode of the voltage regulator is electrically connected to the collector of the light receiving transistor.
Optionally, the signal receiving circuit 132 includes a third optical coupler O3 and a third resistor R3, a first end of the third optical coupler O3 is electrically connected to a driving power supply, a second end of the third optical coupler O3 is electrically connected to the MCU110 through the third resistor R3, a third end of the third optical coupler O3 is electrically connected to the signal transmitting circuit 131, and a fourth end of the third optical coupler O3 is electrically connected to the device to be communicated.
The third optical coupler O3 also includes a light emitting diode and a light receiving triode, the anode of the light emitting diode is electrically connected with the emitter of the light receiving triode in the second optical coupler O2, the cathode of the light emitting diode is connected with the device to be communicated, the collector of the light receiving triode is connected with the driving power supply, and the emitter of the light receiving triode is electrically connected with the MCU110 through a third resistor R3.
When the MCU110 controls the switch module 140 to be turned off and transmit a high level to turn on the signal transmitting circuit 131, if the relay assembly 120 is not stuck, the communication circuit cannot get power from the live wire, and the MCU110 cannot receive signals from the signal receiving circuit 132. When the relay assembly 120 is stuck, the communication module 130 can take power from the live wire, and the MCU110 receives a high-level signal from the signal receiving circuit 132, so as to determine that the relay assembly 120 has a sticking failure.
It should be noted that, in a possible implementation manner, the adhesion detection circuit 100 may be applied to an air conditioner, and specifically, the adhesion detection circuit 100 is disposed in an internal unit of the air conditioner, and correspondingly, a device to be communicated is disposed in an external unit of the air conditioner, for example, the device to be communicated may be a strong electric communication circuit.
On the basis of the foregoing implementation manner, an embodiment of the present application further provides an adhesion detection method, where the method is applied to the MCU of the adhesion detection circuit, please refer to fig. 5, and the method includes:
s102, judging whether a starting-up instruction is received, if so, executing S104.
And S104, controlling the switch module to be switched off.
And S106, judging whether a signal is received through the communication module, if so, executing S108, and if not, executing S110.
And S108, determining that the relay assembly has adhesion fault.
And S110, controlling the switch module to be closed.
As an implementation manner, when determining whether a signal is received through the communication module 130, a certain time period may be set, for example, it is determined whether the signal is received through the communication module 130 within one minute, if so, it indicates that an adhesion fault occurs in the relay assembly 120, and if not, it indicates that no fault occurs, and since the switch module 140 is turned off only during the detection process after power is turned on, once the detection is finished, the MCU110 controls the switch module 140 to be turned on, so as to ensure normal use of the communication module 130.
In a possible implementation manner, when an adhesion fault occurs, the MCU110 may further control a corresponding alarm device to alarm, for example, a display screen displays a flashing and fault code, or a buzzer sounds, or when the circuit is disposed in the air conditioner, the MCU110 may further control the damper to open and the fan operates at the maximum rotation speed.
Optionally, before S102, the method further includes:
and S101-1, controlling the signal sending loop to be conducted when the power is on.
S101-2, judging whether a signal is received through the communication module, if so, executing S101-3, and if not, executing S101-4.
S101-3, determining that the relay assembly has adhesion fault.
And S101-4, controlling the switch module to be closed.
When the power-on initialization is performed, the MCU110 will also detect whether the relay assembly 120 is stuck. And will not be described in detail herein. It should be noted that, when the power is turned on, the switch module 140 is in the off state, and after receiving the power-on instruction, the MCU110 controls the switch module 140 to be turned off, so as to implement the adhesion detection. In other words, the adhesion detection performed after the startup instruction is received can be verified during power-on, so that the accuracy is higher.
In addition, the method further comprises:
s103, when the starting-up instruction is not received, the standby state is entered and the switch module 140 is controlled to be switched off until the starting-up instruction is received.
That is, when it is determined that the power-on command is not received, S103 is executed.
In the standby state, the switch module 140 is turned off. Meanwhile, when judging whether the starting-up instruction is received, a certain time can be given, for example, 5h, when the starting-up instruction is not received, adhesion detection is performed again, and when the starting-up instruction is received, adhesion detection is performed immediately.
Optionally, after the step of S110, the method further includes:
and S112, controlling the relay assembly to be closed when the heating instruction is received so as to drive the electric heating module to start.
Similarly, when receiving the electric heating off command, the MCU110 can also control the relay assembly 120 to turn off.
In summary, the present application provides an adhesion detection circuit and method, the adhesion detection circuit is electrically connected to a main path, the main path includes a live line and a zero line; the adhesion detection circuit comprises an MCU, a relay assembly, a communication module, a switch module, a one-way conduction module and an electric heating module, wherein the MCU is respectively and electrically connected with the relay assembly, the communication module and the switch module; the MCU is used for communicating with a device to be communicated through the communication module; MCU is used for when control relay subassembly and switch module all break off, carries out the adhesion through communication module to relay subassembly and detects. Because the adhesion detection circuitry that this application provided only needs to adopt a relay subassembly, therefore its cost has obtained effective control to, when carrying out the adhesion and detecting, adopt communication module and MCU complex mode to detect, and because communication module is MCU and treats the intermediate module between the communication device, belong to existing module in the circuit, consequently can not increase extra cost, the start-stop of the realization electrical heating function of low cost.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. An adhesion detection circuit (100), characterized in that the adhesion detection circuit (100) is electrically connected to a main path, the main path comprising a live line and a neutral line; the adhesion detection circuit (100) comprises an MCU (microprogrammed control unit) (110), a relay assembly (120), a communication module (130), a switch module (140), a one-way conduction module (150) and an electric heating module (160), wherein the MCU (110) is respectively and electrically connected with the relay assembly (120), the communication module (130) and the switch module (140), the electric heating module (160) and the relay assembly (120) are connected in series between the live wire and the zero wire, the switch module (140) is also respectively and electrically connected with the live wire and the communication module (130), and the one-way conduction module (150) is respectively and electrically connected with the relay assembly (120) and the communication module (130); wherein the content of the first and second substances,
the MCU (110) is used for communicating with a device to be communicated through the communication module (130);
the MCU (110) is used for detecting adhesion of the relay assembly (120) through the communication module (130) when the relay assembly (120) and the switch module (140) are controlled to be disconnected.
2. The sticking detection circuit (100) according to claim 1, characterized in that the unidirectional conduction module (150) comprises a first diode (D1), the anode of the first diode (D1) is electrically connected with the relay assembly (120) and the electric heating module (160), respectively, and the cathode of the first diode (D1) is electrically connected with the communication module (130) and the switch module (140), respectively.
3. The adhesion detection circuit (100) according to claim 1, wherein the switch module (140) comprises a first optical coupler (O1), a first optical coupler (O1) control circuit and a second diode (D2), the first optical coupler (O1) is electrically connected with the live wire, the first optical coupler (O1) control circuit, the anode of the second diode (D2) and the driving power supply respectively, the first optical coupler (O1) control circuit is electrically connected with the MCU (110), and the cathode of the second diode (D2) is electrically connected with the communication module (130).
4. The adhesion detection circuit (100) according to claim 1, wherein the communication module (130) comprises a signal transmission loop and a signal reception loop, the signal transmission loop is electrically connected to the MCU (110), the switch module (140), the one-way conduction module and the signal reception loop, respectively, and the signal reception loop is electrically connected to the MCU (110); wherein the content of the first and second substances,
the MCU (110) is used for controlling the relay assembly (120) and the switch module (140) to be disconnected, and after the signal sending loop is closed, when the signal receiving loop receives a signal, it is determined that the relay assembly (120) has adhesion fault.
5. The adhesion detection circuit (100) according to claim 4, wherein the signal transmission circuit comprises a second optical coupler (O2), a first resistor (R1), a second resistor (R2) and a transistor, a first end of the second optical coupler (O2) is electrically connected to the switching module (140) and the unidirectional conducting module (150), respectively, a second end of the second optical coupler (O2) is electrically connected to the signal receiving circuit, a third end of the second optical coupler (O2) is electrically connected to a driving power source through the first resistor (R1), a fourth end of the second optical coupler (O2) is electrically connected to a collector of the transistor, an emitter of the transistor is grounded, and a base of the transistor is electrically connected to the MCU (110) through the second resistor (R2).
6. The adhesion detection circuit (100) according to claim 4, wherein the signal receiving circuit comprises a third optical coupler (O3) and a third resistor (R3), a first end of the third optical coupler (O3) is electrically connected to a driving power supply, a second end of the third optical coupler (O3) is electrically connected to the MCU (110) through the third resistor (R3), a third end of the third optical coupler (O3) is electrically connected to the signal transmitting circuit, and a fourth end of the third optical coupler (O3) is electrically connected to the device to be communicated.
7. An adhesion detection method, applied to an MCU (110) of the adhesion detection circuit (100) of any one of claims 1 to 6, the method comprising:
when a starting-up instruction is received, the switch module (140) is controlled to be switched off;
determining that an adhesion fault has occurred with the relay assembly (120) when a signal is received through the communication module (130);
and when the signal is not received through the communication module (130), controlling the switch module (140) to be closed.
8. The adhesion detection method according to claim 7, wherein the communication module (130) comprises a signal transmitting circuit and a signal receiving circuit, and before the step of controlling the switch module (140) to be turned off when the power-on command is received, the method further comprises:
when the power is on, controlling the signal sending loop to be conducted;
determining that an adhesion fault has occurred with the relay assembly (120) when a signal is received through the communication module (130);
and when the signal is not received through the communication module (130), controlling the switch module (140) to be closed.
9. The adhesion detection method according to claim 7, further comprising:
and when the starting-up instruction is not received, entering a standby state and controlling the switch module (140) to be switched off until the starting-up instruction is received.
10. The adhesion detection method of claim 7, wherein after the step of controlling the switch module (140) to close, the method further comprises:
when a heating instruction is received, the relay assembly (120) is controlled to be closed so as to drive the electric heating module (160) to be started.
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Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001124414A (en) * | 1999-10-29 | 2001-05-11 | Temuko Kk | Power saving controller for antifreezing electric heater |
| CN201897339U (en) * | 2010-11-13 | 2011-07-13 | 浙江创能新能源科技有限公司 | Solar water heater monitor with electric heating anti-adhesion detection device |
| CN104142466A (en) * | 2013-05-06 | 2014-11-12 | 广州汽车集团股份有限公司 | Automotive relay contact closed-state detecting system and method |
| CN106653482A (en) * | 2016-11-03 | 2017-05-10 | 江苏英索纳智能科技有限公司 | Self-tuning relay anti-adhesion circuit and control method thereof |
| WO2018036249A1 (en) * | 2016-08-24 | 2018-03-01 | 深圳市科列技术股份有限公司 | Main relay adhesion detection circuit of vehicle-mounted battery management system, and detection method therefor |
| CN109932641A (en) * | 2017-12-16 | 2019-06-25 | 郑州宇通客车股份有限公司 | A kind of battery system heating relay method for diagnosing faults and device |
| CN110022621A (en) * | 2019-05-09 | 2019-07-16 | 王振福 | A kind of electric heater unit and its fault detection method, control device |
| CN110456263A (en) * | 2019-08-02 | 2019-11-15 | 恒大智慧充电科技有限公司 | A kind of relay is adhered detection circuit, device and its detection method |
| CN209946327U (en) * | 2019-03-29 | 2020-01-14 | 泰科电子(上海)有限公司 | Detection circuit of relay contact and power supply device |
| US20200243269A1 (en) * | 2019-01-29 | 2020-07-30 | Reinhold Henke | Power Contact Health Assessor Apparatus and Method |
| CN112578273A (en) * | 2019-09-30 | 2021-03-30 | 江苏万帮德和新能源科技股份有限公司 | Adhesion detection device and method for alternating current circuit relay and alternating current charging pile |
| JP2021057981A (en) * | 2019-09-30 | 2021-04-08 | 株式会社デンソーテン | Sticking detector and sticking detection method |
| CN113049950A (en) * | 2021-03-05 | 2021-06-29 | 阳光电源股份有限公司 | Relay detection device and method and charging pile |
-
2021
- 2021-08-11 CN CN202110920731.8A patent/CN113533956B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001124414A (en) * | 1999-10-29 | 2001-05-11 | Temuko Kk | Power saving controller for antifreezing electric heater |
| CN201897339U (en) * | 2010-11-13 | 2011-07-13 | 浙江创能新能源科技有限公司 | Solar water heater monitor with electric heating anti-adhesion detection device |
| CN104142466A (en) * | 2013-05-06 | 2014-11-12 | 广州汽车集团股份有限公司 | Automotive relay contact closed-state detecting system and method |
| WO2018036249A1 (en) * | 2016-08-24 | 2018-03-01 | 深圳市科列技术股份有限公司 | Main relay adhesion detection circuit of vehicle-mounted battery management system, and detection method therefor |
| CN106653482A (en) * | 2016-11-03 | 2017-05-10 | 江苏英索纳智能科技有限公司 | Self-tuning relay anti-adhesion circuit and control method thereof |
| CN109932641A (en) * | 2017-12-16 | 2019-06-25 | 郑州宇通客车股份有限公司 | A kind of battery system heating relay method for diagnosing faults and device |
| US20200243269A1 (en) * | 2019-01-29 | 2020-07-30 | Reinhold Henke | Power Contact Health Assessor Apparatus and Method |
| CN209946327U (en) * | 2019-03-29 | 2020-01-14 | 泰科电子(上海)有限公司 | Detection circuit of relay contact and power supply device |
| CN110022621A (en) * | 2019-05-09 | 2019-07-16 | 王振福 | A kind of electric heater unit and its fault detection method, control device |
| CN110456263A (en) * | 2019-08-02 | 2019-11-15 | 恒大智慧充电科技有限公司 | A kind of relay is adhered detection circuit, device and its detection method |
| CN112578273A (en) * | 2019-09-30 | 2021-03-30 | 江苏万帮德和新能源科技股份有限公司 | Adhesion detection device and method for alternating current circuit relay and alternating current charging pile |
| JP2021057981A (en) * | 2019-09-30 | 2021-04-08 | 株式会社デンソーテン | Sticking detector and sticking detection method |
| CN113049950A (en) * | 2021-03-05 | 2021-06-29 | 阳光电源股份有限公司 | Relay detection device and method and charging pile |
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