CN113524029A - Chip discharge mechanism for semiconductor chip production - Google Patents
Chip discharge mechanism for semiconductor chip production Download PDFInfo
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- CN113524029A CN113524029A CN202110813686.6A CN202110813686A CN113524029A CN 113524029 A CN113524029 A CN 113524029A CN 202110813686 A CN202110813686 A CN 202110813686A CN 113524029 A CN113524029 A CN 113524029A
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- fixedly connected
- side wall
- chip
- lead screw
- motor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
Abstract
The invention discloses a chip discharge mechanism for semiconductor chip production, which comprises a box body, wherein the bottom of the box body is fixedly connected with an operation table through a plurality of support rods, the lower end of the operation table is provided with two grooves, the inner walls of the two grooves are both connected with a slide rod in a sliding manner, the lower end of the slide rod is fixedly connected with a slide block, the side wall of the slide block is fixedly connected with a U-shaped rod, one end, far away from the slide block, of the U-shaped rod is fixedly connected with an arc-shaped plate, the upper end of the operation table is provided with a plurality of circular grooves, and the bottoms of the circular grooves are both fixedly connected with springs. According to the invention, the first motor is driven to rotate clockwise and anticlockwise, so that the arc-shaped plate can fix and loosen the chip, and the disc can synchronously drive the chip to move downwards and upwards, so that the chip can be conveniently taken out, the whole process does not need manual operation, the labor intensity of workers is reduced, the chip is clamped from the edge when being clamped, and the comprehensive polishing effect on the surface of the chip is not influenced.
Description
Technical Field
The invention relates to the technical field of semiconductor chip production, in particular to a chip discharge mechanism for semiconductor chip production.
Background
A semiconductor chip is a semiconductor device which is etched and wired on a semiconductor wafer to realize a certain function.
In the invention patent "202010835386.3" patent, chip discharge mechanism for semiconductor chip production, the scheme is that a first rectangular ring mounting block is pressed, then a chip is placed on an ejector plate to release the first rectangular ring mounting block, under the action of four first springs, two clamping arms rotate in opposite directions, and then the two clamping arms can tightly fix the chip on a fixed ejector plate, after the chip is ground, the first rectangular ring mounting block is pressed downwards again, and then the ejector plate can eject the chip from the fixing mechanism, however, the scheme has the following problems:
1. when the chips are fixed, manual operation is needed, so that the labor intensity of workers is high when a large number of chips are produced;
2. the chip is fixed from top to bottom, so that the surface of the chip cannot be polished comprehensively, and the polishing quality is low.
Based on this, the invention provides a chip discharge mechanism for semiconductor chip production.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a chip discharge mechanism for semiconductor chip production.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a chip discharge mechanism for semiconductor chip production, includes the box, the bottom half is through a plurality of bracing piece fixedly connected with operation panel, two recesses have been seted up to the operation panel lower extreme, two equal sliding connection of recess inner wall has the slide bar, slide bar lower extreme fixedly connected with slider, slider lateral wall fixedly connected with U type pole, the one end fixedly connected with arc of slider is kept away from to U type pole, a plurality of slots have been seted up to the operation panel upper end, and is a plurality of equal fixedly connected with spring in slot bottom, spring upper end fixedly connected with disc, disc lower extreme fixedly connected with slide bar, the slide bar lower extreme runs through operation panel lower extreme and fixedly connected with diaphragm, install the gliding actuating mechanism of drive slider in the box.
Preferably, first actuating mechanism includes the first motor of fixed connection in the bottom half, first motor activity end fixedly connected with first lead screw, first lead screw lateral wall threaded connection has screw nut, the screw nut lateral wall rotates and is connected with two actuating levers, the one end that screw nut was kept away from to the actuating lever rotates with the slider lateral wall and is connected, install the second actuating mechanism that the drive disc moved down on the first motor.
Preferably, the second driving mechanism comprises a first gear fixedly connected to the side wall of the movable shaft of the first motor, the lower end of the operating platform is rotatably connected with a second lead screw, the side wall of the second lead screw is in threaded connection with the side wall of the transverse plate, and the lower end of the second lead screw is fixedly connected with a second gear meshed with the first gear.
Preferably, two fixed plates of box lateral wall fixedly connected with, two electric putter of fixed plate upper end fixedly connected with, two the common fixedly connected with of electric putter expansion end is dull and stereotyped, dull and stereotyped upper end fixedly connected with second motor, the second motor expansion end runs through dull and stereotyped lateral wall and extends to its lower extreme, second motor expansion end fixedly connected with connecting plate, the connecting plate lateral wall is through bolt fixedly connected with polishing strip, install on the flat board and carry out absorptive absorption mechanism to the dust when semiconductor chip polishes.
Preferably, the absorption mechanism includes the fixed frame of fixed connection at dull and stereotyped lower extreme, top fixedly connected with dead lever in the fixed frame, the dead lever lateral wall rotates and is connected with the horizontal pole, the horizontal pole is kept away from a plurality of impellers of one end fixedly connected with of fixed frame inner wall, fixed frame inner wall fixedly connected with filter screen, fixed frame inner wall fixedly connected with dust absorption pipe, install drive horizontal pole pivoted third actuating mechanism on the second motor, install the clearance mechanism that clears up filter screen surface dust on the horizontal pole.
Preferably, the third driving mechanism comprises a first bevel gear, the movable shaft of the second motor penetrates through the inner wall of the fixed frame, the side wall of the movable shaft, located in the fixed frame, of the second motor is fixedly connected with the inner side wall of the first bevel gear, the side wall of the cross rod is fixedly connected with a second bevel gear, and the first bevel gear is in meshed connection with the second bevel gear.
Preferably, clearance mechanism includes a plurality of scrapers, the one end that the impeller was kept away from to the horizontal pole runs through the filter screen lateral wall setting, and is a plurality of the lateral wall fixed connection of impeller is kept away from to scraper blade and horizontal pole, the laminating of scraper blade and filter screen lateral wall, fixed frame bottom fixedly connected with collection dirt frame, collection dirt frame inner wall is close to the filter screen lateral wall setting.
Preferably, the diameter of the first gear is far larger than that of the second gear, and the side wall threads of the first lead screw and the second lead screw are opposite in direction respectively.
Compared with the prior art, the invention has the advantages that:
1: by arranging the slide bar, the slide block, the U-shaped bar, the arc plates, the disc, the first driving mechanism and the second driving mechanism, the chip is placed on the disc, the first motor is driven to rotate clockwise, the first gear drives the second gear to rotate quickly, the second lead screw rotates quickly, the transverse plate drives the slide bar to slide downwards, the lower surface of the disc is contacted with the upper surface of the operating table, meanwhile, the first motor rotates to drive the first lead screw to rotate, the lead screw nut slides downwards on the side wall of the first lead screw, the lead screw nut drives the two slide blocks to approach each other through the two driving rods, the two arc plates approach each other to clamp the chip, and further the chip is fixed, after the chip is processed, the first motor is driven to rotate anticlockwise, the first lead screw rotates to slide the lead screw nut upwards, the two slide blocks drive the two arc plates to move away from each other, and further the chip is loosened, meanwhile, the second lead screw rotates to drive the transverse plate to move upwards, and the disc drives the chip to move upwards, so that the chip can be conveniently taken out, the whole process is carried out automatically without manual operation, the labor intensity of workers is reduced, and the chip is clamped from the edge when being clamped, so that the comprehensive polishing effect on the surface of the chip cannot be influenced;
2: through setting up absorption mechanism, the second motor rotates and makes first bevel gear drive second bevel gear and rotate, and then the horizontal pole drives the impeller and rotate fast for there is the negative pressure in the fixed frame, and then the dust absorption pipe absorbs the dust when polishing the chip this moment, avoids the dust to fly away at will, makes chip surface dirty, leads to follow-up needs manual work to clear up.
3: through setting up clearance mechanism, the horizontal pole rotates and drives a plurality of scraper blades and rotate, and then can clear up the dust that the filter screen surface was gathered, and then avoid filter screen surface dust to gather more for the absorption effect of fixed frame to the dust descends.
Drawings
FIG. 1 is a schematic structural diagram of a chip ejection mechanism for semiconductor chip production according to the present invention;
FIG. 2 is a schematic vertical sectional view of a chip ejection mechanism for semiconductor chip production according to the present invention;
FIG. 3 is an enlarged view of the structure at A in FIG. 2;
FIG. 4 is an enlarged view of the structure at B in FIG. 2;
fig. 5 is an enlarged schematic view of the structure at C in fig. 2.
In the figure: the device comprises a box body 1, a supporting rod 2, an operation table 3, a groove 4, a sliding rod 5, a sliding block 6, a U-shaped rod 7, an arc-shaped plate 8, a first motor 9, a first lead screw 10, a lead screw nut 11, a driving rod 12, a circular groove 13, a spring 14, a disk 15, a sliding rod 16, a transverse plate 17, a second lead screw 18, a first gear 19, a second gear 20, an electric push rod 21, a flat plate 22, a second motor 23, a connecting plate 24, a bolt 25, a polishing strip 26, a fixing frame 27, a transverse rod 28, an impeller 29, a filter screen 30, a dust suction pipe 31, a first bevel gear 32, a second bevel gear 33, a scraper 34 and a dust collection frame 35.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, a chip discharge mechanism for semiconductor chip production, including box 1, box 1 bottom is through a plurality of bracing pieces 2 fixedly connected with operation panel 3, two recesses 4 have been seted up to operation panel 3 lower extreme, two equal sliding connection in recess 4 inner walls have slide bar 5, slide bar 5 lower extreme fixedly connected with slider 6, slider 6 lateral wall fixedly connected with U type pole 7, the one end fixedly connected with arc 8 of slider 6 is kept away from to U type pole 7, a plurality of circular slots 13 have been seted up to operation panel 3 upper end, the equal fixedly connected with spring 14 in a plurality of circular slots 13 bottoms, spring 14 upper end fixedly connected with disc 15, disc 15 lower extreme fixedly connected with slide bar 16, slide bar 16 lower extreme runs through operation panel 3 lower extreme and fixedly connected with diaphragm 17, install the gliding first actuating mechanism of drive slider 6 in the box 1.
First actuating mechanism includes first motor 9 of fixed connection in the 1 bottom of box, and first motor 9 movable end fixedly connected with first lead screw 10, and first lead screw 10 lateral wall threaded connection has screw nut 11, and screw nut 11 lateral wall rotates and is connected with two actuating levers 12, and the one end that screw nut 11 was kept away from to actuating lever 12 rotates with slider 6 lateral wall to be connected, installs the second actuating mechanism that drive disc 15 moved down on the first motor 9.
The second driving mechanism comprises a first gear 19 fixedly connected to the side wall of the movable shaft of the first motor 9, the lower end of the operating platform 3 is rotatably connected with a second lead screw 18, the side wall of the second lead screw 18 is in threaded connection with the side wall of the transverse plate 17, and the lower end of the second lead screw 18 is fixedly connected with a second gear 20 meshed with the first gear 19.
The diameter of the first gear 19 is much larger than that of the second gear 20, and the threads on the side walls of the first lead screw 10 and the second lead screw 18 are opposite in direction.
Further, when the first motor 9 rotates clockwise, the first gear 19 rotates clockwise, the second gear 20 rotates counterclockwise, the second lead screw 18 rotates counterclockwise rapidly, the transverse plate 17 drives the disc 15 to move downwards through the slide bar 16, the lower surface of the disc 15 is attached to the upper surface of the operating table 3, meanwhile, the first motor 9 rotates clockwise, the first lead screw 10 rotates clockwise, the lead screw nut 11 moves downwards, the lead screw nut 11 drives the two sliders 6 to approach each other through the two driving rods 12, the two sliders 6 drive the two arc-shaped plates 8 to approach each other through the two U-shaped rods 7, and then the chip is clamped and polished;
after polishing the chip, drive first motor 9 anticlockwise rotation, and then second gear 20 clockwise rotation, and then second lead screw 18 rotates and drives diaphragm 17 and move up, and then disc 15 drives the chip and shifts up, first lead screw 10 anticlockwise rotation drives screw nut 11 and moves up simultaneously, and then drive two sliders 6 and keep away from each other, and then two arcs 8 keep away from each other, and then loosen the chip, thereby be convenient for take out the chip, whole process need not manual operation, independently go on, staff's intensity of labour has been reduced, and press from both sides tightly from the edge when pressing from both sides tight to the chip, can not influence the comprehensive effect of polishing to the chip surface.
Two fixed plates of 1 lateral wall fixedly connected with of box, two electric putter 21 of two fixed plate upper end fixedly connected with, the common fixedly connected with flat board 22 of two electric putter 21 expansion ends, flat board 22 upper end fixedly connected with second motor 23, the expansion end of second motor 23 runs through flat board 22 lateral wall and extends to its lower extreme, second motor 23 expansion end fixedly connected with connecting plate 24, bolt 25 fixedly connected with polishing strip 26 is passed through to the connecting plate 24 lateral wall, be convenient for change the polishing strip 26 of wearing and tearing, install on the flat board 22 and carry out absorptive absorption mechanism to the dust when polishing semiconductor chip.
Absorption mechanism includes fixed frame 27 of fixed connection at dull and stereotyped 22 lower extreme, top fixedly connected with dead lever in the fixed frame 27, the dead lever lateral wall rotates and is connected with horizontal pole 28, horizontal pole 28 keeps away from a plurality of impellers of one end fixedly connected with 29 of fixed frame 27 inner wall, fixed frame 27 inner wall fixedly connected with filter screen 30, fixed frame 27 inner wall fixedly connected with dust absorption pipe 31, furthermore, when impeller 29 rotates fast, there is the negative pressure in the fixed frame 27, and then dust when dust absorption pipe 31 polishes the chip this moment absorbs, avoid the dust to float at will, make chip surface dirty, lead to follow-up artifical the clearing up needs, install drive horizontal pole 28 pivoted third actuating mechanism on the second motor 23, install the clearance mechanism that carries out the clearance to filter screen 30 surface dust on the horizontal pole 28.
The third driving mechanism comprises a first bevel gear 32, a movable shaft of the second motor 23 penetrates through the inner wall of the fixed frame 27, the side wall of the movable shaft, located in the fixed frame 27, of the second motor 23 is fixedly connected with the inner side wall of the first bevel gear 32, a second bevel gear 33 is fixedly connected with the side wall of the cross rod 28, and the first bevel gear 32 is meshed with the second bevel gear 33.
Clearance mechanism includes a plurality of scrapers 34, the one end that impeller 29 was kept away from to horizontal pole 28 runs through the setting of filter screen 30 lateral wall, the lateral wall fixed connection of impeller 29 is kept away from with horizontal pole 28 to a plurality of scrapers 34, scraper 34 and the laminating of filter screen 30 lateral wall, fixed frame 27 bottom fixedly connected with collection dirt frame 35, the setting of filter screen 30 lateral wall is close to collection dirt frame 35 inner wall, horizontal pole 28 rotates and drives a plurality of scrapers 34 and rotate, and then can clear up the dust that the filter screen 30 surface was gathered, and then avoid filter screen 30 surface dust to gather more, make fixed frame 27 descend the absorption effect of dust.
According to the invention, chips are placed on a plurality of discs 15, a first motor 9 is driven to rotate clockwise, and then a first gear 19 is driven to rotate clockwise, so that the first gear 19 drives a second gear 20 to rotate anticlockwise quickly, and then the second gear 20 rotates quickly to drive a transverse plate 17 to move downwards, so that the transverse plate 17 drives the discs 15 to move downwards through slide bars 16, so that the lower surfaces of the discs 15 are attached to the upper surface of an operating table 3, meanwhile, a first lead screw 10 rotates clockwise to drive a lead screw nut 11 to move downwards, so that the lead screw nut 11 drives two sliders 6 to approach each other through two driving rods 12, and then the two sliders 6 drive two arc-shaped plates 8 to approach each other through two U-shaped rods 7, and further the chips are clamped;
the two electric push rods 21 are adjusted to contract, so that the flat plate 22 is driven to move downwards, the polishing strip 26 is attached to the upper surface of the chip, then the second motor 23 is driven to rotate, the polishing strip 26 is driven to rotate, so that the chip is polished, the second motor 23 rotates to drive the first bevel gear 32 fixedly connected with the side wall of the movable shaft of the second motor to rotate, the first bevel gear 32 drives the second bevel gear 33 meshed with the first bevel gear to rotate, the cross rod 28 drives the impeller 29 to rotate rapidly, negative pressure exists in the fixed frame 27, the dust at the time of polishing the chip is absorbed by the dust suction pipe 31, the dust entering the fixed frame 27 is accumulated on the surface of the filter screen 30, meanwhile, the cross rod 28 rotates to drive the plurality of scrapers 34 to rotate, the plurality of scrapers 34 can clean the dust accumulated on the surface of the filter screen 30, and the cleaned dust falls into the dust collection frame 35 to be collected;
after polishing, adjust two electric putter 21 extensions, and then dull and stereotyped 22 drives polishing strip 26 and moves up outside box 1, drive first motor 9 anticlockwise rotation afterwards, and then first gear 19 drives second gear 20 clockwise rotation, and then second lead screw 18 rotates and drives diaphragm 17 and move up, and then disc 15 drives the chip and shifts up, and first lead screw 10 anticlockwise rotation drives screw nut 11 and moves up simultaneously, and then drive two sliders 6 and keep away from each other, and then two arcs 8 keep away from each other, and then loosen the chip, thereby be convenient for take out the chip.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.
Claims (8)
1. The chip discharge mechanism for semiconductor chip production comprises a box body (1) and is characterized in that the bottom of the box body (1) is fixedly connected with an operation table (3) through a plurality of support rods (2), the lower end of the operation table (3) is provided with two grooves (4), the inner walls of the two grooves (4) are all slidably connected with a slide rod (5), the lower end of the slide rod (5) is fixedly connected with a slide block (6), the side wall of the slide block (6) is fixedly connected with a U-shaped rod (7), one end, far away from the slide block (6), of the U-shaped rod (7) is fixedly connected with an arc-shaped plate (8), the upper end of the operation table (3) is provided with a plurality of circular grooves (13), the bottoms of the circular grooves (13) are all fixedly connected with springs (14), the upper ends of the springs (14) are fixedly connected with a disc (15), the lower end of the disc (15) is fixedly connected with a slide rod (16), the lower end of the sliding rod (16) penetrates through the lower end of the operating platform (3) and is fixedly connected with a transverse plate (17), and a first driving mechanism for driving the sliding block (6) to slide is installed in the box body (1).
2. The chip discharge mechanism for semiconductor chip production according to claim 1, wherein the first driving mechanism comprises a first motor (9) fixedly connected to the bottom of the box body (1), a first lead screw (10) is fixedly connected to a movable end of the first motor (9), a lead screw nut (11) is connected to a side wall of the first lead screw (10) in a threaded manner, two driving rods (12) are rotatably connected to side walls of the lead screw nut (11), one end of each driving rod (12) far away from the lead screw nut (11) is rotatably connected to a side wall of the slide block (6), and a second driving mechanism for driving the disk (15) to move downwards is installed on the first motor (9).
3. The chip discharge mechanism for semiconductor chip production according to claim 2, wherein the second driving mechanism comprises a first gear (19) fixedly connected to a side wall of a movable shaft of the first motor (9), a second lead screw (18) is rotatably connected to the lower end of the operating platform (3), a side wall of the second lead screw (18) is in threaded connection with a side wall of the transverse plate (17), and a second gear (20) meshed with the first gear (19) is fixedly connected to the lower end of the second lead screw (18).
4. The chip discharge mechanism for semiconductor chip production according to claim 1, wherein two fixing plates are fixedly connected to the side wall of the box body (1), two electric push rods (21) are fixedly connected to the upper ends of the fixing plates, two flat plates (22) are fixedly connected to the movable ends of the electric push rods (21) together, a second motor (23) is fixedly connected to the upper ends of the flat plates (22), the movable ends of the second motor (23) penetrate through the side wall of the flat plates (22) and extend to the lower ends of the flat plates, a connecting plate (24) is fixedly connected to the movable ends of the second motor (23), a polishing strip (26) is fixedly connected to the side wall of the connecting plate (24) through a bolt (25), and an absorption mechanism for absorbing dust generated when the semiconductor chip is polished is installed on the flat plates (22).
5. The chip discharging mechanism for semiconductor chip production according to claim 4, wherein the absorbing mechanism comprises a fixing frame (27) fixedly connected to the lower end of the flat plate (22), a fixing rod is fixedly connected to the inner top of the fixing frame (27), a cross rod (28) is rotatably connected to the side wall of the fixing rod, a plurality of impellers (29) are fixedly connected to one end of the cross rod (28) far away from the inner wall of the fixing frame (27), a filter screen (30) is fixedly connected to the inner wall of the fixing frame (27), a dust suction pipe (31) is fixedly connected to the inner wall of the fixing frame (27), a third driving mechanism for driving the cross rod (28) to rotate is installed on the second motor (23), and a cleaning mechanism for cleaning dust on the surface of the filter screen (30) is installed on the cross rod (28).
6. The chip discharging mechanism for semiconductor chip production according to claim 6, wherein the third driving mechanism comprises a first bevel gear (32), the movable shaft of the second motor (23) is disposed through the inner wall of the fixed frame (27), the side wall of the movable shaft of the second motor (23) in the fixed frame (27) is fixedly connected with the inner side wall of the first bevel gear (32), a second bevel gear (33) is fixedly connected with the side wall of the cross bar (28), and the first bevel gear (32) is engaged with the second bevel gear (33).
7. The chip discharge mechanism for semiconductor chip production according to claim 6, wherein the cleaning mechanism comprises a plurality of scrapers (34), one end of the cross rod (28) far away from the impeller (29) is arranged through the side wall of the filter screen (30), the scrapers (34) and the cross rod (28) are fixedly connected with the side wall of the impeller (29), the scrapers (34) are attached to the side wall of the filter screen (30), the bottom of the fixing frame (27) is fixedly connected with a dust collection frame (35), and the inner wall of the dust collection frame (35) is arranged close to the side wall of the filter screen (30).
8. The chip ejection mechanism for semiconductor chip production according to claim 3, wherein the diameter of the first gear (19) is much larger than that of the second gear (20), and the threads on the side walls of the first lead screw (10) and the second lead screw (18) are opposite in direction.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110813686.6A CN113524029B (en) | 2021-07-19 | 2021-07-19 | Chip discharge mechanism for semiconductor chip production |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110813686.6A CN113524029B (en) | 2021-07-19 | 2021-07-19 | Chip discharge mechanism for semiconductor chip production |
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| CN113524029B CN113524029B (en) | 2022-09-06 |
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| CN113524029B (en) | 2022-09-06 |
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