CN113523010B

CN113523010B - Metal wire preparation method

Info

Publication number: CN113523010B
Application number: CN202110607361.2A
Authority: CN
Inventors: 黄宇彬; 童培云; 朱刘
Original assignee: Pilot Film Materials Co ltd
Current assignee: Leading Film Materials Anhui Co ltd
Priority date: 2021-06-01
Filing date: 2021-06-01
Publication date: 2023-03-10
Anticipated expiration: 2041-06-01
Also published as: CN113523010A

Abstract

The invention relates to the technical field of metal wire manufacturing, and discloses a metal wire preparation method, which comprises the following steps: uniformly casting molten indium on a stainless steel pipe to form an indium rod; installing a stainless steel tube containing an indium rod on a rotating device; and (4) attaching the wire planer to the indium rod, and starting the rotating device to drive the indium rod to rotate so as to realize indium wire molding. Through adopting this granting preparation indium silk, not only can not take place the broken silk, can improve the length of indium silk, improve system silk efficiency, the cross section of digging the silk moreover is the same with the hole of digging the silk ware, can not take place the phenomenon that the crust turned over to impurity can not appear and is drawn into the condition of silk material core, has guaranteed the purity of indium silk. The invention has simple operation, good use effect and easy popularization and use.

Description

Metal wire preparation method

Technical Field

The invention relates to the technical field of metal wire manufacturing, in particular to a preparation method of an ultrafine high-purity low-melting-point metal wire, and more particularly relates to a preparation method of an indium wire.

Background

At present, most of high-purity indium wires on the market are prepared by an extrusion method and wire drawing, but because indium is soft and has the strength of about HV4, the outer skin is easy to roll up in the extrusion process, so that impurities enter the core of the wire, and the purity of the indium wire is reduced. Meanwhile, the elongation of indium is poor, and the general length of the wire material is limited within 40 meters due to the fact that the wire is easy to break.

On the other hand, the higher the purity of indium, the lower the tensile strength, for example, the tensile strength of indium with the penetration of more than 6N is less than 0.5Pa, and the indium wire can not be prepared by using the traditional drawing method.

Disclosure of Invention

In order to solve the technical problems, the invention provides the preparation method of the metal wire, which not only has high wire making speed, but also can ensure the purity of the indium wire and improve the length of the indium wire.

The technical scheme adopted by the invention for solving the technical problems is as follows:

a method for preparing a metal wire comprises the following steps:

uniformly casting molten indium on a stainless steel pipe to form an indium rod;

installing a stainless steel tube containing an indium rod on a rotating device;

and (4) attaching the wire planer to the indium rod, starting the rotating device to drive the indium rod to rotate, and realizing the indium wire molding.

Preferably, after the wire material comes out of the wire planer, a winder is connected, and the tension of the winder is controlled to be 0.03-0.08N.

Preferably, the rotating device is a lathe, and the rotating speed of the lathe is 150-230 revolutions per minute.

Preferably, the feeding amount of the wire planer in the radial direction of the indium rod is 0.5-1.5 mm/pass, and the axial movement amount of the wire planer in the axial direction of the indium rod is 160-180 mm/min.

Preferably, cooling liquid is sprayed to the joint of the wire planer and the indium rod in the wire planing process, and the spraying rate is 0.8-1.2L/min.

Preferably, dig the silk ware including cutter arbor and the tool bit that is connected, be equipped with a plurality of planes silk hole on the tool bit, dig the silk hole and link up the tool bit, just the feed inlet setting in plane silk hole is in the tool bit is kept away from the one end of cutter arbor.

Preferably, a water inlet groove and a water outlet groove are arranged in the cutter bar, the water inlet groove is communicated with the water outlet groove, and the water inlet groove and the water outlet groove both extend to the cutter head;

the water inlet groove and the water outlet groove are parallel and extend along the length direction of the cutter bar.

Preferably, the plurality of shredding holes are parallel, and the connecting line of the centers of the feeding holes of the plurality of shredding holes is arc-shaped.

Preferably, the cutter bar and the cutter head are detachably connected through screws.

Preferably, the discharge hole of the wire planning hole is located on the discharge surface of the cutter head, the surface of the cutter bar and the surface of the discharge surface located on the same projection surface are reference surfaces, the reference surfaces are planes, the center line of the wire planning hole and the reference surfaces are obliquely arranged, and the included angle a is 35-40 degrees.

Compared with the prior art, the preparation method of the metal wire has the beneficial effects that: through adopting this granting preparation indium silk, not only can not take place the broken silk, can improve the length of indium silk, improve system silk efficiency, the cross section of digging the silk moreover is the same with the hole of digging the silk ware, can not take place the phenomenon that the crust turned over to impurity can not appear and is drawn into the condition of silk material core, has guaranteed the purity of indium silk. The invention has simple operation, good use effect and easy popularization and use.

Drawings

FIG. 1 is a schematic diagram of the wire fabrication of the present invention.

Fig. 2 is a schematic structural view of the metal grater of the present invention.

Fig. 3 is a side view of the wire planer of the present invention.

Fig. 4 is a schematic view of the structure of the bit of the wire planer of the present invention.

Fig. 5 isbase:Sub>A schematic sectional view taken along linebase:Sub>A-base:Sub>A of fig. 4.

Wherein: 1-stainless steel tube, 2-indium rod, 3-grater, 31-cutter bar, 32-cutter head, 33-grated hole, 34-water inlet groove, 35-water outlet groove, 36 screw hole, 37-feed inlet, 38-discharge outlet and 4-wire material.

Detailed Description

The following detailed description of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.

As shown in fig. 1, a method for manufacturing a wire according to a preferred embodiment of the present invention is characterized in that: the method comprises the following steps:

molten indium was uniformly cast on a stainless steel tube 1 to form an indium rod 2. Because the strength and hardness of the indium are lower, the indium cannot be independently made into a rod, and the stainless steel tube 1 is used for supporting so as to facilitate the next step of the indium rod 2 to rotate along the axis of the indium rod. Preferably, the amount of the indium in the primary casting is more than one hundred kilograms;

the stainless steel tube 1 containing the indium rod 2 is mounted on a rotating device, which can be any existing device as long as the indium rod 2 can be driven to rotate. Preferably, the rotating device is a lathe, and the rotating speed of the lathe is 150-230 revolutions per minute, such as 180 revolutions, 200 revolutions, and the like, and is determined according to the size of the indium 2 rod, for example, the outer diameter of the indium rod 2 is 150mm, and the length is 1500mm. The lathe preferably turns 175 to good;

and (3) attaching the filament planer 3 to the indium rod 2, starting the rotating device to drive the indium rod 2 to rotate, and realizing indium filament molding. When the wire 4 comes out of the wire planer 3, a winder is required to be connected, the tension of the winder is controlled to be 0.03-0.08N, such as 0.04N, 0.05N, 0.06N and the like, and when the tension is too low in the wire drawing process, the wire 4 is easy to adhere to the wire planer 3 to form an extrusion bump. The wire 4 is broken due to overlarge tension, the tension is controlled to be 0.03-0.08N, the continuity of the wire 4 can be effectively maintained, the wavy defect wire 4 caused by the surface tension is avoided, and the quality of the wire 4 is improved.

In the wire planing process of the wire planer 3, the radial feeding amount along the indium rod 2 is 0.5-1.5 mm/pass, and the axial movement amount along the indium rod 2 is 160-180 mm/min. Mainly according to the width required by the indium wire, the left and right directions and the corresponding rotating speed of the lathe are adjusted. At this time, the cutter head 32 of the filament planer 3 will make helical relative motion with the indium rod 2, so that the material on the indium rod 2 will penetrate through the filament planing hole 33 in the middle of the filament planer 3 to become indium filament. The specific feed rate can be adjusted as desired, but is preferably selected as per the following table.

In addition, cooling liquid is sprayed to the joint of the shredder 3 and the indium bar 2 in the shredding process, and the spraying speed is 0.8-1.2L/min, preferably 1L/min. The cooling liquid adopts absolute ethyl alcohol, and firstly, the absolute ethyl alcohol is used for lubrication, so that the friction resistance in the planing process is reduced; and secondly, the wire material is used as cooling liquid, so that the wire material 4 is prevented from being scrapped due to the fact that the indium material is heated and melted (the melting point is 156 ℃), or the oxygen content of the wire material is increased due to heating, and the wire material is seriously oxidized, and the quality of the wire material 4 is guaranteed. After the use, the absolute ethyl alcohol can volatilize to avoid the pollution problem caused by the cooling of the used oil liquid.

Referring to fig. 2-3, in the present embodiment, the wire planer 3 includes a tool holder 31 and a tool bit 32 connected to each other, and the tool bit 32 is made of titanium with a purity of 4N or more, otherwise, it may cause purity contamination to 6N indium wires. Be equipped with a plurality of grater holes 33 on the tool bit 32, grater holes 33's cross section is square section, circular cross section, rectangle cross section etc. if the diameter is 0.8 millimeters circular, specifically can set up as required. The wire planing hole 33 penetrates through the cutter head 32, and a feed port 37 of the wire planing hole 33 is formed in one end, far away from the cutter head 31, of the cutter head 32. Through set up dig silk hole 33 on tool bit 32, only need control cutter arbor 31 during the system silk, make tool bit 32 dig the silk to indium stick 2 can, not only can not take place disconnected silk, can improve the length of indium silk, the cross section of digging the silk moreover is the same with digging silk hole 43, can not take place the phenomenon that the crust turned over to impurity can not appear and is drawn into the condition of 4 cores of silk material, has guaranteed the purity of indium silk. Meanwhile, the wire planing holes 43 on the cutter head 42 are a plurality of, so that a plurality of wires 4 can be planed by one-time feeding, and the wire manufacturing speed is improved.

In this embodiment, a water inlet groove 34 and a water outlet groove 35 are disposed in the cutter bar 31, the water inlet groove 34 is communicated with the water outlet groove 35, and both the water inlet groove 34 and the water outlet groove 35 extend to the cutter head 32. During the wire making, cold water enters from the water inlet groove 34, exchanges heat with the cutter head 32 and then flows out from the water outlet groove 35, so that the indium wire is prevented from being fused due to the overhigh temperature of the cutter head 32, and the wire planing quality is improved. Preferably, the water inlet groove 34 and the water outlet groove 35 are parallel and both extend along the length direction of the knife bar 31. In addition, the flow area of the water inlet groove 34 and the water outlet groove 35 is 3-5mm ² Preferably 4mm ² The flow rate of heat exchange water is controlled within 100 ml/min, and the temperature of inlet water is controlled within 25-30. The knifeThe material of the rod 31 is economic cost, and only Al6061 is used, so that the strength and the heat exchange performance are completely sufficient.

Referring to fig. 4-5, in the present embodiment, the plurality of shredding holes 33 are parallel, and the connecting lines of the centers of the feeding holes 37 of the plurality of shredding holes 33 are circular arc-shaped. Because the surface of the indium rod 2 is circular in the wire manufacturing process, the connecting lines of the centers of the feed inlets 37 of the wire planning holes 33 are arranged to be circular arc-shaped, so that the indium rod 2 can be better attached, and the wire planning is convenient.

In this embodiment, the knife bar 31 and the knife head 32 are detachably connected through screws, specifically, the knife bar 31 and the knife head 32 are both provided with screw holes 36, and the screws are directly connected with the corresponding screw holes 36 during installation. Therefore, when the cutter head 32 is worn or has other abnormal conditions, the cutter head 32 can be replaced quickly, and the normal operation of wire making is ensured.

In this embodiment, the discharge hole 38 of the wire planning hole 33 is located on the discharge surface of the tool bit 32, the surface of the tool bar 31 and the discharge surface located on the same projection plane is a reference plane, the reference plane is a plane, the center line of the wire planning hole 33 and the reference plane are obliquely arranged, and the included angle a is 35-40 degrees, such as 36 degrees, 37 degrees, 38 degrees, and the like. Through with dig the central line of silk hole 33 with the reference surface slope sets up, conveniently is carried out the rolling by 4 ejection of compact of the silk material of digging, has avoided the reference surface influences the ejection of compact. Meanwhile, the shaping of the metal indium wire with the diameter of less than D0.5mm can be realized by matching with the wire shaping hole 43.

By adopting the preparation method of the scheme, the indium wire 4 with the length of more than 500 meters can be prepared, the wire is not easy to break, the appearance profile shape of the wire is good, the oxygen content is low, and the purity can be consistent with that of the matrix.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, many modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. A method for preparing a metal wire is characterized by comprising the following steps: the method comprises the following steps:

and (4) attaching the wire planer to the indium rod, and starting the rotating device to drive the indium rod to rotate so as to realize indium wire molding.

2. The method of manufacturing a wire according to claim 1, wherein: when the wire material comes out of the wire planer, a winder is required to be connected, and the tension of the winder is controlled to be 0.03-0.08N.

3. The method of manufacturing a wire according to claim 1, wherein: the rotating device is a lathe, and the rotating speed of the lathe is 150-230 revolutions per minute.

4. The method of manufacturing a wire according to claim 1, wherein: in the wire planing process of the wire planer, the radial feeding amount of the wire planer along the indium rod is 0.5-1.5 mm/pass, and the axial movement amount of the wire planer along the indium rod is 160-180 mm/min.

5. The method of manufacturing a wire according to claim 1, wherein: and in the wire planing process, cooling liquid is sprayed to the joint of the wire planer and the indium rod, and the spraying rate is 0.8-1.2L/min.

6. The method of manufacturing a wire according to claim 1, wherein: dig the silk ware including cutter arbor and the tool bit that is connected, be equipped with a plurality of planes silk hole on the tool bit, it link up to dig the silk hole the tool bit, just the feed inlet setting in plane silk hole is in the tool bit is kept away from the one end of cutter arbor.

7. The method of manufacturing a wire according to claim 6, wherein: a water inlet groove and a water outlet groove are arranged in the cutter bar, the water inlet groove is communicated with the water outlet groove, and the water inlet groove and the water outlet groove both extend to the cutter head;

8. The method of manufacturing a wire according to claim 6, wherein: the wire planing holes are parallel, and the connecting line of the centers of the feed inlets of the wire planing holes is arc-shaped.

9. The method of manufacturing a wire according to claim 6, wherein: the cutter arbor with the tool bit passes through the screw and can dismantle the connection.

10. The method of manufacturing a wire according to claim 6, wherein: the discharge hole of the wire planing hole is located on the discharge surface of the cutter head, the surface of the cutter bar and the surface of the discharge surface, which are located on the same projection plane, are taken as reference surfaces, the reference surfaces are planes, the central line of the wire planing hole and the reference surfaces are obliquely arranged, and the included angle a of the central line of the wire planing hole is 35-40 degrees.