CN113517157B - Thermal switch device applied to regulation and control of heat transmission - Google Patents
Thermal switch device applied to regulation and control of heat transmission Download PDFInfo
- Publication number
- CN113517157B CN113517157B CN202110745427.4A CN202110745427A CN113517157B CN 113517157 B CN113517157 B CN 113517157B CN 202110745427 A CN202110745427 A CN 202110745427A CN 113517157 B CN113517157 B CN 113517157B
- Authority
- CN
- China
- Prior art keywords
- conductor
- thermal
- switch
- thermal switch
- hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/64—Contacts
Landscapes
- Thermally Actuated Switches (AREA)
Abstract
The invention belongs to the technical field of thermal control, and particularly relates to a thermal switch device applied to regulating and controlling heat transmission. The invention can independently realize the hot flow path and the hot flow circuit break and can ensure the uniform temperature distribution on the hot switch under the hot flow path state, thereby eliminating the non-uniform thermal stress in the hot switch caused by the non-uniform temperature distribution. Compared with the prior thermal switch, the thermal switch has a simpler structure and wider applicable material range; more flexible, can adjust the thermal shutdown effect of hot switch under the prerequisite that does not influence the hot route effect. The invention is not limited to specific size, and the overall size of the thermal switch can be adjusted according to actual requirements, namely the thermal switch is suitable for both microscopic and macroscopic.
Description
Technical Field
The invention belongs to the technical field of thermal control, and particularly relates to a thermal switch device applied to regulating and controlling heat transmission.
Background
In practical engineering, extreme environmental temperatures can affect the effective operation of mechanical or electronic components, even burn out electronic components. Meanwhile, the working environment of the machine is generally variable, for example, the working temperature of the automobile battery not only changes along with the working time of the automobile battery, but also changes along with the change of seasons. Therefore, the thermal switch is required to be actively regulated, that is, a thermal path or a thermal cut-off is realized according to actual requirements.
The current thermal switches mainly have the following three types: air gap, magnetron, and extended thermal path. The main characteristic is that the structure is complex. When the air gap type thermal switch works, rare gas (such as helium gas and the like) needs to be injected into a closed structure to form a thermal path, and the rare gas is sucked out to form a thermal break. The magnetic thermal switch requires the position of the thermal conductor to be controlled by an electromagnet to form a thermal path and a thermal break. The thermal switch is an improved result of the air gap type thermal switch by prolonging the thermal path, and the vacuum cavity of the air gap type thermal switch is mainly divided into a plurality of communicated cavities by arranging the fins, so that the circulating path of heat flow is prolonged to 3-10 times of that of the traditional air gap type thermal switch. In short, the conventional thermal switch has a complicated structure, and requires injection and suction of a rare gas (e.g., an air gap thermal switch) or regulation of an external physical field (e.g., a magnetron thermal switch). The thermal switch designed based on these methods is limited in practical applications, for example, the air gap thermal switch needs to continuously flush and suck air, and the magnetic control thermal switch needs to be connected with an external power supply.
Disclosure of Invention
The invention aims to provide a thermal switch device for regulating and controlling heat transmission.
The purpose of the invention is realized by the following technical scheme: comprises a first conductor, a second conductor and a third conductor; the second conductor has a thermal conductivity of kappa 2 Cutting two semicircular holes in the second conductor, wherein the circle centers of the two semicircular holes are respectively selected at the upper and lower boundaries of the second conductor and are positioned on the same vertical line, a certain distance is reserved between the vertexes of the two semicircular holes, and the radius of the upper semicircular hole is R 1 The radius of the lower semicircular hole is R 2 (ii) a The first conductor has a thermal conductivity of kappa 1 ，κ 1 ＞κ 2 The first conductor has an outer diameter R 1 Inner diameter of r 1 The hollow hemisphere of (a) is provided with,
the first conductor is arranged in the upper semi-circular hole of the second conductor and is tightly attached; the third conductor has a thermal conductivity of kappa 3 ，κ 3 ＞κ 2 The third conductor has an outer diameter R 2 Inner diameter of r 2 The hollow hemisphere of (a) is provided with,
the third conductor is arranged in the lower semicircular hole of the second conductor and is tightly attached; the close contact of the first conductor, the third conductor and the second conductor realizes the thermal path state of the thermal switch, and the first conductor and the third conductor are taken down when the thermal disconnection state is needed to be realized.
The present invention may further comprise:
and the surfaces of the upper semicircular hole and the lower semicircular hole of the second conductor are coated with heat-conducting silica gel.
The invention has the beneficial effects that:
the invention can independently realize the hot flow path and the hot flow circuit break and can ensure the uniform temperature distribution on the hot switch under the hot flow path state, thereby eliminating the non-uniform thermal stress in the hot switch caused by the non-uniform temperature distribution. Compared with the prior thermal switch, the thermal switch has a simpler structure and wider applicable material range; more flexible, can adjust the thermal shutdown effect of hot switch under the prerequisite that does not influence the hot route effect. The invention is not limited to specific size, and the overall size of the thermal switch can be adjusted according to actual requirements, namely the thermal switch is suitable for both microscopic and macroscopic.
Drawings
FIG. 1 is a schematic illustration of neutral inclusions.
Fig. 2 is a schematic structural diagram of the thermal switch device of the present invention in a thermal path state.
Fig. 3 is a schematic structural diagram of the thermal switch device of the present invention in a thermal shutdown state.
Fig. 4 is a diagram illustrating the operation effect of the thermal switch device in the thermal path state according to the embodiment of the present invention.
Fig. 5 is a diagram illustrating the operation effect of the thermal switch device in the thermal shutdown state according to the embodiment of the present invention.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
The invention belongs to the technical field of thermal control, and provides a thermal switch which can be manufactured by only selecting natural materials meeting requirements. The invention can realize the hot flow path and the hot flow circuit break, and realize the uniform temperature distribution on the hot switch in the hot flow path state, thereby eliminating the non-uniform thermal stress in the hot switch caused by the non-uniform temperature distribution. The invention has simple structure and easy realization, and the used materials are all natural materials, thus having low cost.
A thermal switching device for regulating heat transfer includes a first conductor, a second conductor, and a third conductor; the second conductor has a thermal conductivity of kappa 2 Cutting two semicircular holes in the second conductor, wherein the circle centers of the two semicircular holes are respectively selected at the upper and lower boundaries of the second conductor and are positioned on the same vertical line, a certain distance is reserved between the vertexes of the two semicircular holes, and the radius of the upper semicircular hole is R 1 The radius of the lower semicircular hole is R 2 (ii) a The first conductor has a thermal conductivity of kappa 1 ，κ 1 ＞κ 2 The first conductor has an outer diameter R 1 Inner diameter of r 1 The hollow hemisphere of (a) is provided with,
the first conductor is arranged in the upper semi-circular hole of the second conductor and is tightly attached; the third conductor has a thermal conductivity of kappa 3 ，κ 3 ＞κ 2 The third conductor has an outer diameter R 2 Inner diameter of r 2 The hollow hemisphere of (a) is provided with,
the third conductor is arranged in the lower semicircular hole of the second conductor and is tightly attached; the close contact of the first conductor, the third conductor and the second conductor realizes the thermal path state of the thermal switch, and the first conductor and the third conductor are taken down when the thermal disconnection state is needed to be realized.
Compared with the prior art, the invention has the beneficial effects that: the thermal switch can independently realize the thermal path and the thermal flow disconnection and can ensure the uniform temperature distribution on the thermal switch in the thermal path state, thereby eliminating the non-uniform thermal stress in the thermal switch caused by the non-uniform temperature distribution. Compared with the prior thermal switch, the thermal switch has a simpler structure and wider applicable material range; the thermal switch is more flexible, and the thermal breaking effect of the thermal switch can be adjusted on the premise of not influencing the thermal path effect; the overall size of the thermal switch can be adjusted according to actual requirements without being limited to specific sizes, namely, the thermal switch is applicable to both microscopic and macroscopic.
Example 1:
this embodiment takes two semicircular holes with equal radius as an example. The thermal switch of the present design is comprised of a first conductor and a second conductor. Based on the idea of neutral inclusions, a circular hole is cut in the second conductor, as shown in fig. 1, the material of the first conductor is selected according to actual requirements, the size parameter of the first conductor is obtained through actual calculation, and then the first conductor is arranged in the circular hole of the second conductor. The definition of neutral inclusions is: when the effective properties of an inclusion are the same as those of the surrounding material, the physical field distributed in the surrounding material is not disturbed, and the inclusion is called neutral inclusion.
The circular hole in the second conductor is in communication with air in the surrounding environment, so the air in the circular hole does not affect the heat transfer of the entire thermal switch, i.e. the circular hole is not thermally conductive by default. When the first conductor is tangent to the upper and lower edges of the second conductor, the left and right parts of the second conductor are in point contact, and the heat flow from left to right depends mainly on the first conductor (i.e. the heat path state). When the second conductor is not embedded with the first conductor, the heat flow cannot flow from left to right (i.e. thermal open state). The use of this embodiment will result in an inability to maintain complete connectivity between the left and right portions of the second conductor. Therefore, when the thermal switch is manufactured, the first conductor is not tangent to the upper edge and the lower edge of the second conductor, namely, the upper edge of the first conductor is at a certain distance from the upper edge of the second conductor. When the distance is sufficiently small (relative to the height of the second conductor), the circulation of heat flow can be prevented also in the thermally disconnected state. In the process of designing and manufacturing the thermal switch, the connection strength of the left part and the right part of the first conductor is fully considered, meanwhile, the high symmetry of the circular inclusions is combined, one half of the circular neutral inclusions, namely, a semicircle, is taken, and the two semicircular inclusions are respectively arranged at the upper edge and the lower edge (on the same vertical line) of the second conductor, so that the left connection part and the right connection part of the second conductor can be transferred to the middle of the two semicircles. The distance between two semicircle rings can be designed according to actual demand: the effect of thermal opens weakens as the distance between the two rings increases.
In order to ensure the flexibility of designing the thermal switch, the two semicircular rings can be made of different materials, and the required circular ring sizes of the circular rings made of different materials are different. In designing a thermal switch, the materials of the first and second conductors are first selected, assuming that the thermal conductivities of the first and second conductors, respectively, are κ 1 And kappa 2 Then, the radius R of the round hole formed in the second conductor is selected according to actual requirements, the outer diameter of the first conductor hollow hemisphere is further determined to be R, and finally the inner diameter R of the first conductor hollow hemisphere can be determined to be R
And (4) calculating. The thermal switch designed by the invention has certain limitation on the thermal conductivity of the first conductor and the second conductor:first conductor thermal conductivity κ 1 Must be higher than the second conductor thermal conductivity κ 2 I.e. kappa 1 ＞κ 2 。
Referring to fig. 2, fig. 2 shows the thermal switch in a hot-path state. The thermal switch of the present design is comprised of a first conductor and a second conductor. In practice, the second conductor material (thermal conductivity k) is first selected 2 ) Cutting two semicircular holes with the radius of R in the second conductor, wherein the circle centers of the semicircular holes are selected at the upper and lower boundaries of the second conductor 2 and are positioned on the same vertical line, and keeping a certain distance between the vertexes of the two semicircular holes according to actual requirements; the material of the first conductor 1 (thermal conductivity k) is then selected 1 ) And according to the formula
Calculating the inner diameter r of the first conductor 1; finally, the thermal switch is thermally connected by bringing the first conductor into close contact with the second conductor. When the thermal cut-off state is to be realized, the first conductor is only required to be taken down, as shown in figure 3. In order to make the first conductor and the second conductor closely contact, a small amount of heat-conducting silica gel may be coated on the interface of the two conductors, or other mechanical means may be applied to implement the present invention, which is not limited to a specific connection manner.
The operation effect of the thermal flow switch manufactured according to the embodiment in the thermal path and thermal disconnection state is shown in fig. 4 and fig. 5. Wherein the black curve 3 is the isotherm of heat flow through the thermal switching device from left to right. In the hot-path state, the heat flow can flow through the thermal switch smoothly and the temperature on the first conductor is distributed uniformly, see fig. 4; the circulation of the heat flow in the thermally disconnected state is not only impeded, but the temperature distribution over the second conductor is extremely uneven, see fig. 5.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (2)
1. The utility model provides a be applied to thermal switching device of regulation and control heat transmission which characterized in that: comprises a first conductor, a second conductor and a third conductor; the second conductor has a thermal conductivity of kappa 2 Cutting two semicircular holes in the second conductor, wherein the circle centers of the two semicircular holes are respectively selected at the upper and lower boundaries of the second conductor and are positioned on the same vertical line, a certain distance is reserved between the vertexes of the two semicircular holes, and the radius of the upper semicircular hole is R 1 The radius of the lower semicircular hole is R 2 (ii) a The first conductor has a thermal conductivity of kappa 1 ，κ 1 ＞κ 2 The first conductor has an outer diameter R 1 Inner diameter of r 1 The hollow hemisphere of (a) is provided with,
the first conductor is arranged in the upper semi-circular hole of the second conductor and is tightly attached; the third conductor has a thermal conductivity of kappa 3 ，κ 3 ＞κ 2 The third conductor has an outer diameter R 2 Inner diameter of r 2 The hollow hemisphere of (a) is provided with,
the third conductor is arranged in the lower semicircular hole of the second conductor and is tightly attached; the close contact of the first conductor, the third conductor and the second conductor realizes the thermal path state of the thermal switch, and the first conductor and the third conductor are taken down when the thermal disconnection state is needed to be realized.
2. A thermal switching device for regulating heat transfer as defined in claim 1, wherein: and the surfaces of the upper semicircular hole and the lower semicircular hole of the second conductor are coated with heat-conducting silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110745427.4A CN113517157B (en) | 2021-07-01 | 2021-07-01 | Thermal switch device applied to regulation and control of heat transmission |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110745427.4A CN113517157B (en) | 2021-07-01 | 2021-07-01 | Thermal switch device applied to regulation and control of heat transmission |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113517157A CN113517157A (en) | 2021-10-19 |
| CN113517157B true CN113517157B (en) | 2022-07-29 |
Family
ID=78066623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110745427.4A Active CN113517157B (en) | 2021-07-01 | 2021-07-01 | Thermal switch device applied to regulation and control of heat transmission |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113517157B (en) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2831198C2 (en) * | 1978-07-15 | 1982-11-04 | Limitor AG, 8022 Zürich | Bimetal temperature switch |
| JP2781892B2 (en) * | 1989-07-06 | 1998-07-30 | 石川島播磨重工業株式会社 | Thermal diode |
| CN2158523Y (en) * | 1993-05-07 | 1994-03-09 | 中国科学院上海技术物理研究所 | Controlling device for low temp. heat medium |
| US7934321B2 (en) * | 2005-04-13 | 2011-05-03 | Egresson, Llc | Tilt switch employing graphite |
| FR2891958B1 (en) * | 2005-10-11 | 2008-08-01 | Schneider Electric Ind Sas | CURRENT LIMITER DEVICE, CIRCUIT BREAKER COMPRISING SUCH A DEVICE, AND CURRENT LIMITER METHOD |
| CN201057618Y (en) * | 2007-09-13 | 2008-05-07 | 北京斯瑞科晶体技术发展有限公司 | Electro-optical Q switch |
| US9349558B2 (en) * | 2011-12-06 | 2016-05-24 | Palo Alto Research Center Incorporated | Mechanically acuated heat switch |
| CN203456385U (en) * | 2013-08-20 | 2014-02-26 | 深圳市恒进丰科技有限公司 | High-efficiency insulative thermoswitch |
| RU159005U1 (en) * | 2015-06-18 | 2016-01-20 | Анна Сергеевна Николаева | THERMOSENSITIVE ACTUATOR |
| CN105428153A (en) * | 2015-11-19 | 2016-03-23 | 中国科学院等离子体物理研究所 | Semiconductor low-temperature thermal switch |
| CN110826272B (en) * | 2019-10-26 | 2023-05-30 | 复旦大学 | Heat rotating device suitable for conduction, convection and radiation simultaneously |
-
2021
- 2021-07-01 CN CN202110745427.4A patent/CN113517157B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN113517157A (en) | 2021-10-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113517157B (en) | Thermal switch device applied to regulation and control of heat transmission | |
| CN105304973A (en) | Battery thermal management device and manufacture method thereof | |
| CN204130435U (en) | Big current self-cooled vacuum breaker pole | |
| CN105829956A (en) | Thermo-optic phase shifter | |
| CN205984551U (en) | Radiating dry -type transformer of annular air current | |
| CN205177979U (en) | Battery module | |
| CN207925405U (en) | Automatically control electric appliance | |
| CN210004502U (en) | far infrared radiation type warmer | |
| CN209965282U (en) | Portable wearable air conditioning device | |
| CN209132649U (en) | Liquid temperature control ceramic tile and liquid temperature control system | |
| CN207199803U (en) | Li-ion batteries piles | |
| CN202364398U (en) | High temperature chromium wire rare earth composite ceramic heating sheet | |
| CN105135391A (en) | Cooler | |
| CN206541280U (en) | A kind of mouse with constant temperature warm hand function | |
| CN209689378U (en) | Smelting furnace | |
| CN206640107U (en) | Extend the device and laser of VCSEL laser. operating temperature scopes | |
| CN206926217U (en) | Temperature maintaining body in a kind of injection die manufacture | |
| CN208158911U (en) | Directional heater and directional heating device | |
| CN217521749U (en) | Vehicle-mounted hard disk device and vehicle-mounted monitoring equipment | |
| CN208159108U (en) | Cooler | |
| CN206674390U (en) | A kind of unmanned plane electricity consumption mode transfer blocking structure | |
| CN107236988B (en) | Polycrystal air cooling silicon ingot furnace | |
| CN109366872A (en) | A kind of temp auto-controlled energy saving heating ring | |
| CN105673269A (en) | Fuel heating system and vehicle | |
| CN212045863U (en) | Structure for quickly dissipating heat of molten rubber charging barrel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |