CN113507776B

CN113507776B - A high frequency circuit board for 5G communication

Info

Publication number: CN113507776B
Application number: CN202110862157.5A
Authority: CN
Inventors: 陆金明; 程林海
Original assignee: Kunshan Jinpeng Electron Co ltd
Current assignee: Kunshan Jinpeng Electron Co ltd
Priority date: 2021-07-29
Filing date: 2021-07-29
Publication date: 2022-05-03
Anticipated expiration: 2041-07-29
Also published as: CN113507776A

Abstract

The invention relates to a high-frequency circuit board, in particular to a high-frequency circuit board for 5G communication. It includes the circuit board body and installs the heat sink in circuit board body below, the mounting hole has been seted up in the four corners on circuit board body surface, and the mounting hole is used for the fixed of circuit board body, the heat sink includes refrigeration mechanism at least, refrigeration mechanism is including setting up the installation shell in circuit board body below, should be arranged in the high frequency circuit board of 5G communication, through the heat sink that sets up, can be even cool down the circuit board body to improve circuit board body work efficiency, solved current cooling mode to the circuit board be through laying the cooling tube at the circuit board, the flow has the coolant liquid to cool down in the cooling tube, but the part that the cooling tube did not contact with the circuit board then can not cool down, thereby lead to the local temperature of circuit board too high or cross lowly, influenced the life of circuit board.

Description

A high frequency circuit board for 5G communication

Technical Field

The invention relates to a high-frequency circuit board, in particular to a high-frequency circuit board for 5G communication.

Background

The circuit board can be called as a printed circuit board or a printed circuit board, a PCB, an FPC circuit board and a rigid-flex board, and the birth and development of the FPC and the PCB urge the generation of a new product of the rigid-flex board. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.

Along with the continuous progress of science and technology, people have developed the high frequency circuit board that supports 5G communication, the circuit board is when carrying out a large amount of receiving and dispatching signals, its circuit board itself can produce higher heat, and the heat is higher then can make the components and parts on the circuit board take place to damage, current cooling mode to the circuit board is through laying the cooling tube at the circuit board, it has the coolant liquid to cool down to flow in the cooling tube, but the cooling tube then can not cool down with the part that does not contact of circuit board, thereby lead to the local high temperature or low excessively of circuit board, the life of circuit board has been influenced.

Disclosure of Invention

The invention aims to provide a high-frequency circuit board for 5G communication, which solves the problems in the background technology.

In order to realize the above-mentioned purpose, a high frequency circuit board for 5G communication is provided, including circuit board body and the heat sink of installing in circuit board body below, the mounting hole has been seted up in the four corners on circuit board body surface, and the mounting hole is used for the fixed to the circuit board body, the heat sink includes at least:

the refrigeration mechanism comprises an installation shell arranged below the circuit board body, a refrigeration sheet is installed inside the installation shell, a through hole is formed in one side of the installation shell, a fan blade is installed in the through hole and driven by a driving device, an air guide pipe is communicated in the through hole, and an air inlet hole is formed in the side wall of one end, corresponding to the through hole, of the through hole;

the air exhaust mechanism comprises an air exhaust pipe arranged below the circuit board body, the air exhaust pipe is of an S-shaped structure, a plurality of air exhaust holes are formed in the surface of the air exhaust pipe, and the air exhaust holes are used for blowing air to the circuit board body;

the fixed rod is fixed on the outer wall of the top of the exhaust pipe and the mounting shell, and the other end of the fixed rod is fixedly connected with the outer wall of the circuit board body.

As a further improvement of the technical scheme, protection blocks are arranged around the circuit board body and are of a U-shaped structure, inner walls on two sides of each protection block are attached to two sides of the circuit board body, a buffer cavity is formed between the inner wall and the outer wall of each protection block, and gas is filled in the buffer cavity.

As a further improvement of the technical scheme, the inner walls of the two sides of the protection block are fixedly connected with clamping strips, the outer walls of the two sides of the circuit board body are provided with a plurality of clamping grooves, and the clamping grooves are matched with the perforated clamping.

As a further improvement of the technical scheme, a lantern ring is sleeved in the mounting hole, a connecting cavity is formed between the inner wall and the outer wall of the lantern ring, gas is filled in the connecting cavity, and external threads are formed in the inner wall of the lantern ring.

As a further improvement of the technical scheme, a blocking disc is arranged at the air inlet hole, a filtering hole is formed in the side wall of the blocking disc, and the blocking disc is sleeved on the inner wall of the air inlet hole.

As a further improvement of the technical scheme, one end, located at the air inlet hole, of the side wall of the installation shell is provided with a slot, an inserting plate is inserted in the slot, the side wall of the inserting plate is provided with a fixing hole matched with the air inlet hole, and the fixing hole is matched with the blocking disc in a clamping mode.

As a further improvement of the technical scheme, a filling cavity is formed between the inner wall and the outer wall of the installation shell, and a heat insulation material is filled in the filling cavity and used for heat insulation of the installation shell.

As a further improvement of the technical scheme, a snap ring is fixedly connected in one part of the air exhaust holes, an air guide ball is fixedly connected to the top of the snap ring, and a channel with a certain height is reserved between the air guide ball and the snap ring.

As a further improvement of the technical scheme, a plurality of through holes are formed in the surface of the circuit board body, the fixing rod penetrates through the through holes, internal threads are formed in the outer wall of the fixing rod, and a nut is connected to the outer wall of the fixing rod through threads.

As a further improvement of the technical scheme, a penetrating groove is formed in one end of the fixing rod, the exhaust pipe is communicated with the penetrating groove, a supporting rod is fixedly connected to the top of the penetrating groove, and a wind shield is fixedly connected to the top of the supporting rod.

Compared with the prior art, the invention has the beneficial effects that:

1. this a high frequency circuit board for 5G communication, through the heat sink that sets up, can be even cool down to the circuit board body to in improving circuit board body work efficiency, solved current cooling mode to the circuit board through laying the cooling tube at the circuit board, the flow has the coolant liquid to cool down in the cooling tube, but the cooling tube then can not cool down with the part of not contacting of circuit board, thereby the local high temperature that leads to the circuit board is perhaps low excessively, has influenced the life of circuit board.

2. In the high-frequency circuit board for 5G communication, the protection block can protect the edge core of the circuit board body and prevent the phenomenon that the edge is easy to crack when the circuit board body is faded.

3. In the high-frequency circuit board for 5G communication, the lantern ring is arranged, so that the phenomenon that the mounting hole is easy to crack when a case is collided can be prevented.

4. In this a high frequency circuit board for 5G communication, through the fender dish that sets up, can block the dust, prevent that the dust from entering into in the installation shell.

Drawings

FIG. 1 is a schematic view of the overall structure of embodiment 1 of the present invention;

fig. 2 is a schematic structural view of a circuit board body in embodiment 1 of the present invention;

FIG. 3 is a schematic diagram of a protection block structure according to embodiment 1 of the present invention;

FIG. 4 is a schematic structural view of a collar in embodiment 1 of the present invention;

fig. 5 is a schematic structural view of a cooling device according to embodiment 1 of the present invention;

fig. 6 is a schematic structural view of a refrigeration mechanism according to embodiment 1 of the present invention;

fig. 7 is a schematic structural view of a mounting case according to embodiment 1 of the present invention;

FIG. 8 is a schematic structural view of an exhaust mechanism according to embodiment 1 of the present invention;

fig. 9 is a sectional view schematically showing the structure of a mounting case according to embodiment 1 of the present invention;

fig. 10 is a schematic view of a wind-guiding ball structure according to embodiment 2 of the present invention;

fig. 11 is a schematic structural view of a fixing rod according to embodiment 3 of the present invention.

The various reference numbers in the figures mean:

100. a circuit board body; 101. mounting holes; 102. a card slot; 103. perforating;

110. a protection block; 111. clamping the strip;

120. a collar;

200. a cooling device;

210. a refrigeration mechanism; 211. mounting a shell; 212. refrigerating plates; 213. a through hole; 214. a fan blade; 215. an air guide pipe; 216. An air inlet hole; 217. a catch tray;

220. an air exhaust mechanism; 221. an exhaust duct; 222. an air exhaust hole; 223. fixing the rod;

230. a slot; 231. inserting plates; 232. a fixing hole;

240. a thermal insulation material;

250. a snap ring; 251. a wind guide ball;

260. an external thread; 261. penetrating a groove; 262. a wind deflector.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Example 1

Referring to fig. 1 to 9, a high-frequency circuit board for 5G communication is provided, which includes a circuit board body 100 and a cooling device 200 installed below the circuit board body 100, wherein four corners of the surface of the circuit board body 100 are provided with mounting holes 101, the mounting holes 101 are used for fixing the circuit board body 100, and the cooling device 200 at least includes:

the refrigeration mechanism 210 comprises a mounting shell 211 arranged below the circuit board body 100, a refrigeration sheet 212 is arranged inside the mounting shell 211, a through hole 213 is formed in one side of the mounting shell 211, a fan blade 214 is arranged in the through hole 213, the fan blade 214 is driven by a driving device, the driving device is preferably driven by a micro motor, the micro motor has the advantage of small volume so as to be conveniently mounted in the through hole 213, an air guide pipe 215 is communicated in the through hole 213, and an air inlet hole 216 is formed in the side wall of one end, corresponding to the through hole 213, of the through hole 213;

the air exhaust mechanism 220 comprises an air exhaust pipe 221 arranged below the circuit board body 100, the air exhaust pipe 221 is of an S-shaped structure, the length of the S-shaped air exhaust pipe 221 is long so as to uniformly blow air to the circuit board body 100, a plurality of air exhaust holes 222 are formed in the surface of the air exhaust pipe 221, and the air exhaust holes 222 are used for blowing air to the circuit board body 100;

the fixing rod 223 is fixed on the outer wall of the top of the exhaust duct 221 and the mounting shell 211, the other end of the fixing rod 223 is fixedly connected with the outer wall of the circuit board body 100, and the circuit board body 100 can be uniformly cooled through the arranged cooling device 200, so that the working efficiency of the circuit board body 100 is improved.

When the circuit board body 100 and the cooling device 200 of the embodiment are specifically used, the power supply of the cooling plate 212 is switched on, the cooling plate 212 starts to cool, the cooling plate 212 cools to generate cold air in the mounting shell 211, the micro motor drives the fan blade 214 to rotate, the fan blade 214 rotates to pump out the cold air of the mounting shell 211 and send the cold air into the exhaust pipe 221 through the air guide pipe 215, then the cold air is blown out through the plurality of exhaust holes 222 on the surface of the exhaust pipe 221, the blown cold air is contacted with the circuit board body 100, and uniform cooling of the circuit board body 100 is achieved.

In addition, in order to realize the protection at circuit board body 100 edge, be provided with protection piece 110 around circuit board body 100, protection piece 110 is "U" shape structure, the both sides inner wall of protection piece 110 is laminated with circuit board body 100's both sides mutually, the buffering cavity has been seted up between protection piece 110's inner wall and the outer wall, the buffering cavity intussuseption is filled with gas, protection piece 110 preferably adopts the rubber material, rubber has stronger flexibility, when circuit board body 100 fell, protection piece 110 and ground contact, the inside buffering cavity compression of protection piece 110 comes the impact force that the absorption collision produced, and then reach the protection to the edge.

Further, in order to improve the detachability to protection piece 110, the equal fixedly connected with card strip 111 of inner wall of protection piece 110 both sides, a plurality of draw-in grooves 102 have all been seted up to the outer wall of circuit board body 100 both sides, and draw-in groove 102 and perforation 103 joint cooperation come to fix protection piece 110 through joint complex mode for when protection piece 110 damaged in the collision many times, can be quick change protection piece 110.

Still further, in order to prevent that the quick-witted case of fixed circuit board body 100 from receiving the collision, the phenomenon of mounting hole 101 fracture produces, mounting hole 101 endotheca is equipped with lantern ring 120, the connection cavity has been seted up between the inner wall of lantern ring 120 and the outer wall, it has gas to connect the cavity intussuseption, the external screw thread has been seted up to the inner wall of lantern ring 120, after fixed, when the machine case receives the collision, the machine case can produce slight deformation, the machine case can drive the screw during the deformation and remove, it begins the compression to connect the cavity during the screw removes, the direct contact of screw and mounting hole 101 has been prevented.

Specifically, in order to prevent dust from entering the mounting case 211, a blocking disc 217 is arranged at the air inlet hole 216, a filtering hole is formed in the side wall of the blocking disc 217, the blocking disc 217 is sleeved on the inner wall of the air inlet hole 216, and the dust in the air is blocked by the arranged blocking disc 217, so that the dust is prevented from entering the mounting case 211.

In addition, in order to facilitate the rapid cleaning of the baffle disc 217, a slot 230 is formed in one end, located at the air inlet hole 216, of the side wall of the mounting shell 211, an inserting plate 231 is inserted in the slot 230, a fixing hole 232 matched with the air inlet hole 216 is formed in the side wall of the inserting plate 231, the fixing hole 232 is in clamping fit with the baffle disc 217, the baffle disc 217 is mounted on the inserting plate 231, the baffle disc 217 can be rapidly pushed out from two sides of the inserting plate 231 during cleaning, the rapid cleaning effect is achieved, meanwhile, the inserting plate 231 is rapidly pulled out from the slot 230, a pulling block is fixedly connected to one end of the inserting plate 231, the stress point of the inserting plate 231 is improved through the pulling block, and the pulling efficiency of the inserting plate 231 is improved.

Further, discharge the cold air that will refrigerate piece 212 and produce for installation shell 211, the packing cavity has been seted up between the inner wall of installation shell 211 and the outer wall, it has thermal-insulated material 240 to fill the cavity intussuseption, thermal-insulated material 240 is used for the heat preservation to installation shell 211, thermal-insulated material 240 prefers to adopt the aerogel, the aerogel has good thermal-insulated effect, small in size simultaneously, be convenient for fill, glass fiber has, keep warm to installation shell 211 through thermal-insulated material 240 that sets up, make the cold air in installation shell 211 can not be discharged by installation shell 211, and then the temperature of the air in exhaust pipe 221 has been reduced.

Example 2

In order to further improve the uniformity of heat dissipation to the circuit board body 100, the following improvements are made on the basis of embodiment 1:

referring to fig. 10, a snap ring 250 is fixedly connected to a portion of the air outlet hole 222, an air guiding ball 251 is fixedly connected to the top of the snap ring 250, a channel with a certain height is reserved between the air guiding ball 251 and the snap ring 250, the air blown out from the air outlet hole 222 is blocked by the air guiding ball 251, and the air is diffused to the periphery of the air guiding ball 251 through the arc shape of the air guiding ball 251, so that the uniform heat dissipation of the circuit board body 100 is achieved.

Example 3

In order to realize the adjustment of the distance between the temperature reducing device 200 and the circuit board body 100, the following improvements are made on the basis of embodiment 1:

referring to fig. 11, a plurality of through holes 103 are formed in the surface of the circuit board body 100, the fixing rod 223 penetrates through the through holes 103, the inner thread 260 is formed in the outer wall of the fixing rod 223, the nut is connected to the outer wall of the fixing rod 223 through a thread, and the distance between the cooling device 200 and the circuit board body 100 is adjusted by rotating the nut, so that the circuit board body 100 can be installed in chassis under different environments, and the use scene of the circuit board body 100 is improved.

In addition, in order to realize dispelling the heat to the top outer wall of circuit board body 100, worn groove 261 has been seted up to the one end of dead lever 223, exhaust pipe 221 is linked together with worn groove 261, the top fixedly connected with bracing piece of worn groove 261, the top fixedly connected with deep bead 262 of bracing piece, the cold air in the exhaust pipe 221 passes through worn groove 261 conveying to deep bead 262 department, blocking to the cold air through deep bead 262 for the contact of cold air and the top outer wall of circuit board body 100.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A high frequency circuit board for 5G communication, its characterized in that: including circuit board body (100) and install heat sink (200) in circuit board body (100) below, mounting hole (101) have been seted up in the four corners on circuit board body (100) surface, and mounting hole (101) are used for the fixed to circuit board body (100), heat sink (200) include at least:

the refrigeration mechanism (210) comprises an installation shell (211) arranged below the circuit board body (100), a refrigeration sheet (212) is installed inside the installation shell (211), a through hole (213) is formed in one side of the installation shell (211), fan blades (214) are installed in the through hole (213), the fan blades (214) are driven by a driving device, an air guide pipe (215) is communicated in the through hole (213), and an air inlet hole (216) is formed in the side wall of one end, corresponding to the through hole (213), of the through hole (213);

the air exhaust mechanism (220) comprises an air exhaust pipe (221) arranged below the circuit board body (100), the air exhaust pipe (221) is of an S-shaped structure, a plurality of air exhaust holes (222) are formed in the surface of the air exhaust pipe (221), and the air exhaust holes (222) are used for blowing air to the circuit board body (100);

and the fixing rod (223), the fixing rod (223) is fixed on the outer walls of the top parts of the exhaust pipe (221) and the mounting shell (211), and the other end of the fixing rod (223) is fixedly connected with the outer wall of the circuit board body (100).

2. The high-frequency wiring board for 5G communication according to claim 1, wherein: the circuit board is characterized in that protection blocks (110) are arranged on the periphery of the circuit board body (100), the protection blocks (110) are of a U-shaped structure, inner walls of two sides of each protection block (110) are attached to two sides of the circuit board body (100), a buffer cavity is formed between the inner wall and the outer wall of each protection block (110), and gas is filled in the buffer cavity.

3. The high-frequency wiring board for 5G communication according to claim 2, wherein: the protection piece (110) is characterized in that the inner walls of the two sides of the protection piece are fixedly connected with clamping strips (111), the outer walls of the two sides of the circuit board body (100) are provided with a plurality of clamping grooves (102), and the clamping grooves (102) are matched with the through holes (103) in a clamping mode.

4. The high-frequency wiring board for 5G communication according to claim 1, wherein: the mounting hole (101) is internally sleeved with a lantern ring (120), a connecting cavity is formed between the inner wall and the outer wall of the lantern ring (120), gas is filled in the connecting cavity, and external threads are formed in the inner wall of the lantern ring (120).

5. The high-frequency circuit board for 5G communication according to claim 1, wherein: the department of air inlet hole (216) is provided with fender dish (217), the filter opening has been seted up to the lateral wall that keeps off dish (217), keep off dish (217) cover and establish the inner wall in air inlet hole (216).

6. The high-frequency wiring board for 5G communication according to claim 5, wherein: the lateral wall of installation shell (211) is located the one end of fresh air inlet (216) and has seted up slot (230), it has picture peg (231) to peg graft in slot (230), the lateral wall of picture peg (231) is seted up with fresh air inlet (216) assorted fixed orifices (232), fixed orifices (232) and fender dish (217) joint cooperation.

7. The high-frequency wiring board for 5G communication according to claim 1, wherein: a filling cavity is formed between the inner wall and the outer wall of the mounting shell (211), a heat insulation material (240) is filled in the filling cavity, and the heat insulation material (240) is used for heat insulation of the mounting shell (211).

8. The high-frequency wiring board for 5G communication according to claim 1, wherein: a clamping ring (250) is fixedly connected in one part of the air exhaust hole (222), an air guide ball (251) is fixedly connected to the top of the clamping ring (250), and a channel with a certain height is reserved between the air guide ball (251) and the clamping ring (250).

9. The high-frequency wiring board for 5G communication according to claim 1, wherein: the surface of the circuit board body (100) is provided with a plurality of through holes (103), the fixing rod (223) penetrates through the through holes (103), the outer wall of the fixing rod (223) is provided with an internal thread (260), and the outer wall of the fixing rod (223) is in threaded connection with a nut.

10. The high-frequency wiring board for 5G communication according to claim 9, wherein: wear groove (261) have been seted up to the one end of dead lever (223), exhaust pipe (221) are linked together with wearing groove (261), the top fixedly connected with bracing piece of wearing groove (261), the top fixedly connected with deep bead (262) of bracing piece.