CN113495812A - Method for maintaining and checking internal memory after packaging - Google Patents
Method for maintaining and checking internal memory after packaging Download PDFInfo
- Publication number
- CN113495812A CN113495812A CN202010248373.6A CN202010248373A CN113495812A CN 113495812 A CN113495812 A CN 113495812A CN 202010248373 A CN202010248373 A CN 202010248373A CN 113495812 A CN113495812 A CN 113495812A
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- memory module
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 title claims description 11
- 238000012360 testing method Methods 0.000 claims abstract description 53
- 230000006870 function Effects 0.000 claims abstract description 29
- 238000012423 maintenance Methods 0.000 claims abstract description 14
- 238000011990 functional testing Methods 0.000 claims description 10
- 238000004458 analytical method Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 238000007726 management method Methods 0.000 abstract description 22
- 238000013500 data storage Methods 0.000 abstract description 4
- 238000007689 inspection Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
- G06F11/2205—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
- G06F11/2294—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing by remote test
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
- G06F11/26—Functional testing
- G06F11/263—Generation of test inputs, e.g. test vectors, patterns or sequences ; with adaptation of the tested hardware for testability with external testers
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
Abstract
A maintenance and inspection method after memory package is to provide a test integrated circuit, connect the test integrated circuit with each memory module to be tested, and connect with a data center management unit through an online unit, when a function test is executed to inspect the function state of each memory module to be tested, the test integrated circuit is used to detect and analyze each memory module to be tested, so as to obtain the function test result of each memory module to be tested, and the online unit is used to store the function test result into the data center management unit. Therefore, the data center management unit provides a large amount of data storage space for storing and recording the function test results, and a large amount of batch maintenance can be provided at one time through the display information of the function state of the mass memory module, so that the larger maintenance and repair range is effectively expanded, and the cost is reduced.
Description
Technical Field
The invention relates to a method for maintaining and checking a memory after packaging, in particular to a method for maintaining and checking a memory after packaging, which can connect a function test result of each memory module to be tested obtained by testing to an external data center (data center) management unit through an online unit, can provide a large amount of maintenance in batches at one time, effectively expand a larger maintenance and repair range and reduce the cost.
Background
A Post Package Repair (PPR) refers to a circuit method that can repair a Dynamic Random Access Memory (DRAM) after being packaged. The most basic method is that a Field Programmable Gate Array (FPGA) on an Automatic Test Equipment (ATE) can be directly used to directly test and directly repair a DRAM of a Device Under Test (DUT), which is basically the original factory for producing IC particles.
However, at the application end, the IC particles are sold and then assembled on a module board, and no matter the main board is mounted with a DRAM through a slot or directly soldered with the DRAM, the current practice is to store the address of a fail bit cell (bit cell) into a Serial Presence Detect (SPD), and use the SPD method to detect the DRAMs of a plurality of DUTs and automatically access the status information thereof. However, the storage capacity of the SPD is small, so the number of bit cells that it can repair is quite limited.
In view of the limited storage capacity of the SPD in the prior art, if there are many damaged parts, it is impossible to store many pieces of information, resulting in a limited range of repairable amount. Therefore, it is generally not suitable for the actual use of the user.
Disclosure of Invention
The main objective of the present invention is to overcome the above problems encountered in the prior art, and to provide a method for maintaining and checking a memory after packaging, which does not require a sequence to have a detection amplification capacity, and can use the original SPD by connecting the function test results of each memory module to be tested by a test Integrated Circuit (IC) to an external data center management unit through an online unit, where the data center management unit can manage and provide a large amount of data storage space for storing and recording the function test results by an online central control computer or a cloud server, and can provide a large amount of maintenance in batches at one time through the display information of the function states of a mass memory module in the data center management unit, thereby effectively extending a larger maintenance and repair range and reducing the cost.
In order to achieve the above purposes, the technical scheme adopted by the invention is as follows: a method for maintaining and checking a memory after packaging comprises the following steps:
the method comprises the following steps: providing a test integrated circuit, and connecting the test integrated circuit with a plurality of memory modules to be tested;
step two: starting an on-line unit and connecting the test integrated circuit with the data center management unit through the on-line unit;
step three: the testing integrated circuit is used for carrying out function detection analysis on each memory module to be tested so as to obtain a function testing result of each memory module to be tested, and the function testing result is stored to the data center management unit through the online unit;
step four: through the recording of each function test result in the data center management unit, the position of the known damaged memory module in each memory module to be tested can be obtained, and the subsequent maintenance of the memory unit on the memory module is provided.
In the method for maintaining and checking the memory after packaging, the test integrated circuit is a main Board installed on an additional circuit Board (Load Board), each function test result in the function test results of each memory module to be tested corresponds to a serial number, and the position of a known damaged memory module in each memory module to be tested is known through the record of the serial number corresponding to each function test result.
In the method for maintaining and checking the encapsulated memory, the data center management unit is a cloud server or an online storage space managed by a central control computer.
In the method for maintaining and checking the memory after being packaged, the online unit is online in a wired or wireless mode, and the wireless mode can be a built-in or external device with a WiFi module or a Bluetooth module.
Drawings
FIG. 1 is a schematic flow diagram of the present invention.
FIG. 2 is a block diagram of the present invention.
Reference numbers refer to:
Data center management unit 2
Testing of integrated circuits 3
An online unit 31.
Detailed Description
Please refer to fig. 1 and fig. 2, which are a schematic flow chart and a block diagram of the present invention, respectively. As shown in the figure: the invention relates to a method for maintaining and checking a memory after being packaged, which is implemented by a device for maintaining and checking the memory after being packaged, and comprises the following steps:
step one s 1: a test Integrated Circuit (IC) 3 is provided, and the test integrated circuit 3 is connected to a plurality of memory modules (DUTs) 1 to be tested.
Step two s 2: the testing integrated circuit 3 is connected with an online unit 31, the online unit 31 can be a built-in or external device with a WiFi module or a bluetooth module, the testing integrated circuit 3 is connected with a data center management unit 2 by turning on the online unit 31, and the data center management unit 2 can be a cloud server or an online storage space managed by a central control computer.
Step three s 3: when a functional test is performed to check the functional status of each memory module 1 to be tested, the testing integrated circuit 3 is used to perform a testing analysis on each memory module 1 to be tested to obtain a functional test result of each memory module 1 to be tested, and the functional test result is stored in the data center management unit 2 through the connection unit 31.
Step four s 4: through the recording of each function test result in the data center management unit 2, the position of the known damaged memory module in each memory module 1 to be tested can be known, and the subsequent maintenance of the memory unit on the memory module is provided. Therefore, the method for maintaining and checking the memory after packaging is completely new by the process disclosed above.
In an embodiment, the testing ic 3 may be a Motherboard (MB) mounted on an add-on Board (Load Board), and the Motherboard includes a Serial Presence Detect (SPD) chip (not shown), and each of the functional test results of the memory modules 1 to be tested corresponds to a serial number through the SPD chip.
In an embodiment, after the functional test result of each memory module 1 to be tested is obtained through the test comparison, the test ic 3 may directly perform the repair operation on line according to the functional test result, and each functional test result in the functional test result of each memory module to be tested may not need to store a serial number (serial number) of the corresponding memory module 1 to be tested.
When the memory module testing device is used, the capacity of the SPD does not need to be amplified, the original SPD can be used, the function testing result of each memory module 1 to be tested, which is tested by the testing integrated circuit 3, is only connected to the external data center management unit 2 through the online unit 31, and the position of the known damaged memory module in each memory module 1 to be tested can be obtained through the record of the serial number corresponding to each function testing result, so that the memory unit on the memory module can be maintained subsequently. Therefore, the data center management unit 2 can manage and provide a large amount of data storage space for storing and recording function test results through an online central control computer or a cloud server, and can provide a large amount of batch maintenance at one time through display information of the function state of the mass memory module in the data center management unit 2, thereby effectively expanding a larger maintenance and repair range and reducing the cost.
In summary, the method for maintaining and checking the memory after packaging can effectively improve various defects in the prior art, the function test results of each memory module to be tested obtained by testing are connected to an external data center management unit through an online unit, a large amount of data storage space is provided for storing and recording the function test results through the management of an online central control computer or a cloud server, a large amount of batch maintenance can be provided at one time through the display information of the function state of a mass memory module in the data center management unit, a larger maintenance and repair range is effectively expanded, the cost is reduced, the method can further progress, is more practical, and better meets the requirements of users, the requirements of the invention patent application are ensured, and the patent application is legally proposed.
However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereby; therefore, all the equivalent changes and modifications made according to the claims and the content of the specification of the present invention should be covered by the scope of the present invention.
Claims (4)
1. A method for maintaining and checking a memory after packaging is implemented by a device for maintaining and checking the memory after packaging, and is characterized by comprising the following steps:
the method comprises the following steps: providing a test integrated circuit, and connecting the test integrated circuit with a plurality of memory modules to be tested;
step two: starting an on-line unit and connecting the test integrated circuit with the data center management unit through the on-line unit;
step three: the testing integrated circuit is used for carrying out function detection analysis on each memory module to be tested so as to obtain a function testing result of each memory module to be tested, and the function testing result is stored to the data center management unit through the online unit;
step four: through the recording of each function test result in the data center management unit, the position of the known damaged memory module in each memory module to be tested can be obtained, and the subsequent maintenance of the memory unit on the memory module is provided.
2. The method as claimed in claim 1, wherein the testing ic is mounted on a motherboard of an additional circuit board, each of the functional test results of the memory modules to be tested corresponds to a serial number, and the location of the known damaged memory module in each memory module to be tested is known through the record of the serial number corresponding to each functional test result.
3. The method of claim 1, wherein the data center management unit is a cloud server or an online storage space managed by a central control computer.
4. The method as claimed in claim 1, wherein the connection unit is a built-in or external device having a WiFi module or a bluetooth module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010248373.6A CN113495812B (en) | 2020-04-01 | 2020-04-01 | Maintenance and inspection method after memory packaging |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010248373.6A CN113495812B (en) | 2020-04-01 | 2020-04-01 | Maintenance and inspection method after memory packaging |
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| Publication Number | Publication Date |
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| CN113495812A true CN113495812A (en) | 2021-10-12 |
| CN113495812B CN113495812B (en) | 2024-02-06 |
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| CN202010248373.6A Active CN113495812B (en) | 2020-04-01 | 2020-04-01 | Maintenance and inspection method after memory packaging |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1991782A (en) * | 2005-12-30 | 2007-07-04 | 英业达股份有限公司 | RAM module mounting condition detecting method and system |
| CN102402473A (en) * | 2011-10-28 | 2012-04-04 | 武汉供电公司变电检修中心 | Computer hardware and software fault diagnosis and repair system |
| CN105955874A (en) * | 2016-05-03 | 2016-09-21 | 浪潮电子信息产业股份有限公司 | Method for testing performance of server memory based on cloud platform |
| US20190115053A1 (en) * | 2017-10-13 | 2019-04-18 | Samsung Electronics Co., Ltd. | Memory modules, methods of operating the memory modules, and test systems of the memory modules |
| CN110297726A (en) * | 2019-07-03 | 2019-10-01 | 上海兆芯集成电路有限公司 | With the computer system and memory modules control method that serially there is detection data |
| CN110491440A (en) * | 2019-07-02 | 2019-11-22 | 深圳市金泰克半导体有限公司 | A kind of internal storage testing method and system |
| CN110825321A (en) * | 2018-08-14 | 2020-02-21 | 三星电子株式会社 | Storage device and operation method thereof |
-
2020
- 2020-04-01 CN CN202010248373.6A patent/CN113495812B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1991782A (en) * | 2005-12-30 | 2007-07-04 | 英业达股份有限公司 | RAM module mounting condition detecting method and system |
| CN102402473A (en) * | 2011-10-28 | 2012-04-04 | 武汉供电公司变电检修中心 | Computer hardware and software fault diagnosis and repair system |
| CN105955874A (en) * | 2016-05-03 | 2016-09-21 | 浪潮电子信息产业股份有限公司 | Method for testing performance of server memory based on cloud platform |
| US20190115053A1 (en) * | 2017-10-13 | 2019-04-18 | Samsung Electronics Co., Ltd. | Memory modules, methods of operating the memory modules, and test systems of the memory modules |
| CN110825321A (en) * | 2018-08-14 | 2020-02-21 | 三星电子株式会社 | Storage device and operation method thereof |
| CN110491440A (en) * | 2019-07-02 | 2019-11-22 | 深圳市金泰克半导体有限公司 | A kind of internal storage testing method and system |
| CN110297726A (en) * | 2019-07-03 | 2019-10-01 | 上海兆芯集成电路有限公司 | With the computer system and memory modules control method that serially there is detection data |
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| CN113495812B (en) | 2024-02-06 |
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