CN113490761A

CN113490761A - Vapor deposition mask

Info

Publication number: CN113490761A
Application number: CN202080014896.2A
Authority: CN
Inventors: 岩井洋平; 高城淳
Original assignee: Japan Display Inc
Current assignee: Japan Display Inc
Priority date: 2019-02-19
Filing date: 2020-01-31
Publication date: 2021-10-08
Also published as: WO2020170762A1; KR102641271B1; KR20210114040A; JP7233954B2; JP2020132939A

Abstract

The invention provides a vapor deposition mask capable of depositing a light emitting body to a pixel with good accuracy in manufacturing a display device. Therefore, the present invention has the following structure. The vapor deposition mask used in the manufacture of a display device is characterized in that the vapor deposition mask is composed of a mask (50) for forming a vapor deposition material on a pixel and a support frame (60) for supporting the mask (50), the support frame (60) is composed of an upper plate (61), a lower plate (62) and an adhesive member (63) for adhering the upper plate (61) and the lower plate (62), and the vapor deposition mask is provided with a stopper (100) for preventing the upper plate (61) and the lower plate (62) from shifting from each other in the main surface direction of the support frame (60) when a shearing force is applied between the upper plate (61) and the lower plate (62).

Description

Vapor deposition mask

Technical Field

The present invention relates to a vapor deposition mask used for forming pixels of an organic EL display device or the like by vapor deposition.

Background

The organic EL display device forms an organic layer as a light-emitting material for each pixel by vapor deposition. Since the pixel pitch is small, the size of the light emitter including the organic EL layer in each pixel formed by vapor deposition is also small. Along with this, the pitch of the holes and the size of the holes in the vapor deposition mask are also very small. Therefore, the accuracy of the vapor deposition mask is important.

The vapor deposition mask is composed of a portion of a mask foil in which a large number of holes for vapor deposition of pixels are formed, and a support frame that supports the mask foil. Patent document 1 describes a structure in which the support frame is configured as 2 upper and lower frames, and the upper and lower frames are bonded together with an adhesive in order to reduce the deformation of the support frame and improve the dimensional accuracy.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2017-210633.

Disclosure of Invention

Problems to be solved by the invention

The vapor deposition mask of the present invention is composed of a foil mask having a plurality of holes formed corresponding to pixels in a display region of an organic EL display device, and a support frame for supporting the foil mask. In the present specification, a foil mask having a plurality of holes formed therein is simply referred to as a mask, and an assembly of the mask and a support frame is referred to as a vapor deposition mask.

The pixel pitch of the organic EL display device is very small, and the diameter of the mask hole corresponding to each pixel is very small. Therefore, the thickness of the mask required to form the holes is also very small. In addition, the mask needs to be planarized in advance along the substrate to be vapor-deposited. In order to maintain the flatness of the mask, it is necessary to apply a tensile force to the mask outward by the support frame. In this case, an inward tensile force is applied to the support frame as a reaction.

The support frame has a double frame structure of an upper frame and a lower frame, and the upper frame and the lower frame are bonded together by an adhesive material for the purpose of improving the dimensional accuracy and preventing the deformation of the frame itself. At this time, a tensile force acting on the support frame as a reaction from the mask is mainly applied to the upper frame.

In this way, a shearing force is applied to the adhesive layer adhering the upper frame and the lower frame, and the upper frame and the lower frame are displaced in the plane direction. The displacement of the upper frame and the lower frame due to such a shearing force has an important influence on the accuracy of vapor deposition by the vapor deposition mask.

The present invention prevents the upper frame and the lower frame from shifting due to a shearing force, and maintains the dimensional accuracy of the vapor deposition mask, thereby realizing the manufacture of an organic EL display device with excellent quality.

Means for solving the problems

The present invention is an invention for overcoming the above problems, and the main specific technical means are as follows.

(1) A vapor deposition mask used for manufacturing a display device, characterized in that: the vapor deposition mask is composed of a mask for forming a vapor deposition material on a pixel and a support frame for supporting the mask, the support frame is composed of an upper plate, a lower plate and an adhesive member for adhering the upper plate and the lower plate, and the vapor deposition mask is provided with a stopper for preventing the upper plate and the lower plate from shifting from each other in a main surface direction of the support frame when a shearing force is applied between the upper plate and the lower plate.

(2) A vapor deposition mask used for manufacturing a display device, characterized in that: the vapor deposition mask is composed of a mask for forming a vapor deposition material on a pixel and a support frame for supporting the mask, the support frame is composed of an upper plate, a lower plate and an adhesive member for adhering the upper plate and the lower plate, convex portions are formed on one surface of the upper plate at a predetermined pitch, concave portions are formed on one surface of the lower plate at the predetermined pitch, and the convex portions are fitted with the concave portions.

Drawings

Fig. 1 is a plan view of an organic EL display device.

Fig. 2 is a plan view showing a pixel structure of the organic EL display device.

Fig. 3 is a sectional view showing a relationship between a substrate and a vapor deposition mask in a display region.

Fig. 4 is a schematic cross-sectional view of a vapor deposition device.

Fig. 5 is a detailed view of the vapor deposition mask.

Fig. 6A is a sectional view showing a state where a vapor deposition mask is formed.

Fig. 6B is a sectional view of the support frame.

Fig. 6C is a sectional view showing a state where the support frame and the mask are temporarily attached.

Fig. 6D is a sectional view showing a state where the mask and the support frame are joined together by a joining member formed by electroplating.

Fig. 6E is a sectional view showing a state where the base material is peeled off from the mask.

Fig. 7 is a sectional view showing a manufacturing process of the support frame.

Fig. 8 is a plan view of the vapor deposition mask.

Fig. 9 is a sectional view a-a of fig. 8.

Fig. 10 is a sectional view of the support frame in a state where a tensile force is applied to the upper plate of the support frame.

Fig. 11 is a schematic cross-sectional view showing the present invention.

Fig. 12 is a schematic plan view showing the present invention.

Fig. 13A is a sectional view showing the production process of embodiment 1 of example 1.

Fig. 13B is a sectional view showing a step following fig. 13A.

Fig. 13C is a sectional view showing embodiment 1 of example 1.

Fig. 14A is a sectional view showing the production process of embodiment 2 of example 1.

Fig. 14B is a sectional view showing a step following fig. 14A.

Fig. 14C is a sectional view showing a step following fig. 14B.

Fig. 14D is a sectional view showing the structure of embodiment 1 of example 2.

Fig. 15A is a sectional view showing the production process of embodiment 1 of example 2.

Fig. 15B is a sectional view showing the step following fig. 15A.

Fig. 15C is a sectional view showing the step following fig. 15B.

Fig. 15D is a sectional view showing a step following fig. 15C.

Fig. 15E is a sectional view showing the structure of embodiment 1 of example 2.

Fig. 16A is a sectional view showing the production process of embodiment 2 of example 2.

Fig. 16B is a sectional view showing the step following fig. 16A.

Fig. 16C is a sectional view showing the step following fig. 16B.

Fig. 16D is a sectional view showing the structure of embodiment 2 of example 2.

Fig. 17A is a sectional view showing the production process of embodiment 3 of example 2.

Fig. 17B is a sectional view showing the step following fig. 17A.

Fig. 17C is a sectional view showing the step following fig. 17B.

Fig. 17D is a sectional view showing a step following fig. 17C.

Fig. 17E is a sectional view showing a step following fig. 17D.

Fig. 17F is a sectional view showing the structure of embodiment 3 of example 2.

Fig. 18A is a sectional view showing the production process of embodiment 1 of example 3.

Fig. 18B is a sectional view showing a step following fig. 18A.

Fig. 18C is a sectional view showing the step following fig. 18B.

Fig. 18D is a sectional view showing a step following fig. 18C.

Fig. 18E is a sectional view showing the structure of embodiment 1 of example 3.

Fig. 18F is a plan view showing the decoupling strand of embodiment 1 of example 3.

Fig. 18G is a plan view showing another example of the structure of embodiment 1 of example 3.

Fig. 19A is a sectional view showing the production process of embodiment 2 of example 3.

Fig. 19B is a sectional view showing the step following fig. 19A.

Fig. 19C is a sectional view showing the step following fig. 19B.

Fig. 19D is a sectional view showing a step following fig. 19C.

Fig. 19E is a sectional view showing a step following fig. 19D.

Fig. 19F is a sectional view showing the structure of embodiment 2 of example 3.

Fig. 19G is a plan view showing the structure of embodiment 2 of example 3.

Fig. 19H is a plan view showing another example of the structure of embodiment 2 of example 3.

Fig. 20A is a sectional view showing the production process of embodiment 1 of example 4.

Fig. 20B is a sectional view showing the step following fig. 20A.

Fig. 20C is a sectional view showing the step following fig. 20B.

Fig. 20D is a sectional view showing the step following fig. 20C.

Fig. 20E is a sectional view showing a step following fig. 20D.

Fig. 20F is a sectional view showing the final step of embodiment 1 of example 4.

Fig. 20G is a plan view showing the structure of embodiment 1 of example 4.

Fig. 21A is a sectional view showing the production process of embodiment 2 of example 4.

Fig. 21B is a sectional view showing a step following fig. 21A.

Fig. 21C is a sectional view showing a step following fig. 21B.

Fig. 21D is a sectional view showing a step following fig. 21C.

Fig. 21E is a sectional view showing a step following fig. 21D.

Fig. 21F is a sectional view showing the structure of embodiment 2 of example 4.

Fig. 22 is a sectional view showing the production process of embodiment 1 of example 5.

Fig. 23 is a sectional view showing the structure of embodiment 1 of example 5.

Fig. 24 is a diagram showing an example of the convex portion and the concave portion in example 5.

Fig. 25 is a view showing another example of the convex portion and the concave portion in example 5.

FIG. 26 is a plan view showing another example of the convex and concave portions in example 5.

FIG. 27 is a plan view showing another example of the convex portion and the concave portion in example 5.

FIG. 28 is a plan view showing another example of the convex portion and the concave portion in example 5.

Fig. 29 is a sectional view showing the production process of embodiment 2 of example 5.

Fig. 30 is a sectional view showing the structure of embodiment 2 of example 5.

Fig. 31 is a sectional view showing the production process of embodiment 3 of example 5.

Fig. 32 is a sectional view showing the structure of embodiment 3 of example 5.

Detailed Description

Fig. 1 is a plan view of an organic EL display device. In fig. 1, a display region 10 for displaying an image is formed on a TFT substrate 40 formed of glass or polyimide resin. A frame region 21 is arranged around the display region 10. In the frame region 21, a current supply line for supplying a current to the pixel 14, a scan line driver circuit 20, and the like are arranged. In the display region 10, the scanning lines 11 extend in the lateral direction (x direction) and are arranged in the longitudinal direction (y direction). The video signal lines 12 and the power lines 13 extend in the vertical direction and are arranged in the horizontal direction. A region surrounded by the scanning line 11, the video signal line 12, and the power supply line 13 is a pixel 14, and an organic EL layer for emitting light, a driving transistor formed of a TFT, a switching transistor, and the like are formed in the pixel 14.

A terminal region 30 is formed on side 1 of the substrate 40. A driver IC31 is mounted in the terminal area 30 to drive the video signal lines 12, and a flexible wiring board 32 is connected to the terminal area to supply power and signals to the organic EL display device.

Fig. 2 is a plan view of a display region of the organic EL display device. In fig. 2, a red pixel having a red light emitter R, a green pixel having a green light emitter G, or a blue pixel having a blue light emitter B is formed in a portion corresponding to the pixel 14 in fig. 1, and each pixel or each light emitter is arranged in a triangular shape. The red light-emitting body R, the green light-emitting body G, and the blue light-emitting body B are formed of different organic EL materials, and are deposited by vapor deposition. Therefore, 3 vapor deposition masks are required to form the pixel structure shown in fig. 2.

In fig. 2, the planar shape of each light-emitting body is circular, and each light-emitting body is arranged in a triangular manner, but this is an example, and the planar shape of the light-emitting body may be square, rectangular, stripe, or the like. The arrangement of the light emitters is not limited to a triangle, and may be a diamond shape, a parallelogram, a stripe arrangement, or the like. In fig. 2, the diameter d1 of the luminous body is, for example, 15 μm to 20 μm. The pixel pitch pp is, for example, 30 μm to 40 μm. In this case, the diameter of the mask is the same as the diameter of the emitter. On the other hand, the apertures of the mask are formed individually for each emitter, so that the pitch pm of the apertures of the mask is 50 μm to 67 μm. The interval between different colors arranged adjacently, that is, the alignment margin of the vapor deposition mask, needs to be about 10 μm to 30 μm, and it is preferable that the distance be small in view of the enlargement of the light emitting region of each pixel and the high definition of the display region.

Fig. 3 is a sectional view showing a state of a mask 50 and a substrate 40 for vapor-depositing an organic EL material which is one of light emitters of 3 colors. In fig. 3, the thickness ts of the TFT substrate 40 as the deposition substrate 40 is, for example, 0.5 mm. On the other hand, in order to form the diameter d1 of the light emitter to be 15 μm to 20 μm, the mask 50 is similarly formed with holes having a hole diameter d 1. The organic EL material is evaporated on the surface of the substrate 40 exposed through the hole provided in the mask 50. In order to properly deposit the organic EL material in the region of the aperture d1, the plate thickness tm of the mask 50 needs to be formed thin to be about 5 μm to 10 μm. If the mask 50 is thick, a so-called "dark angle" is generated as a shield against the organic EL material to be deposited from an oblique direction, and a vapor deposition failure is caused.

In order to form a high-definition pixel structure as shown in fig. 2, it is necessary to form the mask 50 and the vapor deposition substrate 40 in a nearly close contact state as shown in fig. 3. For this reason, a tensile force needs to be applied to the mask 50 to keep the mask 50 flat. Further, an arrow 80 in fig. 3 is an evaporant of the organic EL material. Although not shown, a magnet may be disposed to face the mask 50 on the opposite side of the substrate 40, and the mask 50 may be brought into close contact with the substrate 40 by magnetic force.

Fig. 4 is a schematic sectional view showing a state of vacuum deposition. In the vacuum chamber 1000 of fig. 4, the vapor deposition material 80 is evaporated from the vapor deposition source 900 toward the substrate 40. The light-emitting material can be vapor-deposited on the substrate 40 through the mask 50 of the vapor deposition mask. In fig. 4, 2 vapor deposition sources 90 are used to make the vapor deposition film thickness uniform. The number of the vapor deposition sources 90 can be increased or decreased as necessary to make the vapor deposition film uniform.

The vapor deposition mask is formed by bonding a foil-shaped mask 50 to a support frame 60 by a bonding member 70. The support frame 60 is formed by bonding an upper plate 61 and a lower plate 62 with a bonding material 63. The support frame 60 and the mask 50 are joined by a joining member 70 formed based on electroplating. In order to prevent the thin mask 50 from being bent, a tensile force is applied to the mask 50 by the support frame 60. As a reaction to this, an inward tensile force is generated in the support frame 60, and a shear stress is generated in the adhesive 63 that adheres the upper plate 61 and the lower plate 62.

Fig. 5 is a detailed view of the vapor deposition mask 5. In fig. 5, the upper side is a plan view and the lower side is a sectional view. Since the organic EL display device is manufactured separately with low efficiency, a plurality of organic EL display panels are formed on a large substrate. Therefore, the vapor deposition mask 5 also has a structure corresponding to the large substrate.

In fig. 5, the vapor deposition mask 5 is divided into 4 by the support frame 60, and the mask 50 is present in each region. Each mask 50 corresponds to 16 organic EL display devices. Accordingly, 64 organic EL display devices were formed using the vapor deposition mask 50 of fig. 5. In fig. 5, the vapor deposition mask 5 is divided into 4, but this is an example and the number of divisions is not limited to 4.

Each mask 50 is configured by an opening region 51 in which a plurality of holes are formed corresponding to each pixel in the display region of the organic EL display device, and a peripheral region 52 in which no hole is present. The mask 50 is, for example, Ni or a Ni alloy having a thickness of several μm to ten μm, and is formed by electroplating.

The support frame 60 is formed by bonding an upper plate 61 and a lower plate 62 with a bonding material 63. One of the reasons for forming the support frame 60 into a 2-layer structure is that when a plate material is formed by a roll, the number of rolls is increased to form a thin plate, and thus, the size can be more easily and accurately formed. Another reason is that the deformation inherent to the plate materials can be canceled by each other by 2 plate materials, and the deformation of the stacked support frames can be prevented.

The upper plate 61 and the lower plate 62 are formed of an invar alloy material having a thickness of about 0.5mm, for example. Invar materials are alloys of iron and nickel with very low coefficients of thermal expansion. The support frame 60 formed of the upper plate 61, the lower plate 62, and the adhesive 63 and the mask 50 are joined by a joining member 70 formed by plating. The completed mask 50 is subjected to a tensile force by the support frame 60, thereby preventing the mask 50 from being bent.

Fig. 6A to 6E are sectional views showing a process for forming the vapor deposition mask shown in fig. 5. Fig. 6A is a sectional view showing a state where the mask 50 is formed by electroplating. A flat and smooth metal plate is prepared and used as a base material 90, and a mask 50 is formed on the base material 90. That is, a photoresist 91 for patterning is formed on the base material 90, and a plating layer is grown on a predetermined portion to form a foil. In fig. 6A, the photoresist 91 is formed only in the outline portion of the mask 50, but the photoresist is formed to form holes in the opening region, and holes for vapor deposition in the pixel portion can be formed simultaneously in the opening portion of the mask 50.

Fig. 6B is a sectional view of the support frame 60 formed separately from the mask 50. The support frame 60 is configured by bonding an upper plate 61 and a lower plate 62 made of invar alloy material having a thickness of 0.5mm by an adhesive 63, for example. The adhesive 63 has a thickness of, for example, 15 μm. Since the plate material is provided in a roll form as an elongated material, the plate material may be left warped in a circular arc direction. In this case, 2 plates were bonded with their front and back surfaces reversed, and the warpage was cancelled to ensure flatness. The support frame 50 may be machined by cutting or etching.

Fig. 6C is a cross-sectional view showing a state in which the support frame 60 is temporarily bonded to the base material 90 on which the mask 50 is formed. The temporary bonding material 92 used for temporary bonding is preferably a material that facilitates peeling of the base material 90 in a subsequent step.

Fig. 6D is a cross-sectional view showing a state in which a photoresist 91 is formed on the structure of fig. 6C in order to bond the mask 50 and the support frame 60, and then a plating layer is grown to form the connecting member 70 between the mask 50 and the support frame 60. In fig. 6D, the bonding member 70 is formed by plating by covering the portion other than the portion where the plating layer is formed as the bonding member 70 with a photoresist 91.

In fig. 6D, in the support frame 60, a resist 91 is formed except for a portion where the joining member 70 is formed by plating. However, the present invention is not limited to this, and the entire surface of the support frame 60 may be plated. However, in this case, the support frame 60 may be deformed by stress of the plating film by plating the entire surface of the support frame 60, and thus attention is required.

Fig. 6E is a sectional view showing a state where the base material 90 made of a metal is peeled off from the vapor deposition mask 5 after the photoresist 91 is peeled off. Thereby, the vapor deposition mask 5 is completed. Further, in the base material 90, when the mask 50 is formed by electroplating, stress is generated in the mask 50, and this stress acts in a direction in which the mask 50 contracts when the base material 90 is peeled from the vapor deposition mask 5, and acts as a force for supporting the mask 50 in a direction opposite to the contraction of the support frame 60. In other words, the mask 50 is pulled outward by the support frame 60. The flatness of the mask 50 is maintained by the tensile force.

Fig. 7 is a sectional view showing a method of manufacturing the support frame 60. The support frame 60 is formed by bonding an upper plate 61 and a lower plate 62 with a bonding material 63. The sheet material for the upper and

lower plates

61, 62 is provided in a roll form as an extension material, and therefore, the warp in the circular arc direction is retained. Therefore, as shown in fig. 7, 2 plates were bonded with their front and back sides reversed, and flatness was secured.

As shown in fig. 5, the vapor deposition mask 5 of the present invention is illustrated in a simplified diagram for easy understanding in the following description. Fig. 8 is a plan view of the vapor deposition mask 5 in the following description. Fig. 8 shows only 1 region in fig. 5. That is, 1 mask 50 is formed in the support frame 60. Fig. 9 is a sectional view a-a of fig. 8. In the actual vapor deposition mask 5, as shown in fig. 5, the mask 50 and the support frame 60 are joined by a joining member 70 formed by plating, and in fig. 9, the joining member 70 is omitted. The mask 50 is bonded to the upper plate 61 of the support frame 60. Hereinafter, a cross section of the vapor deposition mask 5 in the description of the present invention will be described with reference to fig. 9. In addition, in the case where the joining member 70 shown in fig. 5 is present, the tensile force from the mask 50 to the support frame 60 is mainly generated in the upper plate 61, which is the same as in fig. 9.

Fig. 10 is a sectional view showing a problem to be solved by the present invention. To maintain flatness to the mask 50, a tensile force is applied. On the other hand, the support frame 60 is pulled inward in reaction to generate a shear force in the adhesive 63 that bonds the upper plate 61 and the lower plate 62, and the upper plate 61 and the lower plate 62 are displaced in the planar direction. As a result, the positions of the holes of the mask 50 are shifted.

That is, since the substrate 40 and the lower plate 62 of the vapor deposition mask 5 are fixed to the vapor deposition device, the openings in the mask 50 bonded to the upper plate 61 of the support frame 60 are offset with respect to the substrate 40 as a result. As described with reference to fig. 2 and the like, in the organic EL display device, since the pixel pitch is very small, when the shift shown in fig. 10 occurs, the position of the organic EL layer as the light emitter in the pixel shifts, which has a significant influence on the display quality.

In the structure of the present invention, as shown in fig. 11, the stopper 100 for preventing the displacement of the upper plate 61 and the lower plate 62 is provided in the support frame 60, so that the displacement of the organic EL layer as the light emitting body is prevented and the position of the organic EL layer as the light emitting body is prevented even when shear stress due to tensile force is applied between the upper plate 61 and the lower plate 62.

Fig. 12 is a plan view of the vapor deposition mask 5 having the structure formed in this manner. In fig. 12, on the outer side of the mask 50, stoppers 100 for fixing the upper plate 61 and the lower plate 62 of the support frame 60 are formed on the long sides, the short sides, and the corners. The position of the plane of the stopper 100 is not limited to fig. 12, and may be selected according to the properties of the stopper 100. The embodiments shown below illustrate various stop 100 configurations.

Example 1

In embodiment 1, the upper plate 61 and the lower plate 62 are punched through by a punching tool 110 such as an ice pick, an awl, or a drill, which has a pointed front end, and the upper plate 61 and the lower plate 62 are prevented from being displaced in the plane direction by deformation of the upper plate 61 at the punched portion.

(embodiment mode 1)

Fig. 13A to 13C are views showing embodiment 1 of example 1. The upper cross-sectional view of fig. 13A shows a state in which the support frame 60 is sandwiched between the lower rigid body (mounting table) 115 having a hole and the upper rigid body (pressing table) 114, and the punching tool 110 is in contact with the support frame 60. Fig. 13A is a plan view of a dotting point 111 of a punching tool 110 disposed on the support frame 60.

Fig. 13B is a view showing a state where the upper plate 61 and the lower plate 62 of the support frame 60 are penetrated by the punching tool 110, the upper side view is a sectional view, and the lower side view is a plan view. As shown in the sectional view of fig. 13B, when the support frame 60 has been punched, burrs 113 are generated on the upper plate 61 and the lower plate 62, and the upper plate 61 and the lower plate 62 are prevented from being displaced from each other by the burrs 113. In the lower plan view of fig. 13B, 112 is a through hole, 1121 is a portion where the support frame 60 is deformed so as to generate burrs.

Fig. 13C is a sectional view showing a state of the burr 113 formed in the through-hole 112. The hole 112 is formed, for example, in a circular shape. Therefore, the movement of the upper plate 61 and the lower plate 62 of the support frame 60 relative to each other can be suppressed in any one of the planar directions.

(embodiment mode 2)

Fig. 14A to 14D are sectional views showing embodiment 2 of example 1. In embodiment 1, as shown in fig. 13C, a burr 113 is generated as a protrusion on the back side of the support frame 60 punched by the punching tool 110. Such a protruding burr 113 may be an obstacle in a vapor deposition device or the like. Embodiment 2 is a mode for dealing with this problem.

The upper cross-sectional view of fig. 14A is a cross-sectional view showing the support frame 60 sandwiched between the lower rigid body 115 and the upper rigid body 114 having holes, and when an end mill 116 for performing end milling is brought into contact with the lower plate 62. Holes are formed only in the lower plate 62 using an end mill 116.

Fig. 14B is a cross-sectional view showing a state in which after a hole is formed in lower plate 62, support frame 60 is disposed in a portion of lower rigid body 115 having a smaller diameter, and punching tool 110 is brought into contact with upper plate 61. Fig. 14C is a sectional view showing a state where the upper plate 61 is punched by the punching tool 110. At this time, a hole is formed in the lower plate 62 in advance, and the burr 113 of the upper plate 61 does not protrude downward from the lower plate 62 but abuts against the end portion of the lower plate 62 because the diameter of the lower rigid body 115 is reduced.

Fig. 14D is a sectional view of the processed support frame 60. In fig. 14D, the burr 113 of the punched upper plate 61 does not protrude from the lower surface of the lower plate 62, but abuts against the end surface of the lower plate 62. The lower plate 62 is prevented from being displaced in the planar direction from the upper plate 61 by the burr 113 of the upper plate 61. Further, the burr 113 does not protrude further downward than the lower surface of the lower plate 62.

Example 2

In example 2, the upper plate 61 and the lower plate 62 of the support frame 60 are prevented from being displaced from each other by inserting pins into through holes formed in the upper plate 61 and the lower plate 62.

(embodiment mode 1)

Fig. 15A to 15E are sectional views showing embodiment 1 of example 2. Fig. 15A shows a state in which the reamer 117 is in contact with the upper plate 61 in order to form a through hole in the upper plate 61 and the lower plate 62. The lower rigid body 115 on which the support frame 60 is placed has an opening formed in a portion corresponding to the reamer 117.

Fig. 15B is a cross-sectional view showing a state in which the support frame 60 formed with the through-hole is placed on the lower rigid body 115 not formed with the opening, and the end mill 116 is brought into contact with the upper plate 61 in order to form a hole for receiving the head of the driven pin. Fig. 15C is a sectional view showing a state in which holes are formed in portions corresponding to the heads of the pins by the end mill 116.

Fig. 15D is a sectional view showing a state where the pin 120 is inserted into the holes of the upper plate 61 and the lower plate 62 formed in this manner. In order to eliminate the deviation in the planar direction between the upper plate 61 and the lower plate 62, the main body of the pin 120 is preferably "tightly fitted" rather than "loosely fitted" to the through holes of the upper plate 61 and the lower plate 62.

Fig. 15E is a sectional view showing a state where the pin 120 is inserted into holes formed in the upper plate 61 and the lower plate 62. The pin 120 is completely received in the upper and

lower plates

61 and 62 by the broaching and end milling processes. In fig. 15E, the pins 120 can prevent the upper plate 61 and the lower plate 62 of the support frame 60 from being displaced. In addition, the reproducibility is excellent compared to the case where the upper plate 61 and the lower plate 62 are prevented from being displaced by the burr 113 as in example 1.

(embodiment mode 2)

Fig. 16A to 16D are sectional views showing embodiment 2 of example 2. Embodiment 2 is different from embodiment 1 in that the pin used is a parallel pin 121 as shown in fig. 16C. In the case of the parallel pin 121, since the pin has no head, the end milling process used in embodiment 1 is not necessary.

Fig. 16A is a sectional view showing a state where the reamer 117 is in contact with the lower rigid body 115 having the hole. Fig. 16B is a cross-sectional view showing a state in which support frame 60 having a through-hole formed by reamer 117 is placed on lower rigid body 115 having no hole. Fig. 16C is a sectional view showing a state where the parallel pin 121 is inserted into the through hole of the support frame 60. In this case, in order to eliminate the displacement in the planar direction of the upper plate 61 and the lower plate 62, the relation between the parallel pins 121 and the through holes of the upper plate 61 and the lower plate 62 is not "fitting with clearance", but more preferably "close fitting".

Fig. 16D is a sectional view showing a state in which the parallel pin 121 is inserted by being screwed into the through hole of the support frame 60. Since embodiment 2 does not require end milling as compared with embodiment 1, the process can be simplified accordingly.

(embodiment mode 3)

Fig. 17A to 17D are sectional views showing embodiment 3 of example 2. Embodiment 3 is different from embodiment 1 in that the pin used is a hollow pin 122 as shown in fig. 17D. The pin 122 has a similar outer shape to the pin 120 of embodiment 1. Therefore, the through hole formed in the support frame 115 and the hole formed in the upper plate 61 by the end mill 116 are the same as those in embodiment 1, and the processing steps shown in fig. 17A, 17B, and 17C in embodiment 3 are the same as those in fig. 15A, 15B, and 15C in embodiment 1.

Fig. 17D is different from fig. 15D in that the length of the pin 122 used in fig. 17D is longer than the length of the pin 120 used in fig. 15D. In fig. 17D, a hole is formed in lower rigid body 115 on which support frame 60 is placed, and the tip of pin 122 protrudes downward from the lower surface of lower plate 62.

Fig. 17E is a sectional view showing a state where the support frame 60 is turned upside down and the hollow portion of the pin 122 is struck with a tool (striking rod) 123 on the lower rigid body 115 where no hole is present. This presses down the tip of the hollow pin 122, and fixes the hollow pin 122.

Fig. 17F is a sectional view showing a state in which the tip of the hollow pin 122 is pressed down and the hollow pin 122 is fixed. As shown in fig. 17F, the depressed portion of the tip of the hollow pin 122 protrudes downward beyond the lower surface of the lower plate 62. In the vapor deposition device, if any one surface of the vapor deposition mask 5 may have a protrusion, the structure shown in fig. 17F can be used.

Example 3

In example 3, the lower plate 62 is made smaller than the upper plate 61 in the planar shape, and a material capable of strongly adhering the lower plate 62 and the upper plate 61 at the end portions is formed on the lower surface of the end portion of the upper plate 61 and the side surfaces of the end portion of the lower plate 62, thereby preventing the upper plate 61 and the lower plate 62 from shifting in the planar direction.

(embodiment mode 1)

Fig. 18A to 18E are sectional views showing embodiment 1 of example 3. Fig. 18A is a cross-sectional view showing a state in which upper plate 61 and lower plate 62 are placed on lower rigid body 115 upside down. As shown in fig. 18, the lower plate 62 is smaller in size than the upper plate 61, and the upper plate 61 protrudes outward from the lower plate 62 at the end portion.

Fig. 18B shows a state in which a three-dimensional printer is used to stack a shaped object 133 on an end portion of the upper plate 61. And 130, a nozzle of the three-dimensional printer. The shaped object 133 formed in this manner is a material having a property of being strongly bonded to the upper plate 61 and the lower plate 62 with the adhesive 63 or more after being subjected to heat treatment, ultraviolet irradiation, or the like. Fig. 18C is a cross section showing a state in which the shaped objects 133 are laminated by the three-dimensional printer. In this state, for example, the shaped object 133 is cured by performing not only heat treatment but also ultraviolet irradiation, and the shaped object 133 is strongly bonded to the upper plate 61 and the lower plate 62. The barbell 135 in fig. 18C and the like indicates that the layered molding 133 is strongly bonded to the upper plate 61 and the lower plate 62.

Fig. 18D is a cross-sectional view showing a state in which the flat surface and the side surface of the support frame 60 are flattened by polishing the shaped object 133 with the polishing tool 132. Fig. 18E is a sectional view of the processed support frame 60. Fig. 18A to 18D are views in which the upper plate 61 and the lower plate 62 are turned upside down, and fig. 18E is a view in which the vertical relationship between the upper plate 61 and the lower plate 62 is restored.

Fig. 18F is a rear plan view of the support frame 60 as viewed from the rear. The lower plate 62 has a smaller outer shape over the entire circumference than the upper plate 61. When the three-dimensional printer is disadvantageous in terms of time and cost for forming the layered shaped object 131 over the entire circumference, the layered shaped object 131 can be formed discretely on the outer side of the lower plate 62 as shown in fig. 18F. Of course, if the conditions permit, the layered structure 131 may be formed in the entire outer peripheral region of the lower plate 62.

Fig. 18G shows an example in which the layered structure 131 is formed on the inner peripheral side of the support frame 60. Fig. 18G is a rear plan view, and therefore only the lower plate 62 is visible. When the entire inner circumference of the lower plate 62 is smaller in width than the upper plate 61, the layered structure 113 is formed on the entire inner circumference of the lower plate 62.

(embodiment mode 2)

Fig. 19A to 19E are sectional views showing embodiment 2 of example 3. Embodiment 2 differs from embodiment 1 in that, in the support frame 60, the lower plate 62 and the upper plate 61 are initially the same size, and the space for forming the shaped object 131 by the three-dimensional printer is secured by removing the end portion of the lower plate 62 with an end mill.

Fig. 19A is a cross-sectional view showing a state in which an end mill 116 is provided to remove a part of an end portion of a lower plate 62 in a state in which a support frame 60 having the same size as the upper plate 61 and the lower plate 62 is disposed on a lower rigid body 115 in a vertically inverted state. In fig. 19A to 19E, support frame 60 is turned upside down and placed on lower rigid body 115.

Fig. 19B is a sectional view showing a state where the end of the lower plate 62 is cut and removed by the end mill 116. Fig. 19C is a cross-sectional view showing a state in which a layered shaped object 133 is formed at an end portion of the upper plate 61 by a three-dimensional printer. And 130, a nozzle of the three-dimensional printer. The structure illustrated in fig. 19C is the same as that illustrated in fig. 18B. Fig. 19D corresponds to fig. 18C of embodiment 1, and fig. 19E corresponds to fig. 18D of embodiment 1. Reference numeral 19F denotes a cross-sectional view of the support frame 60 after processing, and corresponds to fig. 18E of embodiment 1.

A plan view of the support frame 60 according to embodiment 2 is different from that according to embodiment 1. That is, in embodiment 2, since the end portion of the lower plate 62 is removed by the end mill 116, the plane of the removed portion is generally a circle. Fig. 19G is a back plan view of the support frame 60 according to embodiment 2. In fig. 19G, a hole formed in the end of the lower plate 62 by the end mill 116 is filled with a layered structure 133 formed by a three-dimensional printer. Since the hole is formed by an end mill, the hole and the layered molding 133 are discretely formed at the outer periphery.

Fig. 19H is a rear plan view of another example of the support frame 60 according to embodiment 2. In fig. 19H, a hole is formed in the inner peripheral end of the lower plate 62 by an end mill 116, and the hole is filled with a layered structure 133 formed by a three-dimensional printer. In fig. 19H, since the hole is formed by the end mill 116, the hole and the layered structure 133 are discretely formed on the inner periphery.

In fig. 19G, 19H, and the like, the removed portion formed in the lower plate 62 is formed by the end mill 116, and therefore, a circular hole is formed. However, the planar shape of the portion of the lower plate 62 other than the end mill 116 may be formed into a shape other than a circle.

Example 4

In example 4, the upper plate 61 and the lower plate 62 are fixed to the support frame 60 by plating at the end portions thereof in order to eliminate the misalignment between the upper plate 61 and the lower plate 62.

(embodiment mode 1)

Fig. 20A to 20F are sectional views showing embodiment 1 of example 4, and fig. 20G is a plan view of a support frame 60 according to example 4. Fig. 20A is a sectional view of the support frame 60 before the treatment according to the present embodiment is performed, and a sectional view of a solvent tank 141 in which a solvent 140 is placed, the solvent dissolving the adhesive 63 adhering the upper plate 61 and the lower plate 62 of the support frame 60. The end of the support frame 60 on side 1 is immersed in the solvent.

Fig. 20B is a sectional view showing a state where the 1-side end of the support frame 60 is immersed in the solvent 140. In fig. 20B, the circle mark of the portion of the support frame 60 immersed in the solvent 140 indicates the middle of the process of dissolving the adhesive 63 into the solvent 140. Fig. 20C is a sectional view showing a state where the adhesive 63 immersed in the solvent 140 is removed.

In the present embodiment, plating is a method of forming a plated layer between the upper plate 61 and the lower plate 62 at the end surfaces of the upper plate 61 and the lower plate 62 and at the end portions. The upper side of fig. 20D is a cross-sectional view showing a state where the masking tape 142 is attached before plating so that no plating layer is formed on the main surfaces of the upper plate 61 and the lower plate 62. The lower view of fig. 20 is a sectional view showing a state in which the plating liquid 143 is contained in the plating vessel 145.

Fig. 20E is a sectional view showing a state where the end portion of the support frame 60 is immersed in the plating liquid 143. In fig. 20E, the upper plate 61 and the lower plate 62 in contact with the plating liquid 143 are plated. Fig. 20F is a sectional view showing a state in which the support frame 60 having the plating layer 144 formed on the end portion between the upper plate 61 and the lower plate 62 and the end portion side surface is taken out of the plating tank 145. As shown in the upper side of fig. 20F, the plating layer 144 is filled between the lower plate 62 and the upper plate 61 to firmly adhere the upper plate 61 and the lower plate 62, and the upper plate 61 and the lower plate 62 can be prevented from being displaced due to a shear force. Incidentally, the plating thickness between the upper plate 61 and the lower plate 62 is the same thickness as the adhesive 63, and is 15 μm to 20 μm.

The steps shown in fig. 20A to 20F can be applied not only to 1 side of the support frame 60 but also to 4 sides of the support frame 60. Fig. 20G is a plan view showing a state in which the support frame 60 is plated with the plating layer 144 according to the present embodiment. As shown in fig. 20G, the plating layer 144 is applied to the entire outer end area of the 4 sides of the support frame 60, and can cope with a shear force in any direction. In fig. 20G, the dotted line indicates a state in which a plating layer is formed between the upper plate 61 and the lower plate 62 at the end of the support frame 60.

(embodiment mode 2)

Fig. 21A to 21E are sectional views showing embodiment 2 of example 4. Fig. 21A is a cross-sectional view showing a state in which an end portion of the support frame 60 is immersed in the solvent 140 to dissolve the adhesive 63, and corresponds to fig. 20B of embodiment 1. In the support frame 60, the distance between the upper plate 61 and the lower plate 62 is likely to increase in the range where the adhesive 63 is removed. Fig. 21B is a sectional view showing a state in which the distance between the upper plate 61 and the lower plate 62 is increased at the end of the support frame 60. In this way, even if the plating layer 144 is applied to the upper plate 61 and the lower plate 62, the upper plate 61 and the lower plate 62 cannot be bonded to each other by the plating layer 144.

Fig. 21C is a sectional view showing a state in which the gap between the upper plate 61 and the lower plate 62 is prevented from being widened by the clamp 146 before the plating in order to prevent the above-described state. In the upper drawing of fig. 21C, a masking tape 142 is attached to the support frame 60 from which the end adhesive 63 has been removed, and thereafter, the gap between the upper plate 61 and the lower plate 62 is prevented from expanding by a clamp 146, and plating is performed between the upper plate 61 and the lower plate 62 at a uniform thickness. The clamp 146 may be formed integrally with the support frame 60 at the 1-side thereof or may be formed discretely. In this state, the substrate is immersed in the plating liquid 143 shown in FIG. 21C.

Fig. 21D is a sectional view showing a state in which the support frame 60 in a clamped state is immersed in the plating liquid 143 and the plating layer 144 is applied. Fig. 21D is a sectional view showing a state where the support frame 60 with the end portions plated in this manner is taken out from the plating liquid 143. Fig. 21E is a sectional view showing the support frame 60 with the clamp 146 and the masking tape 142 removed. The plan view of the support frame 60 of embodiment 2 formed in this manner is the same as that of embodiment 1 shown in fig. 20G.

As described above, according to the support frame 60 of the present embodiment, the upper plate 61 and the lower plate 62 can be reliably bonded to each other at the end portions by the plating layer 144, and therefore, the displacement due to the shearing force can be reliably prevented.

Example 5

The support frame 60 of example 5 is different from those of examples 1 to 4 in cross-sectional structure. In the support frame 60 of example 5, an upper plate 61 having a convex portion 611 and a concave portion 612 on one surface and a lower plate 62 having a convex portion 621 and a concave portion 622 on one surface are prepared, and one convex portion of the upper plate 61 or the lower plate 62 is fitted into the other concave portion of the upper plate 61 or the lower plate 62, and the upper plate 61 and the lower plate 62 are bonded. In the support frame 60 formed in this manner, even if a shear force is generated in a direction parallel to the main surface by the convex portion and the concave portion which are engaged with each other, the upper plate 61 and the lower plate 62 are not displaced.

(embodiment mode 1)

Fig. 22 is a sectional view showing a method of manufacturing the support frame 60 according to embodiment 1 of example 5. In fig. 22, an upper plate 61 having a convex portion 611 and a concave portion 612 formed on one surface thereof and a lower plate 62 having a convex portion 621 and a concave portion 622 formed on one surface thereof are prepared. Such a plate material may be produced by pressing or machining. In fig. 22, the upper plate 61 and the lower plate 62 are bonded to each other with the uneven surfaces facing each other by a roller. At the time of bonding, the upper plate 61 and the lower plate 62 are not peeled off by applying the adhesive liquid 152 from the nozzle 153 to the bonding surface by a force in a direction perpendicular to the main surface of the support frame 60.

When the upper plate 61 and the lower plate 62 are bonded, the convex portion of one of the upper plate 61 and the lower plate 62 is fitted into the concave portion of the other of the upper plate 61 and the lower plate 62 by the roller 150, and therefore, even if a shear force is applied between the upper plate 61 and the lower plate 62, the upper plate 61 and the lower plate 62 are not displaced in the main surface direction. Further, since the convex portions and the concave portions are fitted to each other while being rolled by the roller 150, it is possible to prevent the shift due to the manufacturing tolerance of the convex portions and the concave portions.

Fig. 23 is a sectional view of the support frame thus produced. In fig. 23, since the convex portion of the upper plate 61 and the concave portion of the lower plate are fitted and combined, the upper plate 61 and the lower plate 62 are not displaced even if a shearing force is applied. Further, since the adhesive is present between the upper plate 61 and the lower plate 62, even if a force in a direction perpendicular to the principal surface is applied, the upper plate 61 and the lower plate 62 are not peeled off.

Fig. 24 is a view showing a state where the upper plate 61 and the lower plate 62 have surfaces with convex portions and concave portions formed thereon. In fig. 24, the upper plate 61 is provided on the left side, and the lower plate 62 is provided on the right side. In the left side view of fig. 24, the upper plate 61 has projections 611 formed at a predetermined pitch. The upper side is a plan view and the lower side is a B-B sectional view thereof. In the left side of fig. 24, the convex portions 611 are formed in an island shape and arranged in a matrix. The planar shape of each convex portion 611 is circular in fig. 24, but may be square or rectangular.

In the right-hand drawing of fig. 24, a recess 622 is formed in the lower plate 62 at a portion corresponding to the projection 611 of the upper plate 61. The upper side of the right-hand side of fig. 24 is a plan view and the lower side is a C-C sectional view thereof. The recesses 622 of the lower plate 62 are formed at the same pitch as the protrusions 611 in the upper plate 61, and the planar shape of each recess 622 is the same as the protrusions 611 in the upper plate 61. In fig. 24, the convex portion 611 of the upper plate 61 and the concave portion 622 of the lower plate 62 are fitted and bonded to each other, whereby the support frame 60 in which the upper plate 61 and the lower plate 62 are not displaced can be manufactured even when a shearing force is applied.

Fig. 25 is a view showing another example of the state of the surfaces of the upper plate 61 and the lower plate 62 on which the concave portions and the convex portions are formed. In fig. 24, the upper plate 61 is provided on the left side, and the lower plate 62 is provided on the right side. In the left side view of fig. 24, the upper plate 61 has projections 611 formed at a predetermined pitch. The upper side is a plan view and the lower side is a D-D sectional view thereof.

In the right side of fig. 25, the lower plate 62 has projections 621 formed at a predetermined pitch, as in the upper plate 61. The upper side is a plan view and the lower side is a sectional view E-E thereof. That is, the lower plate 62 and the upper plate 61 have the same structure. When the upper plate 61 and the lower plate 62 are bonded to each other, the convex portion 611 of the upper plate 61 is fitted into the concave portion indicated by the dotted circle of the lower plate 62. In the lower plate 62, the space between the 4 convex portions 621 constitutes a concave portion 622.

Fig. 25 also shows the same effect as fig. 24. In the structure of fig. 24, the upper plate 61 and the lower plate 62 need to be formed through different steps, but in the structure of fig. 25, the upper plate 61 and the lower plate 62 can be formed simultaneously. Therefore, the manufacturing cost can be reduced.

Fig. 26 is a plan view showing another example of the convex portions and concave portions formed in the upper plate 61 and the lower plate 62 of the support frame 60. In fig. 26, in one surface of the upper plate 61, the convex portions 611 are formed in a stripe shape in the longitudinal direction (y direction) and are formed at a predetermined pitch in the lateral direction (x direction). The convex portions 611 and the convex portions 611 form concave portions 612. In the embodiment of fig. 26 to 28, the upper plate 61 and the lower plate 62 have the same shape, and therefore only the upper plate 61 is described.

In fig. 26, by setting the pitch of the convex portions 611 to pp and the width w of the convex portions 611 to p/2, the convex portions 611 and the concave portions 612 having the same width are formed at the same pitch. With this structure, the upper plate 61 and the lower plate 62 can be formed at the same time. The convex portions and concave portions of the upper plate 61 and lower plate 62 formed in this manner are fitted to each other, whereby the support frame 60 can be formed. Note that the manner of discharging the adhesive liquid 152 when the upper plate 61 and the lower plate 62 are fitted to each other is the same as that described with reference to fig. 22.

The support frame 60 thus formed does not cause the upper plate 61 and the lower plate 62 to shift with respect to a shear force applied in the lateral direction (x direction in fig. 26). On the other hand, even if a shear force is applied in the vertical direction (y direction in fig. 26), the concave-convex formed in the upper plate 61 and the lower plate 62 increases the bonding area, and therefore, a certain degree of effect is obtained. However, it is insufficient against the shear force applied in the longitudinal direction.

Fig. 27 is a plan view showing another example of the convex portion 611 and the concave portion 612 formed in the upper plate 61 and the lower plate 62 of the support frame 60. In fig. 27, on one surface of the upper plate 61, the convex portions 611 extend in a stripe shape in an oblique direction and are formed at a predetermined pitch in a direction perpendicular thereto. The convex portions 611 and the convex portions 611 form concave portions 612. The structure of fig. 27 is the same as that of fig. 26 except that the convex portions 611 are formed in a stripe shape in an oblique direction.

In the support frame 60 formed by fitting the upper plate 61 and the lower plate 62 having the structure of fig. 27, since the shear force in the lateral direction (x direction of fig. 27) and the longitudinal direction (y direction of fig. 27) is dispersed, the upper plate 61 and the lower plate 62 are not displaced in either the x direction or the y direction. However, in the case where the shearing force in the x-direction or the y-direction is very large, the upper plate 61 and the lower plate 62 are slightly displaced.

Fig. 28 is a plan view showing another example of the convex portion and the concave portion formed on the upper plate and the lower plate of the support frame 60. In fig. 28, in one surface of the upper plate 61, the convex portions 611 are formed in a zigzag shape in the longitudinal direction and are arranged at a predetermined pitch in the direction perpendicular thereto. Between the convex portion 611 and the convex portion 611, a concave portion 612 is formed. The structure of fig. 28 is the same as that of fig. 26 except that the convex portion 61 is formed in a zigzag shape.

Since the shear force in the lateral direction (x direction in fig. 28) and the longitudinal direction (y direction in fig. 28) is dispersed in the support frame 60 formed by fitting the upper plate 61 and the lower plate 62 having the structure of fig. 28, the upper plate and the lower plate are less likely to be displaced in either the x direction or the y direction. Particularly, if the bending angle is 45 degrees, the shear force in the x direction or the y direction is applied, and the shear force is cancelled out to zero in both the upper, lower, left, and right directions. Therefore, if a large shearing force is generated, the upper plate 61 and the lower plate 62 are not displaced.

In addition, in the structure of fig. 26 to 28, the upper plate 61 and the lower plate 62 can be formed as the same member, which is advantageous in terms of manufacturing cost.

(embodiment mode 2)

Fig. 29 is a sectional view showing a manufacturing process of the structure of embodiment 2 of example 5. Fig. 29 is the same as fig. 22 of embodiment 1, except that the cross section of the convex portion 611 of the upper plate 61 and the cross section of the convex portion 621 of the lower plate 62 are triangular. The

convex portions

611 and 621 shown in fig. 29 can also be formed by punching or machining. The planar shape of the upper plate 61 or the lower plate 62 in embodiment 2 is the same as that described in fig. 24 to 28.

Fig. 30 is a sectional view of a support frame 60 according to embodiment 2. By fitting the convex portion 611 of the upper plate 61 and the concave portion 621 of the lower plate 62, the upper plate 61 and the lower plate 62 are not displaced even if a tensile force is applied to the support frame 60 from the mask 50. However, embodiment 2 shows a case where the cross section is triangular, but the cross section is not limited to a triangle, and the same is true even when the apex of the triangle is shaped with a curvature R, or is trapezoidal.

(embodiment mode 3)

Fig. 31 is a sectional view showing a manufacturing process of the structure of embodiment 3 of example 5. Embodiment 3 is different from embodiment 1 in that the convex portion 65 is formed on the upper plate 61 and the convex portion 66 is formed on the lower plate 62 by the three-dimensional printer. The same as described with reference to fig. 22 in embodiment 1 is true except that the

convex portions

65 and 66 are formed by a three-dimensional printer. Fig. 32 is a sectional view of the support frame according to embodiment 3. The same as that described with reference to fig. 23 in embodiment 1 is true except that the

convex portions

65 and 66 are formed by a three-dimensional printer.

The planar shape of the upper plate 61 or the lower plate 62 of embodiment 3 is the same as that described in fig. 24 to 28. For example, it is difficult to form the convex portion 611 in a zigzag shape in a planar shape by machining as shown in fig. 28, but it can be easily formed if a three-dimensional printer is used.

The above embodiments have been described with respect to the case where an organic EL display device is manufactured using a vapor deposition mask. However, the present invention is not limited to this, and can be used as a vapor deposition mask in a case where vapor deposition with a high fine pitch is required in a display device other than an organic EL display device.

Description of reference numerals

5 … vapor deposition mask, 10 … display area, 11 … scanning line, 12 … video signal line, 13 … power line, 14 … pixel, 14 … pixel, 14 … pixel, 14 … pixel, 20 … scanning line driving circuit, 21 … frame area, 30 … terminal area, 31 … driver IC, 32 … flexible wiring substrate, 40 … substrate, 50 … mask, 51 … opening area, 52 … peripheral area, 60 … support frame, 61 … upper plate, 62 … lower plate, 63 … bonding member, 65 … three-dimensional printer formed convex part, 66 … three-dimensional printer formed convex part, 70 … joint member, 80 … evaporant, 90 …, 91 …, 92 … temporary fixing member, 100 … stopper, 110 … punching tool, 36111 punching point, … hole, 113 burr …, … upper side (mounting table 115), rigid body … table), rigid body … (mounting table), …) pressing rigid body … table, 117 … counterboring cone, 120 … pin, 121 … parallel pin, 122 … hollow pin, 123 … knock bar, 130 … nozzle for three-dimensional printer, 131 … three-dimensional shaped object, 132 … grinding tool, 133 … ejection object, 135 … mark indicating strong adhesion, 140 … solvent, 141 … solvent tank, 142 … masking tape, 143 … plating solution, 144 … plating, 145 … plating tank, 150 … roller, 152 … bonding solution, 153 … nozzle, 150 … common electrode, 151 … capacitive insulating film, 152 … pixel electrode, 153 … orientation film, 611 … convex portion, 612 … concave portion, 621 … convex portion, 622 … concave portion, 900 … evaporation source, 1000 … vacuum evaporation chamber, 1121 … support frame deformation portion, B … blue light emitter, G … green light emitter, R39 … red light emitter.

Claims

1. A vapor deposition mask used for manufacturing a display device, comprising:

the vapor deposition mask is composed of a mask for forming a vapor deposition material on a pixel and a support frame for supporting the mask,

the support frame is composed of an upper plate, a lower plate and a bonding piece for bonding the upper plate and the lower plate,

the support frame has a stopper for preventing the upper plate and the lower plate from being displaced from each other in a main surface direction of the support frame when a shear force is applied between the upper plate and the lower plate.

2. The vapor deposition mask according to claim 1, wherein:

the mask is formed in a foil shape by plating, a plurality of holes are formed corresponding to pixels of the display device, and the mask and the support frame are joined together by a joining member.

3. The vapor deposition mask according to claim 2, wherein:

the joint member is formed by plating.

4. The vapor deposition mask according to claim 1, wherein:

the stopper is constituted by a burr formed by punching the upper plate and the lower plate at the same time.

5. The vapor deposition mask according to claim 1, wherein:

the stopper is constituted by a burr formed by punching one of the upper plate and the lower plate.

6. The vapor deposition mask according to claim 1, wherein:

the stopper is formed by inserting a pin into a hole penetrating the upper plate and the lower plate.

7. The vapor deposition mask according to claim 6, wherein:

the pins are parallel pins.

8. The vapor deposition mask according to claim 6, wherein:

the pin is a hollow pin.

9. The vapor deposition mask according to claim 1, wherein:

the stopper is a shaped object formed on a peripheral portion of one of the lower plate and the upper plate with a three-dimensional printer.

10. The vapor deposition mask according to claim 1, wherein:

a dimension in a planar direction of one of the upper plate and the upper plate is larger than a dimension in a planar direction of the other of the upper plate and the upper plate,

a shaped object formed by a three-dimensional printer is formed on an end portion of the one of the upper plate and the lower plate,

the shaped object constitutes the stop.

11. The vapor deposition mask according to claim 1, wherein:

the stopper is formed of a plating layer formed between the upper plate and the lower plate at the periphery of the support frame.

12. A vapor deposition mask used for manufacturing a display device, comprising:

the upper plate has projections formed on one surface thereof at a predetermined pitch, the lower plate has recesses formed on one surface thereof at the predetermined pitch, and the projections and the recesses are fitted to each other.

13. The vapor deposition mask according to claim 12, wherein:

the convex portions are formed in an island shape and arranged in a matrix shape,

the recessed portions are formed in an island shape and arranged in a matrix.

14. The vapor deposition mask according to claim 13, wherein:

the one face of the upper plate and the one face of the lower plate are the same shape,

the concave portion of the lower plate is formed by a region sandwiched by convex portions formed on the lower plate.

15. The vapor deposition mask according to claim 12, wherein:

the convex portion is formed in a stripe shape.

16. The vapor deposition mask according to claim 12, wherein:

the protruding portion is formed in a stripe shape, and the extending direction of the stripe is a direction inclined with respect to the side of the support frame.

17. The vapor deposition mask according to claim 12, wherein:

the convex portion is formed in a zigzag shape in a plan view.

18. The vapor deposition mask according to claim 12, wherein:

the convex portion is formed by a three-dimensional printer.

19. The vapor deposition mask according to claim 12, wherein:

the cross-sectional shape of the convex part is rectangular.

20. The vapor deposition mask according to claim 12, wherein:

the cross-sectional shape of the convex part is triangular.