CN113488754B - Method for realizing interconnection between microwave signal boards and interconnected microwave signal boards - Google Patents
Method for realizing interconnection between microwave signal boards and interconnected microwave signal boards Download PDFInfo
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- CN113488754B CN113488754B CN202110570032.5A CN202110570032A CN113488754B CN 113488754 B CN113488754 B CN 113488754B CN 202110570032 A CN202110570032 A CN 202110570032A CN 113488754 B CN113488754 B CN 113488754B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
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Abstract
The invention relates to the field of active phased arrays, and discloses a method for realizing interconnection among microwave signal boards and an interconnected microwave signal board, wherein the method comprises the following steps: arranging an interlayer adapter plate for supporting the composite substrate at the middle position of the upper and lower adjacent layers of composite substrates, and arranging a limiting hole for limiting a spring connecting structure on the interlayer adapter plate; a separable spring connecting structure is arranged between the upper and lower layers of adjacent composite substrates, the spring connecting structure is arranged in the limiting hole, and a metal bonding pad is arranged at the position of the upper and lower layers of adjacent composite substrates corresponding to the spring connecting structure; extruding the adjacent upper and lower layers of composite substrates, and contacting the spring connecting structure with the metal bonding pads on the upper and lower layers of composite substrates to realize interconnection; and after interconnection is completed, arranging a high-low frequency mixed joint assembly for external connection on the upper-layer composite substrate. The invention can realize longitudinal interconnection among boards with the thickness of more than 10mm and has high expansibility.
Description
Technical Field
The invention relates to the field of active phased arrays, in particular to a method for realizing interconnection among microwave signal boards and an interconnected microwave signal board.
Background
There are various methods for interconnection between microwave signal boards, and the traditional methods mainly include two methods:
the first one is to adopt radio frequency connector SMP or SMPM plus transition adapter KK to realize the transition between composite substrate 1 and the composite substrate 2, the drawback of this kind of method is that there is plug moment between transition adapter KK and the radio frequency connector SMPM, when there is more than 100 group connection structure to plug simultaneously between the board, there is great moment, cause to play to pull out and insert the difficulty, composite substrate distortion warp, damage the device that bears on the base plate even.
The second method is realized by adopting the fuzz buttons and the metal frame, the metal frame between the upper layer composite substrate and the lower layer composite substrate plays a role in supporting two layers of plates, holes are dug in corresponding positions on the frame where signal longitudinal transmission is to be realized, insulating medium bodies are embedded in the holes, the fuzz buttons and elastic ejector pins are embedded in the medium bodies, when the composite substrates are oppositely extruded, the ejector pins are compressed back into the medium bodies, meanwhile, the fuzz buttons are compressed, and the fuzz buttons and the ejector pins are conductive structures with low insertion loss, so that the longitudinal transmission of microwave signals can be realized. The method has the advantages of high frequency for realizing signal transmission and large vibration resistance magnitude, but has three disadvantages: the relative distance between the upper-layer composite substrate and the lower-layer composite substrate exceeds 10mm, and a plurality of groups of fuzz buttons are required to be connected in series to realize long-distance transmission, so that the reliability problem exists; the length of the extended out of the fuzz button thimble is related to the fuzz button compression amount, generally within 10% (the thimble has the maximum extension length of 0.5 mm), and the requirement of larger elastic extension amount cannot be met; the fuzz buttons are integrated in the medium body of the metal frame, if the quantity of the fuzz buttons integrated in one frame is too large, a plurality of or part of the fuzz buttons are damaged, and the whole frame needs to be removed for maintenance and replacement.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: in view of the above problems, a method for interconnecting microwave signal boards and an interconnected microwave signal board are provided.
The technical scheme adopted by the invention is as follows: a method for interconnecting microwave signal boards comprises the following steps:
arranging an interlayer adapter plate for supporting the composite substrate at the middle position of the upper and lower adjacent layers of composite substrates, and arranging a plurality of limiting holes for limiting the spring connecting structure on the interlayer adapter plate;
a separable spring connecting structure is arranged between the upper and lower layers of adjacent composite substrates, the spring connecting structure is arranged in the limiting hole, and a metal bonding pad is arranged at the position of the upper and lower layers of adjacent composite substrates corresponding to the spring connecting structure;
extruding the adjacent upper and lower layers of composite substrates, and contacting the spring connecting structure with the metal bonding pads on the upper and lower layers of composite substrates to realize interconnection; the spring connection structure can realize radio frequency transmission, power supply transmission and control signal transmission among the composite substrates, and solves the problem of layer-by-layer longitudinal transmission of all low frequencies and high frequencies;
and after interconnection is completed, arranging a high-low frequency mixed joint assembly for external connection on the upper-layer composite substrate.
Furthermore, the spring connecting structure comprises a radio frequency spring thimble for radio frequency transmission and a cluster spring thimble for power supply transmission and control signal transmission.
The radio frequency spring thimble comprises a spring, an upper thimble and a lower thimble, wherein the spring is positioned between the upper thimble and the lower thimble, two ends of the spring are respectively connected with the upper thimble and the lower thimble, the finally constructed radio frequency spring thimble is an independent radio frequency transmission structure, the minimum transmission frequency of the radio frequency spring thimble is not lower than 2GHz and not higher than 40GHz, the length of the radio frequency spring thimble can exceed 10mm, and the extending length of the upper thimble and the lower thimble can reach 1 mm.
Further, the process of realizing radio frequency transmission by the radio frequency spring thimble comprises the following steps: the radio frequency spring thimble is arranged in a limiting hole on the interlayer adapter plate, a metal pad is arranged at the position of the upper layer composite substrate corresponding to the upper thimble of the radio frequency spring thimble, then a metal pad is arranged at the position of the lower layer composite substrate corresponding to the lower thimble of the radio frequency spring thimble, the adjacent upper and lower layers of composite substrates are extruded, the upper thimble of the radio frequency spring thimble is contacted with the metal pad of the upper layer composite substrate, the lower thimble of the radio frequency spring thimble is contacted with the metal pad on the lower layer of composite substrate, and radio frequency transmission between the adjacent upper and lower layers of composite substrates is realized. The number of radio frequency spring thimbles arranged between the adjacent upper and lower layers of composite substrates is not less than 5, and the elastic moment is less than 1N/.
The bundling spring ejector pins are formed by integrating a plurality of independent spring ejector pins, corresponding media are arranged between every two spring ejector pins to realize supporting and isolation, the transmission rate of the bundling spring ejector pins is not lower than 50Mbps, and the number of cores of the independent spring ejector pins is not less than 9.
Further, the spring thimble tied in a bundle realizes that power supply transport and control signal transmission process include: the method comprises the steps of firstly arranging the bundling spring ejector pins in limiting holes in an interlayer adapter plate, arranging metal pads at positions, corresponding to the top ends of the bundling spring ejector pins, of an upper-layer composite substrate, then arranging metal pads at positions, corresponding to the bottom ends of the bundling spring ejector pins, of a lower-layer composite substrate, extruding the adjacent upper-layer composite substrate and the adjacent lower-layer composite substrate to enable the top ends of the bundling spring ejector pins to be in contact with the metal pads on the upper-layer composite substrate, enabling the bottom ends of the bundling spring ejector pins to be in contact with the metal pads on the lower-layer composite substrate, and achieving power supply transmission and control signal transmission between the adjacent upper-layer composite substrate and the adjacent lower-layer composite substrate. The number of the bundling elastic thimbles arranged between the adjacent upper and lower layers of composite substrates is not less than 1, and the elastic moment is less than 1N per core.
Furthermore, the interlayer adapter plate is a liquid cooling plate, a liquid cooling micro channel is arranged in the interlayer adapter plate, liquid can be supplied to realize heat dissipation, and the interlayer adapter plate is in contact with the top of the attached device on the composite substrate to realize heat transfer.
The invention also provides an interconnected microwave signal plate, which comprises an upper layer of composite substrate and a lower layer of composite substrate, wherein an interlayer adapter plate and a spring connecting structure are arranged between the upper layer of composite substrate and the lower layer of composite substrate; the spring connection structure comprises a radio frequency spring thimble for radio frequency transmission and a cluster spring thimble for power supply transmission and control signal transmission.
Furthermore, the radio frequency spring thimble includes spring, upper ejector pin and thimble down, the spring is located between upper ejector pin and the thimble down, and both ends respectively with upper ejector pin with thimble down is connected, and the radio frequency spring thimble is independent radio frequency transmission structure, and its transmission frequency is minimum not less than 2GHz, and the biggest is not higher than 40GHz, and the length of radio frequency spring thimble can exceed 10mm, and the length that upper and lower thimble stretches out can reach 1 mm.
Further, the cluster spring thimble is formed by the set of a plurality of solitary spring thimbles, is provided with corresponding medium between every spring thimble to realize supporting and keeping apart, the transmission rate of cluster spring thimble is not less than 50Mbps, and its solitary spring thimble core number is no less than 9 cores, wherein, the setting of cluster spring thimble is in spacing downthehole, and upper composite substrate corresponds be provided with the metal pad on the position on the top of cluster spring thimble, and lower floor's composite substrate is provided with the metal pad on the position of the bottom of corresponding cluster spring thimble.
Compared with the prior art, the beneficial effects of adopting the technical scheme are as follows:
the signal transmission between boards realized by the invention has the following advantages:
(1) compact structure, elastic construction all can independently dismantle the change.
(2) Longitudinal interconnection of more than 10mm of plate spacing can be realized.
(3) The elastic thimble has larger expansion amount (more than 1mm) and can be compatible with the situation that the warping degree of the substrate is larger (more than 0.5%).
Drawings
Fig. 1 is a schematic diagram of an interconnected microwave signal board structure.
Fig. 2 is a schematic diagram of a radio frequency pogo pin structure.
Fig. 3 is a schematic view of a bundling spring thimble structure.
Fig. 4 is a plan view of the bundling spring thimble.
Fig. 5 is a top view of a high and low frequency hybrid terminal assembly.
Fig. 6 is a schematic structural diagram of a high-frequency and low-frequency hybrid adapter assembly.
Reference numerals: the radio frequency spring thimble structure comprises a radio frequency spring thimble 1, a cluster spring thimble 2, a high-low frequency mixed connector assembly 3, an interlayer adapter plate 4, a composite substrate 1 5, a composite substrate 6, an upper thimble 2, an upper thimble 101, a spring of the radio frequency spring thimble 102, a lower thimble 103, a low-frequency thimble metal hard cap 104, a spring of the cluster spring thimble 105, a radio frequency thimble metal hard cap 106, an SMPM 107 and a lock nut 108.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that the indication of the orientation or the positional relationship is based on the orientation or the positional relationship shown in the drawings, or the orientation or the positional relationship which is usually placed when the product of the present invention is used, or the orientation or the positional relationship which is usually understood by those skilled in the art, or the orientation or the positional relationship which is usually placed when the product of the present invention is used, and is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the indicated device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, cannot be understood as limiting the present invention. Furthermore, the terms "first" and "second" are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be further noted that the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, unless explicitly stated or limited otherwise; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases by those skilled in the art; the drawings in the embodiments are used for clearly and completely describing the technical scheme in the embodiments of the invention, and obviously, the described embodiments are a part of the embodiments of the invention, but not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Example 1
The following technical problems exist in the prior art:
1. the problem of longitudinal signal transmission and longitudinal external interconnection of long distance between microwave signals;
2. the composite substrate is low in torque plugging;
3. the elastic mechanism is detachable and maintained;
4. the signal interconnection problem between the composite substrates with excessive warpage.
In order to solve the above technical problem, this embodiment provides a method for interconnecting microwave signal boards, which specifically includes the following steps:
in this embodiment, as shown in fig. 1, taking an adjacent composite substrate 1 and an adjacent composite substrate 2 as an example, first, an interlayer adapter plate for supporting the composite substrate is disposed at a middle position between the adjacent composite substrate 1 and the adjacent composite substrate 2, and a limiting hole for limiting a spring connection structure is formed in the interlayer adapter plate;
secondly, a separable spring connecting structure is arranged between the composite substrate 1 and the composite substrate 2, the spring connecting structure is arranged in the limiting hole, and metal pads are arranged at the positions of the composite substrate 1 and the composite substrate 2 corresponding to the spring connecting structure;
then, extruding the composite substrate 1 and the composite substrate 2, and contacting the spring connecting structure with metal pads on the composite substrate 1 and the composite substrate 2 to realize interconnection; the spring connection structure can realize radio frequency transmission, power supply transmission and control signal transmission among the composite substrates, and solves the problem of layer-by-layer longitudinal transmission of all low frequencies and high frequencies;
after the interconnection is completed, a high-low frequency mixed joint assembly for external connection is arranged on the composite substrate 1.
Specifically, in this embodiment, as shown in fig. 1, the spring connection structure includes a radio frequency spring thimble for radio frequency transmission and a cluster spring thimble for power supply transmission and control signal transmission.
The structure of the radio frequency spring thimble is shown in fig. 2, the radio frequency spring thimble comprises a spring, an upper thimble and a lower thimble, the spring is positioned between the upper thimble and the lower thimble, and two ends of the spring are respectively connected with the upper thimble and the lower thimble, the finally constructed radio frequency spring thimble is an independent radio frequency transmission structure, the minimum transmission frequency of the radio frequency spring thimble is not lower than 2GHz, the maximum transmission frequency of the radio frequency spring thimble is not higher than 40GHz, the length of the radio frequency spring thimble can exceed 10mm, and the extending length of the upper thimble and the lower thimble can reach 1 mm.
Specifically, in this embodiment, the process of implementing radio frequency transmission by the radio frequency spring thimble includes:
firstly, arranging a radio frequency spring thimble in a limiting hole on an interlayer adapter plate;
arranging a metal pad at the position of the composite substrate 1 corresponding to the upper thimble of the radio-frequency spring thimble, and arranging a metal pad at the position of the composite substrate 2 corresponding to the lower thimble of the radio-frequency spring thimble;
and extruding the composite substrate 1 and the composite substrate 2 to enable the upper thimble of the radio frequency spring thimble to be in contact with the metal pad of the composite substrate 1 and the lower thimble of the radio frequency spring thimble to be in contact with the metal pad on the composite substrate 2, so that radio frequency transmission between the composite substrate 1 and the composite substrate 2 is realized.
Specifically, in the present embodiment, as shown in fig. 3, the bundled spring thimble is formed by assembling a plurality of individual spring thimbles, and a medium is disposed between each individual spring thimble for achieving the supporting and isolating effects; two ends of each single spring thimble are provided with low-frequency thimble metal hard caps; the transmission rate of the bundling spring thimble is not lower than 50Mbps, the number of the cores of the independent spring thimble is not less than 9 cores, and specifically, in the embodiment, the number of the cores of the independent spring thimble is 10 cores.
The power supply transmission and control signal transmission process realized by the bundling spring thimble include:
firstly, arranging a bundling spring thimble in a limiting hole on an interlayer adapter plate;
arranging a metal pad at the position of the composite substrate 1 corresponding to the top end of the bundling spring ejector pin, and then arranging a metal pad at the position of the composite substrate 2 corresponding to the bottom end of the bundling spring ejector pin;
and extruding the composite substrate 1 and the composite substrate 2 to enable the top end of the bundling spring ejector pin to be in contact with the metal pad on the composite substrate 1, and the bottom end of the bundling spring ejector pin to be in contact with the metal pad on the composite substrate 2, so that power supply transmission and control signal transmission between the composite substrate 1 and the composite substrate 2 are realized.
Specifically, in this embodiment, the interlayer adapter plate is a liquid cooling plate, a liquid cooling micro channel is arranged in the interlayer adapter plate, liquid can be supplied to achieve heat dissipation, and the interlayer adapter plate is in contact with the tops of the attachment devices on the upper and lower layers of composite substrates to achieve heat transfer.
In the invention, the number of radio frequency spring thimbles used between every two adjacent layers of composite substrates is not less than 5, and the elastic moment is less than 1N/thimble; the number of the used bundling elastic thimbles is not less than 1, and the elastic moment is less than 1N per core; the number of the high-frequency and low-frequency mixed joint components connected to the upper-layer composite substrate is not less than 1; specifically, in this embodiment, 5 rf pogo pins and 1 bundling pogo pin are disposed between the composite substrate 1 and the composite substrate 2, and 1 high-low frequency mixed connector assembly is disposed on the composite substrate 1.
The interconnection mode provided by the invention is not limited to the single 2-layer composite substrate, and the interconnection between the microwave signal boards can be realized by the invention only by the adjacent 2-layer composite substrate, so that the longitudinal interconnection between the multi-layer composite substrate can be realized.
The embodiment also provides an interconnected microwave signal board, and the specific structure is shown in fig. 1.
The microwave signal plate comprises an upper composite substrate 1 and a lower composite substrate 2 which are adjacent to each other, wherein an interlayer adapter plate and a spring connecting structure are arranged between the composite substrate 1 and the composite substrate 2, a plurality of limiting holes are formed in the interlayer adapter plate and used for limiting a radio frequency spring thimble and a beam spring thimble, metal pads are arranged at positions, corresponding to the radio frequency spring thimble and the beam spring thimble, of the composite substrate 1 and the composite substrate 2, and a high-frequency and low-frequency mixed assembly joint component is arranged on the composite substrate 1.
The spring connection structure comprises a radio frequency spring thimble for radio frequency transmission and a cluster spring thimble for power supply transmission and control signal transmission.
Specifically, in this embodiment, the rf spring thimble includes a spring, an upper thimble and a lower thimble, and as shown in fig. 2, the spring is located between the upper thimble and the lower thimble, and two ends of the spring are respectively connected to the upper thimble and the lower thimble. The radio frequency spring thimble is an independent radio frequency transmission structure, the minimum transmission frequency of the radio frequency spring thimble is not lower than 2GHz, the maximum transmission frequency is not higher than 40GHz, the length of the radio frequency spring thimble can exceed 10mm, and the length of the upper thimble and the lower thimble extending can reach 1 mm.
The radio frequency spring thimble is arranged in a limiting hole of the interlayer adapter plate, a metal pad is arranged at the position, corresponding to the upper thimble of the radio frequency spring thimble, of the composite substrate 1, and a metal pad is arranged at the position, corresponding to the lower thimble of the radio frequency spring thimble, of the composite substrate 2.
Specifically, in the present embodiment, the bundled spring thimble is formed by assembling a plurality of individual spring thimbles, as shown in fig. 3, a medium is disposed between each individual spring thimble for achieving the supporting and isolating effects; two ends of each single spring thimble are provided with low-frequency thimble metal hard caps; the transmission rate of the bundling spring thimble is not lower than 50Mbps, the number of the cores of the independent spring thimble is not less than 9 cores, and specifically, in the embodiment, the number of the cores of the independent spring thimble is 10 cores.
The bundling spring ejector pins are arranged in limiting holes of the interlayer adapter plate, metal pads are arranged on the positions, corresponding to the top ends of the bundling spring ejector pins, of the composite substrate 1, and metal pads are arranged on the positions, corresponding to the bottom ends of the bundling spring ejector pins, of the composite substrate 2.
Specifically, in this embodiment, the interlayer adapter plate is a liquid cooling plate, a liquid cooling micro channel is arranged in the interlayer adapter plate, liquid can be supplied to achieve heat dissipation, and the interlayer adapter plate is in contact with the tops of the attachment devices on the upper and lower layers of composite substrates to achieve heat transfer.
Specifically, in this embodiment, the structure of the high-frequency and low-frequency mixed connector assembly is as shown in fig. 6, the high-frequency and low-frequency mixed connector assembly is mounted on the composite substrate 1 through a lock nut, one surface of the high-frequency and low-frequency mixed connector assembly, which is connected to the composite substrate 1, is provided with a radio frequency thimble metal hard cap and a low-frequency thimble metal hard cap, and the other surface of the high-frequency and low-frequency mixed connector assembly is provided with an SMPM connector connected to the outside.
In the interconnected microwave signal plate provided by the invention, the number of radio frequency spring thimbles used between every two adjacent layers of composite substrates is not less than 5, and the elastic moment is less than 1N/thimble; the number of the used bundling elastic thimbles is not less than 1, and the elastic moment is less than 1N per core; the number of the high-frequency and low-frequency mixed joint components connected to the upper-layer composite substrate is not less than 1; specifically, in this embodiment, 5 rf pogo pins and 1 bundling pogo pin are disposed between the composite substrate 1 and the composite substrate 2, and 1 high-low frequency mixed connector assembly is disposed on the composite substrate 1.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed. Those skilled in the art to which the invention pertains will appreciate that insubstantial changes or modifications can be made without departing from the spirit of the invention as defined by the appended claims.
Claims (10)
1. A method for realizing interconnection among microwave signal boards is characterized by comprising the following steps:
arranging an interlayer adapter plate for supporting the composite substrate at the middle position of the upper and lower adjacent layers of composite substrates, and arranging a plurality of limiting holes for limiting the spring connecting structure on the interlayer adapter plate;
a separable spring connecting structure is arranged between the upper and lower layers of adjacent composite substrates, the spring connecting structure is arranged in the limiting hole, and a metal bonding pad is arranged at the position of the upper and lower layers of adjacent composite substrates corresponding to the spring connecting structure;
extruding the adjacent upper and lower layers of composite substrates, and contacting the spring connecting structure with the metal bonding pads on the upper and lower layers of composite substrates to realize interconnection;
and after interconnection is completed, arranging a high-low frequency mixed joint assembly for external connection on the upper-layer composite substrate.
2. The method of claim 1, wherein said spring connecting structure comprises rf pogo pins for rf transmission and pogo pins for power supply and control signal transmission.
3. The method according to claim 2, wherein the rf pogo pin includes a spring, an upper pin and a lower pin, the spring is located between the upper pin and the lower pin, and two ends of the spring are respectively connected to the upper pin and the lower pin.
4. The method as claimed in claim 3, wherein the rf transmission process implemented by the rf pogo pin comprises: the radio frequency spring thimble is arranged in a limiting hole on the interlayer adapter plate, a metal pad is arranged at the position of the upper layer composite substrate corresponding to the upper thimble of the radio frequency spring thimble, then a metal pad is arranged at the position of the lower layer composite substrate corresponding to the lower thimble of the radio frequency spring thimble, the adjacent upper and lower layers of composite substrates are extruded, the upper thimble of the radio frequency spring thimble is contacted with the metal pad of the upper layer composite substrate, the lower thimble of the radio frequency spring thimble is contacted with the metal pad on the lower layer of composite substrate, and radio frequency transmission between the adjacent upper and lower layers of composite substrates is realized.
5. The method as claimed in claim 2, wherein said bundled spring thimble is formed by assembling a plurality of individual spring thimbles, the transmission rate of said bundled spring thimble is not less than 50Mbps, and the number of individual spring thimble cores is not less than 9 cores.
6. The method as claimed in claim 2, wherein the process of implementing power supply transmission and signal transmission control by the bundled spring thimble comprises: the method comprises the steps of firstly arranging the bundling spring ejector pins in limiting holes in an interlayer adapter plate, arranging metal pads at positions, corresponding to the top ends of the bundling spring ejector pins, of an upper-layer composite substrate, then arranging the metal pads at positions, corresponding to the bottom ends of the bundling spring ejector pins, of a lower-layer composite substrate, extruding the adjacent upper-layer composite substrate and the adjacent lower-layer composite substrate to enable the top ends of the bundling spring ejector pins to be in contact with the metal pads on the upper-layer composite substrate, enabling the bottom ends of the bundling spring ejector pins to be in contact with the metal pads on the lower-layer composite substrate, and achieving power supply transmission and control signal transmission between the adjacent upper-layer composite substrate and the adjacent lower-layer composite substrate.
7. The method of claim 1, wherein the interlayer adapter plate is a liquid-cooled plate with a liquid-cooled microchannel disposed therein.
8. An interconnected microwave signal plate comprises an upper layer of composite substrate and a lower layer of composite substrate, and is characterized in that an interlayer adapter plate and a spring connecting structure are arranged between the upper layer of composite substrate and the lower layer of composite substrate, a plurality of limiting holes are formed in the interlayer adapter plate, the spring connecting structure is arranged in the limiting holes, metal pads are arranged at positions of the upper layer of composite substrate and the lower layer of composite substrate, which correspond to the spring connecting structures, and the upper layer of composite substrate and the lower layer of composite substrate are extruded to enable the spring connecting structures to be in contact with the corresponding metal pads, so that interconnection is realized;
the spring connection structure comprises a radio frequency spring thimble for radio frequency transmission and a cluster spring thimble for power supply transmission and control signal transmission.
9. The interconnected microwave signal board of claim 8, wherein the radio frequency pogo pin comprises a spring, an upper pogo pin and a lower pogo pin, the spring is located between the upper pogo pin and the lower pogo pin, and both ends of the spring are respectively connected with the upper pogo pin and the lower pogo pin, the radio frequency pogo pin is disposed in a limiting hole, a metal pad is disposed at a position of the upper composite substrate corresponding to the upper pogo pin of the radio frequency pogo pin, and a metal pad is disposed at a position of the lower composite substrate corresponding to the lower pogo pin of the radio frequency pogo pin.
10. The interconnected microwave signal board of claim 8, wherein the bundled spring thimble is formed by assembling a plurality of individual spring thimbles, the bundled spring thimble is disposed in the limiting hole, a metal pad is disposed on the upper composite substrate at a position corresponding to the top end of the bundled spring thimble, and a metal pad is disposed on the lower composite substrate at a position corresponding to the bottom end of the bundled spring thimble.
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| CN104733824A (en) * | 2015-03-25 | 2015-06-24 | 中国电子科技集团公司第二十九研究所 | Radio-frequency vertical transformation circuit based on fuzz button |
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| US20120212375A1 (en) * | 2011-02-22 | 2012-08-23 | Depree Iv William Frederick | Quantum broadband antenna |
| TWI484695B (en) * | 2013-10-14 | 2015-05-11 | Two-Shaft Hinge Antenna and Foldable Electronic Device Using the Same | |
| CN105445506A (en) * | 2015-12-24 | 2016-03-30 | 贵州航天计量测试技术研究所 | Welding-free self-clamping interconnection structure |
| CN207490239U (en) * | 2017-11-03 | 2018-06-12 | 苏州市吴通天线有限公司 | High tolerance plate is to plate RF coaxial contactor |
| CN108695621B (en) * | 2018-07-06 | 2024-05-07 | 中国电子科技集团公司第五十四研究所 | Heterogeneous substrate high-frequency interconnection structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104733824A (en) * | 2015-03-25 | 2015-06-24 | 中国电子科技集团公司第二十九研究所 | Radio-frequency vertical transformation circuit based on fuzz button |
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