CN113488461B - Thick film hybrid integrated circuit applied to micro-circuit system - Google Patents
Thick film hybrid integrated circuit applied to micro-circuit system Download PDFInfo
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- CN113488461B CN113488461B CN202110761238.6A CN202110761238A CN113488461B CN 113488461 B CN113488461 B CN 113488461B CN 202110761238 A CN202110761238 A CN 202110761238A CN 113488461 B CN113488461 B CN 113488461B
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- H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
- H01L27/013—Thick-film circuits
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Abstract
The invention provides a thick film hybrid integrated circuit applied to a microcircuit system. The thick film hybrid integrated circuit comprises an input end, a conversion end and an output end; and the micro circuit system is connected with the thick film hybrid integrated circuit through a feedback branch. The feedback branch is connected with the input end, the output end and the microcircuit system; the feedback branch comprises a power factor correction circuit and an output protection circuit; the power factor correction circuit is connected with the output end and is used for detecting the power of the microcircuit system connected with the output end and correcting the output voltage detected by the output protection circuit based on the detected power; the conversion end comprises a control module, a rectification module and a filtering module; the control module comprises a switch controller and a transformer combination unit; the input end and the control module are integrated through a thick film process; the thick film process integration comprises: and bonding the input end with the switch controller and then assembling.
Description
Technical Field
The invention belongs to the technical field of thick film integration and microcircuits, and particularly relates to a thick film hybrid integrated circuit applied to a microcircuit system.
Background
Microcircuits refer to microelectronic devices having a high density of equivalent circuit elements and/or components, and which may be provided as stand-alone pieces. The thick film integrated circuit is a hybrid integrated circuit formed by manufacturing a passive network on the same substrate by using thick film processes such as screen printing, sintering and the like, assembling a discrete semiconductor device chip or a monolithic integrated circuit or a micro element on the passive network, and externally packaging the discrete semiconductor device chip or the monolithic integrated circuit or the micro element. Thick film hybrid integrated circuits are a type of miniature electronic functional component.
Compared with the thin film hybrid integrated circuit, the thick film hybrid integrated circuit has the characteristics of more flexible design, simple and convenient process and low cost, and is particularly suitable for various small-batch production. In terms of electrical properties, it can withstand higher voltages, higher powers and higher currents. The working frequency of the thick film microwave integrated circuit can reach more than 4 GHz. It is suitable for various circuits, especially for analog circuits used in consumer and industrial electronic products. Substrates with thick film networks have found widespread use as micro printed wiring boards.
The switch power supply is a power supply with light weight, small volume and high efficiency, and is widely applied to the national economy and national defense industry fields of household electrical equipment, PC computers, industrial robots, armored chariot and the like. With the continuous innovation and development of electronic technology, the performance of the switching power supply is also continuously improved, particularly, the working frequency of the switching power supply is increased explosively, the power supply is rapidly developed in the directions of lightness, thinness, low interference and high efficiency, and an important propulsion function is provided for the electronization and informatization development of social life.
The assembly process of the DC/DC switching power supply can be generally divided into a printed circuit board assembly process and a thick film hybrid integrated assembly process.
Chinese patent application No. CN202110113985.9 proposes a control method of a DC-DC converter. The method comprises the following steps: acquiring a current communication frequency band in a communication mode; judging whether the current communication frequency band is a preset high-risk communication frequency band or not; and when the current communication frequency band is a preset high-risk communication frequency band, adjusting a clock signal related parameter value of the DC-DC converter so as to reduce the electromagnetic interference of the current communication frequency band. By applying the scheme, the electromagnetic interference can be reduced, and the hardware cost and the power supply efficiency are considered at the same time.
The invention provides a packaging structure of a thick film hybrid integrated circuit and a manufacturing method thereof in the Chinese patent of invention CN108962846B, and the packaging structure of the thick film hybrid integrated circuit is provided with a support structure on a thick film forming substrate, so that a first type of components can be assembled through the thick film forming substrate and the support structure simultaneously, thereby forming a 3D packaging structure, increasing the assembly area of the first type of components in a product, improving the assembly density of the thick film hybrid integrated circuit product, and facilitating the miniaturization design of electronic components.
In the research literature, reference is made to the following prior art descriptions:
[1 ] Huyuan, Zhengwen, the reliable design of thick film hybrid integrated DC/DC module power supply,. hybrid microelectronics, 2003(3-4): 130-.
[2] Liu Ying Xiao, Lin Zheng, Zhang Tian would, Thick film hybrid Integrated Circuit bonding Process research [ J ] electronic world, 2019(18):16-20.
However, the inventor finds in practice that the existing thick film hybrid integrated circuit needs to be enhanced in stability and safety; and its efficiency, volume, weight, etc. are also lacking, and the coupling to a particular microcircuit system needs to be improved.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides a thick film hybrid integrated circuit applied to a microcircuit system.
The microcircuit system includes a load network; the load network comprises a direct current load and an alternating current load;
the direct current load comprises a photovoltaic power generation system and an energy storage system;
the alternating current load comprises a variable-frequency intelligent household appliance.
The thick film hybrid integrated circuit comprises an input end, a conversion end and an output end; and the micro circuit system is connected with the thick film hybrid integrated circuit through a feedback branch.
The feedback branch is connected with the input end, the output end and the microcircuit system; the feedback branch comprises a power factor correction circuit and an output protection circuit; the power factor correction circuit is connected with the output end and is used for detecting the power of the microcircuit system connected with the output end,
correcting an output voltage detected by the output protection circuit based on the detected power;
the conversion end comprises a control module, a rectification module and a filtering module; the control module comprises a switch controller and a transformer combination unit; the input end and the control module are integrated through a thick film process;
the thick film process integration comprises: and bonding the input end with the switch controller and then assembling.
The thick film hybrid integrated circuit also comprises a sampling circuit which is integrated in the feedback branch circuit through thick film mixing;
the sampling circuit is adhered to the feedback branch circuit after being subjected to laser resistance adjustment.
The sampling circuit is used for maintaining the amplitude of the voltage at the output end of the thick film hybrid integrated circuit to be stable.
The switch controller comprises an inversion unit and a resonance unit;
a pre-control unit is connected between the inverter unit and the resonance unit and is connected to a reference source circuit through a starting circuit;
the reference source circuit is connected with the first feedback branch and the second feedback branch at the same time.
The first feedback branch is an error comparator; the second feedback branch is an error amplifier.
The thick film hybrid integrated circuit disclosed by the invention can be widely applied to a hybrid microcircuit micro-grid system comprising alternating current and direct current loads.
Further advantages of the invention will be apparent in the detailed description section in conjunction with the drawings attached hereto.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic diagram of a main structure of a thick film hybrid integrated circuit applied to a microcircuit system according to an embodiment of the present invention
FIG. 2 is a schematic diagram of a substrate layout for a thick film hybrid integration process of the thick film hybrid integrated circuit of FIG. 1
FIG. 3 is a schematic diagram of the thick film hybrid integrated circuit of FIG. 1 applied to a microcircuit system
FIG. 4 is a schematic diagram of the structure of the conversion terminal of the thick film hybrid integrated circuit of FIG. 1
FIG. 5 is a schematic diagram of a portion of a switch controller of a switch terminal of the thick film hybrid integrated circuit of FIG. 1
Detailed Description
The invention is further described with reference to the following drawings and detailed description.
It should be noted that the description of the drawings given in the various embodiments of the present invention is merely schematic and does not represent all of the specific circuit configurations;
the present invention is not limited to the specific module structure described in the prior art. The prior art mentioned in the background section can be used as part of the invention to understand the meaning of some technical features or parameters. The scope of the present invention is defined by the claims.
Referring to fig. 1, a schematic diagram of a main structure of a thick film hybrid integrated circuit applied to a microcircuit system according to an embodiment of the present invention is shown.
In fig. 1, the thick film hybrid integrated circuit includes an input terminal, a transform terminal, and an output terminal; and the micro circuit system is connected with the thick film hybrid integrated circuit through a feedback branch.
The feedback branch is a general one of a plurality of modules, as indicated by the dashed box in fig. 1.
The feedback branch is connected with the input end, the output end and the microcircuit system;
the feedback branch comprises a power factor correction circuit and an output protection circuit;
the power factor correction circuit is connected with the output end and used for detecting the power of the microcircuit system connected with the output end and correcting the output voltage detected by the output protection circuit based on the detected power.
In fig. 1, the converter terminal includes a control module, a rectifying module and a filtering module; the control module comprises a switch controller and a transformer combination unit.
The input end and the control module are integrated through a thick film process.
Fig. 2 shows a schematic layout of a substrate for a thick film hybrid integration process of the thick film hybrid integrated circuit of fig. 1.
In fig. 2, the thick film process integration comprises: and bonding the input end with the switch controller and then assembling.
Although not shown, the thick film hybrid integrated circuit further includes a sampling circuit integrated in the feedback branch through the thick film hybrid;
the thick film hybrid integration comprises:
the sampling circuit is adhered to the feedback branch circuit after being subjected to laser resistance adjustment.
Fig. 3 is a schematic diagram of the thick film hybrid integrated circuit of fig. 1 applied to a microcircuit system.
The microcircuit system includes a load network; the load network comprises a direct current load and an alternating current load; the direct current load comprises a photovoltaic power generation system and an energy storage system; the alternating current load comprises a variable-frequency intelligent household appliance.
More specifically, the direct current load further comprises an electric automobile charging pile and a terminal lighting assembly.
Reference is next made to fig. 4 to 5.
In fig. 4, the converter terminal further includes an input protection circuit; the feedback branch comprises a first feedback branch and a second feedback branch; the input end of the first feedback branch is connected with the output end of the second feedback branch through a bias branch; the input protection circuit is connected with the output end and the input end of the first feedback branch circuit; the output protection circuit is connected with the input end and the output end of the second feedback branch circuit.
In fig. 4, although not shown, the switching controller includes an inverting unit and a resonating unit;
a pre-control unit is connected between the inverter unit and the resonance unit and is connected to a reference source circuit through a starting circuit;
the reference source circuit is connected with the first feedback branch and the second feedback branch at the same time.
More specifically, the switch controller includes a DC-DC conversion circuit; the DC-DC conversion circuit is connected with the reference source circuit through the starting circuit.
More preferably, referring to fig. 5, the reference source circuit is connected to the non-inverting input terminals of the first feedback branch and the second feedback branch;
the first feedback branch is an error comparator; the second feedback branch is an error amplifier.
As a further preferred, the input protection circuit is an over-temperature protection circuit; the over-temperature protection circuit comprises a temperature detection circuit; the temperature detection circuit detects the temperature of the input end, and when the temperature exceeds a preset value, the starting circuit is closed.
The output protection circuit is an overvoltage protection circuit, and the overvoltage protection circuit comprises a voltage detection circuit; the voltage detection circuit detects the output voltage of the DC/DC converter, and when the variation value of the output voltage is higher than a preset range, an early warning signal is sent to the second feedback branch circuit, so that the second control feedback branch circuit adjusts the state of a switching device in the conversion end through the front control circuit.
As a further preference, in the above embodiment, the inverter unit is connected to the transformer combination unit through the resonance unit; the transformer combination unit is connected to the output end through the rectifying module.
The inversion unit comprises a multi-stage inverter, and the last stage of the multi-stage inverter is a full-bridge inverter circuit; the resonance unit is an LLC resonance circuit; the LLC resonant circuit is connected with the full-bridge inverter circuit in parallel.
In the above further preferred embodiment, the resonance unit is an LLC resonance circuit; LLC resonant circuit with full-bridge inverter circuit connects in parallel, and full-bridge contravariant and LLC cooperation are parallelly connected to be realized, can reduce harmonic interference.
In the above embodiment, the switch controller and the transformer constitute a transduction module of the circuit, and the transduction module is used for respectively completing the tasks of energy transmission, energy output and energy storage, and input and output voltage amplitude adjustment. The sampling circuit has the task of maintaining the amplitude of the output voltage of the power supply to be stable, and the feedback branch circuit adjusts the duty ratio of a switching tube of the converter in real time to ensure that the output voltage does not change along with the fluctuation of an external load.
The input end is also provided with a first filter circuit which is used for eliminating the influence of circuit inrush current and impact voltage on the power supply circuit, ensuring the safe operation of the circuit and inhibiting the interference of voltage ripples on the input and the output of the circuit. The output end is also provided with a second filter circuit which is used for filtering out the interference signals such as alternating current and the like on the output current of the power supply to obtain stable direct current output and realize the filtering and shaping of the output voltage.
Practice proves that the thick film hybrid integrated circuit disclosed by the invention can be widely applied to a hybrid microcircuit microgrid system comprising alternating current and direct current loads; more specifically, the integrated circuit module of the invention can be applied to a building microgrid to design a direct current power supply system comprising a plurality of voltage levels; and the power cooperative control of voltage partition operation in the AC/DC micro-grid system can also be realized, so that the power balance in the micro-grid is adjusted through the control of the voltage at the DC interface.
In a word, compared with the prior art, the thick film hybrid integrated circuit provided by the invention has the characteristics of high efficiency, small volume, light weight, wider voltage stabilizing range and smaller output ripple, and can be widely applied to a micro-grid load network and a micro-grid circuit system.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A thick film hybrid integrated circuit for application to a microcircuit system, said thick film hybrid integrated circuit comprising an input terminal, a transformation terminal, and an output terminal; the micro circuit system is connected with the thick film hybrid integrated circuit through a feedback branch circuit;
the method is characterized in that:
the feedback branch is connected with the input end, the output end and the microcircuit system;
the feedback branch comprises a power factor correction circuit and an output protection circuit;
the power factor correction circuit is connected with the output end and is used for detecting the power of the microcircuit system connected with the output end and correcting the output voltage detected by the output protection circuit based on the detected power;
the conversion end comprises a control module, a rectification module and a filtering module;
the control module comprises a switch controller and a transformer combination unit;
the input end and the control module are integrated through a thick film process;
the thick film process integration comprises:
and bonding the input end with the switch controller and then assembling.
2. A thick film hybrid integrated circuit for use in microcircuit systems according to claim 1, wherein:
the microcircuit system includes a load network; the load network comprises a direct current load and an alternating current load;
the direct current load comprises a photovoltaic power generation system and an energy storage system;
the alternating current load comprises a variable-frequency intelligent household appliance.
3. A thick film hybrid integrated circuit for use in microcircuit systems according to claim 1, wherein:
the conversion end also comprises an input protection circuit;
the feedback branch comprises a first feedback branch and a second feedback branch;
the input end of the first feedback branch is connected with the output end of the second feedback branch through a bias branch;
the input protection circuit is connected with the output end and the input end of the first feedback branch circuit;
the output protection circuit is connected with the input end and the output end of the second feedback branch circuit.
4. A thick film hybrid integrated circuit for use in microcircuit systems according to claim 3, wherein:
the switch controller comprises an inversion unit and a resonance unit;
a pre-control unit is connected between the inverter unit and the resonance unit and is connected to a reference source circuit through a starting circuit;
the reference source circuit is connected with the first feedback branch and the second feedback branch at the same time.
5. A thick film hybrid integrated circuit for use in microcircuit systems according to claim 4, wherein:
the inversion unit is connected with the transformer combination unit through the resonance unit;
the transformer combination unit is connected to the output end through the rectifying module.
6. A thick film hybrid integrated circuit for use in microcircuit systems according to claim 4, wherein:
the switch controller comprises a DC-DC conversion circuit;
the DC-DC conversion circuit is connected with the reference source circuit through the starting circuit.
7. A thick film hybrid integrated circuit for use in microcircuit systems according to claim 4, wherein:
the inversion unit comprises a multi-stage inverter, and the last stage of the multi-stage inverter is a full-bridge inverter circuit;
the resonance unit is an LLC resonance circuit;
the LLC resonant circuit is connected with the full-bridge inverter circuit in parallel.
8. A thick film hybrid integrated circuit for use in microcircuit systems according to claim 4, wherein:
the reference source circuit is connected to the non-inverting input ends of the first feedback branch and the second feedback branch;
the first feedback branch is an error comparator; the second feedback branch is an error amplifier.
9. A thick film hybrid integrated circuit for use in microcircuit systems according to any of claims 1-8 wherein:
the thick film hybrid integrated circuit also comprises a sampling circuit integrated in the feedback branch circuit through a thick film hybrid process;
the sampling circuit is adhered to the feedback branch circuit after being subjected to laser resistance adjustment.
10. A thick film hybrid integrated circuit for use in microcircuit systems according to claim 9, wherein:
the sampling circuit is used for maintaining the amplitude of the voltage of the output end of the thick film hybrid process integrated circuit to be stable.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110761238.6A CN113488461B (en) | 2021-07-06 | 2021-07-06 | Thick film hybrid integrated circuit applied to micro-circuit system |
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| CN202110761238.6A CN113488461B (en) | 2021-07-06 | 2021-07-06 | Thick film hybrid integrated circuit applied to micro-circuit system |
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| CN113488461A CN113488461A (en) | 2021-10-08 |
| CN113488461B true CN113488461B (en) | 2022-03-18 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100568368B1 (en) * | 2004-01-13 | 2006-04-07 | (주)알트코리아 | Device for controlling output current of smps |
| CN201352767Y (en) * | 2009-01-21 | 2009-11-25 | 南京思立科电子有限公司 | Switch power supply module |
| CN201830521U (en) * | 2010-10-19 | 2011-05-11 | 天津光电通信技术有限公司 | Offline type high-power LED (light-emitting diode) constant-current drive power supply |
| CN202424526U (en) * | 2011-11-17 | 2012-09-05 | 常州能动电子科技有限公司 | High-voltage input power system |
| CN104377964A (en) * | 2014-12-01 | 2015-02-25 | 中国电子科技集团公司第四十三研究所 | Integrated control circuit on basis of voltage loop feedback and automatic load current sharing |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040004446A1 (en) * | 2002-07-05 | 2004-01-08 | Hun-Huang Liu | Drive circuit for an led lighting apparatus |
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2021
- 2021-07-06 CN CN202110761238.6A patent/CN113488461B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100568368B1 (en) * | 2004-01-13 | 2006-04-07 | (주)알트코리아 | Device for controlling output current of smps |
| CN201352767Y (en) * | 2009-01-21 | 2009-11-25 | 南京思立科电子有限公司 | Switch power supply module |
| CN201830521U (en) * | 2010-10-19 | 2011-05-11 | 天津光电通信技术有限公司 | Offline type high-power LED (light-emitting diode) constant-current drive power supply |
| CN202424526U (en) * | 2011-11-17 | 2012-09-05 | 常州能动电子科技有限公司 | High-voltage input power system |
| CN104377964A (en) * | 2014-12-01 | 2015-02-25 | 中国电子科技集团公司第四十三研究所 | Integrated control circuit on basis of voltage loop feedback and automatic load current sharing |
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