CN113478871B - Forming method of CT slip ring conductive disc - Google Patents
Forming method of CT slip ring conductive disc Download PDFInfo
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- CN113478871B CN113478871B CN202110746402.6A CN202110746402A CN113478871B CN 113478871 B CN113478871 B CN 113478871B CN 202110746402 A CN202110746402 A CN 202110746402A CN 113478871 B CN113478871 B CN 113478871B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/681—Component parts, details or accessories; Auxiliary operations
- B29C70/683—Pretreatment of the preformed part, e.g. insert
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/78—Moulding material on one side only of the preformed part
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
- B29C70/885—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding with incorporated metallic wires, nets, films or plates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/26—Silicon- containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/28—Glass
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- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a method for forming a CT slip ring conductive disc, which comprises the following steps: (1) preparing a conductive disc mould; (2) turning a copper plate ring groove on the annular copper plate at one time; putting the annular copper plate into a conductive disc mold; (3) preparing a casting material; (4) dividing the material into a component A and a component B; (5) Respectively adding the component A and the component B into static mixing vacuum pouring equipment, heating, stirring and defoaming in vacuum; (6) Spraying a polytetrafluoroethylene coating on the inner surface of the conductive disc mould, smearing an organic silicon release agent, heating in a constant-temperature hot air oven and preserving heat; (7) Vacuumizing the air pressure in the die cavity by a vacuum pump, (8) pouring the die cavity by static mixing vacuum pouring equipment; (9) After the pouring is finished, heating and curing the conductive disc mould, cooling the conductive disc mould in a furnace, and then demoulding; and (10) carrying out integral milling and forming after demolding. The invention can realize batch production, and the produced conductive discs have high coaxiality.
Description
Technical Field
The invention relates to the technical field of CT slip rings, in particular to a method for forming a conductive disc of a CT slip ring.
Background
The disc type slip ring is one of electric rotary connectors, can realize unlimited free rotation transmission of signals and power, and has the advantages that a single disc can be provided with loops on two sides, the axial width is short, the conductive disc is of an annular structure and the like; the disadvantage that the existing conductive slip ring needs to be installed in the center of a rotating shaft is overcome, and the conductive slip ring can be widely applied to large-scale security check machines, medical CT (computed tomography) and other equipment.
The size of the conductive disc of the CT slip ring is large, the diameter of the conductive disc can reach 1.5m, and the manufacturing process of the conductive disc in the current market cannot well meet the requirement of manufacturing the conductive disc with the outer diameter larger than 1m, so that the application of the conductive disc of the CT slip ring is influenced to a certain extent.
The manufacturing process of the CT slip ring conducting disc capable of realizing batch production is especially necessary.
Disclosure of Invention
The invention aims to solve the problems in the prior art, and provides a method for forming a CT slip ring conductive disc, which can realize batch production and can produce conductive discs with high coaxiality.
The technical scheme adopted by the invention for solving the technical problem is as follows: a method for forming a CT slip ring conductive disc comprises the following steps:
(1) Preparing a conductive disc mold; (2) turning a copper plate ring groove on the annular copper plate at one time; putting the annular copper plate into a conductive disc mold; (3) Preparing a casting material, wherein the casting material comprises E44 epoxy resin, methyl tetrahydrophthalic anhydride, polysebacic dianhydride, an accelerator, fumed silica and hollow glass beads; (4) Mixing E44 epoxy resin, fumed silica and hollow glass beads to obtain a component A; mixing methyl tetrahydrophthalic anhydride, polysebacic anhydride, an accelerator, fumed silica and hollow glass beads to obtain a component B; (5) Respectively adding the component A and the component B into static mixing vacuum pouring equipment, heating, stirring and defoaming in vacuum; (6) Spraying a polytetrafluoroethylene coating on the inner surface of the conductive disc mould, smearing an organic silicon release agent, heating to 85 ℃ in a constant-temperature hot air oven, and keeping the temperature for more than 30 min; (7) Communicating a discharge port of static mixing vacuum pouring equipment with a pouring hole of a conductive disc mold by using a polytetrafluoroethylene hose, and vacuumizing the pressure in a mold cavity of the conductive disc mold to be below 300pa by using a vacuum pump; (8) Mixing the component A and the component B through static mixing vacuum pouring equipment and pouring a conductive disc mold; (9) After the pouring is finished, placing the conductive disc mold in a constant-temperature hot air oven for heating and curing, and demolding after heating and curing and furnace cooling to 60 ℃; and (10) carrying out integral milling and forming after demolding.
Further setting the following steps: in the step (5), the heating and stirring temperature is controlled to be 80 +/-3 ℃, and the vacuum defoaming time is more than 2 hours.
Further setting the following steps: and (5) controlling the pouring flow rate to be 2L/min during pouring in the step (8), wherein the total pouring amount needs to exceed the volume of the die cavity of the conductive disc die by more than 0.5L.
Further setting the following steps: the heating curing temperature and time in the step (9) are as follows: 100 ℃ (4 h) +140 ℃ (2 h) +180 ℃ (2 h).
Further setting the following steps: the casting material comprises the following components in percentage by mass: 36-44% of E44 epoxy resin, 9-17% of methyl tetrahydrophthalic anhydride, 9-17% of polysebacic dianhydride, 0.3-1.4% of accelerator, 6-14% of fumed silica and the balance of hollow glass beads.
Further setting the following steps: the component A comprises 60% of the total amount of the gas phase white carbon black and the hollow glass beads, and the component B comprises 40% of the total amount of the gas phase white carbon black and the hollow glass beads.
Further setting the following steps: the conductive disc mould comprises a mould bottom plate, a mould inner ring and a mould outer ring which are arranged on the mould bottom plate, and a mould cover plate which covers the mould inner ring and the mould outer ring; the die bottom plate, the die inner ring, the die outer ring and the die cover plate enclose a die cavity; the mould bottom plate department is equipped with the position of placing that supplies the annular copper to place, the annular copper is through placing the position and realizing that the annular copper puts into the conducting disc mould.
Further setting the following steps: a pouring hole and an air suction hole are formed in the mold cover plate; the pouring hole is connected with a discharge hole of static mixing vacuum pouring equipment through a hose so as to realize that the static mixing vacuum pouring equipment pours the conductive disc mold; the air exhaust hole is connected with a vacuum pump so as to realize that the vacuum pump reduces the air pressure in the die cavity of the conductive disc die.
Further setting the following steps: the pouring hole and the exhaust hole are arranged on the opposite sides, and the pouring hole and the exhaust hole are both close to the edge of the mold cover plate.
Further setting the following steps: the accelerant is 2-ethyl-4-methylimidazole.
The invention has the beneficial effects that:
1. through once only turning formation copper spout on the annular copper plate, guaranteed the axiality of copper plate spout on the annular copper plate like this, put into electrically conductive dish mould with this annular copper plate again, like this with the axiality of guaranteeing the electrically conductive dish internal and external diameter and each conducting ring of pouring formation, both compare with traditional technology and promoted the axiality of electrically conductive dish internal and external diameter and each conducting ring, make things convenient for follow-up installation to use.
2. Through the manufacturing of the conductive disc mould and the steps, the mass production of the conductive discs can be realized, and the quality of the produced conductive discs is high.
3. Simple convenient to use of electrically conductive dish mould, wherein the setting up of the position of plug hole and aspirating hole can make things convenient for static compounding vacuum pouring equipment and vacuum pump to its job connection more, and the while during operation can be better bleed the die cavity through the aspirating hole, through the static compounding vacuum pouring equipment of plug hole can be better carry out even pouring for the die cavity.
Drawings
Fig. 1 is a schematic view of a conductive disc mold of the present invention.
In the figure, 1 a mould bottom plate, 2 a mould outer ring, 3 a mould cover plate, 4 air extraction holes, 5 a mould inner ring, 6 an annular copper plate and 7 a pouring hole.
Detailed Description
The invention is further described below with reference to the accompanying drawings: :
as shown in fig. 1, the present invention comprises the steps of:
(1) Preparing and manufacturing a conductive disc mold, wherein the conductive disc mold comprises a mold bottom plate, a mold inner ring and a mold outer ring which are arranged on the mold bottom plate, and a mold cover plate which covers the mold inner ring and the mold outer ring, wherein a mold cavity is defined by the mold bottom plate, the mold inner ring, the mold outer ring and the mold cover plate; wherein the bottom plate of the mold is provided with a placing position for placing the annular copper plate. Wherein, the mould cover plate is provided with a pouring hole and an air exhaust hole; the pouring hole and the exhaust hole are arranged on opposite sides, and the pouring hole and the exhaust hole are both close to the edge of the mold cover plate.
(2) Preparing an annular copper plate, and turning a copper plate ring groove on the annular copper plate at one time; and the annular copper plate is placed in a conductive disc mold and placed on a placement position.
(3) Preparing a casting material, wherein the casting material comprises E44 epoxy resin, methyl tetrahydrophthalic anhydride, polysebacic dianhydride, an accelerator, fumed silica and hollow glass beads.
Wherein the mass percent of the casting material is as follows: 36-44% of E44 epoxy resin, 9-17% of methyl tetrahydrophthalic anhydride, 9-17% of polysebacic anhydride, 0.3-1.4% of accelerant, 6-14% of fumed silica and the balance of hollow glass beads.
(4) Mixing E44 epoxy resin, fumed silica and hollow glass beads to obtain a component A; mixing methyl tetrahydrophthalic anhydride, polysebacic dianhydride, an accelerant, fumed silica and hollow glass beads to obtain a component B.
Wherein, 60 percent of the total amount of the gas-phase white carbon black and the hollow glass beads are distributed in the component A, and 40 percent of the total amount of the gas-phase white carbon black and the hollow glass beads are distributed in the component B.
(5) Respectively adding the component A and the component B into static mixing vacuum casting equipment, heating, stirring and vacuum defoaming for more than 2 hours, and controlling the temperature to be 80 +/-3 ℃.
(6) And spraying a polytetrafluoroethylene coating on the inner surface of the conductive disc mould, smearing an organic silicon type release agent, heating to 85 ℃ in a constant-temperature hot air oven, and keeping the temperature for more than 30 min.
(7) And communicating a discharge port of the static mixing vacuum pouring equipment with a pouring hole of the conductive disc mold by using a polytetrafluoroethylene hose, and vacuumizing the pressure in the mold cavity of the conductive disc mold to be below 300pa by using a vacuum pump.
(8) Mixing the component A and the component B through static mixing vacuum pouring equipment and pouring a conductive disc mold; and the pouring flow is controlled to be 2L/min during pouring, and the total pouring amount needs to exceed the volume of the die cavity of the conductive disc die by more than 0.5L.
(9) After the pouring is finished, placing the conductive disc mold in a constant-temperature hot air oven for heating and curing, wherein the curing temperature is as follows: heating to 100 deg.C (4 h) +140 deg.C (2 h) +180 deg.C (2 h), and demoulding by furnace cooling to 60 deg.C, wherein the heating is performed at 100 deg.C for 4 hr, the heating is performed at 140 deg.C for 2 hr, and the heating is performed at 180 deg.C for 2 hr, and then the furnace cooling is performed to 60 deg.C.
(10) And (5) integrally milling and forming after demolding.
Wherein the accelerator is 2-ethyl-4-methylimidazole.
In the first embodiment: according to the steps, the mass percentage of the casting material is as follows: 40% of E44 epoxy resin, 13% of methyl tetrahydrophthalic anhydride, 13% of polysebacic anhydride, 0.7% of accelerator, 10% of fumed silica and the balance of hollow glass beads;
wherein, the component A is obtained by premixing 60 percent of the total mass of the fumed silica and the hollow glass beads and 40 percent of E44 epoxy resin.
Wherein 40 percent of the total mass of the fumed silica and the hollow glass beads, methyl tetrahydrophthalic anhydride, polysebacic anhydride and an accelerator are premixed to obtain a component B.
The second embodiment: according to the steps, the casting materials comprise 36% of E44 epoxy resin, 9% of methyl tetrahydrophthalic anhydride, 9% of polysebacic anhydride, 0.3% of accelerator, 6% of fumed silica and the balance of hollow glass beads in percentage by mass;
wherein, the component A is obtained by premixing 60 percent of the total mass of the fumed silica and the hollow glass beads and 40 percent of E44 epoxy resin.
Wherein 40 percent of the total mass of the gas-phase white carbon black and the hollow glass beads, methyltetrahydrophthalic anhydride, polysebacic dianhydride and an accelerator are premixed to obtain a component B.
In the third embodiment: according to the steps, the casting materials comprise 44 mass percent of E44 epoxy resin, 17 mass percent of methyl tetrahydrophthalic anhydride, 17 mass percent of polysebacic dianhydride, 1.4 mass percent of accelerator, 14 mass percent of fumed silica and the balance of hollow glass beads;
wherein, the component A is obtained by premixing 60 percent of the total mass of the fumed silica and the hollow glass beads and 40 percent of E44 epoxy resin.
Wherein 40 percent of the total mass of the gas-phase white carbon black and the hollow glass beads, methyltetrahydrophthalic anhydride, polysebacic dianhydride and an accelerator are premixed to obtain a component B.
The above embodiments are illustrative of the present invention, and are not intended to limit the present invention, and any simple modifications of the present invention are within the scope of the present invention.
Claims (10)
1. A method for forming a CT slip ring conductive disc is characterized by comprising the following steps:
(1) Preparing a conductive disc mold;
(2) Turning a copper plate ring groove on the annular copper plate at one time; putting the annular copper plate into a conductive plate mould;
(3) Preparing a casting material, wherein the casting material comprises E44 epoxy resin, methyl tetrahydrophthalic anhydride, polysebacic dianhydride, an accelerator, fumed silica and hollow glass beads;
(4) Mixing E44 epoxy resin, fumed silica and hollow glass beads to obtain a component A; mixing methyl tetrahydrophthalic anhydride, polysebacic anhydride, an accelerator, fumed silica and hollow glass beads to obtain a component B;
(5) Respectively adding the component A and the component B into static mixing vacuum pouring equipment, heating, stirring and defoaming in vacuum;
(6) Spraying a polytetrafluoroethylene coating on the inner surface of the conductive disc mould, smearing an organic silicon release agent, heating to 85 ℃ in a constant-temperature hot air oven, and keeping the temperature for more than 30 min;
(7) Communicating a discharge port of static mixing vacuum pouring equipment with a pouring hole of a conductive disc mold by using a polytetrafluoroethylene hose, and vacuumizing the pressure in a mold cavity of the conductive disc mold to be below 300pa by using a vacuum pump;
(8) Mixing the component A and the component B by using static mixing vacuum pouring equipment and pouring a conductive disc mold;
(9) After the pouring is finished, placing the conductive disc mold in a constant-temperature hot air oven for heating and curing, and demolding after heating and curing and furnace cooling to 60 ℃;
(10) And (5) integrally milling and forming after demolding.
2. The method for forming the CT slip ring conductive disc according to claim 1, wherein: in the step (5), the heating and stirring temperature is controlled to be 80 +/-3 ℃, and the vacuum defoaming time is more than 2 h.
3. The method for forming the CT slip ring conducting disc as claimed in claim 1, wherein the method comprises the following steps: and (3) controlling the pouring flow rate to be 2L/min during pouring in the step (8), wherein the total pouring amount needs to exceed the volume of the die cavity of the conductive disc die by more than 0.5L.
4. The method for forming the CT slip ring conducting disc as claimed in claim 1, wherein the method comprises the following steps: the heating curing temperature and time in the step (9) are as follows: the temperature was first raised to 100 ℃ for 4 hours, then to 140 ℃ for 2 hours, and then to 180 ℃ for 2 hours.
5. The method for forming the CT slip ring conducting disc as claimed in claim 1, wherein the method comprises the following steps: the mass percentage of the casting material is as follows: 36-44% of E44 epoxy resin, 9-17% of methyl tetrahydrophthalic anhydride, 9-17% of polysebacic anhydride, 0.3-1.4% of accelerant, 6-14% of fumed silica and the balance of hollow glass beads.
6. The method for forming the CT slip ring conducting disc as claimed in claim 5, wherein the method comprises the following steps: the component A comprises 60% of the total amount of the gas phase white carbon black and the hollow glass beads, and the component B comprises 40% of the total amount of the gas phase white carbon black and the hollow glass beads.
7. The method for forming the CT slip ring conducting disc as claimed in claim 1, wherein the method comprises the following steps: the conductive disc mould comprises a mould bottom plate, a mould inner ring and a mould outer ring which are arranged on the mould bottom plate, and a mould cover plate which covers the mould inner ring and the mould outer ring;
the die bottom plate, the die inner ring, the die outer ring and the die cover plate enclose a die cavity;
the bottom plate department is equipped with the position of placing that supplies the annular copper to place, the annular copper is through placing the position and realizing that the annular copper puts into the conducting disc mould.
8. The method for forming the CT slip ring conducting disc as claimed in claim 7, wherein the method comprises the following steps: the mould cover plate is provided with a pouring hole and an air exhaust hole;
the pouring hole is connected with a discharge hole of static mixing vacuum pouring equipment through a hose so as to realize that the static mixing vacuum pouring equipment pours the conductive disc mold;
the air exhaust hole is connected with a vacuum pump so as to realize that the vacuum pump reduces the air pressure in the die cavity of the conductive disc die.
9. The method for forming the CT slip ring conducting disc as claimed in claim 8, wherein the method comprises the following steps: the pouring hole and the exhaust hole are arranged on opposite sides, and the pouring hole and the exhaust hole are both close to the edge of the mold cover plate.
10. The method for forming the CT slip ring conducting disc as claimed in claim 1, wherein the method comprises the following steps: the accelerant is 2-ethyl-4-methylimidazole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110746402.6A CN113478871B (en) | 2021-07-01 | 2021-07-01 | Forming method of CT slip ring conductive disc |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110746402.6A CN113478871B (en) | 2021-07-01 | 2021-07-01 | Forming method of CT slip ring conductive disc |
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| CN113478871A CN113478871A (en) | 2021-10-08 |
| CN113478871B true CN113478871B (en) | 2023-03-24 |
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| CN115178973A (en) * | 2022-07-19 | 2022-10-14 | 深圳市华盛电气技术有限公司 | CT medical slip ring casting process |
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| CN202462746U (en) * | 2012-03-16 | 2012-10-03 | 西安西光模具制造有限公司 | Demolding device for insulation disk |
| CN205081343U (en) * | 2015-10-28 | 2016-03-09 | 九江精达检测技术有限公司 | Lead electrical slip ring's pouring device |
| CN206211239U (en) * | 2016-11-23 | 2017-05-31 | 九江精达检测技术有限公司 | A kind of split type disc-type slide ring conductive plate |
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