CN113452390A

CN113452390A - Power compensation method, device, storage medium and electronic equipment

Info

Publication number: CN113452390A
Application number: CN202110711743.XA
Authority: CN
Inventors: 刘红伟; 李晓丽; 刘二晓
Original assignee: Spreadtrum Communications Shanghai Co Ltd
Current assignee: Spreadtrum Communications Shanghai Co Ltd
Priority date: 2021-06-25
Filing date: 2021-06-25
Publication date: 2021-09-28
Anticipated expiration: 2041-06-25
Also published as: CN113452390B

Abstract

The embodiment of the invention provides a power compensation method, a power compensation device, a storage medium and electronic equipment. In the technical scheme provided by the embodiment of the invention, a first curve and a second curve are obtained by performing APC calibration on equipment to be tested; calculating a first offset difference of the second curve relative to the first curve according to the first curve and the second curve; calculating the first offset difference value by a linear interpolation method to obtain a second offset difference value at the target temperature; and calculating the second offset difference value and a first compensation curve corresponding to the first curve to obtain a target compensation curve corresponding to the target temperature. The embodiment of the invention can solve the problem of the deterioration of the in-band spectrum flatness performance of the RFFE in a high-temperature or low-temperature scene on the basis of saving the storage space and not increasing the calibration cost of a production line.

Description

Power compensation method, device, storage medium and electronic equipment

[ technical field ] A method for producing a semiconductor device

The present invention relates to the field of communications technologies, and in particular, to a power compensation method, apparatus, storage medium, and electronic device.

[ background of the invention ]

A Radio Frequency Front-End module (RFFE) includes RFFE devices and matching circuits such as a Duplexer (duplex), a Diplexer (Diplexer), a surface acoustic wave filter (Saw), a Radio Frequency (RF) Switch (Switch) and a Power Amplifier (PA), which results in different insertion loss of Radio Frequency signals in the same Frequency band; meanwhile, Long Term Evolution (LTE) radio frequency signals are bandwidth signals, and have a certain requirement on in-band flatness.

In a communication system, in order to improve the in-band flatness radio frequency index, power compensation needs to be performed on a transmitter, and the power compensation is performed on a production line. Under a high-temperature or low-temperature scene, the RFFE device can cause frequency spectrum drift due to temperature change, and at the moment, a compensation curve at normal temperature is still called, so that the in-band flatness index is deteriorated. If the same set of compensation curves is used in the normal temperature scene and the high and low temperature scenes, the standard requirements on the in-band flatness in the three scenes cannot be met simultaneously. If PA drop calibration is respectively carried out on a normal-temperature scene and a high-temperature scene, the in-band flatness radio frequency index is guaranteed, but the complexity of production line calibration is improved and the requirement on calibration time is higher.

Therefore, the current power compensation cannot solve the problem of performance deterioration of the in-band spectrum flatness of the RFFE in a high-temperature or low-temperature scene on the basis of saving the storage space and not increasing the calibration cost of a production line.

[ summary of the invention ]

In view of this, embodiments of the present invention provide a power compensation method, apparatus, storage medium, and electronic device, which can solve the problem of performance degradation of in-band spectrum flatness in a high-temperature or low-temperature scenario due to RFFE on the basis of saving a storage space and not increasing a production line calibration cost.

In a first aspect, an embodiment of the present invention provides a power compensation method, where the method includes:

performing APC calibration on equipment to be tested to obtain a first curve and a second curve;

calculating an offset difference of the second curve relative to the first curve according to the first curve and the second curve;

calculating the first offset difference value by a linear interpolation method to obtain a second offset difference value at the target temperature;

and calculating the second offset difference value and a first compensation curve corresponding to the first curve to obtain a target compensation curve corresponding to the target temperature.

Optionally, the obtaining of the first curve and the second curve by performing APC calibration on the device to be tested specifically includes:

performing APC calibration on the equipment to be tested at a first temperature to obtain a first curve;

and performing APC calibration on the equipment to be tested at a second temperature to obtain a second curve.

Optionally, the first temperature includes a normal temperature, and the first curve includes a radio frequency front end uplink amplitude-frequency response curve at the normal temperature;

the second temperature comprises a high temperature or a low temperature, and the second curve comprises a radio frequency front end uplink amplitude-frequency response curve at the high temperature or the low temperature.

Optionally, the calculating the second offset difference and a first compensation curve corresponding to the first curve to obtain a target compensation curve corresponding to the target temperature specifically includes:

and adding or subtracting the second offset difference value to the first compensation curve to obtain the target compensation curve.

In another aspect, an embodiment of the present invention provides a power compensation apparatus, where the apparatus includes:

the APC calibration module is used for carrying out APC calibration on the equipment to be tested to obtain a first curve and a second curve;

a calculating module, configured to calculate, according to the first curve and the second curve, an offset difference of the second curve with respect to the first curve;

the linear difference value module is used for calculating the first offset difference value through a linear interpolation method to obtain a second offset difference value at the target temperature;

and the compensation module is used for calculating the second offset difference value and a first compensation curve corresponding to the first curve to obtain a target compensation curve corresponding to the target temperature.

Optionally, the APC calibration module specifically includes:

the first calibration submodule is used for carrying out APC calibration on the equipment to be tested at a first temperature to obtain a first curve;

and the second calibration submodule is used for carrying out APC calibration on the equipment to be tested at a second temperature to obtain a second curve.

Optionally, the compensation module is specifically configured to:

In another aspect, an embodiment of the present invention provides a storage medium, where the storage medium includes a stored program, and when the program runs, a device in which the storage medium is located is controlled to execute the above power compensation method.

In another aspect, an embodiment of the present invention provides an electronic device, including a memory and a processor, where the memory is used to store information including program instructions, and the processor is used to control execution of the program instructions, where the program instructions are loaded into and executed by the processor to implement the steps of the power compensation method.

In the technical scheme of the power compensation method, the device, the storage medium and the electronic equipment provided by the embodiment of the invention, a first curve and a second curve are obtained by performing APC calibration on equipment to be tested; calculating a first offset difference of the second curve relative to the first curve according to the first curve and the second curve; calculating the first offset difference value by a linear interpolation method to obtain a second offset difference value at the target temperature; and calculating the second offset difference value and a first compensation curve corresponding to the first curve to obtain a target compensation curve corresponding to the target temperature. The embodiment of the invention can solve the problem of the deterioration of the in-band spectrum flatness performance of the RFFE in a high-temperature or low-temperature scene on the basis of saving the storage space and not increasing the calibration cost of a production line.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.

Fig. 1 is a flowchart of a power compensation method according to an embodiment of the present invention;

FIG. 2 is a detailed flowchart of the APC calibration of the device under test in FIG. 1 to obtain a first curve and a second curve;

FIG. 3 is a plot of the amplitude-frequency response of the uplink at the RF front end and the corresponding compensation curve;

fig. 4 is a schematic structural diagram of a power compensation apparatus according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of the specific structure of the APC calibration module in FIG. 4;

fig. 6 is a schematic diagram of an electronic device according to an embodiment of the present invention.

[ detailed description ] embodiments

For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.

It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the term "and/or" as used herein is merely one type of associative relationship that describes an associated object, meaning that three types of relationships may exist, e.g., A and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

In order to meet the rf specification requirement of RFFE in-band flatness, PA drop calibration needs to be power compensated. For example, the compensation curve is index [ x ] in a normal temperature scene; in a high-temperature or low-temperature scene, in order to ensure the in-band flatness performance of the current working scene, the compensation curve is index [ x' ]; because the compensation curves in the normal temperature scene and the high and low temperature scene are different, the performance of in-band flatness is reduced by directly calling the compensation curve of the normal temperature scene in the high and low temperature scene.

In view of the above problems, the current solutions include two. One solution is that the normal temperature scene and the high and low temperature scene both adopt the compensation curve index [ x ] of the normal temperature scene, and the disadvantage is that the optimal in-band flatness performance cannot be obtained under the high and low temperature scene; the other solution is to respectively perform PA drop calibration on a normal-temperature scene and a high-temperature and low-temperature scene to obtain corresponding compensation curves index [ x ] and index [ x' ], judge the current working scene through software, and then call the corresponding compensation curves, and the defect is that the calibration complexity of a production line is increased due to the calibration time and equipment requirements. Therefore, the current solution cannot solve the problem of performance deterioration of the in-band spectrum flatness of the RFFE in a high-temperature or low-temperature scene on the basis of saving the storage space and not increasing the calibration cost of the production line.

In order to solve the above technical problem, embodiments of the present invention provide a power compensation method, apparatus, storage medium, and electronic device.

Fig. 1 is a flowchart of a power compensation method according to an embodiment of the present invention, as shown in fig. 1, the method includes:

step 101, calibrating an Automatic Power Control (APC) of a device to be tested to obtain a first curve and a second curve.

The APC calibration is to adjust a compensation parameter (Pa Offset) to ensure that the transmission power of the electronic equipment can meet the GSM05.05 specification at each frequency band and each power level.

In the embodiment of the present invention, as shown in fig. 2, step 101 specifically includes:

step 1011, performing APC calibration on the device under test at the first temperature to obtain a first curve.

The first temperature comprises a normal temperature, and the first curve comprises a radio frequency front end uplink amplitude-frequency response curve at the normal temperature.

For example, as shown in fig. 3, a curve a is an amplitude-frequency response curve of an uplink of a radio frequency front end obtained by performing APC calibration on a device to be tested by using a calibration tool under a first temperature, that is, a normal temperature scene, that is, a first curve, and a curve aa is a first compensation curve corresponding to the curve a. The curve a is combined with the curve aa to obtain the optimal in-band flatness performance of the normal-temperature scene.

Step 1012, performing APC calibration on the device under test at the second temperature to obtain a second curve.

The second temperature comprises high temperature or low temperature, and the second curve comprises an amplitude-frequency response curve of the uplink at the radio frequency front end at the high temperature or the low temperature.

In the embodiment of the invention, under a high-temperature or low-temperature scene, the frequency spectrum of the RFFE device drifts due to the temperature characteristic. Generally, the spectrum shifts to a high frequency in a low temperature scene and to a low frequency in a high temperature scene.

For example, as shown in fig. 3, the curve b is a radio frequency front end uplink amplitude-frequency response curve, i.e., a second curve, obtained by performing APC calibration on the device to be tested by using the calibration tool in a second temperature, i.e., a low temperature scenario.

And 102, calculating a first offset difference value of the second curve relative to the first curve according to the first curve and the second curve.

For example, as shown in fig. 3, a first offset difference of curve b with respect to curve a is calculated from curve a and curve b.

And 103, calculating the first offset difference value through a linear interpolation method to obtain a second offset difference value at the target temperature.

In the embodiment of the present invention, the target temperature includes any temperature, and thus may include a normal temperature, a high temperature, or a low temperature.

For example, if the first temperature comprises 25 degrees celsius, the second temperature comprises 35 degrees celsius, the first offset difference comprises 2, and the target temperature comprises 36 degrees celsius, then the second offset difference of 36 degrees celsius comprises 2.2 can be calculated according to the linear difference method.

Similarly, according to the first offset difference, the offset difference in any temperature scene can be obtained by a linear interpolation method.

Therefore, the production line only needs to finish the calibration of the normal-temperature scene PA drop to obtain a first offset difference value. The second offset difference in other temperature scenarios may be obtained by linear interpolation.

In the embodiment of the invention, the linear interpolation method not only ensures the power compensation precision, but also greatly saves the storage space of a non-volatile memory (NV), simultaneously saves the large-scale calibration cost and the calibration time of a production line, reduces the production cost and improves the production efficiency.

The RFFE devices are different from one another, and the deviation difference based on the normal-temperature scene is stored in the embodiment of the invention, so that the difference between the RFFE devices can be controlled, and the deviation difference does not need to be calibrated for each RFFE device.

And 104, calculating the second offset difference value and the first compensation curve corresponding to the first curve to obtain a target compensation curve corresponding to the target temperature.

In the embodiment of the present invention, step 104 specifically includes: and adding or subtracting the second offset difference value from the first compensation curve to obtain a target compensation coefficient.

In the embodiment of the present invention, Index [ x' ] ═ Index [ x ] +/-Index _ delta. Where Index [ x' ] is the target compensation curve, Index [ x ] is the first compensation curve, and Index _ delta is the second offset difference. In general, when the target temperature is lower than the first temperature, the target compensation curve drifts to a high frequency, i.e. right shifts, relative to the first compensation curve, and the second offset difference Index _ delta is added to the first compensation curve Index [ x ] to obtain a target compensation curve Index [ x' ]; when the target temperature is higher than the first temperature, the target compensation curve drifts to a low frequency, i.e., shifts left, relative to the first compensation curve, and the second offset difference Index _ delta is subtracted from the first compensation curve Index [ x ] to obtain a target compensation curve Index [ x' ].

In the technical scheme of the power amplifier droop compensation method provided by the embodiment of the invention, a first curve and a second curve are obtained by performing APC calibration on equipment to be tested; calculating a first offset difference of the second curve relative to the first curve according to the first curve and the second curve; calculating the first offset difference value by a linear interpolation method to obtain a second offset difference value at the target temperature; and calculating the second offset difference value and a first compensation curve corresponding to the first curve to obtain a target compensation curve corresponding to the target temperature. The embodiment of the invention can solve the problem of the deterioration of the in-band spectrum flatness performance of the RFFE in a high-temperature or low-temperature scene on the basis of saving the storage space and not increasing the calibration cost of a production line.

Fig. 4 is a schematic structural diagram of a power compensation apparatus according to an embodiment of the present invention, as shown in fig. 4, the apparatus includes: APC calibration module 31, calculation module 32, linear difference module 33 and compensation module 34.

The APC calibration module 31 is configured to obtain a first curve and a second curve by performing APC calibration on the device to be tested.

In the embodiment of the present invention, as shown in fig. 5, the APC calibration module 31 specifically includes: a first calibration sub-module 311 and a second calibration sub-module 312.

The first calibration submodule 311 is configured to perform APC calibration on the device under test at the first temperature to obtain a first curve.

And a second calibration submodule 312, configured to obtain a second curve by performing APC calibration on the device to be tested at a second temperature.

The second temperature is different from the first temperature, and the second curve comprises an amplitude-frequency response curve of an uplink at the radio frequency front end at the second temperature.

For example, the second temperature includes a high temperature or a low temperature.

And a calculating module 32, configured to calculate an offset difference of the second curve with respect to the first curve according to the first curve and the second curve.

And a linear difference module 33, configured to calculate the first offset difference by a linear interpolation method, so as to obtain a second offset difference at the target temperature.

And the compensation module 34 is configured to calculate the second offset difference and the first compensation curve corresponding to the first curve to obtain a target compensation curve corresponding to the target temperature.

In the embodiment of the present invention, the compensation module 34 is specifically configured to: and adding or subtracting the second offset difference value from the first compensation curve to obtain a target compensation curve.

The power compensation apparatus provided by the embodiment of the present invention can be used to implement the power compensation method in fig. 1 to fig. 2, and for specific description, reference may be made to the embodiment of the power compensation method, and a description thereof is not repeated here.

The power compensation device may be, for example: a chip, a chip module, or a portion of a chip module.

In the technical scheme of the power compensation device provided by the embodiment of the invention, a first curve and a second curve are obtained by performing APC calibration on equipment to be tested; calculating a first offset difference of the second curve relative to the first curve according to the first curve and the second curve; calculating the first offset difference value by a linear interpolation method to obtain a second offset difference value at the target temperature; and calculating the second offset difference value and a first compensation curve corresponding to the first curve to obtain a target compensation curve corresponding to the target temperature. The embodiment of the invention can solve the problem of the deterioration of the in-band spectrum flatness performance of the RFFE in a high-temperature or low-temperature scene on the basis of saving the storage space and not increasing the calibration cost of a production line.

Each of the apparatuses and products described above in the embodiments of fig. 4 to 5 includes a module/unit, which may be a software module/unit, a hardware module/unit, or a part of the software module/unit and a part of the hardware module/unit. For example, for each device or product of an application or integrated chip, each module/unit included in the device or product may be implemented by hardware such as a circuit, or at least a part of the modules/units may be implemented by a software program, which runs on an integrated processor inside the chip, and the remaining (if any) part of the modules/units may be implemented by hardware such as a circuit; for each device and product corresponding to or integrating a chip module, each module/unit included in the device and product may be implemented by using hardware such as a circuit, different modules/units may be located in the same piece (e.g., a chip, a circuit module, etc.) or different components of the chip module, and at least part of the module/unit may be implemented by using a software program, where the software program runs on the remaining (if any) part of the module/unit of the integrated processor inside the chip module and may be implemented by using hardware such as a circuit; for each device or product corresponding to or integrating the terminal, the modules/units included in the device or product may all be implemented by hardware such as circuits, different modules/units may be located in the same component (e.g., chip, circuit module, etc.) or different components in the terminal, or at least some of the modules/units may be implemented by software programs running on a processor integrated in the terminal, and the remaining (if any) sub-modules/units may be implemented by hardware such as circuits.

FIG. 6 is a schematic block diagram of an embodiment of an electronic device according to the present disclosure, which may include at least one processor, as shown in FIG. 6; and at least one memory communicatively coupled to the processor, wherein: the memory stores program instructions executable by the processor, and the processor calls the program instructions to execute the power compensation method provided by the embodiments shown in fig. 1 to 3 in the present specification.

FIG. 6 illustrates a block diagram of an exemplary electronic device suitable for use in implementing embodiments of the present specification. The electronic device shown in fig. 6 is only an example, and should not bring any limitation to the functions and the scope of use of the embodiments of the present specification.

As shown in fig. 6, the electronic device is in the form of a general purpose computing device. Components of the electronic device may include, but are not limited to: one or more processors 21, a memory 23, and a communication bus 24 that couples the various system components (including the memory 23 and the processing unit 21).

Communication bus 24 represents one or more of any of several types of bus structures, including a memory bus or memory controller, a peripheral bus, an accelerated graphics port, and a processor or local bus using any of a variety of bus architectures. These architectures include, but are not limited to, Industry Standard Architecture (ISA) bus, Micro Channel Architecture (MAC) bus, enhanced ISA bus, Video Electronics Standards Association (VESA) local bus, and Peripheral Component Interconnect (PCI) bus, to name a few.

Electronic devices typically include a variety of computer system readable media. Such media may be any available media that is accessible by the electronic device and includes both volatile and nonvolatile media, removable and non-removable media.

Memory 23 may include computer system readable media in the form of volatile Memory, such as Random Access Memory (RAM) and/or cache Memory. The electronic device may further include other removable/non-removable, volatile/nonvolatile computer system storage media. Memory 23 may include at least one program product having a set (e.g., at least one) of program modules that are configured to carry out the functions of embodiments of the specification.

A program/utility having a set (at least one) of program modules may be stored in memory 23, such program modules including, but not limited to, an operating system, one or more application programs, other program modules, and program data, each of which examples or some combination may comprise an implementation of a network environment. The program modules generally perform the functions and/or methodologies of the embodiments described herein.

The processor 21 executes programs stored in the memory 23 to execute various functional applications and data processing, for example, to implement the power compensation method provided by the embodiments shown in fig. 1 to 3 in the present specification.

The embodiments of the present specification provide a non-transitory computer-readable storage medium storing computer instructions that cause the computer to perform the power compensation method provided by the embodiments shown in fig. 1 to 3 of the present specification.

The non-transitory computer readable storage medium described above may take any combination of one or more computer readable media. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a Read Only Memory (ROM), an Erasable Programmable Read Only Memory (EPROM), a flash Memory, an optical fiber, a portable compact disc Read Only Memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.

A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.

Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

Computer program code for carrying out operations for aspects of the present description may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, Smalltalk, C + + or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of Network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet service provider).

The foregoing description has been directed to specific embodiments of this disclosure. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may also be possible or may be advantageous.

In the description of the specification, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the specification. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present specification, "a plurality" means at least two, e.g., two, three, etc., unless explicitly defined otherwise.

Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing steps of a custom logic function or process, and alternate implementations are included within the scope of the preferred embodiment of the present description in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the embodiments of the present description.

The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrases "if determined" or "if detected (a stated condition or event)" may be interpreted as "when determined" or "in response to a determination" or "when detected (a stated condition or event)" or "in response to a detection (a stated condition or event)", depending on the context.

It should be noted that the terminal referred to in the embodiments of the present disclosure may include, but is not limited to, a Personal Computer (Personal Computer; hereinafter, referred to as PC), a Personal Digital Assistant (Personal Digital Assistant; hereinafter, referred to as PDA), a wireless handheld device, a Tablet Computer (Tablet Computer), a mobile phone, an MP3 player, an MP4 player, and the like.

In the several embodiments provided in this specification, it should be understood that the disclosed system, apparatus, and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions in actual implementation, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

In addition, functional units in the embodiments of the present description may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.

The integrated unit implemented in the form of a software functional unit may be stored in a computer readable storage medium. The software functional unit is stored in a storage medium and includes several instructions to enable a computer device (which may be a personal computer, a server, or a network device) or a Processor (Processor) to execute some steps of the methods described in the embodiments of the present disclosure. And the aforementioned storage medium includes: a U disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.

The above description is only a preferred embodiment of the present disclosure, and should not be taken as limiting the present disclosure, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present disclosure should be included in the scope of the present disclosure.

Claims

1. A method of power compensation, the method comprising:

calculating a first offset difference of the second curve relative to the first curve according to the first curve and the second curve;

2. The method according to claim 1, wherein the first curve and the second curve are obtained by performing APC calibration on the device under test, and specifically comprises:

3. The method of claim 2,

the first temperature comprises a normal temperature, and the first curve comprises an amplitude-frequency response curve of an uplink at the radio frequency front end at the normal temperature;

4. The method according to claim 1, wherein calculating the second offset difference and a first compensation curve corresponding to the first curve to obtain a target compensation curve corresponding to the target temperature specifically includes:

5. A power compensation apparatus, the apparatus comprising:

6. The apparatus of claim 5, wherein the APC calibration module specifically comprises:

7. The apparatus of claim 6,

8. The apparatus of claim 5, wherein the compensation module is specifically configured to:

9. A storage medium, characterized in that the storage medium comprises a stored program, wherein the program, when executed, controls an apparatus in which the storage medium is located to perform the method of any of claims 1-4.

10. An electronic device comprising a memory for storing information comprising program instructions and a processor for controlling the execution of the program instructions, characterized in that the program instructions are loaded and executed by the processor to implement the steps of the method according to any of claims 1-4.