CN113451180A - Packaging plastic packaging equipment with peculiar smell removing function for integrated circuit - Google Patents
Packaging plastic packaging equipment with peculiar smell removing function for integrated circuit Download PDFInfo
- Publication number
- CN113451180A CN113451180A CN202110785017.2A CN202110785017A CN113451180A CN 113451180 A CN113451180 A CN 113451180A CN 202110785017 A CN202110785017 A CN 202110785017A CN 113451180 A CN113451180 A CN 113451180A
- Authority
- CN
- China
- Prior art keywords
- frame body
- integrated circuit
- spring
- clamping rod
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/80—Packaging reuse or recycling, e.g. of multilayer packaging
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a packaging plastic package device with an integrated circuit odor removing function. The invention aims to provide a packaging and plastic packaging device which is convenient for placing a mobile integrated circuit and can automatically move a nozzle downwards to spray resin and has a peculiar smell removing function. A packaging plastic package device with an odor removing function for an integrated circuit comprises a supporting seat, wherein a workbench is connected to the upper part of the supporting seat; the frame body is connected to the middle of the upper part of the workbench, and a plurality of notches are symmetrically and uniformly formed in one side of the frame body at intervals; the plastic door curtain is connected to one side of the frame body; and the storage assembly is arranged on the upper part of the frame body. The integrated circuit disclosed by the invention has the advantages that the packaging plastic packaging equipment with the peculiar smell removing function automatically and sequentially pushes the integrated circuit to move, spray resin, automatically unlock the placing plate and the integrated circuit, automatically remove the sprayed resin, conveniently adjust the position of the stop lever and ensure that the plastic door cannot be rolled up.
Description
Technical Field
The invention relates to a plastic package device, in particular to a package plastic package device with an integrated circuit odor removing function.
Background
The integrated circuit is a miniature electronic device or component, and is made up by using transistor, resistor and other elements and wiring which are interconnected together through a certain technological process, and making them be made into small semiconductor wafer or medium substrate, and finally packaging them in a tube shell.
The existing integrated circuit packaging plastic package technology is generally that, rely on the staff to promote integrated circuit and remove in proper order, lead to the nozzle simultaneously and spout the resin on integrated circuit, take off integrated circuit at last again, accomplish the encapsulation after the hot-working, however so operation, at first need the staff constantly to promote integrated circuit, consume the manpower, inefficiency, secondly, give out a large amount of peculiar smells during the spun resin, discharge to the external world, cause the pollution, the peculiar smell that produces at last will give off to the external world fast owing to not sheltering from, be difficult to handle.
Therefore, there is a need for a packaging and plastic packaging apparatus with odor removing function for an integrated circuit, which is convenient for placing a mobile integrated circuit and can automatically move a nozzle downwards to spray resin.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the packaging plastic packaging equipment which is convenient for placing the mobile integrated circuit and can automatically move down the nozzle to spray resin and has the peculiar smell removing function.
The purpose of the invention can be achieved by adopting the following technical scheme:
in a first aspect, a packaging and plastic packaging device with an odor removing function for an integrated circuit comprises: the workbench is connected to the upper part of the supporting seat; the frame body is connected to the middle of the upper part of the workbench, and a plurality of notches are symmetrically and uniformly formed in one side of the frame body at intervals; the plastic door curtain is connected to one side of the frame body; the storage component is arranged on the upper part of the frame body; the nozzle is arranged on the material storage component; place the subassembly, place the subassembly setting on the workstation.
Further, the magazine assembly includes: the supporting rod is connected to the middle of the upper part in the frame body; the lower sides of the lower parts of the supporting rods are both provided with air cylinders, and the lower sides of piston rods of the air cylinders are both connected with nozzles; the storage frame is connected to one side of the upper part of the frame body; the conveying pipe is connected between the material storage frame and the nozzle.
Further, the placing component comprises: the guide rod is connected to one side inside the workbench; the sliding block is connected to the guide rod in a sliding manner; the first spring is connected between the sliding block and the workbench and sleeved on the guide rod; place the board, place the board and connect on slider upper portion, place board one side interval and evenly separate and have a plurality of recesses.
Further, still include the pushing assembly, the pushing assembly includes: the first connecting rod is connected to one side of the lower part of the nozzle; the first wedge-shaped block is connected to one side of the lower part of the first connecting rod in a sliding manner; the second spring is connected between the first wedge block and the first connecting rod; the plurality of second connecting rods are uniformly connected to one side of the placing plate at intervals, and the second connecting rods are matched with the first connecting rods and the first wedge-shaped blocks; the first clamping rod is connected to one side of the inner lower part of the workbench in a sliding manner, and the first clamping rod is matched with the placing plate; and the third springs are symmetrically connected between the first clamping rod and the workbench.
Further, still include the subassembly of untiing, untie the subassembly and include: the second wedge-shaped block is connected to one side of the first clamping rod and matched with the placing plate; the second clamping rod is connected to one side inside the workbench in a sliding mode, and the second clamping rod is matched with the placing plate and the first clamping rod; and the fourth spring is symmetrically connected between the second clamping rod and the workbench.
Further, still including convulsions subassembly, including: the air collecting box is connected to one side of the upper part of the frame body; the fan is arranged on one side of the air collecting box; the filter element is connected to the upper part of the air collecting box; the air pipes are symmetrically connected between one side of the air collecting box and the frame body; the baffle is connected to one side of the inner lower part of the frame in a sliding manner, grooves are symmetrically formed in one side of the lower part of the baffle, and the baffle is matched with the first connecting rod; the fifth spring is symmetrically connected between the baffle and the frame body; the third clamping rod is connected to one side of the inner lower part of the frame body in a sliding mode, the third clamping rod is matched with the first clamping rod, and the third clamping rod is matched with the baffle; the sixth spring is connected between the third clamping rod and the frame body; the button is arranged on one side of the inner lower part of the frame body and is matched with the baffle.
Furthermore, the device also comprises a blocking component which is arranged on one side of the frame body.
Further, the blocking assembly comprises: the stop lever is connected between the two sides of the frame body in a sliding manner; the clamping blocks are connected to the two sides of the stop lever in a sliding manner and are matched with the frame body; and a seventh spring is connected between the clamping block and the stop lever.
The invention has the advantages that: (1) the placing plate drives the second connecting rod to move rightwards, the nozzle drives the first connecting rod and the first wedge-shaped block to move downwards, the second connecting rod is propped by the first connecting rod through the first wedge-shaped block, the placing plate is matched with the first clamping rod and fixed, the nozzle drives the first connecting rod to move upwards, the second connecting rod, the placing plate and the integrated circuit are pushed to move rightwards, and the effect of automatically and sequentially pushing the integrated circuit to move and spray resin is achieved; (2) according to the invention, the placing plate moves rightwards, the second wedge-shaped block and the first clamping rod are pushed to move forwards and far away from the placing plate and the second clamping rod, the second clamping rod moves upwards to reset and clamp the first clamping rod and the second wedge-shaped block, the placing plate and the integrated circuit move leftwards to reset, and the effect of automatically unlocking the placing plate and the integrated circuit is achieved; (3) according to the invention, the baffle is pushed to move downwards by the first connecting rod and is matched with the third clamping rod, the baffle is fixed, the button is pressed at the same time, the fan is started, the peculiar smell air in the frame is pumped out to the air collecting box and is absorbed and filtered by the filter element, and the purpose of automatically removing the peculiar smell generated by the sprayed resin is achieved; (4) according to the invention, the stop lever and the clamping block are moved up and down, and the clamping block is matched with the frame body, so that the stop lever is fixed after being moved to a proper position, the effect of conveniently adjusting the position of the stop lever and ensuring that the plastic door cannot be rolled up is achieved.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic cross-sectional structure of the present invention.
Fig. 3 is a schematic view of the installation of the magazine assembly of the present invention.
Fig. 4 is a schematic view of the installation of the placement assembly of the present invention.
Fig. 5 is a schematic view of the installation of the pushing assembly of the present invention.
FIG. 6 is a schematic view of a portion of the pushing assembly of the present invention.
Fig. 7 is a schematic view of the installation of the release assembly and a partial structure of the pushing assembly according to the present invention.
Fig. 8 is another perspective view of the release assembly of the present invention.
Fig. 9 is an enlarged schematic view of the structure at a of the present invention.
Fig. 10 is a partial structural schematic view of the unlocking assembly of the present invention.
FIG. 11 is a schematic view of the installation of the draft assembly of the present invention.
FIG. 12 is a schematic view of a portion of the construction of the draft assembly of the present invention.
Fig. 13 is an enlarged schematic view of the present invention at B.
Fig. 14 is a schematic view of the installation of the baffle assembly of the present invention.
Fig. 15 is an enlarged schematic view of the present invention at C.
In the above drawings: 1: supporting seat, 2: table, 21: frame, 3: plastic door curtain, 4: nozzle, 5: magazine assembly, 51: support bar, 52: cylinder, 53: delivery pipe, 54: storage frame, 6: placement assembly, 61: guide bar, 62: slider, 63: placement plate, 64: first spring, 7: pushing assembly, 71: first link, 72: first wedge block, 73: second spring, 74: second link, 75: first catch lever, 76: third spring, 8: unlocking assembly, 81: second wedge block, 82: second catch lever, 83: fourth spring, 9: convulsions subassembly, 91: air collecting box, 92: fan, 93: a filter element, 94: air duct, 95: baffle, 96: fifth spring, 97: third jamming lever, 98: sixth spring, 99: button, 10: blocking member, 101: stopper rod, 102: a latch, 103: and a seventh spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in fig. 1-4, the embodiment discloses an integrated circuit has encapsulation plastic packaging equipment who removes peculiar smell function, including supporting seat 1, workstation 2, framework 21, plastics door curtain 3, nozzle 4, storage component 5 and place subassembly 6, supporting seat 1 upper portion is connected with workstation 2, 2 upper portion intermediate connections of workstation have framework 21, framework 21 left side front and back symmetrical interval is evenly opened has a plurality of notches, framework 21 left side is connected with plastics door curtain 3, framework 21 upper portion is equipped with storage component 5, be equipped with nozzle 4 on the storage component 5, be equipped with on the workstation 2 and place subassembly 6.
The material storage assembly 5 comprises a support rod 51, an air cylinder 52, a conveying pipe 53 and a material storage frame 54, the support rod 51 is connected to the middle of the upper portion in the frame body 21, the air cylinders 52 are mounted on the left side and the right side of the lower portion of the support rod 51, the lower sides of piston rods of the air cylinders 52 are connected with the nozzles 4, the material storage frame 54 is connected to the rear side of the upper portion of the frame body 21, and the conveying pipe 53 is connected between the material storage frame 54 and the nozzles 4.
Place subassembly 6 including guide bar 61, slider 62, place board 63 and first spring 64, the inside left side of workstation 2 is connected with guide bar 61, and the gliding style is connected with slider 62 on guide bar 61, is connected with first spring 64 between slider 62 and the workstation 2, and first spring 64 overlaps on guide bar 61, and slider 62 upper portion is connected with places board 63, places board 63 front side interval and evenly opens and have a plurality of recesses.
When a user needs to plastically package an integrated circuit, firstly, enough resin is added into the material storage frame 54, the resin flows out to the nozzle 4 through the conveying pipe 53, the integrated circuit is sequentially placed on the placing plate 63, then the placing plate 63 is pushed to move rightwards, the integrated circuit and the sliding block 62 are driven to move rightwards, the first spring 64 is compressed, meanwhile, the air cylinder 52 and the nozzle 4 are started, the piston rod of the air cylinder 52 moves downwards, the nozzle 4 is driven to move downwards, the rightmost integrated circuit moves to be right below the nozzle 4, the nozzle 4 sprays the resin onto the integrated circuit, then the piston rod of the air cylinder 52 moves upwards, the nozzle 4 is driven to move upwards, the placing plate 63 and the integrated circuit are continuously pushed to move rightwards, the first spring 64 is continuously compressed, so that a second integrated circuit from right to left moves to be below the nozzle 4, and meanwhile, the piston rod of the air cylinder 52 moves downwards, the nozzle 4 is driven to move downwards, spout the resin to integrated circuit once more, so reciprocal, all integrated circuit all spout the resin after, close cylinder 52 and nozzle 4, nozzle 4 no longer removes and spouts the resin, loosen simultaneously and place board 63, under the effect of first spring 64, promote slider 62, place board 63 and integrated motor and remove to original position left, can take off the integrated circuit who has spouted the resin this moment, at last through hot-working, with the resin solidification, accomplish integrated circuit's plastic envelope, so reciprocal, reach the light effect of accomplishing the plastic envelope to the supplementary completion of integrated circuit blowout resin.
Example 2
As shown in fig. 1, 2, and 5 to 15, in some embodiments, the pushing assembly 7 further includes a first link 71, a first wedge block 72, a second spring 73, a second link 74, a first clamping rod 75, and a third spring 76, the first link 71 is connected to the rear side of the lower portion of the nozzle 4, the first wedge block 72 is connected to the left side of the lower portion of the first link 71 in a sliding manner, the second spring 73 is connected between the first wedge block 72 and the first link 71, a plurality of second links 74 are uniformly connected to the rear side of the placing plate 63 at intervals, the second links 74 are matched with the first link 71 and the first wedge block 72, the first clamping rod 75 is connected to the lower portion of the workbench 2 in a sliding manner, the first clamping rod 75 is matched with the placing plate 63, and the third spring 76 is symmetrically connected between the first clamping rod 75 and the workbench 2.
When the placing plate 63 moves rightwards, the second connecting rod 74 is driven rightwards, when the nozzle 4 moves downwards, the first connecting rod 71 and the first wedge-shaped block 72 are driven downwards, the first wedge-shaped block 72 moves to contact with the rightmost second connecting rod 74 and is driven to move backwards, the second spring 73 is compressed, after the first wedge-shaped block 72 moves through the rightmost second connecting rod 74, the first wedge-shaped block 72 is driven to move forwards under the action of the second spring 73, at the moment, the first connecting rod 71 abuts against the rightmost second connecting rod 74, when the placing plate 63 moves rightwards to contact with the first clamping rod 75, the first clamping rod 75 is driven to move forwards, the third spring 76 is compressed, after the rightmost groove in the front of the placing plate 63 moves to be opposite to the first clamping rod 75, the first clamping rod 75 is driven to move backwards under the action of the third spring 76, the placing plate 63 and the integrated circuit card are fixed, after the rightmost integrated circuit is sprayed with resin, the nozzle 4 drives the first connecting rod 71 to move upwards, the rightmost second connecting rod 74 is pushed to move rightmost, the placing plate 63 and the rest of the second connecting rods 74 are driven to move rightmost, then the nozzle 4 drives the first connecting rod 71 and the first wedge-shaped block 72 to move downwards again, the actions are repeated, the next integrated circuit is sprayed with resin, after all the integrated circuits are sprayed with resin, the first clamping rod 75 is manually pushed to move forwards to be far away from the placing plate 63, the third spring 76 is compressed, the placing plate 63 and the integrated circuits move leftwards to reset, the integrated circuits can be taken down, and the effect of automatically and sequentially pushing the integrated circuits to move to spray resin is achieved.
Still including untie subassembly 8, untie subassembly 8 is including second wedge 81, second card pole 82 and fourth spring 83, and first card pole 75 right side is connected with second wedge 81, and second wedge 81 mutually supports with placing board 63, and the inside left front side sliding type of workstation 2 is connected with second card pole 82, and second card pole 82 mutually supports with placing board 63 and first card pole 75, and bilateral symmetry is connected with fourth spring 83 between second card pole 82 and the workstation 2.
In the initial state, the placing plate 63 and the first clamping bar 75 press the second clamping bar 82, the fourth spring 83 is in a compressed state, after the placing plate 63 moves to the rightmost side and contacts the second wedge-shaped block 81, the placing plate is far away from the second clamping bar 82 and pushes the first clamping bar 75 to move forwards, the third spring 76 is compressed, at this time, the placing plate 63 and the integrated circuit which are fastened by the clamping are moved leftwards to reset, meanwhile, the first clamping bar 75 is far away from the second clamping bar 82, under the action of the fourth spring 83, the second clamping bar 82 is pushed to move upwards to clamp and fix the first clamping bar 75 and the second wedge-shaped block 81, after the placing plate 63 moves leftwards to contact the second clamping bar 82, the second clamping bar 82 is pushed to move downwards to be far away from the first clamping bar 75, the fourth spring 83 is compressed, under the action of the third spring 76, the first clamping bar 75 and the second wedge-shaped block 81 are pushed to move backwards to restore to the original state, the effect of automatically unlocking the placing plate 63 and the integrated circuit is achieved.
The air draft device also comprises an air draft assembly 9, which comprises an air collecting box 91, a fan 92, a filter element 93, an air pipe 94, a baffle 95, a fifth spring 96, a third clamping rod 97, a sixth spring 98 and a button 99, wherein the air collecting box 91 is connected to the front side of the upper part of the frame body 21, the fan 92 is installed on the left side of the air collecting box 91, the filter element 93 is connected to the upper part of the air collecting box 91, the air pipes 94 are symmetrically connected between the front side of the air collecting box 91 and the frame body 21 in the left-right direction, the baffle 95 is movably connected to the front side of the lower part in the frame body 21, grooves are symmetrically formed in the front side of the lower part of the baffle 95 in the left-right direction, the baffle 95 is matched with the first connecting rod 71, the fifth spring 96 is symmetrically connected between the baffle 95 and the frame body 21 in the left-right direction, the third clamping rod 97 is movably connected to the front side of the lower part in the frame body 21, the third clamping rod 97 is matched with the first clamping rod 75, the third clamping rod 97 is matched with the baffle 95, the sixth spring 98 is connected between the third clamping rod 97 and the frame body 21, a button 99 is mounted on the front side of the lower portion of the frame 21, and the button 99 is engaged with the shutter 95.
After resin is sprayed on the integrated circuit, a large amount of peculiar smell can be emitted, under the shielding effect of the plastic door curtain 3, the peculiar smell can not be emitted out of the frame body 21, when the first connecting rod 71 moves downwards, the pushing baffle 95 moves downwards, the fifth spring 96 is stretched, after the baffle 95 moves to contact with the third clamping rod 97, the third clamping rod 97 is pushed to move forwards, the sixth spring 98 is compressed, the groove of the baffle 95 moves to be opposite to the third clamping rod 97, under the action of the sixth spring 98, the third clamping rod 97 is pushed to move backwards, the baffle 95 is clamped and fixed, at the moment, the baffle 95 does not block the air pipe 94 any more, and moves to press the button 99, the fan 92 is started, the peculiar smell air in the frame body 21 is pumped out of the air collecting box 91 through the air pipe 94, the peculiar smell is absorbed and filtered by the filter element 93, the peculiar smell-free air is discharged to the outside, when the first clamping rod 75 moves forwards, the third clamping rod 97 is pushed to move forwards to move away from the baffle 95, the sixth spring 98 is compressed, under the action of the fifth spring 96, the baffle 95 is pushed to move upwards to be away from the button 99, the fan 92 is closed, the air outlet pipe 94 is blocked again, then the first clamping rod 75 moves backwards to be reset to be away from the third clamping rod 97, and under the action of the sixth spring 98, the third clamping rod 97 is pushed to move backwards to be restored to the original state, so that the peculiar smell generated by the sprayed resin is automatically removed.
The blocking component 10 comprises a blocking rod 101, a clamping block 102 and a seventh spring 103, the blocking rod 101 is connected between the front side and the rear side of the left portion of the frame body 21 in a sliding mode, the clamping block 102 is connected on the front side and the rear side of the blocking rod 101 in a sliding mode, the clamping block 102 is matched with the frame body 21 in a sliding mode, and the seventh spring 103 is connected between the clamping block 102 and the blocking rod 101.
The stop lever 101 blocks the plastic door curtain 3, guarantee under the effect of fan 92, when taking out the air in the framework 21, the plastic door can not be rolled up, when needing to clear up or repair the interior part of framework 21, can promote the stop lever 101 and reciprocate, drive fixture block 102 and reciprocate, fixture block 102 is pushed to the inboard by framework 21 and is removed, seventh spring 103 is compressed, after stop lever 101 moved to suitable position, fixture block 102 is just to the notch of framework 21, under the effect of seventh spring 103, promote fixture block 102 and move to the outside, block into in the framework 21, fix stop lever 101, reach the convenient adjustment stop lever 101 position, guarantee the effect that the plastic door can not be rolled up.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. The utility model provides an integrated circuit has encapsulation plastic envelope equipment of removing peculiar smell function which characterized in that, including: the supporting seat (1), the workbench (2) is connected to the upper part of the supporting seat (1); the frame body (21), the frame body (21) is connected to the middle of the upper part of the workbench (2), and a plurality of notches are symmetrically and uniformly formed in one side of the frame body (21) at intervals; the plastic door curtain (3), the plastic door curtain (3) is connected to one side of the frame body (21); the storage component (5), the storage component (5) is arranged on the upper part of the frame body (21); the nozzle (4), the nozzle (4) is set up on the stock assembly (5); the placing component (6) is arranged on the workbench (2).
2. The packaging and plastic packaging equipment with the odor removing function for the integrated circuit according to claim 1, wherein the material storage component (5) comprises: a support rod (51), wherein the support rod (51) is connected to the middle of the upper part in the frame body (21); the two sides of the lower part of the supporting rod (51) are provided with the air cylinders (52), and the lower sides of piston rods of the air cylinders (52) are connected with the nozzles (4); a storage frame (54), wherein the storage frame (54) is connected to one side of the upper part of the frame body (21); and the conveying pipe (53), wherein the conveying pipe (53) is connected between the material storage frame (54) and the nozzle (4).
3. The package and plastic package equipment with the function of removing the peculiar smell of the integrated circuit according to claim 2, characterized in that, the placing component (6) includes: the guide rod (61), the guide rod (61) is connected to one side inside the workbench (2); the sliding block (62), the sliding block (62) is connected on the guide rod (61) in a sliding way; the first spring (64), the first spring (64) is connected between the slide block (62) and the workbench (2), and the first spring (64) is sleeved on the guide rod (61); the placing plate (63) is connected to the upper portion of the sliding block (62), and a plurality of grooves are uniformly formed in one side of the placing plate (63) at intervals.
4. A package and package equipment with odor removing function for ic according to claim 3, further comprising a pushing assembly (7), wherein the pushing assembly (7) comprises: the first connecting rod (71), the first connecting rod (71) is connected to one side of the lower part of the nozzle (4); the first wedge block (72) is connected to one side of the lower part of the first connecting rod (71) in a sliding manner; a second spring (73), the second spring (73) being connected between the first wedge block (72) and the first link (71); the second connecting rods (74) are uniformly connected to one side of the placing plate (63) at intervals, and the second connecting rods (74) are matched with the first connecting rods (71) and the first wedge-shaped blocks (72) mutually; the first clamping rod (75) is connected to one side of the inner lower part of the workbench (2) in a sliding mode, and the first clamping rod (75) is matched with the placing plate (63); and the third springs (76) are symmetrically connected between the first clamping rod (75) and the workbench (2).
5. The apparatus for packaging and plastic packaging with odor removing function for integrated circuit according to claim 4, further comprising a releasing assembly (8), wherein the releasing assembly (8) comprises: the second wedge-shaped block (81), the second wedge-shaped block (81) is connected to one side of the first clamping rod (75), and the second wedge-shaped block (81) is matched with the placing plate (63); the second clamping rod (82), the second clamping rod (82) is connected to one side inside the workbench (2) in a sliding mode, and the second clamping rod (82) is matched with the placing plate (63) and the first clamping rod (75) mutually; and the fourth spring (83) is symmetrically connected between the second clamping rod (82) and the workbench (2).
6. The packaging and plastic packaging equipment with the odor removing function for the integrated circuit according to claim 5, characterized by further comprising an air draft assembly (9) comprising: an air collecting box (91), wherein the air collecting box (91) is connected to one side of the upper part of the frame body (21); a fan (92), wherein the fan (92) is arranged on one side of the air collecting box (91); the filter element (93), the filter element (93) is connected to the upper part of the air collecting box (91); the air pipes (94), the air pipes (94) are symmetrically connected between one side of the air collecting box (91) and the frame body (21); the baffle (95) is connected to one side of the inner lower part of the frame body (21) in a sliding mode, grooves are symmetrically formed in one side of the lower part of the baffle (95), and the baffle (95) is matched with the first connecting rod (71); the fifth spring (96), the fifth spring (96) is symmetrically connected between the baffle (95) and the frame body (21); the third clamping rod (97) is connected to one side of the inner lower part of the frame body (21) in a sliding mode, the third clamping rod (97) is matched with the first clamping rod (75), and the third clamping rod (97) is matched with the baffle (95); a sixth spring (98), wherein the sixth spring (98) is connected between the third clamping rod (97) and the frame body (21); the button (99), the button (99) is installed in the lower part of the frame (21), and the button (99) is mutually matched with the baffle (95).
7. The packaging and plastic packaging equipment with the function of removing the peculiar smell of the integrated circuit according to claim 6, characterized by further comprising a blocking component (10), wherein the blocking component (10) is arranged at one side of the frame body (21).
8. The apparatus for encapsulating and molding an integrated circuit with a deodorizing function according to claim 7, wherein the shielding member (10) comprises: the stop lever (101), the stop lever (101) is connected between both sides of the frame body (21) in a sliding way; the clamping blocks (102) are connected to two sides of the stop lever (101) in a sliding mode, and the clamping blocks (102) are matched with the frame body (21); and a seventh spring (103) is connected between the fixture block (102) and the stop lever (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110785017.2A CN113451180B (en) | 2021-07-12 | 2021-07-12 | Packaging plastic packaging equipment with peculiar smell removing function for integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110785017.2A CN113451180B (en) | 2021-07-12 | 2021-07-12 | Packaging plastic packaging equipment with peculiar smell removing function for integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113451180A true CN113451180A (en) | 2021-09-28 |
| CN113451180B CN113451180B (en) | 2022-09-02 |
Family
ID=77815898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110785017.2A Active CN113451180B (en) | 2021-07-12 | 2021-07-12 | Packaging plastic packaging equipment with peculiar smell removing function for integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113451180B (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090047104A1 (en) * | 2006-04-07 | 2009-02-19 | Hanmi Semiconductor Co., Ltd | Package handler |
| CN206716552U (en) * | 2017-05-11 | 2017-12-08 | 李文龙 | One kind processing stock surface automatic cleaning device |
| CN109192683A (en) * | 2018-09-10 | 2019-01-11 | 无锡豪帮高科股份有限公司 | A kind of MCM integrated antenna package production line merging SMT process |
| CN111923333A (en) * | 2020-06-06 | 2020-11-13 | 常世猛 | Runner waste material clearing mold after semiconductor component packaging and forming |
| CN111987020A (en) * | 2020-08-28 | 2020-11-24 | 菏泽景月装饰有限公司 | Semiconductor tube core packaging device |
| CN112071777A (en) * | 2020-08-17 | 2020-12-11 | 容泰半导体(江苏)有限公司 | Semiconductor packaging equipment |
| CN112289713A (en) * | 2020-10-31 | 2021-01-29 | 陈圆圆 | Multi-chip packaging device |
| CN212485295U (en) * | 2020-08-24 | 2021-02-05 | 深圳市兴光电子有限公司 | Integrated circuit packaging plastic package air draft device |
| CN112530844A (en) * | 2020-12-07 | 2021-03-19 | 湖南奕瀚电子科技有限公司 | Diode production is with encapsulation equipment that has dust removal mechanism |
| CN112635364A (en) * | 2020-12-21 | 2021-04-09 | 陈圆圆 | Semiconductor chip sealing device |
| CN112670208A (en) * | 2020-12-22 | 2021-04-16 | 江阴新基电子设备有限公司 | MGP mould encapsulation automation line |
| CN112864041A (en) * | 2019-11-27 | 2021-05-28 | 西安航思半导体有限公司 | Semiconductor device packaging apparatus |
-
2021
- 2021-07-12 CN CN202110785017.2A patent/CN113451180B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090047104A1 (en) * | 2006-04-07 | 2009-02-19 | Hanmi Semiconductor Co., Ltd | Package handler |
| CN206716552U (en) * | 2017-05-11 | 2017-12-08 | 李文龙 | One kind processing stock surface automatic cleaning device |
| CN109192683A (en) * | 2018-09-10 | 2019-01-11 | 无锡豪帮高科股份有限公司 | A kind of MCM integrated antenna package production line merging SMT process |
| CN112864041A (en) * | 2019-11-27 | 2021-05-28 | 西安航思半导体有限公司 | Semiconductor device packaging apparatus |
| CN111923333A (en) * | 2020-06-06 | 2020-11-13 | 常世猛 | Runner waste material clearing mold after semiconductor component packaging and forming |
| CN112071777A (en) * | 2020-08-17 | 2020-12-11 | 容泰半导体(江苏)有限公司 | Semiconductor packaging equipment |
| CN212485295U (en) * | 2020-08-24 | 2021-02-05 | 深圳市兴光电子有限公司 | Integrated circuit packaging plastic package air draft device |
| CN111987020A (en) * | 2020-08-28 | 2020-11-24 | 菏泽景月装饰有限公司 | Semiconductor tube core packaging device |
| CN112289713A (en) * | 2020-10-31 | 2021-01-29 | 陈圆圆 | Multi-chip packaging device |
| CN112530844A (en) * | 2020-12-07 | 2021-03-19 | 湖南奕瀚电子科技有限公司 | Diode production is with encapsulation equipment that has dust removal mechanism |
| CN112635364A (en) * | 2020-12-21 | 2021-04-09 | 陈圆圆 | Semiconductor chip sealing device |
| CN112670208A (en) * | 2020-12-22 | 2021-04-16 | 江阴新基电子设备有限公司 | MGP mould encapsulation automation line |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113451180B (en) | 2022-09-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113451180B (en) | Packaging plastic packaging equipment with peculiar smell removing function for integrated circuit | |
| CN112427359A (en) | Surface cleaning device before PCB circuit board test | |
| CN108711741A (en) | A kind of anticollision electric power cabinet of removable adjustable | |
| CN116884880B (en) | Large-chip packaging equipment and method for improving yield | |
| CN116544814A (en) | Multifunctional distribution box with adjustable clamping rail | |
| CN210246074U (en) | Power communication power cabinet efficient heat dissipation device | |
| CN117119699A (en) | Outer layer etching process for producing automobile circuit board | |
| CN109332065B (en) | Glue removing machine for semiconductor processing | |
| CN217474252U (en) | Cleaning device for mechanical electronic component | |
| CN212190377U (en) | Dust collector of many net gapes mainboard | |
| CN214931882U (en) | Combined circuit board plugboard frame | |
| CN211508392U (en) | Indoor metal-enclosed ring network type switch device | |
| CN211781593U (en) | Dustproof and moistureproof ventilating duct for base station communication machine room | |
| CN210295697U (en) | Vertical advertising machine cabinet | |
| CN208387136U (en) | A kind of moistureproof and waterproof type network cabinet | |
| CN114308764A (en) | Silicon-based plasma photoresist remover compatible with third-generation semiconductor material | |
| CN212310292U (en) | Recovery device for cooling, dewatering and removing residues of workpieces | |
| KR20070004079A (en) | Method and device for feeding encapsulating material to a mould cavity | |
| CN221009622U (en) | Outdoor type switching station | |
| CN114160701A (en) | Adjustable pulley rapid moulding demoulding device | |
| CN217443494U (en) | Integrated circuit test module | |
| CN211135426U (en) | Core making machine capable of preventing sand from flowing back through air bag | |
| CN110314451A (en) | A kind of automatic pressure-vaccum ash system for train air-conditioning filter gauze cleaning | |
| CN217239407U (en) | Chip etching equipment | |
| CN219458465U (en) | High-voltage outlet cabinet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |