CN113444352A - Low dielectric composite material and antenna assembly - Google Patents
Low dielectric composite material and antenna assembly Download PDFInfo
- Publication number
- CN113444352A CN113444352A CN202110699644.4A CN202110699644A CN113444352A CN 113444352 A CN113444352 A CN 113444352A CN 202110699644 A CN202110699644 A CN 202110699644A CN 113444352 A CN113444352 A CN 113444352A
- Authority
- CN
- China
- Prior art keywords
- temperature
- master batch
- section
- plastic master
- low dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 55
- 239000004594 Masterbatch (MB) Substances 0.000 claims abstract description 73
- 239000004033 plastic Substances 0.000 claims abstract description 73
- 229920003023 plastic Polymers 0.000 claims abstract description 73
- 239000000945 filler Substances 0.000 claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 229920001707 polybutylene terephthalate Polymers 0.000 claims abstract description 13
- -1 polybutylene terephthalate Polymers 0.000 claims abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 7
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 17
- 239000008187 granular material Substances 0.000 claims description 15
- 238000001746 injection moulding Methods 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 12
- 238000001125 extrusion Methods 0.000 claims description 10
- NXDJCCBHUGWQPG-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol;terephthalic acid Chemical compound OCC1CCC(CO)CC1.OC(=O)C1=CC=C(C(O)=O)C=C1 NXDJCCBHUGWQPG-UHFFFAOYSA-N 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 9
- 229960000892 attapulgite Drugs 0.000 claims description 7
- 239000004927 clay Substances 0.000 claims description 7
- 239000003365 glass fiber Substances 0.000 claims description 7
- 229910052625 palygorskite Inorganic materials 0.000 claims description 7
- 229920000515 polycarbonate Polymers 0.000 claims description 7
- 239000004417 polycarbonate Substances 0.000 claims description 7
- 238000001291 vacuum drying Methods 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 5
- 238000005303 weighing Methods 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 229920001955 polyphenylene ether Polymers 0.000 claims 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 10
- 229920006380 polyphenylene oxide Polymers 0.000 description 10
- 239000000843 powder Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000005469 granulation Methods 0.000 description 3
- 230000003179 granulation Effects 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
The invention provides a low dielectric composite material, which comprises a first plastic master batch, a second plastic master batch and a filler, wherein the mass ratio of the first plastic master batch to the second plastic master batch to the filler is (3-6): (4-7): 0.1, the first plastic master batch is one or the combination of two of poly 1, 4-cyclohexane dimethanol terephthalate or polybutylene terephthalate, and the low-dielectric composite material is prepared by mixing the first plastic master batch, the second plastic master batch and the filler. The invention also provides an antenna assembly. The low dielectric composite material provided by the invention has the advantages of high strength and high toughness, and has the advantages of lower dielectric constant, excellent electrical property, better heat resistance and weather resistance, simple manufacture, low price and high yield.
Description
Technical Field
The invention relates to the technical field of composite materials, in particular to a low dielectric composite material and an antenna assembly.
Background
The poly (1, 4-cyclohexanedimethanol terephthalate) (PCT for short) is a novel industrial polyester engineering plastic, the property of the poly (1, 4-cyclohexanedimethanol terephthalate) (PCT) is similar to that of polyethylene terephthalate (PET) and polybutylene terephthalate (PBT), and the PCT has good toughness, thermal stability, easy processability and chemical resistance and good dielectric property. PCT has higher heat resistance than PBT and PET.
However, the strength and toughness of the conventional PCT material are limited, which affects the application of PCT in the fields of wireless communication materials and the like, and cannot completely meet the use requirements for special application environments such as military industry, navigation, aviation and the like. The existing reinforcement technology for the PCT is simple, and the fiber-reinforced material of the PCT cannot completely meet the stable use in special application environments such as military industry, navigation, aviation and the like, so that the application is not wide, and the PCT has wide space for the development and application.
Disclosure of Invention
The invention aims to provide a low dielectric composite material, which aims to overcome the defects in the prior art, has the advantages of high strength and high toughness, has lower dielectric constant, excellent electrical property, better heat resistance and weather resistance, simple manufacture, low price, high yield and strong plasticity, and can realize industrial mass production.
The invention provides a low dielectric composite material, which comprises a first plastic master batch, a second plastic master batch and a filler, wherein the mass ratio of the first plastic master batch to the second plastic master batch to the filler is (3-6): (4-7): 0.1, the first plastic master batch is one or the combination of two of poly 1, 4-cyclohexane dimethanol terephthalate or polybutylene terephthalate, and the low-dielectric composite material is prepared by mixing the first plastic master batch, the second plastic master batch and the filler.
Further, the second plastic master batch is one or the combination of polycarbonate and polyphenyl ether.
Further, the filler is one or more of glass fiber, carbon fiber, attapulgite clay or boron nitride.
Further, the manufacturing method of the low dielectric composite material comprises the following steps:
weighing a certain amount of the first plastic master batch, the second plastic master batch and the filler in proportion, and placing the first plastic master batch, the second plastic master batch and the filler in a vacuum drying oven for drying for a period of time, wherein the temperature in the vacuum drying oven is a first temperature; after the drying is finished, stirring and uniformly mixing the first plastic master batch, the second plastic master batch and the filler by a stirrer to obtain a mixed material;
adding the blend into an extruder, and extruding and granulating the blend at a second temperature to obtain granules; and after the extrusion is finished, adding the granules into an injection molding machine, and carrying out injection molding on the granules at a third temperature to obtain the low dielectric composite material.
Further, the extruder comprises a machine head and a machine body, wherein the machine body is divided into a plurality of sections, and when the mixture is extruded and granulated, the temperatures of the machine head and the machine body in the sections are different.
Further, the machine body is divided into eight sections, the machine body comprises a first section, a second section, a third section, a fourth section, a fifth section, a sixth section, a seventh section and an eighth section which are sequentially arranged, the eight sections of the machine body are divided into four groups, every two adjacent sections form one group, the temperatures of the two sections in each group are the same, the temperatures of the four groups are gradually increased, and the temperature difference between every two adjacent groups is 5-10 ℃.
Further, the first plastic master batch is poly (1, 4-cyclohexanedimethanol terephthalate), the second plastic master batch is polycarbonate, the temperatures of the first section and the second section of the machine body are 230 ℃, the temperatures of the third section and the fourth section are 240 ℃, the temperatures of the fifth section and the sixth section are 250 ℃, the temperatures of the seventh section and the eighth section are 260 ℃, and the temperature of the machine head is 250 ℃.
Further, the first plastic master batch is poly (1, 4-cyclohexanedimethanol terephthalate), the second plastic master batch is polyphenylene oxide, the temperatures of the first section and the second section of the machine body are 260 ℃, the temperatures of the third section and the fourth section are 265 ℃, the temperatures of the fifth section and the sixth section are 270 ℃, the temperatures of the seventh section and the eighth section are 275 ℃, and the temperature of the machine head is 270 ℃.
Further, the second temperature is 230-280 ℃, and the third temperature is 270-285 ℃.
The invention also provides an antenna component which is made of the low dielectric composite material.
The low dielectric composite material provided by the invention takes the first plastic master batch as a raw material, the first plastic master batch is one or the combination of two of poly 1, 4-cyclohexane dimethanol terephthalate (PCT) or polybutylene terephthalate (PBT), the first plastic master batch can provide a good strength and toughness foundation, and the second plastic master batch can further enhance the strength and toughness of the composite material. The filler can not only improve the tensile strength of the composite material, but also reduce the cost (the unit price of the filler is generally lower).
The low dielectric composite material provided by the invention has the advantages of high strength and high toughness (higher tensile strength and cantilever beam notch impact strength), has lower dielectric constant, excellent electrical property, better heat resistance and weather resistance, can better adapt to various climates and environmental conditions, is simple to manufacture, low in price and high in yield, has very strong plasticity, and can realize industrial mass production. The low dielectric composite material is suitable for the technical field of communication, and is particularly suitable for being used as an antenna manufacturing material.
Drawings
FIG. 1 is a schematic diagram of a process for manufacturing a low dielectric composite material according to an embodiment of the invention.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
The terms of orientation, up, down, left, right, front, back, top, bottom, and the like (if any) referred to in the specification and claims of the present invention are defined by the positions of structures in the drawings and the positions of the structures relative to each other, only for the sake of clarity and convenience in describing the technical solutions. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims.
The low dielectric composite material provided by the embodiment of the invention comprises the following components in parts by mass: (4-7): 0.1. the first plastic master batch is one or the combination of two of poly 1, 4-cyclohexane dimethanol terephthalate (PCT) or polybutylene terephthalate (PBT), and the low dielectric composite material is prepared by mixing the first plastic master batch, the second plastic master batch and a filler.
Preferably, the first plastic masterbatch is PCT or a combination of PCT and PBT.
Specifically, the low dielectric composite material takes a first plastic master batch as a raw material, the first plastic master batch is one or a combination of two of poly (1, 4-cyclohexanedimethanol terephthalate) (PCT) and polybutylene terephthalate (PBT), the first plastic master batch can provide a good strength and toughness foundation, and the second plastic master batch can further enhance the strength and toughness of the composite material. The filler can not only improve the tensile strength of the composite material, but also reduce the cost (the unit price of the filler is generally lower).
Further, in this embodiment, the second plastic masterbatch is one or a combination of two of Polycarbonate (PC) or polyphenylene oxide (PPO). Of course, in other embodiments, other materials may be used for the second plastic masterbatch.
Further, in this embodiment, the filler is a combination of one or more of glass fiber, carbon fiber, attapulgite clay (attapulgite clay), or boron nitride. Of course, in other embodiments, other materials may be used for the filler.
Further, as shown in fig. 1, in this embodiment, the method for manufacturing the low dielectric composite material includes:
weighing a certain amount of first plastic master batch, a certain amount of second plastic master batch and a certain amount of filler in proportion, and placing the first plastic master batch, the certain amount of second plastic master batch and the certain amount of filler in a vacuum drying oven for drying for a period of time, wherein the temperature in the vacuum drying oven is a first temperature; after the drying is finished, stirring and uniformly mixing the first plastic master batch, the second plastic master batch and the filler by a stirrer to obtain a mixed material;
adding the blend into an extruder, and extruding and granulating the blend at a second temperature to obtain granules; and after the extrusion is finished, adding the granules into an injection molding machine, and carrying out injection molding on the granules at a third temperature to obtain the low dielectric composite material.
In the embodiment, the drying is performed in a vacuum drying oven at 70 to 80 ℃ for 3 to 4 hours, that is, the first temperature is 70 to 80 ℃.
In the present embodiment, the second temperature is 230 ℃ to 280 ℃. The third temperature is 270 ℃ to 285 ℃, preferably 280 ℃.
Specifically, in this embodiment, the extruder includes a head and a body, and the body is divided into a plurality of sections, and the temperatures set in the sections of the head and the body are different when the blend is extruded and pelletized.
In this embodiment, the machine body is divided into eight sections, the machine body includes a first section, a second section, a third section, a fourth section, a fifth section, a sixth section, a seventh section and an eighth section, which are sequentially arranged, the eight sections of the machine body are divided into four groups, each two adjacent sections are a group, the temperatures of the two sections in each group are the same, the temperatures of the four groups are gradually increased, and the temperature difference between each two adjacent groups is 5-10 ℃.
Specifically, the set temperature of the machine head and the machine body is greater than or equal to the melting temperature of the first plastic master batch, the second plastic master batch and the filler, and is less than the decomposition temperature of the first plastic master batch, the second plastic master batch and the filler. Meanwhile, the temperature of each group of the machine body is set to be increased step by step, so that the blend is cooled and formed more quickly during extrusion, and the production speed is increased.
In particular, the temperature of the sections of the fuselage can be set selectively according to the type of material. When the first plastic master batch is poly (1, 4-cyclohexanedimethanol terephthalate) and the second plastic master batch is polycarbonate, the temperature of the first section and the second section of the machine body is 230 ℃, the temperature of the third section and the fourth section is 240 ℃, the temperature of the fifth section and the sixth section is 250 ℃, the temperature of the seventh section and the eighth section is 260 ℃, and the temperature of the machine head is 250 ℃.
When the first plastic master batch is poly (1, 4-cyclohexanedimethanol terephthalate) and the second plastic master batch is polyphenylene oxide, the temperature of the first section and the second section of the machine body is 260 ℃, the temperature of the third section and the fourth section is 265 ℃, the temperature of the fifth section and the sixth section is 270 ℃, the temperature of the seventh section and the eighth section is 275 ℃, and the temperature of the machine head is 270 ℃.
The embodiment of the invention also provides an antenna component which is made of the low dielectric composite material.
The low dielectric composite material provided by the embodiment has the advantages that:
1. the first plastic master batch, the second plastic master batch and the filler are added in proportion to obtain a novel low dielectric composite material, and the low dielectric composite material not only has the advantages of high strength and high toughness (higher tensile strength and higher cantilever beam notch impact strength), but also has lower dielectric constant, excellent electrical property and better heat resistance and weather resistance, and can better adapt to various different climates and environmental conditions;
2. the low dielectric composite material has the advantages of simple manufacturing process, low requirement on equipment and low price. The raw materials of the low dielectric composite material are easy to obtain and low in price, wherein the filler can improve the tensile strength of the composite material and reduce the cost (the unit price of the filler is generally low);
3. the low dielectric composite material has strong plasticity, and the addition proportion of raw materials of each part can be flexibly controlled according to actual requirements so as to obtain the low dielectric composite materials with different performances.
The low dielectric composite material provided by the embodiment has the advantages of high strength and high toughness, and is lower in dielectric constant, excellent in electrical property, better in heat resistance and weather resistance, capable of better adapting to various climates and environmental conditions, simple to manufacture, low in price, high in yield, very strong in plasticity and capable of realizing industrial mass production. The low dielectric composite material is suitable for the technical field of communication, and is particularly suitable for being used as an antenna manufacturing material.
Example one:
300g, 700g and 30g of PCT, PC and glass fiber powder are respectively weighed, dried in a vacuum drier and stirred by a stirrer to be uniformly mixed. After the materials are uniformly mixed, the materials are added into an extruder which is cleaned and preheated for extrusion granulation, wherein the first section and the second section of the extruder bodyThe temperature of the second section is 230 ℃, the temperature of the third section and the fourth section is 240 ℃, the temperature of the fifth section and the sixth section is 250 ℃, the temperature of the seventh section and the eighth section is 260 ℃, and the temperature of the machine head is 250 ℃. After the extrusion is finished, adding the granules into a cleaned and preheated injection molding machine, and performing injection molding on the granules at 280 ℃ to obtain the low dielectric composite material. The finished product is subjected to performance test, and the tensile strength is 85Mpa, and the notched impact strength of the cantilever beam is 60kJ/m2The dielectric constant was 2.85.
Example two:
respectively weighing 300g, 700g and 30g of PCT, PPO and glass fiber powder, drying the PCT, PPO and glass fiber powder in a vacuum dryer, and stirring by a stirrer to uniformly mix the PCT, PPO and glass fiber powder. After the materials are uniformly mixed, the materials are added into an extruder which is cleaned and preheated for extrusion granulation, wherein the temperature of the first section and the second section of the machine body is 260 ℃, the temperature of the third section and the fourth section is 265 ℃, the temperature of the fifth section and the sixth section is 270 ℃, the temperature of the seventh section and the eighth section is 275 ℃, and the temperature of the machine head is 270 ℃. After the extrusion is finished, adding the granules into a cleaned and preheated injection molding machine, and performing injection molding on the granules at 280 ℃ to obtain the low dielectric composite material. The finished product is subjected to performance test, and the tensile strength is measured to be 98Mpa, and the notched impact strength of the cantilever beam is measured to be 72kJ/m2The dielectric constant was 3.02.
Example three:
respectively weighing 300g, 700g and 30g of PCT, PPO and attapulgite clay, drying the PCT, PPO and attapulgite clay in a vacuum dryer, and stirring by a stirrer to uniformly mix the PCT, PPO and attapulgite clay. After the materials are uniformly mixed, the materials are added into an extruder which is cleaned and preheated for extrusion granulation, wherein the temperature of the first section and the second section of the machine body is 260 ℃, the temperature of the third section and the fourth section is 265 ℃, the temperature of the fifth section and the sixth section is 270 ℃, the temperature of the seventh section and the eighth section is 275 ℃, and the temperature of the machine head is 270 ℃. After the extrusion is finished, adding the granules into a cleaned and preheated injection molding machine, and performing injection molding on the granules at 280 ℃ to obtain the low dielectric composite material. The finished product is subjected to performance test to obtainThe tensile strength is 90Mpa, the notch impact strength of the cantilever beam is 65kJ/m2The dielectric constant was 2.92.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. The low dielectric composite material is characterized in that the composition materials of the low dielectric composite material comprise a first plastic master batch, a second plastic master batch and a filler, and the mass ratio of the first plastic master batch to the second plastic master batch to the filler is (3-6): (4-7): 0.1, the first plastic master batch is one or the combination of two of poly 1, 4-cyclohexane dimethanol terephthalate or polybutylene terephthalate, and the low-dielectric composite material is prepared by mixing the first plastic master batch, the second plastic master batch and the filler.
2. The low dielectric composite of claim 1, wherein the second plastic masterbatch is one or a combination of polycarbonate and polyphenylene ether.
3. The low dielectric composite of claim 1, wherein the filler is a combination of one or more of glass fiber, carbon fiber, attapulgite clay, or boron nitride.
4. The low dielectric composite of any of claims 1-3, wherein the method of making the low dielectric composite comprises:
weighing a certain amount of the first plastic master batch, the second plastic master batch and the filler in proportion, and placing the first plastic master batch, the second plastic master batch and the filler in a vacuum drying oven for drying for a period of time, wherein the temperature in the vacuum drying oven is a first temperature; after the drying is finished, stirring and uniformly mixing the first plastic master batch, the second plastic master batch and the filler by a stirrer to obtain a mixed material;
adding the blend into an extruder, and extruding and granulating the blend at a second temperature to obtain granules; and after the extrusion is finished, adding the granules into an injection molding machine, and carrying out injection molding on the granules at a third temperature to obtain the low dielectric composite material.
5. The low dielectric composite of claim 4, wherein the extruder comprises a head and a body, the body is divided into multiple sections, and the temperature of each section of the head and the body is set to be different when the blend is extruded and pelletized.
6. The low dielectric composite material of claim 5, wherein the body is divided into eight sections, the body includes a first section, a second section, a third section, a fourth section, a fifth section, a sixth section, a seventh section, and an eighth section, which are sequentially disposed, the eight sections of the body are divided into four groups, each two adjacent sections are one group, the temperatures of the two sections in each group are the same, the temperatures of the four groups are increased step by step, and the temperature difference between each two adjacent groups is 5 ℃ to 10 ℃.
7. The low dielectric composite of claim 6, wherein the first plastic masterbatch is poly 1, 4-cyclohexanedimethanol terephthalate, the second plastic masterbatch is polycarbonate, the first and second sections of the body have a temperature of 230 ℃, the third and fourth sections have a temperature of 240 ℃, the fifth and sixth sections have a temperature of 250 ℃, the seventh and eighth sections have a temperature of 260 ℃, and the head has a temperature of 250 ℃.
8. The low dielectric composite of claim 6, wherein the first plastic masterbatch is poly 1, 4-cyclohexanedimethanol terephthalate, the second plastic masterbatch is polyphenylene ether, the first and second sections of the body have a temperature of 260 ℃, the third and fourth sections have a temperature of 265 ℃, the fifth and sixth sections have a temperature of 270 ℃, the seventh and eighth sections have a temperature of 275 ℃, and the head has a temperature of 270 ℃.
9. The low dielectric composite of claim 4, wherein the second temperature is 230 ℃ to 280 ℃ and the third temperature is 270 ℃ to 285 ℃.
10. An antenna assembly, characterized in that the antenna assembly is made of the low dielectric composite material according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110699644.4A CN113444352A (en) | 2021-06-23 | 2021-06-23 | Low dielectric composite material and antenna assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110699644.4A CN113444352A (en) | 2021-06-23 | 2021-06-23 | Low dielectric composite material and antenna assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113444352A true CN113444352A (en) | 2021-09-28 |
Family
ID=77812348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110699644.4A Pending CN113444352A (en) | 2021-06-23 | 2021-06-23 | Low dielectric composite material and antenna assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113444352A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103865246A (en) * | 2012-12-14 | 2014-06-18 | 苏州汉扬精密电子有限公司 | Glass fiber reinforced resin composition |
| CN104927316A (en) * | 2015-06-26 | 2015-09-23 | 苏州云舒新材料科技有限公司 | Highly heat-resistant composite and preparation method thereof |
| CN109575528A (en) * | 2018-10-22 | 2019-04-05 | 广东圆融新材料有限公司 | Low dielectric high tenacity enhancing PBT/PPO composition and preparation method thereof |
| CN111073230A (en) * | 2019-12-27 | 2020-04-28 | 会通新材料股份有限公司 | Low-dielectric-constant PC/PBT alloy material and preparation method thereof |
-
2021
- 2021-06-23 CN CN202110699644.4A patent/CN113444352A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103865246A (en) * | 2012-12-14 | 2014-06-18 | 苏州汉扬精密电子有限公司 | Glass fiber reinforced resin composition |
| CN104927316A (en) * | 2015-06-26 | 2015-09-23 | 苏州云舒新材料科技有限公司 | Highly heat-resistant composite and preparation method thereof |
| CN109575528A (en) * | 2018-10-22 | 2019-04-05 | 广东圆融新材料有限公司 | Low dielectric high tenacity enhancing PBT/PPO composition and preparation method thereof |
| CN111073230A (en) * | 2019-12-27 | 2020-04-28 | 会通新材料股份有限公司 | Low-dielectric-constant PC/PBT alloy material and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109096725B (en) | Lightweight PC/ABS weight-reducing composite material and preparation method thereof | |
| CN102344654B (en) | Hydrolysis resistant PET composite material and preparation method thereof | |
| CN101402776B (en) | Electroconductive plastics and method of producing the same | |
| CN103450631B (en) | Polyether-ether-ketone cable material and preparation method thereof | |
| CN103044837B (en) | HIPS composite, its preparation method and application | |
| CN113121962B (en) | Polytetrafluoroethylene/liquid crystal polymer composite material and preparation method thereof | |
| CN109503969B (en) | Efficient enhanced flame-retardant heat-conducting shading multifunctional master batch for direct injection molding of nylon and preparation method thereof | |
| CN111154241A (en) | Reinforced flame-retardant low-warpage PBT (polybutylene terephthalate) composite material and preparation method thereof | |
| CN102108181A (en) | Thermoplastic alloy and preparation method thereof | |
| CN109535701B (en) | Efficient enhanced flame-retardant functional master batch for direct injection molding of nylon 6 and preparation method thereof | |
| CN109504078B (en) | Efficient enhanced halogen-free flame-retardant heat-conducting shading multifunctional master batch for direct injection molding of nylon resin and preparation method thereof | |
| CN103351617A (en) | Environment-friendly, flame-retardant and high-impact-resistance PA6/PC/PPO (polyamide 6/polycarbonate/poly-p-phenylene oxide) alloy compound and preparation method for same | |
| CN101555348B (en) | Composite material of polycarylene ether nitrile fiberglass and preparation method thereof | |
| CN113604038B (en) | Ultrahigh-flow high-impact PPO/PA66 alloy material and preparation method thereof | |
| CN104845127A (en) | Halogen-free flame-retardant modified PET/PTT/TPEE composite material | |
| CN113444352A (en) | Low dielectric composite material and antenna assembly | |
| CN105504795A (en) | Heat-resistant and hydrolysis-resistant reinforced nylon composite material and preparation method thereof | |
| CN102140236B (en) | Calcium sulfate whisker modified polyester composite material and preparation process thereof | |
| CN104151789A (en) | Low-warping high voltage resistance PBT modified material and preparation method thereof | |
| CN110054892A (en) | A kind of fire-retardant enhancing PPA/PPO material of high-rigidity and low-warpage and preparation method thereof | |
| CN113930069B (en) | High-melt-strength polyamide particles with high crosslinking degree, and preparation method and application thereof | |
| CN109438905A (en) | A kind of ABS quaternary blending modified material and preparation method thereof | |
| CN102311579A (en) | Antistatic polypropylene material and preparation method and application thereof | |
| CN113736250A (en) | PES filter material return material and nylon 66 alloy and preparation method thereof | |
| CN109486154B (en) | Efficient halogen-free enhanced flame-retardant functional master batch for direct injection molding of PC-ABS (polycarbonate-acrylonitrile butadiene styrene) alloy and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210928 |
|
| RJ01 | Rejection of invention patent application after publication |