CN113436805A - Preparation method and application of low-silver aqueous conductive silver paste - Google Patents
Preparation method and application of low-silver aqueous conductive silver paste Download PDFInfo
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- CN113436805A CN113436805A CN202110472371.XA CN202110472371A CN113436805A CN 113436805 A CN113436805 A CN 113436805A CN 202110472371 A CN202110472371 A CN 202110472371A CN 113436805 A CN113436805 A CN 113436805A
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- silver paste
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 79
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 26
- 239000004332 silver Substances 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000002002 slurry Substances 0.000 claims abstract description 29
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000843 powder Substances 0.000 claims abstract description 21
- 238000000498 ball milling Methods 0.000 claims abstract description 20
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 19
- 239000002270 dispersing agent Substances 0.000 claims abstract description 18
- 239000006185 dispersion Substances 0.000 claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 10
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 8
- 239000011230 binding agent Substances 0.000 claims abstract description 7
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000011888 foil Substances 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 16
- 239000000839 emulsion Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 10
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 10
- 229920001225 polyester resin Polymers 0.000 claims description 9
- 239000004645 polyester resin Substances 0.000 claims description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 7
- 229910021389 graphene Inorganic materials 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- -1 sulfate ester salt Chemical class 0.000 claims description 7
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 6
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 5
- 239000002041 carbon nanotube Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000003945 anionic surfactant Substances 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 150000007942 carboxylates Chemical class 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229920001909 styrene-acrylic polymer Polymers 0.000 claims description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 3
- 229920000142 Sodium polycarboxylate Polymers 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical class [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 abstract description 7
- 239000002131 composite material Substances 0.000 abstract description 3
- 230000036541 health Effects 0.000 abstract description 3
- 229920002799 BoPET Polymers 0.000 abstract 1
- 238000005303 weighing Methods 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- NJVOHKFLBKQLIZ-UHFFFAOYSA-N (2-ethenylphenyl) prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1C=C NJVOHKFLBKQLIZ-UHFFFAOYSA-N 0.000 description 2
- 239000013530 defoamer Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 159000000000 sodium salts Chemical class 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920002125 Sokalan® Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- ZHPNWZCWUUJAJC-UHFFFAOYSA-N fluorosilicon Chemical compound [Si]F ZHPNWZCWUUJAJC-UHFFFAOYSA-N 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021392 nanocarbon Inorganic materials 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920005646 polycarboxylate Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
Abstract
The invention discloses a preparation method and application of low-silver aqueous conductive silver paste, wherein the preparation method comprises the steps of respectively adding a binder, a defoaming agent, a dispersing agent and nonmetal conductive powder into a ball milling tank according to a proportion, and carrying out ball milling for a period of time to obtain a dispersion liquid; adding silver powder into the dispersion liquid for dispersion to obtain slurry; taking out the obtained slurry, and defoaming to obtain conductive silver paste; the prepared low-silver aqueous conductive silver paste is applied to a PET film, a PI film, an aluminum foil or other film materials to form a stably attached conductive circuit layer or conductive film layer. Through the mode, the silver powder and the carbon-based powder are compounded, so that the silver powder can be effectively prevented from settling, and meanwhile, the silver powder is contacted with the silver powder to form a conductive path so as to improve the conductivity; meanwhile, the usage amount of the silver powder is reduced, so that the material cost of the slurry is reduced; the water-soluble adhesive is adopted, so that the pollution to the environment is avoided, and the health of workers is not harmed. The composite material has excellent conductivity, flexibility and humidity resistance when being applied to a film material.
Description
Technical Field
The invention relates to low-silver aqueous conductive silver paste, a preparation method and application.
Background
The conventional conductive paste is mostly solvent-based, the resin is usually dissolved by an organic solvent, silver powder is added into the resin solution, and an auxiliary agent forms the conductive paste, so that a large amount of silver powder (more than 50% by mass) is usually added to achieve good conductivity, the cost is high, and the organic solvent mostly has pungent odor and certain toxicity, and is not environment-friendly. With the improvement of environmental protection consciousness of people, the research of the environment-friendly water-based conductive paste is valued by people.
Disclosure of Invention
The invention mainly solves the technical problem of providing the low-silver aqueous conductive silver paste, the preparation method and the application thereof, and the silver powder content in the conductive silver paste can be reduced by compounding the silver powder and the conductive powder; the aqueous system is used to solve the problem of environmental pollution caused by volatilization of the common silver paste solvent.
In order to solve the technical problems, the invention adopts a technical scheme that: the preparation method of the low-silver aqueous conductive silver paste comprises the following steps:
(1) respectively adding the binder, the defoaming agent, the dispersing agent and the nonmetal conductive powder into a ball milling tank according to the proportion, and carrying out ball milling for a period of time to obtain a dispersion liquid;
(2) adding silver powder into the dispersion liquid obtained in the step (1) for dispersion to obtain slurry;
(3) and (3) taking out the slurry obtained in the step (2), and defoaming to obtain the conductive silver paste.
In a preferred embodiment of the present invention, in the step (1), the rotation speed of the ball milling is 200RPM to 600RPM, and the ball milling time is 60min to 180 min.
In a preferred embodiment of the present invention, a three-roll mill is used for the dispersion in step (2).
In a preferred embodiment of the present invention, the defoaming in step (3) is performed by a vacuum mixing defoaming machine.
In a preferred embodiment of the present invention, the conductive silver paste comprises the following components by mass:
adhesive: 40-70 percent of the total weight of the mixture,
silver powder: 29 to 50 percent of the total weight of the mixture,
non-metal conductive powder: 0.5-20 percent of the total weight of the mixture,
dispersing agent: 0.05 to 3 percent of the total weight of the mixture,
defoaming agent: 0.1 to 5 percent.
In a preferred embodiment of the invention, the binder is one or a mixture of two of water-based polyester resin emulsion and water-based styrene-acrylic emulsion.
In a preferred embodiment of the present invention, the non-metallic conductive powder includes one or more of graphene powder, conductive carbon powder, graphite powder and carbon nanotubes.
In a preferred embodiment of the present invention, the dispersant comprises one or more of a high molecular polymer containing a pigment affinity group, a carboxylate, a sulfate ester salt, a sulfonate, an aqueous solution of a sodium polyacrylate salt, and an anionic surfactant of a sodium polycarboxylate salt.
In a preferred embodiment of the present invention, the defoaming agent comprises one or more of a modified organopolysiloxane compound, isopropyl alcohol, butyl alcohol, a polyether defoaming agent, and an organofluorosilicone compound.
In order to solve the technical problem, the invention adopts another technical scheme that: the application of the low-silver aqueous conductive silver paste prepared by the method is applied to a PET (polyethylene terephthalate) film, a PI (polyimide) film, an aluminum foil or other film materials, and is solidified to form a stably attached conductive circuit layer or conductive film layer.
The invention has the beneficial effects that: according to the invention, the silver powder and the carbon-based powder are compounded, the carbon-based powder is light in weight and large in specific surface area, the silver powder can be effectively prevented from settling after being compounded with the silver powder in the slurry, and meanwhile, the carbon-based powder and the silver powder are contacted with each other to form a conductive path so as to improve the conductivity; meanwhile, the usage amount of the silver powder is reduced, so that the material cost of the slurry is reduced; the water-soluble adhesive is adopted, so that the pollution to the environment is avoided, and the health of workers is not harmed. The composite material has excellent conductivity, flexibility and humidity resistance when being applied to a film material, and can be widely applied to the fields of printed circuits, electromagnetic shielding and the like.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. The components of embodiments of the present invention that are generally shown herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "front" and "back" are used for indicating the conventional positions or positional relationships of the products, and are only used for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the devices or elements to be referred must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, the first feature may be present on or under the second feature in direct contact with the first and second feature, or may be present in the first and second feature not in direct contact but in contact with another feature between them. Also, the first feature being above, on or above the second feature includes the first feature being directly above and obliquely above the second feature, or merely means that the first feature is at a higher level than the second feature. A first feature that underlies, and underlies a second feature includes a first feature that is directly under and obliquely under a second feature, or simply means that the first feature is at a lesser level than the second feature.
The embodiment of the invention comprises the following steps:
a preparation method of low-silver aqueous conductive silver paste comprises the following steps:
(1) respectively adding the binder, the defoaming agent, the dispersing agent and the nonmetal conductive powder into a ball milling tank according to a proportion, and performing ball milling for 60-180 min at a rotating speed of 200-600 RPM to obtain a dispersion liquid;
(2) adding silver powder into the dispersion liquid obtained in the step (1), and dispersing by using a three-roll grinder to obtain slurry;
(3) and (3) taking out the slurry obtained in the step (2), and defoaming by adopting a vacuum mixing defoaming machine to obtain the conductive silver paste.
The conductive silver paste comprises the following components in percentage by mass:
adhesive: 40-70 percent of the total weight of the mixture,
silver powder: 29 to 50 percent of the total weight of the mixture,
non-metal conductive powder: 0.5-20 percent of the total weight of the mixture,
dispersing agent: 0.05 to 3 percent of the total weight of the mixture,
defoaming agent: 0.1 to 5 percent.
The binder is one or a mixture of water-based polyester resin emulsion and water-based styrene-acrylic emulsion.
The nonmetal conductive powder comprises one or more of graphene powder, conductive carbon powder, graphite powder and carbon nano tubes.
The dispersing agent comprises one or more of high molecular polymer containing pigment affinity group, carboxylate, sulfate ester salt, sulfonate, polyacrylic acid sodium salt aqueous solution and polycarboxylate sodium salt anionic surfactant.
The defoaming agent comprises one or more of modified organic polysiloxane compound, isopropanol, butanol, polyether defoaming agent and organic fluorine silicon compound.
The invention also relates to application of the low-silver aqueous conductive silver paste, which is prepared by the method and is applied to a PET (polyethylene terephthalate) film, a PI (polyimide) film, an aluminum foil or other film materials through technologies such as screen printing, gravure printing, steel plate printing, surface smearing and the like, and is cured at the temperature of 80-120 ℃ to form a stably attached conductive circuit layer or conductive film layer.
Example 1:
the formula table of the conductive silver paste is as follows:
| name of raw materials | Mass/g | Mass fraction/% |
| Graphene (Single layer) | 0.2g | 1.22% |
| Styrene-acrylate emulsion (30% solid content) | 10g | 60.97% |
| Defoaming agent (organic siloxane) | 0.1g | 0.61% |
| Dispersing agents (Polymer series) | 0.1g | 0.61% |
| Silver powder | 6g | 36.59% |
A preparation method of low-silver aqueous conductive silver paste comprises the following steps:
1. 20g of styrene-acrylate emulsion, 0.4g of graphene, 0.2g of defoamer and 0.2g of dispersant are weighed and added into a ball milling tank for ball milling for 60min at 500 RPM.
2. And (3) weighing 6g of silver powder, adding the silver powder into 10.4g of the dispersion liquid obtained in the step (1), and grinding and dispersing the silver powder by using a three-roller machine until the particle size is less than 5 um.
3. And (3) taking out the slurry obtained in the step (2), and defoaming the slurry through a vacuum mixing defoaming machine to obtain the aqueous conductive slurry.
The obtained conductive slurry has the viscosity of 12000 mPas, is coated on a PET substrate, is dried and cured for 30 minutes at 100 ℃ and then is completely dried, and the thickness of the tested film is 15 mu m, and the resistivity is 0.5m omega cm. The adhesive force is tested by a 3M adhesive tape, and the adhesive force does not fall off.
Example 2: the formula table of the conductive silver paste is as follows:
| name of raw materials | Mass/g | Mass fraction/% |
| Graphene (Single layer) | 0.2g | 1.22% |
| Water-based polyester resin emulsion (30% solid content) | 10g | 60.97% |
| Defoaming agent (organic siloxane) | 0.1g | 0.61% |
| Dispersing agents (Polymer series) | 0.1g | 0.61% |
| Silver powder | 6g | 36.59% |
A preparation method of low-silver aqueous conductive silver paste comprises the following steps:
1. 20g of the aqueous polyester resin emulsion, 0.4g of graphene, 0.2g of defoamer and 0.2g of dispersant are weighed and added into a ball milling tank for ball milling for 60min at 500 RPM.
2. And (3) weighing 6g of silver powder, adding the silver powder into 10.4g of the dispersion liquid obtained in the step (1), and grinding and dispersing the silver powder by using a three-roller machine until the particle size is less than 5 um.
3. And (3) taking out the slurry obtained in the step (2), and defoaming the slurry through a vacuum mixing defoaming machine to obtain the aqueous conductive slurry.
The viscosity of the obtained conductive slurry is 11000 mPas, a film is coated on a PET substrate, the film is completely dried after being dried and cured for 30 minutes at 100 ℃, the thickness of the film is 15 mu m through testing, and the resistivity is 0.3m omega cm. The adhesive force is tested by a 3M adhesive tape, and the adhesive force does not fall off.
Example 3: the formula table of the conductive silver paste is as follows:
| name of raw materials | Mass/g | Mass fraction/% |
| Carbon nanotubes (Multi-wall) | 0.2g | 1.22% |
| Water-based polyester resin emulsion (30% solid content) | 10g | 60.97% |
| Defoaming agent (organic siloxane) | 0.1g | 0.61% |
| Dispersing agents (Polymer series) | 0.1g | 0.61% |
| Silver powder | 6g | 36.59% |
A preparation method of low-silver aqueous conductive silver paste comprises the following steps:
1. 20g of the aqueous polyester resin emulsion, 0.4g of the carbon nano tube, 0.2g of the antifoaming agent and 0.2g of the dispersing agent are weighed and added into a ball milling tank for ball milling for 60min at 500 RPM.
2. And (3) weighing 6g of silver powder, adding the silver powder into 10.4g of the dispersion liquid obtained in the step (1), and grinding and dispersing the silver powder by using a three-roller machine until the particle size is less than 5 um.
3. And (3) taking out the slurry obtained in the step (2), and defoaming the slurry through a vacuum mixing defoaming machine to obtain the aqueous conductive slurry.
The obtained conductive slurry has viscosity of 10000 mPas, is coated on a PET substrate, is dried and cured for 30 minutes at 100 ℃ and then is completely dried, and the thickness of the film is 15 mu m and the resistivity is 0.5m omega cm after being tested. The adhesive force is tested by a 3M adhesive tape, and the adhesive force does not fall off.
Example 4: the formula table of the conductive silver paste is as follows:
| name of raw materials | Mass/g | Mass fraction/% |
| Nano conductive carbon powder | 1g | 5.81% |
| Water-based polyester resin emulsion (30% solid content) | 10g | 58.14% |
| Defoaming agent (organic siloxane) | 0.1g | 0.58% |
| Dispersing agents (Polymer series) | 0.1g | 0.58% |
| Silver powder | 6g | 34.89% |
A preparation method of low-silver aqueous conductive silver paste comprises the following steps:
1. weighing 20g of water-based polyester resin emulsion, 2g of nano carbon powder, 0.2g of defoaming agent and 0.2g of dispersing agent, and adding the mixture into a ball milling tank to perform ball milling for 60min at 500 RPM.
2. And (3) weighing 6g of silver powder, adding the silver powder into 10.4g of the dispersion liquid obtained in the step (1), and grinding and dispersing the silver powder by using a three-roller machine until the particle size is less than 5 um.
3. And (3) taking out the slurry obtained in the step (2), and defoaming the slurry through a vacuum mixing defoaming machine to obtain the aqueous conductive slurry.
The obtained conductive slurry has viscosity of 10000 mPas, is coated on a PET substrate, is dried and cured for 30 minutes at 100 ℃ and then is completely dried, and the thickness of the film is 15 mu m and the resistivity is 0.7m omega cm after being tested. The adhesive force is tested by a 3M adhesive tape, and the adhesive force does not fall off.
In conclusion, the silver powder and the carbon-based powder are compounded, the carbon-based powder is light in weight and large in specific surface area, the silver powder can be effectively prevented from settling after being compounded in the slurry, and meanwhile, the carbon-based powder and the silver powder are contacted with each other to form a conductive path so as to improve the conductivity; meanwhile, the usage amount of the silver powder is reduced, so that the material cost of the slurry is reduced; the water-soluble adhesive is adopted, so that the pollution to the environment is avoided, and the health of workers is not harmed. The composite material has excellent conductivity, flexibility and humidity resistance when being applied to a film material, and can be widely applied to the fields of printed circuits, electromagnetic shielding and the like.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The preparation method of the low-silver aqueous conductive silver paste is characterized by comprising the following steps of:
(1) respectively adding the binder, the defoaming agent, the dispersing agent and the nonmetal conductive powder into a ball milling tank according to the proportion, and carrying out ball milling for a period of time to obtain a dispersion liquid;
(2) adding silver powder into the dispersion liquid obtained in the step (1) for dispersion to obtain slurry;
(3) and (3) taking out the slurry obtained in the step (2), and defoaming to obtain the conductive silver paste.
2. The preparation method of the low-silver aqueous conductive silver paste as claimed in claim 1, wherein in the step (1), the rotation speed of the ball milling is 200RPM to 600RPM, and the ball milling time is 60min to 180 min.
3. The method for preparing the low-silver aqueous conductive silver paste according to claim 1, wherein a three-roll mill is used for dispersing in the step (2).
4. The method for preparing the low-silver aqueous conductive silver paste according to claim 1, wherein the defoaming in the step (3) is performed by using a vacuum mixing and defoaming machine.
5. The method for preparing the low-silver aqueous conductive silver paste according to claim 1, wherein the conductive silver paste comprises the following components in percentage by mass:
adhesive: 40-70 percent of the total weight of the mixture,
silver powder: 29 to 50 percent of the total weight of the mixture,
non-metal conductive powder: 0.5-20 percent of the total weight of the mixture,
dispersing agent: 0.05 to 3 percent of the total weight of the mixture,
defoaming agent: 0.1 to 5 percent.
6. The method for preparing the low-silver aqueous conductive silver paste according to claim 5, wherein the binder is one or a mixture of two of a water-based polyester resin emulsion and a water-based styrene-acrylic emulsion.
7. The method for preparing the low-silver aqueous conductive silver paste according to claim 5, wherein the non-metallic conductive powder comprises one or more of graphene powder, conductive carbon powder, graphite powder and carbon nanotubes.
8. The method for preparing low-silver aqueous conductive silver paste according to claim 5, wherein the dispersant comprises one or more of a high molecular polymer containing a pigment affinity group, a carboxylate, a sulfate ester salt, a sulfonate, an aqueous solution of sodium polyacrylate salt, and an anionic surfactant of sodium polycarboxylate salt.
9. The method for preparing the low-silver aqueous conductive silver paste according to claim 5, wherein the defoaming agent comprises one or more of a modified organopolysiloxane compound, isopropanol, butanol, a polyether defoaming agent, and an organofluorosilicone compound.
10. The application of the low-silver aqueous conductive silver paste prepared by the method of any one of claims 1 to 9 is characterized in that the low-silver aqueous conductive silver paste prepared by the method of any one of claims 1 to 9 is applied to a PET (polyethylene terephthalate) film, a PI (polyimide) film, an aluminum foil or other film materials to form a conductive circuit layer or a conductive film layer which is stably attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110472371.XA CN113436805A (en) | 2021-04-29 | 2021-04-29 | Preparation method and application of low-silver aqueous conductive silver paste |
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| CN101624491A (en) * | 2008-07-07 | 2010-01-13 | 鹤山雅图仕印刷有限公司 | Water-based driography electrically conductive ink and preparation method thereof |
| CN107129752A (en) * | 2017-06-29 | 2017-09-05 | 合肥微晶材料科技有限公司 | A kind of graphene nano silver wire composite mortar and preparation method thereof |
| CN110054937A (en) * | 2018-01-19 | 2019-07-26 | 上海宝银电子材料有限公司 | A kind of stretch-proof water-soluble conducting ink and preparation method thereof |
| CN110511609A (en) * | 2019-09-26 | 2019-11-29 | 威海云山科技有限公司 | Aqueous self limiting temperature fever ink of a kind of graphene and preparation method thereof and the application in heating film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101624491A (en) * | 2008-07-07 | 2010-01-13 | 鹤山雅图仕印刷有限公司 | Water-based driography electrically conductive ink and preparation method thereof |
| CN107129752A (en) * | 2017-06-29 | 2017-09-05 | 合肥微晶材料科技有限公司 | A kind of graphene nano silver wire composite mortar and preparation method thereof |
| CN110054937A (en) * | 2018-01-19 | 2019-07-26 | 上海宝银电子材料有限公司 | A kind of stretch-proof water-soluble conducting ink and preparation method thereof |
| CN110511609A (en) * | 2019-09-26 | 2019-11-29 | 威海云山科技有限公司 | Aqueous self limiting temperature fever ink of a kind of graphene and preparation method thereof and the application in heating film |
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