CN113427853A - Aluminum-plastic composite back plate and application thereof - Google Patents

Aluminum-plastic composite back plate and application thereof Download PDF

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Publication number
CN113427853A
CN113427853A CN202110749289.7A CN202110749289A CN113427853A CN 113427853 A CN113427853 A CN 113427853A CN 202110749289 A CN202110749289 A CN 202110749289A CN 113427853 A CN113427853 A CN 113427853A
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China
Prior art keywords
aluminum
percent
aluminum alloy
layer
plastic composite
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Pending
Application number
CN202110749289.7A
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Chinese (zh)
Inventor
杜作政
邢锦
罗奕桢
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DONGGUAN WALLTES DECORATIVE MATERIAL CO LTD
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DONGGUAN WALLTES DECORATIVE MATERIAL CO LTD
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Priority to CN202110749289.7A priority Critical patent/CN113427853A/en
Publication of CN113427853A publication Critical patent/CN113427853A/en
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/02—Layer formed of wires, e.g. mesh
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    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
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    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
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    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
    • C21D8/06—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of rods or wires
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C22C1/026—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/06—Making non-ferrous alloys with the use of special agents for refining or deoxidising
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/12—Alloys based on aluminium with copper as the next major constituent
    • C22C21/16—Alloys based on aluminium with copper as the next major constituent with magnesium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/002—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working by rapid cooling or quenching; cooling agents used therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/057—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with copper as the next major constituent
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
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    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to the technical field of heat dissipation type composite boards, in particular to an aluminum-plastic composite back plate and an application thereof. The aluminum-plastic composite back plate has good heat dissipation performance by utilizing the aluminum silicate fiber plate layer, the strength of the aluminum-plastic composite back plate can be improved by combining the upper aluminum alloy plate layer and the lower aluminum alloy plate layer, the heat conduction diffusion layer and the radiation-proof layer can ensure that the aluminum-plastic composite back plate has good heat dissipation performance and radiation-proof performance, the strength and folding resistance of the aluminum-plastic composite back plate can be improved by arranging the metal fiber layer, and the surface of a product can be protected from dirt and dust by the PET film layer and the PVDE coating.

Description

Aluminum-plastic composite back plate and application thereof
Technical Field
The invention relates to the technical field of heat dissipation type composite boards, in particular to an aluminum-plastic composite back plate and application thereof.
Background
With the development of science and technology and the market demand, the novel multimedia interactive terminal covers a plurality of functions such as a projector, an electronic whiteboard, a computer, a television, a sound box, a power amplifier and the like, brings great convenience to the development of the society and the life of the masses, and can be more and more favored by the masses. The existing multimedia equipment can generate a large amount of heat in the using process, the existing multimedia equipment mainly radiates heat through the radiating holes, but the radiating holes are communicated with the inside and the outside of the multimedia equipment and are easy to enter dust, and the board made of the radiating type material is adopted as the back board of the multimedia equipment to solve the defects of the existing multimedia equipment, so that the trend is reached, however, the existing radiating type material has limited radiating performance, can be single in addition, and has poor strength to limit the application of the existing radiating type material.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the invention aims to provide the aluminum-plastic composite back plate, the aluminum-plastic composite back plate utilizes the aluminum silicate fiber plate layer to have certain compressive strength and excellent sound absorption and noise reduction performance, the strength of the aluminum-plastic composite back plate can be further improved by combining the upper aluminum alloy plate layer and the lower aluminum alloy plate layer, meanwhile, the aluminum-plastic composite back plate has better heat dissipation performance and radiation protection performance due to the arranged heat conduction diffusion layer and the arranged radiation protection layer, the strength and the folding resistance of the aluminum-plastic composite back plate can be integrally improved due to the arranged metal fiber layer, the PET film layer and the PVDE coating can isolate water vapor to prevent the aluminum-plastic composite back plate from being corroded, the outer surface of a product can be protected from dirt and dust, and the comprehensive performance of the aluminum-plastic composite back plate is improved.
The invention also aims to provide an application of the aluminum-plastic composite back plate, wherein the aluminum-plastic composite back plate is applied to the back plate of the multimedia equipment, the excellent heat dissipation performance of the aluminum-plastic composite back plate is utilized to ensure that the aluminum-plastic composite back plate can effectively dissipate heat when being applied to the multimedia equipment, the working time and the service life of the multimedia equipment are prolonged, meanwhile, dust can be effectively prevented from entering the inside of the equipment to influence the conductivity and the heat dissipation performance of electrical elements inside the equipment, and the aluminum-plastic composite back plate also has the characteristics of low manufacturing cost and good using effect.
The purpose of the invention is realized by the following technical scheme: the utility model provides a compound backplate of plastic-aluminum, includes PET rete, metal fiber layer, last aluminum alloy plate layer, grid layer, silicic acid fiber layer, heat conduction diffusion layer, lower aluminum alloy plate layer, radiation protection layer and the PVDE coating that top-down set gradually, the heat conduction diffusion layer is equipped with and runs through the louvre of heat conduction diffusion layer, it all adopts high heat dissipating aluminium alloy plate to make with lower aluminum alloy plate layer to go up the aluminium alloy plate. The heat conduction diffusion layer is a graphite sheet layer; the radiation-proof layer is a ceramic fiber layer; the material of grid layer is PP material.
The aluminum-plastic composite back plate has the advantages that the aluminum silicate fiber plate layer has certain heat dissipation, static electricity prevention, scratch prevention and radiation prevention effects, so that the aluminum-plastic composite back plate is light, good in folding resistance and reasonable in structure, the strength of the aluminum-plastic composite back plate can be further improved by combining the upper aluminum alloy plate layer and the lower aluminum alloy plate layer, meanwhile, the aluminum-plastic composite back plate has good heat dissipation and radiation prevention performance due to the arranged heat conduction diffusion layer and radiation prevention layer, the strength and folding resistance of the aluminum-plastic composite back plate can be integrally improved due to the arrangement of the metal fiber layer, the PET film layer and the PVDE coating can isolate water vapor, the surface of a product can be protected from dirt and dust, and the comprehensive performance of the aluminum-plastic composite back plate is improved.
Preferably, the high-heat-dissipation aluminum alloy plate comprises the following raw materials in percentage by mass: 0.1 to 0.4 percent of Si, 0.04 to 0.08 percent of ZrC, 2.4 to 3.4 percent of Cu2.01 to 0.05 percent of Sc, 0.001 to 0.05 percent of Be0.001, 1.0 to 2.0 percent of Ti1, 0.05 to 0.2 percent of Mg0.05, 0.1 to 0.3 percent of Cr0.1, 0.05 to 0.1 percent of Co0, 0.05 to 0.1 percent of Ni0.3 to 0.5 percent of Fe0.02 to 0.05 percent of Pb0, and the balance of Al and inevitable impurities.
More preferably, the high heat dissipation aluminum alloy plate comprises the following raw materials in percentage by mass: 0.1 to 0.4 percent of Si, 0.04 to 0.08 percent of ZrC, 2.5 to 3.4 percent of Cu2.01 to 0.05 percent of Sc, 0.001 to 0.05 percent of Be0.001 to 0.05 percent of Ti1.0 to 2.0 percent of Mg0.05 to 0.2 percent of Cr0.2 to 0.3 percent of Cr0.08 to 0.1 percent of Co0.05 to 0.1 percent of Ni0.05 to 0.1 percent of Fe0.3 to 0.5 percent of Pb0.02 to 0.05 percent of the balance of Al and inevitable impurities.
The aluminum alloy plate is prepared from the raw materials, so that the prepared aluminum alloy plate has excellent heat conducting property, heat dissipation, antistatic, scratch-resistant and radiation-resistant effects and high dimensional stability, and TiAl can be formed by the adopted Ti and Al2Phase becomes a non-spontaneous core during crystallization, plays a role in refining a casting structure and a welding line structure, and the addition of a proper amount of Ti can effectively improve the strength, the high-temperature creep resistance and the corrosion resistance of the aluminum alloyThe added Ti has certain influence on the ductility of the aluminum alloy, so that the addition of a proper amount of Cu can enhance the ductility of the aluminum alloy to form a strengthening phase CuAl2When the aluminum alloy is dissolved in the aluminum alloy, the strength and the hardness of the aluminum alloy plate are improved; mg and Al can form an Al-Mg phase, so that the corrosion resistance and the strength of the prepared aluminum alloy plate can Be improved, and Be can prevent the acidification and the die reaction of the aluminum alloy plate and improve the toughness of the aluminum alloy plate; cr forms (CrFe) AI in aluminum7The intermetallic compound can block the formation and growth process of recrystallization, has certain strengthening effect on the alloy, and can also improve the toughness of the alloy and reduce the stress corrosion cracking sensitivity; the addition of Co can improve the oxidation resistance of the finally prepared aluminum alloy plate, Ni can improve the tensile strength and hardness of the alloy, and can improve the high-temperature strength and corrosion resistance, in addition, the proportion of Si, Mg, Cu and other components in the aluminum alloy is designed and adjusted, Zr, Pb, Sc and other elements are added, and the components are matched with each other, so that the microstructure of the aluminum alloy is optimized, the heat conducting property of the aluminum alloy plate is improved, and the comprehensive performance of the finally prepared aluminum-plastic composite back plate is improved.
Preferably, the high heat dissipation aluminum alloy sheet is produced by the steps of:
1) putting the raw materials into a smelting furnace according to the mass percentage, heating to 760-800 ℃, smelting for 3-5h to obtain an aluminum alloy melt, fully stirring, adding a refining agent with the mass percentage of 0.2-0.4% to carry out refining degassing, deslagging and standing the melt;
2) purifying the aluminum alloy solution prepared in the step 1), filtering by adopting a 30-40-mesh high-temperature ceramic filter plate, baking the ceramic filter plate to 180-220 ℃ to ensure that meshes of the filter plate are baked thoroughly and can smoothly pass through molten aluminum to obtain the purified aluminum alloy solution;
3) pouring the aluminum alloy solution prepared in the step 2) to obtain an alloy rod;
4) carrying out isothermal heat preservation at 350-450 ℃ for 20-30min on the aluminum bar obtained in the step 3) and then immediately carrying out quenching treatment;
5) stretching and straightening the quenched alloy rod;
6) carrying out aging treatment on the alloy rod straightened in the step 5); the aging treatment temperature is 170-180 ℃, and the treatment time is 3-6 h;
7) and finally, sequentially carrying out first washing, acetone washing and second washing on the aluminum alloy rod subjected to aging treatment to obtain an aluminum alloy finished product.
The high-heat-dissipation aluminum alloy plate is prepared by the method, wherein the aluminum alloy melt obtained after smelting is cast into an alloy rod, and then quenching treatment is adopted, so that cracks and other defects of the section bar can be avoided in the quenching process, and meanwhile, the yield strength, the fatigue strength, the toughness and the hardness of the section bar can be obviously improved by reasonably setting the air flow temperature and the air cooling time in the quenching and air cooling quenching process. During aging treatment, the aging temperature and the heating rate are reasonably set, so that the hardness and the heat dissipation performance of the section are further improved, and the stress in the alloy is almost completely eliminated; meanwhile, the temperature during smelting in the step 1) needs to be controlled to be 760-800 ℃, and if the temperature is too high, the refining agent added subsequently loses effectiveness due to the too high temperature, so that the aluminum alloy solution obtained by final smelting contains partial hydrogen and floating oxidation slag inclusion, and the casting is not facilitated.
Preferably, in the step 3), the temperature during pouring is 660-760 ℃, the temperature of the mold cavity is 250-350 ℃, the extrusion specific pressure is 80-120MPa, the mold filling speed is 0.04-0.14m/s, and the pressure maintaining time is 15-35s, and the aluminum alloy liquid is extruded and cast into the alloy rod.
In the invention, parameters such as temperature, mold temperature, pressure and the like during pouring in the step 3) need to be strictly controlled, so that the defects of shrinkage cavities, air holes, heat cracks and the like can be effectively eliminated, the extrusion casting part is complete in mold filling and compact in structure, the mechanical property of the aluminum alloy plate with high heat dissipation performance is further improved, and the production requirements of extrusion casting of various radiator parts with complex shapes are met.
Preferably, the refining agent is a mixture consisting of vermiculite powder, sodium aluminum fluoride, calcium fluoride and nano silicon dioxide according to the weight ratio of 0.8-1.2:0.4-0.8:0.6-1.0: 0.1-0.5.
The mixed refining agent with the specific proportion can effectively remove partial hydrogen and floating oxidation slag inclusion in the aluminum alloy solution, so that the aluminum alloy solution is purer and has the function of a slag remover.
The invention also provides an application of the aluminum-plastic composite back plate, and the aluminum-plastic composite back plate is used for a back plate of multimedia equipment, a back plate of a base station shell and an LED lamp heat dissipation back plate.
The aluminum-plastic composite back plate is applied to the back plate of the multimedia equipment, the excellent heat dissipation performance of the aluminum-plastic composite back plate is utilized to well ensure that the aluminum-plastic composite back plate can effectively dissipate heat when being applied to the multimedia equipment, the working time and the service life of the multimedia equipment are prolonged, meanwhile, dust can be effectively prevented from entering the inside of the equipment to influence the conductivity and the heat dissipation performance of electrical elements inside the equipment, and the aluminum-plastic composite back plate also has the characteristics of low manufacturing cost and good use effect.
The invention has the beneficial effects that: the aluminum-plastic composite back plate has certain compressive strength and excellent sound absorption and noise reduction performance by utilizing the aluminum silicate fiber plate layer, the strength of the aluminum-plastic composite back plate can be further improved by combining the upper aluminum alloy plate layer and the lower aluminum alloy plate layer, meanwhile, the arranged heat conduction diffusion layer and the arranged radiation-proof layer can enable the aluminum-plastic composite back plate to have better heat radiation performance and radiation-proof performance, the strength and folding resistance of the aluminum-plastic composite back plate can be integrally improved by arranging the metal fiber layer, the PET film layer and the PVDE coating layer can isolate water vapor to avoid the aluminum-plastic composite back plate from being corroded, the appearance of a product can be protected from being polluted and dust, and the comprehensive performance of the aluminum-plastic composite back plate is improved.
The aluminum-plastic composite back plate is applied to the back plate of the multimedia equipment, and the excellent heat dissipation performance of the aluminum-plastic composite back plate is utilized to ensure that the aluminum-plastic composite back plate can effectively dissipate heat when being applied to the multimedia equipment, so that the working time and the service life of the multimedia equipment are prolonged, meanwhile, dust can be effectively prevented from entering the inside of the equipment to influence the conductivity and the heat dissipation performance of electrical elements inside the equipment, and the aluminum-plastic composite back plate also has the characteristics of low manufacturing cost and good use effect.
Drawings
FIG. 1 is a schematic cross-sectional view of the present invention;
fig. 2 is a schematic cross-sectional view of a grid layer of the present invention.
The reference signs are: 1-PET film layer, 2-metal fiber layer, 3-upper aluminum alloy plate layer, 4-grid layer, 5-silicic acid fiber layer, 6-heat conduction diffusion layer, 61-heat dissipation hole, 7-lower aluminum alloy plate layer, 8-radiation protection layer and 9-PVDE coating.
Detailed Description
For the understanding of those skilled in the art, the present invention will be further described with reference to the following examples and accompanying fig. 1-2, which are not intended to limit the present invention.
Example 1
The utility model provides an aluminum-plastic composite back plate, includes PET rete 1, metal fiber layer 2, the last aluminum alloy plate layer 3, grid layer 4, silicic acid fibrous layer 5, heat conduction diffusion layer 6, lower aluminum alloy plate layer 7, radiation protection layer 8 and PVDE coating 9 that top-down set gradually, heat conduction diffusion layer 6 is equipped with and runs through heat dissipation hole 61 of heat conduction diffusion layer 6, it all adopts high heat dissipating aluminum alloy plate to make with lower aluminum alloy plate layer 7 to go up the aluminum alloy plate. The heat conduction diffusion layer 6 is a graphite sheet layer; the radiation-proof layer 8 is a ceramic fiber layer; the material of the grid layer 4 is a PP material.
The high-heat-dissipation aluminum alloy plate comprises the following raw materials in percentage by mass: 0.1% of Si, 0.04% of ZrC, 2.4% of Cu2.01% of Sc0.01%, 0.001% of Be0.0%, 1.0% of Ti0.05%, 0.1% of Cr0.05%, 0.05% of Ni0.3%, 0.02% of Pb0.02%, and the balance of Al and inevitable impurities.
The high-heat-dissipation aluminum alloy plate is prepared by the following steps:
1) putting the raw materials into a smelting furnace according to the mass percent, heating to 760 ℃ for smelting for 3 hours to obtain an aluminum alloy melt, fully stirring, adding a refining agent with the mass percent of 0.2% for refining, degassing, deslagging and standing the melt;
2) purifying the aluminum alloy solution prepared in the step 1), filtering by using a 30-mesh high-temperature ceramic filter plate, baking the ceramic filter plate to 180 ℃, so that meshes of the filter plate are baked thoroughly, and the aluminum alloy solution can smoothly pass through aluminum water to obtain a purified aluminum alloy solution;
3) pouring the aluminum alloy solution prepared in the step 2) to obtain an alloy rod;
4) carrying out isothermal heat preservation on the aluminum bar obtained in the step 3) at 350 ℃ for 20min and then immediately carrying out quenching treatment;
5) stretching and straightening the quenched alloy rod;
6) carrying out aging treatment on the alloy rod straightened in the step 5); the aging treatment temperature is 170 ℃, and the treatment time is 3 h;
7) and finally, sequentially carrying out first washing, acetone washing and second washing on the aluminum alloy rod subjected to aging treatment to obtain an aluminum alloy finished product.
In the step 3), the temperature during pouring is 660 ℃, the temperature of a die cavity is 250 ℃, the extrusion specific pressure is 80MPa, the mold filling speed is 0.04m/s, and the pressure maintaining time is 15s, and the aluminum alloy liquid is extruded and cast into an alloy rod.
The refining agent is a mixture consisting of vermiculite powder, sodium aluminum fluoride, calcium fluoride and nano silicon dioxide according to the weight ratio of 0.8:0.4:0.6: 0.1.
The utility model provides an application of compound backplate of plastic-aluminum, compound backplate of plastic-aluminum is used for the backplate of multimedia equipment, the backplate of base station shell and LED lamp heat dissipation backplate.
Example 2
The utility model provides an aluminum-plastic composite back plate, includes PET rete 1, metal fiber layer 2, the last aluminum alloy plate layer 3, grid layer 4, silicic acid fibrous layer 5, heat conduction diffusion layer 6, lower aluminum alloy plate layer 7, radiation protection layer 8 and PVDE coating 9 that top-down set gradually, heat conduction diffusion layer 6 is equipped with and runs through heat dissipation hole 61 of heat conduction diffusion layer 6, it all adopts high heat dissipating aluminum alloy plate to make with lower aluminum alloy plate layer 7 to go up the aluminum alloy plate. The heat conduction diffusion layer 6 is a graphite sheet layer; the radiation-proof layer 8 is a ceramic fiber layer; the material of the grid layer 4 is a PP material.
The high-heat-dissipation aluminum alloy plate comprises the following raw materials in percentage by mass: 0.2% of Si, 0.05% of ZrC, 2.6% of Cu2, 0.02% of Sc0.02%, 0.02% of Be0.02%, 1.3% of Ti1.3%, 0.07% of Mg0.15%, 0.15% of Cr0.25%, 0.06% of Ni0.35%, 0.02% of Pb0.02%, and the balance of Al and inevitable impurities.
The high-heat-dissipation aluminum alloy plate is prepared by the following steps:
1) putting the raw materials into a smelting furnace according to the mass percent, heating to 770 ℃, smelting for 3.5 hours to obtain an aluminum alloy melt, fully stirring, adding a refining agent with the mass percent of 0.25%, refining, degassing, deslagging, and standing the melt;
2) purifying the aluminum alloy solution prepared in the step 1), filtering by using a 32-mesh high-temperature ceramic filter plate, baking the ceramic filter plate to 190 ℃, so that meshes of the filter plate are baked thoroughly, and the aluminum alloy solution can smoothly pass through aluminum water to obtain a purified aluminum alloy solution;
3) pouring the aluminum alloy solution prepared in the step 2) to obtain an alloy rod;
4) carrying out isothermal heat preservation on the aluminum bar obtained in the step 3) at 375 ℃ for 23min and then immediately carrying out quenching treatment;
5) stretching and straightening the quenched alloy rod;
6) carrying out aging treatment on the alloy rod straightened in the step 5); the aging treatment temperature is 173 ℃, and the treatment time is 4 h;
7) and finally, sequentially carrying out first washing, acetone washing and second washing on the aluminum alloy rod subjected to aging treatment to obtain an aluminum alloy finished product.
In the step 3), the temperature during pouring is 690 ℃, the temperature of a die cavity is 275 ℃, the extrusion specific pressure is 90MPa, the mold filling speed is 0.34m/s, and the pressure maintaining time is 20s, and the aluminum alloy liquid is extruded and cast into an alloy rod.
The refining agent is a mixture consisting of vermiculite powder, sodium aluminum fluoride, calcium fluoride and nano silicon dioxide according to the weight ratio of 0.9:0.5:0.7: 0.2.
The utility model provides an application of compound backplate of plastic-aluminum, compound backplate of plastic-aluminum is used for the backplate of multimedia equipment, the backplate of base station shell and LED lamp heat dissipation backplate.
Example 3
The utility model provides an aluminum-plastic composite back plate, includes PET rete 1, metal fiber layer 2, the last aluminum alloy plate layer 3, grid layer 4, silicic acid fibrous layer 5, heat conduction diffusion layer 6, lower aluminum alloy plate layer 7, radiation protection layer 8 and PVDE coating 9 that top-down set gradually, heat conduction diffusion layer 6 is equipped with and runs through heat dissipation hole 61 of heat conduction diffusion layer 6, it all adopts high heat dissipating aluminum alloy plate to make with lower aluminum alloy plate layer 7 to go up the aluminum alloy plate. The heat conduction diffusion layer 6 is a graphite sheet layer; the radiation-proof layer 8 is a ceramic fiber layer; the material of the grid layer 4 is a PP material.
The high-heat-dissipation aluminum alloy plate comprises the following raw materials in percentage by mass: 0.3% of Si, 0.06% of ZrC, 2.8% of Cu2, 0.03% of Sc0.03%, 0.03% of Be0.03%, 1.5% of Ti1.5%, 0.1% of Mg0.2%, 0.2% of Cr0.5%, 0.07% of Ni0.4%, 0.03% of Pb0.03%, and the balance of Al and inevitable impurities.
The high-heat-dissipation aluminum alloy plate is prepared by the following steps:
1) putting the raw materials into a smelting furnace according to the mass percent, heating to 780 ℃ for smelting for 4 hours to obtain an aluminum alloy melt, fully stirring, adding a refining agent with the mass percent of 0.3% for refining, degassing, deslagging and standing the melt;
2) purifying the aluminum alloy solution prepared in the step 1), filtering by adopting a 35-mesh high-temperature ceramic filter plate, baking the ceramic filter plate to 200 ℃, so that meshes of the filter plate are baked thoroughly, and the aluminum alloy solution can smoothly pass through aluminum water to obtain the purified aluminum alloy solution;
3) pouring the aluminum alloy solution prepared in the step 2) to obtain an alloy rod;
4) carrying out isothermal heat preservation on the aluminum bar obtained in the step 3) at 400 ℃ for 25min, and then immediately carrying out quenching treatment;
5) stretching and straightening the quenched alloy rod;
6) carrying out aging treatment on the alloy rod straightened in the step 5); the aging treatment temperature is 175 ℃, and the treatment time is 5 h;
7) and finally, sequentially carrying out first washing, acetone washing and second washing on the aluminum alloy rod subjected to aging treatment to obtain an aluminum alloy finished product.
In the step 3), the temperature during pouring is 710 ℃, the temperature of a die cavity is 300 ℃, the extrusion specific pressure is 100MPa, the mold filling speed is 0.54m/s, and the pressure maintaining time is 25s, and the aluminum alloy liquid is extruded and cast into an alloy rod.
The refining agent is a mixture consisting of vermiculite powder, sodium aluminum fluoride, calcium fluoride and nano silicon dioxide according to the weight ratio of 1.0:0.6:0.8: 0.3.
The utility model provides an application of compound backplate of plastic-aluminum, compound backplate of plastic-aluminum is used for the backplate of multimedia equipment, the backplate of base station shell and LED lamp heat dissipation backplate.
Example 4
The utility model provides an aluminum-plastic composite back plate, includes PET rete 1, metal fiber layer 2, the last aluminum alloy plate layer 3, grid layer 4, silicic acid fibrous layer 5, heat conduction diffusion layer 6, lower aluminum alloy plate layer 7, radiation protection layer 8 and PVDE coating 9 that top-down set gradually, heat conduction diffusion layer 6 is equipped with and runs through heat dissipation hole 61 of heat conduction diffusion layer 6, it all adopts high heat dissipating aluminum alloy plate to make with lower aluminum alloy plate layer 7 to go up the aluminum alloy plate. The heat conduction diffusion layer 6 is a graphite sheet layer; the radiation-proof layer 8 is a ceramic fiber layer; the material of the grid layer 4 is a PP material.
The high-heat-dissipation aluminum alloy plate comprises the following raw materials in percentage by mass: 0.4% of Si, 0.07% of ZrC, 3.0% of Cu3, 0.04% of Sc0.04%, 0.04% of Be0.04%, 1.8% of Ti1, 0.15% of Mg0.25%, 0.25% of Cr0.75%, 0.08% of Ni0.45%, 0.04% of Pb0, and the balance of Al and inevitable impurities.
The high-heat-dissipation aluminum alloy plate is prepared by the following steps:
1) putting the raw materials into a smelting furnace according to the mass percent, heating to 790 ℃ for smelting for 4.5 hours to obtain an aluminum alloy melt, fully stirring, adding a refining agent with the mass percent of 0.35% for refining, degassing, deslagging and standing the melt;
2) purifying the aluminum alloy solution prepared in the step 1), filtering by using a 38-mesh high-temperature ceramic filter plate, baking the ceramic filter plate to 210 ℃, so that meshes of the filter plate are baked thoroughly, and the aluminum alloy solution can smoothly pass through aluminum water to obtain a purified aluminum alloy solution;
3) pouring the aluminum alloy solution prepared in the step 2) to obtain an alloy rod;
4) carrying out isothermal heat preservation on the aluminum bar obtained in the step 3) at 425 ℃ for 280min and then immediately carrying out quenching treatment;
5) stretching and straightening the quenched alloy rod;
6) carrying out aging treatment on the alloy rod straightened in the step 5); the aging treatment temperature is 178 ℃, and the treatment time is 6 h;
7) and finally, sequentially carrying out first washing, acetone washing and second washing on the aluminum alloy rod subjected to aging treatment to obtain an aluminum alloy finished product.
In the step 3), the temperature during pouring is 740 ℃, the temperature of a die cavity is 325 ℃, the extrusion specific pressure is 110MPa, the mold filling speed is 0.84m/s, and the pressure maintaining time is 30s, and the aluminum alloy liquid is extruded and cast into an alloy rod.
The refining agent is a mixture consisting of vermiculite powder, sodium aluminum fluoride, calcium fluoride and nano silicon dioxide according to the weight ratio of 1.1:0.7:0.9: 0.4.
The utility model provides an application of compound backplate of plastic-aluminum, compound backplate of plastic-aluminum is used for the backplate of multimedia equipment, the backplate of base station shell and LED lamp heat dissipation backplate.
Example 5
The utility model provides an aluminum-plastic composite back plate, includes PET rete 1, metal fiber layer 2, the last aluminum alloy plate layer 3, grid layer 4, silicic acid fibrous layer 5, heat conduction diffusion layer 6, lower aluminum alloy plate layer 7, radiation protection layer 8 and PVDE coating 9 that top-down set gradually, heat conduction diffusion layer 6 is equipped with and runs through heat dissipation hole 61 of heat conduction diffusion layer 6, it all adopts high heat dissipating aluminum alloy plate to make with lower aluminum alloy plate layer 7 to go up the aluminum alloy plate. The heat conduction diffusion layer 6 is a graphite sheet layer; the radiation-proof layer 8 is a ceramic fiber layer; the material of the grid layer 4 is a PP material.
The high-heat-dissipation aluminum alloy plate comprises the following raw materials in percentage by mass: 0.4% of Si, 0.08% of ZrC, 3.4% of Cu3, 0.05% of Sc0, 0.05% of Be0, 2.0% of Ti2, 0.2% of Mg0.3%, 0.3% of Cr0, 0.1% of Co0, 0.1% of Ni0, 0.5% of Fe0, 0.05% of Pb0, and the balance of Al and inevitable impurities.
The high-heat-dissipation aluminum alloy plate is prepared by the following steps:
1) putting the raw materials into a smelting furnace according to the mass percent, heating to 800 ℃ for smelting for 5 hours to obtain an aluminum alloy melt, fully stirring, adding a refining agent with the mass percent of 0.4% for refining, degassing, deslagging and standing the melt;
1) purifying the aluminum alloy solution prepared in the step 1), filtering by using a 40-mesh high-temperature ceramic filter plate, baking the ceramic filter plate to 220 ℃, so that meshes of the filter plate are baked thoroughly, and the aluminum alloy solution can smoothly pass through aluminum water to obtain a purified aluminum alloy solution;
2) pouring the aluminum alloy solution prepared in the step 2) to obtain an alloy rod;
3) carrying out isothermal heat preservation on the aluminum bar obtained in the step 3) at 450 ℃ for 30min and then immediately carrying out quenching treatment;
4) stretching and straightening the quenched alloy rod;
5) carrying out aging treatment on the alloy rod straightened in the step 5); the aging treatment temperature is 180 ℃, and the treatment time is 6 h;
6) and finally, sequentially carrying out first washing, acetone washing and second washing on the aluminum alloy rod subjected to aging treatment to obtain an aluminum alloy finished product.
In the step 3), the temperature during pouring is 760 ℃, the temperature of a die cavity is 350 ℃, the extrusion specific pressure is 120MPa, the mold filling speed is 0.14m/s, and the pressure maintaining time is 35s, and the aluminum alloy liquid is extruded and cast into an alloy rod.
The refining agent is a mixture consisting of vermiculite powder, sodium aluminum fluoride, calcium fluoride and nano silicon dioxide according to the weight ratio of 1.2:0.8:1.0: 0.5.
The utility model provides an application of compound backplate of plastic-aluminum, compound backplate of plastic-aluminum is used for the backplate of multimedia equipment, the backplate of base station shell and LED lamp heat dissipation backplate.
Comparative example 1
This comparative example differs from example 1 above in that: the thermal conductive diffusion layer 6 in this comparative example employs a thermal conductive PPA material. The remainder of this comparative example is the same as example 1 and will not be described again here.
Comparative example 2
This comparative example differs from example 3 above in that: the grid layer 4 is not provided in this comparative example. The remainder of this comparative example is the same as example 3 and will not be described again here.
Comparative example 3
This comparative example differs from example 5 above in that: the raw materials of the high heat dissipating aluminum alloy sheet of this comparative example were reduced in both Si and Ni, and the remaining raw materials were mixed in the ratio of example 5. The remainder of this comparative example is the same as example 5 and will not be described again here.
Various performance tests were performed on the aluminum-plastic composite back sheets using the materials described in examples 1, 3 and 5 and comparative examples 1 to 3, and the results are shown in table 1.
The measurement of the heat conductivity coefficient is tested according to the GB/T37796-2019 standard; the tensile strength was measured according to GB/T34219-2017 standard.
TABLE 1
Figure BDA0003143936600000121
Figure BDA0003143936600000131
As can be seen from the above table, the thermal conductivity of the aluminum-plastic composite back plate is as high as 276W/(m.K), and the aluminum-plastic composite back plate has good mechanical properties; the back plate is applied to the multimedia equipment, the excellent heat dissipation performance of the back plate is well guaranteed, the back plate can effectively dissipate heat when being applied to the multimedia equipment, the working time and the service life of the multimedia equipment are prolonged, meanwhile, dust can be effectively prevented from entering the inside of the equipment to influence the conductivity and the heat dissipation performance of electrical elements inside the equipment, and the back plate also has the characteristics of low manufacturing cost and good use effect.
The above-described embodiments are preferred implementations of the present invention, and the present invention may be implemented in other ways without departing from the spirit of the present invention.

Claims (10)

1. The utility model provides an aluminum-plastic composite backboard which characterized in that: the radiation-proof PET film comprises a PET film layer, a metal fiber layer, an upper aluminum alloy plate layer, a grid layer, a silicic acid fiber layer, a heat conduction diffusion layer, a lower aluminum alloy plate layer, a radiation-proof layer and a PVDE coating, wherein the PET film layer, the metal fiber layer, the upper aluminum alloy plate layer, the grid layer, the silicic acid fiber layer, the heat conduction diffusion layer, the lower aluminum alloy plate layer, the radiation-proof layer and the PVDE coating are sequentially arranged from top to bottom, the heat conduction diffusion layer is provided with heat dissipation holes penetrating through the heat conduction diffusion layer, and the upper aluminum alloy plate and the lower aluminum alloy plate layer are all made of high-heat-dissipation aluminum alloy plates.
2. The aluminum-plastic composite back plate of claim 1, wherein: the high-heat-dissipation aluminum alloy plate comprises the following raw materials in percentage by mass: 0.1 to 0.4 percent of Si, 0.04 to 0.08 percent of ZrC, 2.4 to 3.4 percent of Cu2.01 to 0.05 percent of Sc, 0.001 to 0.05 percent of Be0.001, 1.0 to 2.0 percent of Ti1, 0.05 to 0.2 percent of Mg0.05, 0.1 to 0.3 percent of Cr0.1, 0.05 to 0.1 percent of Co0, 0.05 to 0.1 percent of Ni0.3 to 0.5 percent of Fe0.02 to 0.05 percent of Pb0, and the balance of Al and inevitable impurities.
3. The aluminum-plastic composite back plate as claimed in claim 2, wherein: the high-heat-dissipation aluminum alloy plate comprises the following raw materials in percentage by mass: 0.1 to 0.4 percent of Si, 0.04 to 0.08 percent of ZrC, 2.5 to 3.4 percent of Cu2.01 to 0.05 percent of Sc, 0.001 to 0.05 percent of Be0.001 to 0.05 percent of Ti1.0 to 2.0 percent of Mg0.05 to 0.2 percent of Cr0.2 to 0.3 percent of Cr0.08 to 0.1 percent of Co0.05 to 0.1 percent of Ni0.05 to 0.1 percent of Fe0.3 to 0.5 percent of Pb0.02 to 0.05 percent of the balance of Al and inevitable impurities.
4. An aluminum-plastic composite backing plate according to claim 2 or 3, wherein: the high-heat-dissipation aluminum alloy plate is prepared by the following steps:
1) putting the raw materials into a smelting furnace according to the mass percent for smelting to obtain an aluminum alloy melt, fully stirring, adding a refining agent with the mass percent of 0.2-0.4% for refining, degassing, deslagging and standing the melt;
2) purifying the aluminum alloy solution prepared in the step 1), filtering by adopting a 30-40-mesh high-temperature ceramic filter plate, baking the ceramic filter plate to 180-220 ℃ to ensure that meshes of the filter plate are baked thoroughly and can smoothly pass through molten aluminum to obtain the purified aluminum alloy solution;
3) pouring the aluminum alloy solution prepared in the step 2) to obtain an alloy rod;
4) carrying out isothermal heat preservation on the aluminum bar obtained in the step 3), and then immediately carrying out quenching treatment;
5) stretching and straightening the quenched alloy rod;
6) carrying out aging treatment on the alloy rod straightened in the step 5);
7) and finally, sequentially carrying out first washing, acetone washing and second washing on the aluminum alloy rod subjected to aging treatment to obtain the aluminum alloy plate.
5. The aluminum-plastic composite back plate of claim 4, wherein: in the step 1), the smelting temperature is 760 and 800 ℃, and the smelting time is 3-5 h.
6. The aluminum-plastic composite back plate of claim 4, wherein: in the step 3), the temperature during pouring is 660-760 ℃, the temperature of the die cavity is 250-350 ℃, the extrusion specific pressure is 80-120MPa, the mold filling speed is 0.04-0.14m/s, and the pressure maintaining time is 15-35s, and the aluminum alloy liquid is extruded and cast into the alloy rod.
7. The aluminum-plastic composite back plate of claim 4, wherein: in the step 4), the isothermal heat preservation temperature is 350-450 ℃, and the isothermal heat preservation time is 20-30 min.
8. The aluminum-plastic composite back plate of claim 4, wherein: in the step 6), the aging treatment temperature is 170-180 ℃, and the treatment time is 3-6 h.
9. The aluminum-plastic composite back plate of claim 4, wherein: the refining agent is a mixture consisting of vermiculite powder, sodium aluminum fluoride, calcium fluoride and nano silicon dioxide according to the weight ratio of 0.8-1.2:0.4-0.8:0.6-1.0: 0.1-0.5.
10. Use of an aluminium-plastic composite backsheet according to any one of claims 1 to 9, wherein: the aluminum-plastic composite back plate is used for a back plate of multimedia equipment.
CN202110749289.7A 2021-07-01 2021-07-01 Aluminum-plastic composite back plate and application thereof Pending CN113427853A (en)

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CN206528165U (en) * 2016-12-29 2017-09-29 重庆优优新材料有限公司 A kind of sound insulation composited aluminum and plastic decking with radiating heat-proof quality
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Application publication date: 20210924