CN113421904A - Display panel and manufacturing method thereof - Google Patents
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- CN113421904A CN113421904A CN202110680227.5A CN202110680227A CN113421904A CN 113421904 A CN113421904 A CN 113421904A CN 202110680227 A CN202110680227 A CN 202110680227A CN 113421904 A CN113421904 A CN 113421904A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 115
- 239000000463 material Substances 0.000 claims description 55
- 239000007772 electrode material Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 25
- 238000010329 laser etching Methods 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000003086 colorant Substances 0.000 claims description 4
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 14
- 239000010410 layer Substances 0.000 description 336
- 230000008569 process Effects 0.000 description 18
- 239000010409 thin film Substances 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 239000011229 interlayer Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000012780 transparent material Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000005360 phosphosilicate glass Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GDFCWFBWQUEQIJ-UHFFFAOYSA-N [B].[P] Chemical compound [B].[P] GDFCWFBWQUEQIJ-UHFFFAOYSA-N 0.000 description 1
- VQQONBUSTPHTDO-UHFFFAOYSA-N [Sn]=O.[In].[Ag].[Sn]=O.[In] Chemical compound [Sn]=O.[In].[Ag].[Sn]=O.[In] VQQONBUSTPHTDO-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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Abstract
The application provides a display panel and a manufacturing method thereof, relates to the technical field of display, and is used for solving the technical problem that the shooting effect of a camera module and the manufacturing difficulty of the display panel are difficult to take into consideration. The first electrode layer of the display panel comprises an electrode contact and a plurality of first electrodes on the same layer, the first electrodes are spaced, and the first electrodes are spaced from the electrode contact; the shielding part in the array substrate is opposite to the interval between the first electrode and the electrode contact, and the orthographic projection of the first electrode and the electrode contact on the array substrate is adjacent to or partially overlapped with the orthographic projection of the shielding part on the array substrate; the second electrode layer is in contact with the electrode contact and is provided with a hollow area, and the orthographic projection of the second electrode layer on the array substrate covers the orthographic projection of the first electrode, the electrode contact and the shielding part on the array substrate. The hollowed-out area can be used for external light to pass through, the shooting effect of the camera module is improved, the electrode contact and the first electrode are arranged on the same layer, and the manufacturing difficulty of the display panel is reduced.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel and a manufacturing method thereof.
Background
Organic Light Emitting display panels (OLEDs for short) have many features such as self-luminescence, fast response, wide viewing angle, and capability of being fabricated on flexible substrates, and are increasingly used in high performance display fields such as flexible display devices.
In order to increase the screen ratio of the display panel, a functional device such as a camera module is generally disposed below the display panel. In one implementation, the cathode layer is a monolithic structure, and the cathode layer is connected to a common potential by a wire. Adopt the cathode layer of this kind of structure, the cathode layer is easily makeed, and the wire simple manufacture, display panel's the preparation degree of difficulty is lower, but the luminousness of second electrode layer is lower, and it is relatively poor to lead to the shooting effect of camera module. In another kind of implementation, the cathode layer includes a plurality of cathodes, adopts the cathode layer of this kind of structure, and the luminousness of cathode layer is better, and the shooting of camera module is effectual, but the preparation degree of difficulty of cathode layer is higher, and every negative pole in the cathode layer all need be connected with the wire, and the wire preparation is complicated, and then leads to display panel's the preparation degree of difficulty to be higher.
Disclosure of Invention
In view of the foregoing problems, embodiments of the present application provide a display panel and a manufacturing method thereof, which are used for reducing the manufacturing difficulty of the display panel while improving the shooting effect of the camera module.
In order to achieve the above object, the embodiments of the present application provide the following technical solutions:
a first aspect of embodiments of the present application provides a display panel, which includes: the array substrate, the first electrode layer, the light emitting layer and the second electrode layer are arranged in a stacked mode, the first electrode layer comprises an electrode contact and a plurality of first electrodes, the electrode contact and the first electrodes are arranged on the same layer, the first electrodes are arranged at intervals, and the first electrodes and the electrode contact are arranged at intervals; a shielding part is arranged in the array substrate, the shielding part is opposite to the interval between the first electrode and the electrode contact, and the orthographic projection of the first electrode and the electrode contact on the array substrate is adjacent to or partially overlapped with the orthographic projection of the shielding part on the array substrate; the second electrode layer is in contact with the electrode contact, the second electrode layer is provided with a hollow area, and the orthographic projection of the second electrode layer on the array substrate covers the first electrode, the electrode contact and the orthographic projection of the shielding part on the array substrate.
In the display panel that this application embodiment provided, be provided with the fretwork district in the second electrode layer, the fretwork district can supply external light to get into, has reduced the second electrode layer to external light's blockking, has increased the external light that the camera module received to improve the shooting effect of camera module. Meanwhile, the shielding part in the array substrate is opposite to the first electrode and the electrode contact at intervals, the orthographic projection of the first electrode and the electrode contact on the array substrate is adjacent to or partially overlapped with the orthographic projection of the shielding part on the array substrate, so that the first electrode, the electrode contact and the orthographic projection of the shielding part on the array substrate are connected into a whole, the orthographic projection of the second electrode layer on the array substrate covers the first electrode and the electrode contact, and the orthographic projection of the shielding part on the array substrate, so that the second electrode layer above the electrode contact is communicated with the second electrode layer above the first electrode, the second electrode layer is contacted with the electrode contact, the second electrode layer is electrically connected with the electrode contact, the display panel can normally emit light, and simultaneously, as the first electrode and the electrode contact are arranged in the same layer, a lead connected with the first electrode and a lead connected with the electrode contact can be manufactured in the same layer, the process is simplified, and the manufacturing difficulty of the display panel is reduced.
In a possible implementation manner, the hollow-out area corresponds to an interval between the adjacent first electrodes, and the electrode contact is not arranged in the interval opposite to the electrode contact.
In a possible implementation manner, one electrode contact is correspondingly arranged beside each first electrode, and the interval between each first electrode and the electrode contact which corresponds to the first electrode corresponds to one shielding part.
In one possible implementation, the edge of the first electrode is provided with a recess, and at least a partial region of the electrode contact is located in the recess.
In one possible implementation manner, the cross-sectional shape of the recessed portion is a circular arc, the cross-sectional shape of the electrode contact is a circle, and the curvature of the recessed portion is the same as the curvature of the electrode contact.
In a possible implementation manner, the plurality of first electrodes are divided into arrays, each array includes one electrode contact and at least two first electrodes adjacent to the electrode contact, and the interval between the electrode contact and each first electrode in each array respectively corresponds to one shielding portion.
Preferably, the light emitting layer includes a pixel defining layer disposed on the first electrode layer, the pixel defining layer having a plurality of first openings disposed therein corresponding to the first electrodes and a plurality of second openings disposed therein corresponding to the electrode contacts, the first openings having a light emitting material disposed therein, and the second openings exposing at least a portion of the electrode contacts.
Preferably, an orthographic projection of the first opening on the first electrode layer is located in the first electrode, and a distance between an edge of the orthographic projection of the first opening on the first electrode layer and a corresponding edge of the first electrode is greater than 2 micrometers.
Preferably, the luminescent material includes a red luminescent material, a green luminescent material, and a blue luminescent material; each group includes three first electrodes and one electrode contact, and the colors of the light-emitting materials disposed in the first openings corresponding to the three first electrodes are different.
Preferably, the centers of the three first electrodes are respectively located at three vertexes of a virtual triangle; the center of the second opening is located at the center of the virtual triangle.
In one possible implementation, the array substrate includes a substrate, an insulating layer, and a planarization layer, which are stacked; the shielding portion is disposed between the insulating layer and the planarized layer.
In a possible implementation manner, a first conducting wire and a second conducting wire are further disposed on the same layer between the first electrode layer and the array substrate, the first conducting wire is in contact with the first electrode to electrically connect the first electrode to a driving potential, and the second conducting wire is in contact with the electrode contact to electrically connect the electrode contact to a common potential.
A second aspect of the embodiments of the present application provides a method for manufacturing a display panel, including:
providing an array substrate, wherein a shielding part is arranged in the array substrate;
forming a first electrode layer on the array substrate, wherein the first electrode layer comprises an electrode contact and a plurality of first electrodes which are arranged on the same layer, the plurality of first electrodes are arranged at intervals, the plurality of first electrodes and the electrode contact are arranged at intervals, the interval between the first electrodes and the electrode contact is in direct correspondence with the shielding part, and the orthographic projections of the first electrodes and the electrode contact on the array substrate are adjacent to or partially overlapped with the orthographic projection of the shielding part on the array substrate;
forming a light emitting layer including a pixel defining layer formed on the first electrode layer, the pixel defining layer having a plurality of first openings provided therein corresponding to the respective first electrodes and second openings corresponding to the electrode contacts, the first openings having light emitting materials provided therein, the second openings exposing at least a portion of the electrode contacts;
forming a second electrode material layer on the light emitting layer and in the second opening, the second electrode material layer being in contact with the electrode contact;
and with the shielding part, the first electrode and the electrode contact as masks, performing laser etching on the second electrode material layer to form a second electrode layer, wherein the second electrode layer is provided with a hollow area, and the orthographic projection of the second electrode layer on the array substrate covers the first electrode, the electrode contact and the orthographic projection of the shielding part on the array substrate.
In the manufacturing method of the display panel provided by the embodiment of the application, the shielding part, the first electrode and the electrode contact are used as the mask to perform laser etching on the second electrode material layer to form the second electrode layer with the hollowed-out area, so that the area of the second electrode layer is reduced, a space for external light to pass through is formed in the second electrode layer, the amount of the external light received by the camera module is increased, and the shooting effect of the camera module is improved. Meanwhile, the first electrode and the electrode contact are arranged on the same layer, so that the lead connected with the first electrode and the lead connected with the electrode contact can be manufactured on the same layer, the process is simplified, and the manufacturing difficulty of the display panel is reduced.
In a possible implementation manner, the first electrode, the electrode contact and the shielding portion are all made of light-tight material layers, and the second electrode is made of silver, magnesium-silver alloy or aluminum.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel in an embodiment of the present application;
FIG. 2 is a schematic view of an arrangement of a first electrode and an electrode contact in an embodiment of the present application;
FIG. 3 is a schematic view of another arrangement of first electrodes and electrode contacts in an embodiment of the present application;
FIG. 4 is a flowchart illustrating a method for fabricating a display panel according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of an array substrate in an embodiment of the present application;
fig. 6 is a schematic structural view after a first electrode layer is formed in the embodiment of the present application;
FIG. 7 is a schematic structural diagram of a pixel after a pixel definition layer in an embodiment of the present application;
FIG. 8 is a schematic structural view after a light-emitting layer is formed in the embodiment of the present application;
fig. 9 is a schematic structural diagram of the second electrode material layer after being formed in the embodiment of the present application;
fig. 10 is a schematic view of laser etching in the embodiment of the present application.
Description of reference numerals:
100-an array substrate; 110-a substrate;
120-an insulating layer; 121-a gate insulating layer;
122-interlayer insulating layer; 130-a planarization layer;
140-a shield; 210-an anode;
220-electrode contact; 230-a second wire;
240-interval; 250-a first conductive line;
300-a light emitting layer; 310-a pixel defining layer;
311-a second opening; 312 — a first opening;
320-a luminescent material; 321-a first common layer;
410-a second electrode layer; 420-layer of second electrode material.
Detailed Description
Just as the background art, the display panel among the correlation technique has the problem that the shooting effect of camera module and the display panel preparation degree of difficulty are difficult to compromise, and the inventor discovers through the research, the reason that appears this kind of problem lies in, the camera module is located the below of display panel, if adopt the scheme that the cathode layer of keeping away from the camera module among the display panel is whole layer structure, and the cathode layer is easily makeed, and the wire of cathode layer is also convenient for draw forth, and the preparation degree of difficulty of display panel is lower. However, in this scheme, the transmittance of the cathode layer is low, and the transmittance thereof is usually lower than 50%, resulting in less external light passing through the display panel, thereby resulting in insufficient external light being received by the camera module, and the shooting effect of the camera module is poor.
The inventor also researches and discovers that if the scheme that the cathode layer is of a block structure is adopted, namely the cathode layer comprises a plurality of cathodes arranged at intervals, and the intervals form light transmission areas due to the fact that the intervals are arranged among the cathodes, so that external light passing through the display panel can be increased, and the shooting effect of the camera module is improved. However, in this scheme, the manufacturing difficulty of the display panel is high, and is mainly embodied in the following two aspects:
in one aspect, the plurality of cathodes are usually manufactured by a vacuum evaporation process, a high-precision Metal Mask (FMM) required by the process is difficult to manufacture, specifically, the thickness of the high-precision Metal Mask is usually 20 micrometers, the diameter of an opening required by the evaporation cathode is also usually 20 micrometers, the opening is difficult to manufacture on the high-precision Metal Mask, the failure rate is high, the manufacturing cost of the high-precision Metal Mask is high, and the manufacturing difficulty and the manufacturing cost of the display panel are also increased. If the cathode is fabricated by other methods, there is a problem that it is difficult to align the cathode with the anode, or a problem that the light emitting material is damaged.
On the other hand, each cathode needs to be connected to a common potential of the display panel, so that a potential difference can be generated between the cathode and the anode to ensure that the light-emitting material between the cathode and the anode emits light. However, the manufacturing of the lead connected to the cathode is complicated, which also increases the manufacturing difficulty and cost of the display panel.
To above-mentioned technical problem, in the display panel that this application embodiment provided, one in anode layer and the cathode layer includes a plurality of electrode blocks, and another is provided with the fretwork district, and the fretwork district can supply external light to get into, has reduced stopping to external light, has increased the external light that the camera module received to improve the shooting effect of camera module. Meanwhile, the cathode layer or the anode layer of the whole layer structure is connected with a common potential through the electrode contact, and the electrode contact and the anode layer or the cathode layer comprising the electrode blocks are arranged on the same layer, so that the number of wires connected with the cathode layer or the anode layer of the whole layer structure is small, the cathode layer and the anode layer can be manufactured together, and the wire manufacturing process is simplified, therefore, the manufacturing difficulty of the display panel can be simplified, and the manufacturing cost can be reduced.
In order to make the aforementioned objects, features and advantages of the embodiments of the present application more comprehensible, embodiments of the present application are described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, the display panel provided in the embodiment of the present application includes an array substrate 100, a first electrode layer, a light emitting layer 300, and a second electrode layer 410, which are stacked. The array substrate 100 may be a Thin Film Transistor (TFT) array substrate. The array substrate 100 includes a substrate 110, an insulating Layer 120 disposed on the substrate 110, and a Planarization Layer 130 (PLN) disposed on the insulating Layer 120.
The substrate 110 may be a glass substrate, a flexible plastic substrate, or a quartz substrate. A plurality of gate lines arranged in a first direction and a plurality of data lines arranged in a second direction are disposed on a surface of the substrate 110, the gate lines and the data lines defining pixel units in defined areas, and the first direction crosses the second direction. The grid electrode of the thin film transistor is connected with the grid line, the source electrode of the thin film transistor is connected with the data line, and the drain electrode of each thin film transistor is electrically connected with the corresponding pixel unit. In the display process, the thin film transistor supplies a data display signal input by the data line to the pixel unit corresponding to the thin film transistor under the control of the gate line.
The insulating layer 120 may have a single-layer or multi-layer structure, and a connection line, such as a metal line, is disposed in the insulating layer 120 and penetrates through the insulating layer 120 to electrically connect the thin film transistor and a first electrode layer (e.g., an anode layer) in the pixel unit.
As shown in fig. 1, the insulating Layer 120 includes a Gate Insulator (GI) Layer 121 on the substrate 110, and an interlayer Insulator (interlayer Dielectric, abbreviated as "Inter Layer Dielectric") Layer 121 on the Gate insulating Layer 121Referred to as ILD) layer 122. The gate insulating layer 121 covers the source and drain electrodes of the thin film transistor, and a gate electrode of the thin film transistor is disposed on the gate insulating layer 121. The gate insulating layer 121 and the interlayer insulating layer 122 may be formed by a Chemical Vapor Deposition (CVD) process. The gate insulating layer 121 is made of silicon oxide, and the interlayer insulating layer 122 is made of silicon oxide (e.g., SiO)2) Boron Phosphorus Silicate Glass (BPSG), phosphosilicate glass (PSG) or silicon nitride (e.g. Si)3N4) And the like.
The planarization layer 130 is located on the uppermost layer of the array substrate 100, and the upper surface of the planarization layer 130 is flush, so as to form more flat film layers on the planarization layer 130. The material of the planarization layer 130 may be an organic material, and the planarization layer 130 may be formed by a coating or sputtering process.
With continued reference to fig. 1, a shielding portion 140 is further disposed in the array substrate 100. In some possible examples, the blocking portion 140 is disposed on the insulating layer 120, and the planarization layer 130 covers the insulating layer 120 and the blocking portion 140 disposed on the insulating layer 120.
The shielding portion 140 is a non-transparent material layer, i.e., the shielding portion 140 is non-transparent. Illustratively, the material of the shielding portion 140 is metal (e.g., silver), or the shielding portion 140 is a black material layer, such as a resin layer including carbon black. The shielding part 140 may be provided separately, or may be a metal wire in the array substrate 100, that is, a metal wire in the array substrate 100, as the shielding part 140.
In this embodiment, the first electrode layer may be an anode layer, and the second electrode layer 410 may be a cathode layer; alternatively, the first electrode layer may be a cathode layer, and the second electrode layer 410 may be an anode layer, and the first electrode layer is an anode layer, and the second electrode layer 410 is a cathode layer.
The first electrode layer in the embodiment of the present application includes an anode 210 and an electrode contact 220, and the anode 210 and the electrode contact 220 are disposed in the same layer, so that the anode 210 and the electrode contact 220 are simultaneously fabricated. The anode 210 may be provided in plurality, the plurality of anodes 210 are spaced apart, and the electrode contact 220 is spaced apart from the anode 210. I.e., a space 240 is provided between the electrode contact 220 and the anode 210 to prevent conduction between the electrode contact 220 and the anode 210.
The interval between the anode 210 and the electrode contact 220 is opposite to the shielding part 140, and the orthographic projection of the anode 210 and the electrode contact 220 on the array substrate 100 is adjacent to or partially overlapped with the orthographic projection of the shielding part 140 on the array substrate 100. It is understood that the anode 210, the electrode contact 220 and the shielding part 140 are connected to form a single piece.
The anode 210 and the electrode contact 220 may have the same structure and material, so that the anode 210 and the electrode contact 220 may be manufactured at the same time, the manufacturing difficulty of the display panel is reduced, and the manufacturing efficiency of the display panel is improved. The anode 210 and the electrode contact 220 are both made of a light-impermeable material layer, and the anode 210 and the electrode contact 220 may be made of a metal layer, such as a silver layer; it may also be a stack of metal-transparent materials, such as an ITO-Ag-ITO layer (indium tin oxide-silver-indium tin oxide layer).
On the basis of the above embodiments, in some embodiments of the present application, referring to fig. 1 and fig. 2, one electrode contact 220 is correspondingly disposed beside each anode 210, that is, the number of anodes 210 is the same as the number of electrode contacts 220, and a plurality of anodes 210 correspond to a plurality of electrode contacts 220 one to one. The space 240 between each anode 210 and the corresponding electrode contact 220 directly faces a corresponding one of the blinders 140.
As shown in fig. 2, the edge of the anode 210 may be provided with a recess, and at least a partial area of the electrode contact 220 is located in the recess to reduce the space occupied by the anode 210 and the electrode contact 220. Illustratively, the cross-sectional shape of the recess is circular arc, the cross-sectional shape of the electrode contact 220 is circular, and the curvature of the recess is the same as that of the electrode contact 220, so that the anode 210 and the electrode contact 220 are matched. For example, anode 210 is equidistant from spacing 240 between electrode contacts 220. Of course, the sectional shape of the recess and the sectional shape of the electrode contact 220 are not limited, and for example, the sectional shape of the recess is a polygonal line, the sectional shape of the electrode contact 220 is a triangle or a square, and the sectional shape of the recess is adapted to the sectional shape of the electrode contact 220.
Based on the above embodiments, in other embodiments of the present application, the plurality of anodes 210 may be divided into an array, each array includes one electrode contact 220, and at least two anodes 210 adjacent to the electrode contact 220, so as to reduce the number of the electrode contacts 220, thereby reducing the difficulty in manufacturing the first electrode layer.
The number of anodes 210 in each group may be the same or different. For example, some groups include two anodes 210, and other groups include three anodes 210; alternatively, two anodes 210 are included in each group. Illustratively, as shown in fig. 3, each group includes three anodes 210 and one electrode contact 220, the centers of the three anodes 210 are respectively located at three vertices of a virtual triangle (shown by a dotted line in fig. 3), and the electrode contact 220 is located inside the virtual triangle.
The spacing 240 between the electrode contact 220 and each anode 210 in each group corresponds directly to one of the blinding portions 140, i.e. the number of blinding portions 140 is the same as the number of anodes 210 in the group. For example, the edge of electrode contact 220 is equidistant from the edge of each anode 210, and the width of each shield 140 in the direction from anode 210 to electrode contact 220 is equal to each shield 140 directly corresponding to the gap 240 between electrode contact 220 and anode 210.
In other embodiments, the space 240 between the electrode contact 220 and the anode 210 in each group directly corresponds to one shielding portion 140, that is, the orthographic projection of the electrode contact 220 on the array substrate 100 is located inside the orthographic projection of the shielding portion 140 on the array substrate 100, and the orthographic projection of the anode 210 on the array substrate 100 is adjacent to or partially overlapped with the orthographic projection of the shielding portion 140 on the array substrate 100.
As shown in fig. 1, a first conductive line 250 is disposed below the anode 210, the first conductive line 250 is located between the anode 210 and the array substrate 100, and the first conductive line 250 electrically connects the anode 210 to a driving potential. A second conductive line 230 is disposed under the electrode contact 220, the second conductive line 230 being located between the electrode contact 220 and the array substrate 100, the second conductive line 230 electrically connecting the electrode contact 220 to a common potential. The first conductive lines 250 and the second conductive lines 230 may be disposed in the same layer, so that the first conductive lines 250 and the second conductive lines 230 are simultaneously fabricated, thereby simplifying the fabrication steps of the display panel.
With continued reference to fig. 1, the light emitting Layer 300 in the embodiment of the present application includes a Pixel defining Layer 310 (PDL), the Pixel defining Layer 310 is disposed on the first electrode Layer, the Pixel defining Layer 310 may be a silicon oxide Layer, a silicon nitride Layer, or a transparent resin Layer, and the Pixel defining Layer 310 may be manufactured by a Plasma Chemical Vapor Deposition (PCVD) method, an inkjet printing process, or a Spin Coating process.
The pixel defining layer 310 has a plurality of first openings and second openings 311 therein, the plurality of first openings corresponding to the plurality of anodes 210 one to one, and the second openings 311 corresponding to the electrode contacts 220. When the electrode contacts 220 are provided in plurality, the second openings 311 are also provided in plurality, and the plurality of second openings 311 correspond to the plurality of electrode contacts 220 one to one. A first opening and a second opening 311 penetrate the pixel defining layer 310, the anode 210 is exposed within the first opening, and the second opening 311 exposes at least a portion of the electrode contact 220, for example, the second opening 311 exposes a central region of the electrode contact 220.
The orthographic projection of the first opening on the first electrode layer is located in the anode 210, and the distance between the edge of the orthographic projection of the first opening on the first electrode layer and the corresponding edge of the anode 210 is greater than 2 micrometers. So configured, the pixel defining layer 310 can seal the edge of the anode 210 to prevent the burr and other structures on the edge of the anode 210 from affecting the normal operation of the light emitting material 320 in the first opening. The second opening 311 is located inside the electrode contact 220 or coincides with the electrode contact 220 in an orthogonal projection of the first electrode layer.
The light emitting materials 320 may include red, green and blue light emitting materials R, G and B to emit different colors of light. When each group includes three anodes 210 and one electrode contact 220, in some possible examples, as shown in fig. 3, the colors of the luminescent materials disposed in the first openings corresponding to the three anodes 210 are different, that is, a red luminescent material R is disposed in the first opening corresponding to one anode 210 of the three anodes 210, a green luminescent material G is disposed in the first opening corresponding to another anode 210 of the three anodes 210, and a blue luminescent material B is disposed in the first opening corresponding to the last anode 210 of the three anodes 210. One electrode contact 220 is shared by three anodes 210 to reduce the number of electrode contacts 220. The centers of the three anodes 210 are located at three vertexes of a virtual triangle, respectively, in which the electrode contact 220 is located, and the central region of the electrode contact 220 is exposed in the second opening 311, the center of the second opening 311 being located at the center of the virtual triangle.
In other possible examples, as shown in fig. 1, a first common Layer 321 may be further disposed on the pixel defining Layer 310, and the first common Layer 321 includes a Hole Injection Layer (HIL) and/or a Hole Transport Layer (HTL). A light emitting material (not shown) is disposed on the first common Layer 321 located in the first opening, and a second common Layer (not shown) is disposed on the first common Layer 321 and the light emitting material, and includes an Electron Injection Layer (EIL) and/or an Electron Transport Layer (ETL).
When the first common layer 321 and the second common layer are disposed on the pixel defining layer 310, the second opening 311 extends into the first common layer 321 and the second common layer, that is, the second opening 311 penetrates through the first common layer 321 and the second common layer to expose the electrode contact 220, so that the second electrode layer can contact the electrode contact 220 to electrically connect the second electrode layer with the electrode contact 220. The second opening 311 in the first common layer 321, the second common layer, and the pixel defining layer 310 may be shaped as a stepped through hole or a through hole. The first electrode layer, the first common layer 321, the light emitting material, the second common layer, and the second electrode layer positioned in the first opening constitute a pixel unit.
With continued reference to fig. 1, the cathode layer is in contact with the electrode contact 220, and the cathode layer is connected to a common potential via the electrode contact 220 and the second wire 230. The cathode layer has the fretwork district, and the cathode layer is run through in the fretwork district to reduce the area of cathode layer, pass the cathode layer for external light, improve external light's the entering volume, thereby improve the shooting effect of camera module. Illustratively, the gap between the hollow-out area and the anode 210 is opposite, and the electrode contact 220 is not disposed in the interval opposite to the hollow-out area, that is, the hollow-out area is opposite to and opposite to the anode 210 and the electrode contact 220, so as to ensure that the electrode contact 220 is communicated with the cathode layer opposite to the anode 210.
The orthographic projection of the cathode layer on the array substrate 100 covers the anode 210, the electrode contact 220, and the orthographic projection of the shielding part 140 on the array substrate 100, that is, the cathode layer above the anode 210 is communicated with the cathode layer on the electrode contact 220. The cathode layer in the range of the forward projection of the anode 210 may be connected to a common potential through the electrode contact 220 to ensure that the display panel can operate properly.
Illustratively, the orthographic projection of the cathode layer on the array substrate 100 coincides with the orthographic projection of the anode 210, the electrode contact 220, and the shielding part 140 on the array substrate 100, so as to further reduce the area of the cathode layer and improve the entering amount of the external light.
In some possible examples, as shown in fig. 3, the cathode layer includes a plurality of cathodes, each cathode corresponding to a set of anodes 210 and electrode contacts 220. The cathode opposite to the anode 210 and the electrode contact 220 in one group is a single structure, that is, at least two pixel units in one group share one cathode, and the cathode is in contact with the electrode contact 220 to reduce the number of the electrode contacts 220.
The material of the second electrode layer may include metal, such as one or more of silver, magnesium-silver alloy, and aluminum. The second electrode layer may be formed by laser etching with the anode 210, the electrode contact 220, and the barrier portion 140 as masks. During etching, laser is focused on the second electrode layer to avoid damaging other film layers. In addition, the wavelength of the laser is a specific value, so that the absorptivity of the second electrode layer to the laser with the wavelength is high, the absorptivity of other film layers to the laser with the wavelength is low, and the other film layers are further prevented from being damaged.
In the display panel that this application embodiment provided, be provided with the fretwork district in the second electrode layer 410, the fretwork district can supply external light to get into, has reduced the second electrode layer 410 and to external light's blockking, has increased the external light that the camera module received to improve the shooting effect of camera module. Meanwhile, the shielding part 140 in the array substrate 100 is opposite to the first electrode and the electrode contact 220 at an interval, and the orthographic projection of the first electrode and the electrode contact 220 on the array substrate 100 is adjacent to or partially overlapped with the orthographic projection of the shielding part 140 on the array substrate 100, so that the first electrode, the electrode contact 220 and the orthographic projection of the shielding part 140 on the array substrate 100 are connected into a whole, the orthographic projection of the second electrode layer 410 on the array substrate 100 covers the first electrode, the orthographic projection of the electrode contact 220 and the shielding part 140 on the array substrate 100, so that the second electrode layer 410 above the electrode contact 220 is communicated with the second electrode layer 410 above the first electrode, and the second electrode layer 410 is in contact with the electrode contact 220, so that the second electrode layer 410 is electrically connected with the electrode contact 220, and the display panel can normally emit light. Meanwhile, the first electrode and the electrode contact 220 are arranged on the same layer, so that the lead connected with the first electrode and the lead connected with the electrode contact 220 can be manufactured on the same layer, the process is simplified, the manufacturing difficulty of the display panel is reduced, and the manufacturing difficulty of the display panel is reduced.
An embodiment of the present application further provides a manufacturing method of a display panel, as shown in fig. 4, the manufacturing method of the display panel includes the following steps:
step S101, providing an array substrate, wherein a shielding part is arranged in the array substrate.
Referring to fig. 5, the array substrate 100 may be a TFT array substrate, and the array substrate 100 includes a substrate 110, an insulating layer 120 disposed on the substrate 110, and a planarization layer 130 disposed on the insulating layer 120.
A plurality of gate lines arranged in a first direction and a plurality of data lines arranged in a second direction are disposed on a surface of the substrate 110, the gate lines and the data lines defining pixel units in defined areas, and the first direction crosses the second direction. The grid electrode of each thin film transistor is connected with the grid line, the source electrode of each thin film transistor is connected with the data line, and the drain electrode of each thin film transistor is electrically connected with the corresponding pixel unit; in the display process, the thin film transistor supplies a data display signal input by the data line to the pixel unit corresponding to the thin film transistor under the control of the gate line.
The insulating layer 120 may have a single-layer or multi-layer structure, and a connection line, such as a metal line, is disposed in the insulating layer 120 and penetrates through the insulating layer 120 to electrically connect the thin film transistor and the first electrode layer. Illustratively, the insulating layer 120 includes a gate insulating layer 121 on the substrate 110, and an interlayer insulating layer 122 on the gate insulating layer 121. The gate insulating layer 121 covers the source and drain electrodes of the thin film transistor, and a gate electrode of the thin film transistor is disposed on the gate insulating layer 121.
The planarization layer 130 is generally located on the uppermost layer of the array substrate 100, and the upper surface of the planarization layer 130 is flush, so as to form more planar layers on the planarization layer 130. The material of the planarization layer 130 may be an organic material, and the planarization layer 130 may be formed by a coating or sputtering process.
The array substrate 100 further includes a shielding portion 140. The blocking portion 140 may be disposed on the insulating layer 120, and the planarization layer 130 covers the insulating layer 120 and the blocking portion 140 disposed on the insulating layer 120. The shielding portion 140 is a non-transparent material layer, i.e., the shielding portion 140 is non-transparent. Illustratively, the material of the shielding portion 140 is metal (e.g., silver), or the shielding portion 140 is a black material layer, such as a resin layer including carbon black. The shielding part 140 may be provided separately, or may be a metal wire in the array substrate 100, that is, a metal wire in the array substrate 100, as the shielding part 140.
Step S102, a first electrode layer is formed on the array substrate, the first electrode layer comprises an electrode contact and a plurality of first electrodes which are arranged on the same layer, the plurality of first electrodes are arranged at intervals, the plurality of first electrodes and the electrode contact are arranged at intervals, the intervals between the first electrodes and the electrode contact are in positive correspondence with the shielding parts, and the orthographic projections of the first electrodes and the electrode contact on the array substrate are adjacent to or partially overlapped with the orthographic projections of the shielding parts on the array substrate.
Referring to fig. 6, illustratively, a plurality of first electrodes and electrode contacts 220 are formed simultaneously by depositing a first electrode material on the array substrate 100 and then etching the first electrode material by a laser etching process or the like. The first electrode material is a light-tight material, and the first electrode material can be metal, such as silver; it may also be a stack of metal-transparent materials, such as a stack of ITO-Ag-ITO.
As shown in fig. 6, the first electrode (for example, the anode 210) may be a plurality of first electrodes, the plurality of first electrodes are spaced apart, the electrode contact 220 is spaced apart from the first electrodes, and the spacing (the space shown by the dotted line in fig. 6) corresponds to the shielding portion 140. The orthographic projection of the first electrode and the electrode contact 220 on the array substrate 100 is adjacent to or partially overlapped with the orthographic projection of the shielding part 140 on the array substrate 100, that is, the orthographic projection of the first electrode and the electrode contact 220 on the array substrate 100 is connected with the orthographic projection of the shielding part 140.
In some embodiments of the present application, as shown in fig. 2, one electrode contact 220 is disposed beside each first electrode, and the space between each first electrode and the corresponding electrode contact 220 corresponds to one shielding portion 140. The edge of the first electrode may be provided with a recess, and at least a partial area of the electrode contact 220 is located in the recess, so as to reduce the space occupied by the first electrode and the electrode contact 220.
In other embodiments of the present application, the plurality of first electrodes may be divided into an array, each array includes at least two adjacent first electrodes and an electrode contact 220 located between the first electrodes, so as to reduce the number of electrode contacts 220 and reduce the difficulty in manufacturing the first electrode layer. Illustratively, as shown in fig. 3, each group includes three first electrodes and one electrode contact 220, the centers of the three first electrodes are located at three vertexes of a virtual triangle respectively, and the electrode contacts 220 are located inside the virtual triangle. In each group, the spacing between the electrode contact 220 and each first electrode corresponds directly to one of the blinding portions 140, i.e. the number of blinding portions 140 is the same as the number of first electrodes in the group.
As shown in fig. 6, a first wire 250 is disposed below the first electrode, the first wire 250 is located between the first electrode and the array substrate 100, and the first wire 250 electrically connects the first electrode to a driving potential. A second conductive line 230 is disposed under the electrode contact 220, the second conductive line 230 being located between the electrode contact 220 and the array substrate 100, the second conductive line 230 electrically connecting the electrode contact 220 to a common potential. The first conductive lines 250 and the second conductive lines 230 may be disposed in the same layer, so that the first conductive lines 250 and the second conductive lines 230 are simultaneously fabricated, thereby simplifying the fabrication steps of the display panel.
Step S103, forming a light emitting layer, where the light emitting layer includes a pixel defining layer formed on the first electrode layer, and the pixel defining layer is provided with a plurality of first openings corresponding to the first electrodes and second openings corresponding to the electrode contacts, where the first openings are provided with light emitting materials therein, and the second openings expose at least part of the electrode contacts.
Referring to fig. 7, a pixel defining material layer is formed on the first electrode layer through a plasma chemical vapor deposition process, an inkjet printing process, a spin coating process, or the like, and then a patterning process is performed on the pixel defining material layer to form a first opening 312 and a second opening 311 penetrating the pixel defining material layer, and the pixel defining material layer having the first opening 312 and the second opening 311 forms a pixel defining layer 310.
The number of the first openings 312 is plural, the plural first openings 312 correspond to the plural first electrodes one by one, the first electrodes are exposed in the first openings 312, the second openings 311 correspond to the electrode contacts 220, and at least a part of the electrode contacts 220 are exposed in the second openings 311. When the electrode contacts 220 are provided in plurality, the second openings 311 are also provided in plurality, and the plurality of second openings 311 correspond to the plurality of electrode contacts 220 one to one. The orthographic projection of the first opening 312 on the first electrode layer is positioned in the first electrode, and the distance between the edge of the orthographic projection of the first opening 312 on the first electrode layer and the edge of the corresponding first electrode is more than 2 microns. The second opening 311 is located inside the electrode contact 220 or coincides with the electrode contact 220 in an orthogonal projection of the first electrode layer.
In some possible examples of the present application, referring to fig. 8, after forming the pixel defining layer 310, a first common layer 321 is formed within the pixel defining layer 310, the first opening 312, and the second opening 311, the first common layer 321 including a hole injection layer and/or a hole transport layer; then, the first common layer 321 in the first opening 312 is vapor-deposited with a light-emitting material; forming a second common layer including an electron injection layer and/or an electron transport layer on the first common layer 321 and the light emitting material; the laser etching removes at least a portion of the first common layer 321 and the second common layer located within the second opening 311 to expose the electrode contact 220.
It should be noted that, when each group includes three first electrodes and one electrode contact 220, as shown in fig. 3, the first openings 312 corresponding to the three first electrodes respectively correspond to the red light-emitting material R, the green light-emitting material G and the blue light-emitting material B, the centers of the three first electrodes are respectively located at three vertexes of a virtual triangle, and the center of the second opening 311 is located at the center of the virtual triangle.
Step S104, forming a second electrode material layer on the light-emitting layer and in the second opening, wherein the second electrode material layer is in contact with the electrode contact.
Illustratively, the second electrode material layer 420 is formed on the second common layer and within the second opening 311, and as shown in fig. 9, the second electrode material layer 420 is a whole layer structure. The second electrode material layer 420 covers the second common layer and is in contact with the electrode contact 220, so that the second electrode material layer 420 is electrically connected with the electrode contact 220. The material of the second electrode material layer 420 may be a metal, such as one or more of silver, magnesium-silver alloy, and aluminum.
And S105, with the shielding part, the first electrode and the electrode contact as masks, performing laser etching on the second electrode material layer to form a second electrode layer, wherein the second electrode layer has a hollow area, and the orthographic projection of the second electrode layer on the array substrate covers the first electrode, the electrode contact and the orthographic projection of the shielding part on the array substrate.
Referring to fig. 10, the shielding portion 140, the first electrode and the electrode contact 220 are used as masks, the second electrode material layer 420 is laser etched, the second electrode material layer 420 which is not shielded by the shielding portion 140, the first electrode and the electrode contact 220 is removed, the remaining second electrode material layer 420 forms a second electrode layer 410, and the second electrode layer 410 has a hollow area.
It can be understood that the orthographic projection of the second electrode layer 410 on the array substrate 100 covers the first electrode, the electrode contact 220, and the orthographic projection of the shielding part 140 on the array substrate 100, and the second electrode layer 410 in each group is an integer. The gap between the hollow-out area of the second electrode layer 410 and the first electrode is opposite, and the electrode contact 220 is not arranged in the interval opposite to the hollow-out area, so as to ensure that the electrode contact 220 is communicated with the second electrode layer 410 opposite to the first electrode.
As shown in fig. 10, when the second electrode material layer 420 is etched by laser, the laser is located below the array substrate 100, that is, the laser is irradiated from bottom to top, and by focusing the laser on the second electrode material layer 420, other film layers can be prevented from being damaged. In addition, the wavelength of the laser may be set to a specific value, the second electrode material layer 420 has a high absorptivity to the laser with the wavelength, and the other film layers have a low absorptivity to the laser with the wavelength, so as to further prevent the other film layers from being damaged.
It should be noted that the shielding portion 140 in the embodiment of the present application is disposed in the array substrate 100, and in other possible embodiments, the shielding portion 140 may also be a Support Pad (SPC) located between the first electrode layer and the second electrode layer 410, and the support pad is opaque. With such an arrangement, the shielding portion 140 does not need to be additionally manufactured by using the structure of the display panel.
In the manufacturing method of the display panel provided by the embodiment of the application, the shielding part 140, the first electrode and the electrode contact 220 are used as the mask to perform laser etching on the second electrode material layer 420, so that the second electrode layer 410 with the hollow part is formed, the area of the second electrode layer 410 is reduced, a space for external light to pass through exists in the second electrode layer 410, the external light received by the camera module is increased, and the shooting effect of the camera module is improved. Meanwhile, the plurality of first electrodes and the electrode contacts 220 are arranged on the same layer, so that the wires connected with the first electrodes and the wires connected with the electrode contacts 220 can be manufactured on the same layer, the process is simplified, and the manufacturing difficulty of the display panel is reduced.
The embodiments or implementation modes in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
It should be noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
In general, terms should be understood at least in part by their use in context. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in the singular or may be used to describe a combination of features, structures, or characteristics in the plural, depending, at least in part, on the context. Similarly, terms such as "a" or "the" may also be understood to convey a singular use or to convey a plural use, depending at least in part on the context.
It should be readily understood that "on … …", "above … …" and "above … …" in this disclosure should be interpreted in its broadest sense such that "on … …" means not only "directly on something", but also includes the meaning of "on something" with intervening features or layers therebetween, and "above … …" or "above … …" includes not only the meaning of "above something" or "above" but also includes the meaning of "above something" or "above" with no intervening features or layers therebetween (i.e., directly on something).
Furthermore, spatially relative terms, such as "below," "lower," "above," "upper," and the like, may be used herein for ease of description to describe one element or feature's illustrated relationship to another element or feature. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may have other orientations (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly as well.
The term "substrate" as used herein refers to a material on which a subsequent layer of material is added. The substrate itself may be patterned. The material added atop the substrate may be patterned or may remain unpatterned. In addition, the substrate may comprise a wide range of materials, such as silicon, germanium, gallium arsenide, indium phosphide, and the like. Alternatively, the substrate may be made of a non-conductive material (e.g., glass, plastic, or sapphire wafer, etc.).
The term "layer" as used herein may refer to a portion of material that includes a region having a thickness. A layer may extend over the entire underlying or overlying structure or may have a smaller extent than the underlying or overlying structure. Furthermore, a layer may be a region of a continuous structure, homogeneous or heterogeneous, having a thickness less than the thickness of the continuous structure. For example, a layer may be located between the top and bottom surfaces of the continuous structure or between any pair of lateral planes at the top and bottom surfaces. The layers may extend laterally, vertically, and/or along a tapered surface. The substrate may be a layer, may include one or more layers therein, and/or may have one or more layers located thereon, above and/or below. The layer may comprise a plurality of layers. For example, the interconnect layer may include one or more conductors and contact layers (within which contacts, interconnect lines, and/or vias are formed) and one or more dielectric layers.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. The display panel is characterized by comprising an array substrate, a first electrode layer, a light emitting layer and a second electrode layer which are arranged in a laminated mode, wherein the first electrode layer comprises an electrode contact and a plurality of first electrodes which are arranged on the same layer, the first electrodes are arranged at intervals, and the first electrodes and the electrode contact are arranged at intervals;
a shielding part is arranged in the array substrate, the shielding part is opposite to the interval between the first electrode and the electrode contact, and the orthographic projection of the first electrode and the electrode contact on the array substrate is adjacent to or partially overlapped with the orthographic projection of the shielding part on the array substrate;
the second electrode layer is in contact with the electrode contact, the second electrode layer is provided with a hollow area, and the orthographic projection of the second electrode layer on the array substrate covers the first electrode, the electrode contact and the orthographic projection of the shielding part on the array substrate.
2. The display panel according to claim 1, wherein the hollow-out region corresponds to a space between adjacent first electrodes, and the electrode contact is not provided in the space directly opposite to the electrode contact.
3. The display panel according to claim 1 or 2, wherein one of the electrode contacts is disposed beside each of the first electrodes, and a space between each of the first electrodes and the corresponding electrode contact is directly opposite to one of the shielding portions.
4. A display panel as claimed in claim 3 characterized in that the edge of the first electrode is provided with a recess, in which recess at least a partial area of the electrode contact is located.
5. The display panel according to claim 4, wherein a cross-sectional shape of the recess portion is a circular arc, a cross-sectional shape of the electrode contact is a circular shape, and a curvature of the recess portion is the same as a curvature of the electrode contact.
6. The display panel according to claim 1 or 2, wherein a plurality of the first electrodes are divided into groups, each group includes one of the electrode contacts, and at least two of the first electrodes are adjacent to the electrode contact, and a space between the electrode contact in each group and each of the first electrodes corresponds to one of the shielding portions;
preferably, the light emitting layer includes a pixel defining layer disposed on the first electrode layer, the pixel defining layer having a plurality of first openings disposed therein corresponding to the first electrodes and a plurality of second openings disposed therein corresponding to the electrode contacts, the first openings having a light emitting material disposed therein, the second openings exposing at least a portion of the electrode contacts;
preferably, an orthographic projection of the first opening on the first electrode layer is located in the first electrode, and a distance between an edge of the orthographic projection of the first opening on the first electrode layer and a corresponding edge of the first electrode is greater than 2 micrometers;
preferably, the luminescent material includes a red luminescent material, a green luminescent material, and a blue luminescent material;
each group comprises three first electrodes and one electrode contact, and the colors of the luminescent materials arranged in the first openings corresponding to the three first electrodes are different;
preferably, the centers of the three first electrodes are respectively located at three vertexes of a virtual triangle;
the center of the second opening is located at the center of the virtual triangle.
7. The display panel according to claim 1, wherein the array substrate includes a substrate, an insulating layer, and a planarizing layer which are stacked;
the shielding portion is disposed between the insulating layer and the planarized layer.
8. The display panel according to claim 1, wherein a first conductive line and a second conductive line are further disposed on the same layer between the first electrode layer and the array substrate, the first conductive line is in contact with the first electrode to electrically connect the first electrode to a driving potential, and the second conductive line is in contact with the electrode contact to electrically connect the electrode contact to a common potential.
9. A method for manufacturing a display panel is characterized by comprising the following steps:
providing an array substrate, wherein a shielding part is arranged in the array substrate;
forming a first electrode layer on the array substrate, wherein the first electrode layer comprises an electrode contact and a plurality of first electrodes which are arranged on the same layer, the plurality of first electrodes are arranged at intervals, the plurality of first electrodes and the electrode contact are arranged at intervals, the interval between the first electrodes and the electrode contact is in direct correspondence with the shielding part, and the orthographic projections of the first electrodes and the electrode contact on the array substrate are adjacent to or partially overlapped with the orthographic projection of the shielding part on the array substrate;
forming a light emitting layer including a pixel defining layer formed on the first electrode layer, the pixel defining layer having a plurality of first openings provided therein corresponding to the respective first electrodes and second openings corresponding to the electrode contacts, the first openings having light emitting materials provided therein, the second openings exposing at least a portion of the electrode contacts;
forming a second electrode material layer on the light emitting layer and in the second opening, the second electrode material layer being in contact with the electrode contact;
and with the shielding part, the first electrode and the electrode contact as masks, performing laser etching on the second electrode material layer to form a second electrode layer, wherein the second electrode layer is provided with a hollow area, and the orthographic projection of the second electrode layer on the array substrate covers the first electrode, the electrode contact and the orthographic projection of the shielding part on the array substrate.
10. The method of claim 9, wherein the first electrode, the electrode contact and the shielding portion are all made of opaque material, and the second electrode is made of silver, magnesium-silver alloy or aluminum.
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CN202110680227.5A CN113421904B (en) | 2021-06-18 | 2021-06-18 | Display panel and manufacturing method thereof |
KR1020237020667A KR20230101925A (en) | 2021-06-18 | 2022-03-31 | Display panel and its manufacturing method |
PCT/CN2022/084646 WO2022262367A1 (en) | 2021-06-18 | 2022-03-31 | Display panel and method for manufacturing same |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114400239A (en) * | 2021-12-21 | 2022-04-26 | 昆山国显光电有限公司 | Display panel, display device and preparation method of display panel |
CN115132749A (en) * | 2022-06-28 | 2022-09-30 | 昆山国显光电有限公司 | Array substrate and display panel |
WO2022262367A1 (en) * | 2021-06-18 | 2022-12-22 | 合肥维信诺科技有限公司 | Display panel and method for manufacturing same |
WO2024031833A1 (en) * | 2022-08-09 | 2024-02-15 | 昆山国显光电有限公司 | Display panel, display apparatus, and method for preparing display panel |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140353657A1 (en) * | 2012-02-20 | 2014-12-04 | Kaneka Corporation | Organic el device and method for manufacturing organic el device |
US20160240810A1 (en) * | 2015-02-13 | 2016-08-18 | Samsung Display Co., Ltd. | Organic light emitting display device and method of manufacturing an organic light emitting display device |
CN205645814U (en) * | 2016-03-15 | 2016-10-12 | 上海天马微电子有限公司 | Organic light-emitting display panel |
CN209119108U (en) * | 2018-12-12 | 2019-07-16 | 武汉华星光电技术有限公司 | A kind of OLED display |
WO2019208895A1 (en) * | 2018-04-27 | 2019-10-31 | 셀로코아이엔티 주식회사 | In-cell touch display device and manufacturing method therefor |
CN111952481A (en) * | 2020-08-25 | 2020-11-17 | 湖北长江新型显示产业创新中心有限公司 | Display panel and electronic device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100466398B1 (en) * | 2000-11-14 | 2005-01-13 | 현대엘씨디주식회사 | Method for manufacturing cathode electrodes of electroluminescent display device |
KR102020805B1 (en) * | 2012-12-28 | 2019-09-11 | 엘지디스플레이 주식회사 | Transparent organic light emitting display device and method for manufacturing the same |
CN105552107A (en) * | 2016-02-29 | 2016-05-04 | 上海天马有机发光显示技术有限公司 | Display panel, manufacturing method and electronic equipment |
CN106876331B (en) * | 2017-03-03 | 2019-11-22 | 武汉华星光电技术有限公司 | OLED display panel and preparation method thereof, display device |
CN108470749A (en) * | 2018-03-07 | 2018-08-31 | 深圳市华星光电半导体显示技术有限公司 | Display panel and its manufacturing method |
CN110854290B (en) * | 2019-10-29 | 2021-06-22 | 苏州华星光电技术有限公司 | Display panel and preparation method thereof |
CN112635693A (en) * | 2021-01-05 | 2021-04-09 | Tcl华星光电技术有限公司 | Array substrate and preparation method thereof |
CN113421904B (en) * | 2021-06-18 | 2024-02-13 | 合肥维信诺科技有限公司 | Display panel and manufacturing method thereof |
-
2021
- 2021-06-18 CN CN202110680227.5A patent/CN113421904B/en active Active
-
2022
- 2022-03-31 KR KR1020237020667A patent/KR20230101925A/en active Search and Examination
- 2022-03-31 WO PCT/CN2022/084646 patent/WO2022262367A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140353657A1 (en) * | 2012-02-20 | 2014-12-04 | Kaneka Corporation | Organic el device and method for manufacturing organic el device |
US20160240810A1 (en) * | 2015-02-13 | 2016-08-18 | Samsung Display Co., Ltd. | Organic light emitting display device and method of manufacturing an organic light emitting display device |
CN205645814U (en) * | 2016-03-15 | 2016-10-12 | 上海天马微电子有限公司 | Organic light-emitting display panel |
WO2019208895A1 (en) * | 2018-04-27 | 2019-10-31 | 셀로코아이엔티 주식회사 | In-cell touch display device and manufacturing method therefor |
CN209119108U (en) * | 2018-12-12 | 2019-07-16 | 武汉华星光电技术有限公司 | A kind of OLED display |
CN111952481A (en) * | 2020-08-25 | 2020-11-17 | 湖北长江新型显示产业创新中心有限公司 | Display panel and electronic device |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022262367A1 (en) * | 2021-06-18 | 2022-12-22 | 合肥维信诺科技有限公司 | Display panel and method for manufacturing same |
CN114400239A (en) * | 2021-12-21 | 2022-04-26 | 昆山国显光电有限公司 | Display panel, display device and preparation method of display panel |
CN115132749A (en) * | 2022-06-28 | 2022-09-30 | 昆山国显光电有限公司 | Array substrate and display panel |
CN115132749B (en) * | 2022-06-28 | 2023-05-02 | 昆山国显光电有限公司 | Array substrate and display panel |
WO2024031833A1 (en) * | 2022-08-09 | 2024-02-15 | 昆山国显光电有限公司 | Display panel, display apparatus, and method for preparing display panel |
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