CN113419639B - Preparation process of integrated electrode for capacitance pen and preparation process of capacitance pen nib assembly - Google Patents
Preparation process of integrated electrode for capacitance pen and preparation process of capacitance pen nib assembly Download PDFInfo
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- CN113419639B CN113419639B CN202110614912.8A CN202110614912A CN113419639B CN 113419639 B CN113419639 B CN 113419639B CN 202110614912 A CN202110614912 A CN 202110614912A CN 113419639 B CN113419639 B CN 113419639B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
- G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
- G06F3/03545—Pens or stylus
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0442—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using active external devices, e.g. active pens, for transmitting changes in electrical potential to be received by the digitiser
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention discloses a preparation process of an integrated electrode for a capacitance pen and a preparation process of a nib component of the capacitance pen, wherein the preparation process of the integrated electrode for the capacitance pen comprises the following steps of taking a battery cell as a matrix, and injection molding a first plastic cylinder on the battery cell; preparing a GND layer line on the peripheral wall of a first plastic cylinder to obtain a first semi-finished product; taking the first semi-finished product as a matrix, and injection molding a second plastic cylinder on the first semi-finished product; preparing a TX 2/RX layer circuit on the peripheral wall of the second plastic cylinder to obtain a second semi-finished product; and taking the second semi-finished product as a matrix, and injection molding a plastic shell on the second semi-finished product. The preparation of the electrode assembly comprises three times of injection molding and two times of circuit manufacturing, the whole process does not need to produce and assemble miniature structural parts, the production and manufacturing work of the electrode assembly are facilitated, the production efficiency of the electrode assembly is improved, the manufacturing cost of the electrode assembly is reduced, and the structural stability of the electrode assembly can be improved due to the integrated design of the electrode assembly.
Description
Technical Field
The invention relates to the technical field of capacitive touch pens, in particular to a preparation process of an integrated electrode for a capacitive pen and a preparation process of a pen point component of the capacitive pen.
Background
With the increasing popularity of capacitive screens, electronic products such as tablet computers, mobile phones and navigator increasingly use capacitive screens for operation control, although the capacitive screens can be touched by fingers, the touch accuracy of the fingers is not good because the touch screen is easy to be stained by the fingers, and some professionals cannot achieve the required accuracy by the fingers, so that more and more consumers pursue high-quality capacitive touch pens to operate the touch screens.
The capacitor pen is limited by the size, so that the structural parts are slightly difficult to mass produce and assemble, particularly, the electrode assembly used for the capacitor pen comprises a plurality of miniature structural parts, the assembly is very troublesome, and the structural stability is also difficult to ensure.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: provides a preparation process of an integrated electrode for a capacitance pen and a preparation process of a nib component of the capacitance pen.
In order to solve the technical problems, the invention adopts the following technical scheme: the preparation process of the integrated electrode for the capacitance pen comprises the following steps,
taking the battery cell as a matrix, and injection molding a first plastic cylinder on the battery cell;
preparing a GND layer line on the peripheral wall of the first plastic cylinder to obtain a first semi-finished product;
taking the first semi-finished product as a matrix, and injection molding a second plastic cylinder on the first semi-finished product;
preparing a TX 2/RX layer circuit on the peripheral wall of the second plastic cylinder to obtain a second semi-finished product;
and taking the second semi-finished product as a matrix, and injection molding a plastic shell on the second semi-finished product.
In order to solve the technical problems, the invention also adopts the following technical scheme: the preparation process of the capacitive pen nib component comprises the following steps,
acquiring an electrode assembly, a pen tip shaft, a strain sensor and a chip assembly, wherein the electrode assembly is prepared by adopting the integrated electrode preparation process for the capacitance pen;
and respectively mounting the electrode assembly, the strain sensor and the chip assembly on the pen tip shaft, and conducting the chip assembly and the strain sensor.
The invention has the beneficial effects that: the preparation of electrode assembly includes three times injection molding and twice circuit preparation, and whole process need not production, equipment miniature structure, has made things convenient for electrode assembly's production manufacturing work greatly, does benefit to the production efficiency that improves electrode assembly and reduces electrode assembly's manufacturing cost, moreover, electrode assembly integrated design can effectively improve electrode assembly's structural stability, reduces the probability of dropping the damage for electrode assembly is durable, does benefit to reinforcing user experience.
Drawings
Fig. 1 is a cross-sectional view of an electrode assembly manufactured by an integrated electrode manufacturing process for a capacitive pen embodying an embodiment of the present invention;
FIG. 2 is a schematic diagram of a capacitive pen nib assembly manufactured by implementing the capacitive pen nib assembly manufacturing process according to the second/third embodiment of the present invention;
fig. 3 is a schematic structural diagram of a capacitive pen nib assembly (after hiding a sheet metal shell) manufactured by implementing the capacitive pen nib assembly manufacturing process of the second embodiment;
fig. 4 is a top view of a material plate after implementing step S100 in the second/third embodiment of the present invention;
fig. 5 is a left side view of the material plate after implementing step S200 in the second/third embodiment of the present invention;
fig. 6 is a cross-sectional view of a gimbal structure in accordance with a third embodiment of the present invention.
Description of the reference numerals:
1. an electrode assembly; 11. a battery cell; 12. a first plastic cylinder; 13. a GND layer line; 14. a second plastic cylinder; 15. a TX 2/RX layer line; 16. a plastic housing; 17. pogo pin;
2. a pen tip shaft;
3. a strain sensor; 31. a material plate; 32. a mass of material; 33. strain gauges;
4. a sheet metal shell;
9. a sleeve assembly; 91. an inner sleeve; 911. an outer cambered surface; 912. a chamfering structure; 92. an outer sleeve; 921. an annular portion; 9211. an intrados surface; 922. an extension.
Detailed Description
In order to describe the technical contents, the achieved objects and effects of the present invention in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
Referring to fig. 1 to 6, the manufacturing process of the integrated electrode for the capacitive pen comprises the following steps,
taking the battery cell 11 as a matrix, and injection molding a first plastic cylinder 12 on the battery cell 11;
preparing a GND layer line 13 on the outer peripheral wall of the first plastic cylinder 12 to obtain a first semi-finished product;
taking the first semi-finished product as a matrix, and performing injection molding on the first semi-finished product to form a second plastic cylinder 14;
preparing a TX 2/RX layer circuit 15 on the peripheral wall of the second plastic cylinder 14 to obtain a second semi-finished product;
the second semifinished product is used as a base body, on which the plastic housing 16 is injection molded.
From the above description, the beneficial effects of the invention are as follows: the preparation of electrode assembly 1 includes three times injection molding and twice circuit preparation, and whole process need not production, equipment miniature structure spare, has made things convenient for electrode assembly 1's production manufacturing work greatly, does benefit to the production efficiency that improves electrode assembly 1 and reduces electrode assembly 1's manufacturing cost, moreover, electrode assembly 1 integrated design can effectively improve electrode assembly 1's structural stability, reduces the probability of dropping the damage for electrode assembly 1 is durable, does benefit to reinforcing user experience.
Further, the step of preparing the GND layer line 13 on the outer peripheral wall of the first plastic cylinder 12 includes the steps of first sputtering a first tin metal layer on the outer peripheral wall of the first plastic cylinder 12, then laser carving the first tin metal layer to form a first line, and finally electroplating a first copper layer on the first line to complete the preparation of the GND layer line 13.
From the above description, the molding process of the GND layer wire 13 is simple, and the GND layer wire 13 and the first plastic cylinder 12 have good bonding stability and are not easy to separate.
Further, the step of preparing the TX 2/RX layer circuit 15 on the outer peripheral wall of the second plastic cylinder 14 includes the steps of sputtering a second tin metal layer on the outer peripheral wall of the second plastic cylinder 14, laser engraving the second circuit on the second tin metal layer, and finally electroplating the second copper layer on the second circuit to complete the preparation of the TX 2/RX layer circuit 15.
As can be seen from the above description, the molding process of the TX 2/RX layer circuit 15 is simple, and the combination stability of the TX 2/RX layer circuit 15 and the second plastic cylinder 14 is good, so that the TX 2/RX layer circuit is not easy to separate.
Further, when the first plastic cylinder 12 is injection molded on the battery cell 11, injection molding operation is performed by taking the battery cell 11 and the Pogo pin17 as substrates; wherein, the Pogo pin17 is coaxial with the battery cell 11 and is mutually contradicted.
As can be seen from the above description, the Pogo pin17 is directly injected into the first plastic barrel 12, and the additional assembly of the Pogo pin17 is not needed in the following steps, which further facilitates the production and manufacture of the electrode assembly 1.
The preparation process of the capacitive pen nib component comprises the following steps,
the method comprises the steps of obtaining an electrode assembly 1, a pen point shaft 2, a strain sensor 3 and a chip assembly, wherein the electrode assembly 1 is manufactured by adopting the integrated electrode manufacturing process for the capacitance pen;
the electrode assembly 1, the strain sensor 3 and the chip assembly are respectively mounted on the pen-tip shaft 2, and the chip assembly is conducted with the strain sensor 3.
From the above description, it is apparent that capacitive pen nib assemblies are easy to manufacture.
Further, the acquisition of the strain sensor 3 comprises the steps of,
connecting and fixing a plurality of strain gauges 33 with a plurality of material blocks 32 on the material plate 31, wherein the strain gauges 33 are in one-to-one correspondence with the material blocks 32;
bending the area of the material block 32 corresponding to the strain gauge 33;
the mass 32 is removed from the plate 31 to obtain the strain sensor 3.
As can be seen from the above description, when the material block 32 is still in a flat state, the strain gauge 33 is connected and fixed with the material block 32, which is beneficial to improving the assembly accuracy and assembly efficiency of the material block 32 and the strain gauge 33, and effectively ensuring the consistency of mass-produced capacitive pen nib assemblies.
Further, when the material block 32 is bent to correspond to the region of the strain gauge 33, all the material blocks 32 on the material plate 31 are bent by one punching operation of the punching device.
Further, when "removing the material block 32 from the material plate 31", all the material blocks 32 on the material plate 31 are removed by one punching operation of the punching apparatus.
As can be seen from the above description, in the strain sensor 3, the elastic body is bent uniformly, and the processing efficiency is extremely high, which is beneficial to mass production.
Further, the specific step of mounting the electrode assembly 1 to the nib shaft 2 is as follows, in which the electrode assembly 1 is first inserted into the mounting hole of the nib shaft 2, and then the electrode assembly 1 is fixed to the nib shaft 2 using a lock nut.
From the above description, the electrode assembly 1 and the pen tip shaft 2 are fixed in a simple and reliable manner.
Further, the method further comprises the steps of mounting the electrode assembly 1, the strain sensor 3 and the chip assembly on the pen tip shaft 2 respectively, sleeving the sheet metal shell 4 outside the pen tip shaft 2, and connecting and fixing the sheet metal shell 4 and the strain sensor 3.
From the above description, the metal plate shell 4 can play a role of shielding signals, which is beneficial to ensuring the performance of the capacitive pen nib assembly.
Example 1
Referring to fig. 1, a first embodiment of the present invention is as follows: an integrated electrode preparation process for a capacitive stylus is used for preparing an electrode assembly 1 used for the capacitive stylus.
The preparation process of the integrated electrode for the capacitance pen comprises the following steps,
s1, taking a battery cell 11 as a matrix, and injection molding a first plastic cylinder 12 on the battery cell 11;
s2, preparing a GND layer line 13 on the outer peripheral wall of the first plastic cylinder 12 to obtain a first semi-finished product;
s3, taking a first semi-finished product as a matrix, and performing injection molding on the first semi-finished product to form a second plastic cylinder 14;
s4, preparing a TX 2/RX layer circuit 15 on the peripheral wall of the second plastic cylinder 14 to obtain a second semi-finished product;
s5, taking the second semi-finished product as a matrix, and injection molding a plastic shell 16 on the second semi-finished product.
It is easy to understand that, in the structure obtained in step S1, the first plastic cylinder 12 has a structure with two open ends and a first hollow area, where the battery cell 11 is located in the first hollow area, that is, the first plastic cylinder 12 wraps the battery cell 11; in the structure obtained in step S3, the second plastic cylinder 14 has a structure with two open ends and a second hollow area, wherein the first semi-finished product is located in the second hollow area, that is, the second plastic cylinder 14 wraps the first semi-finished product, and the second plastic cylinder 14 covers the GND layer line 13, so that the risk of peeling of the GND layer line 13 is reduced; in the structure obtained in step S5, the plastic housing 16 has a structure with two open ends and a third hollow area, wherein the second semi-finished product is located in the third hollow area, that is, the plastic housing 16 wraps the second semi-finished product, and the plastic housing 16 covers the TX 2/RX layer circuit 15, so that the risk of peeling of the TX 2/RX layer circuit 15 is reduced.
In step S2, "preparing the GND layer line 13 on the outer peripheral wall of the first plastic cylinder 12" includes the steps of sputtering a first tin metal layer on the outer peripheral wall of the first plastic cylinder 12, laser engraving the first line on the first tin metal layer, and finally electroplating the first copper layer on the first line to complete the preparation of the GND layer line 13. The thickness of the first tin metal layer is 0.1-0.5um, the thickness of the first copper layer is 6-10um, in this embodiment, the thickness of the first tin metal layer is 0.3um, and the thickness of the first copper layer is 8um.
In step S4, "preparing the TX 2/RX layer circuit 15 on the outer peripheral wall of the second plastic cylinder 14" includes the steps of sputtering a second tin metal layer on the outer peripheral wall of the second plastic cylinder 14, laser engraving the second circuit on the second tin metal layer, and finally electroplating the second copper layer on the second circuit to complete the preparation of the TX 2/RX layer circuit 15. The thickness of the second tin metal layer is 0.1-0.5um, the thickness of the second copper layer is 6-10um, in this embodiment, the thickness of the second tin metal layer is 0.3um, and the thickness of the second copper layer is 8um.
In order to avoid the need for assembling the Pogo pin17 in the following steps, preferably, in step S1", when the first plastic barrel 12" is injection molded on the battery cell 11, the injection molding operation is performed by using the battery cell 11 and the Pogo pin17 as the substrates; wherein, the Pogo pin17 is coaxial with the battery cell 11 and is mutually contradicted.
Example two
Referring to fig. 1 to 5, a second embodiment of the present invention is as follows: a manufacturing process of a nib component of a capacitive stylus is used for manufacturing the nib component used by the capacitive stylus.
The preparation process of the capacitive pen nib component comprises the following steps,
s10, acquiring an electrode assembly 1, a pen tip shaft 2, a strain sensor 3 and a chip assembly (not shown), wherein the electrode assembly 1 is an integrated electrode for a capacitive pen;
and S20, respectively mounting the electrode assembly 1, the strain sensor 3 and the chip assembly on the pen point shaft 2, and conducting the chip assembly and the strain sensor 3.
Referring to fig. 1, the preparation process of the integrated electrode for the capacitive pen comprises the following steps,
s1, taking a battery cell 11 as a matrix, and injection molding a first plastic cylinder 12 on the battery cell 11;
s2, preparing a GND layer line 13 on the outer peripheral wall of the first plastic cylinder 12 to obtain a first semi-finished product;
s3, taking a first semi-finished product as a matrix, and performing injection molding on the first semi-finished product to form a second plastic cylinder 14;
s4, preparing a TX 2/RX layer circuit 15 on the peripheral wall of the second plastic cylinder 14 to obtain a second semi-finished product;
s5, taking the second semi-finished product as a matrix, and injection molding a plastic shell 16 on the second semi-finished product.
It is easy to understand that, in the structure obtained in step S1, the first plastic cylinder 12 has a structure with two open ends and a first hollow area, where the battery cell 11 is located in the first hollow area, that is, the first plastic cylinder 12 wraps the battery cell 11; in the structure obtained in step S3, the second plastic cylinder 14 has a structure with two open ends and a second hollow area, wherein the first semi-finished product is located in the second hollow area, that is, the second plastic cylinder 14 wraps the first semi-finished product, and the second plastic cylinder 14 covers the GND layer line 13, so that the risk of peeling of the GND layer line 13 is reduced; in the structure obtained in step S5, the plastic housing 16 has a structure with two open ends and a third hollow area, wherein the second semi-finished product is located in the third hollow area, that is, the plastic housing 16 wraps the second semi-finished product, and the plastic housing 16 covers the TX 2/RX layer circuit 15, so that the risk of peeling of the TX 2/RX layer circuit 15 is reduced.
In step S2, "preparing the GND layer line 13 on the outer peripheral wall of the first plastic cylinder 12" includes the steps of sputtering a first tin metal layer on the outer peripheral wall of the first plastic cylinder 12, laser engraving the first line on the first tin metal layer, and finally electroplating the first copper layer on the first line to complete the preparation of the GND layer line 13. The thickness of the first tin metal layer is 0.1-0.5um, the thickness of the first copper layer is 6-10um, in this embodiment, the thickness of the first tin metal layer is 0.3um, and the thickness of the first copper layer is 8um.
In step S4, "preparing the TX 2/RX layer circuit 15 on the outer peripheral wall of the second plastic cylinder 14" includes the steps of sputtering a second tin metal layer on the outer peripheral wall of the second plastic cylinder 14, laser engraving the second circuit on the second tin metal layer, and finally electroplating the second copper layer on the second circuit to complete the preparation of the TX 2/RX layer circuit 15. The thickness of the second tin metal layer is 0.1-0.5um, the thickness of the second copper layer is 6-10um, in this embodiment, the thickness of the second tin metal layer is 0.3um, and the thickness of the second copper layer is 8um.
In order to avoid the need for assembling the Pogo pin17 in the following steps, preferably, in step S1", when the first plastic barrel 12" is injection molded on the battery cell 11, the injection molding operation is performed by using the battery cell 11 and the Pogo pin17 as the substrates; wherein, the Pogo pin17 is coaxial with the battery cell 11 and is mutually contradicted.
Referring to fig. 4 and 5, in step S10, the step of obtaining the strain sensor 3 specifically includes the steps of,
s100, connecting and fixing a plurality of strain gauges 33 with a plurality of material blocks 32 on a material plate 31, wherein the strain gauges 33 are in one-to-one correspondence with the material blocks 32;
s200, bending the area of the material block 32 corresponding to the strain gauge 33, wherein the bent material block 32 is L-shaped as a whole;
and S300, detaching the material block 32 from the material plate 31 to obtain the strain sensor 3.
In step S200, when the area of the material block 32 corresponding to the strain gauge 33 is bent, all the material blocks 32 on the material plate 31 are bent by one pressing operation of the pressing device, so that the processing efficiency of the strain sensor 3 can be effectively improved, and it is possible to bend only a part of the material blocks 32 by one pressing operation of the pressing device.
In step S300, when the material block 32 is removed from the material plate 31, all the material blocks 32 on the material plate 31 are removed by one punching operation of the punching apparatus, so that the processing efficiency of the strain sensor 3 can be effectively improved, and it is needless to say that only a part of the material blocks 32 may be punched from the material plate 31 by one punching operation of the punching apparatus.
In step S20, the specific step of mounting the electrode assembly 1 to the nib shaft 2 is as follows, the electrode assembly 1 is first inserted into the mounting hole of the nib shaft 2, and then the electrode assembly 1 is fixed to the nib shaft 2 by means of the locking nut.
In order to improve the performance of the nib assembly of the capacitive pen, please refer to fig. 2 and 3, optionally, step S20 is followed by step S30, in which a sheet metal shell 4 is sleeved outside the nib shaft 2 and the sheet metal shell 4 is fixedly connected with the strain sensor 3. The connection mode of the sheet metal shell 4 and the strain sensor 3 can be selected from welding and the like.
Example III
Referring to fig. 1 to 6, a third embodiment of the present invention is a further improvement based on the second embodiment, and is different from the second embodiment only in that: referring to fig. 1 to 3, step S10 is to acquire not only the electrode assembly 1, the nib shaft 2, the strain sensor 3 and the chip assembly, but also the gimbal structure; step S20 requires not only the electrode assembly 1, the strain sensor 3 and the chip assembly to be mounted on the nib shaft 2, respectively, but also the gimbal to be mounted on the nib shaft 2; step S30 not only needs to connect and fix the sheet metal shell 4 and the strain sensor 3, but also needs to connect and fix the sheet metal shell 4 and the universal structure. The connection mode of the sheet metal shell 4 and the universal structure can be selected to be welded, etc.
According to the embodiment, the L-shaped strain sensor 3 is matched with a universal structure, so that the problem that the strain gauge 33 is large in deformation difference under the same load condition when the capacitance pen is at different writing angles can be effectively solved, and the use effect and experience of a nib component of the capacitance pen are improved; and compared with the independent L-shaped strain sensor 3, the increase of the universal structure can share partial stress of the L-shaped strain sensor 3 and reduce deformation of the L-shaped strain sensor 3, so that the service life of the L-shaped strain sensor 3 is prolonged.
Referring to fig. 2, 3 and 6, in detail, the universal structure includes a sleeve assembly 9, the sleeve assembly 9 includes an inner sleeve 91 and an outer sleeve 92 that are matched, the inner sleeve 91 is sleeved on the pen-tip shaft 2, and the outer sleeve 92 is fixed on the sheet metal shell 4. In detail, the number of the outer sleeves 92 in the sleeve assembly 9 is two, the outer sleeves 92 comprise annular portions 921, the annular portions 921 have inner cambered surfaces 9211, outer circumferential walls of the inner sleeves 91 are provided with outer cambered surfaces 911 matched with the inner cambered surfaces 9211, the annular portions 921 of the two outer sleeves 92 are mutually close to form limiting cavities for limiting the inner sleeves 91, and diameters of two openings of the limiting cavities are smaller than the maximum diameter of the outer cambered surfaces 911, so that the inner sleeves 91 can be prevented from being separated from the limiting cavities, and structural stability of the sleeve assembly 9 is guaranteed.
Preferably, the two outer sleeves 92 of the sleeve assembly 9 are fixedly connected to each other, in this embodiment, the outer sleeves 92 further include an extension 922, the extension 922 is located outside the annular portion 921 and is connected to the annular portion 921, and the outer sleeve 92 is fixed to the sheet metal shell 4 through the extension 922. Specifically, the two extending portions 922 in the sleeve assembly 9 are welded and fixed, the inner sleeve 91 is welded and fixed on the pen tip shaft 2, and it is also possible to connect the two outer sleeves 92 by other fixing methods, such as screwing, clamping, bonding, etc.; likewise, the inner hub 91 may be fixed to the pen tip shaft 2 by other fixing methods, such as clamping, interference fit, adhesion, screwing, etc.
As a preferred embodiment, the inner sleeve 91 is provided with a mounting hole matched with the nib shaft 2, and both ends of the mounting hole are respectively provided with a chamfer structure 912, and the chamfer structure 912 can play a guiding role when the inner sleeve 91 is mounted on the nib shaft 2, so that the inner sleeve 91 is convenient to mount; when the inner sleeve 91 is welded to the nib shaft 2, the chamfer 912 can serve to contain tin, thereby improving the stability of the connection of the inner sleeve 91 to the nib shaft 2. It can be seen that the chamfer 912 provides a one-piece multi-purpose in this embodiment.
To ensure structural stability of the outer sleeve 92 and to facilitate manufacturing thereof, the ring portion 921 and the extension portion 922 are integrally formed by stretching a metal plate.
In summary, the preparation process of the integrated electrode for the capacitance pen and the preparation process of the nib component of the capacitance pen provided by the invention have the advantages that the preparation of the electrode component comprises three times of injection molding and two times of circuit manufacture, the whole process does not need to produce and assemble micro structural parts, the production and manufacturing work of the electrode component are greatly facilitated, the production efficiency of the electrode component is improved, the manufacturing cost of the electrode component is reduced, in addition, the integrated design of the electrode component can effectively improve the structural stability of the electrode component, the falling damage probability is reduced, the electrode component is durable, and the user experience is enhanced.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent changes made by the specification and drawings of the present invention, or direct or indirect application in the relevant art, are included in the scope of the present invention.
Claims (8)
1. The preparation process of the capacitive pen nib component is characterized by comprising the following steps of: comprises the following steps of the method,
s10, acquiring an electrode assembly, a pen tip shaft, a strain sensor, a chip assembly and a universal structure;
s20, respectively mounting the electrode assembly, the strain sensor, the chip assembly and the universal structure on the pen point shaft, and conducting the chip assembly and the strain sensor;
s30, sleeving a metal plate shell outside the pen point shaft, and connecting and fixing the metal plate shell with the strain sensor and the universal structure;
the obtaining of the electrode assembly includes the steps of,
s1, taking a battery cell as a matrix, and injection molding a first plastic cylinder on the battery cell;
s2, preparing a GND layer line on the peripheral wall of the first plastic cylinder to obtain a first semi-finished product;
s3, taking the first semi-finished product as a matrix, and performing injection molding on the first semi-finished product to form a second plastic cylinder;
s4, preparing a TX 2/RX layer circuit on the peripheral wall of the second plastic cylinder to obtain a second semi-finished product;
s5, taking a second semi-finished product as a matrix, and performing injection molding on the second semi-finished product to form a plastic shell;
the obtaining of the strain sensor comprises the steps of,
s100, connecting and fixing a plurality of strain gauges with a plurality of material blocks on a material plate, wherein the strain gauges correspond to the material blocks one by one;
s200, bending the area, corresponding to the strain gauge, of the material block, wherein the bent material block is L-shaped overall;
and S300, detaching the material block from the material plate to obtain the strain sensor.
2. The capacitive pen nib assembly manufacturing process of claim 1, wherein: the manufacturing method of the GND layer line on the outer peripheral wall of the first plastic cylinder body comprises the following steps of firstly sputtering and forming a first tin metal layer on the outer peripheral wall of the first plastic cylinder body, then radium-carving and forming a first line on the first tin metal layer, and finally electroplating and forming a first copper layer on the first line to finish the manufacturing of the GND layer line.
3. The capacitive pen nib assembly manufacturing process of claim 1, wherein: the preparation of the TX 2/RX layer circuit on the peripheral wall of the second plastic cylinder comprises the following steps of firstly sputtering and forming a second tin metal layer on the peripheral wall of the second plastic cylinder, then radium carving and forming a second circuit on the second tin metal layer, and finally electroplating and forming a second copper layer on the second circuit, thereby completing the preparation of the TX 2/RX layer circuit.
4. The capacitive pen nib assembly manufacturing process of claim 1, wherein: when the first plastic cylinder is injection molded on the battery cell, the battery cell and the Pogo pin are used as a matrix for injection molding operation; wherein, pogo pin with the electric core is coaxial and contradict each other.
5. The capacitive pen nib assembly manufacturing process of claim 1, wherein: when the area of the material block corresponding to the strain gauge is bent, all the material blocks on the material plate are bent by one stamping action of stamping equipment.
6. The capacitive pen nib assembly manufacturing process of claim 1, wherein: when the material blocks are detached from the material plate, all the material blocks on the material plate are detached by one punching action of the punching equipment.
7. The capacitive pen nib assembly manufacturing process of claim 1, wherein: the specific steps of mounting the electrode assembly to the nib shaft are as follows, the electrode assembly is first inserted into the mounting hole of the nib shaft, and then the electrode assembly is fixed to the nib shaft by means of the locking nut.
8. The capacitive pen nib assembly manufacturing process of claim 1, wherein: the method comprises the steps of mounting the electrode assembly, the strain sensor and the chip assembly on the pen tip shaft respectively, sleeving a sheet metal shell outside the pen tip shaft, and connecting and fixing the sheet metal shell and the strain sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110614912.8A CN113419639B (en) | 2021-06-02 | 2021-06-02 | Preparation process of integrated electrode for capacitance pen and preparation process of capacitance pen nib assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110614912.8A CN113419639B (en) | 2021-06-02 | 2021-06-02 | Preparation process of integrated electrode for capacitance pen and preparation process of capacitance pen nib assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113419639A CN113419639A (en) | 2021-09-21 |
| CN113419639B true CN113419639B (en) | 2023-06-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110614912.8A Active CN113419639B (en) | 2021-06-02 | 2021-06-02 | Preparation process of integrated electrode for capacitance pen and preparation process of capacitance pen nib assembly |
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| US6720957B1 (en) * | 2000-06-09 | 2004-04-13 | High Tech Computer Corporation | Method for manufacturing improved touch pen and device formed thereby |
| US9851818B2 (en) * | 2015-10-19 | 2017-12-26 | Microsoft Technology Licensing, Llc | Handheld input apparatus |
| CN108008841A (en) * | 2016-10-28 | 2018-05-08 | 翰硕电子股份有限公司 | Capacitance pen with double emission electrodes |
| CN207238904U (en) * | 2017-08-24 | 2018-04-17 | 昆山永顺电子科技发展有限公司 | A kind of bearing continuous stamping die |
| CN108007631B (en) * | 2017-11-22 | 2020-10-23 | 怡得乐电子(杭州)有限公司 | Pressure sensor production forming process |
| CN108788767B (en) * | 2018-05-29 | 2024-01-05 | 杭州泰尚机械有限公司 | Welding equipment for realizing welding of two material sheet patches and control method thereof |
| CN209625169U (en) * | 2019-05-09 | 2019-11-12 | 黄玲 | A kind of active capacitance pen mould group of tailored version |
| CN110347272A (en) * | 2019-07-11 | 2019-10-18 | 汉王科技股份有限公司 | Capacitance pen and its manufacturing method |
| CN210244311U (en) * | 2019-08-02 | 2020-04-03 | 深圳市千分一智能技术有限公司 | Active universal capacitive touch pen and pen point thereof |
| CN210836023U (en) * | 2019-12-06 | 2020-06-23 | 北京科加触控技术有限公司 | Pen head and capacitance pen |
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