CN113416496A - Glue film for packaging LED module and LED display screen - Google Patents

Glue film for packaging LED module and LED display screen Download PDF

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Publication number
CN113416496A
CN113416496A CN202110660422.1A CN202110660422A CN113416496A CN 113416496 A CN113416496 A CN 113416496A CN 202110660422 A CN202110660422 A CN 202110660422A CN 113416496 A CN113416496 A CN 113416496A
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layer
led
packaging
led display
pcb
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黄艳轶
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Guangzhou Human Chem Co ltd
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Guangzhou Human Chem Co ltd
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Priority to CN202110660422.1A priority Critical patent/CN113416496A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/14—Glass
    • C09J2400/143—Glass in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/006—Presence of (meth)acrylic polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2469/00—Presence of polycarbonate
    • C09J2469/006—Presence of polycarbonate in the substrate

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The adhesive film for packaging the LED module comprises a transparent adhesive layer, a supporting film layer and a black semi-transparent adhesive layer, wherein the supporting film layer is arranged between the transparent adhesive layer and the black semi-transparent adhesive layer. The adhesive film with the transparent adhesive layer for packaging the LED module has excellent adhesion, can be directly pasted to the surface of the LED display module, is simple in operation process, and meanwhile, the color of the PCB can be shielded by the black semi-transparent adhesive layer on the adhesive film for packaging the LED module, so that the colors of the surfaces of different display modules are consistent, and the contrast is increased.

Description

Glue film for packaging LED module and LED display screen
Technical Field
The invention belongs to the technical field of display screens, and particularly relates to an adhesive film for packaging an LED module and an LED display screen.
Background
The LED display screen has rich colors, real-time dynamic display modes, perfect multimedia effects and strong visual impact, develops rapidly in the field of outdoor display, and is particularly widely applied to railways, expressways, squares and superstores.
LED display screen generally is formed by the concatenation of a plurality of LED display screen boxes, and every LED display screen box all includes a box frame and a plurality of display module assembly, because the slight difference of production technology leads to the inconsistent problem of surperficial china ink colour between the display module assembly of different batches easily among the prior art, when splicing into the LED large screen, because the colour of monoblock screen is inhomogeneous, the display effect is poor, and the contrast is low, seriously influences the visual sensation. In view of this, the common solution in the industry is to spray ink on the surface of the LED screen, which increases the cost of installation and maintenance of the LED display screen, and the stability of the ink cannot be guaranteed. Therefore, it is necessary to research a new product, which not only can solve the problems of inconsistent ink color and low contrast on the surface of the LED display module, but also can be adapted to large-scale industrial production, and has simple and convenient operation process and reduced production cost.
Disclosure of Invention
The invention provides an adhesive film for packaging an LED module and an LED display screen, aiming at solving the problems of uneven color and low contrast among the existing LED display modules.
The purpose of the invention is realized by the following technical scheme:
on one hand, the invention provides an adhesive film for packaging an LED module, which comprises a transparent adhesive layer, a supporting film layer and a black semi-transparent adhesive layer, wherein the supporting film layer is arranged between the transparent adhesive layer and the black semi-transparent adhesive layer.
Optionally, the adhesive film for packaging the LED module further comprises a fingerprint-proof coating, wherein the fingerprint-proof coating is arranged on the surface of the black semitransparent adhesive layer, which deviates from the surface of the supporting film layer.
Optionally, the transparent adhesive layer is acrylate pressure-sensitive adhesive, thermoplastic elastomer pressure-sensitive adhesive or organic silicon pressure-sensitive adhesive, and the thickness of the transparent adhesive layer is 1-100 um.
Optionally, the support film layer is PET, PC, PMMA or glass, and the thickness of the support film layer is 5-100 um.
Optionally, the black translucent glue layer is dispersed with black particles.
Optionally, the black semitransparent glue layer is an acrylic resin layer, an epoxy resin layer, a polyester resin layer or a polyurethane resin layer, the thickness of the black semitransparent glue layer is 0.1-10um, the black semitransparent glue layer is preferably a modified acrylic resin layer, a modified epoxy resin layer, a modified polyester resin layer or a modified polyurethane resin layer, and the black semitransparent glue layer is preferably modified by silicon, fluorine or fluorine silicon; further preferred is a black translucent glue layer having a thickness of 0.5-10um
Optionally, the anti-fingerprint coating is a modified acrylic resin layer, a modified epoxy resin layer, a modified polyester resin layer or a modified polyurethane resin layer, and the thickness of the anti-fingerprint coating is 0.5-10 um.
On the other hand, the invention also provides an LED display screen which comprises an LED display module and the LED module packaging adhesive film, wherein the LED module packaging adhesive film is arranged on the light-emitting surface of the LED display module.
Optionally, the LED display module includes a driver IC, a PCB, an LED chip and a package layer, the driver IC is disposed on the surface of the PCB, the LED chip is disposed on a side of the PCB away from the driver IC, the package layer is disposed on the surface of the PCB and covers the LED chip, and a pixel pitch of the LED display module is P0.01-P4.0.
Optionally, the LED display module includes a driver IC, a PCB, a support, an LED chip and a package layer, the driver IC is disposed on the surface of the PCB, the support is disposed on a side of the PCB away from the driver IC, the LED chip is disposed on the support away from the surface of the PCB, the package layer is disposed on the surface of the support and covers the LED chip, and a pixel pitch of the LED display module is P0.01-P4.0.
The invention has the beneficial effects that: the black semitransparent glue layer on the glue film for packaging the LED module has certain light transmittance, and can shield the color of a PCB (printed circuit board), so that the colors of the surfaces of different LED display modules are consistent, the contrast is increased, and the quality and the display effect of an LED display screen are improved; in the LED module packaging adhesive film, the supporting film layer is used as a supporting structure of the black semi-transparent adhesive layer, so that the LED module packaging adhesive film can be produced and molded as a single component, the supporting film layer can effectively improve the coating smoothness of the black semi-transparent adhesive layer, the phenomenon that the thickness of the black semi-transparent adhesive layer is uneven due to the unevenness of the bottom layer is avoided, the uniformity of the overall thickness of the LED module packaging adhesive film is favorably ensured, the overall light transmittance of the black semi-transparent adhesive layer is ensured to be consistent, and chromatic aberration is avoided; the adhesive film with the transparent adhesive layer for packaging the LED module has excellent adhesion, can be directly adhered to the surface of the LED display module, is high in stability, is simple in operation process, does not need to be formed with the LED display module at the same time, can be used for producing the LED display module and the adhesive film for packaging the LED module respectively, is beneficial to controlling the consistency of products, reduces the construction difficulty, and is suitable for large-scale industrial production.
Drawings
Fig. 1 is a schematic structural view of an adhesive film for packaging an LED module according to some embodiments of the present invention;
fig. 2 is a schematic structural view of an adhesive film for packaging an LED module according to another embodiment of the present invention;
fig. 3 and 4 are schematic structural views of an LED display module using the adhesive film for packaging the LED module in fig. 1;
fig. 5 and 6 are schematic structural views of an LED display module using the adhesive film for packaging the LED module in fig. 2;
the reference numbers illustrate: 1. an adhesive film for packaging the LED module; 2. a driver IC; 3. a PCB board; 4a, an LED chip 4 a; 4b, an LED chip 4 b; 5a, a packaging layer 5 a; 5b, a packaging layer 5 b; 6. a support; 10. a transparent adhesive layer; 11. a support film layer; 12a, a black semitransparent glue layer 12 a; 12b, a black semitransparent glue layer 12 b; 13. anti-fingerprint coating.
Detailed Description
The technical solutions in the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings in the embodiments of the present invention. It should be understood that the embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.
It should be noted that all directional indicators (such as up, down, left, right, front, back, and deviation … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
As shown in fig. 1, an embodiment of the invention discloses an adhesive film 1 for packaging an LED module, which includes a transparent adhesive layer 10, a supporting film layer 11 and a black semi-transparent adhesive layer 12a, wherein the supporting film layer 11 is disposed between the transparent adhesive layer 10 and the black semi-transparent adhesive layer 12 a.
The adhesive film 1 with the transparent adhesive layer 10 for packaging the LED module has excellent adhesion, the adhesive film 1 for packaging the LED module can be produced on a large scale at the front end, the later stage is directly pasted to the surface of the LED display module, the production efficiency of the LED display screen is greatly improved, the adhesive film is high in stability for packaging the LED module, the operation process is simple, and the adhesive film is suitable for large-scale industrial production.
In some embodiments, referring to fig. 2, the adhesive film 1 for packaging the LED module further includes an anti-fingerprint coating 13, and the anti-fingerprint coating 13 is disposed on the surface of the black translucent adhesive layer 12b away from the support film layer 11.
Will prevent fingerprint coating 13 and set up in LED module encapsulation is with glued membrane 1, can play the guard action to black translucent adhesive 12b layer on the one hand, prevent black translucent adhesive 12 b's fracture, drop etc. ensure that the ink color on different LED display module surfaces is unanimous, on the other hand prevent that fingerprint coating 13 has excellent water-resistant anti-oil ability, can prevent the adhesion of dust or fingerprint on the LED display screen, improve the display effect of LED display screen, reinforcing user experience and visual effect.
In some embodiments, the transparent adhesive layer 10 is an acrylate pressure-sensitive adhesive, a thermoplastic elastomer pressure-sensitive adhesive or an organic silicon pressure-sensitive adhesive, and the thickness of the transparent adhesive layer 10 is 1-100 um.
Acrylate pressure-sensitive adhesive, thermoplastic elastomer pressure-sensitive adhesive or organosilicon pressure-sensitive adhesive can closely combine with the substrate through exerting pressure on its surface lightly when using, have excellent adhesive force, can make the glued membrane firmly fix on LED display module assembly surface, improve LED display module assembly's quality, work as when the thickness of transparent adhesive layer is less than 1um, because the thickness is too thin, the adhesive force to LED display module assembly is not enough, in the use, leads to droing of glued membrane easily, influences product quality, works as when the thickness of transparent adhesive layer is greater than 100um, the refractive index of glued membrane can be influenced to the transparent adhesive layer of excessive thickness to influence the luminous effect of LED chip.
Furthermore, the acrylate pressure-sensitive adhesive has the optimal effect.
In some embodiments, the support film layer 11 is PET, PC, PMMA or glass, and the thickness of the support film layer 11 is 5-100 um.
The PET, PC, PMMA or glass is a material with high hardness and high light transmittance, because the transparent adhesive layer has very low hardness and strong deformability, if the supporting film layer is not arranged, when the adhesive film is adhered to the LED display module with uneven surface, the black semi-transparent adhesive layer may be deformed during the use process, thereby causing the change of the refractive index and influencing the luminous effect of the LED chip, so the black semi-transparent adhesive layer is arranged between the transparent adhesive layer and the black semi-transparent adhesive layer, can support the black semitransparent glue layer and the anti-fingerprint coating, effectively avoid the deformation of the black semitransparent glue layer after being pasted to influence the product quality, when the thickness of the supporting film layer is less than 5um, because thickness is too thin, bears the pressure and diminishes easy fracture, and when thickness was greater than 100um, the refractive index can be influenced to too thick supporting layer, leads to the luminous effect variation of LED chip.
In some embodiments, the black translucent glue layer 12a or the black translucent glue layer 12b are both dispersed with black particles.
The black particles can be selected from nano graphene, carbon black, carbon nanotubes and the like, and are uniformly distributed in the black semitransparent glue layer, so that the PCB can be shielded, and the color difference among different LED display modules can be reduced.
In some embodiments, the mass ratio of the black particles in the black translucent adhesive layer 12a or the black translucent adhesive layer 12b is 0.01 to 50%, the light transmittance is 30 to 99%, and when the mass ratio is less than 0.01%, the content of the black particles in the black translucent adhesive layer is too small, the light transmittance is too large, and the effect of shielding the color of the PCB cannot be achieved, and when the mass ratio is more than 50%, the light transmittance of the black translucent adhesive layer is too low due to too much content of the black particles, and the light emitting effect of the LED chip is affected.
Further, in order to increase the matte effect of the black translucent adhesive layer, the black translucent adhesive layer 12a or the black translucent adhesive layer 12b may further disperse nano silica, titanium dioxide, alumina, nano resin or resin with the same matte effect, etc.
In some embodiments, referring to fig. 1, the black translucent adhesive layer 12a is a modified acrylic resin layer, a modified epoxy resin layer, a modified polyester resin layer, or a modified urethane resin layer, and the thickness of the black translucent adhesive layer 12a is 0.5-10 um.
The modified acrylic resin layer, the modified epoxy resin layer, the modified polyester resin layer or the modified polyurethane resin layer not only have excellent heat resistance and chemical corrosion resistance, but also can improve the quality of products, and simultaneously have extremely low surface tension, and can play the effects of resisting water, oil and solvent and preventing fingerprints. The thickness of the black semi-transparent adhesive layer 12a is between 0.5 and 10um, and the thickness can prevent the black semi-transparent adhesive layer from effectively shielding the color of the PCB due to too thin thickness, so that the effect of effectively enhancing contrast is achieved, and the influence of the black semi-transparent adhesive layer on the quality reliability of the film layer due to too thick thickness (such as easy cracking and uneven surface) can be avoided.
Further, the black semitransparent glue layer 12a may be formed on the surface of the supporting film layer 11 by spraying, printing, or glue pouring.
In other embodiments, referring to fig. 2, the black semi-transparent adhesive layer 12b is an acrylic resin layer, an epoxy resin layer, a polyester resin layer or a polyurethane resin layer, the thickness of the black semi-transparent adhesive layer 12b is 0.1-10um, the surface of the black semi-transparent adhesive layer 12b may further be provided with an anti-fingerprint coating layer 13, the anti-fingerprint coating layer 13 is a modified acrylic resin layer, a modified epoxy resin layer, a modified polyester resin layer or a modified polyurethane resin layer, and the thickness of the anti-fingerprint coating layer is 0.5-10 um.
The modified acrylic resin layer, the modified epoxy resin layer, the modified polyester resin layer or the modified polyurethane resin layer have good friction resistance and durability, and are strong in adhesive force with the black semitransparent glue layer 12b, so that the required durability and abrasion resistance can be provided for the application of the LED display screen, the surface of the LED screen is prevented from being scratched, meanwhile, the LED display screen has extremely low surface tension, excellent water resistance and oil resistance, dust and fingerprints adhered to the surface of the LED display screen can be reduced, the display effect is improved, the thickness of the fingerprint-proof coating 13 is 0.5-10um, and in the range, the black semitransparent glue layer 12b can be effectively protected, meanwhile, the LED display screen is resistant to scratch, alcohol wiping and fingerprints, and the display effect and the quality of the display screen are improved.
Further, the anti-fingerprint coating 13 may be formed on the surface of the black semitransparent glue layer 12b by spraying, printing, or glue pouring.
The invention further discloses an LED display screen, which comprises an LED display module and the adhesive film, wherein the adhesive film is arranged on the light-emitting surface of the LED display module.
The adhesive film 1 for packaging the LED module shown in the figure 1 or the figure 2 can be fixed on the light-emitting surface of the LED display module in an adhesive mode, and the black semitransparent adhesive layer on the adhesive film can shield the color of the PCB, so that the color difference between the LED display modules is reduced, and the contrast is improved.
In some embodiments, the LED display module includes a driver IC, a PCB, an LED chip and a package layer, the driver IC is disposed on a surface of the PCB, the LED chip is disposed on a side of the PCB away from the driver IC, the package layer is disposed on the surface of the PCB and covers the LED chip, and a pixel pitch of the LED display module is P0.01-P4.0.
Referring to fig. 3, the LED display module includes a driver IC2, a PCB 3, an LED chip 4a and a package layer 5a, the driver IC2 is disposed on the surface of the PCB 3, the LED chip 4a is disposed on a side of the PCB 3 facing away from the driver IC2, the package layer 5a is disposed on the surface of the PCB 3 and covers the LED chip 4a, the adhesive film 1 for LED module packaging is disposed on the package layer 5a facing away from the surface of the PCB 3, the adhesive film 1 for LED module packaging is sequentially provided with a transparent adhesive layer 10, a support film layer 11 and a black semi-transparent adhesive layer 12a, wherein the transparent adhesive layer 10 is adjacent to the package layer 5 a. The adhesive film 1 for packaging the LED module can be fixed on the surface of the LED display module in an adhesive mode, and is simple in process and high in production efficiency.
The pixel point distance of the LED display module is the distance from the center of one pixel point to the center of another adjacent pixel point in the adhesive film, wherein the pixel point distance is P0.01-P4.0, the Mini LED display screen belongs to a Mini LED display screen, the size of an LED chip is 100 microns in magnitude, the adhesive film 1 for packaging the LED module is suitable for the Mini LED display screen, the color difference between different display modules can be reduced, the color of the screen is consistent, and the contrast is improved.
In some embodiments, referring to fig. 5, the adhesive film 1 for packaging the LED module applied to the Mini LED display module further includes a fingerprint-proof coating 13, the fingerprint-proof coating 13 is disposed on the surface of the black semi-transparent adhesive layer 12b away from the supporting film layer 11, the fingerprint-proof coating 13 can prevent fingerprints or dust from adhering to the surface of the LED screen, and meanwhile, the adhesive film is scratch-resistant and friction-resistant, can protect the LED display screen, and can improve the product quality.
In some other embodiments, the LED display module includes a driver IC, a PCB, a bracket, an LED chip and a package layer, the driver IC is disposed on the surface of the PCB, the bracket is disposed on a side of the PCB away from the driver IC, the LED chip is disposed on a surface of the bracket away from the PCB, the package layer is disposed on the surface of the bracket and covers the LED chip, and a pixel pitch of the LED display module is P0.01 to P4.0.
Referring to fig. 4, the LED display module includes a driver IC2, a PCB 3, a support 6, an LED chip 4b, and a package layer 5b, the driver IC2 is disposed on the surface of the PCB 3, the support 6 is disposed on a side of the PCB 3 facing away from the driver IC2, the LED chip 4b is disposed on the surface of the support 6 facing away from the PCB 3, the package layer 5b is disposed on the surface of the support 6 and covers the LED chip 4b, the adhesive film 1 is disposed on the surface of the package layer 5b facing away from the support 6, the adhesive film 1 for packaging the LED module is sequentially provided with a transparent adhesive layer 10, a support film layer 11, and a black semi-transparent adhesive layer 12a, wherein the transparent adhesive layer 10 is adjacent to the package layer 5 b. The adhesive film 1 for packaging the LED module can be fixed on the surface of the LED display module in an adhesive mode, and is simple in process and high in production efficiency.
The pixel point distance of the LED display module is between P0.01 and P4.0, and the LED display module belongs to a small-distance LED display screen. The adhesive film 1 for packaging the LED modules is suitable for small-spacing LED display screens, and can reduce color difference among different display modules, so that the color of the screen is consistent, and the contrast is improved.
Referring to fig. 6, in some embodiments, the adhesive film 1 for packaging the LED module shown in fig. 2 can also be applied to a small-pitch LED display module, and the fingerprint-proof coating 13 on the adhesive film 1 for packaging the LED module is scratch-resistant, friction-resistant and alcohol-resistant, so that the protective effect on the LED display screen is further achieved, the product quality is improved, meanwhile, fingerprint adhesion can be prevented, and the display effect of the LED display screen is improved.
In some embodiments, the encapsulation layer 5a or 5b is used to protect and fix the LED chip 4a or 4b, has good heat resistance, electrical insulation, adhesion and sealing performance, and can prevent water and ultraviolet rays, so that the LED chip is not affected by the environment, and the service life of the LED chip is prolonged.
The encapsulation layer 5a or 5b may be made of epoxy resin or silicone resin, which is commonly used in the art and is not described herein.
The above description is only exemplary of the present invention and should not be taken as limiting the invention, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. The adhesive film for packaging the LED module is characterized by comprising a transparent adhesive layer, a supporting film layer and a black semi-transparent adhesive layer, wherein the supporting film layer is arranged between the transparent adhesive layer and the black semi-transparent adhesive layer.
2. The adhesive film for packaging the LED module as claimed in claim 1, further comprising a fingerprint-proof coating layer, wherein the fingerprint-proof coating layer is disposed on the surface of the black semi-transparent adhesive layer, which is away from the supporting film layer.
3. The adhesive film for packaging the LED module according to claim 1, wherein the transparent adhesive layer is an acrylate pressure-sensitive adhesive, a thermoplastic elastomer pressure-sensitive adhesive or an organic silicon pressure-sensitive adhesive, and the thickness of the transparent adhesive layer is 1-100 μm.
4. The adhesive film for packaging the LED module as claimed in claim 1, wherein the supporting film layer is made of PET, PC, PMMA or glass, and the thickness of the supporting film layer is 5-100 um.
5. The adhesive film for packaging an LED module according to claim 1, wherein the black translucent adhesive layer is dispersed with black particles.
6. The adhesive film for packaging the LED module as claimed in claim 1, wherein the black semi-transparent adhesive layer is an acrylic resin layer, an epoxy resin layer, a polyester resin layer or a polyurethane resin layer, and the thickness of the black semi-transparent adhesive layer is 0.1-10 um.
7. The adhesive film for packaging the LED module according to claim 2, wherein the anti-fingerprint coating is a modified acrylic resin layer, a modified epoxy resin layer, a modified polyester resin layer or a modified polyurethane resin layer, and the thickness of the anti-fingerprint coating is 0.5-10 um.
8. An LED display screen, characterized in that, including LED display module assembly and the LED module assembly packaging of any claim 1 ~ 7 with the glued membrane, the LED module assembly packaging with the glued membrane set up in LED display module assembly's play plain noodles.
9. The LED display screen of claim 8, wherein the LED display module comprises a driver IC, a PCB, an LED chip and a packaging layer, the driver IC is disposed on the surface of the PCB, the LED chip is disposed on a side of the PCB away from the driver IC, the packaging layer is disposed on the surface of the PCB and covers the LED chip, and the pixel pitch of the LED display module is P0.01-P4.0.
10. The LED display screen of claim 8, wherein the LED display module comprises a driver IC, a PCB, a bracket, an LED chip and a packaging layer, the driver IC is disposed on the surface of the PCB, the bracket is disposed on a side surface of the PCB away from the driver IC, the LED chip is disposed on a surface of the bracket away from the PCB, the packaging layer is disposed on the surface of the bracket and covers the LED chip, and a pixel pitch of the LED display module is P0.01-P4.0.
CN202110660422.1A 2021-06-15 2021-06-15 Glue film for packaging LED module and LED display screen Pending CN113416496A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022151780A1 (en) * 2021-01-12 2022-07-21 深圳市艾比森光电股份有限公司 Led display module and manufacturing method therefor
CN115598748A (en) * 2022-10-17 2023-01-13 长春希龙显示技术有限公司（Cn） Display screen nano light modulation film, LED display module and packaging method thereof
CN116741907A (en) * 2023-08-16 2023-09-12 长春希龙显示技术有限公司 Integrated packaging LED display module and preparation method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022151780A1 (en) * 2021-01-12 2022-07-21 深圳市艾比森光电股份有限公司 Led display module and manufacturing method therefor
CN115598748A (en) * 2022-10-17 2023-01-13 长春希龙显示技术有限公司（Cn） Display screen nano light modulation film, LED display module and packaging method thereof
CN115598748B (en) * 2022-10-17 2023-09-19 长春希龙显示技术有限公司 Display screen nano dimming film, LED display module and packaging method of LED display module
CN116741907A (en) * 2023-08-16 2023-09-12 长春希龙显示技术有限公司 Integrated packaging LED display module and preparation method
CN116741907B (en) * 2023-08-16 2023-11-14 长春希龙显示技术有限公司 Integrated packaging LED display module and preparation method

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