CN113411954A - Mainboard and communication equipment - Google Patents
Mainboard and communication equipment Download PDFInfo
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- CN113411954A CN113411954A CN202110684036.6A CN202110684036A CN113411954A CN 113411954 A CN113411954 A CN 113411954A CN 202110684036 A CN202110684036 A CN 202110684036A CN 113411954 A CN113411954 A CN 113411954A
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- 238000004891 communication Methods 0.000 title claims abstract description 18
- 238000000926 separation method Methods 0.000 claims abstract description 68
- 230000000149 penetrating effect Effects 0.000 claims abstract description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 31
- 238000003466 welding Methods 0.000 claims description 14
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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Abstract
The application provides a mainboard and communication equipment, wherein the mainboard comprises a stratum, and the stratum is provided with at least one separation groove; the separation groove has one edge with only one end penetrating the stratum. On the premise of not increasing the size of the whole machine and meeting the miniaturization requirement, the form of the stratum is changed by arranging the separation grooves, so that the length of the reference ground corresponding to the stratum is changed, the electrical length requirement corresponding to the whole machine is met, and the performance of the whole machine is guaranteed.
Description
Technical Field
The application relates to the field of communication equipment, in particular to a mainboard and communication equipment.
Background
With the advent of the 5G (5th Generation Mobile Communication Technology) era, more and more frequency bands are required for antennas, and the required frequency is also wider. The current communication devices, including handheld terminal devices and portable terminal devices, tend to be miniaturized, so that the size of the communication devices and antennas therein is too small. And the performance of the antenna has a direct relation with the reference ground length of the whole machine.
Therefore, it is a difficult problem to those skilled in the art how to adjust the reference ground length of the whole machine to meet the performance requirement of the antenna under the condition that the size of the whole machine is too small and cannot be changed.
Disclosure of Invention
An object of the present invention is to provide a motherboard and a communication device, so as to at least partially improve the above problems.
In order to achieve the above purpose, the embodiments of the present application employ the following technical solutions:
in a first aspect, an embodiment of the present application provides a motherboard, where the motherboard includes a ground layer, and the ground layer is provided with at least one separation groove;
the separation groove has one end only penetrating through one edge of the stratum, and the separation groove is used for adjusting the corresponding reference ground length of the stratum.
In one possible implementation, the first end of the separation groove is adjacent to a first edge of the formation, and the first end does not penetrate the first edge;
the second end of the separation groove is adjacent to a second edge penetrating through the stratum, and the second edge is any edge of the stratum except the first edge.
In a possible implementation manner, the second edge is an edge which does not intersect with the first edge, and the separation groove includes a first section, a second section and a third section;
one end of the first section is used as a first end of the separation groove, one end of the third section is used as a second end of the separation groove, and the other end of the first section and the other end of the third section are respectively connected with two ends of the second section;
the first segment and the third segment are spaced apart by a preset distance in a first direction, wherein the first direction is a direction parallel to the second edge or the first edge.
In one possible implementation, the separation slots are opened in the most sensitive region of the formation, where the most sensitive region is the region where the electrical length is affected most per a specified length of the opening.
In a possible implementation manner, at least one group of parallel welding spots is arranged on the stratum, the parallel welding spots include a first welding spot and a second welding spot, and the first welding spot and the second welding spot are respectively arranged on two sides of the separation groove;
and when the first welding point and the second welding point are respectively communicated with the two ends of the corresponding patch assembly, the length of the reference ground of the mainboard is adjusted.
In one possible implementation, the motherboard further includes a selector and at least one set of patch components;
the grounding end of the selector is connected to one side of the separation groove, the first end of the patch component is connected to the other side of the separation groove, and the second end of the patch component is connected with the access port of the selector;
the selector is connected with the controller corresponding to the mainboard;
the controller is used for switching an access port in the selector, which is conducted with the grounding terminal, according to the required frequency.
In one possible implementation, the patch component is a resistor, a capacitor, an inductor, or any combination thereof.
In a possible implementation manner, the main board further includes an extension structure made of a conductive material, and a first end of the extension structure is in conductive connection with one end of one edge of the separation groove penetrating through the ground layer.
In a possible implementation manner, the width of the gap of the separation groove ranges from 1 mm to 2 mm.
In a second aspect, an embodiment of the present application provides a communication device, where the communication device includes the above motherboard.
Compared with the prior art, the mainboard and the communication equipment provided by the embodiment of the application comprise a stratum, wherein the stratum is provided with at least one separation groove; the separation groove has one edge with only one end penetrating the stratum. On the premise of not increasing the size of the whole machine and meeting the miniaturization requirement, the form of the stratum is changed by arranging the separation grooves, so that the length of the reference ground corresponding to the stratum is changed, the electrical length requirement corresponding to the whole machine is met, and the performance of the whole machine is guaranteed.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and it will be apparent to those skilled in the art that other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic diagram of a formation state provided in an embodiment of the present application;
FIG. 2 is a schematic illustration of another formation configuration provided by an embodiment of the present application;
FIG. 3 is a schematic illustration of a third formation type provided by an embodiment of the present application;
FIG. 4 is a schematic length diagram of a formation without a partition operation according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of a plate length of a formation with separation grooves according to an embodiment of the present disclosure;
FIG. 6 is a schematic diagram of a distribution of parallel welding spots provided in an embodiment of the present application;
FIG. 7 is a schematic diagram of a parallel connection pad according to an embodiment of the present disclosure;
FIG. 8 is a schematic diagram of a parallel connection pad according to an embodiment of the present disclosure;
FIG. 9 is a schematic diagram of a parallel connection pad according to an embodiment of the present disclosure;
fig. 10 is a schematic diagram of a distribution of the patch assembly and the selector according to an embodiment of the present disclosure;
FIG. 11 is an equivalent diagram of a selector and patch assembly according to an embodiment of the present disclosure;
fig. 12 is a distribution diagram of an extended structure provided in an embodiment of the present application.
In the figure: 10-the formation; 101-a separation tank; 102-parallel pads; 103-extension structure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally found in use of products of the application, and are used only for convenience in describing the present application and for simplification of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.
In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
If the terminal communication device is to achieve the optimal performance in the required frequency band, the electrical length of the antenna system disposed in the terminal communication device needs to reach 1/2 corresponding to the wavelength of the required frequency. Typically, the electrical length of the antenna itself needs to be up to 1/4 wavelengths, with the electrical length of the additional 1/4 wavelengths being supplemented by a reference ground length.
In a possible implementation manner, the main board may be in contact with other ground layers, and the electrical length provided by the main board may be changed by raising the length of the reference ground in a grounding manner to meet the requirement of the corresponding frequency.
Optionally, when the main board or the complete machine is not in contact with another reference layer, the embodiment of the present application provides an implementation manner that the length of the reference ground is increased by modifying the shape of the main board to meet the requirement of the electrical length. And under the condition that the size of the whole machine is too small and the size change cannot be carried out, the reference ground length of the whole machine is adjusted to meet the performance requirement of the antenna.
Specifically, please refer to fig. 1 to 3, and fig. 1 to 3 are schematic diagrams of three main board configurations provided in the present application. As shown in fig. 1 to 3, the main plate includes a ground layer 10, and the ground layer 10 is provided with at least one separation groove 101; the separation channel 101 has one and only one end penetrating one edge of the ground layer 10. The separation groove 101 is used to adjust the corresponding reference ground length of the formation 10.
Specifically, in fig. 1 and 2, the formation 10 is provided with a separation groove 101; in fig. 3, the ground layer 10 is opened with two separation grooves 101.
Specifically, the formation 10 provided with the separation groove 101 is changed in shape relative to the formation 10 not provided with the separation groove 101 (i.e., the complete formation 10), so that the reference ground length corresponding to the formation 10 is changed, i.e., the electrical length corresponding to the complete machine is changed. On the premise of not increasing the size of the whole machine and meeting the miniaturization requirement, the form of the stratum 10 is changed by arranging the separation groove 101, so that the length of the reference ground corresponding to the stratum 10 is changed, the electrical length requirement corresponding to the whole machine is met, and the performance of the whole machine is guaranteed.
The embodiments of the present application also provide a possible implementation manner of comparing the plate length of the formation 10 provided with the separation groove 101 with the plate length of the formation 10 not provided with the separation operation 101, please refer to fig. 4 and 5.
Fig. 4 is a schematic sheet length view of a formation 10 without a cutting operation 101, and fig. 5 is a schematic sheet length view of a formation 10 with a separation groove 101 shown in fig. 1. It is clear from fig. 4 and 5 that the plate length of the formation 10 has changed, i.e. the corresponding reference ground length of the formation 10 has changed.
It should be noted that the arrows in fig. 4 and 5 do not represent the current flow.
In summary, the present application provides a main board, where the main board includes a ground layer, and the ground layer is provided with at least one separation groove; the separation groove has one edge with only one end penetrating the stratum. On the premise of not increasing the size of the whole machine and meeting the miniaturization requirement, the form of the stratum is changed by arranging the separation grooves, so that the length of the reference ground corresponding to the stratum is changed, the electrical length requirement corresponding to the whole machine is met, and the performance of the whole machine is guaranteed.
With continuing reference to fig. 1, regarding the orientation and structure of the separating groove 101, the embodiment of the present application also provides a possible implementation manner.
The first end of the separation channel 101 is adjacent to the first edge of the formation 10 and does not extend through the first edge.
The second end of the partition groove 101 is adjacent to a second edge of the penetrated formation 10, which is any edge of the formation excluding the first edge.
It should be noted that the first edge and the second edge shown in fig. 1 are opposite sides, and are not adjacent to each other, but this is not a limitation. The second edge may also be an adjacent edge of the first edge, and is not described herein for brevity.
With continuing reference to fig. 1, regarding the structural orientation of the separating groove 101, the present embodiment further provides a possible implementation manner, specifically, the second edge is an edge that does not intersect with the first edge, and the second edge is opposite to the first edge. The divided tank 101 includes a first section, a second section, and a third section.
One end of the first section is used as a first end of the separation groove 101, one end of the third section is used as a second end of the separation groove 101, and the other end of the first section and the other end of the third section are respectively connected with the two ends of the second section.
The first section and the third section are separated by a preset distance in a first direction, wherein the first direction is a direction parallel to the second edge or the first edge.
Specifically, since the first segment and the third segment are spaced apart by a predetermined distance in the first direction, the reference ground length is increased.
It should be noted that, most of the existing PCB boards are rectangular, and the first edge and the second edge may be parallel.
In one possible implementation, the second segment is parallel to the first edge, and the first and third segments are perpendicular to the second segment, and thus may be longer in reference length.
Regarding the opening position of the separation groove 101, the embodiment of the present application also provides a possible implementation manner, please continue to refer to fig. 1.
In one possible implementation, the extent of the most sensitive region may be determined by pre-testing, such as analog debugging or simulation testing.
In a possible implementation manner, the range of the width of the gap of the separation groove 101 is 1-2 mm, the total length of the separation groove 101 can be determined by calculation according to the lowest required frequency, and the lengths of the first section, the second section and the third section are distributed according to the total length.
On the basis of fig. 1, as to how to further implement flexible adjustment of the electrical length, the embodiment of the present application also provides a possible implementation manner, please refer to fig. 6, at least one set of parallel connection pads 102 is disposed on the formation 10, the parallel connection pads 102 include a first pad k1 and a second pad k2, and the first pad k1 and the second pad k2 are respectively disposed on two sides of the separation tank 101.
When the first welding point k1 and the second welding point k2 are respectively conducted with two ends of the corresponding chip assembly, the length of the reference ground of the mainboard is adjusted.
It should be noted that the number of parallel connection pads 102 shown in fig. 6 is 3 groups, which is only for illustration, and the number of parallel connection pads 102 is not limited thereto.
Referring to fig. 7 and 8, when the first pad k1 and the second pad k2 in the same set of parallel pads 102 are respectively connected to two ends of the corresponding chip assembly, the length of the separation groove 101 is changed, so that the reference ground length of the main board can be adjusted.
Referring to fig. 9, in a possible implementation manner, a first pad k1 and a second pad k2 in multiple sets of parallel pads 102 may be simultaneously conducted to two ends of a corresponding chip assembly, where the number of sets of parallel pads 102 that are conducted is not limited.
On the basis of fig. 1, as to how to further implement flexible adjustment of the electrical length, the embodiment of the present application also provides a possible implementation manner, please refer to fig. 10, in which the main board further includes a selector S and at least one set of patch components, where the patch components are shown as T1, T2, T3, and T4 in fig. 10. It should be noted that the number of patch modules shown in fig. 10 is 4, which is merely for illustration and not for limitation.
The ground terminal of the selector S is connected to one side of the separation groove 101, and corresponds to ground.
The first end of the chip assembly is connected to the other side of the separation groove 101, which is equivalent to ground.
The second end of the patch component is connected with the access port of the selector S, and the second ends of different patch components are respectively connected with different access ports of the selector S.
The selector S is connected with a controller corresponding to the mainboard; the controller is used for switching the access port which is conducted with the grounding terminal in the selector according to the required frequency.
Specifically, the controller is configured to calculate a required electrical length according to a required frequency, determine a reference ground length required to be provided by the formation after determining the electrical length, determine a length of the required separation tank 101 according to the reference ground length, thereby determining an access port that needs to be electrically connected to the ground terminal, and electrically connect two sides of the separation tank 101 through a patch assembly connected to the access port to change the length of the separation tank 101.
Specifically, referring to fig. 11, fig. 11 is an equivalent schematic diagram of the connection between the selector S and the patch assembly.
The patch assembly in the embodiment of the present application may be a resistor, a capacitor, an inductor, or any combination of a plurality of resistors and capacitors.
On the basis of fig. 1, in order to solve the problem that the electrical length requirement cannot be satisfied after the form of the ground layer 10 is changed, the present embodiment further provides a possible implementation manner, please refer to fig. 12, in which the main board further includes an extension structure 103 made of a conductive material, and a first end of the extension structure 103 is conductively connected to a second end of the separation groove 101.
In fig. 12, the first end of the extension structure is denoted by a symbol Δ. The extension structure 103 may be a metal flap. A first end of the extension structure 103 is conductively connected to one end of one edge of the separation groove 101 penetrating the formation 10. Taking the separation groove 101 in fig. 1 as an example, the first end of the extension structure 103 is connected with the second end of the separation groove 101 by a welding point.
The extension structure 103 is not connected to the formation 10 except for a first end conductively connected to a second end of the separation groove 101. And the orientation of the extension structure 103 is not limited in the embodiment of the present application.
It should be noted that the separation groove 101 in the embodiment of the present application may only cut off the conductive material on the surface of the formation 10, and the formation 10 does not need to be completely penetrated.
The embodiment of the application also provides communication equipment which comprises the mainboard.
It should be noted that the communication device provided in this embodiment can perform the function of the motherboard to achieve the corresponding technical effect. For the sake of brevity, the corresponding contents in the above embodiments may be referred to where not mentioned in this embodiment.
The controller provided by the embodiment of the application can be an integrated circuit chip with signal processing capability. The controller may be a general-purpose Processor, and includes a Central Processing Unit (CPU), a Network Processor (NP), and the like; the device can also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, a discrete Gate or transistor logic device, or a discrete hardware component.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. A main board is characterized by comprising a stratum, wherein at least one separation groove is formed in the stratum;
the separation groove has one end only penetrating through one edge of the stratum, and the separation groove is used for adjusting the corresponding reference ground length of the stratum.
2. Motherboard according to claim 1,
the first end of the separation groove is close to the first edge of the stratum, and the first end does not penetrate through the first edge;
the second end of the separation groove penetrates through a second edge of the stratum, and the second edge is any edge of the stratum except the first edge.
3. A main panel as recited in claim 2, wherein said second edge is an edge that does not intersect said first edge, and said partition channel includes a first section, a second section, and a third section;
one end of the first section is used as a first end of the separation groove, one end of the third section is used as a second end of the separation groove, and the other end of the first section and the other end of the third section are respectively connected with two ends of the second section;
the first segment and the third segment are spaced apart by a preset distance in a first direction, wherein the first direction is a direction parallel to the second edge or the first edge.
4. The primary sheet of claim 1, wherein the separation slots open into a most sensitive region of the formation, wherein the most sensitive region is a region of maximum influence on electrical length per given length of the slots.
5. The main plate of claim 1, wherein at least one set of parallel welds is disposed in the ground layer, the parallel welds including a first weld and a second weld, the first weld and the second weld being disposed on opposite sides of the dividing groove, respectively;
and when the first welding point and the second welding point are respectively communicated with the two ends of the corresponding patch assembly, the length of the reference ground of the mainboard is adjusted.
6. The motherboard of claim 1, further comprising a selector and at least one set of patch components;
the grounding end of the selector is connected to one side of the separation groove, the first end of the patch component is connected to the other side of the separation groove, and the second end of the patch component is connected with the access port of the selector;
the selector is connected with the controller corresponding to the mainboard;
the controller is used for switching an access port in the selector, which is conducted with the grounding terminal, according to the required frequency.
7. A motherboard according to claim 5 or 6, characterised in that the chip component is a resistor, a capacitor, an inductor or any combination of these.
8. The motherboard according to claim 1 further comprising an extension of conductive material, a first end of the extension being in conductive communication with an end of the separation channel that extends through an edge of the ground layer.
9. The main plate of claim 1, wherein the gap width of the separation groove ranges from 1 mm to 2 mm.
10. A communication device, characterized in that the communication device comprises a main board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110684036.6A CN113411954A (en) | 2021-06-21 | 2021-06-21 | Mainboard and communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110684036.6A CN113411954A (en) | 2021-06-21 | 2021-06-21 | Mainboard and communication equipment |
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| Publication Number | Publication Date |
|---|---|
| CN113411954A true CN113411954A (en) | 2021-09-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110684036.6A Pending CN113411954A (en) | 2021-06-21 | 2021-06-21 | Mainboard and communication equipment |
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| CN (1) | CN113411954A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030193438A1 (en) * | 2002-04-11 | 2003-10-16 | Samsung Electro-Mechanics Co., Ltd. | Multi band built-in antenna |
| US20090262028A1 (en) * | 2005-07-21 | 2009-10-22 | Josep Mumbru | Handheld device with two antennas, and method of enhancing the isolation between the antennas |
| CN102884680A (en) * | 2010-05-10 | 2013-01-16 | 捷讯研究有限公司 | High isolation multiple port antenna array handheld mobile communication devices |
| CN103779657A (en) * | 2012-10-23 | 2014-05-07 | 汤姆逊许可公司 | Compact slot antenna |
| CN111628283A (en) * | 2020-06-10 | 2020-09-04 | 安徽华米信息科技有限公司 | Antenna structure and wearable equipment |
-
2021
- 2021-06-21 CN CN202110684036.6A patent/CN113411954A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030193438A1 (en) * | 2002-04-11 | 2003-10-16 | Samsung Electro-Mechanics Co., Ltd. | Multi band built-in antenna |
| US20090262028A1 (en) * | 2005-07-21 | 2009-10-22 | Josep Mumbru | Handheld device with two antennas, and method of enhancing the isolation between the antennas |
| CN102884680A (en) * | 2010-05-10 | 2013-01-16 | 捷讯研究有限公司 | High isolation multiple port antenna array handheld mobile communication devices |
| CN103779657A (en) * | 2012-10-23 | 2014-05-07 | 汤姆逊许可公司 | Compact slot antenna |
| CN111628283A (en) * | 2020-06-10 | 2020-09-04 | 安徽华米信息科技有限公司 | Antenna structure and wearable equipment |
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