CN113409991A

CN113409991A - High-performance flexible composite conductive film and preparation method and application thereof

Info

Publication number: CN113409991A
Application number: CN202110679210.8A
Authority: CN
Inventors: 范江峰; 刘腾蛟; 胡源; 苏燕平
Original assignee: Jiangsu Nameida Photoelectric Technology Co ltd
Current assignee: Jiangsu Nameida Photoelectric Technology Co ltd
Priority date: 2021-06-18
Filing date: 2021-06-18
Publication date: 2021-09-17
Anticipated expiration: 2041-06-18
Also published as: CN113409991B

Abstract

The invention relates to a high-performance flexible composite conductive film and a preparation method and application thereof, wherein the high-performance flexible composite conductive film comprises a substrate, a metal nanowire layer, a metal grid layer and a first anchoring layer, wherein the metal nanowire layer and the metal grid layer are arranged between the substrate and the first anchoring layer, and the arrangement sequence of the metal nanowire layer and the metal grid layer can be exchanged; a conductive path is formed between the metal nanowire layer and the metal grid layer; the metal mesh layer includes a mesh-shaped conductive structure composed of a plurality of metal wires, the nanowire layer includes a mesh-shaped conductive structure composed of a plurality of metal nanowires, and network voids in the mesh-shaped conductive structure are smaller than those in the mesh-shaped conductive structure. The high performance flexible composite conductive film may further include a planar conductive layer and a second anchor layer. The high-performance flexible composite conductive film provided by the invention has excellent conductive performance and better light transmittance, and can meet the application requirements of large-size flexible touch display and photoelectric devices.

Description

High-performance flexible composite conductive film and preparation method and application thereof

Technical Field

The present disclosure relates to conductive films, methods of making conductive films, and applications of the conductive films, and more particularly, to a high-performance flexible composite conductive film, and methods of making and using the same.

Background

In recent years, with the rise of the flexible electronic industry, flexible touch control and devices have become development trends of the electronic industry, and under the industrial trends, flexible transparent conductive films with flexibility, high light transmittance and high conductivity are the basis of many flexible photoelectric products. As is well known, a conductive layer of an ITO (Indium-Tin-Oxide) transparent conductive film used in a conventional touch product is fragile and easy to break, lacks flexibility, and has a problem of voltage drop in application of a large-sized electrode, which limits application of the ITO transparent conductive film to large-sized flexible touch and devices.

The nano silver wire transparent conductive film has the advantages of excellent photoelectric property, excellent deflection resistance, simple preparation process and the like, and has been widely applied to the fields of touch screens, writing pads, heating films, PDLC (Polymer Dispersed Liquid Crystal), electromagnetic shielding and the like. However, the transparent conductive film of the nano silver wire has some defects, such as the limitation of insufficient conductivity of the nano silver wire and the characteristics of network conductivity, and cannot be applied to some devices requiring high conductivity.

Disclosure of Invention

Aiming at the defects of the prior art, the invention aims to provide a high-performance flexible composite conductive film, and a preparation method and application thereof, so that the conductivity of the high-performance flexible composite conductive film is improved, and the high-performance flexible composite conductive film meets the requirements of large-size flexible touch and high conductivity in devices.

In a first aspect of the present invention, a high performance flexible composite conductive film is provided, which includes a substrate, a metal nanowire layer, a metal mesh layer and a first anchoring layer, wherein the metal nanowire layer and the metal mesh layer are both disposed between the substrate and the first anchoring layer, and the arrangement order of the metal nanowire layer and the metal mesh layer is changeable;

a conductive path is formed between the metal nanowire layer and the metal grid layer;

the metal grid layer comprises a grid-shaped conductive structure formed by a plurality of metal wires, grid gaps are formed between the adjacent metal wires, the metal nanowire layer comprises a grid-shaped conductive structure formed by a plurality of metal nanowires, the grid gaps are formed between the adjacent metal nanowires, and the grid gaps are smaller than the grid gaps.

In one possible implementation manner, the high-performance flexible composite conductive film further comprises a planar conductive layer, the planar conductive layer is a planar conductive structure,

the planar conductive layer is disposed between or over any two of the substrate, the metal nanowire layer, the metal mesh layer, and the first anchoring layer;

conductive paths are formed among the metal nanowire layer, the metal grid layer and the planar conductive layer.

In one possible implementation, the high performance flexible composite conductive film further includes a second anchoring layer,

the second anchoring layer is disposed between any two of the metal nanowire layer, the metal mesh layer, and the planar conductive layer.

In a second aspect of the present invention, a method for preparing a high-performance flexible composite conductive film is provided, the method comprising:

forming a conductive composite layer on a substrate, wherein the conductive composite layer comprises a metal nanowire layer and a metal grid layer, the positions of the metal nanowire layer and the metal grid layer can be exchanged, and a conductive path is formed between the metal nanowire layer and the metal grid layer;

a first anchoring layer is formed on the conductive composite layer.

In one possible implementation, the method further includes:

forming a planar conductive layer between or over any two of the substrate, the metal nanowire layer, the metal mesh layer, and the first anchoring layer;

In one possible implementation, the method further includes:

forming a second anchoring layer between any two of the metal nanowire layer, the metal mesh layer, and the planar conductive layer.

The third aspect of the present invention provides an application of the high performance flexible composite conductive film, including the application of the high performance flexible composite conductive film described in the first aspect in touch panels, displays, mobile phone antenna circuits, infrared optical imaging elements, photoelectric sensors, electromagnetic shielding, smart windows, smart handwriting boards, and solar cells.

The high-performance flexible composite conductive film provided by the invention comprises a layered structure formed by a substrate, a metal nanowire layer, an anchoring layer and a metal grid layer, and the metal nanowire layer and the metal grid layer are compounded, so that the high-performance flexible composite conductive film has better conductive performance, flexible bending property and better light transmittance; in the high-performance flexible composite conductive film provided by the invention, the surface of the metal nanowire layer is coated by other layer structures, so that the metal nanowire layer is not exposed outside, and further the high-performance flexible composite conductive film has better oxidation resistance, the durability of the high-performance flexible composite conductive film is improved, and the high-performance flexible composite conductive film has better surface flatness.

The high-performance flexible composite conductive film prepared by the method provided by the invention has better light transmittance and better conductivity, can be widely applied to the aspects of touch screens, displays, mobile phone antenna circuits, infrared optical imaging elements, photoelectric sensors, electromagnetic shielding, intelligent windows, intelligent handwriting boards and solar cells, and can meet the requirements of large-size flexible touch and high conductivity in devices.

Drawings

In order to more clearly illustrate the technical solution of the present disclosure, the drawings used in the description of the embodiment or the prior art will be briefly described below. It is apparent that the drawings in the following description are only some embodiments of the disclosure, and that other drawings may be derived from those drawings by a person of ordinary skill in the art without inventive effort.

Fig. 1 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 2 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 3 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 4 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 5 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 6 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 7 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 8 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 9 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 10 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 11 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 12 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 13 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 14 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 15 is a schematic diagram of one structure of a high performance flexible composite conductive film provided by embodiments of the present disclosure;

fig. 16 is a schematic diagram of a structure of a high-performance flexible composite conductive film provided by an embodiment of the present disclosure.

In the figure: 1-substrate, 2-metal nanowire layer, 3-metal grid layer, 4-first anchoring layer, 5-planar conducting layer, 6-second anchoring layer.

Detailed Description

In order to make the technical solutions of the present disclosure better understood by those skilled in the art, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only some embodiments of the present disclosure, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

It should be noted that the terms "first," "second," and the like in the description and claims of the present disclosure and in the drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the disclosure described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.

At present, most capacitive touch panels use ITO (indium tin oxide) conductive films with mature manufacturing processes, but the ITO conductive films have the defects of high resistance, fragility and the like, and are not suitable for manufacturing medium-sized and large-sized touch panels and flexible panels. The Metal Mesh conductive film (Metal Mesh) has lower resistance, better light transmittance and high response speed than the ITO conductive film, and is particularly suitable for manufacturing large-size touch panels and flexible panels, so that the Metal Mesh conductive film becomes one of the most competitive alternatives of the ITO conductive film. In addition, the nano silver wire conductive film is widely applied to the fields of touch screens, writing pads, heating films, electromagnetic shielding and the like due to the advantages of good photoelectric property, good deflection resistance and the like, but the application of the nano silver wire conductive film in some devices with high conductivity requirements is limited due to weak conductivity. With the development of science and technology, the demand for large-sized touch panels and flexible panels has increased, however, the search for the manufacture of large-sized touch panels and flexible panels has not been successful. According to the invention, the metal grid conductive structure and the nano silver wire network conductive structure are innovatively combined to obtain the high-performance flexible composite conductive film, and on the premise that the high-performance flexible composite conductive film meets the requirement of light transmission in the application of large-size touch panels and flexible panels, the resistance of the composite transparent conductive film is reduced as much as possible through the combination of layer structures and the selection of layer thicknesses, so that the conductivity is improved. The structure and the manufacturing method of the high-performance flexible composite conductive film according to the present invention will be described below.

The invention provides a high-performance flexible composite conductive film which comprises a substrate, a metal nanowire layer, a metal grid layer and a first anchoring layer, wherein the metal nanowire layer and the metal grid layer are arranged between the substrate and the first anchoring layer, and the arrangement sequence of the metal nanowire layer and the metal grid layer can be exchanged; a conductive path is formed between the metal nanowire layer and the metal grid layer; the metal grid layer comprises a grid-shaped conductive structure formed by a plurality of metal wires, grid gaps are formed between the adjacent metal wires, the metal nanowire layer comprises a grid-shaped conductive structure formed by a plurality of metal nanowires, the grid gaps are formed between the adjacent metal nanowires, and the grid gaps are smaller than the grid gaps. Wherein, the first anchoring layer covers at least one surface of the metal mesh layer or at least one surface of the metal nanowire layer, even wraps the metal mesh layer or the metal nanowire layer. This flexible compound conducting film of high performance has integrated the advantage of metal nanowire layer and metal net check layer, has good electric conductive property, flexible bending characteristic and better luminousness to, the upper and lower surface on metal nanowire layer all is by other layer structure cladding, makes the metal nanowire layer have better anti-oxidation performance.

In particular, the high-performance flexible composite conductive film formed of the substrate, the metal nanowire layer, the first anchor layer, and the metal mesh layer may exhibit two different layer structures as shown in fig. 1 and 2.

Referring to fig. 1, a structure of a high-performance flexible composite conductive film is shown, which includes, from bottom to top, a substrate 1, a metal mesh layer 3, a metal nanowire layer 3, and a first anchoring layer 4, wherein a conductive path is formed between the metal nanowire layer and the metal mesh layer, and the first anchoring layer covers at least one surface of the metal nanowire layer and fills or is embedded in a network gap of the metal nanowire layer.

Referring to fig. 2, another structure of a high-performance flexible composite conductive film is shown, which sequentially includes, from bottom to top, a substrate 1, a metal nanowire layer 2, a metal mesh layer 3, and a first anchoring layer 4, wherein a conductive path is formed between the metal nanowire layer and the metal mesh layer, and the first anchoring layer covers at least one surface of the metal mesh layer and fills or is embedded in a mesh gap of the metal mesh layer.

Further, the high-performance flexible composite conductive film may further include a planar conductive layer, and the planar conductive layer may be disposed such that the high-performance flexible composite conductive film is changed from network conduction to planar conduction, and specifically, the planar conductive layer may be disposed between any two layers of the substrate, the metal nanowire layer, the metal mesh layer, and the first anchor layer, or on the first anchor layer. The high performance flexible composite conductive film formed by the substrate, the metal nanowire layer, the first anchor layer, the metal mesh layer, and the planar conductive layer may exhibit eight different layer structures as shown in fig. 3 to 10.

Referring to fig. 3, a structure of a high performance flexible composite conductive film is shown, which comprises, from bottom to top, a substrate 1, a metal nanowire layer 2, a metal mesh layer 3, a first anchoring layer 4 and a planar conductive layer 5. Wherein the planar conductive layer, the metal mesh layer and the metal nanowire layer form a conductive path. The first anchoring layer covers at least one surface of the metal grid layer, fills or is embedded in grid gaps of the metal grid layer, and improves the oxidation resistance of the high-performance flexible composite conductive film; the planar conductive layer covers the first anchoring layer to improve the surface flatness of the high-performance flexible composite conductive film.

Referring to fig. 4, a structure of a high performance flexible composite conductive film is shown, which comprises, from bottom to top, a substrate 1, a metal mesh layer 3, a metal nanowire layer 2, a first anchoring layer 4 and a planar conductive layer 5. Wherein the metal mesh layer, the planar conductive layer and the metal nanowire layer form a conductive path. The first anchoring layer covers at least one surface of the metal nanowire layer, and fills or is embedded in network gaps of the metal nanowire layer, so that the oxidation resistance of the high-performance flexible composite conductive film is improved; the planar conductive layer covers the first anchoring layer to improve the surface flatness of the high-performance flexible composite conductive film.

Referring to fig. 5, a structure of a high-performance flexible composite conductive film is shown, which sequentially comprises, from bottom to top, a substrate 1, a metal nanowire layer 2, a metal mesh layer 3, a planar conductive layer 5 and a first anchoring layer 4. Wherein the planar conductive layer, the metal mesh layer and the metal nanowire layer form a conductive path. The metal grid layer is covered on the plane conducting layer, and the first anchoring layer covers the plane conducting layer so as to improve the surface flatness and the oxidation resistance of the high-performance flexible composite conducting film.

Referring to fig. 6, a structure of a high-performance flexible composite conductive film is shown, which sequentially comprises, from bottom to top, a substrate 1, a metal nanowire layer 2, a planar conductive layer 5, a metal mesh layer 3 and a first anchoring layer 4. Wherein the planar conductive layer, the metal mesh layer and the metal nanowire layer form a conductive path. The planar conducting layer is arranged between the metal nanowire layer and the metal grid layer and used for improving the surface flatness of the high-performance flexible composite conducting film, the first anchoring layer covers the surface of the metal grid layer and fills or is embedded in grid gaps of the metal grid layer so as to improve the surface flatness and the oxidation resistance of the high-performance flexible composite conducting film.

Referring to fig. 7, a structure of a high-performance flexible composite conductive film is shown, which includes, from bottom to top, a substrate 1, a metal mesh layer 3, a planar conductive layer 5, a metal nanowire layer 2, and a first anchor layer 4. Wherein the planar conductive layer, the metal mesh layer and the metal nanowire layer form a conductive path. The planar conducting layer is arranged between the metal nanowire layer and the metal grid layer and used for improving the surface flatness of the high-performance flexible composite conducting film, the first anchoring layer covers the surface of the metal nanowire layer and fills or is embedded in network gaps of the metal nanowire layer so as to improve the surface flatness and the oxidation resistance of the high-performance flexible composite conducting film.

Referring to fig. 8, a structure of a high-performance flexible composite conductive film is shown, which includes, from bottom to top, a substrate 1, a metal mesh layer 3, a metal nanowire layer 2, a planar conductive layer 5, and a first anchor layer 4. Wherein the planar conductive layer, the metal mesh layer and the metal nanowire layer form a conductive path. The planar conducting layer is arranged on the metal nanowire layer and used for improving the surface flatness and the oxidation resistance of the high-performance flexible composite conducting film, and the first anchoring layer covers the planar conducting layer and can further improve the surface flatness of the high-performance flexible composite conducting film.

Referring to fig. 9, a structure of a high-performance flexible composite conductive film is shown, which includes, from bottom to top, a substrate 1, a planar conductive layer 5, a metal nanowire layer 2, a metal mesh layer 3, and a first anchor layer 4. Wherein the planar conductive layer, the metal mesh layer and the metal nanowire layer form a conductive path. The first anchoring layer covers the surface of the metal grid layer and fills or is embedded in grid gaps of the metal grid layer, so that the oxidation resistance and the surface flatness of the high-performance flexible composite conductive film are improved.

Referring to fig. 10, a structure of a high-performance flexible composite conductive film is shown, which includes, from bottom to top, a substrate 1, a planar conductive layer 5, a metal mesh layer 3, a metal nanowire layer 2, and a first anchor layer 4. Wherein the planar conductive layer, the metal mesh layer and the metal nanowire layer form a conductive path. The first anchoring layer covers the surface of the metal nanowire layer, fills or is embedded in network gaps of the metal nanowire layer, and improves the oxidation resistance and the surface flatness of the high-performance flexible composite conductive film.

Further, the high-performance flexible composite conductive film may further include a second anchor layer disposed between any two of the metal nanowire layer, the metal mesh layer, and the planar conductive layer. The high performance flexible composite conductive film formed by the substrate, the metal nanowire layer, the first anchor layer, the metal mesh layer, the second anchor layer, and the planar conductive layer may exhibit six different layer structures as shown in fig. 11 to 16.

Referring to fig. 11, a structure of a high-performance flexible composite conductive film is shown, which sequentially comprises, from bottom to top, a substrate 1, a metal nanowire layer 2, a second anchoring layer 6, a metal mesh layer 3, a planar conductive layer 5, and a first anchoring layer 4. Wherein the planar conductive layer, the metal mesh layer and the metal nanowire layer form a conductive path. The second anchoring layer covers the surface of the metal nanowire layer and fills or is embedded in network gaps of the metal nanowire layer, the planar conducting layer covers the surface of the metal grid layer, and the first anchoring layer covers the surface of the planar conducting layer.

Referring to fig. 12, a structure of a high-performance flexible composite conductive film is shown, which sequentially comprises, from bottom to top, a substrate 1, a metal nanowire layer 2, a second anchoring layer 6, a planar conductive layer 5, a metal mesh layer 3, and a first anchoring layer 4. Wherein the planar conductive layer, the metal mesh layer and the metal nanowire layer form a conductive path. The second anchoring layer covers the surface of the metal nanowire layer and fills or is embedded in network gaps of the metal nanowire layer to improve the oxidation resistance and the surface flatness of the metal nanowire layer, the first anchoring layer covers the surface of the metal grid layer and fills or is embedded in grid gaps of the metal grid layer to improve the oxidation resistance and the surface flatness of the metal grid layer, and the planar conducting layer covers the second anchoring layer to further improve the surface flatness of the high-performance flexible composite conducting film.

Referring to fig. 13, a structure of a high-performance flexible composite conductive film is shown, which includes, from bottom to top, a substrate 1, a metal mesh layer 3, a metal nanowire layer 2, a second anchor layer 6, a planar conductive layer 5, and a first anchor layer 4. Wherein the planar conductive layer, the metal mesh layer and the metal nanowire layer form a conductive path. The second anchoring layer covers the surface of the metal nanowire layer, and fills or is embedded in network gaps of the metal nanowire layer, so that the oxidation resistance and the surface flatness of the metal nanowire layer can be improved.

Referring to fig. 14, a structure of a high-performance flexible composite conductive film is shown, which includes, from bottom to top, a substrate 1, a planar conductive layer 5, a metal nanowire layer 2, a second anchoring layer 6, a metal mesh layer 3, and a first anchoring layer 4. Wherein the planar conductive layer, the metal mesh layer and the metal nanowire layer form a conductive path. The second anchoring layer covers the surface of the metal nanowire layer and fills or is embedded in network gaps of the metal nanowire layer, so that the oxidation resistance and the surface flatness of the metal nanowire layer can be improved, the first anchoring layer covers the surface of the metal grid layer and fills or is embedded in grid gaps of the metal grid layer, and the oxidation resistance and the surface flatness of the metal grid layer can be improved.

Referring to fig. 15, a structure of a high-performance flexible composite conductive film is shown, which sequentially comprises, from bottom to top, a substrate 1, a metal nanowire layer 2, a metal mesh layer 3, a second anchoring layer 6, a planar conductive layer 5, and a first anchoring layer 4. Wherein the planar conductive layer, the metal mesh layer and the metal nanowire layer form a conductive path. The second anchoring layer covers the surface of the metal grid layer, and fills or is embedded in grid gaps of the metal grid layer, so that the oxidation resistance and the surface flatness of the metal grid layer can be improved.

Referring to fig. 16, a structure of a high-performance flexible composite conductive film is shown, which includes, from bottom to top, a substrate 1, a metal mesh layer 3, a metal nanowire layer 2, a second anchor layer 6, a planar conductive layer 5, and a first anchor layer 4. Wherein the planar conductive layer, the metal mesh layer and the metal nanowire layer form a conductive path. The second anchoring layer covers the surface of the metal nanowire layer, and fills or is embedded in network gaps of the metal nanowire layer, so that the oxidation resistance and the surface flatness of the metal nanowire layer can be improved.

The respective layers constituting the high-performance flexible composite conductive film will be described below.

(1) Substrate

The substrate is a flexible substrate, and the material of the substrate may be any one or a combination of a plurality of materials selected from PET (Polyethylene terephthalate), CPI (polyimide film), PI film, PI (polyimide resin), PC (Polycarbonate), PMMA (polymethyl methacrylate material), PP (polypropylene), PE (Polyethylene), and EVA (Ethylene vinyl acetate Copolymer). The flexible substrate is adopted to prepare the high-performance flexible composite conductive film, so that the flexing resistance of the high-performance flexible composite conductive film can be enhanced.

(2) Metal nanowire layer

The metal nanowires in the metal nanowire layer may be any one or a combination of more than one of copper nanowires, gold nanowires and silver nanowires. Since the length of the metal nanowire directly affects the contact resistance of the composite transparent conductive film, the longer the wire, the fewer the contact points, and the smaller the sheet resistance of the film, but the metal nanowire is too long and is easy to form winding, which affects the uniformity of the coating, in this embodiment, the diameter of the metal nanowire is preferably 5nm to 100nm, and the length-diameter ratio is preferably 500 to 2500. Particularly, the diameter of the metal nanowire is preferably 10-30 nm, and the length-diameter ratio is 1000-1200, so that the uniformity of the metal nanowire layer is improved, and the sheet resistance is reduced. Considering the requirement of a large-sized touch screen on light transmittance and the possibility of reducing light transmittance due to the overlapping arrangement of the metal nanowire layer and the metal mesh layer, the thickness of the metal nanowire layer may be set according to the light transmittance requirement in the application scene, and is preferably 20nm to 300 nm.

(3) First anchoring layer

When the first anchoring layer covers the metal nanowire layer or the metal grid layer, the first anchoring layer mainly plays a role in protecting the covered metal nanowire layer or the metal grid layer, and the oxidation resistance of the high-performance flexible composite conductive film is improved.

When the first anchoring layer is arranged between the plane conducting layer and the metal nanowire layer or the metal grid layer, the first anchoring layer not only plays a role in protection, but also has an electric conduction function, so that an electric conduction path is formed between the metal nanowire layer and the plane conducting layer or the metal grid layer.

In the embodiment of the present invention, the first anchor layer is made of a material having good weather resistance, transparency, and good light transmittance after film formation, and is preferably made of any one or a combination of more of acrylic resin, polypyrrole, polythiophene, polyacetylene, polyparaphenylene, polyaniline, perylene pigment, azo pigment, phthalocyanine and phthalocyanine compound, pentacene derivative, benzothiophene derivative, rubrene, C60, poly-3-hexylthiophene, polyparaphenylene vinylene, and polyphenol. The first anchoring layer can enhance various performances of the conductive film, including increasing the light transmittance of the conductive film, reducing optical haze, increasing electrical stability, increasing surface adhesion and surface tension, improving the anti-aging performance of the conductive film, preventing oxidation and ion migration of the metal nanowires in the metal nanowire layer, and the like.

Preferably, a tunneling effect is generated between the metal nanowire layer and the planar conductive layer or the metal mesh layer, so that electrical conduction is realized. The two conductive layers in contact with the first anchoring layer form a conductive path through tunneling electrons in the first anchoring layer, and in order to realize the effect of electron tunneling, the thickness of the first anchoring layer is sufficient to enhance the adhesive force between the two layers in contact with the first anchoring layer, and preferably, the thickness of the first anchoring layer can be set to be 0.1 nm-5 nm.

(4) Metal mesh layer

The metal grid layer is of a grid-shaped conductive structure and has the advantages of low resistance and high response speed. The metal grid layer is made of copper and/or silver. The thickness of the metal grid layer is 50 nm-500 nm, the line width is 1 um-30 um, and the line distance is 30 um-500 um.

(5) Planar conductive layer

The planar conducting layer enables the high-performance flexible composite conducting film to be converted from net-shaped conducting to whole-surface conducting, the material which can realize whole-surface conducting, good weather resistance and good light transmittance after film forming is selected to prepare the planar conducting layer, and the material of the planar conducting layer is preferably any one or combination of a transparent oxide film, a metal film, a graphene film and a transparent organic conducting thin film. The thicker the planar conductive layer is, the better the conductivity of the planar conductive layer is, and the thickness of the planar conductive layer can be determined according to the conductive requirements of the conductive film under different applications, and is preferably 5nm to 200 nm.

(6) Second anchoring layer

The second anchoring layer is arranged on the metal nanowire layer or the metal grid layer, on one hand, the metal nanowire layer or the metal grid layer covered by the second anchoring layer can be protected, the oxidation resistance of the high-performance flexible composite conductive film is improved, and on the other hand, a conductive path can be formed between the metal nanowire layer and the planar conductive layer or the metal grid layer. In the embodiments of the present invention, the material of the second anchoring layer is the same as that of the first anchoring layer, please refer to the above, which is not described herein again.

In a possible implementation manner, a functional composite layer is further arranged between the substrate and the metal nanowire layer or the metal grid layer, and the functional composite layer is any one or combination of multiple of an optical adaptation layer, an electrical adaptation layer, a mechanical adaptation layer and a refractive index adaptation layer. The optical adaptation layer is a metal layer or a ceramic layer formed by sputtering, evaporation, coating and the like, so that the substrate and the optical adaptation layer form refractive index compensation, the difference of the reflectivity of the conductive area and the non-conductive area after etching is reduced, and the visual contrast is reduced. Optical adaptation layer materials include metals, alloys, oxide nanomaterials, and combinations thereof. The mechanical adaptation layer is used for reducing stress between the substrate and the coating and between the coating and improving adhesion between the substrate and the coating and between the coating and the coating. The refractive index adaptation layer can enhance the functional layer of the composite transparent conductive film in the light transmittance area, and the principle is to redistribute the transmitted light, the reflected light and the light in other directions and improve the proportion of the incident light.

The high-performance flexible composite conductive film can be prepared by the following method, and the method comprises the following steps:

s172: forming a conductive composite layer on a substrate, wherein the conductive composite layer comprises a metal nanowire layer and a metal grid layer, the positions of the metal nanowire layer and the metal grid layer can be exchanged, and a conductive path is formed between the metal nanowire layer and the metal grid layer.

S174: a first anchoring layer is formed on the conductive composite layer.

Further, the method may further include the step of forming a planar conductive layer between or over any two of the substrate, the metal nanowire layer, the metal mesh layer, and the first anchoring layer. Conductive paths are formed among the metal nanowire layer, the metal grid layer and the planar conductive layer.

Still further, the method may further comprise the step of forming a second anchoring layer between any two of the metal nanowire layer, the metal mesh layer, and the planar conductive layer.

Specifically, under the condition that the high-performance flexible composite conductive film comprises a substrate, a metal nanowire layer, a metal grid layer and a first anchoring layer, the high-performance flexible composite conductive film is prepared by the following method:

respectively manufacturing the following three-layer structure on a flexible substrate:

(1) the metal nanowire layer is manufactured by coating metal nanowire ink;

(2) the metal grid layer is manufactured by nano-imprinting, ink-jet printing, silk-screen printing or magnetron sputtering, orthogonal etching and the like;

(3) the first anchoring layer is manufactured by coating an anchoring layer solution. Specifically, an anchoring layer solution can be coated on the metal nanowire layer, so that the anchoring layer solution fills network gaps formed between adjacent metal nanowires in the metal nanowire layer, and then the metal nanowire layer is dried and cured; alternatively, an anchor layer solution is coated on the metal mesh layer, such that the anchor layer solution fills the mesh voids formed between adjacent metal lines in the metal mesh layer, and then dried and cured to obtain a first anchor layer.

In the three-layer structure, the positions of the metal nanowire layer and the metal grid layer can be changed, and only the metal nanowire layer and the metal grid layer are required to be ensured to be positioned between the flexible substrate and the first anchoring layer.

In the case that the high-performance flexible composite conductive film comprises a substrate, a metal nanowire layer, a metal mesh layer, a planar conductive layer and a first anchoring layer, the high-performance flexible composite conductive film can be prepared by the following method:

the following four-layer structure is respectively manufactured on a flexible substrate:

(1) the metal nanowire layer is manufactured by coating metal nanowire ink;

(2) the metal grid layer is manufactured by nano-imprinting, ink-jet printing, silk-screen printing or magnetron sputtering and orthogonal etching;

(3) the planar conducting layer is manufactured in a magnetron sputtering or coating mode and the like;

(4) the first anchoring layer is manufactured by coating an anchoring layer solution. Specifically, an anchoring layer solution can be coated on the metal nanowire layer, so that the anchoring layer solution fills network gaps formed between adjacent metal nanowires in the metal nanowire layer, and then the metal nanowire layer is dried and cured; alternatively, an anchor layer solution is coated on the metal mesh layer, such that the anchor layer solution fills the mesh voids formed between adjacent metal lines in the metal mesh layer, and then dried and cured to obtain a first anchor layer.

In the structure, the metal nanowire layer and the metal grid layer are required to be positioned between the first anchoring layer and the substrate; the planar conductive layer may be between the first anchor layer and the substrate or on top of the first anchor layer as the outermost layer of the high performance flexible composite conductive film.

In the case that the high-performance flexible composite conductive film comprises a substrate, a metal nanowire layer, a metal mesh layer, a planar conductive layer, a first anchoring layer and a second anchoring layer, the high-performance flexible composite conductive film can be prepared by the following method:

the following five-layer structures are respectively manufactured on a flexible substrate:

(1) the metal nanowire layer is manufactured by coating metal nanowire ink;

(3) the planar conducting layer is manufactured in modes of magnetron sputtering, coating and the like;

(4) the first anchoring layer is manufactured by coating an anchoring layer solution on the metal grid layer or the planar conducting layer, and when the anchoring layer is positioned on the metal grid layer, the anchoring layer solution fills grid gaps formed between adjacent metal wires in the metal grid layer;

(5) the second anchoring layer is manufactured by coating an anchoring layer solution on the metal nanowire layer or the metal grid layer, when the second anchoring layer is positioned on the metal nanowire layer, the anchoring layer solution fills network gaps formed between adjacent metal nanowires in the metal nanowire layer, and when the second anchoring layer is positioned on the metal grid layer, the anchoring layer solution fills the grid gaps formed between adjacent metal wires in the metal grid layer;

in the five-layer structure, the metal nanowire layer, the second anchoring layer, the metal grid layer and the planar conductive layer are all arranged between the flexible substrate and the first anchoring layer, and the arrangement sequence of the metal nanowire layer, the second anchoring layer, the metal grid layer and the planar conductive layer can be changed randomly.

In one possible implementation manner, the anchoring layer solution contains one or more of acrylic monomers, silicone-epoxy, siloxane, phenolic resin, polyurethane prepolymer and polyimide prepolymer, and further, the anchoring layer may also contain any one or more of polypyrrole, polythiophene, polyacetylene, polyparaphenylene, polyaniline, perylene pigments, azo pigments, phthalocyanines and phthalocyanine compounds, pentacene derivatives, benzothiophene derivatives, rubrene, C60, poly 3-hexylthiophene, polyparaphenylene vinylene and polyphenol. The anchoring layer is made by photo-curing or thermal curing. The metal nanowire in the metal nanowire layer is any one or a combination of several of a nano copper wire, a nano gold wire, a nano silver wire, a nano tungsten wire, a nano platinum wire, a nano palladium wire, a nano iron wire, a nano cobalt wire and a nano nickel wire. The material of the plane conducting layer is any one or combination of a plurality of transparent oxide films, metal films, graphene films and transparent organic conducting thin films. The material of the metal grid layer is one or a combination of more of silver, copper, silver alloy and copper alloy. The metal grid layer is manufactured through modes of nano-imprinting, ink-jet printing, silk-screen printing or magnetron sputtering, orthogonal etching and the like.

The metal mesh layer is manufactured by nanoimprinting, namely, a master die or a template is pressed into a base material carrying a conformal material, the conformal material deforms according to the shape of the raised template, the conformal material is solidified by an ultraviolet exposure or heat treatment method, and after the master die or the template is removed, graphic information opposite to the height position of the template can be obtained. Coating nano conductive ink on the surface of the graphic information in a scraping manner, filling the conductive ink into the groove, and performing thermocuring to obtain a metal grid layer; the method is suitable for directly manufacturing the metal grid layer on the flexible substrate.

The metal mesh layer is manufactured by ink-jet printing, wherein conductive ink containing metal nano-particles is directly printed on a substrate by using an ink-jet printing technology, and the metal mesh layer is formed after drying and subsequent treatment.

The metal grid layer is manufactured in a silk-screen mode, and conductive ink containing metal nano-particles is transferred to a printing stock through meshes of a silk-screen mesh plate grid by extruding of a scraper plate to form the metal grid layer.

The metal grid layer is manufactured by magnetron sputtering and orthogonal etching, namely a metal layer is manufactured on a substrate by a magnetron sputtering method, then a photosensitive substance (also called photoresist or light resistance) is coated on the surface of the metal layer, a grid pattern left after exposure and development plays a role in protecting a bottom layer, finally, the unprotected metal layer is etched by an orthogonal etching mode, and then, the metal grid layer is obtained by demoulding.

The high-performance flexible composite conductive film prepared by the method can meet the optical performance requirements of large-size touch devices, has the advantages of oxidation resistance, good flexibility, good conductivity and high stability, and can be widely applied to the aspects of touch screens, displays, mobile phone antenna circuits, infrared optical imaging elements, photoelectric sensors, electromagnetic shielding, intelligent windows, intelligent handwriting boards and solar cells.

The present invention will be specifically described below based on examples, but the present invention is not limited thereto.

Example 1

The high-performance flexible composite conductive film provided by this embodiment includes, as shown in fig. 1, a substrate, a metal nanowire layer, a metal mesh layer, and a first anchor layer in sequence. Wherein:

the substrate is a PET flexible substrate and has a thickness of 125 um.

The metal nanowire layer is a network-shaped conductive structure formed by a plurality of silver nanowires, gaps are formed among the silver nanowires, and the silver nanowires are 25nm in diameter and 30um in length; the thickness of the metal nanowire layer was 75 nm.

The metal grid layer is a grid-shaped conductive structure formed by a plurality of copper wires, and gaps formed among the copper wires in the metal grid layer are larger than gaps formed among the nano-silver wires in the metal nanowire layer. Wherein, metal mesh thickness is 50nm, and the linewidth is 15um, and the line spacing is 50 um.

The first anchoring layer is made of acrylic resin and has a thickness of 1 nm. The first anchoring layer covers the surfaces of the metal nanowires and fills gaps among the metal nanowires.

The high-performance flexible composite conductive film is prepared by the following steps:

s11, preparing 0.09 wt% of nano silver wire ink, wherein the diameter of the nano silver wire is 25nm, and the length of the nano silver wire is 30 microns; and coating the nano silver wire ink on a PET substrate in a slit coating mode to form a network-shaped conductive structure to obtain a metal nanowire layer, wherein the thickness of a dry film is 75 nm.

S12, performing magnetron sputtering on a copper layer above the nano silver wire layer manufactured in the step S11, then coating a photosensitive substance (also called photoresist or light resistance) on the surface of the metal layer, exposing and developing, finally etching the metal copper layer by adopting an orthogonal etching mode, and then stripping to obtain the metal grid layer. Wherein the thickness of the metal grid is 50nm, the line width is 15um, the line distance is 50um, wherein, the etching solution for etching the metal grid only etches copper and not etches silver.

S13, coating an anchoring layer solution with a solid content of 2.0 wt% on the metal grid layer in a slit coating mode, filling gaps in the metal grid layer with the anchoring layer solution, drying and carrying out ultraviolet curing to obtain a first anchoring layer, wherein the thickness of the coating after curing is 1 nm.

Example 2

The high-performance flexible composite conductive film provided by the embodiment includes a substrate, a metal mesh layer, a metal nanowire layer, and a first anchor layer, as shown in fig. 2. Wherein:

the substrate is the flexible substrate of PET, and thickness is 150 um.

The metal grid layer is a grid-shaped conductive structure formed by a plurality of silver wires, and grid-shaped gaps are formed among the silver wires in the metal grid layer.

The metal nanowire layer is of a network-shaped conductive structure formed by a plurality of nano copper wires, gaps formed among the nano copper wires are smaller than gaps among the silver wires in the metal grid layer, and the nano copper wires are 100nm in diameter and 250um in length; the thickness of the metal nanowire layer was 300 nm.

The first anchoring layer is made of acrylic resin and has a thickness of 3 nm. The first anchoring layer covers the surfaces of the metal nanowires and fills gaps among the metal nanowires.

s21, vacuum evaporating a silver layer on the PET substrate, coating a photosensitive substance (also called photoresist or light resistance) on the surface of the metal layer, exposing and developing, etching the metal copper layer by adopting an orthogonal etching mode, and then stripping to obtain the metal grid layer. Wherein the thickness of the metal grid is 500nm, the line width is 30um, and the line distance is 500 um.

S22, preparing nano copper wire ink with the content of 0.09 wt%, wherein the diameter of the nano copper wire is 100nm, and the length of the nano copper wire is 250 micrometers; and (3) coating the nano copper wire ink on the metal grid layer in a slit coating mode to form a network-shaped conductive structure to obtain a metal nanowire layer, wherein the thickness of a dry film is 300 nm.

S23, coating an anchoring layer solution with a solid content of 2.0 wt% on the metal nanowire layer in a slit coating mode, filling gaps in the metal nanowire layer with the anchoring layer solution, drying and carrying out ultraviolet curing to obtain a first anchoring layer, wherein the thickness of the coating after curing is 3 nm.

Example 3

The high-performance flexible composite conductive film provided by the embodiment includes a substrate, a metal nanowire layer, a metal mesh layer, a planar conductive layer, and a first anchor layer, as shown in fig. 5. Wherein:

the substrate is a PP flexible substrate, and the thickness is 125 um.

The metal nanowire layer is of a network-shaped conductive structure formed by a plurality of silver nanowires, gaps are formed among the silver nanowires, and the silver nanowires are 15nm in diameter and 20um in length; the thickness of the metal nanowire layer was 60 nm.

The metal grid layer is a grid-shaped conductive structure formed by a plurality of copper wires, and gaps formed among the copper wires in the metal grid layer are larger than gaps formed among the metal nanowires in the metal nanowire layer.

The first anchoring layer is made of acrylic resin and has a thickness of 0.1 nm. The first anchoring layer covers the surface of the metal grid and fills gaps among the metal lines in the metal grid layer.

s31, preparing 0.09 wt% of nano silver wire ink, wherein the diameter of the nano silver wire is 15nm, and the length of the nano silver wire is 20 um; and coating the nano silver wire ink on a PP substrate in a slit coating mode to form a network-shaped conductive structure to obtain a metal nanowire layer, wherein the thickness of a dry film is 60 nm.

S32, vacuum evaporating a copper layer above the metal nanowire layer, coating a photosensitive substance (also called photoresist or light resistance) on the surface of the metal copper layer, exposing and developing, etching the metal copper layer by adopting an orthogonal etching mode, and then stripping to obtain the metal grid layer. Wherein the thickness of the metal grid layer is 80nm, the line width is 10um, and the line distance is 80 um. Wherein, the etching solution for etching the metal grid only etches copper and not silver.

And S33, performing magnetron sputtering of an ITO layer above the metal grid layer to obtain a planar conductive layer with the thickness of 80 nm.

S34, coating an anchoring layer solution with a solid content of 2.0 wt% on the metal grid layer in a slit coating mode, filling gaps in the metal grid layer with the anchoring layer solution, and then carrying out ultraviolet curing to obtain a first anchoring layer, wherein the thickness of the coating after curing is 0.1 nm.

Example 4

The high-performance flexible composite conductive film provided by this embodiment includes, as shown in fig. 11, a substrate, a metal nanowire layer, a second anchor layer, a metal mesh layer, a planar conductive layer, and a second anchor layer in sequence. Wherein:

the substrate is a PET flexible substrate and is 188um thick.

The metal nanowire layer is a network-shaped conductive structure formed by a plurality of nano gold wires, gaps are formed among the nano gold wires, and the nano gold wires are 5nm in diameter and 10um in length; the thickness of the metal nanowire layer was 30 nm.

The second anchoring layer is made of acrylic resin. The second anchoring layer covers the surfaces of the metal nanowires and fills gaps among the metal nanowires.

The metal grid layer is a grid-shaped conductive structure formed by a plurality of copper wires, gaps formed among the copper wires in the metal grid layer are larger than gaps formed among the metal nanowires in the metal nanowire layer, and the thickness of the metal grid layer is 200 nm.

The planar conducting layer is a transparent oxide film and has the thickness of 100 nm;

the first anchoring layer is made of acrylic resin and covers the planar conducting layer.

s41, preparing 0.09 wt% nano gold wire ink, wherein the diameter of the nano gold wire is 5nm, and the length of the nano gold wire is 10 um; and (3) coating the nano gold wire ink on a PET substrate in a slit coating mode to form a network-shaped conductive structure to obtain a metal nanowire layer, wherein the thickness of a dry film is 30 nm.

S42, coating an anchoring layer solution with solid content of 2.0 wt% on the metal nanowire layer in a slit coating mode, filling gaps in the metal nanowire layer with the anchoring layer solution, and then carrying out ultraviolet curing to obtain a second anchoring layer, wherein the thickness of the cured coating is 4 nm.

And S43, performing surface treatment on the cured second anchoring layer by adopting a corona treatment mode.

S44, vacuum evaporating a copper layer on the second anchor layer manufactured in step S43, then coating a photosensitive material (also called photoresist or photoresist) on the surface of the metal copper layer, exposing, developing, etching the metal copper layer by orthogonal etching, and then stripping to obtain the metal mesh layer. Wherein the thickness of the metal grid layer is 200nm, the line width is 20um, the line distance is 150um, wherein, the etching solution for etching the metal grid only etches copper and not etches gold.

And S45, performing magnetron sputtering of an ITO layer above the metal grid layer to obtain a planar conductive layer with the thickness of 100 nm.

S46, preparing a second anchoring layer on the planar conductive layer obtained in step S45, by: coating an anchoring layer solution with the solid content of 2.0 wt% on the planar conductive layer by adopting a slit coating mode, drying and carrying out ultraviolet curing to obtain a second anchoring layer, wherein the thickness of the cured coating is 5 nm.

Example 5

The high-performance flexible composite conductive film provided by this embodiment includes, as shown in fig. 12, a substrate, a metal nanowire layer, a second anchor layer, a planar conductive layer, a metal mesh layer, and a first anchor layer in sequence. Wherein:

the substrate is the flexible substrate of EVA, and thickness is 150 um.

The metal nanowire layer is a network-shaped conductive structure formed by a plurality of silver nanowires, gaps are formed among the silver nanowires, and the silver nanowires are 30nm in diameter and 40um in length; the thickness of the metal nanowire layer was 90 nm.

The second anchoring layer is made of acrylic resin and has a thickness of 2 nm. The second anchoring layer covers the surface of the metal nanowire layer and fills gaps among the metal nanowires.

The planar conductive layer is a transparent oxide film with a thickness of 120 nm.

The metal grid layer is of a grid-shaped conductive structure formed by a plurality of silver wires, and gaps formed among the silver wires in the metal grid layer are larger than gaps formed among the metal nanowires in the metal nanowire layer;

the first anchoring layer is made of acrylic resin and has a thickness of 5 nm. The first anchoring layer covers the surface of the metal mesh layer and fills gaps between the metal mesh lines.

s51, preparing 0.09 wt% of nano silver wire ink, wherein the diameter of the nano silver wire is 30nm, and the length of the nano silver wire is 40 um; and (3) coating the nano gold wire ink on the EVA substrate in a slit coating mode to form a network-shaped conductive structure to obtain a metal nanowire layer, wherein the thickness of a dry film is 90 nm.

S52, coating an anchoring layer solution with a solid content of 2.0 wt% on the metal nanowire layer in a slit coating mode, filling gaps in the metal nanowire layer with the anchoring layer solution, and then carrying out ultraviolet curing to obtain a second anchoring layer, wherein the thickness of the cured coating is 2 nm.

And S53, performing surface treatment on the cured first anchoring layer by adopting a corona treatment mode.

And S54, performing magnetron sputtering of an ITO layer above the metal grid layer to obtain a planar conductive layer with the thickness of 120 nm.

S55, performing magnetron sputtering on the copper layer above the planar conductive layer manufactured in the step S54, and etching the copper layer into a grid-shaped conductive structure by adopting a yellow light process to obtain a metal grid layer with the thickness of 150nm, the line width of 5um and the line distance of 100um, wherein the etching solution for etching the metal grid only etches copper but not silver and ITO.

S56, preparing a second anchoring layer on the metal grid layer obtained in the step S55, wherein the method comprises the following steps: coating an anchoring layer solution with the solid content of 2.0 wt% on the metal grid layer by adopting a slit coating mode, and then carrying out ultraviolet curing to obtain a first anchoring layer, wherein the thickness of the coating after curing is 5 nm.

Example 6

The high-performance flexible composite conductive film provided by this embodiment includes, as shown in fig. 3, a substrate, a metal mesh layer, a metal nanowire layer, a first anchor layer, and a planar conductive layer in sequence. Wherein:

the substrate is a CPI flexible substrate with a thickness of 25 um.

The metal grid layer is a grid-shaped conductive structure formed by a plurality of copper wires, and gaps are formed among the copper wires in the metal grid layer.

The metal nanowire layer is of a network-shaped conductive structure formed by a plurality of silver nanowires, gaps formed among the silver nanowires are smaller than gaps formed among copper wires in the metal grid layer, and the silver nanowires are 20nm in diameter and 35um in length; the thickness of the metal nanowire layer was 80 nm.

The planar conductive layer is a transparent oxide film with a thickness of 5 nm.

s61, vacuum-evaporating a copper layer above the CPI substrate, and etching the copper layer into a grid-shaped conductive structure by adopting a yellow light process to obtain a metal grid layer with the thickness of 100nm, the line width of 1um and the line distance of 30 um.

S62, preparing 0.09 wt% of nano silver wire ink, wherein the diameter of the nano silver wire is 20nm, and the length of the nano silver wire is 35 um; and (3) coating the nano silver wire ink on the metal grid layer in a slit coating mode to form a network-shaped conductive structure to obtain a metal nanowire layer, wherein the thickness of a dry film is 80 nm.

S63, coating an anchoring layer solution with solid content of 2.0 wt% on the metal nanowire layer in a slit coating mode, filling gaps in the metal nanowire layer with the anchoring layer solution, and then carrying out ultraviolet curing to obtain a first anchoring layer, wherein the thickness of the coating after curing is 3 nm.

And S64, performing surface treatment on the cured first anchoring layer by adopting a corona treatment mode.

And S65, performing magnetron sputtering of an ITO layer above the first anchoring layer to obtain a planar conducting layer with the thickness of 5 nm.

The high-performance flexible composite conductive films of examples 1 to 6 were subjected to tests of light transmittance, resistance, and the like, respectively, to obtain the following film material performance data.

From the above, the average light transmittance of the high-performance flexible composite conductive film provided by the invention in the visible light range of 400 nm-800 nm is more than 75%, the requirement on light transmittance in large-size touch device application can be met, and the high-performance flexible composite conductive film has lower resistance and better conductivity than the traditional nano silver wire conductive film and metal grid conductive film.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only show several embodiments of the present disclosure, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the concept of the present disclosure, and these changes and modifications are all within the scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the appended claims.

Claims

1. A high-performance flexible composite conductive film is characterized by comprising a substrate, a metal nanowire layer, a metal grid layer and a first anchoring layer, wherein the metal nanowire layer and the metal grid layer are arranged between the substrate and the first anchoring layer, and the arrangement sequence of the metal nanowire layer and the metal grid layer can be exchanged;

2. The high performance flexible composite conductive film of claim 1, further comprising a planar conductive layer, wherein the planar conductive layer is a planar conductive structure;

3. The high performance flexible composite conductive film of claim 2, further comprising a second anchoring layer,

4. The high-performance flexible composite conductive film according to any one of claims 1 to 3,

when the first anchoring layer is disposed on the metal nanowire layer, the first anchoring layer fills or is embedded in network voids in the metal nanowire layer;

when the first anchoring layer is arranged on the metal grid layer, the first anchoring layer is filled or embedded in grid gaps in the metal grid layer;

when the first anchoring layer is disposed on the planar conductive layer, the first anchoring layer covers a surface of the planar conductive layer.

5. The high performance flexible composite conductive film according to any one of claims 1 to 3, wherein the first anchoring layer covers at least one surface of the metal mesh layer, at least one surface of the metal nanowire layer, or at least one surface of the planar conductive layer.

6. The high performance flexible composite conductive film of claim 5, wherein the first anchoring layer wraps around the metal mesh layer, the metal nanowire layer, or the planar conductive layer.

7. The high-performance flexible composite conductive film according to any one of claims 1 to 3, wherein a functional composite layer is further disposed between the substrate and the metal nanowire layer or the metal mesh layer, and the functional composite layer is any one or a combination of more of an optical adaptive layer, an electrical adaptive layer, a mechanical adaptive layer, a planar conductive layer, and a refractive index adaptive layer.

8. The high-performance flexible composite conductive film according to any one of claims 1 to 3, wherein the metal nanowire is any one or a combination of several of a nano copper wire, a nano gold wire, a nano silver wire, a nano tungsten wire, a nano platinum wire, a nano palladium wire, a nano iron wire, a nano cobalt wire and a nano nickel wire.

9. The high-performance flexible composite conductive film according to any one of claims 1 to 3, wherein the metal nanowires have a diameter of 5nm to 100nm and an aspect ratio of 500 to 2500.

10. The high-performance flexible composite conductive film according to any one of claims 1 to 3, wherein the thickness of the metal nanowire layer is 20nm to 300 nm.

11. The high-performance flexible composite conductive film according to any one of claims 1 to 3, wherein the first anchor layer comprises one or a combination of several of acrylic resin, silicone-epoxy, siloxane, phenol, epoxy, polyurethane and polyimide, and further comprises one or a combination of several of polypyrrole, polythiophene, polyacetylene, polyparaphenylene, polyaniline, perylene pigment, azo pigment, phthalocyanine and phthalocyanine compound, derivative of pentacene, derivative of benzothiophenes, rubrene, C60, poly-3-hexylthiophene, polyparaphenylene vinylene and polyphenol.

12. The high performance flexible composite conductive film according to claim 3, wherein the second anchoring layer comprises one or a combination of several of acrylic resin, silicone-epoxy, siloxane, phenolic, epoxy, polyurethane and polyimide, and further comprises any one or a combination of several of polypyrrole, polythiophene, polyacetylene, polyparaphenylene, polyaniline, perylene pigment, azo pigment, phthalocyanine and phthalocyanine compound, pentacene derivative, benzothiophene derivative, rubrene, C60, poly-3-hexylthiophene, polyparaphenylene vinylene and polyphenol.

13. The high-performance flexible composite conductive film according to any one of claims 1 to 3, wherein the first anchoring layer is made by photo-curing or thermal-curing a prepolymer.

14. The high-performance flexible composite conductive film according to any one of claims 1 to 3, wherein the thickness of the first anchor layer is 0.1nm to 5 nm.

15. The high performance flexible composite conductive film according to claim 2 or 3, wherein the planar conductive layer comprises any one or a combination of more of a transparent oxide film, a metal film, a graphene film, and a transparent organic conductive thin film.

16. The high-performance flexible composite conductive film according to claim 2 or 3, wherein the thickness of the planar conductive layer is 5nm to 200 nm.

17. The flexible composite conductive film according to any one of claims 1 to 3, wherein the metal wires in the metal mesh layer comprise one or a combination of silver, copper, silver alloy and copper alloy, the thickness of the metal mesh layer is 50nm to 500nm, the line width is 1um to 30um, and the line distance is 30um to 500 um.

18. The high-performance flexible composite conductive film according to any one of claims 1 to 3, wherein the metal mesh layer is manufactured by nanoimprint, printing, screen printing or magnetron sputtering and orthogonal etching.

19. The high-performance flexible composite conductive film according to claim 1, wherein the surface of the metal mesh layer is further provided with a passivation layer and/or a blackening layer, and the passivation layer and/or the blackening layer is used for preventing the metal mesh layer from being oxidized and failing.

20. A preparation method of a high-performance flexible composite conductive film is characterized by comprising the following steps:

a first anchoring layer is formed on the conductive composite layer.

21. The method of claim 20, further comprising:

22. The method of claim 21, further comprising:

23. The method according to any one of claims 20 to 22, wherein the first anchoring layer comprises one or more of acrylic monomers, silicone-epoxy, siloxane, phenolic resin, polyurethane prepolymer and polyimide prepolymer, and further comprises one or more of polypyrrole, polythiophene, polyacetylene, polyparaphenylene, polyaniline, perylene pigments, azo pigments, phthalocyanine and phthalocyanine compounds, pentacene derivatives, benzothiophene derivatives, rubrene, C60, poly 3-hexylthiophene, polyparaphenylene vinylene and polyphenol;

the first anchoring layer is manufactured in a way of over-light curing or heat curing;

the metal nanowire in the metal nanowire layer is any one or a combination of several of a nano copper wire, a nano gold wire, a nano silver wire, a nano tungsten wire, a nano platinum wire, a nano palladium wire, a nano iron wire, a nano cobalt wire and a nano nickel wire;

the material of the planar conducting layer is any one or combination of a plurality of transparent oxide films, metal films, graphene films and transparent organic conducting thin films;

the metal grid layer is made of one or a combination of more of silver, copper, silver alloy and copper alloy;

the metal grid layer is manufactured in a nano-imprinting mode, an ink-jet printing mode, a silk-screen printing mode or a magnetron sputtering mode and an orthogonal etching mode.

24. Use of a high performance flexible composite conductive film according to any one of claims 1 to 19 in touch screens, displays, mobile phone antenna circuits, infrared optical imaging elements, photosensors, electromagnetic shielding, smart windows, smart handwriting boards and solar cells.