CN113400733A - Cover plate, cover plate forming method and electronic equipment - Google Patents
Cover plate, cover plate forming method and electronic equipment Download PDFInfo
- Publication number
- CN113400733A CN113400733A CN202010183184.5A CN202010183184A CN113400733A CN 113400733 A CN113400733 A CN 113400733A CN 202010183184 A CN202010183184 A CN 202010183184A CN 113400733 A CN113400733 A CN 113400733A
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- Prior art keywords
- layer
- cover plate
- composite board
- cover
- polymer film
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/416—Reflective
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/726—Permeability to liquids, absorption
- B32B2307/7265—Non-permeable
Abstract
The present disclosure relates to the field of electronic product processing technologies, and in particular, to a cover plate, a cover plate forming method, and an electronic device. The cover plate comprises a composite board and a cover bottom membrane, wherein the cover bottom membrane comprises a glue layer, a polymer membrane layer and an ink layer. Wherein, the polymer film layer passes through the glue film and connects in one side of composite board, and the printing ink layer sets up in the one side that the glue film was kept away from to the polymer film layer. The application provides a apron is through covering the laminating of diaphragm on composite board at the bottom of to the realization is to composite board's shading and guard action. The cover plate, the cover plate forming method and the electronic equipment are simple in process and low in cost. The waterproof performance of the polymer film layer is better, and the adjacent coating layer can not be corroded.
Description
Technical Field
The present disclosure relates to the field of electronic product processing technologies, and in particular, to a cover plate, a cover plate forming method, and an electronic device.
Background
With the coming of the formality of the 5G era, the metal rear cover of the electronic equipment is gradually eliminated, the cost of the 3D glass and the ceramic is too high, the traditional plastics cannot meet the requirements of the market on the appearance of the mobile phone and the increasingly fierce middle and low-end market in competition, and therefore the application of the screen printing cover bottom in the prior art is more and more.
The back cover (cover plate) of electronic equipment usually includes composite board and cover bottom, and in the appearance process for realizing the fine appearance of composite board, it is very important to have a process, i.e. screen printing ink cover bottom, which has very important effect on both appearance and reliability of composite board. At present, the silk-screen printing cover bottom needs to be printed for 3-5 times and baked for a long time, the process is time-consuming and labor-consuming, the water resistance of silk-screen printing ink is poor, and the protection of the front coating is poor. In addition, because the printing ink contains strong solvent, the solvent can corrode the previous coating during printing, poor appearance is generated, and the development period of new appearance schemes is greatly prolonged.
Disclosure of Invention
The application provides a cover plate, a cover plate forming method and electronic equipment, which are used for simplifying the process, reducing the cost and improving the waterproof performance.
The present application provides in a first aspect a cover plate, comprising:
compounding the board;
the cover bottom membrane comprises a glue layer, a polymer membrane layer and an ink layer; the polymer film layer is connected to one side of the composite board through the adhesive layer; the printing ink layer is arranged on one side, far away from the glue layer, of the polymer film layer.
The application provides a apron is through covering the laminating of diaphragm on composite board at the bottom of to the realization is to composite board's shading and guard action. The cover plate provided by the embodiment of the application has the advantages of simple process and low cost. The waterproof performance of the polymer film layer is better, and the adjacent coating layer can not be corroded.
In a possible embodiment, the material of the polymer film layer is polyethylene terephthalate, polycarbonate or a thermoplastic polyurethane elastomer.
In one possible embodiment, the glue layer is an optical glue layer.
The optical adhesive layer can improve the drawing force between the composite board and the bottom covering membrane.
In one possible embodiment, the thickness of the ink layer is 8 ± 0.2 microns.
The dyne value of the surface of the bottom covering membrane can be regulated and controlled by adjusting the dumb degree of the ink layer.
In one possible embodiment, the thickness of the glue layer is 25 ± 0.2 microns.
In one possible embodiment, the composite board comprises a board, a Logo layer, a color layer, a texture layer and a reflection layer which are sequentially stacked;
the reflecting layer is connected with the polymer film layer through the glue layer.
The composite sheet is mainly embodied by coatings on top of the reflective layer, but these coatings generally have high light transmittance and greatly affect the appearance of the cover plate once damaged, and for this reason, the reflective layer is required to shield and protect from light.
The second aspect of the present application provides a method for forming a cover plate, including:
mounting the bottom cover membrane on a rotating shaft of a film laminating machine;
placing the composite board on a conveyor belt of a laminating machine;
and adhering the bottom covering membrane to the composite board by using a pressing roller.
In a possible embodiment, after the cover bottom film sheet is attached to the composite board by using the pressing roller, the molding method further includes:
and cutting the bottom covering membrane according to the contour size of the composite board.
In one possible embodiment, after the installation of the mulching film sheet on the rotating shaft of the laminating machine, the molding method further comprises:
and adjusting the friction force between the rotating shaft and the film laminating machine support to enable the friction force to be smaller than a set value.
A third aspect of the present application provides an electronic device, comprising a body, wherein the electronic device further comprises any one of the above-mentioned cover plates, the cover plate is connected to the body, and the bottom covering membrane is close to the body relative to the composite board.
The technical scheme provided by the application can achieve the following beneficial effects:
according to the cover plate, the cover plate forming method and the electronic equipment, the cover bottom membrane is attached to the composite plate, so that the composite plate is shaded and protected. The cover plate provided by the embodiment of the application has the advantages of simple process and low cost. The waterproof performance of the polymer film layer is better, and the adjacent coating layer can not be corroded.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic cross-sectional view of a cover plate according to an embodiment of the present disclosure;
fig. 2 is a flowchart of a method for forming a cover plate according to an embodiment of the present disclosure;
fig. 3 is a schematic diagram of an apparatus in a method for forming a cover plate according to an embodiment of the present disclosure.
Reference numerals:
100-a cover plate;
1-composite board;
11-a plate material;
12-Logo layer;
13-a color layer;
14-a texture layer;
15-a reflective layer;
2-cover bottom membrane;
21-glue layer;
22-a polymer film layer;
23-an ink layer;
3-a rotating shaft;
4-press rolls.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be noted that the terms "upper", "lower", "left", "right", and the like used in the embodiments of the present application are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.
The cover plate in the prior art needs to be printed and baked for many times, is long in baking time, wastes time and labor, consumes a lot of resources of a factory, and limits delivery capacity. Most of the ink used for the cover plate at present is acrylate, the waterproof effect is general, and the previous coating is difficult to be protected. Finally, since the inks all contain a strong solvent, the solvent may corrode the previous coating during printing, resulting in poor appearance.
The embodiment of the application provides a cover plate aiming at the current situation that the cover plate of the current electronic equipment adopts silk-screen printing ink, and solves the problems that the process cycle is long, the waterproofness is poor and the adjacent coating is corroded.
Fig. 1 is a schematic cross-sectional view of a cover plate according to an embodiment of the present disclosure, and as shown in fig. 1, the embodiment of the present disclosure provides a cover plate 100 for connecting to a main body of an electronic device. The electronic equipment can be an electronic product such as a mobile phone, a tablet computer and the like. Taking a mobile phone as an example, the cover plate 100 can be fastened to the main body of the mobile phone as a rear cover.
The cover plate 100 includes a composite plate 1 and a bottom film 2. The bottom covering membrane 2 comprises a glue layer 21, a polymer membrane layer 22 and an ink layer 23. Wherein, the polymer film layer 22 is connected to one side of the composite board 1 through the glue layer 21; the ink layer 23 is disposed on a side of the polymer film layer 22 away from the adhesive layer 21.
The apron 100 that this application embodiment provided is through covering diaphragm 2 laminating on composite board 1 at the bottom of to the realization is to composite board 1's shading and guard action. The cover plate 100 provided by the embodiment of the application has the advantages of simple process and low cost. The polymer film layer 22 has better water resistance and does not corrode adjacent coatings.
The polymer film layer 22 may be a black/white polymer film formed by injection molding and having a certain thickness, and specifically, the material of the polymer film layer 22 may be polyethylene terephthalate, polycarbonate or a thermoplastic polyurethane elastomer.
In a specific embodiment, the glue layer 21 is an optical glue layer (OCA). The glue layer 21 needs to have good waterproofness, and after the bottom covering membrane 2 and the composite board 1 are connected through the glue layer 21, the drawing force needs to be greater than or equal to 16 newtons.
In a specific embodiment, the thickness of the ink layer 23 may be 8 ± 0.2 microns. The ink layer 23 is coated on one surface of the polymer film layer 22, and the dyne value of the surface of the bottom covering membrane 2 can be regulated and controlled by adjusting the dumb degree of the ink layer 23.
In one embodiment, the thickness of the glue layer 21 may be 25 ± 0.2 microns. The other side of the polymer film layer 22 may be coated with a glue layer 21.
After the bottom covering membrane 2 is attached to the composite board 1, the bottom covering membrane 2 can be cut into corresponding sizes according to the size of the composite board 1.
In a particular embodiment, the composite panel 1 may include a panel 11, a Logo layer 12, a color layer 13, a texture layer 14(UV texture), and a reflective layer 15(OPVD) that are sequentially stacked and connected. Wherein, the reflecting layer 15 is connected with the polymer film layer 22 through the glue layer 21.
The embodiment of the present application provides the cover plate 100 having a high-quality appearance, which is achieved by a multi-layer coating together. Referring to fig. 1, the composite panel 1 (color, texture) is mainly represented by coatings on the reflective layer 15, but these coatings generally have high light transmittance and greatly affect the appearance of the cover plate 100 once damaged, and thus the reflective layer (primer) is required for shading and protecting.
Fig. 2 is a flowchart of a method for forming a cover plate according to an embodiment of the present disclosure, and fig. 3 is a schematic diagram of an apparatus in the method for forming a cover plate according to the embodiment of the present disclosure.
Referring to fig. 2 and 3, an embodiment of the present application further provides a method for forming a cover plate, including:
in step S1, the mulching-film sheet 2 is attached to the rotating shaft 3 of the laminating machine.
In a specific embodiment, before or after step S1, the molding method may further include: and adjusting the friction force between the rotating shaft 3 and the film laminating machine support to enable the friction force to be smaller than a set value.
The friction force between the rotating shaft 3 and the film laminating machine support is required to be as small as possible, so that the situation that the bottom covering film 2 is excessively stretched due to the overlarge friction force during film laminating to generate residual stress, and the composite board 1 deforms after the bottom covering film 2 is attached is avoided.
In step S2, the composite board 1 is placed on a conveyor belt of a laminating machine.
Several scrapped plates can be firstly used for feeding and adjusting the machine, and the smooth and wrinkle-free joint of the bottom covering membrane 2 is ensured by adjusting the linear speed of the laminating machine and the pressure of the rubber 4.
In step S3, the lidding film 2 is bonded to the composite sheet 1 by the pressure roller 4.
In a specific embodiment, after the bottom-covering film sheet 2 is attached to the composite board 1 by the pressing roller 4, the molding method may further include: the bottom covering membrane 2 is cut according to the contour size of the composite board 1.
Specifically, the lidding film sheet 2 may be cut at the bottom edge of the composite sheet 1, either automatically or manually, to form the lid sheet 100.
The cover plate obtained by the cover plate forming method provided by the embodiment of the application is compared with the cover plate in the prior art, the two cover plates are soaked in water at 80 ℃ for half an hour, and the cover plate in the prior art is not added with water resistance, so that water vapor enters the coating and hidden troubles in appearance are caused. The cover plate provided by the embodiment of the application has good waterproofness and no abnormal appearance.
The embodiment of the application further provides an electronic device, which comprises a body and further comprises the cover plate 100 provided by any embodiment of the application. The cover plate 100 is connected to the body, and the bottom membrane 2 is close to the body relative to the composite board 1. The electronic equipment can be a mobile phone or a tablet computer and the like.
It is noted that a portion of this patent application contains material which is subject to copyright protection. The copyright owner reserves the copyright rights whatsoever, except for making copies of the patent files or recorded patent document contents of the patent office.
Claims (10)
1. A cover plate (100), comprising:
a composite panel (1);
the film comprises a bottom covering film (2), wherein the bottom covering film (2) comprises an adhesive layer (21), a polymer film layer (22) and an ink layer (23); the polymer film layer (22) is connected to one side of the composite board (1) through the adhesive layer (21); the printing ink layer (23) is arranged on one side, far away from the glue layer (21), of the polymer film layer (22).
2. The cover sheet (100) according to claim 1, wherein the material of the polymer film layer (22) is polyethylene terephthalate, polycarbonate or thermoplastic polyurethane elastomer.
3. The cover sheet (100) according to claim 1, wherein the glue layer (21) is an optical glue layer.
4. The cover sheet (100) according to claim 1, wherein the thickness of the ink layer (23) is 8 ± 0.2 microns.
5. The cover sheet (100) according to claim 1, wherein the thickness of the glue layer (21) is 25 ± 0.2 microns.
6. The cover sheet (100) according to any one of claims 1 to 5, wherein the composite sheet (1) comprises a sheet (11), a Logo layer (12), a color layer (13), a texture layer (14) and a reflective layer (15) which are stacked and connected in sequence;
the reflecting layer (15) is connected with the polymer film layer (22) through the adhesive layer (21).
7. A method of forming a cover plate (100), comprising:
mounting the cover bottom membrane (2) on a rotating shaft (3) of a film laminating machine;
placing the composite board (1) on a conveyor belt of a laminating machine;
and adhering the bottom covering membrane (2) to the composite board (1) by using a compression roller (4).
8. The molding method according to claim 7, wherein after the film sheet (2) is attached to the composite board (1) by a press roller (4), the molding method further comprises:
and cutting the bottom covering membrane (2) according to the contour size of the composite board (1).
9. The molding method according to claim 7 or 8, further comprising:
and adjusting the friction force between the rotating shaft (3) and the film laminating machine support to enable the friction force to be smaller than a set value.
10. An electronic device comprising a body, characterized in that the electronic device further comprises a cover plate (100) according to any one of claims 1-6, the cover plate (100) being connected to the body, and the cover bottom membrane (2) being close to the body with respect to the composite board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010183184.5A CN113400733A (en) | 2020-03-16 | 2020-03-16 | Cover plate, cover plate forming method and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010183184.5A CN113400733A (en) | 2020-03-16 | 2020-03-16 | Cover plate, cover plate forming method and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113400733A true CN113400733A (en) | 2021-09-17 |
Family
ID=77676597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010183184.5A Pending CN113400733A (en) | 2020-03-16 | 2020-03-16 | Cover plate, cover plate forming method and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113400733A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115074018A (en) * | 2021-12-31 | 2022-09-20 | 荣耀终端有限公司 | Finishing coat composition, composite material, electronic equipment middle frame, electronic equipment shell and electronic equipment |
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| CN107517552A (en) * | 2017-08-04 | 2017-12-26 | 捷开通讯(深圳)有限公司 | A kind of diaphragm for cover plate and preparation method thereof |
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| CN109468079A (en) * | 2018-10-31 | 2019-03-15 | 维沃移动通信有限公司 | The shell of rupture pressure disc, the preparation method of rupture pressure disc and electronic equipment |
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| CN110802881A (en) * | 2019-11-21 | 2020-02-18 | 昇印光电（昆山）股份有限公司 | Decorative film and electronic product cover plate |
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2020
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| US20090104396A1 (en) * | 2007-10-17 | 2009-04-23 | Compal Electronics, Inc. | Color pattern film for metal shell |
| CN107517552A (en) * | 2017-08-04 | 2017-12-26 | 捷开通讯(深圳)有限公司 | A kind of diaphragm for cover plate and preparation method thereof |
| CN108582896A (en) * | 2018-04-25 | 2018-09-28 | 王慧明 | Individual facial tissue preheating mechanism, corrugated paper board production line, technique and control method |
| CN109109550A (en) * | 2018-08-17 | 2019-01-01 | Oppo广东移动通信有限公司 | Processing method, housing unit and the electronic equipment of housing unit |
| CN109468079A (en) * | 2018-10-31 | 2019-03-15 | 维沃移动通信有限公司 | The shell of rupture pressure disc, the preparation method of rupture pressure disc and electronic equipment |
| CN110290657A (en) * | 2019-06-27 | 2019-09-27 | Oppo广东移动通信有限公司 | Housing unit and preparation method thereof and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115074018A (en) * | 2021-12-31 | 2022-09-20 | 荣耀终端有限公司 | Finishing coat composition, composite material, electronic equipment middle frame, electronic equipment shell and electronic equipment |
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