CN113395884A - Heat dissipation system and electronic equipment - Google Patents

Abstract

The application provides a cooling system and electronic equipment, cooling system includes evaporation plant, evaporation plant is including the ventilative layer, evaporation blanket and the liquid trap layer that stack gradually the setting, evaporation plant has the runner, the runner at least by the evaporation blanket constitutes, the runner is used for acceping liquid, the liquid trap layer is used for connecting the heat source, so that the heat transfer of heat source extremely liquid in the runner just makes the liquid evaporation heat absorption reduce the temperature of heat source, ventilative layer is used for permeating through gas and separation liquid and passes through. The application provides a cooling system can reduce power consumption when being applied to electronic equipment.

Description

Heat dissipation system and electronic equipment

Technical Field

The application relates to the technical field of heat dissipation, in particular to a heat dissipation system and electronic equipment.

Background

In order to meet various functional requirements of users on electronic equipment, functional devices in the electronic equipment are more and more, and the problems brought by the functional devices are that the power consumption of the electronic equipment is more and more large and the heat generation is more and more serious. In the related art, a circulating water cooling scheme is adopted to dissipate heat from a heat source in the electronic device, but the heat dissipation manner of the scheme increases power consumption.

Disclosure of Invention

The application provides a heat dissipation system and electronic equipment, when being applied to the electronic equipment, the heat dissipation system can reduce the electric energy consumption.

In a first aspect, the present application provides a heat dissipation system, the heat dissipation system includes an evaporation apparatus, the evaporation apparatus includes a breathable layer, an evaporation layer, and a liquid barrier layer, which are stacked in sequence, the evaporation apparatus has a flow channel, the flow channel is at least formed by the evaporation layer, the flow channel is used for accommodating liquid, the liquid barrier layer is used for connecting a heat source, so that heat of the heat source is transferred to liquid in the flow channel, and the liquid is evaporated to absorb heat to reduce the temperature of the heat source, and the breathable layer is used for permeating gas and blocking the liquid from passing through.

In a second aspect, the present application further provides an electronic device, where the electronic device includes a heat source and a heat dissipation system, and an evaporation device of the heat dissipation system is connected to the heat source to carry away at least part of heat of the heat source.

In the heat dissipation system provided by the present application, the evaporation effect of the liquid is utilized to dissipate heat from the heat source of the electronic device, and therefore, the heat dissipation system can be designed as follows: the gases formed during the evaporation are discharged directly out of the electronic device, i.e. the gases formed during the evaporation act as a carrier to carry the heat to the environment. Because the heat enters into the external environment, the process of cooling liquid in the related technology can be eliminated, so that a large amount of electric energy can be saved, and meanwhile, the liquid circulation process in the related technology does not need to be built, so that the problem of liquid deterioration can be avoided. Furthermore, the evaporation process of the liquid is accelerated along with the rise of the temperature, so that more heat can be taken away, the heat dissipation effect is better, namely, compared with other heat dissipation measures, the evaporation heat dissipation has the characteristics of higher temperature and stronger heat dissipation capacity.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic view of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic view of an electronic device according to another embodiment of the present application.

Fig. 3 is a schematic diagram illustrating a bonding relationship between a heat dissipation system and a heat source according to an embodiment of the present disclosure.

Fig. 4 is a schematic view of a heat dissipation system according to an embodiment of the present application.

Fig. 5 is an exploded view of an evaporation apparatus according to an embodiment of the present application.

Fig. 6 is a schematic view of a breathable layer provided in embodiments of the present application.

Fig. 7 is an exploded view of an evaporation apparatus according to another embodiment of the present application.

Fig. 8 is an exploded view of an evaporation apparatus according to another embodiment of the present application.

Fig. 9 is an exploded view of an evaporation apparatus according to another embodiment of the present application.

Fig. 10 is a schematic diagram illustrating an arrangement relationship between a liquid pump and a flow passage according to an embodiment of the present application.

Fig. 11 is a schematic diagram illustrating an arrangement relationship between a liquid pump and a flow passage according to another embodiment of the present application.

Fig. 12 is a schematic view of an arrangement of flow passages provided in the embodiments of the present application.

Fig. 13 is a schematic view of a heat dissipation system according to another embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present disclosure.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments, in case at least two embodiments are combined together without contradiction.

Referring to fig. 1 to 2, the present application provides an electronic device 1, where the electronic device 1 may be, but is not limited to, a charger, a mobile phone, a tablet, a notebook computer, a desktop computer, a television, and the like.

The electronic device 1 comprises a heat source 20 and a heat dissipation system 10 as described in any of the embodiments below. The evaporation device 110 of the heat dissipation system 10 is connected to the heat source 20 to remove at least part of the heat source 20.

The heat source 20 is a heat generating device that generates heat inside the electronic device 1 when the electronic device operates, such as a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), and the like. The evaporation device 110 is connected to the heat source 20, heat generated by the heat source 20 during operation is transferred to the evaporation device 110, and the evaporation device 110 takes away at least part of the heat by evaporation, so as to reduce or maintain the temperature of the heat source 20, thereby preventing the temperature of the heat source 20 from exceeding a critical safety value.

The evaporation apparatus 110 may be directly connected to the heat source 20 or indirectly connected to the heat source 20, which will be described below as an example.

Referring to fig. 1, in an embodiment, the electronic device 1 may further include a housing 30, the evaporation apparatus 110 and the heat source 20 are disposed in the housing 30, and the evaporation apparatus 110 is directly attached to a surface of the heat source 20. It is understood that, in the direct connection mode, the heat conduction path between the heat source 20 and the evaporation device 110 is the shortest, and the thermal resistance is the smallest, so that the evaporation device 110 can timely take away the heat of the heat source 20.

Referring to fig. 2, in another embodiment, the electronic device 1 may further include a housing 30, the heat source 20 is disposed in the housing 30, and the evaporation apparatus 110 is disposed outside the housing 30 and directly or indirectly connected to the housing 30. The heat generated by the heat source 20 during operation is directly or indirectly transferred to the housing 30, and the heat on the housing 30 is finally transferred to the evaporation device 110, so that the evaporation device 110 indirectly takes away the heat of the heat source 20. It is understood that in the indirect connection form, the evaporation device 110 can be disposed outside the housing 30 so as to avoid occupying the inner space of the housing 30, and in some embodiments, the evaporation device 110 and the housing 30 can be designed to be detachably connected.

Of course, the indirect connection of the evaporation device 110 to the heat source 20 is not limited to the arrangement shown in fig. 2, for example: the electronic device 1 further comprises a heat conducting member, the evaporation device 110 and the heat source 20 are arranged at intervals, the heat source 20 is arranged in the casing 30 or outside the casing 30, and the evaporation device 110 and the heat source 20 are in heat transfer connection through the heat conducting member.

Referring to fig. 3, the electronic device 1 further includes a thermal conductive adhesive 40, where the thermal conductive adhesive 40 is used to be adhered between the heat dissipation system 10 and the heat source 20, that is, two opposite sides of the thermal conductive adhesive 40 are respectively adhered to the heat dissipation system 10 and the heat source 20, and the arrangement form can reduce the thermal resistance between the heat dissipation system 10 and the heat dissipation system 20. Specifically, if the heat dissipation system 10 is directly connected to the heat source 20, it is difficult to transfer heat from the heat source 20 to the heat dissipation system 10, because the heat dissipation system 10 and the heat source 20 cannot be completely attached to each other, a gap exists, the gap is filled with air, and the heat conductivity coefficient of air is small and the heat resistance is large, so that a larger temperature gradient (temperature difference) is required to transfer a certain amount of heat from the heat source 20 to the heat dissipation system 10, thereby causing poor heat dissipation effect.

In this embodiment, the heat dissipation system 10 and the heat source 20 are bonded by the heat conductive adhesive 40, and the heat conductive adhesive 40 can fill the gap well, that is, the heat conductive adhesive 40 can make the gap between the heat conductive adhesive 40 and the heat dissipation system 10, and the gap between the heat conductive adhesive 40 and the heat source 20 smaller or zero, so that the heat transfer process among the heat source 20, the heat conductive adhesive 40, and the heat dissipation system 10 is easier to perform, thereby ensuring that a better heat dissipation effect can be obtained. It should be noted that the thermal conductivity of the thermal conductive paste 40 is greater than that of air.

Optionally, the heat conducting glue 40 may be a liquid glue, where the liquid glue is a liquid glue when the heat conducting glue 40 is just coated on the surface of the heat source 20 or the heat dissipation system 10, and is solidified into a solid after a certain time. It is understood that since the liquid glue is liquid at the beginning of coating and thus has fluidity, the heat conductive glue 40 having fluidity can well fill the gap between the heat conductive glue 40 and the heat dissipating system 10 and the gap between the heat conductive glue 40 and the heat source 20, thereby preventing air from being generated.

Alternatively, the thermal conductive adhesive 40 may be an adhesive tape (e.g., a double-sided adhesive tape) with certain elasticity. Due to the compressibility of the thermal conductive paste 40, a certain pressure may be applied to the thermal conductive paste 40 through the heat dissipation system 10 and the heat source 20 (for example, by pressing the heat dissipation system 10) at the beginning of bonding, and the thermal conductive paste 40 may thereby fill the gap between the thermal conductive paste 40 and the heat dissipation system 10 and the gap between the thermal conductive paste 40 and the heat source 20 by elastic action.

The heat dissipation system 10 in the electronic device 1 provided in the above embodiment is described in detail with reference to the drawings.

Referring to fig. 4 and 5, the present application provides a heat dissipation system 10. The heat dissipation system 10 includes an evaporation apparatus 110, the evaporation apparatus 110 includes a ventilation layer 111, an evaporation layer 112, and a liquid-blocking layer 113, which are sequentially stacked, and the ventilation layer 111, the evaporation layer 112, and the liquid-blocking layer 113 are sequentially connected. The evaporation device 110 has a flow channel a, which is formed by at least the evaporation layer 112. The flow channel a is used for accommodating liquid, which may be, but is not limited to, water. The liquid barrier layer 113 is used to connect a heat source 20, so that heat of the heat source 20 is transferred to the liquid in the flow channel a, and the liquid evaporates to absorb heat to lower the temperature of the heat source 20. The gas permeable layer 111 is for transmitting gas and blocking liquid from passing through. The material of the gas-permeable layer 111 may be, but is not limited to, polytetrafluoroethylene. The material of the evaporation layer 112 can be, but is not limited to, metal, plastic, etc., and the material of the evaporation layer 112 is required not to react with the liquid in the flow channel a.

It will be appreciated that evaporation is the vaporization that occurs at the surface of a liquid, occurring at any temperature, and that as the temperature increases, the faster the evaporation rate, the more heat is removed. Thus, the heat from the heat source 20 can cause the liquid to be heated and evaporated to form gas, and the gas carries the heat through the gas permeable layer 111, thereby carrying the heat out of the evaporation device 110, and the liquid which is not evaporated is blocked in the flow passage a by the gas permeable layer 111, thereby avoiding the liquid loss. In fig. 4, the direction indicated by the arrow is the escape direction of the gas formed by the evaporation of the liquid.

The liquid barrier layer 113 also serves to isolate the liquid from the heat source 20 to prevent the liquid or vapor from contacting the heat source 20, thereby preventing the liquid from corroding the heat source 20 or causing a short circuit. The material of the liquid barrier layer 113 may be an aluminum-plastic film, a waterproof composite PET film, a metal sheet, or the like.

In the related art, a circulation type water cooling scheme is generally used to dissipate heat from the heat source 20 in the electronic device 1, and the heat dissipation system 10 using this scheme generally includes a heat dissipation device and a cooling device. The heat sink and the cooling device are communicated through a pipe 125, and the heat sink is connected to the heat source 20, and a liquid as a cooling liquid circulates throughout the heat dissipation system 10. During the passage of the liquid through the heat sink, the liquid removes heat from the heat source 20 and the temperature of the liquid itself rises. The heated liquid flows through the cooling device, the cooling device takes away heat of the liquid, so that the temperature of the liquid is reduced, the cooled liquid flows into the heat dissipation device again to dissipate heat of the heat source 20, and the process is repeated. As can be seen from the above process, in the circulation-type water cooling scheme, a cooling device needs to be used to convert the liquid with a higher temperature into the liquid with a lower temperature, the cooling device needs to consume a large amount of electric energy, and the higher the temperature of the heat source 20 is, the more electric energy is consumed by the cooling device. Meanwhile, the liquid may deteriorate in the long-term recycling process, and the deteriorated liquid will cause the reduction of the heat dissipation effect.

In the present application, the heat source 20 of the electronic device 1 is designed to dissipate heat by utilizing the evaporation action of the liquid, and therefore: the gas formed during evaporation is discharged directly out of the electronic device 1, i.e. the gas formed during evaporation acts as a carrier to carry the heat to the environment. Because the heat enters into the external environment, the process of cooling liquid in the related technology can be eliminated, so that a large amount of electric energy can be saved, and meanwhile, the liquid circulation process in the related technology does not need to be built, so that the problem of liquid deterioration can be avoided. Furthermore, the evaporation process of the liquid is accelerated along with the rise of the temperature, so that more heat can be taken away, the heat dissipation effect is better, namely, compared with other heat dissipation measures, the evaporation heat dissipation has the characteristics of higher temperature and stronger heat dissipation capacity.

Alternatively, the size of the flow channel a in the direction in which the air-permeable layer 111 is directed to the liquid-barrier layer 113 is 0.1mm to 2mm, which can make the liquid form an extremely thin liquid film in the flow channel a. Since the heat is dissipated by evaporation of the liquid, the evaporation only occurs on the liquid surface (the surface of the liquid adjacent to or connected to the air-permeable layer 111), and the heat is transferred to the liquid through the liquid-blocking layer 113, the thickness of the liquid will affect the heat dissipation effect of the evaporation of the liquid, in other words, the greater the thickness of the liquid, the greater the thermal resistance of the liquid, the poorer the heat dissipation effect, and the adverse effect of cooling the heat source 20 is. In the embodiment, the extremely thin liquid film means that the thermal resistance is small, so that the evaporation is more facilitated, and the heat dissipation effect can be improved.

Referring to fig. 6, the air-permeable layer 111 includes a breathable film 1111 and a reinforcing film 1112 stacked together. Wherein the breathable film 1111 is used for ventilation and blocking liquid from passing through. The strength of the strengthening film 1112 is greater than the strength of the breathable film 1111. Specifically, the breathable film 1111 is extremely fragile, so that the breathable film is easily damaged under the pulling and rubbing action of external force. If the air permeable film 1111 is damaged, the function of blocking the passage of the liquid is disabled, the liquid in the flow channel a leaks out of the evaporation device 110, and if the evaporation device 110 is disposed inside the electronic apparatus 1, the leaked liquid may cause a problem such as a short circuit of the electronic apparatus 1. Therefore, in the present embodiment, the reinforcing film 1112 protects the breathable film 1111, and the strength of the breathable layer 111 as a whole is increased and is not easily damaged. The reinforcing film 1112 may be, but is not limited to, a breathable, tough fibrous material such as a nonwoven fabric. The breathable film 1111 and the strengthening film 1112 can be integrated by, but not limited to, high temperature pressing.

It should be noted that the connection form of the air-permeable layer 111 and the evaporation layer 112 may be: the permeable membrane 1111 is connected to the evaporation layer 112, and the strengthening membrane 1112 is disposed at an interval from the evaporation layer 112, or the permeable membrane 1111 is disposed at an interval from the evaporation layer 112, and the strengthening membrane 1112 is connected to the evaporation layer 112.

Referring to fig. 4, the heat dissipation system 10 further includes a liquid supply device 120. The liquid supply device 120 includes a tank 121 and a liquid pump 122. The tank 121 communicates with the liquid pump 122 and is used for storing liquid. The liquid pump 122 is communicated with the flow passage a and is used for conveying the liquid in the tank 121 to the flow passage a. That is, the outlet of the tank 121 is connected to the inlet of the liquid pump 122, the outlet of the liquid pump 122 is connected to the evaporation device 110, and the liquid pump 122 can pump the liquid in the tank 121 into the evaporation device 110.

It should be noted that, in the present application, the liquid in the evaporation device 110 is consumed only by evaporation, and is not discharged. When the liquid in the evaporation device 110 needs to be replenished, the liquid stored in the tank 121 is pumped into the evaporation device 110 by the liquid pump 122. When the liquid in the tank 121 is insufficient, the liquid is injected into the tank 121 through the inlet of the tank 121.

Referring to fig. 4, the liquid supply device 120 may further include a filter 124, the filter 124 is connected to an inlet of the tank 121, the liquid injected into the tank 121 needs to pass through the filter 124, and the filter 124 may filter the liquid flowing through, so as to ensure that the liquid is clean and prevent the liquid pump 122, the flow path a, and the like from being blocked.

Referring to fig. 4, the liquid supply device 120 may further include a gas-permeable valve 123. The air-permeable valve 123 is connected to the box body 121 and is used for balancing air pressures of the box body 121 and the external environment. It will be appreciated that during the process of the liquid pump 122 pumping the liquid in the tank 121 into the evaporation device 110, the air pressure in the tank 121 will gradually decrease to become negative pressure, so that the pressure at the inlet end of the liquid pump 122 is higher, and the pressure at the outlet end is lower, so that it is increasingly difficult for the liquid pump 122 to pump the liquid into the evaporation device 110. After the ventilation valve 123 is added, the ventilation valve 123 can communicate the inside of the box body 121 with the external environment, so that the air pressure in the box body 121 cannot become negative pressure.

It should be noted that, in the entire heat dissipation system 10, the communication relationship among the filter 124, the vent valve 123, the tank 121, the liquid pump 122, and the evaporation device 110 may be established through the pipe 125, and in other embodiments, the communication may be directly connected without the pipe 125, or some components may be connected through the pipe 125 and some other components may be directly connected.

Referring to fig. 4, the heat dissipation system 10 further includes a control device 130, and the control device 130 includes a function sensor 133 and a controller 132 electrically connected to each other. The function sensor 133 is connected to the evaporation device 110 and is used to generate a status signal. The controller 132 is configured to determine whether to control the liquid pump 122 to inject the liquid into the flow channel a according to the status signal.

It will be appreciated that since the evaporation device 110 absorbs heat by evaporation to lower the temperature of the heat source 20, the liquid in the flow passage a will decrease after a certain period of evaporation, so that the liquid needs to be replenished to avoid the decrease of the heat dissipation effect. In this embodiment, whether the liquid in the flow channel a is sufficient or not can be judged by the cooperation of the function sensor 133 and the controller 132, and then whether the liquid needs to be supplemented into the flow channel a or not can be determined, and this arrangement can make the liquid supplementing operation of the evaporation device 110 more intelligent without human judgment.

In one embodiment, the function sensor 133 is a liquid level sensor for acquiring the liquid level of the liquid in the flow channel a and generating a status signal related to the liquid level. The controller 132 is configured to determine whether the liquid level reaches a preset level according to the status signal. If the liquid level is lower than the preset liquid level, a control signal is generated. The control signal is used to control the liquid pump 122 to inject liquid into the flow channel a. That is, when the controller 132 determines that the liquid level is lower than the preset liquid level, the controller 132 controls the liquid pump 122 to pump the liquid in the tank 121 into the flow channel a of the evaporation apparatus 110. The liquid level sensor can be at least partially accommodated in the flow channel A, and can also be embedded in the breathable layer 111 and the like.

In another embodiment, the function sensor 133 is a temperature sensor for detecting the temperature of the heat source 20 and generating a status signal related to the temperature of the heat source 20. The controller 132 is configured to determine whether the temperature of the heat source 20 is increased according to the status signal. A control signal is generated if the temperature of the heat source 20 rises. The control signal is used to control the liquid pump 122 to inject liquid into the flow channel a. That is, when the controller 132 determines that the temperature of the heat source 20 is increased, the controller 132 controls the liquid pump 122 to pump the liquid in the tank 121 into the flow channel a of the evaporation device 110.

Further, the controller 132 determines whether the temperature of the heat source 20 is rising, and can compare the temperature difference with a temperature variation threshold. Wherein the temperature difference is a temperature difference of the heat source 20 within a preset time period. The temperature change threshold may be a temperature value set manually. When the temperature difference is greater than the temperature change threshold, the temperature of the heat source 20 is regarded as rising. Wherein the interval period may be, but not limited to, 1 second, 3 seconds, 4 seconds, 5 seconds, 10 seconds, 15 seconds, 20 seconds, 30 seconds, 55 seconds, 60 seconds, etc. The temperature variation threshold may be, but is not limited to, 0 ℃, 0.5 ℃, 0.6 ℃, 0.9 ℃, 1 ℃, 10 ℃, 15 ℃, 17 ℃, 20 ℃, 25 ℃ and the like. Of course, there may be other embodiments for determining whether the temperature of the heat source 20 is increased, for example, when the temperature difference is greater than 0 ℃, the determination may be made without setting a temperature change threshold.

Further, the number of the temperature sensors may be 1, 2, 4, 5, 6, 8, 9, etc. When the number is a plurality (more than or equal to 2), a plurality of temperature sensors are arranged at intervals, and are uniformly distributed or symmetrically arranged. It is understood that the temperatures of the heat source 20 acquired by the plurality of temperature sensors at the same time may not be the same, and therefore, the average value of the acquired temperatures may be used as the current temperature of the heat source 20, and of course, in other embodiments, the maximum value, the minimum value, or the intermediate value of the acquired temperatures may be used as the current temperature of the heat source 20.

It should be noted that the temperature sensor may be disposed on a side of the heat conductive adhesive 40 facing away from the air permeable layer 111, so that the temperature sensor may directly contact the heat source 20 to obtain a more accurate temperature of the heat source 20. The temperature sensor can also be arranged between the liquid barrier layer 113 and the heat-conducting glue 40, so that the temperature sensor can be protected more conveniently. The temperature sensor may also be embedded in the liquid barrier layer 113. Of course, other arrangements exist, not described herein.

Further, the volume of the flow channel a is a preset volume, and the controller 132 is configured to control the volume of the liquid injected into the flow channel a by the liquid pump 122 to be half of the preset volume. The function sensor 133 is exemplified as a temperature sensor.

The electronic device 1 starts to operate. During operation of the electronic device 1, the heat source 20 generates heat, and the temperature of the heat source 20 gradually increases. When the temperature sensor detects that the temperature of the heat source 20 rises to a critical temperature (e.g., 100 ℃), the controller 132 controls the liquid pump 122 to inject the liquid into the flow channel a (first injection), and the injection amount of the liquid is a predetermined volume. The critical temperature is a temperature threshold of the heat source 20, and if the heat source 20 continues to operate at or above the critical temperature, the lifetime of the heat source 20 is impaired. When the temperature of the heat source 20 reaches the critical temperature, it is considered that no liquid or a very small amount of liquid is present in the flow path a.

After the first injection of the liquid into the flow passage a, the liquid in the flow passage a can contain part of the heat, and the liquid absorbs heat by evaporation and takes away part of the heat, so that the temperature of the heat source 20 will decrease (for example, from 100 ℃ to 60 ℃). At the same time, the liquid is continuously reduced due to evaporation, and when the liquid is reduced to a certain extent, the liquid may be gathered into droplets due to tension, which causes the total surface area of the liquid to be reduced, so that the evaporation effect is reduced, and the temperature of the heat source 20 is increased (for example, from 60 ℃ to 80 ℃).

When the temperature sensor detects that the temperature of the heat source 20 has risen, the controller 132 controls the liquid pump 122 to inject the liquid into the flow path a (second injection), and the injection amount of the liquid is half of the predetermined volume because a part of the liquid remains in the flow path a. It will be appreciated that since the volume of the remaining liquid in the flow path a is uncertain, the amount of the liquid injected cannot be a predetermined volume, or the liquid may break the evaporation device 110. The amount of the injected liquid is half of the preset volume, so that the evaporation device 110 is not broken, and the heat dissipation effect can be ensured.

After the second injection of liquid into channel a, the temperature of the heat source 20 will decrease (e.g., from 80 c to 60 c). After the liquid has been evaporated for a period of time, the temperature of the heat source 20 will increase again (for example, from 60 ℃ to 80 ℃), and then the second injection process is repeated, i.e., half of the preset volume of the liquid is injected into the flow channel a each time the temperature increase of the heat source 20 is detected.

Several possible designs of the flow channel a in the evaporation device 110 are described below.

Referring to fig. 7, in one embodiment, the flow channel a penetrates through two opposite sides of the evaporation layer 112. The flow channel a is defined by the air-permeable layer 111, the evaporation layer 112, and the liquid-barrier layer 113. That is, the evaporation layer 112 has a through hole a1, the through hole a1 penetrates the evaporation layer 112, and the penetrating direction is a direction in which the liquid barrier layer 113 points to the evaporation layer 112. The through-hole a1 constitutes part of the flow passage a. The air-permeable layer 111, the evaporation layer 112, and the liquid-barrier layer 113 are sequentially stacked and connected to form a flow channel a. It can be understood that, since the flow channel a penetrates through the evaporation layer 112, the liquid in the flow channel a can directly contact the liquid barrier layer 113, so that the heat of the heat source 20 can be more easily transferred to the liquid, thereby improving the heat dissipation effect. In the structure of the present embodiment, the evaporation layer 112 may be made of the same material as the air-permeable layer 111 and the liquid-barrier layer 113.

Referring to fig. 8, in another embodiment, the evaporation layer 112 has a groove a2, and the groove a2 forms part of the flow channel a. The flow passage a is formed by enclosing the breathable layer 111 and the evaporation layer 112 together. That is, the opening of the groove a2 is directed toward the air-permeable layer 111, or the recess direction of the groove a2 on the evaporation layer 112 is the direction in which the air-permeable layer 111 is directed toward the liquid barrier layer 113. It can be understood that, since the flow channel a does not penetrate through the evaporation layer 112, the evaporation layer 112 has higher strength, so that the evaporation layer 112 is not easily damaged, and the heat dissipation system 10 is ensured to have a continuously good heat dissipation effect. In the structure of the present embodiment, the evaporation layer 112 may be made of the same material as the air-permeable layer 111 and the liquid-barrier layer 113.

Referring to fig. 9, in another embodiment, the evaporation layer 112 has a groove a2, and the groove a2 forms part of the flow channel a. The flow channel a is defined by the evaporation layer 112 and the liquid barrier layer 113. That is, the grooves a2 open toward the liquid-barrier layer 113, or alternatively, the grooves a2 are recessed in the evaporation layer 112 in a direction in which the liquid-barrier layer 113 is directed toward the air-permeable layer 111. In the structure of the present embodiment, the material of the evaporation layer 112 is the same as that of the air-permeable layer 111.

It should be noted that, referring to fig. 10, the liquid pump 122 may be disposed outside the flow passage a, and when disposed outside the flow passage a, an outlet of the liquid pump 122 is communicated with the flow passage a through the pipeline 125. Referring to fig. 11, the liquid pump 122 may also be at least partially disposed in the flow channel a, and when disposed in the flow channel a, an outlet of the liquid pump 122 is directly connected to the flow channel a, that is, the outlet of the liquid pump 122 is not connected to the flow channel a through the pipe 125.

It should be further noted that the flow channel a is continuously bent or bent, so as to increase the total length of the flow channel a, so that the liquid in the flow channel a has a larger surface area, and further the heat dissipation effect can be improved. The overall shape of the flow channel a may be substantially rectangular (as shown in fig. 10 and 11), circular (as shown in fig. 12), triangular, etc., but this is not necessarily an example.

Further, referring to fig. 13, the heat dissipation system 10 may further include a gas collecting device 140. The gas collecting device 140 is connected to the evaporation device 110. The gas collecting device 140 is used for collecting gas evaporated from the liquid in the evaporation device 110, and the gas collecting device 140 is also used for cooling the gas so that the gas becomes liquid. In fig. 13, the direction indicated by the straight arrows is the escape direction of the gas formed by the evaporation of the liquid in the heat dissipation system 10.

The gas collecting device 140 may include a gas collecting hood 141, a connecting pipe 142, and a reservoir 143. The gas collecting channel 141 is connected to the evaporation device 110. The gas collecting channel 141 has a gas collecting chamber B for collecting gas evaporated from the liquid in the evaporation device 110. The connection pipe 142 is used to connect the gas collecting channel 141 and the accumulator 143. The gas-collecting hood 141, the connecting pipe 142, and the liquid accumulator 143 may be, but not limited to, metal, and may be used to condense the gas collected by the gas-collecting hood 141, so that the gas is converted into liquid. The liquid accumulator 143 is used for collecting liquid converted from gas. It can be understood that the liquid collected by the liquid accumulator 143 can be poured into the tank 121, so that the liquid can be reused, and the waste of the liquid can be avoided.

The heat dissipation system 10 may further include a circulation device 150, and the circulation device 150 includes a circulation pump 151 and a circulation pipe 152. The inlet of the circulation pump 151 communicates with the reservoir 143 through a circulation pipe 152. The outlet of the circulation pump 151 communicates with the tank 121 through the outlet. The controller 132 may be connected to the circulation pump 151, and may control the circulation pump 151 to pump the liquid in the reservoir 143 into the tank 121.

Although embodiments of the present application have been shown and described, it is understood that the above embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the above embodiments without departing from the scope of the present application, and that such changes and modifications are also to be considered as within the scope of the present application.

Claims (11)

1. The heat dissipation system is characterized by comprising an evaporation device, wherein the evaporation device comprises a breathable layer, an evaporation layer and a liquid separation layer which are sequentially stacked, the evaporation device is provided with a flow channel, the flow channel at least comprises the evaporation layer and is used for containing liquid, the liquid separation layer is used for being connected with a heat source so that heat of the heat source is transferred to the liquid in the flow channel, the liquid is evaporated and absorbs heat to reduce the temperature of the heat source, and the breathable layer is used for permeating gas and blocking the liquid from passing through.

2. The heat dissipation system of claim 1, wherein the flow channel extends through opposite sides of the evaporation layer, and the flow channel is defined by the air-permeable layer, the evaporation layer, and the liquid barrier layer.

3. The heat dissipation system of claim 1, wherein the evaporation layer has a groove, the groove forms part of a flow channel, and the flow channel is defined by the air-permeable layer and the evaporation layer together, or the flow channel is defined by the evaporation layer and the liquid-barrier layer together.

4. The heat dissipation system of claim 1, wherein the air-permeable layer comprises an air-permeable membrane and a strengthening membrane, the air-permeable membrane is stacked to allow air to pass through and block liquid from passing through, and the strength of the strengthening membrane is greater than that of the air-permeable membrane.

5. The heat dissipation system of claim 1, further comprising a liquid supply device, the liquid supply device comprising a tank and a liquid pump, the tank being in communication with the liquid pump and configured to store liquid, the liquid pump being in communication with the flow channel and configured to deliver liquid in the tank into the flow channel.

6. The heat dissipating system of claim 5, wherein the liquid supply further comprises a vent valve connected to the tank for equalizing air pressure between the tank and the environment.

7. The heat dissipation system according to any one of claims 1 to 6, further comprising a control device and a liquid pump, wherein the liquid pump is connected to the flow channel and is configured to inject liquid into the flow channel, the control device includes a function sensor and a controller, the function sensor is electrically connected to the evaporation device and is configured to generate a status signal, and the controller is configured to determine whether to control the liquid pump to inject liquid into the flow channel according to the status signal.

8. The heat dissipation system of claim 7, wherein the function sensor is a temperature sensor, the temperature sensor is configured to obtain a temperature of the heat source and generate a status signal related to the temperature of the heat source, the controller is configured to determine whether the temperature of the heat source rises according to the status signal, and generate a control signal if the temperature of the heat source rises, the control signal being configured to control the liquid pump to inject the liquid into the flow channel.

9. The heat dissipation system of claim 8, wherein the volume of the flow channel is a predetermined volume, and the controller is configured to control the liquid pump to inject the liquid into the flow channel by an injection amount that is equal to or half of the predetermined volume.

10. An electronic device comprising a heat source and the heat dissipation system of any of claims 1-9, wherein the evaporator of the heat dissipation system is coupled to the heat source to remove at least a portion of the heat from the heat source.

11. The heat dissipating system of claim 10, wherein the electronic device further comprises a thermally conductive adhesive for bonding between the evaporation apparatus and the heat source.

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