CN113391729A - Touch module and electronic equipment - Google Patents
Touch module and electronic equipment Download PDFInfo
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- CN113391729A CN113391729A CN202110718102.7A CN202110718102A CN113391729A CN 113391729 A CN113391729 A CN 113391729A CN 202110718102 A CN202110718102 A CN 202110718102A CN 113391729 A CN113391729 A CN 113391729A
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- 239000002245 particle Substances 0.000 claims abstract description 22
- 239000002313 adhesive film Substances 0.000 claims description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003032 molecular docking Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 230000008054 signal transmission Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
- G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
- G06F3/03547—Touch pads, in which fingers can move on a surface
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention relates to a touch module and electronic equipment, wherein the touch module comprises a touch panel and a flexible circuit board, a binding area of the touch module is provided with a first bonding pad and a second bonding pad, the first bonding pad comprises a first sub-bonding pad group and a first grounding bonding pad, and the second bonding pad comprises a second sub-bonding pad group and a second grounding bonding pad; the flexible circuit board comprises a third bonding pad and a fourth bonding pad, the third bonding pad comprises a third bonding pad group and a third grounding bonding pad, and the fourth bonding pad comprises a fourth bonding pad group and a fourth grounding bonding pad; the first grounding pad and the third grounding pad, the second grounding pad and the fourth grounding pad are grounded and aligned, the first sub-pad group and the third sub-pad group, and the second sub-pad group and the fourth sub-pad group are connected to realize signal output and signal reception; conductive particles are arranged between the binding region and the flexible circuit board, and the first grounding bonding pad and the second grounding bonding pad are provided with observation ports for exposing the conductive particles. The touch module can solve the problem that the size of the flexible circuit board is difficult to reduce due to the fact that each bonding pad cannot be directly removed.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a touch module and electronic equipment.
Background
The binding portion between the flexible circuit board and the touch panel generally includes a plurality of signal connection portions, and a mark pad, a dummy pad, a signal output pad, and a signal receiving pad are disposed on the flexible circuit board corresponding to each signal connection portion. When the flexible circuit board is bound with the touch panel, the grounding pad of the touch panel is connected with the marking pad of the flexible circuit board, so that the flexible circuit board and the touch panel are aligned while grounding is realized; other bonding pads of the touch panel are respectively connected with the signal output bonding pad and the signal receiving bonding pad of the flexible circuit board, so that signal transmission is realized; and no pad is arranged at the position of the touch panel corresponding to the dummy pad of the flexible circuit board, so that the condition of the conductive particles can be observed through the pad. The flexible circuit board and the pads of the touch panel are correspondingly arranged according to the electrical connection requirement between the flexible circuit board and the touch panel, and any one of the pads cannot be directly removed, so that the size of the flexible circuit board is difficult to reduce.
Disclosure of Invention
Therefore, it is necessary to provide a touch module and an electronic device for solving the problem that the size of the flexible circuit board is difficult to reduce because the pads on the flexible circuit board and the touch panel cannot be directly removed.
A touch module includes: the touch panel is provided with a binding area, and the binding area is provided with at least one first bonding pad and at least one second bonding pad; the first bonding pad comprises a first sub bonding pad group and first grounding bonding pads which are positioned on two opposite sides of the first sub bonding pad group along a first direction, and the first sub bonding pad group comprises a plurality of first sub bonding pads which are arranged at intervals along the first direction; the second bonding pad comprises a second sub bonding pad group and second grounding bonding pads which are positioned on two opposite sides of the second sub bonding pad group along a first direction, and the second sub bonding pad group comprises a plurality of second sub bonding pads which are arranged at intervals along the first direction; the flexible circuit board comprises a base body and a plurality of connecting bonding pads positioned on one side of the base body, and the connecting bonding pads are correspondingly connected and aligned with the first bonding pads and the second bonding pads one to one; in the direction perpendicular to the touch panel, a conductive adhesive film is arranged between the binding area of the touch panel and the flexible circuit board, the conductive adhesive film comprises conductive particles, and the first grounding pad and the second grounding pad are provided with observation ports capable of exposing the conductive particles.
In one embodiment, the plurality of connection pads includes at least one third pad and at least one fourth pad; the third pad comprises a third sub-pad group and third grounding pads which are positioned on two opposite sides of the third sub-pad group along a first direction, and the third sub-pad group comprises a plurality of third sub-pads which are arranged at intervals along the first direction; the fourth pad comprises a fourth sub-pad group and fourth grounding pads which are positioned on two opposite sides of the fourth sub-pad group along the first direction, and the fourth sub-pad group comprises a plurality of fourth sub-pads which are arranged at intervals along the first direction; the first ground pad is configured to align with the third ground pad, the second ground pad is configured to align with the fourth ground pad, the first sub-pad is configured to connect with the third sub-pad, and the second sub-pad is configured to connect with the fourth sub-pad.
In one embodiment, the first ground pad is provided with a first alignment block protruding to one side of the first ground pad in the first direction, and the third ground pad is provided with a third alignment block protruding to one side of the third ground pad in the first direction; the first alignment block is configured to be aligned with the third alignment block, and the first alignment block is provided with the observation port; the second grounding pad is provided with a second alignment block protruding to one side of the second grounding pad along the first direction, and the fourth grounding pad is provided with a fourth alignment block protruding to one side of the fourth grounding pad along the first direction; the second alignment block is configured to align with the fourth alignment block, and the second alignment block is provided with the observation port.
In one embodiment, the first alignment block is arranged on one side, opposite to the first sub-pad group, of the first ground pad; and/or the second alignment block is arranged on one side of the second grounding pad, which is back to the second sub-pad group; and/or the third alignment block is arranged on one side of the third grounding pad back to the third sub-pad group; and/or the fourth alignment block is arranged on one side of the fourth grounding pad back to the fourth sub-pad group.
In one embodiment, the first alignment block is integrally formed with the first ground pad; and/or the third alignment block and the third grounding pad are integrally formed.
In one embodiment, the viewing port is configured as a through hole through the first alignment block.
In one embodiment, the first alignment block and the second alignment block form a frame at the periphery of the corresponding viewing port, and the width W of the frame satisfies the condition: w is more than or equal to 0.05 mm.
In one embodiment, in the direction in which the touch panel and the flexible circuit board are bound and overlapped, the projection area S of the viewing port satisfies the condition: s is more than or equal to 0.1 square millimeter.
In one embodiment, the viewing port is rectangular, square, or circular in shape.
In one embodiment, the viewing port is configured as a mesh through the first docking block.
An electronic device includes the touch module.
The touch module comprises a touch panel and a flexible circuit board, wherein the touch panel is provided with a binding area, the binding area is provided with at least one first bonding pad and at least one second bonding pad, and a plurality of connecting bonding pads are arranged on a substrate of the flexible circuit board and are respectively connected and aligned with the first bonding pad and the second bonding pad in a one-to-one correspondence manner. The first pads comprise a first sub-pad group and first grounding pads positioned on two opposite sides of the first sub-pad group along the first direction, and the second pads comprise a second sub-pad and second grounding pads positioned on two opposite sides of the second sub-pad group along the first direction. In the direction perpendicular to the touch panel, a conductive adhesive film is arranged between the binding area of the touch panel and the flexible circuit board, and the conductive adhesive film comprises conductive particles.
When the flexible circuit board is bound with the touch panel, the first grounding pad and the second grounding pad are connected with the connecting pad on the flexible circuit board through the conductive particles of the conductive adhesive film, so that the touch panel and the flexible circuit board are electrically connected and grounded, namely, the first sub-pad and the second sub-pad realize the alignment function and the grounding function. And the first grounding pad and the second grounding pad are provided with observation ports, and the condition of the conductive particles can be observed through the observation ports. That is to say, above-mentioned touch module is for traditional touch module, under the prerequisite that does not sacrifice the function of virtual pad, has saved virtual pad, has reduced the quantity of pad to be favorable to reducing the flexible circuit board size, and can reduce cost.
Drawings
Fig. 1 is a schematic structural diagram of a binding state of a flexible circuit board and a touch panel in the prior art;
fig. 2 is a schematic side view of the flexible circuit board and the touch panel in fig. 1 in a binding state;
fig. 3 is a schematic structural diagram of a binding state between a flexible circuit board and a touch panel according to an embodiment of the invention;
fig. 4 is a schematic side view of the flexible circuit board and the touch panel in fig. 3 in a binding state;
FIG. 5 is a schematic structural diagram of a first ground pad according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a first ground pad according to another embodiment of the present invention;
fig. 7 is a schematic structural diagram of a first ground pad in another embodiment of the invention.
The reference numbers illustrate:
100: the touch panel 211: third ground pad
110: first pad 212: third alignment block
111: first ground pad 213: third sub-pad
112: first alignment block 220: fourth bonding pad
113: first sub-pad 221: fourth ground pad
120: second pad 222: fourth alignment block
121: second ground pad 223: fourth sub-pad
122: the second alignment block 300: viewing port
123: second sub-pad 400: conductive particles
200: flexible circuit board 500: dummy pad
210: third bonding pad
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Referring to fig. 1 and 2, fig. 1 illustrates a schematic structural diagram of a state in which a flexible circuit board is bound to a touch panel in the prior art, and fig. 2 illustrates a schematic structural diagram of a side surface of the state in which the flexible circuit board is bound to the touch panel in fig. 1. When the flexible circuit board is bound with the touch panel, signal connection is usually performed through a plurality of bonding pads, the bonding pads comprise sub-bonding pads with a signal output function, a signal receiving function and a grounding function, and the sub-bonding pads on the flexible circuit board and the sub-bonding pads on the touch panel are electrically connected through a conductive adhesive film provided with conductive particles. In addition, the dummy pads 500 are disposed on the flexible circuit board 200, and no pad is disposed on the touch panel 100 at a position corresponding to the dummy pads 500, so as to form an observation area for observing the condition of the conductive particles, so as to determine the electrical connection effect between the flexible circuit board 200 and the touch panel 100. The flexible circuit board and the pads of the touch panel are correspondingly arranged according to the electrical connection requirement between the flexible circuit board and the touch panel, and any one of the pads cannot be directly removed, so that the size of the flexible circuit board is difficult to reduce. Accordingly, it is desirable to provide a touch module to solve the above problems.
Referring to fig. 3 and 4, fig. 3 is a schematic structural diagram illustrating a binding state between a flexible circuit board and a touch panel according to an embodiment of the invention; fig. 4 is a schematic side view illustrating a binding state of the flexible circuit board and the touch panel in fig. 3; the touch module provided by an embodiment of the invention includes a touch panel 100 and a flexible circuit board 200. The touch panel 100 is provided with a bonding area, the bonding area is provided with at least one first bonding pad 110 and at least one second bonding pad 120, the first bonding pad 110 comprises a first sub-bonding pad 113 group and first grounding bonding pads 111 which are positioned on two opposite sides of the first sub-bonding pad 113 group along a first direction, and the first sub-bonding pad 113 group comprises a plurality of first sub-bonding pads 113 which are arranged at intervals along the first direction; the second pad 120 includes a second sub-pad 123 group and second ground pads 121 located on opposite sides of the second sub-pad 123 group along the first direction, and the second sub-pad 123 group includes a plurality of second sub-pads 123 arranged at intervals along the first direction. One of the first sub-pad 113 group and the second sub-pad 123 group is configured to output a signal, and the other is configured to receive a signal, so as to implement signal output and signal reception of the touch module.
The flexible circuit board 200 includes a base and a plurality of connection pads located at one side of the base, and the connection pads are connected and aligned with the first pads 110 and the second pads 120 in a one-to-one correspondence. When the flexible circuit board 200 is bound to the touch panel 100, the first ground pad 111 and the second ground pad 121 are connected to the connection pad on the flexible circuit board 200 through the conductive particles 400 of the conductive adhesive film, so as to electrically connect and ground the touch panel 100 and the flexible circuit board 200, that is, the first sub-pad 113 and the second sub-pad 123 achieve the alignment function and the grounding function. The first and second ground pads 111 and 121 are provided with the observation ports 300, and the condition of the conductive particles 400 can be observed through the observation ports 300. That is to say, compared with the conventional touch module, the touch module omits the dummy pads 500 and reduces the number of the pads on the premise of not sacrificing the functions of the dummy pads 500, thereby being beneficial to reducing the size of the flexible circuit board 200 and reducing the cost.
In some embodiments, the plurality of connection pads includes at least one third pad 210 and at least one fourth pad 220. The third pad 210 includes a third sub-pad 213 group and third ground pads 211 located at two opposite sides of the third sub-pad 213 group along the first direction, and the third sub-pad 213 group includes a plurality of third sub-pads 213 arranged at intervals along the first direction; the fourth pad 220 includes a fourth sub-pad 223 group and fourth ground pads 221 located at opposite sides of the fourth sub-pad 223 group along the first direction, and the fourth sub-pad 223 group includes a plurality of fourth sub-pads 223 arranged at intervals along the first direction.
Wherein the first ground pad 111 is configured to be aligned with the third ground pad 211, the second ground pad 121 is configured to be aligned with the fourth ground pad 221, the first sub-pad 113 is configured to be connected with the third sub-pad 213, and the second sub-pad 123 is configured to be connected with the fourth sub-pad 223; in the direction perpendicular to the touch panel 100, a conductive film is disposed between the bonding area of the touch panel 100 and the flexible circuit board 200, the conductive film includes conductive particles 400, when the flexible circuit board 200 is bonded to the touch panel 100, the first ground pad 111 is aligned with the third ground pad 211, the second ground pad 121 is aligned with the fourth ground pad 221, the first sub-pad 113 is aligned with the third sub-pad 213, the second sub-pad 123 is aligned with the fourth sub-pad 223, the conductive particles 400 of the conductive adhesive film electrically connect and ground the touch panel 100 and the flexible circuit board 200, that is, the first sub-pad 113 is electrically connected to the third sub-pad 213, and the second sub-pad 123 is electrically connected to the fourth sub-pad 223, so as to implement a signal output function and a signal receiving function, and the first ground pad 111 is aligned with the third ground pad 211 and the second ground pad 121 is aligned with the fourth ground pad 221, so as to implement an alignment function and a ground function. The observation ports 300 are provided in the first and second ground pads 111 and 121, and the condition of the conductive particles 400 can be observed through the observation ports 300, thereby observing the condition of the electrical connection between the flexible circuit board 200 and the touch panel 100. That is to say, compared with the conventional touch module, the touch module omits the dummy pads 500 and reduces the number of the pads on the premise of not sacrificing the functions of the dummy pads 500, thereby being beneficial to reducing the size of the flexible circuit board 200 and reducing the cost.
In an embodiment, the bonding area of the touch panel 100 is provided with two first pads 110 and a second pad 120 disposed between the two first pads 110, the first pad 110 outputs a signal, and the second pad 120 receives the signal, so as to realize a middle signal reception and two side signal outputs.
In some embodiments, the first ground pad 111 is provided with a first alignment block 112 protruding to one side of the first ground pad 111 in the first direction, and the third ground pad 211 is provided with a third alignment block 212 protruding to one side of the third ground pad 211 in the first direction; the first alignment block 112 is configured to align with the third alignment block 212, and a viewing port 300 is disposed on the first alignment block 112; the second ground pad 121 is provided with a second alignment block 122 protruding to one side of the second ground pad 121 along the first direction, and the fourth ground pad 221 is provided with a fourth alignment block 222 protruding to one side of the fourth ground pad 221 along the first direction; the second alignment block 122 is configured to align with the fourth alignment block 222, and a viewing port 300 is disposed on the second alignment block 122. The alignment in the binding process is realized by the alignment between the first alignment block 112 and the third alignment block 212 and the alignment between the second alignment block 122 and the fourth alignment block 222, the observation ports 300 are arranged on the first alignment block 112 and the second alignment block 122, and the condition of the conductive particles 400 is observed through the observation ports 300 to judge the binding effect. Moreover, since the observation port 300 is disposed on the first alignment block 112 on the first ground pad 111 side and the second alignment block 122 on the second ground pad 121 side, an effective contact area can be maintained between the first ground pad 111 and the third ground pad 211 and between the second ground pad 121 and the fourth ground pad 221 while the observation port 300 is disposed, so as to ensure an electrical connection effect thereof.
In one embodiment, the first alignment block 112 is disposed on a side of the first ground pad 111 facing away from the first set of sub-pads 113. By arranging the first alignment block 112 at a side of the first ground pad 111 facing away from the group of the first sub-pads 113, a distance between the first ground pad 111 and the first sub-pad 113 and a distance between two adjacent first sub-pads 113 in the first direction can be kept the same to ensure uniformity of pad structures.
In one embodiment, the second alignment block 122 is disposed on a side of the second ground pad 121 opposite to the second sub-pad 123 group. By arranging the second alignment block 122 on the side of the second ground pad 121 facing away from the group of the second sub-pads 123, the distance between the second ground pad 121 and the second sub-pad 123 and the distance between two adjacent second sub-pads 123 in the first direction can be kept the same, so as to ensure the consistency of the pad structure.
In one embodiment, the third alignment block 212 is disposed on a side of the third ground pad 211 opposite to the set of third sub-pads 213. By arranging the third alignment block 212 on the side of the third ground pad 211 opposite to the group of the third sub-pads 213, the distance between the third ground pad 211 and the third sub-pad 213 and the distance between two adjacent third sub-pads 213 in the first direction can be kept the same, so as to ensure the uniformity of the pad structure.
In one embodiment, the fourth alignment block 222 is disposed on a side of the fourth ground pad 221 facing away from the set of fourth sub-pads 223. By disposing the fourth alignment block 222 on the side of the fourth ground pad 221 facing away from the group of the fourth sub-pads 223, the distance between the fourth ground pad 221 and the fourth sub-pad 223 and the distance between two adjacent fourth sub-pads 223 in the first direction can be kept the same, so as to ensure the uniformity of the pad structure.
In some embodiments, the first alignment block 112 is integrally formed with the first ground pad 111. In the pad molding process, the first alignment block 112 is formed on one side of the first ground pad 111 by integral molding, so that the required effect can be achieved by a simpler process. The forming process of the bonding pad refers to the prior art, and is not described herein again.
In some embodiments, the third alignment block 212 is integrally formed with the third ground pad 211. In the pad forming process, the third alignment block 212 is formed on the third ground pad 211 in an integrated manner, so that the required effect can be achieved by a simpler process.
Referring to fig. 5, in some embodiments, the viewing port 300 is configured as a through hole through the first alignment block 112. Specifically, in the forming process of the bonding pad, when the mask is opened, the light blocking material corresponding to the portion where the viewing port 300 needs to be disposed is removed, and the viewing port 300 is obtained by exposure, development, and etching when the bonding pad is manufactured. The forming mode is simple and convenient, and the cost can be saved due to the reduction of the pad materials.
In some embodiments, the first alignment block 112 and the second alignment block 122 form a frame at the periphery of the corresponding viewing port 300, and the width W of the frame satisfies the condition: w is more than or equal to 0.05 mm. By defining the width of the perimeter frame of the viewing port 300 to be greater than or equal to 0.05 mm, it is avoided that the width is too small to break.
In some embodiments, in the direction in which the touch panel 100 and the flexible circuit board 200 are bound and overlapped, the projection area S of the viewing port 300 satisfies the condition: s is more than or equal to 0.1 square millimeter, so that a larger observation range is ensured, observation is more convenient, and the observation result is more accurate. In an embodiment, in the binding and overlapping direction of the touch panel 100 and the flexible circuit board 200, the projection area S of the viewing port 300 is greater than or equal to 0.1 square millimeter, and the number of the cracked conductive particles 400 in the region of the viewing port 300 is greater than or equal to 15, so as to ensure a good viewing effect.
In the above embodiments, the shape of the viewing port 300 is rectangular, square, or circular. By setting the shape of the viewing port 300 to be the shape with the regular edge profile, the conductive particles 400 can be observed conveniently, and inaccurate observation results caused by overlooking the particles due to the complex shape of the edge of the viewing port 300 can be avoided.
Referring to fig. 6, in the above embodiment, the viewing port 300 is constructed to penetrate the meshes of the first docking block 112. Specifically, in the process of forming the bonding pad, when the mask is opened, the portion corresponding to the portion where the viewing port 300 is to be disposed is designed to be a mesh shape, and the viewing port 300 is obtained by exposure, development, and etching when the bonding pad is manufactured. The forming mode is simple and convenient, and the cost can be saved due to the reduction of the pad materials.
In some embodiments, the viewing port 300 is formed by arranging and combining a plurality of sub-ports, the shape of the sub-ports includes one or more of a triangle, a rectangle, a circle, etc., and a plurality of sub-ports with the same shape or a plurality of sub-ports with different shapes form a new shape to form the viewing port 300, for example, two triangle sub-ports form a rectangle or a parallelogram viewing port 300, so that the viewing port 300 has various forms.
Referring to fig. 7, in some embodiments, the viewing port 300 includes a plurality of spaced sub-ports having a shape including one or more of a triangle, a rectangle, a circle, and the like. For example, in a specific embodiment, the shape of the sub-openings is triangular, the number of the sub-openings is two, the two sub-openings are arranged on the first aligning block 112 in a central symmetry manner, and the two sub-openings are arranged, so that the material at the interval between two adjacent sub-openings can play a role of structure enhancement on the first aligning block 112, and at the same time, the observation area of the observation opening 300 can be increased as much as possible.
The invention further provides an electronic device, which comprises the touch module, and the electronic device at least has all the technical effects as the electronic device comprises all the technical characteristics of the touch module, and the description is omitted.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. A touch module, comprising:
the touch panel is provided with a binding area, and the binding area is provided with at least one first bonding pad and at least one second bonding pad; the first bonding pad comprises a first sub bonding pad group and first grounding bonding pads which are positioned on two opposite sides of the first sub bonding pad group along a first direction, and the first sub bonding pad group comprises a plurality of first sub bonding pads which are arranged at intervals along the first direction; the second bonding pad comprises a second sub bonding pad group and second grounding bonding pads which are positioned on two opposite sides of the second sub bonding pad group along a first direction, and the second sub bonding pad group comprises a plurality of second sub bonding pads which are arranged at intervals along the first direction; and
the flexible circuit board comprises a base body and a plurality of connecting bonding pads positioned on one side of the base body, wherein the connecting bonding pads are correspondingly connected and aligned with the first bonding pads and the second bonding pads one to one;
in the direction perpendicular to the touch panel, a conductive adhesive film is arranged between the binding area of the touch panel and the flexible circuit board, the conductive adhesive film comprises conductive particles, and the first grounding pad and the second grounding pad are provided with observation ports capable of exposing the conductive particles.
2. The touch module of claim 1, wherein the plurality of connection pads comprise at least a third pad and at least a fourth pad; the third pad comprises a third sub-pad group and third grounding pads which are positioned on two opposite sides of the third sub-pad group along a first direction, and the third sub-pad group comprises a plurality of third sub-pads which are arranged at intervals along the first direction; the fourth pad comprises a fourth sub-pad group and fourth grounding pads which are positioned on two opposite sides of the fourth sub-pad group along the first direction, and the fourth sub-pad group comprises a plurality of fourth sub-pads which are arranged at intervals along the first direction;
the first ground pad is configured to align with the third ground pad, the second ground pad is configured to align with the fourth ground pad, the first sub-pad is configured to connect with the third sub-pad, and the second sub-pad is configured to connect with the fourth sub-pad.
3. The touch module of claim 2, wherein the first ground pad has a first alignment block protruding toward one side of the first ground pad along the first direction, and the third ground pad has a third alignment block protruding toward one side of the third ground pad along the first direction; the first alignment block is configured to be aligned with the third alignment block, and the first alignment block is provided with the observation port;
the second grounding pad is provided with a second alignment block protruding to one side of the second grounding pad along the first direction, and the fourth grounding pad is provided with a fourth alignment block protruding to one side of the fourth grounding pad along the first direction; the second alignment block is configured to align with the fourth alignment block, and the second alignment block is provided with the observation port.
4. The touch module of claim 3, wherein the first alignment block is disposed on a side of the first ground pad facing away from the first sub-pad set; and/or
The second alignment block is arranged on one side, back to the second sub-bonding pad group, of the second grounding bonding pad; and/or
The third alignment block is arranged on one side, back to the third sub-pad group, of the third grounding pad; and/or
The fourth alignment block is arranged on one side, back to the fourth sub-pad group, of the fourth grounding pad.
5. The touch module of claim 3, wherein the first alignment block is integrally formed with the first ground pad; and/or
The third alignment block and the third grounding pad are integrally formed.
6. The touch module of any of claims 3-5, wherein the view port is configured as a through hole passing through the first alignment block.
7. The touch module of claim 6, wherein the first alignment block and the second alignment block form a frame around the corresponding viewing port, and a width W of the frame satisfies a condition:
w is more than or equal to 0.05 mm.
8. The touch module of claim 6, wherein in a direction in which the touch panel and the flexible circuit board are bonded and overlapped, a projection area S of the viewing port satisfies a condition:
s is more than or equal to 0.1 square millimeter.
9. The touch module of claim 6, wherein the viewing port is rectangular, square or circular.
10. The touch module of any of claims 3-5, wherein the view port is configured as a mesh extending through the first alignment block.
11. An electronic device comprising the touch module according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110718102.7A CN113391729B (en) | 2021-06-28 | 2021-06-28 | Touch module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110718102.7A CN113391729B (en) | 2021-06-28 | 2021-06-28 | Touch module and electronic equipment |
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| CN113391729B CN113391729B (en) | 2022-07-01 |
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| Publication number | Publication date |
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| CN113391729B (en) | 2022-07-01 |
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Effective date of registration: 20240115 Address after: 518109, Building E4, 101, Foxconn Industrial Park, No. 2 East Ring 2nd Road, Fukang Community, Longhua Street, Longhua District, Shenzhen City, Guangdong Province (formerly Building 1, 1st Floor, G2 District), H3, H1, and H7 factories in K2 District, North Shenchao Optoelectronic Technology Park, Minqing Road, Guangdong Province Patentee after: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Patentee after: Interface Technology (Chengdu) Co., Ltd. Patentee after: GENERAL INTERFACE SOLUTION Ltd. Address before: No.689 Hezuo Road, West District, high tech Zone, Chengdu City, Sichuan Province Patentee before: Interface Technology (Chengdu) Co., Ltd. Patentee before: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Patentee before: Yicheng Photoelectric (Wuxi) Co.,Ltd. Patentee before: GENERAL INTERFACE SOLUTION Ltd. |
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