CN113391583A - Sensor simulator with DSI3 interface and interface implementation method - Google Patents

Abstract

The invention provides a sensor simulator with a DSI3 interface and an interface implementation method, wherein the sensor simulator comprises: the micro control unit is in bus communication with the terminal through a bus transceiver; the driving chips are driven by a plurality of DSI3, analog signals output by the micro control unit are communicated with the DIS3 driving chips through a serial port, and data are converted into data in a DS1 bus form and sent out; the power supply detection circuit comprises a terminal and a sensor simulator, wherein when the automatic parking controller of the automobile body drives the ultrasonic sensor to be detected to work, the terminal sends an instruction to the sensor simulator through a bus, the sensor simulator performs data interaction with the automatic parking controller of the automobile body through a multi-channel DSI3 data channel, sends an analog signal to the parking controller of the automobile body and receives state data fed back by the vehicle body, so that a discrete device used for simulating a DSI3 interface in the prior art can be replaced, and a DSI3 interaction interface between the sensor simulator and the automatic parking controller of the automobile body is realized by adopting a sensor driving chip.

Description

Sensor simulator with DSI3 interface and interface implementation method

Technical Field

The invention relates to the technical field of sensor equipment detection, in particular to a sensor simulator with a DSI3 interface and an interface implementation method.

Background

Different automatic parking solutions sense and detect obstacles around the vehicle in different ways. One commonly adopted technical scheme is that ultrasonic sensors are arranged at two ends of a front bumper and a rear bumper of a vehicle in a mode of ultrasonic wave and visual fusion, so that an ultrasonic induction radar ring covering the outline of the vehicle is formed. When parking, the ultrasonic sensor continuously sends signals to the periphery, receives signals returned by surrounding obstacles, and determines the distance between the obstacles according to the time difference between the sent signals and the received signals.

Naturally, the automatic parking technology has high requirements on the stability and consistency of the ultrasonic sensor and the configuration software thereof. The function of the ultrasonic sensor needs to be verified before loading. Due to the fact that a tool capable of replacing a real vehicle to verify the software bug of the ultrasonic radar chip is lacked, the problem that the bug can only adopt a real vehicle test mode is further solved, the actual development process is to verify the running conditions of the sensor and the software under different vehicles, and even a plurality of vehicles are needed to test the reason which possibly causes the bug. Therefore, on the basis of the prior art, the simulation test mode of the vehicle sensor for testing the actual vehicle not only has low test efficiency, but also brings extremely high test cost including the aspects of vehicle purchasing, field and the like.

Due to the rapid development of the application of the ultrasonic sensor, the trend of technical development and innovation inevitably requires that a simulation test mode gradually replaces the real vehicle test, so that the simulation test mode becomes the mainstream of the ultrasonic sensor test. The simulation test mode is that an ultrasonic sensor is configured on a rack structure and is arranged in a simulation environment with real obstacles so as to realize various simulation scenes of real vehicle parking. During actual test, a sensor to be tested is placed in the scene, radar signals generated by an ultrasonic radar of test software are matched through an operation bench and input to the ultrasonic radar simulator in a bus mode, the ultrasonic radar simulator simulates the chip work of a real ultrasonic radar and outputs signals to a video interface of a controller according to a protocol, and therefore the test of the response of the ultrasonic radar to be tested in different parking scenes can be achieved through repeated simulation. Thereby greatly reducing the testing cost and improving the testing efficiency.

Correspondingly, the increase of the technical requirements on the sensor inevitably leads to the increasing requirements on the simulation test of the ultrasonic wave in the laboratory. The early sensor testing tool mostly adopts a mature single-wire system interface (OWI), the analog signal circuit of the interface is complex, the number of external auxiliary equipment is large, and a testing system is complicated and tedious and is not easy to move; due to the adoption of voltage acquisition signals, the operation stability of the voltage acquisition signals is difficult to guarantee, and the communication transmission signal rate is low, so that the voltage acquisition signals can no longer adapt to the development speed of the sensor and the product innovation requirement, and with the advent of a third generation distributed system interface (DSI3), the sensor simulator adopting the DSI3 interface replaces the simulator of an old interface, and becomes a new problem of sensor simulation test.

In the current state of the art, a small number of simulators with DSI3 interface have been provided. However, due to the lack of suitable chip drivers, the essence of the prior art solution for implementing the DSI3 interface is that the simulation of the DSI3 interface is implemented by discrete devices, and the function of enabling the simulator to have the DSI3 interface cannot be really implemented. In view of the above, the prior art should be improved to solve the above technical problems in the ultrasonic sensor test.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a sensor simulator with a DSI3 interface, which can replace a discrete device used for simulating the DSI3 interface in the prior art, adopts a sensor driving chip to realize the DSI3 interaction interface between the sensor simulator and an automatic parking controller of a vehicle body, and provides a realization method for realizing the DSI3 interface interaction between the sensor simulator and the automatic parking controller of the vehicle body.

In order to solve the above technical problems, the present invention adopts a sensor simulator having a DSI3 interface, the sensor simulator communicating with an automatic parking controller of a vehicle body and communicating with a terminal through a bus, the sensor simulator comprising: the micro control unit is connected with the display unit and realizes bus communication with the terminal through the bus transceiver; the DSI3 data channels and the DSI3 data channels correspond to a DSI3 master station of the automatic parking controller of the vehicle body, and each DSI3 data channel is in serial communication with the micro control unit so as to send the converted DSI3 data to the sensor simulator; the power detection circuit is respectively connected with the micro control unit of the sensor simulator and the power supply of the automatic parking controller of the vehicle body, when the automatic parking controller of the vehicle body drives the ultrasonic sensor to be detected to work, the terminal sends an instruction to the sensor simulator through a bus, the sensor simulator performs data interaction with the automatic parking controller of the vehicle body through a plurality of DSI3 data channels and sends an analog signal to the automatic parking controller of the vehicle body, and the automatic parking controller of the vehicle body sends state data to the sensor simulator and finally displays the state data on the display unit.

Preferably, each channel of DSI3 data channel is driven by a sensor driver chip, and each sensor driver chip is in serial communication with the micro control unit through a universal asynchronous transceiver.

Preferably, the power detection circuit includes a boost power chip and a first MOS switch, an output end of the boost power chip is connected to the first MOS switch, the boost power chip is connected in parallel to two adjusting resistors, the boost power chip outputs different voltages through the adjusting resistors, and the first MOS switch is a three-channel single-pole double-throw MOS switch and controls the first MOS switch to switch between different input voltages of the power end of the sensor driving chip.

Still further preferably, a first channel interface of the first MOS switch is connected to the output voltage of the boost power chip, a second channel interface is connected to the working voltage of the sensor simulator, a third channel interface is grounded, and the micro control unit configures a plurality of logic pins of the first MOS switch, wherein the plurality of logic pins of the first MOS switch are respectively configured to correspond to an overvoltage, a short circuit, and a short power supply, so that when the first MOS switch is placed in a corresponding gear, switching of the sensor driving chip between overvoltage, short power supply, and short circuit test conditions is achieved.

Still further preferably, the sensor driver chip further comprises a second MOS switch, the second MOS switch is connected to the signal terminal of the sensor driver chip, and the micro control unit configures a plurality of logic pins of the second MOS switch, wherein the plurality of logic pins of the second MOS switch are respectively corresponding to the open circuit, the short circuit, and the short power supply, so that when the second MOS switch is placed in a corresponding gear, the signal terminal of the sensor driver chip is switched among the test conditions of the open circuit, the short circuit, and the short power supply.

Still further preferably, the first MOS switch is an ADG5433 three-channel switch.

Accordingly, another aspect of the present invention provides a method for implementing a DSI3 interface of a sensor simulator, the method being applied to the sensor simulator prepared according to the foregoing, the method comprising the following steps: step S1 of configuring a plurality of DSI3 data channels on the sensor simulator and a DSI3 master station on the automatic parking controller of the automobile body; and S2, configuring multiple DSI3 data channels to realize serial communication with a micro control unit of the sensor simulator.

Preferably, the step of configuring the multiple DSI3 data channels on the sensor simulator and the DSI3 master station on the automatic parking controller comprises: step S11 of configuring a sensor driving chip, wherein the sensor driving chip is used as an analog signal coding chip to realize current collection and analysis; and step S12 of configuring the sensor driving chip to communicate through a universal asynchronous receiver-transmitter and realize DSI3 bus signal simulation at an interaction interface of the sensor simulator.

Further preferably, the method further comprises a step S3 of configuring a power detection circuit of the sensor simulator, and is connected with a sensor to be tested.

Still further preferably, the step S3 of configuring the power detection circuit of the driver chip includes the steps of: step S31, configuring a boost power supply chip, configuring at least one adjusting resistor connected with the boost power supply chip, and enabling the boost power supply chip to output high voltage through the adjusting resistor; step S32 of configuring a power detection circuit including the boost power chip and a first MOS switch connected to an output terminal of the boost power chip, switching different test conditions of power supply terminals of the sensor driving chip; and step S33, configuring a second MOS switch connected to the signal terminal of the sensor driver chip, and controlling the second MOS switch to be placed in a corresponding shift position, so that the sensor driver chip is switched between different test conditions.

Compared with the prior art, the invention has the following beneficial technical effects due to the adoption of the technical scheme:

1. although the technical purpose of analog detection can be achieved to a certain extent by adopting a discrete device to simulate the interface, the sensor simulator has a DSI3 interface only by simulating the DSI3 interface, but not really, so that the transmission rate of communication transmission signals cannot reach the level of DSI 3. The technical bottleneck that the prior art can only adopt a discrete device simulation interface is that a proper driving mode is lacked, so that the sensor simulator is converted from unstable voltage signal acquisition into stable and efficient current acquisition, in the invention, two ELMOS E524 chips are adopted to match with a universal asynchronous transceiver and a micro control unit to form serial communication, thus realizing a plurality of DSI3 data channels on the sensor simulator, establishing correspondence between the sensor simulator and an automatic parking controller of a vehicle body, namely realizing the interaction of a DSI3 interface between the sensor simulator and the automatic parking controller of the vehicle body, and simplifying the wiring complexity of a test system circuit;

2. corresponding to the implementation of the DSI3 interface, there is a need for an improvement in the way external functions are implemented in the existing test environment. In order to meet different voltage tests in the prior art, a plurality of auxiliary devices are required to be connected externally, switching of working voltages is realized by converting different devices, and the test mode of external power supply directly results in low overall integration degree of the test device, large size and difficulty in moving. An easily-conceived idea is to improve an external power supply mode into an internal power supply mode, and to realize switching of different working voltages in the device through an effective technical means, so that the device integration level is greatly improved, and the device volume is reduced, so that the technical effects are realized through the following two aspects:

1) the boost power supply chip is configured with a three-channel switch and connected to form a voltage detection circuit, the boost power supply chip is connected with two adjustable resistors in parallel, the output voltage of the boost power supply chip can be adjusted through the adjustable resistors, and three channel voltage interfaces of the three-channel switch respectively correspond to the output voltage of the boost power supply chip, the working voltage of the sensor simulator and the grounding, so that the three-channel switch is controlled to be arranged in different gears, and the switching of different input voltages of the power supply end of the sensor driving chip is realized;

2) in order to meet the other aspect of different test condition requirements, a three-channel switch is configured and is adapted to internal power supply, and is connected with a signal end of the sensor driving chip, and a logic pin of the switch is configured through the micro control unit, so that different gears of the switch are respectively adapted to different test conditions, and thus the three-channel switch is controlled to be arranged in different gears, namely the signal end of the sensor driving chip is switched among open circuit, short circuit and short power supply conditions;

3. the ultrasonic sensor simulator for realizing the DSI3 interface has the significance that echo simulation can be realized, namely multi-channel transmission of ultrasonic waves is realized, each channel can simulate a plurality of obstacles, and direct echo distance and indirect echo distance can be simulated by setting echo distance; in the obstacle state simulation, sensor faults including short circuit to a power supply, short circuit to the ground, open circuit, excessive long and short aftershock and the like are realized, and power supply obstacles such as excessive high and excessive low and short circuit of a power supply are realized; moreover, a bus protocol mode is adopted to respond to the simulation process, so that the requirements of real-time performance and synchronism of simulation test are met;

4. the three-channel switch adopts an ADG5433 three-channel single-pole double-throw MOS switch, and because an insulating oxide layer is arranged between the NDMOS and the PDMOS transistor, unlike the junction isolation switch, no parasitic junction exists between the transistors of the three-channel single-pole double-throw MOS switch, thereby obviously improving the latch-up phenomenon of the switch;

5. the sensor simulator prepared based on the DSI3 interface implementation method can relieve the limitation of the existing test on equipment, sites and the like, directly simulate various test faults of the ultrasonic sensor in a laboratory, and can efficiently analyze the position and the reason of the fault while quickly responding to the fault.

Drawings

FIG. 1 is a flow chart illustrating a method for implementing a sensor simulator DSI3 interface according to a preferred embodiment of the present invention;

FIG. 2 is a flow chart illustrating the process of configuring multiple DSI3 data channels on the sensor simulator of FIG. 1;

FIG. 3 is a circuit configuration diagram showing an equivalent circuit configuration of a sensor driving chip in the preferred embodiment;

FIG. 4 is a flow chart showing the flow of the power detection circuit of the driver chip according to the preferred embodiment of the present invention;

FIG. 5 is a circuit configuration diagram showing an equivalent circuit configuration of the power detection circuit in the preferred embodiment;

FIG. 6 is a schematic diagram showing the logic circuit structure of the ADG5433 switch;

FIG. 7 is a circuit configuration diagram showing an equivalent circuit configuration of the test condition changeover switch in the preferred embodiment;

FIG. 8 is a block diagram illustrating the structure of a sensor with a DSI3 interface according to another preferred embodiment of the present invention;

fig. 9 is a frame diagram illustrating a connection structure of the sensor having the DSI3 interface shown in fig. 8 with the automatic parking controller for a vehicle body.

Detailed Description

An embodiment of a sensor simulator having a DSI3 interface and an interface implementation method according to the present invention will be described with reference to the accompanying drawings. Those of ordinary skill in the art will recognize that the described embodiments can be modified in various different ways, without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are illustrative in nature and not intended to limit the scope of the claims. Furthermore, in the present description, the drawings are not to scale and like reference numerals refer to like parts.

It should be noted that, in the embodiments of the present invention, the expressions "first" and "second" are used to distinguish two entities with the same name but different names or different parameters, and it is understood that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and the descriptions thereof in the following embodiments are omitted.

The preferred embodiment of the present invention is proposed to solve the following technical problems of the prior art:

1) the sensor simulator cannot really realize DSI3 interface bus interaction with an automatic parking controller of a vehicle body;

2) in order to meet the test requirements of the sensor simulator under different working voltages, the conventional mode cannot be separated from an external power supply mode, so that the circuit wiring is too large, the external equipment is complex, the conventional simulation test cannot be completely separated from a real obstacle in the test completion process, the demand for a test space is large, and the whole test system is difficult to move in a test environment.

Therefore, to solve the first technical problem, a first aspect of the preferred embodiment of the present invention is to implement DSI3 interface communication between the sensor simulator and the automatic parking controller. Fig. 1 is a flow chart illustrating a method for implementing a DSI3 interface of a sensor simulator according to a preferred embodiment of the present invention. Referring to fig. 1, in the preferred embodiment, the method for implementing the sensor simulator DSI3 interface includes the following steps:

s1, configuring a multi-channel DSI3 data channel on the sensor simulator and a DSI3 master station on the automatic parking controller of the vehicle body;

and S2, configuring multiple DSI3 data channels to realize serial port communication with a micro control unit of the sensor simulator.

FIG. 2 is a flow chart illustrating the process of configuring multiple DSI3 data channels on the sensor simulator of FIG. 1. Specifically, in step S1, it is essential to implement mapping of the multiple DSI3 data channels with the channels within the DSI3 master station on the vehicle body automatic parking controller, that is, to implement DSI3 communication between the sensor simulator and the vehicle body automatic parking controller. In the invention, twelve sensor driving chips are adopted to realize 12 paths of DSI3 interface channels. In the preferred embodiment, the sensor driver chips are elimos E524.17 chips, and each driver chip is connected to the micro control unit of the sensor simulator through a universal asynchronous receiver transmitter (Uart), respectively, so as to implement serial communication between the sensor driver chips and the Micro Control Unit (MCU) of the sensor simulator. Fig. 3 is a circuit configuration diagram showing an equivalent circuit configuration of the sensor driving chip in the preferred embodiment. As shown in FIG. 3, the VSUP pin of the E524 chip is connected to the US pin of its P1 interface, the DSI _ O pin is connected to the P2 interface, and the DSI pin is connected to the DIS pin of the P1 interface. It can be seen that in the preferred embodiment, the sensor driving chip is used as an emulator coding chip, so as to replace the existing voltage acquisition signal, and then change to the current acquisition signal.

On the basis of realizing the interaction of the DSI3 interface, the second aspect of the prior art problem needs to be solved, namely, internal power supply is configured. Fig. 4 is a flow chart showing a flow of configuring the power detection circuit of the driver chip in the preferred embodiment of the present invention. Referring to fig. 4, the process of configuring the sensor driver chip power detection circuit includes the following steps:

s31, configuring a boosting power supply chip, configuring at least one adjusting resistor connected with the boosting power supply chip, and enabling the boosting power supply chip to output high voltage through the adjusting resistor;

s32, configuring a power supply detection circuit comprising the boost power supply chip and a first MOS switch connected with the output end of the boost power supply chip, and switching different test conditions of the power supply end of the sensor driving chip;

and S33, configuring a second MOS switch connected with the signal end of the sensor driving chip, and controlling the second MOS switch to be placed in a corresponding gear so as to switch the signal end of the sensor driving chip among different test conditions.

Specifically, referring to fig. 5, fig. 5 is a circuit structure diagram illustrating an equivalent circuit structure of the power detection circuit in the preferred embodiment, wherein U202 is a boost power chip, and the boost power chip needs to be configured with an adjustable resistance value to adjust the output voltage of the boost power chip in addition to the normal operating voltage, that is, referring to fig. 5, R215 and R217 are connected to the FB pin of U202 after being connected in parallel, so as to achieve the purpose of voltage adjustment by adjusting the resistance values of R215 and R217. For example, in the preferred embodiment, the third-gear output voltage of the boost power supply chip is configured to be 18V high voltage, 12V low voltage and ground voltage.

Then, a change-over switch is needed to be configured to realize the switching of the boost power supply chip between different output voltages. With continued reference to fig. 5, U201 is a three-channel switch that meets the requirements, and in the preferred embodiment, an ADG5433 three-channel single-pole double-throw MOS switch is used as the switcher, and because an insulating oxide layer is disposed between the NDMOS and PDMOS transistors, there is no parasitic junction between the transistors of the three-channel single-pole double-throw MOS switch, unlike the junction-isolated switch, thereby significantly improving the latch-up of the switch. Next, referring to fig. 6, fig. 6 is a schematic diagram showing a logic circuit structure of the ADG5433 switch, IN which an S1A pin of the ADG5433 switch is connected to an output voltage (18V) of the boost power supply chip as a first channel interface, an S2A pin is connected to a working voltage (12V) of the sensor simulator as a second channel interface, an S3A pin is grounded as a third channel voltage interface, and an EN input pin, an IN1 pin, an IN2 pin, and an IN3 pin of the ADG5433 switch are configured, for example, configured as:

1) when IN1 is set to 1, the D1 switch is turned to S1A, the other two paths are IN SxB gear, and at the moment, the normal output voltage of the equipment is pulled to 18V;

2) when IN2 is set to 1, the D2 switch is turned to S2A, the other two paths are IN the SxB gear, and at the moment, the normal output voltage of the equipment is pulled to 12V;

3) when IN3 is set to 1, the D3 switch is turned to S3A, and the other two paths are IN gear SxB, at which time the normal output voltage of the device is pulled to ground.

According to the above example configuration, the logic level of the chip pin is controlled by a micro control unit (for example, a single chip), that is, the switching of the input voltage of the boost power supply chip is realized inside the device. The significance of switching the output voltage of the boost power supply chip inside is that when the power supply of the equipment is diagnosed, a large number of external power supply equipment and overstaffed connecting wires between the external power supply equipment and the external power supply equipment can be saved, and the power supply detection and the state diagnosis of the equipment and the power supply of the equipment can be completed inside the equipment.

In yet another aspect of the present invention, a three-channel switch is also configured on the sensor driving chip to provide different testing conditions, such as open circuit, short circuit, and short power, for the signal terminal of the sensor driving chip. Referring to fig. 7, fig. 7 is a circuit configuration diagram showing an equivalent circuit configuration of the test condition switching switch in the preferred embodiment. IN the preferred embodiment, the testing condition switch also adopts an ADG5433 three-channel single-pole double-throw MOS switch, the EN pin of which corresponds to DLAG _ F _4, the IN1 pin of which corresponds to OV _ F _4 (OPEN circuit), the IN2 pin of which corresponds to SHORT _ F _4 (SHORT circuit), and the IN3 pin of which corresponds to OPEN circuit, and the micro control unit configures the testing condition switch according to a similar configuration method of the three-channel switch of the boost power chip, so that when the testing condition switch is placed IN different gears, the signal terminal of the sensor driving chip is switched among OPEN circuit, SHORT circuit, and SHORT power supply conditions. The significance of realizing the switching of the test conditions of the sensor driving chip inside is also to meet the requirements of the device in condition diagnosis, a large number of external power supply devices and overstaffed connecting wires between the external power supply devices can be saved, and the state switching can be finished inside the device so as to diagnose the fault state of the sensor driving chip.

In another aspect of the preferred embodiment of the present invention, a sensor simulator having a DSI3 interface is prepared according to the above-mentioned method for implementing a DSI3 interface, and the sensor simulator can implement DSI3 data communication with an automatic parking controller of a vehicle body during simulation test of a sensor. Fig. 8 is a block diagram illustrating a structure of a sensor having a DSI3 interface according to still another preferred embodiment of the present invention. Referring to fig. 8, the sensor simulator having a DSI3 interface according to the preferred embodiment of the present invention includes a micro control unit 100 as a processor, twelve sensor driver chips 200, each of which implements 1-way DSI3 data channel, and each of the sensor driver chips 200 implements serial communication with the micro control unit 100 via a universal asynchronous receiver transmitter (Uart). The mcu 100 is powered by a power management module 300, and is connected to an external display device to output and display the processing result on the display device, and the mcu 100 communicates with a processing terminal 400, such as a PC or a mobile terminal, through a bus transceiver. A power detection circuit 500 is further included, one end of the power detection circuit 500 is connected to the micro control unit 100, and the other end thereof is connected to a power supply of the automatic parking controller for the vehicle body, so that the output voltage of the sensor simulator is switched during power detection.

Fig. 9 is a frame diagram illustrating a connection structure of the sensor having the DSI3 interface shown in fig. 8 with the automatic parking controller for a vehicle body. According to the DSI3 interface implementation method, 12 paths of DSI3 data channels are implemented by using two ELMOS E524 chips as sensor driving chips, and an interactive interface is formed with the 12 paths of data channels in the DSI3 master station of the automatic parking controller 600.

In actual testing, the sensor simulator is powered on by the 12V power supply of the power management module 300, so that the sensor simulator is started. The external processing terminal 400 sends an instruction to the sensor simulator through the bus in a CAN bus communication mode, and the sensor simulator performs data interaction with the automatic vehicle parking controller 600 through the 12-channel DSI3 data channel after receiving the instruction sent by the processing terminal 400. The automatic parking controller 600 drives the ultrasonic sensor, and the state of the driven ultrasonic sensor is also fed back to the sensor simulator through the 12-way DSI3 data channel interactive interface, and the sensor simulator displays the data fed back by the automatic parking controller 600 through the sensor simulator or an external display device.

The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A sensor simulator having a DSI3 interface, the sensor simulator communicating with an automatic parking controller of a vehicle body and communicating with a terminal through a bus, the sensor simulator comprising:

the micro control unit is connected with the display unit and realizes bus communication with the terminal through the bus transceiver;

the DSI3 data channels and the DSI3 data channels correspond to a DSI3 master station of the automatic parking controller of the vehicle body, and each DSI3 data channel is in serial communication with the micro control unit so as to send the converted DSI3 data to the sensor simulator;

a power detection circuit respectively connected with the micro control unit of the sensor simulator and the power supply of the automatic parking controller of the vehicle body,

when the automatic parking controller of the vehicle body drives the ultrasonic sensor to be detected to work, the terminal sends an instruction to the sensor simulator through the bus, the sensor simulator performs data interaction with the automatic parking controller of the vehicle body through a plurality of DSI3 data channels and sends an analog signal to the automatic parking controller of the vehicle body, and the automatic parking controller of the vehicle body sends state data to the sensor simulator and finally displays the state data on the display unit.

2. The sensor simulator with the DSI3 interface of claim 1, wherein each DSI3 data channel is driven by a sensor driver chip, and each sensor driver chip is in serial communication with the micro control unit through a universal asynchronous receiver transmitter.

3. The sensor simulator with DSI3 interface of claim 2, wherein the power detection circuit comprises a boost power chip and a first MOS switch, the boost power chip output is connected with the first MOS switch, wherein,

the boost power supply chip is connected with two regulating resistors in parallel, the boost power supply chip outputs different voltages through the regulating resistors, the first MOS switch is a three-channel single-pole double-throw MOS switch, and the first MOS switch is controlled to realize the switching of different input voltages of the power end of the sensor driving chip.

4. The sensor simulator with DSI3 interface of claim 3, wherein a first channel interface of the first MOS switch is connected to the output voltage of the boost power supply chip, a second channel interface is connected to the working voltage of the sensor simulator, a third channel interface is connected to ground, the micro control unit configures a plurality of logic pins of the first MOS switch, wherein,

and respectively configuring a plurality of logic pins of the first MOS switch into corresponding overvoltage, short circuit and short power supply so as to realize the switching of the sensor driving chip among overvoltage, short power supply and short circuit test conditions when the first MOS switch is placed into a corresponding gear.

5. The sensor simulator with DSI3 interface of claim 3, further comprising a second MOS switch connected with the sensor driving chip signal terminal, the micro control unit configuring a plurality of logic pins of the second MOS switch, wherein,

and respectively corresponding a plurality of logic pins of the second MOS switch to an open circuit, a short circuit and a short power supply, so that when the second MOS switch is placed into a corresponding gear, the signal end of the sensor driving chip is switched among open circuit, short circuit and short power supply testing conditions.

6. The sensor simulator with the DSI3 interface of any one of claims 3 to 5, wherein the first MOS switch is an ADG5433 three-channel switch.

7. A method of implementing a DSI3 interface for a sensor simulator, the method being applied to a sensor simulator made according to any one of claims 1 to 6, the method comprising the steps of:

step S1 of configuring a plurality of DSI3 data channels on the sensor simulator and a DSI3 master station on the automatic parking controller of the automobile body;

and S2, configuring multiple DSI3 data channels to realize serial communication with a micro control unit of the sensor simulator.

8. The method for implementing the sensor simulator DSI3 interface of claim 7, wherein the step of configuring the multiple DSI3 data channels on the sensor simulator and the DSI3 master station on the automatic parking controller comprises:

step S11 of configuring a sensor driving chip, wherein the sensor driving chip is used as an analog signal coding chip to realize current collection and analysis;

and step S12 of configuring the sensor driving chip to communicate through a universal asynchronous receiver-transmitter and realize DSI3 bus signal simulation at an interaction interface of the sensor simulator.

9. The method for implementing the DSI3 interface of the sensor simulator of claim 8, further comprising a step S3 of configuring a power detection circuit of the sensor simulator and connecting the sensor simulator with a sensor to be tested.

10. The method for implementing the DSI3 interface of the sensor simulator of claim 9, wherein the step S3 of configuring the power detection circuit of the driver chip comprises the steps of:

step S31, configuring a boost power supply chip, configuring at least one adjusting resistor connected with the boost power supply chip, and enabling the boost power supply chip to output high voltage through the adjusting resistor;

step S32 of configuring a power detection circuit including the boost power chip and a first MOS switch connected to an output terminal of the boost power chip, switching different test conditions of power supply terminals of the sensor driving chip;

and step S33, configuring a second MOS switch connected to the signal terminal of the sensor driver chip, and controlling the second MOS switch to be placed in a corresponding shift position, so that the signal terminal of the sensor driver chip is switched between different test conditions.

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