CN113382145A

CN113382145A - Camera module and electronic equipment

Info

Publication number: CN113382145A
Application number: CN202110646383.XA
Authority: CN
Inventors: 丁文超
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-06-10
Filing date: 2021-06-10
Publication date: 2021-09-10

Abstract

The application discloses a camera module and electronic equipment, wherein the camera module comprises a shell, a lens, a chip assembly, a driving assembly and a flexible circuit board, the lens is arranged at the first end of the shell, the flexible circuit board is arranged at the second end of the shell, a guide rod is arranged in the shell, the chip assembly is positioned in the shell and is in sliding connection with the guide rod, and the chip assembly is electrically connected with the flexible circuit board; the first end and the second end are opposite ends of the shell, the driving component is connected with the chip component, and the driving component can drive the chip component to move relative to the lens along the guide rod. Thus, the power consumption required by the automatic focusing function of the camera module can be reduced.

Description

Camera module and electronic equipment

Technical Field

The application belongs to the technical field of electronic products, and particularly relates to a camera module and electronic equipment.

Background

With the increasing demand of the market for the shooting function, the auto-focusing function of the camera module, which is one of the most common functions in shooting, has become a necessary function of the camera module.

At present, the auto-focusing function of a camera module is generally achieved by driving a lens carrier to drive a lens fixed to the lens carrier to move through a driving motor, so as to change the relative position of the lens and a chip, and further achieve the auto-focusing function of the camera module. However, the mass of the lens is large, so that the power consumption required for driving the lens to move in the process of realizing automatic focusing is also large.

Therefore, in the related art, the problem of large power consumption exists in the realization of the focusing function of the camera module.

Disclosure of Invention

The application aims at providing a camera module and electronic equipment, and the problem that in the related art, the power consumption is large in the realization of the focusing function of the camera module is solved.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a camera module, which includes a housing, a lens, a chip assembly, a driving assembly, and a flexible circuit board, wherein the lens is disposed at a first end of the housing, the flexible circuit board is disposed at a second end of the housing, a guide rod is disposed in the housing, the chip assembly is located in the housing and slidably connected to the guide rod, and the chip assembly is electrically connected to the flexible circuit board;

the first end and the second end are opposite ends of the shell, the driving component is connected with the chip component, and the driving component can drive the chip component to move relative to the lens along the guide rod.

In a second aspect, an embodiment of the present application provides an electronic device, including the camera module of the first aspect.

In the embodiment of the application, because the weight of the chip assembly is far less than that of the lens, the chip assembly is driven by the driving assembly to move relative to the lens, and compared with the mode that the lens is directly driven to move, the automatic focusing function of the camera module is realized, and the power consumption required by the automatic focusing function of the camera module can be effectively reduced.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is an exploded schematic view of a camera module according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a camera module provided in the embodiment of the present application;

FIG. 3 is a schematic structural diagram of a housing provided in an embodiment of the present application;

FIG. 4 is a schematic structural diagram of a chip assembly provided in an embodiment of the present application;

FIG. 5 is a second schematic structural diagram of a chip assembly according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a flexible circuit board provided in an embodiment of the present application.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

As shown in fig. 1 to 6, an embodiment of the present application provides a camera module, which includes a housing 10, a lens 20, a chip assembly 30, a driving assembly, and a flexible circuit board 40, wherein the lens 20 is disposed at a first end of the housing 10, the flexible circuit board 40 is disposed at a second end of the housing 10, a guide rod 11 is disposed in the housing 10, the chip assembly 30 is disposed in the housing 10 and slidably connected to the guide rod 11, and the chip assembly 30 is electrically connected to the flexible circuit board 40;

wherein, the first end and the second end are two opposite ends of the housing 10, the driving component is connected to the chip component 30, and the driving component can drive the chip component 30 to move along the guide rod 11 relative to the lens 20.

In this embodiment, since the weight of the chip assembly 30 is much smaller than the weight of the lens 20, the driving assembly drives the chip assembly 30 to move along the guide rod 11 relative to the lens 20, and compared with directly driving the lens 20 to move, the automatic focusing function of the camera module is realized, which not only effectively reduces the power consumption required by the automatic focusing function of the camera module, but also improves the stability of the movement of the chip assembly 30 in the housing 10.

Moreover, through setting up guide bar 11, can avoid setting up shell fragment and lower shell fragment to further reduce the required consumption of removal of chip subassembly 30, still be favorable to reducing the temperature of the module of making a video recording.

Optionally, the driving assembly includes a carrier 51, a magnetic conduction member 52 and a coil 53, one of the magnetic conduction member 52 and the coil 53 is disposed on the inner side wall of the casing 10, and the other of the magnetic conduction member 52 and the coil 53 is disposed on the carrier 51;

the chip assembly 30 is disposed on the carrier 51, and when the coil 53 is energized, the carrier 51 is driven to move by the electromagnetic induction force generated between the magnetic conduction member 52 and the coil 53, and the carrier 51 drives the chip assembly 30 to move along the guide rod 11 relative to the lens.

In this embodiment, the chip assembly 30 is moved by electromagnetic driving, so that the installation space required for the driving assembly in the housing can be effectively reduced.

In one embodiment, the magnetic conductive member 52 is disposed on the inner sidewall of the casing 10, and the coil 53 is disposed on the carrier 51. Specifically, the magnetic conducting members 52 may be fixed on the inner side wall of the casing 10 in an adhering or clamping manner, and in order to improve the moving stability of the chip assembly 30, a plurality of magnetic conducting members 52 may be disposed, and the plurality of magnetic conducting members 52 are uniformly distributed along the inner side wall of the casing 10 and are disposed around the coil 53.

For example, when the coil 53 is energized with a current in a first direction, the electromagnetic induction force generated between the magnetic conduction member 52 and the coil 53 can drive the carrier 51 to move and drive the chip assembly 30 to move toward the lens 20, so as to shorten the distance between the chip assembly 30 and the lens 20; under the condition that the coil 53 is electrified with current in the second direction, the electromagnetic induction force generated between the magnetic conduction piece 52 and the coil 53 can drive the carrier 51 to move, and drive the chip assembly 30 to move towards the direction away from the lens 20, so that the distance between the chip assembly 30 and the lens 20 is increased, and the automatic focusing function of the camera module is further realized.

As shown in fig. 3, the casing 10 may be a square casing, the number of the magnetic conducting members 52 is four, and the four magnetic conducting members 52 may be respectively disposed at four corners of the casing 10, and the shape of the magnetic conducting members 52 is adapted to the corner structure of the casing 10, so as to reduce the installation space required by the magnetic conducting members 52.

In an example, the second end of the casing 10 is an open slot structure, the chip assembly 30 is movably disposed in the open slot structure, the flexible circuit board 40 is disposed at an opening of the open slot structure, and the chip assembly 30 and the flexible circuit board 40 are always stably electrically connected in a moving process of the chip assembly 30 in the open slot structure, so as to achieve an auto-focusing function or a shooting function of the camera module; the first end of the casing 10 is provided with a first through hole, which is communicated with the open slot structure, so that light rays incident through the lens 20 can be emitted to the chip assembly 30 through the first through hole on the casing 10.

Alternatively, as shown in fig. 5, the chip assembly 30 includes an optical sensing chip 31 and a chip substrate 32, the optical sensing chip 31 is disposed on the chip substrate 32, and the chip substrate 32 is fixedly disposed on the carrier 51;

after passing through the lens 20, the external light is emitted to the optical sensor chip 31 through the first through hole of the housing 10.

In this embodiment, the first through hole is a through hole provided at the first end of the housing 10 and is used for communicating the optical path between the lens 20 and the optical sensing chip 31, so that the optical sensing chip 31 senses light entering through the lens 20 and realizes an image capturing function of the camera module.

Wherein the outer side wall of the carrier 51 is provided with an inwardly recessed annular groove in which the coil 53 can be wound to reduce the installation space required for the coil 53.

Furthermore, a certain magnetic air gap is provided between the coil 53 and the magnetic conducting member 52 to ensure the moving space of the carrier 51 in the housing 10.

In one example, the chip substrate 32 has an inner cavity 321, and the optical sensor chip 31 can be fixed in the inner cavity 321 by bonding or clipping. As shown in fig. 6, the chip substrate 32 is polygonal, and no rigid-flex board is disposed on each of the four opposite corners, so as to reduce the installation space required by the chip assembly 30 in the housing 10 and meet the trend of miniaturization of the camera module.

Optionally, the magnetic conductive member 52 includes a driving magnetic conductive member and a hall magnetic conductive member, and the camera module further includes a hall sensing chip 60;

wherein, the electromagnetic induction force generated between the driving magnetic conduction member and the coil 53 drives the carrier 51 to move, and drives the chip assembly 30 to move relative to the lens 20; the hall magnetizer is used for providing a magnetic field required by the hall sensing chip 60, and the hall sensing chip 60 is used for detecting the position of the chip assembly 30 in the casing 10.

In this embodiment, through setting up hall magnetic conduction spare and hall response chip 60 to realize the position detection of chip subassembly 30 in casing 10 through hall response chip 60, and then promote the accuracy of the displacement distance of chip subassembly 30, and promote the degree of accuracy of the auto focus function of the module of making a video recording.

The hall sensing chip 60 can be embedded in the carrier 51, so that the hall sensing chip 60 is not separately disposed in the inner space of the housing 10, and the installation space required by the hall sensing chip 60 is reduced. Moreover, under the condition that the number of the drive magnetic conduction pieces is multiple, the Hall magnetic conduction pieces can be integrally arranged with one of the drive magnetic conduction pieces, so that the installation space required by the Hall magnetic conduction pieces is reduced.

Optionally, the carrier 51 is provided with a second through hole 511 adapted to the guide rod 11, the carrier 51 is sleeved on the guide rod 11 through the second through hole 511, and the carrier 51 is slidably connected with the guide rod 11.

In this embodiment, by providing the guide rod 11, the moving stability of the carrier 51 in the housing 10 can be improved, and further, the moving stability of the optical sensing chip 31 in the housing 10 can be improved.

In an example, the number of the guide rods 11 is at least two, and by providing at least two guide rods 11, the carrier 51 can be prevented from deflecting during the movement, so as to further improve the smoothness of the movement of the carrier 51 in the housing 10. For example, four guide rods 11 may be provided, and each guide rod 11 may be provided corresponding to one of the magnetic conduction members 52, that is, by providing the guide rods 11 in the region with the strongest magnetic force, the smoothness of the movement of the carrier 51 in the housing 10 is improved.

In addition, the chip substrate 32 may be provided with a guide through hole adapted to the guide bar 11, and the guide bar 11, the second through hole 511, and the guide through hole may be coaxially provided.

Optionally, the camera module further includes an optical filter 70, the carrier 51 is provided with a third through hole 512, the optical filter 70 is disposed on the carrier 51, and the optical filter 70 is located between the lens 20 and the optical sensing chip 31;

the light passing through the filter 70 is emitted to the optical sensing chip 31 through the third through hole 512.

In this embodiment, the optical filter 70 is disposed on the carrier 51, that is, the optical filter 70 and the optical sensing chip 31 are integrally disposed, so that the overall height of the camera module can be reduced, and the reliability of the optical filter 70 can be improved.

In one example, the optical filter 70 may be injection molded inside the carrier 51 by an integral injection molding process to improve the integrity of the optical filter 70 and the carrier 51.

Optionally, the flexible circuit board 40 includes a chip connection portion 41, the optical sensor chip 31 is electrically connected to the flexible circuit board 40 through a chip connection portion 42, and the chip connection portion 42 can move relative to the lens 20 following the optical sensor chip 31.

In this embodiment, the flexible circuit board 40 further includes a circuit board substrate 42, and the chip connection portion 42 may be disposed on the circuit board substrate 42 through a connection feeding belt 43, so that the optical sensing chip 31 may be stably electrically connected to the flexible circuit board 40 when the chip connection portion 42 moves along with the optical sensing chip 31.

The flexible circuit board 40 can provide power for the whole camera module, and the circuit board substrate 42 can be attached to the opening of the open slot structure of the casing 10, and plays a role of closing the camera module.

Moreover, the capacitor 80 required by the chip filtering of the camera module in the present application can also be disposed on the flexible circuit board 40 to reduce the height of the camera module.

In one example, the capacitors 80 can be disposed at four opposite corners of the camera module to reduce the weight of the camera module and simplify the electronic structure design of the camera module.

Optionally, an end of the carrier 51 facing the lens 20 is provided with an elastic stopper 513.

In this embodiment, the elastic stopper 513 is provided to prevent the carrier 51 from directly colliding with the housing 10, so as to protect the optical sensor chip 31 provided on the carrier 51.

The embodiment of the application further provides an electronic device, which comprises the camera module.

It should be noted that the implementation manner of the above-mentioned embodiment of the camera module is also applicable to the embodiment of the electronic device, and can achieve the same technical effect, and is not described herein again.

The electronic device in the present application may be a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a Personal Digital Assistant (PDA), etc.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A camera module is characterized by comprising a shell, a lens, a chip assembly, a driving assembly and a flexible circuit board, wherein the lens is arranged at the first end of the shell, the flexible circuit board is arranged at the second end of the shell, a guide rod is arranged in the shell, the chip assembly is positioned in the shell and is in sliding connection with the guide rod, and the chip assembly is electrically connected with the flexible circuit board;

2. The camera module of claim 1, wherein the driving assembly comprises a carrier, a magnetic conductive member and a coil, one of the magnetic conductive member and the coil is disposed on an inner sidewall of the housing, and the other of the magnetic conductive member and the coil is disposed on the carrier;

the chip assembly is arranged on the carrier, and under the condition that the coil is electrified, the electromagnetic induction force generated between the magnetic conduction piece and the coil drives the carrier to move, and the carrier drives the chip assembly to move along the guide rod relative to the lens.

3. The camera module of claim 2, wherein the magnetic conductive member is disposed on an inner sidewall of the housing, and the coil is wound around the carrier;

the number of the magnetic conduction pieces is multiple, and the magnetic conduction pieces are arranged around the coil.

4. The camera module of claim 2, wherein the chip assembly comprises an optical sensor chip and a chip substrate, the optical sensor chip is disposed on the chip substrate, and the chip substrate is fixedly disposed on the carrier;

the first end of the shell is provided with a first through hole, and light rays penetrate through the lens and then are emitted to the optical sensing chip through the first through hole.

5. The camera module according to claim 3, wherein the magnetic conductive member comprises a driving magnetic conductive member and a Hall magnetic conductive member, and the camera module further comprises a Hall sensing chip;

the carrier is driven to move by the electromagnetic induction force generated between the drive magnetic conduction piece and the coil, and the carrier drives the chip assembly to move along the guide rod relative to the lens; the Hall magnetic conduction piece is used for providing a magnetic field required by the Hall sensing chip, and the Hall sensing chip is used for detecting the position of the chip assembly in the shell.

6. The camera module according to claim 2, wherein the carrier is provided with a second through hole adapted to the guide rod, the carrier is sleeved on the guide rod through the second through hole, and the carrier is slidably connected to the guide rod.

7. The camera module according to claim 2, further comprising a filter, wherein the carrier is provided with a third through hole, the filter is disposed on the carrier, and the filter is located between the lens and the optical sensor chip;

and the light rays passing through the optical filter are emitted to the optical sensing chip through the third through hole.

8. The camera module according to claim 4, wherein the flexible circuit board comprises a chip connection portion, the optical sensor chip is electrically connected to the flexible circuit board through the chip connection portion, and the chip connection portion can move relative to the lens along with the optical sensor chip.

9. The camera module of claim 2, wherein an elastic limiting structure is disposed at an end of the carrier facing the lens.

10. An electronic apparatus, characterized by comprising the camera module according to any one of claims 1 to 9.