CN113382132A - Photosensitive module, camera module and manufacturing method of camera module - Google Patents

Abstract

The application provides a photosensitive module, a camera module and a manufacturing method of the camera module. This sensitization module includes: a substrate; a photosensitive element disposed on the substrate; the lens base and the substrate are bonded with each other through a first bonding agent, the bonded substrate and the lens base form an accommodating space for accommodating the photosensitive element, and the lens base is provided with air holes; and a mesh structure disposed in the airing hole.

Description

Photosensitive module, camera module and manufacturing method of camera module

Technical Field

The present disclosure relates to the field of optical devices, and more particularly, to a photosensitive module, a camera module, and a method for manufacturing a camera module.

Background

When assembling a photosensitive module for image formation, some parts need to be bonded with an adhesive. The bonded components may form a nearly closed, enclosed space. For example, the mirror base and the substrate bonded to each other may form a closed space for accommodating the photosensitive element. However, heat may be generated during the bonding process (e.g., in the case of thermosetting bonding), causing the air inside the enclosed space to expand, so that some parts in the enclosed space may be deformed by the expansion of the air. In addition, when assembling a camera module for imaging, it is often necessary to bond the lens member and the photosensitive module with an adhesive. However, the heat generated during the bonding process also causes the air inside the photosensitive module to expand, thereby affecting the performance of the camera module. Therefore, a scheme for exhausting the internal air in the assembly process of the photosensitive module and the camera module is needed, and adverse effects on the performance and reliability of the photosensitive module and the camera module in the assembly process can be avoided.

In addition, when step by step equipment sensitization module and the module of making a video recording, sensitization module and the module of making a video recording are assembled at a station and are accomplished the back, can be moved another station and carry out equipment on next step. Some environmentally sensitive devices are susceptible to environmental effects during movement, resulting in poor device performance. For example, the photosensitive device is relatively sensitive to dust and the like. Therefore, a solution for shielding dust to some extent during the assembly process of the camera module is needed, and the performance and reliability of the camera module are not adversely affected during the manufacturing process.

Disclosure of Invention

The present application provides such a photosensitive module in one aspect. The sensitization module includes: a substrate; a photosensitive element disposed on the substrate; the lens base is fixed on the substrate, an accommodating space for accommodating the photosensitive element is formed in the substrate, and the lens base is provided with air holes; and a mesh structure disposed in the airing hole.

In one embodiment, the first adhesive is a UV thermoset.

In one embodiment, the lens holder is made of plastic.

In one embodiment, the thickness of the mesh structure is less than 0.3 mm.

In one embodiment, the mirror base and the substrate are bonded to each other by a first adhesive.

In one embodiment, the diameter of the airing hole is in the range of 0.1mm to 0.7 mm.

In one embodiment, the area of the mesh structure is greater than or equal to the cross-sectional area of the vent, wherein the cross-sectional area is the cross-sectional area of the vent at the mesh structure.

In one embodiment, the mesh structure is at least partially embedded in the lens mount.

In one embodiment, the mesh structure is made of a metallic material or made of a ceramic material.

In one embodiment, the vent and the first adhesive are spaced apart from each other.

In one embodiment, the mesh structure is disposed on a side of the mirror base parallel to the substrate.

In one embodiment, the mesh structure is disposed on a sidewall of the mirror base.

In one embodiment, dispensing is performed at the vent.

In one embodiment, the mesh structure is obliquely arranged on the side wall of the mirror base.

In one embodiment, the mesh is disposed at a top region of the mirror base and a sidewall region of the mirror base.

In one embodiment, the mesh structure has a bent shape.

In one embodiment, the mirror base is provided with a light-passing hole at a position facing the photosensitive element, and a color filter is covered on the light-passing hole.

Another aspect of the present application provides such a camera module. The camera module comprises: the photosensitive module provided by the above embodiment; the lens component is fixed on one side of the lens base, which is parallel to the substrate, through a second adhesive.

In one embodiment, characterized in that the second binder is a thermosetting binder.

Another aspect of the present application further provides a method for manufacturing a camera module, where the method includes: coating a first adhesive between a lens seat provided with an air hole and a substrate provided with a photosensitive element, wherein a reticular structure is arranged in the air hole; curing the first adhesive, and forming an accommodating space for accommodating the photosensitive element by the lens base and the substrate bonded by the cured first adhesive; coating a second adhesive between the lens seat and the lens component; and curing the second binder.

In one embodiment, the first adhesive is a UV thermoset.

In one embodiment, the thickness of the mesh structure is less than 0.3 mm.

In one embodiment, the mesh structure is made of a metallic material or made of a ceramic material.

The application also provides a manufacturing method of the camera module. The manufacturing method comprises the following steps: coating a first adhesive between the lens seat provided with the air holes and the substrate provided with the photosensitive element; curing the first adhesive, and forming an accommodating space for accommodating the photosensitive element by the lens base and the substrate bonded by the cured first adhesive; arranging a net-shaped structure at the air vent; coating a second adhesive between the lens seat and the lens component; and curing the second binder.

In one embodiment, the mesh structure is attached to the lens holder at the vent hole.

This application is earlier mirror seat and network structure thing integrated into one piece in order to increase the structural strength of mirror seat. And then curing the first adhesive to form the photosensitive module with the air holes, which contains the photosensitive element. And finally, curing a second adhesive between the lens component and the lens base to finish the installation of the camera module. On one hand, the reticular structure in the air holes and the mirror base are integrally formed, so that the structural strength of the mirror base can be enhanced. On the other hand, the mesh structure has waterproof and breathable effects, and can immediately dissipate heat generated in the process flow and the working process, so that the damage of gas expansion to parts such as a photosensitive element or a color filter and the like is avoided, or the influence of the expansion of the parts on the module image caused by pressure, such as field curvature and other aberrations generated by the bending of the photosensitive element, is avoided. And the mesh structure can also prevent dust from entering the photosensitive module in, for example, a process flow gap.

Drawings

Other features, objects, and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments when taken in conjunction with the accompanying drawings. In the drawings:

fig. 1 is a schematic structural diagram of a camera module according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a camera module according to another embodiment of the present application;

fig. 3 is a schematic structural diagram of a camera module according to another embodiment of the present application;

fig. 4 is a schematic structural diagram of a camera module according to another embodiment of the present application;

fig. 5 is a schematic structural diagram of a camera module according to another embodiment of the present application;

fig. 6 is a schematic structural diagram of a camera module according to another embodiment of the present application;

fig. 7 is a schematic structural diagram of a camera module according to another embodiment of the present application;

FIG. 8 is a schematic structural view of a mesh structure according to an embodiment of the present application;

fig. 9 is a flowchart of a method of manufacturing a camera module according to an embodiment of the present application; and

fig. 10 is a flowchart of a method of manufacturing a camera module according to another embodiment of the present application.

Detailed Description

For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that in this specification, the expressions first, second, third, etc. are used only to distinguish one feature from another, and do not represent any limitation on the features. Thus, the first binder discussed below may also be referred to as the second binder without departing from the teachings of the present application. And vice versa.

In the drawings, the thickness, size and shape of the components have been slightly adjusted for convenience of explanation. The figures are purely diagrammatic and not drawn to scale. As used herein, the terms "approximately", "about" and the like are used as table-approximating terms and not as table-degree terms, and are intended to account for inherent deviations in measured or calculated values that would be recognized by one of ordinary skill in the art.

It will be further understood that terms such as "comprising," "including," "having," "including," and/or "containing," when used in this specification, are open-ended and not closed-ended, and specify the presence of stated features, elements, and/or components, but do not preclude the presence or addition of one or more other features, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of" appears after a list of listed features, it modifies that entire list of features rather than just individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.

Unless otherwise defined, all terms (including engineering and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. In addition, unless explicitly defined or contradicted by context, the specific steps included in the methods described herein are not necessarily limited to the order described, but can be performed in any order or in parallel. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

The features, principles and other aspects of the present application are described in detail below.

Fig. 1 is a schematic structural diagram of a camera module according to an embodiment of the present application.

The camera module 1000 includes a photosensitive module 1100 and a lens member 1200.

The photo-sensor module 1100 may include a substrate 1110, a photo-sensor 1120, a lens mount 1130, and a mesh 1140. The photosensitive element 1120 may be disposed on the substrate 1110. The mirror base 1130 and the substrate 1110 may be bonded to each other by a first adhesive 1150, and the bonded substrate 1110 and mirror base 1130 form an accommodating space 1160 in which the photosensitive element 1120 is accommodated. For example, the photosensitive element 1120 may be disposed in a middle region of the accommodating space 1160.

As shown in fig. 1, the lens base 1130 may have an air hole 1170. Since the interior of the photosensitive module 1100 or the camera module 1000 will expand due to heat during the assembly process, the lens base 1130 is provided with the ventilation holes 1170 to exhaust the excessive gas. For example, the ventilation holes 1170 can be disposed on a side of the base 1130 parallel to the substrate 1110. The diameter of the air holes can be in the range of 0.1 mm-0.7 mm. The area of the mesh structure may be greater than or equal to the cross-sectional area of the airing hole. The mesh 1140 may be disposed in the airing hole 1170. For example, the mesh 1140 may be disposed inside the airing hole 1170. For example, the mesh 1140 may be at least partially embedded in the base 1130.

The mesh 1140 may be disposed in the airing hole 1170 in various ways. For example, the mesh 1140 may be adhered in the airing hole. For another example, the mesh 1140 and the base 1130 can be integrally formed by insert-molding, which can increase the structural strength of the base 1130 and also prevent the mesh 1140 from falling off during the working process. The mesh structure 1140 may function as a barrier to prevent foreign substances such as liquid droplets, dust, etc. from invading the accommodating space 1160, thereby preventing deterioration of the image pickup function due to the photosensitive element being affected by these foreign substances.

The net 1140 may have fine meshes. Because of the existence of liquid surface tension, water molecules can be condensed into water drops with the size far larger than that of common gas molecules, so that the effect of balancing the air pressure inside and outside the lens base while preventing water can be achieved as long as the aperture of the mesh structure is smaller than that of the water drops. Accordingly, the mesh 1140 is permeable to gas and capable of blocking liquid. When cleaning the photosensitive module 1100 or the camera module 1000, or when moisture may enter the photosensitive module 1100 or the camera module 1000 at any time, the mesh 1140 can prevent the moisture from entering, so that the photosensitive module 1100 and the camera module 1000 have a waterproof function, thereby reducing the influence on the imaging of the photosensitive module 1100 or the camera module 1000. Meanwhile, these fine meshes can also block large solid matter such as dust from entering the accommodating space 1160, thereby preventing deterioration of the image pickup function due to the influence of such foreign matter on the photosensitive element.

When the mesh-like structure 1140 and the lens base 1130 are integrally formed by insert-molding process, an additional process for disposing or attaching the mesh-like structure 1140 can be omitted, so that the assembling process of the photosensitive module 1100 and the camera module 1000 can be simplified, and the cost can be saved.

The lens mount 1130 may be made of plastic according to embodiments of the present application. The mesh 1140 may be made of a metal material or made of a ceramic material. And the net structure 1140 may be composed of a plurality of through holes having a smaller diameter than the ventilation holes 1170. The plastic lens mount 1130 and the metallic material or the ceramic material may be integrally formed by insert-molding process. The metal material or the ceramic material also has a function of enhancing heat dissipation, and can dissipate heat generated by the photosensitive element 1120 and the circuit board during operation in time, so as to improve the performance of the photosensitive module 1100 and the camera module 1000.

According to an embodiment of the present application, the first adhesive 1150 may be a UV thermosetting adhesive, and the first adhesive 1150 may be irradiated by ultraviolet light to be cured. The bonded lens mount 1130 and substrate 1110 are then heated to cure the first bonding agent 1150, thereby achieving a secure connection between the lens mount 1130 and the substrate 1110. Preferably, the lens base 1130 and the substrate 1110 after being bonded are baked to achieve the fixed connection between the lens base 1130 and the substrate 1110.

According to an embodiment of the present application, the thickness of the mesh 1140 may be less than 0.3 mm. Also, a portion of the mesh 1140 disposed in the airing hole 1170 may be disposed as a mesh structure to achieve a waterproof airing effect. The portion of the mesh 1140 that is embedded in the mirror base 1130 may be a solid sheet structure to increase the strength and heat dissipation capability of the mirror base 1130.

According to an embodiment of the present application, the vent 1170 and the first adhesive 1150 may be spaced apart from each other. The ventilation hole 1170 is spaced apart from the first adhesive 1150, so that the first adhesive 1150 is prevented from blocking the ventilation hole 1170, and air in the accommodating space 1160 cannot be discharged.

According to the embodiment of the present application, the lens holder 1130 may be provided with a light passing hole at a portion facing the photosensitive element 1120, and the light passing hole may be covered with a color filter 1180. Color filter 1180 may be disposed on the photosensitive path of photosensitive element 1120.

The lens component 1200 may be secured to the side of the mirror mount 1130 parallel to the substrate 1110 by a second adhesive 1230. For example, the edge of the lens component 1200 on the side having the mesh 1140 with the lens mount 1130 can be adhered by the second adhesive 1230, and the curing process is the same as the above-mentioned step. For example, the second adhesive 1230 made of thermosetting adhesive may be pre-cured by light irradiation, and the second adhesive 1230 may be further cured by baking. For example, in some assembly processes, the lens assembly 1200 is attached to the base 1130 generally requiring a photo recognition and alignment process. After the relative positions have been aligned and the second adhesive 1230 is pre-cured, the assembly is placed in an oven for baking to further cure the second adhesive 1230.

Due to the mesh 1140, air expanded by heat in the accommodating space 1160 formed by the lens base 1130 and the substrate 1110 may be discharged to the outside through the mesh 1140 during the secondary heating process.

According to an embodiment of the present application, the vent 1170 and the second adhesive 1230 may be spaced apart from each other. The ventilation hole 1170 and the second adhesive 1230 are spaced apart, so that the second adhesive 1230 is prevented from blocking the ventilation hole 1170, and air in the accommodating space 1160 cannot be discharged.

Fig. 2 is a schematic structural diagram of a camera module 2000 according to another embodiment of the present application.

The camera module 2000 includes a photosensitive module 2100 and a lens member 2200.

The photosensitive module 2100 may include a substrate 2110, a photosensitive element 2120, a lens seat 2130, and a mesh structure 2140. The photosensitive element 2120 may be provided on the substrate 2110. The mirror base 2130 and the base plate 2110 may be adhered to each other by the first adhesive 2150, and the adhered base plate 2110 and the mirror base 2130 form a receiving space 2160 for receiving the photosensitive element 2120. For example, the photosensitive element 2120 may be disposed at a middle area of the receiving space 2160.

As shown in fig. 2, the lens seat 2130 may be provided with air holes 2170. Since the photosensitive module 2100 or the camera module 2000 is thermally expanded during the assembling process, the air holes 2170 are formed on the lens seat 2130 to exhaust the excessive air. For example, the air holes 2170 may be provided on the sidewalls of the lens mount 2130. The diameter of the air holes can be in the range of 0.1 mm-0.7 mm. The area of the mesh structure may be greater than or equal to the cross-sectional area of the airing hole.

The mesh structure 2140 may be disposed in the air holes 2170. For example, the mesh structure 2140 may be disposed inside the air holes 2170. For example, the mesh 2140 can be at least partially embedded in the lens holder 2130.

The mesh structure 2140 may be disposed in the air holes 2170 in various ways. For example, the mesh structure 2140 may adhere in the air holes. For another example, the mesh 2140 and the lens base 2130 can be integrally formed by insert-molding, which can increase the structural strength of the lens base 2130 and prevent the mesh 2140 from falling off during the working process. The mesh structure 2140 may function as a barrier to prevent foreign substances such as liquid droplets, dust, and the like from invading the accommodating space 2160, thereby preventing deterioration of the image pickup function due to the photosensitive element being affected by these foreign substances.

The net structure 2140 may have fine mesh holes. When the liquid droplets flow through these fine mesh holes, the liquid droplets are adsorbed to the mesh structure 2140 due to surface tension. Accordingly, the mesh structure 2140 is permeable to gas and capable of blocking liquid. When cleaning photosensitive module 2100 or camera module 2000, or when perhaps moisture gets into photosensitive module 2100 or camera module 2000 at other times, network 2140 can prevent the moisture from getting into, makes photosensitive module 2100 and camera module 2000 have a waterproof function to reduce the influence to photosensitive module 2100 or camera module 2000 formation of image. Meanwhile, these fine meshes can also block large solid matter such as dust from entering the accommodating space 2160, thereby preventing deterioration of the image pickup function due to the photosensitive element being affected by such foreign matter.

When the mesh-shaped structure 2140 and the lens holder 2130 are integrally formed by insert-molding, an additional process for disposing the mesh-shaped structure 2140 can be omitted, so that the assembling process of the photosensitive module 2100 and the camera module 2000 can be simplified, and the cost can be saved.

According to the embodiment of the present application, the glue material 2190 may be disposed in the region where the ventilation holes 2170 of the mesh structure 2140 are not disposed. After the photosensitive module 2100 or the camera module 2000 is assembled, the adhesive material 2190 may be disposed in the area of the air holes 2170 without the mesh-shaped structure 2140 to seal the air holes 2170, so that the photosensitive module 2100 or the camera module 2000 has stronger dust-proof and water-proof capabilities.

The lens mount 2130 can be made of plastic according to an embodiment of the present application. The mesh structure 2140 may be made of a metal material or made of a ceramic material. And the mesh structure 2140 may be composed of a plurality of through holes having a smaller pore size than the air holes 2170. The plastic lens seat 2130 and the metallic material or the ceramic material may be integrally formed by insert-molding process. The metal material or the ceramic material also has a function of enhancing heat dissipation, and can dissipate heat generated by the photosensitive element 2120 and the circuit board during operation in time, so as to improve the performance of the photosensitive module 2100 and the camera module 2000.

According to an embodiment of the present application, the first adhesive 2150 may be a UV thermosetting adhesive, and the first adhesive 2150 may be irradiated with ultraviolet light to be cured. The bonded lens mount 2130 and substrate 2110 are then heated to cure the first adhesive 2150, thereby fixedly attaching the lens mount 2130 to the substrate 2110. Preferably, the adhered mirror base 2130 and the substrate 2110 are baked to fixedly connect the mirror base 2130 and the substrate 2110.

According to an embodiment of the present application, the thickness of the mesh structure 2140 may be less than 0.3 mm. Also, a portion of the mesh structure 2140 disposed inside the air hole 2170 may be disposed as a mesh structure to achieve a waterproof and air-permeable effect. The portion of the mesh 2140 that is embedded within the lens mount 2130 may be a solid sheet-like structure to increase the strength and heat dissipation capability of the lens mount 2130.

According to the embodiment of the present application, the lens seat 2130 may be provided with a light passing hole at a portion facing the photosensitive element 2120, and the light passing hole may be covered with the color filter 2180. A color filter 2180 may be disposed on a photosensitive path of the photosensitive element 2120.

The lens component 2200 may be secured to a side of the lens mount 2130 parallel to the substrate 2110 by a second adhesive 2230. For example, the lens part 2200 may be bonded to the edge of the lens seat 2130 having the mesh 2140 via the second adhesive 2230, and the curing process is the same as that in the above step. For example, the second adhesive 2230 made of thermosetting adhesive may be pre-cured by light irradiation, and then the second adhesive 2230 may be further cured by baking. For example, in some assembly processes, the lens component 2200 is generally required to be attached to the lens seat 2130 by a photo recognition and alignment process. After the relative positions have been aligned and the second adhesive 2230 is pre-cured, the assembly is placed in an oven for baking to further cure the second adhesive 2230.

Due to the provision of the mesh 2140, air expanded by heat in the accommodating space 2160 formed by the mirror mount 2130 and the base plate 2110 may be discharged to the outside through the mesh 2140 during the secondary heating process.

According to an embodiment of the present application, the airing hole 2170 and the second adhesive 2150 may be spaced apart from each other. The ventilation holes 2170 and the second adhesive 2150 are spaced apart, and the second adhesive 2150 is prevented from blocking the ventilation holes 2170, so that air in the receiving space 2160 cannot be discharged.

Fig. 3 is a schematic structural diagram of a camera module 3000 according to another embodiment of the present application.

The camera module 3000 includes a photosensitive module 3100 and a lens member 3200.

The photosensitive module 3100 may include a substrate 3110, a photosensitive element 3120, a mirror base 3130, and a mesh 3140. The photosensitive element 3120 may be disposed on the substrate 3110. The mirror base 3130 and the substrate 3110 may be bonded to each other by a first adhesive 3150, and the bonded substrate 3110 and mirror base 3130 form an accommodating space 3160 in which the photosensitive element 3120 is accommodated. For example, the photosensitive element 3120 may be disposed at a middle region of the accommodating space 3160.

As shown in FIG. 3, the lens base 3130 may be provided with air holes 3170. Since the photosensitive module 3100 or the camera module 3000 is thermally expanded during the assembly process, the lens base 3130 is provided with a vent 3170 to exhaust the excessive gas. For example, the ventilation holes 3170 may be provided on the side wall of the lens base 3130. The diameter of the air holes can be in the range of 0.1 mm-0.7 mm. The area of the mesh structure may be greater than or equal to the cross-sectional area of the airing hole.

The mesh 3140 may be provided in the airing hole 3170. For example, the mesh 3140 may be disposed inside the airing hole 3170. For example, mesh 3140 can be at least partially embedded in base 3130. As shown in fig. 1 and 2, the mesh structure may be vertically disposed in the airing hole and the mirror base. In addition, as shown in fig. 3, the net-like structure 3140 can be obliquely disposed in the ventilation hole 3170 and the lens base 3130, and the net-like structure 3140 can directly connect the inner space and the outer space of the lens base 3130, so that the heat dissipation effect is better.

The mesh-like structure 3140 may be provided in the airing hole 3170 in various ways. For example, the mesh 3140 may be adhered in the airing hole. For another example, the mesh 3140 and the base 3130 can be integrally formed by insert-molding, which can increase the structural strength of the base 3130 and also prevent the mesh 3140 from falling off during operation. The mesh structure 3140 may function as a barrier to prevent foreign substances such as liquid droplets, dust, and the like from invading the accommodating space 3160, thereby preventing deterioration of the image pickup function due to the photosensitive element being affected by these foreign substances.

The net structure 3140 may have fine meshes. When the liquid droplets flow through these fine mesh holes, the liquid droplets are adsorbed to the mesh-like structure 3140 due to surface tension. Thus, the mesh 3140 is permeable to gas and able to block liquid. When the photosensitive module 3100 or the camera module 3000 is cleaned, or moisture may enter the photosensitive module 3100 or the camera module 3000 at any time, the net-like structure 3140 prevents the moisture from entering, so that the photosensitive module 3100 and the camera module 3000 have a waterproof function to reduce the influence on the imaging of the photosensitive module 3100 or the camera module 3000. Meanwhile, these fine meshes can also block large solid matter such as dust from entering the accommodating space 3160, thereby preventing deterioration of the image pickup function due to the photosensitive element being affected by such foreign matter.

When the net-shaped structure 3140 and the mirror base 3130 are integrally formed through an insert-molding process, an additional process for disposing the net-shaped structure 3140 can be omitted, so that the assembly process of the photosensitive module 3100 and the camera module 3000 can be simplified, and the cost can be saved.

In accordance with an embodiment of the present application, base 3130 may be made of plastic. The mesh 3140 may be made of a metal material or a ceramic material. And the mesh structure 3140 may be composed of a plurality of through holes having a smaller hole diameter than the airing hole 3170. The plastic mirror base 3130 and the metallic or ceramic material may be integrally formed by an insert-molding process. The metal material or the ceramic material also has the function of enhancing heat dissipation, and can dissipate heat generated by the photosensitive element 3120 and the circuit board during operation in time so as to improve the performance of the photosensitive module 3100 and the camera module 3000.

According to an embodiment of the present application, the first adhesive 3150 may be a UV thermosetting adhesive, and the first adhesive 3150 may be irradiated by ultraviolet light to be cured. The bonded lens base 3130 and substrate 3110 are then heated, causing first adhesive 3150 to cure, thereby effecting a secure attachment of lens base 3130 to substrate 3110. Preferably, the lens holder 3130 and the substrate 3110 can be fixed by baking the bonded lens holder 3130 and substrate 3110.

According to an embodiment of the present application, the thickness of the mesh-like structure 3140 may be less than 0.3 mm. Also, a portion of the mesh 3140 disposed inside the airing hole 3170 may be provided as a mesh structure to achieve a waterproof airing effect. The portion of the mesh 3140 embedded in the nosepiece 3130 can be a solid sheet-like structure to increase the strength and heat dissipation capability of the nosepiece 3130.

According to an embodiment of the present application, the mirror base 3130 may be provided with a light passing hole at a portion facing the photosensitive element 3120, and the light passing hole may be covered with a color filter 3180. The color filter 3180 may be disposed on a photosensitive path of the photosensitive element 3120.

The lens component 3200 may be fixed to a side of the lens holder 3130 parallel to the substrate 3110 by a second adhesive 3230. For example, the lens component 3200 may be bonded to the edge position of the side of the lens holder 3130 having the mesh 3140 by a second adhesive 3230, and the curing process is the same as that in the above step. For example, the second adhesive 3230 made of thermosetting adhesive may be pre-cured by light irradiation, and the second adhesive 3230 may be further cured by baking. For example, in some assembly processes, the lens component 3200 and the lens holder 3130 are bonded together by a photo recognition and alignment process. After the relative positions have been aligned and the second adhesive 3230 is pre-cured, the assembly is placed in an oven for baking to further cure the second adhesive 3230.

Due to the provision of the mesh 3140, air expanded by heat in the accommodating space 3160 formed by the mirror base 3130 and the substrate 3110 during the secondary heating process may be discharged to the outside through the mesh 3140.

According to an embodiment of the present application, the vent 3170 and the second adhesive 3150 may be spaced apart from each other. The vent 3170 and the second adhesive 3150 are spaced apart to prevent the second adhesive 3150 from blocking the vent 3170, so that air in the accommodating space 3160 cannot be discharged.

Fig. 4 is a schematic structural diagram of a camera module 4000 according to another embodiment of the present application.

The image pickup module 4000 includes a photosensitive module 4100 and a lens member 4200.

The photo sensor module 4100 may include a substrate 4110, a photo sensor 4120, a mirror holder 4130 and a mesh structure 4140. The photosensitive element 4120 may be disposed on the substrate 4110. The mirror base 4130 and the substrate 4110 may be bonded to each other by a first adhesive 4150, and the bonded substrate 4110 and the mirror base 4130 form an accommodating space 4160 for accommodating the photosensitive element 4120. For example, the photosensitive element 4120 may be disposed in a middle region of the accommodating space 4160.

As shown in fig. 4, the lens seat 4130 may be provided with ventilation holes 4170. Since the photosensitive module 4100 or the camera module 4000 is thermally expanded during the assembling process, the lens holder 4130 is provided with the ventilation holes 4170 to exhaust the excessive gas. For example, the ventilation holes 4170 may be provided on the side wall of the mirror base 4130. The diameter of the air holes can be in the range of 0.1 mm-0.7 mm. The area of the mesh structure may be greater than or equal to the cross-sectional area of the airing hole.

The mesh structure 4140 may be provided in the airing hole 4170. For example, the mesh structure 4140 may be disposed inside the airing hole 4170. For example, the mesh 4140 can be at least partially embedded in the mirror base 4130. As shown in fig. 4, the mesh 4140 is tiltably provided in the airing hole 4170 and the mirror base 4130, and the mesh 4140 has a bent shape. The mesh 4140 is disposed vertically at the airing hole 4170 and the portion in the mirror holder 4130 is disposed to be inclined, thereby conducting heat transfer from the inner space to the outer space of the mirror holder 4130.

The mesh structure 4140 may be provided in the airing hole 4170 in various ways. For example, the mesh structure 4140 may be adhered in the airing hole. For another example, mesh 4140 and base 4130 can be integrally formed by insert-molding, which can increase the structural strength of base 4130 and prevent mesh 4140 from falling off during operation. The mesh structure 4140 may function as a barrier to prevent foreign substances such as liquid droplets, dust, and the like from invading the accommodating space 4160, thereby preventing deterioration of the image pickup function due to the photosensitive element being affected by these foreign substances.

The net structure 4140 may have fine mesh holes. When the liquid droplets flow through these fine mesh holes, the liquid droplets are adsorbed to the mesh structure 4140 due to the surface tension. Accordingly, mesh 4140 is permeable to gas and capable of blocking liquid. When cleaning photosensitive module 4100 or camera module 4000, or when perhaps moisture gets into photosensitive module 4100 or camera module 4000 at other anytime, network structure 4140 can prevent the moisture entering, makes photosensitive module 4100 and camera module 4000 have waterproof function to reduce the influence to photosensitive module 4100 or camera module 4000 formation of image. Meanwhile, these fine meshes also block large solid matters such as dust from entering the accommodating space 4160, thereby avoiding deterioration of the image pickup function due to the photosensitive element being affected by these foreign matters.

When the mesh 4140 and the lens holder 4130 are integrally formed by insert-molding, an additional process for disposing the mesh 4140 may be omitted, so as to simplify the assembling process of the photosensitive module 4100 and the camera module 4000 and save the cost.

The mirror base 4130 may be made of plastic according to an embodiment of the present application. The mesh structure 4140 may be made of a metal material or a ceramic material. And the mesh structure 4140 may be composed of a plurality of through holes having a smaller hole diameter than the airing holes 4170. The plastic mirror base 4130 and the metallic material or the ceramic material may be integrally formed by insert-molding process. The metal material or the ceramic material also has the function of enhancing heat dissipation, and can dissipate heat generated by the photosensitive element 4120 and the circuit board during operation in time so as to improve the performance of the photosensitive module 4100 and the camera module 4000.

According to an embodiment of the present application, the first adhesive 4150 may be a UV thermosetting adhesive, and the first adhesive 4150 may be irradiated by ultraviolet light to be cured. The bonded mirror base 4130 and substrate 4110 are then heated to cure the first bonding agent 4150, thereby fixedly connecting the mirror base 4130 and the substrate 4110. Preferably, the mirror base 4130 and the substrate 4110 are bonded together by baking to fixedly connect the mirror base 4130 and the substrate 4110.

According to an embodiment of the present application, the thickness of the mesh structure 4140 may be less than 0.3 mm. Also, a portion of the mesh structure 4140 disposed in the ventilation holes 4170 may be provided as a mesh structure to achieve a waterproof and breathable effect. The portion of the mesh 4140 that is embedded within the mirror base 4130 may be a solid sheet structure to increase the strength and heat dissipation capabilities of the mirror base 4130.

According to the embodiment of the present application, the mirror base 4130 may be provided with a light passing hole at a portion facing the photosensitive element 4120, and the light passing hole may be covered with the color filter 4180. The color filter 4180 may be disposed on a light sensing path of the light sensing element 4120.

The lens component 4200 may be secured to a side of the mirror mount 4130 parallel to the base plate 4110 by a second adhesive 4230. For example, the lens component 4200 may be bonded to the edge of the side of the mirror base 4130 having the mesh 4140 by the second adhesive 4230, and the curing process is the same as that in the above step. For example, the second adhesive 4230 made of thermosetting adhesive may be pre-cured by light irradiation, and the second adhesive 4230 may be further cured by baking. For example, in some assembly processes, the lens component 4200 and the lens holder 4130 are bonded together by a photo recognition and alignment process. After the relative positions have been aligned and the second adhesive 4230 is pre-cured, the assembly is placed in an oven to bake further the second adhesive 4230.

Due to the provision of the mesh structure 4140, air expanded by heat in the accommodating space 4160 formed by the mirror base 4130 and the substrate 4110 during the secondary heating process may be discharged to the outside through the mesh structure 4140.

According to an embodiment of the present application, the vent 4170 and the second adhesive 4150 may be spaced apart from each other. The vent 4170 and the second adhesive 4150 are spaced apart to prevent the second adhesive 4150 from blocking the vent 4170 so that the air in the accommodating space 4160 cannot be discharged.

Fig. 5 is a schematic structural diagram of a camera module 5000 according to another embodiment of the present application.

The camera module 5000 includes a photosensitive module 5100 and a lens member 5200.

The photosensitive module 5100 can include a substrate 5110, a photosensitive element 5120, a lens mount 5130, and a mesh structure 5140. The photosensitive element 5120 may be disposed on the substrate 5110. The mirror base 5130 and the substrate 5110 can be bonded to each other by a first adhesive 5150, and the bonded substrate 5110 and mirror base 5130 form an accommodating space 5160 for accommodating the photosensitive element 5120. For example, the photosensitive element 5120 may be disposed at the middle region of the accommodating space 5160.

As shown in fig. 5, the lens holder 5130 can be provided with a vent 5170. Since the photosensitive module 5100 or the camera module 5000 is thermally expanded during the assembly process, the lens holder 5130 is provided with the vent 5170 to exhaust excessive air. For example, the ventilation holes 5170 can be provided on the side wall of the lens holder 5130. The diameter of the air holes can be in the range of 0.1 mm-0.7 mm. The area of the mesh structure may be greater than or equal to the cross-sectional area of the airing hole.

A mesh structure 5140 may be provided in the airing hole 5170. For example, the mesh 5140 can be disposed at the top region and the sidewall region of the base 5130. For example, the mesh 5140 can be at least partially embedded in the lens mount 5130. As shown in fig. 5, both the top region and the side wall region of the base 5130 can be integrally formed with the mesh 5140, which can increase the overall structural strength of the base 5130.

Regarding the portion of the mesh structure 6140 as shown in fig. 6, a description of portions similar to the mesh structure 5140 as shown in fig. 5 will be omitted for the sake of brevity.

As shown in fig. 6, the mesh 6140 can be disposed in both the top and side wall regions of the nosepiece 5130, and the mesh 6140 can be disposed in a bent shape to further enhance the structural strength of the nosepiece 5130. The mesh 6140 is preferably a metal material to enhance the heat dissipation capability and structural strength of the nosepiece 5130.

The mesh 5140 and the lens holder 5130 can be integrally formed by insert-molding, which can increase the structural strength of the lens holder 5130 and prevent the mesh 5140 from falling off during operation. The mesh structure 5140 may function as a barrier to prevent foreign substances such as liquid droplets, dust, and the like from invading the accommodating space 5160, thereby preventing deterioration of the image pickup function due to the photosensitive element being affected by these foreign substances.

The mesh structure 5140 may have fine mesh. When the liquid droplets flow through these fine mesh holes, the liquid droplets are adsorbed to the mesh structure 5140 due to surface tension. Accordingly, the mesh structure 5140 is permeable to gas and can block liquid. When rinsing sensitization module 5100 or the module 5000 of making a video recording, perhaps moisture gets into sensitization module 5100 or the module 5000 of making a video recording at other anytime, network structure 5140 can stop the moisture and get into, makes sensitization module 5100 and the module 5000 of making a video recording have waterproof function to reduce the influence to sensitization module 5100 or the module 5000 formation of image of making a video recording. Meanwhile, these fine meshes can also block large solid matters such as dust from entering the accommodating space 5160, thereby preventing deterioration of the image pickup function due to the photosensitive element being affected by such foreign matters.

When the mesh-like structure 5140 and the lens holder 5130 are integrally formed by insert-molding, an additional process for disposing the mesh-like structure 5140 can be omitted, so that the assembly process of the photosensitive module 5100 and the camera module 5000 can be simplified, and the cost can be saved.

According to an embodiment of the present application, the lens mount 5130 can be made of plastic. The mesh structure 5140 may be made of a metal material or a ceramic material. And the mesh structure 5140 may be composed of a plurality of through holes having a smaller pore size than the airing hole 5170. The plastic lens mount 5130 and the metal material or the ceramic material can be integrally formed by insert-molding process. The metal material or the ceramic material also has a function of enhancing heat dissipation, and can dissipate heat generated by the photosensitive element 5120 and the circuit board during operation in time, so as to improve the performance of the photosensitive module 5100 and the camera module 5000.

According to an embodiment of the present application, the first adhesive 5150 may be a UV thermosetting adhesive, and the first adhesive 5150 may be irradiated by ultraviolet light to be cured. The bonded lens mount 5130 and substrate 5110 are then heated to cure the first adhesive 5150, thereby fixedly attaching the lens mount 5130 to the substrate 5110. Preferably, the mirror base 5130 and the substrate 5110 can be fixedly connected by baking the bonded mirror base 5130 and the substrate 5110.

According to an embodiment of the present application, the thickness of the mesh structure 5140 may be less than 0.3 mm. Also, a portion of the mesh structure 5140 disposed in the ventilation hole 5170 may be provided as a mesh structure to achieve a waterproof and breathable effect. The portion of the mesh 5140 that is embedded within the lens mount 5130 can be a solid sheet-like structure to increase the strength and heat dissipation capabilities of the lens mount 5130.

According to an embodiment of the present application, the lens mount 5130 may be provided with a light passing hole at a portion facing the photosensitive element 5120, and the light passing hole may be covered with a color filter 5180. The color filter 5180 may be disposed on a photosensitive path of the photosensitive element 5120.

The lens component 5200 can be fixed to a side of the mirror mount 5130 parallel to the substrate 5110 by a second adhesive 5230. For example, the lens component 5200 can be bonded to the edge position of the side of the mirror mount 5130 having the mesh 5140 by a second adhesive 5230, and the curing process is the same as that in the above-described step. For example, the second adhesive 5230 made of thermosetting adhesive may be pre-cured by light irradiation, and then the second adhesive 5230 may be further cured by baking. For example, in some assembly processes, the lens component 5200 is typically attached to the lens mount 5130 by a photo recognition and alignment process. After the relative positions have been aligned and the second adhesive 5230 is pre-cured, the assembly is placed in an oven to bake further the second adhesive 5230.

Due to the provision of the mesh structure 5140, air expanded by heat in the accommodating space 5160 formed by the lens mount 5130 and the base plate 5110 during the secondary heating process can be discharged to the outside through the mesh structure 5140.

According to an embodiment of the present application, the vent 5170 and the second adhesive 5150 may be spaced apart from each other. The vent 5170 is spaced apart from the second adhesive 5150 to prevent the second adhesive 5150 from blocking the vent 5170, so that air in the accommodating space 5160 cannot be discharged.

Fig. 7 is a schematic structural diagram of a camera module 7000 according to another embodiment of the present application.

The image pickup module 7000 includes a photosensitive module 7100 and a lens component 7200.

The photosensitive module 7100 can include a substrate 7110, a photosensitive element 7120, a mirror holder 7130 and a mesh structure 7140. The photosensitive element 7120 may be disposed on the substrate 7110. The mirror base 7130 and the substrate 7110 may be bonded to each other by a first adhesive 7150, and the bonded substrate 7110 and the mirror base 7130 form a receiving space 7160 for receiving the photosensitive element 7120. For example, the photosensitive element 7120 may be disposed at a middle region of the receiving space 7160.

As shown in fig. 7, the lens holder 7130 may be provided with air holes 7170. Since the photosensitive module 7100 or the camera module 7000 is thermally expanded during the assembly process, the vent holes 7170 are formed in the mirror base 7130 to exhaust the excessive gas. For example, the air holes 7170 may be disposed on the sidewall of the mirror base 7130. The diameter of the air holes can be in the range of 0.1 mm-0.7 mm. The area of the mesh structure may be greater than or equal to the cross-sectional area of the airing hole.

A mesh 7140 may be disposed at the airing holes 7170. For example, the mesh 7140 can be attached to the sidewall of the mirror base 7130 at the vent holes 7170. As shown in fig. 7, a mesh 7140 is vertically attached to the sidewall of the mirror holder 7130 at the airing hole 7170.

The mesh structure 7140 may have fine mesh holes. As the droplets flow through these fine mesh openings, the droplets are attracted to the mesh 7140 due to surface tension. Thus, the mesh 7140 is permeable to gas and can be liquid resistant. When wasing sensitization module 7100 or the module 7000 of making a video recording, perhaps moisture gets into sensitization module 7100 or the module 7000 of making a video recording when other anytime, network structure thing 7140 can prevent the moisture entering, makes sensitization module 7100 and the module 7000 of making a video recording have waterproof function to the reduction is to sensitization module 7100 or the influence that the module 7000 of making a video recording imaged. Meanwhile, these fine meshes also block large solid matters such as dust from entering the housing space 7160, thereby preventing deterioration of the image pickup function due to the photosensitive element being affected by such foreign matters.

The mirror base 7130 can be made of plastic according to embodiments of the present application. Mesh 7140 may be made of a metallic material or a ceramic material. And the mesh 7140 may be composed of a plurality of through holes having a smaller diameter than the air holes 7170. The metal material or the ceramic material also has the function of enhancing heat dissipation, and can dissipate heat generated by the photosensitive element 7120 and the circuit board during operation in time so as to improve the performance of the photosensitive module 7100 and the camera module 7000.

According to an embodiment of the present application, the first adhesive 7150 may be a UV thermosetting adhesive, and the first adhesive 7150 may be irradiated by ultraviolet light to be cured. The bonded mirror base 7130 and substrate 7110 are then heated to cure the first adhesive 7150, thereby fixedly connecting the mirror base 7130 and the substrate 7110. Preferably, the mirror base 7130 and the substrate 7110 can be fixedly connected by baking the adhered mirror base 7130 and the substrate 7110.

According to embodiments of the present application, the thickness of the mesh structure 7140 may be less than 0.3 mm. Also, a portion of the mesh 7140 disposed inside the airing hole 7170 may be provided as a mesh structure to achieve a waterproof airing effect. The portion of the mesh 7140 that is embedded within the mirror base 7130 can be a solid sheet-like structure to increase the strength and heat dissipation capability of the mirror base 7130.

According to the embodiment of the present application, the mirror base 7130 may be provided with a light passing hole at a portion facing the photosensitive element 7120, and the light passing hole may be covered with a color filter 7180. The color filter 7180 may be disposed on a photosensitive path of the photosensitive element 7120.

The lens component 7200 can be secured to the side of the mirror base 7130 parallel to the substrate 7110 by a second adhesive 7230. For example, the lens component 7200 can be bonded to the mirror base 7130 via the second adhesive 7230, the curing process being the same as that in the above step. For example, the second adhesive 7230 made of thermosetting adhesive may be pre-cured by light irradiation, and the second adhesive 7230 may be further cured by baking. For example, in some assembly processes, the lens component 7200 is attached to the base 7130 by a photo identification and alignment process. After the relative positions have been aligned and the second adhesive 7230 is pre-cured, the assembly is placed in an oven for baking to further cure the second adhesive 7230.

According to an embodiment of the present disclosure, the mirror base 7130 and the substrate 7110 may be adhered to each other by a first adhesive 7150, and the mesh 7140 may be attached after the first adhesive 7150 is cured by heat. Then, the lens component 7200 can be fixed to a side of the mirror base 7130 parallel to the substrate 7110 by a second adhesive 7230. This allows the gas in the receiving space 7160 to be more easily exhausted when the first adhesive 7150 is cured, which can increase the reliability of the photosensitive module. In addition, the mesh 7140 may be attached to the sidewall of the mirror holder 7130 at the air holes 7170, and then the mirror holder 7130 and the substrate 7110 are bonded to each other by the first adhesive 7150. Then, the lens component 7200 can be fixed to a side of the mirror base 7130 parallel to the substrate 7110 by a second adhesive 7230. Due to the provision of the mesh 7140, air expanded by heat in the accommodating space 7160 formed by the mirror base 7130 and the base plate 7110 may be discharged to the outside through the mesh 74140 during the secondary heating process. Thus, the net-shaped structure is attached firstly, so that the module assembly process is simpler and is less prone to generate dirt.

According to an embodiment of the present application, the vent 7170 and the second adhesive 7150 may be spaced apart from each other. The ventilation holes 7170 are spaced apart from the second adhesive 7150, and the second adhesive 7150 may prevent the ventilation holes 7170 from being blocked by the second adhesive 7150, so that air in the receiving space 7160 may not be discharged.

Fig. 8 is a schematic structural diagram of a mesh structure 8140 according to an embodiment of the present application.

As shown in fig. 8, the mesh structure 8140 may have fine mesh holes. For example, the mesh structure 8140 may be composed of a plurality of through holes 8142 having a smaller pore size than the airing holes. When the liquid droplets flow through these fine mesh holes, the liquid droplets are adsorbed to the mesh structure 8140 due to surface tension. Thus, the mesh 8140 is permeable to gas and capable of blocking liquid. Considering that the mesh structure is applied to the photo module or the camera module, since the photo module and the camera module are small in volume, it is preferable that the thickness of the mesh structure 8140 is less than 0.3 mm.

The portion of the mesh structure 8140 disposed inside the ventilation hole may be provided as a mesh structure 8141 to achieve a waterproof and ventilation effect. The portion of the mesh 8140 that is embedded within the base may be a solid sheet structure 8143 to increase the strength and heat dissipation capabilities of the base.

Fig. 9 is a flowchart of a method of manufacturing an image pickup module according to an embodiment of the present application.

The method 9000 for manufacturing the camera module can comprise the following steps: in operation S9100, a first adhesive may be coated between the mirror base provided with the airing hole and the substrate provided with the photosensitive element, wherein a mesh structure may be provided in the airing hole; in operation S9200, a first adhesive may be cured, and an accommodating space for accommodating the photosensitive element is formed by the mirror base and the substrate bonded by the cured first adhesive; in operation S9300, a second adhesive may be applied between the lens mount and the lens part; in operation S9400, the second adhesive may be cured. Thus, the net-shaped structure is attached firstly, so that the module assembly process is simpler and is less prone to generate dirt.

According to an embodiment of the application, the method further comprises: the first adhesive may be a UV thermosetting adhesive.

According to an embodiment of the application, the method further comprises: the thickness of the mesh structure may be less than 0.3 mm.

According to an embodiment of the application, the method further comprises: the mesh structure may be made of a metallic material or of a ceramic material.

Fig. 10 is a flowchart of a method of manufacturing a camera module according to another embodiment of the present application.

The method 10000 for manufacturing the camera module group can include: in operation S11000, a first adhesive may be coated between the mirror base provided with the vent hole and the substrate provided with the photosensitive element; in operation S12000, a first adhesive may be cured, and a receiving space to receive the photosensitive element is formed by the mirror base and the substrate bonded by the cured first adhesive; in operation S13000, a mesh structure may be disposed at the vent; in operation S14000, a second adhesive may be applied between the mirror mount and the lens component; in operation S9400, the second adhesive may be cured. Therefore, the gas in the accommodating space can be exhausted more easily when the first adhesive is cured, and the reliability of the module is improved.

According to an embodiment of the application, the mesh structure is arranged at the vent hole of the mirror base.

The above description is only an embodiment of the present application and an illustration of the technical principles applied. It will be appreciated by a person skilled in the art that the scope of protection covered by the present application is not limited to the embodiments with a specific combination of the features described above, but also covers other embodiments with any combination of the features described above or their equivalents without departing from the technical idea described above. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims (10)

1. The utility model provides a sensitization module which characterized in that, sensitization module includes:

a substrate;

a photosensitive element disposed on the substrate;

the lens base is fixed on the substrate, an accommodating space for accommodating the photosensitive element is formed between the lens base and the substrate, and the lens base is provided with air holes; and

a mesh structure disposed at the vent.

2. The photosensitive module of claim 1 wherein the mirror base and the substrate are bonded to each other by a first adhesive.

3. The photosensitive module of claim 2 wherein the first adhesive is a UV thermosetting adhesive.

4. The photosensitive module of claim 1, wherein the mirror base is made of plastic.

5. The photosensitive module of claim 1, wherein the diameter of the air holes is in the range of 0.1mm to 0.7 mm.

6. The photosensitive module of claim 1, wherein the area of the mesh structure is greater than or equal to the cross-sectional area of the vent.

7. The photosensitive module of claim 1, wherein the thickness of the network is less than 0.3 mm.

8. The utility model provides a module of making a video recording, its characterized in that, the module of making a video recording includes:

the photosensitive module according to any one of claims 1 to 7;

the lens component is fixed on one side of the lens base, which is parallel to the substrate, through a second adhesive.

9. A method for manufacturing a camera module, the method comprising:

coating a first adhesive between a lens seat provided with an air hole and a substrate provided with a photosensitive element, wherein a reticular structure is arranged in the air hole;

curing the first adhesive, and forming an accommodating space for accommodating the photosensitive element by the lens base and the substrate bonded by the cured first adhesive;

coating a second adhesive between the lens seat and the lens component; and

curing the second binder.

10. A method for manufacturing a camera module, the method comprising:

coating a first adhesive between the lens seat provided with the air holes and the substrate provided with the photosensitive element;

curing the first adhesive, and forming an accommodating space for accommodating the photosensitive element by the lens base and the substrate bonded by the cured first adhesive;

arranging a net-shaped structure at the air vent;

coating a second adhesive between the lens seat and the lens component; and

curing the second binder.

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