CN113381291A - Laser base and laser - Google Patents

Laser base and laser Download PDF

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Publication number
CN113381291A
CN113381291A CN202110803248.1A CN202110803248A CN113381291A CN 113381291 A CN113381291 A CN 113381291A CN 202110803248 A CN202110803248 A CN 202110803248A CN 113381291 A CN113381291 A CN 113381291A
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CN
China
Prior art keywords
laser
lens
strip
waveguide structure
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110803248.1A
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Chinese (zh)
Inventor
钟文彪
钟文斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xinfeng Optoelectronic Technology Shenzhen Co ltd
Original Assignee
Xinfeng Optoelectronic Technology Shenzhen Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xinfeng Optoelectronic Technology Shenzhen Co ltd filed Critical Xinfeng Optoelectronic Technology Shenzhen Co ltd
Priority to CN202110803248.1A priority Critical patent/CN113381291A/en
Publication of CN113381291A publication Critical patent/CN113381291A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0085—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for modulating the output, i.e. the laser beam is modulated outside the laser cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention provides a laser base and a laser. The laser mount includes a substrate having two opposing surfaces; the substrate is connected with the baffle to form an accommodating cavity, and the accommodating cavity is used for placing a laser chip; the first surface is provided with a strip-shaped waveguide structure, and the second surface is provided with a strip-shaped bulge; and a lens; the end part of the strip-shaped bulge or the position of the baffle corresponding to the strip-shaped waveguide structure is provided with a light outlet; the lens is arranged at the light outlet hole; wherein the slab waveguide structure is configured to guide light; the lens is configured to collimate or narrow a divergence angle of the light radiated from the laser chip; or the lens is configured to focus externally incident light. The coupling of optical waveguide and lens has been realized on the one hand to this application, and on the other hand still realizes the collimation or the divergence angle that radiate the light to laser instrument emission chip narrowing, realizes the convergence to the light of external incidence again.

Description

Laser base and laser
Technical Field
The invention relates to the technical field of laser packaging, in particular to a laser base and a laser.
Background
As the optical communications industry has developed, the commonly used transmitter optical sub-assembly (TOSA) and receiver optical sub-assembly (ROSA) have formed more standardized packages, such as TO-CAN packages and BOX hermetic packages. The TO-CAN package is shaped like a cylindrical CAN and consists of a shell cap and a shell base. The BOX airtight package is mainly used for packaging high-speed optical devices for medium and long distance transmission, so as to meet the requirement of long-term service life of the devices.
However, the coupling efficiency of the lens portion in the constituent assembly is very low, whether the aforementioned TO-CAN package or BOX hermetic package. Taking a spherical lens as an example, the coupling efficiency of a sphere with a slightly larger diameter is approximately 25%, and the coupling efficiency of a sphere with a slightly smaller diameter is approximately 15%; the coupling efficiency of the non-spherical lens is slightly higher, about 35%, and the low coupling efficiency often causes the loss of power consumption of the device to be large, so that the power utilization rate of the laser chip is low. Secondly, the spatial coupling mode brings about the problem of low efficiency caused by difficult coupling.
Therefore, how to solve the problems of low coupling efficiency, large power loss, low power utilization rate, and the like is an urgent problem to be solved.
Disclosure of Invention
In view of the above, it is desirable to provide a laser base and a laser. The laser mount may include:
the substrate comprises a first surface and a second surface which are oppositely arranged;
the substrate is connected with the baffle to form an accommodating cavity, and the accommodating cavity is used for placing a laser chip; the first surface is provided with a strip-shaped waveguide structure, the second surface is provided with a strip-shaped bulge, and the strip-shaped bulge corresponds to the strip-shaped waveguide structure; and
a lens; the end part of the strip-shaped bulge or the position of the baffle corresponding to the strip-shaped waveguide structure is provided with a light outlet; the lens is arranged at the light outlet hole;
wherein the slab waveguide structure is configured to guide light;
the lens is configured to collimate or narrow a divergence angle of the light radiated from the laser chip; or
The lens is configured to focus externally incident light.
According to the laser base, the strip-shaped waveguide structure is arranged on one side of the accommodating cavity on the substrate, the end part of the strip-shaped bulge or the position of the baffle corresponding to the strip-shaped waveguide structure is provided with the light outlet, and the light outlet is provided with the lens. The strip waveguide structure is arranged in parallel to the extending direction of the substrate and is configured to guide light; the lens is configured to collimate or narrow a divergence angle of the light radiated from the laser chip; or the lens is configured to focus externally incident light. On one hand, the coupling of the optical waveguide and the lens is realized, on the other hand, the reduction or collimation of the divergence angle of the light rays radiated by the laser chip can be realized, and the convergence of the externally incident light rays can also be realized.
In one embodiment, the laser chip comprises a laser emitting chip or a laser receiving chip.
In one embodiment, the lens is formed via a molecular deposition technique or a 3D printing technique or an etching technique.
In one embodiment, the lens is a ball lens, and the ball lens is customized to the divergence angle of the laser emitting chip.
In one embodiment, the method further comprises the following steps:
sealing the cover; the size of the sealing cover is matched with that of the accommodating cavity so as to cover the accommodating cavity.
In one embodiment, a side of the cover facing away from the accommodating cavity is provided with an alignment line, and the alignment line, the axis of the strip waveguide structure and the geometric center of the lens are in the same straight line.
In one embodiment, the first surface is further provided with a label slot for adhering information of the laser chip, and the label slot is arranged adjacent to one side of the strip waveguide structure.
In one embodiment, the first surface is further provided with a through hole for the electrode of the laser chip to pass through, and the through hole is arranged adjacent to the other side of the strip waveguide structure.
Based on the same inventive concept, the present application also provides a laser, including:
a base; and
a laser chip;
wherein the base is the laser base of any one of the preceding claims.
In one embodiment, the base and the laser chip are packaged as a unitary structure.
According to the laser, the laser base is used as the base, the strip-shaped waveguide structure is arranged on one side of the accommodating cavity of the base plate, the end part of the strip-shaped protrusion or the position, corresponding to the strip-shaped waveguide structure, of the baffle is provided with the light outlet, and the lens is arranged at the light outlet. The strip waveguide structure is arranged in parallel to the extending direction of the substrate and is configured to guide light; the lens is configured to collimate or narrow a divergence angle of the light radiated from the laser chip; or the lens is configured to focus externally incident light. On one hand, the coupling of the optical waveguide and the lens is realized, on the other hand, the reduction or collimation of the divergence angle of the light rays radiated by the laser chip can be realized, and the convergence of the externally incident light rays can also be realized.
Drawings
FIG. 1 is a schematic perspective view of a laser mount without a lens assembly in an embodiment;
FIG. 2 is a front view of a laser mount without a lens assembled in one embodiment;
FIG. 3 is a rear perspective view of a laser mount without a closure assembled in one embodiment;
fig. 4 is a front view of a laser mount in another embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As the optical communications industry has developed, the commonly used transmitter optical sub-assembly (TOSA) and receiver optical sub-assembly (ROSA) have formed more standardized packages, such as TO-CAN packages and BOX hermetic packages.
And TO-CAN packages or BOX hermetic packages, which constitute assemblies in which the coupling efficiency of the lens portion is very low. Taking a spherical lens as an example, the coupling efficiency of a sphere with a slightly larger diameter is approximately 25%, and the coupling efficiency of a sphere with a slightly smaller diameter is approximately 15%; the coupling efficiency of the non-spherical lens is slightly higher, about 35%, and the low coupling efficiency often causes the loss of power consumption of the device to be large, so that the power utilization rate of the laser chip is low. Secondly, the spatial coupling mode brings about the problem of low efficiency caused by difficult coupling.
In view of the above, the present application is intended to provide a new solution to the above-mentioned technical problem, and the specific structure thereof will be described in detail in the following embodiments.
Reference may be made to fig. 1, with the assistance of fig. 2 and 3, for a schematic perspective view of a laser base provided by the application. Specifically, the laser mount provided herein may include a substrate 10, a baffle 20, and a lens 30. The shape of the substrate 10 includes, but is not limited to, rectangle, square, polygon, etc. The substrate 10 includes two oppositely disposed first surfaces (not shown) and second surfaces (not shown). The baffles 20 are disposed on the first surface, and it should be understood that the number of the baffles 20 is four, and four baffles 20 are disposed around the substrate 10, so as to form a receiving chamber (not shown) together with the substrate 10. The accommodating cavity is mainly used for accommodating a laser chip (not shown), and the laser chip in the application can be a laser emitting chip or a laser receiving chip. It should be understood that the laser emitting chip mainly radiates laser light of a predetermined wavelength by the current, and the laser receiving chip mainly receives light of a predetermined wavelength inputted from the outside.
Referring to fig. 1, and referring to fig. 3, a strip waveguide structure 110 is further disposed on the first surface of the substrate 10, and the strip waveguide structure 110 is disposed on one side of the accommodating cavity of the substrate 10, and may also be understood as being disposed as a bottom of the accommodating cavity. The strip waveguide structure 110 is disposed parallel to the extending direction of the substrate 10, and the strip waveguide structure 110 divides the substrate 10 into two parts, the areas of the two parts may be equal or unequal, and the two parts may be disposed according to actual requirements. The strip waveguide structure 110, which may also be referred to as an optical waveguide, is primarily a dielectric device that guides the propagation of light waves therein.
The stripe waveguide structure 110 of the present application is mainly a rectangular parallelepiped groove (not shown) formed on the first surface of the substrate 10, and it is understood that the shape of the groove may be other shapes, such as a prism. Further, a corresponding dielectric material may be disposed in the groove according to the refractive index relationship of the device and the occurrence condition of total reflection, and certainly, the corresponding dielectric material may not be disposed, and when not disposed, the medium for guiding the light wave is air. In particular, when the laser chip is an emitting chip, i.e. a chip radiating light, the stripe waveguide structure 110 is used to guide the light radiated by the emitting chip. When the laser chip is a receiving chip, i.e. a chip receiving light of a predetermined wavelength, the strip waveguide structure 110 is used to guide the light of the predetermined wavelength. It is understood that the guiding effect of the strip waveguide structure of the present application on light can also be set with reference to other prior arts, and will not be further described herein.
Referring to fig. 1, as well as referring to fig. 2, a strip-shaped protrusion 140 is further disposed on the second surface of the substrate 10, the strip-shaped protrusion 140 corresponds to the strip-shaped waveguide structure 110, that is, the strip-shaped protrusion 140 is disposed parallel to the extending direction of the substrate 10, the height of the strip-shaped protrusion 140 may be the same as the depth of the groove-shaped strip-shaped waveguide structure 110, in other words, the portion of the substrate 10 corresponding to the strip-shaped waveguide structure 110 protrudes outward.
Referring to fig. 1, one of the baffles 20 or the end of the strip-shaped protrusion 140 of the present application is provided with a light exit hole (not shown) corresponding to the strip-shaped waveguide structure 110, that is, the light exit hole may be disposed on any one of the four baffles 20, or may be disposed on one of the ends of the strip-shaped protrusion 140, and the end of the strip-shaped protrusion 140 is perpendicular to the extending direction of the strip-shaped protrusion 140. The lens 30 of the present application is disposed at the light exit hole, which may be circular, pentagonal, or square in shape. It will be appreciated that the shape and size (diameter) of the lens 30 is adapted to the light exit aperture. In particular, the lens 30 may be formed at the exit aperture, for example, via molecular deposition techniques or 3D printing techniques or etching techniques. Accordingly, the molecular deposition technique or the 3D printing technique or the etching technique can be referred to the description of the prior art, which is not repeated herein.
The lens 30 of the present application is configured to collimate or narrow the divergence angle of the light radiated from the laser chip; or the lens is configured to focus externally incident light. That is, when the laser chip is an emitting chip, i.e., a chip that radiates light, the lens 30 is configured to collimate or narrow the divergence angle of the light guided through the slab waveguide structure 110. The existing light loss is reduced to be below 10%, and the collimated light is further coupled into the optical fiber through the rear lens, so that the coupling efficiency of 80% is realized. Meanwhile, the divergence angle of the light narrowed by the lens 30 is reduced by more than 50% compared with the original divergence angle. When the laser chip is a receiving chip, i.e. a chip receiving light of a predetermined wavelength, the lens 30 is configured to focus externally incident light, and then transmit the light to the strip waveguide structure 110, and then guide the light to the laser receiving chip through the strip waveguide structure 110.
In one embodiment, the lens 30 may be a spherical lens or an aspherical lens, and when the lens 30 is a spherical lens, the spherical lens may be customized according to the divergence angle of the laser emitting chip.
According to the laser base, the strip-shaped waveguide structure is arranged on the first surface of the substrate, the strip-shaped protrusion is arranged on the second surface, the end part or the baffle of the strip-shaped protrusion, which corresponds to the strip-shaped waveguide structure, is provided with the light outlet, and the light outlet is provided with the lens. The strip waveguide structure is arranged in parallel to the extending direction of the substrate and is configured to guide light; the lens is configured to collimate or narrow a divergence angle of the light radiated from the laser chip; or the lens is configured to focus externally incident light. On the one hand, the coupling of the optical waveguide and the lens is realized, and on the other hand. It is also possible to realize reduction or collimation of the divergence angle of the light radiated from the laser chip, and also to realize convergence of the externally incident light.
In one embodiment, with continued reference to fig. 3, the present application further provides a label slot 130 for attaching the laser chip information on the first surface of the substrate 10, wherein the label slot 130 is disposed adjacent to one side of the stripe waveguide structure 110. The label slot 130 may be a rectangular slot with a shallow depth, a square slot, or other slot, and it is understood that the slot may be shaped according to the shape of the specific label.
Further, with continuing reference to fig. 2 and 3, the substrate 10 of the present application is further formed with a through hole 120 for passing through the electrode of the laser chip, and the through hole 120 is disposed adjacent to the other side of the stripe waveguide structure 110. That is, the tag slot 130 and the via hole 120 are disposed at both sides of the stripe waveguide structure 110.
In one embodiment, with reference to fig. 4, the laser mount of the present application may further include: a cover 40; the size of the cover 40 is matched with the size of the accommodating cavity to cover the accommodating cavity. That is, the size and dimension of the cover 40 are matched with the size and dimension of the accommodating cavity 40.
In one embodiment, referring to fig. 4, in order to facilitate the assembling of the lens 30 and the opening of the strip waveguide structure 110, the laser base of the present application further includes an alignment line 410 on a surface of the cover 40 facing away from the accommodating cavity (i.e., a surface opposite to a surface where the electrode through hole is opened), where the alignment line 410 may be a strip structure protruding outward or a strip structure recessed inward. Further, in order to achieve the function of reference positioning, the alignment line 410, the axis of the stripe waveguide structure 110 and the geometric center of the lens 30 are all in the same straight line. In other words, the geometric centers of the alignment line 410, the stripe waveguide structure 110, and the lens 30 are on the same straight line.
Based on the same inventive concept, the present application also provides a laser (not shown), which may include: a base; and a laser chip.
Wherein the base may be the laser mount of any one of the preceding claims.
Specifically, the laser chip of the present application can be a laser receiving chip or a laser emitting chip, and when the laser chip of the present application is mounted on a laser base, the mounting can be assisted by an image recognition technology.
In one embodiment, further, in order to ensure the air tightness and reliability of the package, the base using the laser base may be integrally packaged with the laser chip. I.e. the base is integrally encapsulated with the laser chip. During assembly, the laser chip can be placed in the groove, and then the alignment line on the cover and the alignment line on the back surface of the laser chip are aligned. Further, the laser chip can be placed on the laser base in an inverted mode, the ground electrode faces the through hole, then the parts are packaged into a whole, and finally the packaged laser is placed on another packaging carrier in an inverted mode.
According to the laser, the laser base is used as the base, the strip-shaped waveguide structure is arranged on the first surface of the base plate, the strip-shaped bulge is arranged on the second surface of the base plate, the light outlet is formed in the position, corresponding to the strip-shaped waveguide structure, of one of the baffles or the end part of the strip-shaped bulge, and the lens is arranged at the light outlet. The strip waveguide structure is arranged in parallel to the extending direction of the substrate and is configured to guide light; the lens is configured to collimate or narrow a divergence angle of the light radiated from the laser chip; or the lens is configured to focus externally incident light. On the one hand, the coupling of the optical waveguide and the lens is realized, and on the other hand. It is also possible to realize reduction or collimation of the divergence angle of the light radiated from the laser chip, and also to realize convergence of the externally incident light.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A laser mount, comprising:
the substrate comprises a first surface and a second surface which are oppositely arranged;
the substrate is connected with the baffle to form an accommodating cavity, and the accommodating cavity is used for placing a laser chip; the first surface is provided with a strip-shaped waveguide structure, the second surface is provided with a strip-shaped bulge, and the strip-shaped bulge corresponds to the strip-shaped waveguide structure; and
a lens; the end part of the strip-shaped bulge or the position of the baffle corresponding to the strip-shaped waveguide structure is provided with a light outlet; the lens is arranged at the light outlet hole;
wherein the slab waveguide structure is configured to guide light;
the lens is configured to collimate or narrow a divergence angle of the light radiated from the laser chip; or
The lens is configured to focus externally incident light.
2. The laser mount of claim 1, wherein the laser chip comprises a laser emitting chip or a laser receiving chip.
3. The laser mount of claim 1, wherein the lens is formed via a molecular deposition technique or a 3D printing technique or an etching technique.
4. The laser mount of claim 2, wherein the lens is a ball lens, and the ball lens is customized to the emission angle of the laser emitting chip.
5. The laser mount of claim 1, further comprising:
sealing the cover; the size of the sealing cover is matched with that of the accommodating cavity so as to cover the accommodating cavity.
6. The laser mount of claim 5, wherein a side of the cover facing away from the receiving cavity is provided with an alignment line, and the alignment line, the axis of the slab waveguide structure, and the geometric center of the lens are in the same line.
7. The laser mount of any of claims 1-6, wherein the first surface further defines a label slot for attaching information of the laser chip, the label slot being disposed adjacent to a side of the slab waveguide structure.
8. The laser mount of claim 7, wherein the first surface further defines a via for passing the laser chip electrode therethrough, the via being disposed adjacent to the other side of the slab waveguide structure.
9. A laser, characterized in that the laser comprises:
a base; and
a laser chip;
wherein the base is the laser mount of any one of claims 1-8.
10. The laser of claim 9, wherein the base is packaged as a unitary structure with the laser chip.
CN202110803248.1A 2021-07-15 2021-07-15 Laser base and laser Pending CN113381291A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110803248.1A CN113381291A (en) 2021-07-15 2021-07-15 Laser base and laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110803248.1A CN113381291A (en) 2021-07-15 2021-07-15 Laser base and laser

Publications (1)

Publication Number Publication Date
CN113381291A true CN113381291A (en) 2021-09-10

Family

ID=77582262

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110803248.1A Pending CN113381291A (en) 2021-07-15 2021-07-15 Laser base and laser

Country Status (1)

Country Link
CN (1) CN113381291A (en)

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