CN113377139A - Heat dissipation module, mobile terminal, heat dissipation method and storage medium - Google Patents
Heat dissipation module, mobile terminal, heat dissipation method and storage medium Download PDFInfo
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- CN113377139A CN113377139A CN202010112582.8A CN202010112582A CN113377139A CN 113377139 A CN113377139 A CN 113377139A CN 202010112582 A CN202010112582 A CN 202010112582A CN 113377139 A CN113377139 A CN 113377139A
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- mobile terminal
- piezoelectric element
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2250/00—Details of telephonic subscriber devices
- H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The disclosure relates to a heat dissipation module, a mobile terminal, a heat dissipation method and a storage medium. The heat dissipation module includes: the backlight driving chip is used for outputting a high-voltage driving signal; the first switch circuit is connected with the backlight driving chip and used for converting the high-voltage driving signal into a high-voltage pulse signal by periodically switching a conducting state and a disconnecting state; and the piezoelectric element is connected with the first switch circuit and is driven by the high-voltage pulse signal to generate periodic deformation and generate wind pressure. The multiplexing backlight driving chip provides a high-voltage signal, so that a driving circuit of the piezoelectric element can be simplified, the hardware cost of the driving circuit is reduced, and the volume of the driving circuit is reduced.
Description
Technical Field
The present disclosure relates to the field of electronic technologies, and in particular, to a driving circuit, a mobile terminal, a heat dissipation method, and a storage medium.
Background
As the functions of the mobile terminal become more and more abundant, the energy consumption of the mobile terminal also becomes larger and larger. The energy consumption is large, and the heat generation of the mobile terminal is high. In the related art, various heat dissipation schemes of the mobile terminal are proposed, such as an air cooling structure, such as a fan, and a water cooling structure, which uses water as a heat dissipation medium.
However, in the conventional heat dissipation structure, the volume of the air cooling structure is large, which is not favorable for the lightness and the thinness of the mobile terminal, or the driving structure of the air cooling structure in the mobile terminal is complicated, which results in high hardware cost.
The liquid cooling structure also has the problems of large volume and the like.
Disclosure of Invention
The disclosure provides a heat dissipation module, a mobile terminal, a heat dissipation method and a storage medium.
A first aspect of the embodiments of the present disclosure provides a driving circuit, including:
the backlight driving chip is used for outputting a high-voltage driving signal;
the first switch circuit is connected with the backlight driving chip and used for converting the high-voltage driving signal into a high-voltage pulse signal by periodically switching a conducting state and a disconnecting state;
and the piezoelectric element is connected with the first switch circuit and is driven by the high-voltage pulse signal to generate periodic deformation and generate wind pressure.
Based on the scheme, the backlight driving chip is further used for outputting a high-voltage driving signal to the display module.
Based on the above scheme, the backlight driving chip includes:
the public anode is respectively connected with the input ends of the N light source strips in the backlight module; wherein N is a positive integer equal to or greater than 2;
n cathodes, wherein one cathode is used for being connected with the output end of one light source strip;
the first switch circuit is connected with the common anode of the backlight driving chip.
Based on the above scheme, the first switch circuit includes:
the first switch module is in a working state when being switched on, and the driving circuit is in a non-working state when being switched off;
and the second switch module is connected with the first switch module and is periodically switched between the on state and the off state when the heat dissipation module is in the working state.
A second aspect of an embodiment of the present application provides a mobile terminal, including:
the heat dissipation module provided by any of the above technical solutions of the first aspect;
and the processing module is connected with the first switch circuit of the heat dissipation module and used for sending a first control signal for controlling the first switch circuit to be switched between a conducting state and a disconnecting state to the first switch circuit.
Based on the above scheme, the mobile terminal further includes:
a heat generating module;
wherein, the piezoelectric element module is adjacent to the heat generating module.
Based on the above scheme, the heat generating module comprises at least one of the following components:
the processing module;
a power management chip;
a charging management chip;
and a charging interface.
Based on the above scheme, the processing module is further configured to send a second control signal to the backlight driving chip of the heat dissipation module, where the second control signal is switched between a working state and a non-working state.
Based on the above, the piezoelectric element includes: at least two of which are connected in parallel; different voltage elements connected with different output ends of backlight driving chip of the heat dissipation module
The mobile terminal further includes:
the second switch circuit is positioned between the backlight driving chip and the piezoelectric element and is used for switching on the backlight driving chip and the corresponding piezoelectric element or switching off the backlight driving chip and the corresponding piezoelectric element;
and the processing module is connected with the second switch circuit and used for outputting a third control signal for controlling the second switch element to be switched on or switched off.
A third aspect of the embodiments of the present application provides a heat dissipation method, which is applied to a mobile terminal as provided in the second aspect, and the method includes:
determining that a starting condition of the heat dissipation assembly is reached;
outputting a first control signal to a first switch circuit, wherein the first control signal is used for controlling the first switch circuit to periodically switch a conducting state and a disconnecting state, and converting a high-voltage driving signal output by a backlight driving chip into a high-voltage pulse signal; the high-voltage pulse signal is used for driving the piezoelectric element to generate periodic deformation and generate wind pressure.
Based on the above scheme, the determining that the starting condition of the heat dissipation assembly is reached includes:
and when the temperature in the mobile terminal reaches a first threshold value, determining that the starting condition of the heat dissipation module is reached.
Based on the above scheme, the method further comprises:
outputting a second control signal to the first switch circuit, wherein the second control signal is used for controlling a first switch module of the first switch circuit to be in a conducting state when a starting condition of the heat dissipation module is reached; when the starting condition of the heat dissipation module is not met, controlling a second switch module of the first switch circuit to be in a disconnected state; the first control signal is used for controlling a second switch module of the first switch circuit to periodically switch the on state and the off state when the first switch module is in the on state, and converting a high-voltage driving signal output by a backlight driving chip into a high-voltage pulse signal; the high-voltage pulse signal is used for driving the piezoelectric element to generate periodic deformation and generate wind pressure.
Based on the above scheme, the outputting the first control signal to the first switch circuit includes:
determining the duty ratio of the first control signal according to the temperature of the mobile terminal;
outputting the first control signal to the first switching circuit according to the determined duty ratio; wherein the duty cycle of the pulse signal is the same as the duty cycle of the first control signal, and the duty cycle of the pulse signal is as follows: and controlling the time ratio of expansion and contraction in the periodical deformation of the piezoelectric element.
Based on the above, the piezoelectric element includes: at least two of which are connected in parallel; the different voltage elements are connected with different output ends of the backlight driving chip set;
the method further comprises the following steps:
outputting a third control signal to the second switching circuit; the third control signal is used for controlling the connection between the backlight driving chip circuit and the piezoelectric element to be switched on or off.
A fourth aspect of the embodiments of the present application provides a non-transitory computer-readable storage medium, where instructions in the storage medium, when executed by a processor of a mobile terminal, enable the mobile terminal to implement the heat dissipation method according to any of the foregoing technical solutions of the third aspect.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: the multiplexing backlight driving chip provides high voltage, and the first switch circuit is combined to provide high-voltage pulse signals for the piezoelectric body to drive the piezoelectric body to deform periodically, so that the driving circuit of the piezoelectric element can be simplified, the hardware cost of the driving circuit is reduced, and the volume of the driving circuit is reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a block diagram illustrating a heat dissipation module according to an exemplary embodiment;
FIG. 2 is a block diagram illustrating a heat dissipation module according to an exemplary embodiment;
FIG. 3A is a block diagram illustrating the structure of a mobile terminal according to one exemplary embodiment;
FIG. 3B is a block diagram illustrating the structure of a mobile terminal according to one exemplary embodiment;
FIG. 4 is a block diagram illustrating the structure of a mobile terminal according to one exemplary embodiment;
FIG. 5 is a block diagram illustrating the structure of a mobile terminal according to one exemplary embodiment;
FIG. 6 is a schematic flow diagram illustrating a method of dissipating heat in accordance with an exemplary embodiment;
FIG. 7 is a schematic block diagram illustrating a heat dissipation device in accordance with an exemplary embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
As shown in fig. 1, the present embodiment provides a heat dissipation module, including:
the backlight driving chip 11 is used for outputting a high-voltage driving signal;
a first switch circuit 12 connected to the backlight driver chip 11, connected to the backlight driver chip, and configured to convert the high-voltage driving signal into a high-voltage pulse signal by periodically switching an on state and an off state;
and the piezoelectric element 13 is connected with the first switch circuit 12, and is driven by the high-voltage pulse signal to generate periodic deformation and generate wind pressure.
For example, the piezoelectric element may include: a piezoelectric crystal that deforms when an electrical current is applied. After the piezoelectric crystal is removed by the applied current, the piezoelectric crystal returns to a natural state; thus, the piezoelectric element expands and contracts. The contraction or expansion of the piezoelectric crystal can change the size of the space in which the piezoelectric element is located, thereby generating wind pressure. Thus, when the piezoelectric element is repeatedly expanded and contracted, the air volume is continuously generated, and heat dissipation is realized.
But requires a higher differential pressure change as the piezoelectric crystal expands and contracts. The voltage provided by the power supply in a typical mobile terminal is relatively low. A special boost circuit is required for boosting. So, adopt boost circuit to constitute heat dissipation module can make the interior electronic components of mobile terminal increase, and the structure becomes complicated, promotes mobile terminal's hardware cost on the one hand, and on the other hand makes mobile terminal's volume increase. In the embodiment of the present application, the backlight driving chip 11 of the heat dissipation module is a driving chip that multiplexes a light source in the mobile terminal. In general, light source light needs to emit light, and a driving chip is required to boost a power supply voltage and then supply the boosted power supply voltage to the light source light. In the embodiment of the present application, the multiplexing backlight driving chip 11 provides a high voltage driving signal, obtains a large high voltage direct current signal (i.e. the aforementioned high voltage driving signal) with continuous output, and then converts the high voltage driving signal into a high voltage pulse signal through the switching state (i.e. the switching between the on state and the off state) of the first switching circuit. The high-voltage pulse signal can drive the piezoelectric body to deform periodically, for example, the expansion and the contraction are switched periodically, so that wind pressure is generated, and air cooling and heat dissipation are realized.
In the present embodiment, the piezoelectric element needs to be repeatedly expanded and contracted, and thus needs to be converted into a high-voltage pulse signal. The high voltage pulse signal may be: the voltage is larger than the voltage threshold value, and the duty ratio is the voltage signal or the current signal of the duty ratio threshold value.
When the first switch circuit 12 is in a conducting state, the first switch circuit 12 outputs the high-voltage driving signal of the backlight driving chip 11, so as to form a first level of the high-voltage pulse signal; when the first switch circuit 12 is in an off state, the high voltage driving voltage of the backlight driving chip 11 is not output, thereby forming a second level of the pulse signal. The second level may be 0V, and the first level may be any voltage value higher than 0V. For example, the first level of the high voltage pulse signal may be a pulse signal with a voltage higher than that in the mobile terminal, such as 12V or 24V, and the like, and 3.3V or 5.5V, and the like. Of course, this is merely an example of the high voltage pulse signal, and the specific implementation is not limited to this example.
The driving chip of the light source in the mobile terminal usually comprises a booster circuit, so that the backlight source backlight driving chip 11 in the mobile terminal is multiplexed and combined with the first switch circuit, a high-voltage pulse signal for driving the piezoelectric body to deform periodically can be generated simply and conveniently, the heat dissipation module of the piezoelectric element can be simplified, the hardware cost of the heat dissipation module is reduced, and the size of the heat dissipation module is reduced.
In some embodiments, the driving chip of the light source is: the backlight driving chip of the liquid crystal display module.
The backlight driving chip is a heat dissipation module of a backlight source of the liquid crystal display module. The output voltage of the backlight driving chip of the liquid crystal display module can be up to 12V or more, even before 18-22V, so that the first switch circuit 12 can form a pulse signal with high level based on the voltage output by the backlight driving chip.
In some embodiments, the backlight of the liquid crystal display module comprises: n light source strips, wherein N is a positive integer equal to or greater than 2;
the backlight driving chip comprises:
the common anode is respectively connected with the input ends of the N light source strips;
n cathodes, wherein one cathode is connected with the output end of one light source strip;
the first switch circuit 12 is connected to the common anode of the backlight driver chip.
For example, a light source bar may have one or more point light sources thereon, which may include: an OLED lamp.
The heat dissipation module comprises a common anode or N cathodes, and the voltage of the common anode is a floating voltage which is usually kept fixed, for example, fixed at 12V, 18V or 24V. The specific voltage value of the common anode is related to the number of point light sources contained in one light source strip, and generally, the larger the number of point light sources contained in the light source strip is, the larger the voltage of the common anode is.
The voltage of the common anode is greater than the voltage of the cathode.
Different light source strips are connected to the cathodes of the backlight driving chip, the voltages applied to the cathodes connected with the two light source strips are slightly different, and the brightness difference of the light source strips with different conduction characteristics is maintained within a preset range through adjustment of the voltages applied to the cathodes.
In this way, by using the voltage of the common anode as the output voltage of the backlight driving chip 11, the stability of the driving voltage of the preceding stage can be maintained, and the stability of the deformation amplitude of the piezoelectric element can be controlled.
In some embodiments, the high voltage driving signal may be generated by using a driving chip of an OLED lamp in an OLED display screen, or by using a driving chip of an illumination light source instead of the backlight driving chip.
For example, if the display screen included in the mobile terminal is an OLED display screen, the pixels included in the OLED display screen are OLED lamps.
The mobile terminal may further include: the lighting source is also provided with a driving chip which is also connected with the power supply and can boost the output voltage of the power supply.
In some embodiments, as shown in fig. 2, the first switching circuit 12 includes:
the first switch module 121, when the first switch module 121 is turned on, the heat dissipation module is in an operating state, and when the first switch module 121 is turned off, the heat dissipation module is in a non-operating state;
and the second switch module 122 is connected to the first switch module 121, and periodically switches between the on state and the off state when the heat dissipation module is in the on-off state.
The first switch circuit 12 includes two stages of switch modules, and the first switch module is used to control whether the heat dissipation module is in a working state. Under the working state, the first switch circuit outputs a high-voltage pulse signal. If the heat radiation module is in a non-working state, the heat radiation module does not output the high-voltage pulse signal.
The second switch module 122 is configured to generate the high-voltage pulse signal by switching between an on state and an off state when the first switch module 121 is in the on state.
As shown in fig. 3A, the present embodiment provides a mobile terminal, including:
the heat dissipation module provided by any of the above technical schemes;
the processing module 32 is connected with the first switch circuit of the heat dissipation module 31, and is configured to send a first control signal to the first switch circuit to control the first switch circuit to switch between an on state and an off state, so as to generate a high-voltage pulse signal;
the piezoelectric element of the heat dissipation module 31 is configured to deform periodically under the action of the high-voltage pulse signal to generate wind pressure.
The heat dissipation module 31 reuses the existing backlight driving chip in the mobile module, so that the structure of the heat dissipation module 31 is simplified, the hardware cost is reduced, and the space of the mobile terminal is saved.
Referring to fig. 3B, the mobile terminal further includes:
a housing 30;
a power source 33 located within the housing 30;
the heat dissipation module 31 provided by any of the foregoing technical solutions is located in the housing 30; wherein, the input end of the heat dissipation module 31 is connected with the power supply 33;
and the processing module 32 is connected with the first switch circuit 12 of the heat dissipation module 31, and is used for providing a first control signal for switching the first switch circuit 12 between an on state and an off state.
The housing 30 may be a terminal housing, such as a cell phone housing, a tablet housing, or a housing of a wearable device.
The power source 33 may be located within the housing 30. The power supply 33 may include: batteries, such as lithium batteries, and the like.
The heat dissipation module 31 is the heat dissipation module 31 according to any of the embodiments described above.
At this time, the piezoelectric element module 35 generates a pulse signal using a driving chip of a light source in the mobile terminal.
The piezoelectric element has the characteristic of small volume relative to air cooling devices such as fans and the like.
And the heat dissipation module 31 reuses the existing driving chip of the light source in the mobile module, so that the structure of the heat dissipation module 31 is simplified, the hardware cost is reduced, and the space of the mobile terminal is saved.
In some embodiments, the mobile terminal further comprises: a heat generating module 36; the piezoelectric element module 35 is disposed adjacent to the heat generating module 36.
The heat generated by the heat generating module 36 in the mobile terminal is concentrated around the heat generating module, so that the piezoelectric element module 35 and the heat generating module 36 are arranged adjacently, and high-efficiency heat dissipation can be realized.
The housing 30 is provided with heat dissipation holes for dissipating heat by air convection.
For example, the heat generating module 36 includes at least one of:
the processing module 32, such as a Central Processing Unit (CPU), a microprocessor unit (MPU), and an embedded processor (EC);
a Power supply 33 Management chip (PM);
a charge Management chip (Power Management incorporated, PMIC);
and a charging interface. The charging interface may be a USB interface, but is not limited to the USB interface.
As shown in fig. 4, the piezoelectric element module may also be referred to as a micro-piezoelectric transducer. The Central Processing Unit (CPU) in the mobile terminal as described in 4 is connected to the heat dissipation module as a processing module for controlling the heat dissipation module; the PMIC is used as a power management chip and is connected with a power supply and the heat dissipation module. The micro-piezoelectric transducer may be provided as a piezo element module at the CPU or at the interface. The interface may include: a power interface or an audio interface, etc.
Fig. 5 illustrates another mobile terminal, including:
CPU，
PMIC connected with CPU;
an LCD display panel;
a backlight driving chip of the LCD;
the PMIC supplies power to the backlight driving chip, and the backlight driving chip of the LCD outputs a high-voltage signal after boosting; the driving switch is the first light-switching circuit, and a backlight driving chip of the LCD generates a pulse signal according to a pulse period and then inputs the pulse signal to the piezoelectric element module.
The high-voltage signal output by the backlight driving chip of the LCD is displayed by the LCD display panel of the user at the same time.
In some embodiments, the heat generating module 36 may further include: a storage module. The memory module may include various memories, and the memory may generate heat due to power consumption caused by repeatedly writing and reading data.
In some embodiments, the processing module 32 is further configured to send a second control signal to the heat dissipation module 31 to switch between an operating state and a non-operating state.
For example, when the temperature of the mobile terminal is high, the piezoelectric element needs to dissipate heat through its own deformation. When the temperature of the mobile terminal is lower, the piezoelectric element is not required to dissipate heat through self deformation, so that the power consumption of the piezoelectric element deformation is reduced and the standby time of the mobile terminal is prolonged under the condition that the driving element enters a non-working state.
In some embodiments, the piezoelectric element comprises: at least two of which are connected in parallel; different voltage elements connected to different output terminals of the heat dissipation module 31; the mobile terminal further includes: the second switch circuit is located between the heat dissipation module 31 and the piezoelectric element, and is used for conducting the heat dissipation module 31 and the corresponding piezoelectric element, or disconnecting the heat dissipation module 31 and the corresponding piezoelectric element; the processing module 32 is connected to the second switch circuit, and is configured to output a third control signal for controlling the second switch element to be turned on or off.
The piezoelectric elements are individually disposed and connected to different output terminals of the heat dissipation module 31. By introducing the second switch circuit, whether each piezoelectric element works under the pulse signal provided by the heat dissipation module 31 can be controlled individually.
Because different piezoelectric elements are located at different positions, the wind direction control can be realized through the on-off control of the second switch circuit. For example, if the positions of the piezoelectric element a and the piezoelectric element B are different, when the piezoelectric element a and the heat dissipation module 31 are conducted, the piezoelectric element a is deformed to generate wind pressure outside the housing 30 at the position thereof, and thus the wind direction is diffused outward from the piezoelectric element a or blown toward the piezoelectric element a. When the piezoelectric element B is conducted with the heat dissipation module 31, the piezoelectric element B deforms to form wind pressure with the outside of the housing 30 at the position thereof, so that the wind direction is diffused outward from the piezoelectric element B or blown toward the piezoelectric element B, thereby realizing the direction control.
As shown in fig. 6, the present embodiment provides a heat dissipation method applied in a mobile terminal including a heat dissipation module, including:
s21: determining that a starting condition of the heat dissipation assembly is reached;
s22: outputting a first control signal to a first switch circuit, wherein the first control signal is used for controlling the first switch circuit to periodically switch a conducting state and a disconnecting state, and converting a high-voltage driving signal output by a backlight driving chip into a high-voltage pulse signal; the high-voltage pulse signal is used for driving the piezoelectric element to generate periodic deformation and generate wind pressure.
In the embodiment of the application, the driving chip of the light source in the terminal is used as a driving front-stage circuit of the heat dissipation module of the piezoelectric element to generate a high-voltage direct current signal required by a pulse signal. The first switch circuit in the heat dissipation module is turned on or off to generate a pulse signal to supply to the piezoelectric element, so as to realize air-cooling heat dissipation.
In some cases, if the temperature of the mobile terminal is low, the piezoelectric element does not need to work, and the processing module generates the second control signal according to the temperature of the terminal. For example, a temperature sensor is provided in the mobile terminal to detect the temperature of the mobile terminal.
In some embodiments, the S21 may include: and when the temperature in the mobile terminal reaches a first threshold value, determining that the starting condition of the heat dissipation module is reached.
The first threshold may be a predetermined temperature threshold, for example, the first threshold may be 40 degrees, 45 degrees, or 50 degrees. Therefore, when the temperature in the terminal is higher, the starting condition of the heat dissipation module can be considered to be met, and the heat dissipation of the heat dissipation module is started.
In some embodiments, the method further comprises:
outputting a second control signal to the first switch circuit, wherein the second control signal is used for controlling a first switch module of the first switch circuit to be in a conducting state when a starting condition of the heat dissipation module is reached; and when the starting condition of the heat dissipation module is not reached, the second switch module of the first switch circuit is controlled to be in a disconnected state.
The first control signal is used for controlling a second switch module of the first switch circuit to periodically switch the on state and the off state when the first switch module is in the on state, and converting a high-voltage driving signal output by a backlight driving chip into a high-voltage pulse signal; the high-voltage pulse signal is used for driving the piezoelectric element to generate periodic deformation and generate wind pressure.
When the temperature is higher than the first threshold, the processing module of the terminal generates the second control signal for controlling the first switch module to be in a conducting state; and when the temperature is less than or equal to the first threshold, a processing module of the terminal generates the second control signal for controlling the first switch module to be in a disconnected state.
In some embodiments, the S22 may include:
determining the duty ratio of the first control signal according to the temperature of the mobile terminal;
outputting the first control signal to the first switching circuit according to the determined duty ratio; wherein the duty cycle of the pulse signal is the same as the duty cycle of the first control signal, and the duty cycle of the pulse signal is as follows: and controlling the time ratio of expansion and contraction in the periodical deformation of the piezoelectric element.
In some embodiments, the pulse signals with different duty cycles cause different wind forces to be formed by the expansion and contraction of the piezoelectric element.
The duty ratio can lead the piezoelectric element to obtain different current values, so that the wind power is controlled by controlling the deformation amplitude of the piezoelectric element.
In some embodiments, the wind power can also be controlled by adjusting the voltage value of the high-voltage pulse signal.
In some embodiments, the piezoelectric element comprises: at least two in parallel. Different voltage elements are connected with different output ends of the heat dissipation module;
the method further comprises the following steps:
outputting a third control signal to the second switching circuit; the third control signal is used for controlling the connection between the backlight driving chip circuit and the piezoelectric element to be switched on or off.
For example, different piezoelectricity distributes around different heat production modules, and some heat production modules need the heat dissipation at a moment, and some need not the heat dissipation to can control the operating condition of the piezoelectric element of different positions department, realize wind direction control, thereby realize radiating accurate control.
In some embodiments, the number of the piezoelectric elements in the working state can be controlled, so that the wind power can be controlled when the heat is dissipated in the whole mobile terminal.
Several specific examples are provided below in connection with any of the embodiments described above:
example 1:
referring to fig. 4 and 5, the present example provides a heat dissipation apparatus, which uses micro-piezoelectric technology to generate wind pressure to take away heat to solve a heat dissipation problem, for example, solve a heat dissipation problem of a smart phone in a large power consumption scene such as charging, gaming, and high performance modes. The heat dissipating double-fuselage includes: processor, power supply, drive circuit and micro-piezoelectric transducer.
(1) The processor and power supply are responsible for control, communication, and power delivery.
(2) The driving circuit is responsible for generating a high-voltage pulse signal and transmitting the high-voltage pulse signal to the micro-piezoelectric transducer.
(3) Micro-piezoelectric transducer, it controls one or more piezoelectric element module, takes place deformation through signal control piezoelectric element, produces the wind pressure through deformation, size and the direction of control wind pressure that can be accurate to according to detecting the hot spot, adjust the wind direction.
The piezoelectric element module employs one or more piezoelectric elements, which may include, but are not limited to, piezoelectric crystals, which are biased inwardly when an electrical current is applied to the piezoelectric crystals. When the current is interrupted, the piezoelectric crystal will spring back to its original position, and when the current is restored again, the crystal will extend outward.
The piezoelectric element can contract under the control of a signal, and then the piezoelectric element begins to extend outwards to push air to generate wind pressure, so that stable air flow is repeatedly formed.
The micro-piezoelectric technical scheme takes away heat through stably controlling the size and the direction of wind pressure, and solves the problem of heat dissipation. The micro-piezoelectric has lower power consumption and is a high cost performance scheme.
Example 2:
the present example is a mobile terminal by installing a heat dissipation system at a heat generating device location such as a CPU and PMIC. The mobile terminal may include the heat dissipation device of example 1. The heat dissipation device can be assembled at the following positions:
(1): the heat dissipation device is assembled near an IC (integrated circuit) with large heat generation, such as a CPU (processor), a PMI (charge management chip), a PM (power management chip) and the like, so that the heat dissipation problem is solved, and the performance is improved.
(2): the assembly is at the interface that charges, can solve the heat dissipation problem when charging.
Example 3:
the present example provides a driving circuit of the piezoelectric element shown in example 1. The driving circuit needs to generate a high-voltage pulse signal, and a backlight driving chip of a Liquid Crystal Display (LCD) on the mobile phone also outputs a high-voltage signal (generally 20V-40V). Therefore, the present example can innovatively adopt the backlight chip of the LCD as the front stage of the driving circuit to generate the high voltage signal, and then add a first switching circuit of the switching rear stage to form the driving circuit of the whole micro-piezoelectric transducer.
Therefore, a high-voltage signal generated by the micro-piezoelectric transduction preceding stage can be used for generating a pulse voltage signal through a rear-stage circuit of the micro-piezoelectric transduction driving switch, and the pulse voltage signal is supplied to the micro-piezoelectric transducer to generate a wind pressure airflow so as to achieve a heat dissipation effect.
The backlight driving chip of the LCD is multiplexed, so that a high-voltage signal can be provided, and the cost of an additional high-voltage chip is saved.
Fig. 7 is a block diagram illustrating a heat dissipation device 800 according to an exemplary embodiment. For example, the apparatus 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, an exercise device, a personal digital assistant, and the like.
Referring to fig. 7, the apparatus 800 may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, and a communication component 816.
The processing component 802 generally controls overall operation of the device 800, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing components 802 may include one or more processors 820 to execute instructions to perform all or a portion of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interaction between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.
The memory 804 is configured to store various types of data to support operation at the device 800. Examples of such data include instructions for any application or method operating on device 800, contact data, phonebook data, messages, pictures, videos, and so forth. The memory 804 may be implemented by any type or combination of volatile or non-volatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.
The multimedia component 808 includes a screen that provides an output interface between the device 800 and a user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundary of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front facing camera and/or a rear facing camera. The front-facing camera and/or the rear-facing camera may receive external multimedia data when the device 800 is in an operating mode, such as a shooting mode or a video mode. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.
The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio signals when the apparatus 800 is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.
The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.
The sensor assembly 814 includes one or more sensors for providing various aspects of state assessment for the device 800. For example, the sensor assembly 814 may detect the open/closed state of the device 800, the relative positioning of the components, such as a display and keypad of the apparatus 800, the sensor assembly 814 may also detect a change in position of the apparatus 800 or a component of the apparatus 800, the presence or absence of user contact with the apparatus 800, orientation or acceleration/deceleration of the apparatus 800, and a change in temperature of the apparatus 800. Sensor assembly 814 may include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.
The communication component 816 is configured to facilitate communications between the apparatus 800 and other devices in a wired or wireless manner. The device 800 may access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 further includes a Near Field Communication (NFC) module to facilitate short-range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, Ultra Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.
In an exemplary embodiment, the apparatus 800 may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described methods.
In an exemplary embodiment, a non-transitory computer-readable storage medium comprising instructions, such as the memory 804 comprising instructions, executable by the processor 820 of the device 800 to perform the above-described method is also provided. For example, the non-transitory computer readable storage medium may be a ROM, a Random Access Memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.
Embodiments of the present disclosure provide a non-transitory computer-readable storage medium, which may be referred to simply as a storage medium. The instructions in the storage medium, when executed by a processor of a mobile terminal, enable the mobile terminal to perform a method of dissipating heat, the method comprising:
determining that a starting condition of the heat dissipation assembly is reached;
outputting a first control signal to a first switch circuit, wherein the first control signal is used for controlling the first switch circuit to periodically switch a conducting state and a disconnecting state, and converting a high-voltage driving signal output by a backlight driving chip into a high-voltage pulse signal; the high-voltage pulse signal is used for driving the piezoelectric element to generate periodic deformation and generate wind pressure.
In some embodiments, the determining that the activation condition of the heat dissipation assembly is reached includes:
and when the temperature in the mobile terminal reaches a first threshold value, determining that the starting condition of the heat dissipation module is reached.
In some embodiments, the method further comprises:
outputting a second control signal to the first switch circuit, wherein the second control signal is used for controlling a first switch module of the first switch circuit to be in a conducting state when a starting condition of the heat dissipation module is reached; when the starting condition of the heat dissipation module is not met, controlling a second switch module of the first switch circuit to be in a disconnected state; the first control signal is used for controlling a second switch module of the first switch circuit to periodically switch the on state and the off state when the first switch module is in the on state, and converting a high-voltage driving signal output by a backlight driving chip into a high-voltage pulse signal; the high-voltage pulse signal is used for driving the piezoelectric element to generate periodic deformation and generate wind pressure.
In some embodiments, the outputting the first control signal to the first switching circuit comprises:
determining the duty ratio of the first control signal according to the temperature of the mobile terminal;
outputting the first control signal to the first switching circuit according to the determined duty ratio; wherein the duty cycle of the pulse signal is the same as the duty cycle of the first control signal, and the duty cycle of the pulse signal is as follows: and controlling the time ratio of expansion and contraction in the periodical deformation of the piezoelectric element.
In some embodiments, the piezoelectric element comprises: at least two of which are connected in parallel; the different voltage elements are connected with different output ends of the backlight driving chip set;
the method further comprises the following steps:
outputting a third control signal to the second switching circuit; the third control signal is used for controlling the connection between the backlight driving chip circuit and the piezoelectric element to be switched on or off.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (15)
1. A heat dissipation module, comprising:
the backlight driving chip is used for outputting a high-voltage driving signal;
the first switch circuit is connected with the backlight driving chip and used for converting the high-voltage driving signal into a high-voltage pulse signal by periodically switching a conducting state and a disconnecting state;
and the piezoelectric element is connected with the first switch circuit and is driven by the high-voltage pulse signal to generate periodic deformation and generate wind pressure.
2. The heat dissipation module of claim 1, wherein the backlight driver chip is further configured to output a high voltage driving signal to the display module.
3. The heat dissipation module of claim 2,
the backlight driving chip comprises:
the public anode is respectively connected with the input ends of the N light source strips in the backlight module; wherein N is a positive integer equal to or greater than 2;
n cathodes, wherein one cathode is used for being connected with the output end of one light source strip;
the first switch circuit is connected with the common anode of the backlight driving chip.
4. The heat dissipation module of claim 1, wherein the first switching circuit comprises:
the first switch module is in a working state when being switched on, and the driving circuit is in a non-working state when being switched off;
and the second switch module is connected with the first switch module, and periodically switches between the on state and the off state when the heat dissipation module is in the working state.
5. A mobile terminal, comprising:
the heat dissipation module as claimed in any one of claims 1 to 4;
and the processing module is connected with the first switch circuit of the heat dissipation module and used for sending a first control signal for controlling the first switch circuit to be switched between a conducting state and a disconnecting state to the first switch circuit.
6. The mobile terminal of claim 5, wherein the mobile terminal further comprises:
a heat generating module;
wherein, the piezoelectric element module is adjacent to the heat generating module.
7. The mobile terminal of claim 6, wherein the heat generating module comprises at least one of:
the processing module;
a power management chip;
a charging management chip;
and a charging interface.
8. The mobile terminal according to claim 5, wherein the processing module is further configured to send a second control signal to the backlight driver chip of the heat sink module to switch between an active state and an inactive state.
9. The mobile terminal of claim 5, wherein the piezoelectric element comprises: at least two of which are connected in parallel; the different voltage elements are connected with different output ends of the backlight driving chip of the heat dissipation module;
the mobile terminal further includes:
the second switch circuit is positioned between the backlight driving chip and the piezoelectric element and is used for switching on the backlight driving chip and the corresponding piezoelectric element or switching off the backlight driving chip and the corresponding piezoelectric element;
and the processing module is connected with the second switch circuit and used for outputting a third control signal for controlling the second switch element to be switched on or switched off.
10. A heat dissipation method applied to the mobile terminal of claim 5, the method comprising:
determining that a starting condition of the heat dissipation assembly is reached;
outputting a first control signal to a first switch circuit, wherein the first control signal is used for controlling the first switch circuit to periodically switch a conducting state and a disconnecting state, and converting a high-voltage driving signal output by a backlight driving chip into a high-voltage pulse signal; the high-voltage pulse signal is used for driving the piezoelectric element to generate periodic deformation and generate wind pressure.
11. The method of claim 10, wherein the determining that the activation condition of the heat dissipation assembly is reached comprises:
and when the temperature in the mobile terminal reaches a first threshold value, determining that the starting condition of the heat dissipation module is reached.
12. The method of claim 11, further comprising:
outputting a second control signal to the first switch circuit, wherein the second control signal is used for controlling a first switch module of the first switch circuit to be in a conducting state when a starting condition of the heat dissipation module is reached; when the starting condition of the heat dissipation module is not met, controlling a second switch module of the first switch circuit to be in a disconnected state; the first control signal is used for controlling a second switch module of the first switch circuit to periodically switch the on state and the off state when the first switch module is in the on state, and converting a high-voltage driving signal output by a backlight driving chip into a high-voltage pulse signal; the high-voltage pulse signal is used for driving the piezoelectric element to generate periodic deformation and generate wind pressure.
13. The method according to any one of claims 10 to 12,
the outputting of the first control signal to the first switching circuit includes:
determining the duty ratio of the first control signal according to the temperature of the mobile terminal;
outputting the first control signal to the first switching circuit according to the determined duty ratio; wherein the duty cycle of the pulse signal is the same as the duty cycle of the first control signal, and the duty cycle of the pulse signal is as follows: and controlling the time ratio of expansion and contraction in the periodical deformation of the piezoelectric element.
14. The method of any one of claims 10 to 12, wherein the piezoelectric element comprises: at least two of which are connected in parallel; the different voltage elements are connected with different output ends of the backlight driving chip set;
the method further comprises the following steps:
outputting a third control signal to the second switching circuit; the third control signal is used for controlling the connection between the backlight driving chip circuit and the piezoelectric element to be switched on or off.
15. A non-transitory computer readable storage medium having instructions therein which, when executed by a processor of a mobile terminal, enable the mobile terminal to perform the method provided by any of claims 10 to 14.
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| CN113377139B (en) | 2022-07-08 |
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