CN113372512A - Photocuring resin for wind power and corresponding preparation method thereof - Google Patents
Photocuring resin for wind power and corresponding preparation method thereof Download PDFInfo
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- CN113372512A CN113372512A CN202110753382.5A CN202110753382A CN113372512A CN 113372512 A CN113372512 A CN 113372512A CN 202110753382 A CN202110753382 A CN 202110753382A CN 113372512 A CN113372512 A CN 113372512A
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- epoxy acrylate
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- 239000011347 resin Substances 0.000 title claims abstract description 51
- 229920005989 resin Polymers 0.000 title claims abstract description 51
- 238000000016 photochemical curing Methods 0.000 title claims description 11
- 238000002360 preparation method Methods 0.000 title claims description 8
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims abstract description 63
- 239000003365 glass fiber Substances 0.000 claims abstract description 16
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 claims abstract description 10
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims abstract description 8
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 claims abstract description 7
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000002994 raw material Substances 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 12
- 238000010248 power generation Methods 0.000 claims description 11
- 239000000178 monomer Substances 0.000 claims description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 4
- -1 modified bisphenol A epoxy acrylate Chemical class 0.000 claims description 4
- 230000001588 bifunctional effect Effects 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 2
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 238000009661 fatigue test Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 238000001723 curing Methods 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 10
- 239000004925 Acrylic resin Substances 0.000 description 6
- 229920000178 Acrylic resin Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000007865 diluting Methods 0.000 description 4
- OTRIMLCPYJAPPD-UHFFFAOYSA-N methanol prop-2-enoic acid Chemical compound OC.OC.OC(=O)C=C.OC(=O)C=C OTRIMLCPYJAPPD-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000001227 electron beam curing Methods 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 238000012946 outsourcing Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- PSGAAPLEWMOORI-PEINSRQWSA-N medroxyprogesterone acetate Chemical compound C([C@@]12C)CC(=O)C=C1[C@@H](C)C[C@@H]1[C@@H]2CC[C@]2(C)[C@@](OC(C)=O)(C(C)=O)CC[C@H]21 PSGAAPLEWMOORI-PEINSRQWSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
- C08F283/105—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule on to unsaturated polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The invention provides a light-cured resin for wind power, which is suitable for the rapid curing of a glass fiber pultruded plate, ensures that the fatigue performance after the combination with glass fibers is excellent, improves the production efficiency of manufacturing blades by using the glass fiber pultruded plate, and effectively reduces the cost. It includes: epoxy acrylate; modified epoxy acrylate; component A, specifically at least one of isobornyl acrylate or tricyclodecane dimethanol diacrylate; a component B, wherein the component B is at least one of tripropylene glycol diacrylate or dipropylene glycol diacrylate; a photoinitiator 819; component C, which is specifically at least one of a photoinitiator 651 or a photoinitiator 1173.
Description
Technical Field
The invention relates to the technical field of wind power blade manufacturing, in particular to a light-cured resin for wind power, and further provides a preparation method of the light-cured resin for wind power.
Background
A resin system mainly used for wind power generation is epoxy resin, in order to meet the design requirement of a large-size blade, a conventional wind power blade manufacturer uses a carbon fiber and glass fiber pultrusion plate to replace a traditionally used glass fiber unidirectional fabric, and the excellent performance of the pultrusion plate is generally accepted by wind power blade manufacturing enterprises. The production of pultruded panels with epoxy resins is currently used in many applications, however, the production speed is far slower than that of unsaturated polyesters, which contain styrene, which can cause serious environmental pollution.
The existing light-cured resin in the existing market is not provided with a corresponding product for blade adhesion in the field of wind power, and the existing light-cured resin only considers static mechanical properties but not fatigue properties after being combined with glass fibers, so that the existing light-cured resin cannot be applied to wind power blades.
At present, a plurality of wind power blade manufacturing enterprises have blade design tests for replacing traditional glass fiber unidirectional fabrics with glass fiber pultruded panels, however, the reason that the market is pushed slowly at present is that the cost of the glass fiber pultruded panels is too high, and the main reason is that the production cost of products is high due to the low production speed of epoxy system pultruded resin in the production process, so that the price of the products exceeds the design requirements of the blade enterprises. In response to this phenomenon, there is a great need for an alternative system of resin to replace the existing pultruded resins of epoxy systems, thereby increasing the production efficiency of pultruded panels of glass fibers.
In the current fiber and resin combined composite material industry, no matter prepreg molding or wet resin molding, the future ideal development direction is the rapid curing cost and the rapid batch production process, based on the consideration of the factors, the existing rapid molding resin curing methods such as UV (ultraviolet curing) and EB (electron beam curing) are comprehensively analyzed, and because EB curing equipment is expensive and the difficulty of developing molding equipment in a matching way, the existing market is mainly UV curing, and the market application is the widest due to the flexible and various curing methods.
Disclosure of Invention
Aiming at the problems, the invention provides the light-cured resin for wind power, which is suitable for the rapid curing of a glass fiber pultruded plate, ensures that the fatigue performance after the resin is combined with the glass fiber is excellent, improves the production efficiency of manufacturing blades by using the glass fiber pultruded plate, and effectively reduces the cost.
Light-cured resin for wind power, characterized in that it comprises:
epoxy acrylate;
modified epoxy acrylate;
component A, specifically at least one of isobornyl acrylate or tricyclodecane dimethanol diacrylate;
a component B, wherein the component B is at least one of tripropylene glycol diacrylate or dipropylene glycol diacrylate;
a photoinitiator 819;
component C, which is specifically at least one of a photoinitiator 651 or a photoinitiator 1173.
It is further characterized in that:
the preferable mixture ratio is as follows according to the mass percentage:
40 to 60 percent of epoxy acrylate;
5 to 20 percent of modified epoxy acrylate;
25-40% of component A;
5-15% of component B;
0.05-0.3% of photoinitiator 819;
0.8 to 4 percent of component C;
the sum of the above components is 100%.
It is further characterized in that:
the epoxy acrylate has the following properties that bisphenol A epoxy acrylate, bifunctional groups and 2-3% of extensibility are adopted, and the viscosity at 25 ℃ is 4000-7000 cps;
the modified epoxy acrylate has the following properties that the modified bisphenol A epoxy acrylate has double functional groups, the extensibility is more than 5 percent, and the viscosity at 25 ℃ is 4000-7000 cps;
when the component C is specifically the photoinitiator 651 and the photoinitiator 1173, the mass percent of the component C is 0.8-4%;
when the component C is a single photoinitiator 651, the mass percent of the component C is 0.8-2%;
when the component C is a single photoinitiator 1173, the mass percent of the component C is 1-2%;
the light-cured resin for wind power has the following overall properties:
the preparation method of the photocuring resin for wind power is characterized by comprising the following specific steps of:
a, placing epoxy acrylate and modified epoxy acrylate in corresponding mass percentage into an oven, heating to 70-80 ℃, and using the epoxy acrylate and modified epoxy acrylate for heating raw materials to reduce viscosity;
b, adding the component A and the component B in corresponding mass percentages into a stirring kettle in sequence, heating the reaction kettle to 70-75 ℃, and keeping the constant temperature of the diluted monomer for 10-15 minutes;
c, sequentially adding the heated epoxy acrylate and the modified epoxy acrylate into the reaction kettle, and starting the stirring blade, wherein the speed of the blade is controlled at 60-70 rpm;
d, after the four components are fully mixed, adding the photoinitiator 819 and the component C into the reaction kettle according to the corresponding mass percent, and stirring for 60-70 minutes at constant temperature;
and e, carrying out qualitative detection on the prepared resin.
By adopting the photocuring resin disclosed by the invention, the epoxy acrylic resin is modified, the toughness of the epoxy acrylic resin is improved, and the brittleness of the epoxy acrylic resin is reduced, so that the defect of poor fatigue performance of the epoxy acrylic resin is overcome, an acrylic diluting monomer with high toughness and high elongation at break is added, the acrylic diluting monomer comprises a component A and a component B, a photoinitiator for deep curing is used, the photoinitiator 819 and a component C comprising a corresponding initiator are used, and the obtained photocuring resin for wind power generation has the following advantages: the defect of poor fatigue performance of epoxy acrylate is overcome; the bonding strength of the light-cured resin and the glass fiber is improved; the curing speed of the product is improved, and the curing speed of the product with the same specification is more than 10 times that of an epoxy system; the infiltration difficulty of the subsequent composite material forming process is reduced.
Detailed Description
The light-cured resin for wind power comprises the following components in percentage by mass:
40 to 60 percent of epoxy acrylate;
5 to 20 percent of modified epoxy acrylate;
25 to 40 percent of component A, wherein the component A is at least one of isobornyl acrylate or tricyclodecane dimethanol diacrylate;
5-15% of component B, wherein the component B is at least one of tripropylene glycol diacrylate or dipropylene glycol diacrylate;
0.05-0.3% of photoinitiator 819;
0.8% -4% of component C, wherein the component C is at least one of a photoinitiator 651 or a photoinitiator 1173;
the sum of the above components is 100%.
In the specific implementation process, when the component C is specifically the photoinitiator 651 and the photoinitiator 1173, the mass percent of the component C is 0.8-4%;
when the component C is a single photoinitiator 651, the mass percent of the component C is 0.8-2%;
when the component C is a single photoinitiator 651 or a single photoinitiator 1173, the mass percentage of the component C is 1-2%.
The epoxy acrylate has the following properties that bisphenol A epoxy acrylate, bifunctional groups and 2-3% of extensibility are obtained, the viscosity at 25 ℃ is 4000-7000 cps, and the epoxy acrylate is obtained through synthesis production or outsourcing;
the modified epoxy acrylate has the following properties that the modified bisphenol A epoxy acrylate has double functional groups, the elongation is more than 5 percent, the viscosity at 25 ℃ is 4000-7000 cps, and the modified bisphenol A epoxy acrylate is obtained by synthesis production or outsourcing;
the overall performance of the light-cured resin for wind power is as follows:
the curing speed of the light-cured resin is very high, the composite material with the thickness of 5mm can be cured only in 10ms, the light-cured resin is mainly epoxy acrylate, the price is low, and no volatile gas exists in the using process. And the overall performance of the resin can be changed by changing different components and proportions, so that the fatigue performance of the light-cured resin can meet the requirements of customers.
The preparation method of the photocuring resin for wind power comprises the following specific steps:
a, placing epoxy acrylate and modified epoxy acrylate in corresponding mass percentage into an oven, heating to 70-80 ℃, and using the epoxy acrylate and modified epoxy acrylate for heating raw materials to reduce viscosity;
b, adding the component A and the component B in corresponding mass percentages into a stirring kettle in sequence, heating the reaction kettle to 70-75 ℃, and keeping the constant temperature of the diluted monomer for 10-15 minutes;
c, sequentially adding the heated epoxy acrylate and the modified epoxy acrylate into the reaction kettle, and starting the stirring blade, wherein the speed of the blade is controlled at 60-70 rpm;
d, after the four components are fully mixed, adding the photoinitiator 819 and the component C into the reaction kettle according to the corresponding mass percent, and stirring for 60-70 minutes at constant temperature;
and e, carrying out qualitative detection on the prepared resin.
In the first embodiment, the formula of the raw materials in percentage by mass is as follows:
name (R) | Ratio (%) |
Epoxy acrylate | 53 |
Modified epoxy acrylate | 7 |
Dicyclodecane dimethanol diacrylate | 25 |
Tripropylene glycol diacrylate | 13 |
Photoinitiator 819 | 0.2 |
Photoinitiator 651 | 0.8 |
Photoinitiator 1173 | 1 |
Preparing raw materials in corresponding parts according to a mass backup ratio, wherein the preparation method comprises the following steps:
a, taking 53 parts of epoxy acrylate and 7 parts of modified epoxy acrylate, and heating the epoxy acrylate and the modified epoxy acrylate in an oven to 70-80 ℃ for heating raw materials to reduce viscosity;
b, adding 25 parts of tricyclodecane dimethanol diacrylate and 13 parts of tripropylene glycol diacrylate into a stirring kettle in a front-back sequence, heating the reaction kettle to 70-75 ℃, and keeping the constant temperature of the diluted monomer for 10-15 minutes;
c, sequentially adding the heated epoxy acrylate and the modified epoxy acrylate into the reaction kettle, and starting the stirring blade, wherein the speed of the blade is controlled at 60-70 rpm;
d, after the four components are fully mixed, adding 819, 651 and 1173 into the reaction kettle according to corresponding proportions, and stirring for 60-70 minutes under the constant temperature condition;
and e, carrying out qualitative detection on the prepared resin.
The properties are as follows:
in the second embodiment, the formula of the raw materials in percentage by mass is as follows:
name (R) | Ratio (%) |
Epoxy acrylate | 53 |
Modified epoxy acrylate | 7 |
Acrylic acid isobornyl ester | 30 |
Tripropylene glycol diacrylate | 8 |
Photoinitiator 819 | 0.2 |
Photoinitiator 651 | 0.8 |
Photoinitiator 1173 | 1 |
The properties are as follows:
in the third concrete embodiment, the formula of the raw materials in percentage by mass is as follows:
name (R) | Ratio (%) |
Epoxy acrylate | 53 |
Modified epoxy acrylate | 7 |
Dicyclodecane dimethanol diacrylate | 25 |
Tripropylene glycol diacrylate | 13 |
Photoinitiator 819 | 0.2 |
Photoinitiator 1173 | 1.8 |
The properties are as follows:
in the fourth specific embodiment, the formula of the raw materials in percentage by mass is as follows:
name (R) | Ratio (%) |
Epoxy acrylate | 53 |
Modified epoxy acrylate | 7 |
Acrylic acid isobornyl ester | 30 |
Tripropylene glycol diacrylate | 13 |
Photoinitiator 819 | 0.2 |
Photoinitiator 1173 | 1.8 |
The properties are as follows:
in the fifth concrete embodiment, the formula of the raw materials in percentage by mass is as follows:
name (R) | Ratio (%) |
Epoxy acrylate | 40 |
Modified epoxy acrylate | 20 |
Dicyclodecane dimethanol diacrylate | 25 |
Dipropylene glycol diacrylate | 13 |
Photoinitiator 819 | 0.2 |
Photoinitiator 651 | 1.8 |
Photoinitiator 1173 | 1 |
The properties are as follows:
in the sixth embodiment, the formula of the raw materials in percentage by mass is as follows:
the properties are as follows:
the concrete embodiment seven comprises the following raw materials in percentage by mass:
the properties are as follows:
in the specific embodiment eight, the formula of the raw materials in percentage by mass is as follows:
name (R) | Ratio (%) |
Epoxy acrylate | 40 |
Modified epoxy acrylate | 20 |
Acrylic acid isobornyl ester | 30 |
Dipropylene glycol diacrylate | 8 |
Photoinitiator 819 | 0.2 |
Photoinitiator1173 | 1.8 |
The properties are as follows:
in the ninth embodiment, the formula of the raw materials in percentage by mass is as follows:
name (R) | Ratio (%) |
Epoxy acrylate | 53 |
Modified epoxy acrylate | 7 |
Acrylic acid isobornyl ester | 15 |
Dicyclodecane dimethanol diacrylate | 10 |
Tripropylene glycol diacrylate | 8 |
Dipropylene glycol diacrylate | 5 |
Photoinitiator 819 | 0.2 |
Photoinitiator 651 | 0.8 |
Photoinitiator 1173 | 1 |
The properties are as follows:
the preparation methods of the second to ninth embodiments are similar to those of the first embodiment, and are not repeated.
The specific chemical composition of the initiator herein is as follows:
the photoinitiator 819 is an acylphosphine oxide photoinitiator, and is chemically named phenyl bis (2, 4, 6-trimethylbenzoyl) phosphine oxide;
the photoinitiator 651 is also called benzil dimethyl ether, has a chemical name of a, a-dimethoxy-a-phenylacetophenone, is called DMPA for short, and has a structural formula of C6H5COC (OCH3)2C6H5 and a molecular weight of 256.30. White or light yellow crystals, relative density 1.1278. The melting point is 64-67 ℃;
the chemical name of the photoinitiator 1173 is 2-hydroxy-2-methyl-1-phenyl-1-acetone, called HMPP for short. The structural formula is C6H5COC (CH3)2OH, and the molecular weight is 164.20. Colorless or yellowish transparent liquid. The boiling point is 102-103 ℃ (0.53 kPa). Dissolved in toluene, acrylates, methacrylates, and the like. Easy to be mixed with resin, high initiation efficiency, good thermal stability, no yellowing phenomenon and stable storage. The ultraviolet light absorption wavelength is 260-360 nm.
The photocuring resin is used for modifying epoxy acrylic resin, improving the toughness of the photocuring resin and reducing the brittleness of the photocuring resin, so that the defect of poor fatigue performance of the epoxy acrylic resin is overcome, an acrylic diluting monomer with high toughness and high elongation at break is added, the acrylic diluting monomer comprises a component A and a component B, a deep-curing photoinitiator is used, the photoinitiator 819 and a component C comprising a corresponding initiator are included, and the obtained photocuring resin for wind power generation has the following advantages:
1, the defect of poor fatigue performance of epoxy acrylate is overcome;
2, improving the bonding strength of the light-cured resin and the glass fiber;
3, the curing speed of the product is improved, and the product with the same specification is more than 10 times of the curing speed of an epoxy system;
4, the infiltration difficulty of the subsequent composite material forming process is reduced.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. Light-cured resin for wind power, characterized in that it comprises:
epoxy acrylate;
modified epoxy acrylate;
component A, specifically at least one of isobornyl acrylate or tricyclodecane dimethanol diacrylate;
a component B, wherein the component B is at least one of tripropylene glycol diacrylate or dipropylene glycol diacrylate;
a photoinitiator 819;
component C, which is specifically at least one of a photoinitiator 651 or a photoinitiator 1173.
2. The light-cured resin for wind power generation as claimed in claim 1, wherein the preferable mixture ratio is as follows by mass percent:
40 to 60 percent of epoxy acrylate;
5 to 20 percent of modified epoxy acrylate;
25-40% of component A;
5-15% of component B;
0.05-0.3% of photoinitiator 819;
0.8 to 4 percent of component C;
the sum of the above components is 100%.
3. The light-curable resin for wind power generation as defined in claim 1, wherein: the epoxy acrylate has the following properties that bisphenol A epoxy acrylate, bifunctional groups and 2-3% of extensibility are adopted, and the viscosity at 25 ℃ is 4000-7000 cps.
4. The light-curable resin for wind power generation as defined in claim 1, wherein: the modified epoxy acrylate has the following properties that the modified bisphenol A epoxy acrylate has double functional groups, the extensibility is more than 5 percent, and the viscosity at 25 ℃ is 4000-7000 cps.
5. The light-curable resin for wind power generation as defined in claim 2, wherein: when the component C is specifically the photoinitiator 651 and the photoinitiator 1173, the mass percentage of the component C is 0.8-4%.
6. The light-curable resin for wind power generation as defined in claim 2, wherein: when the component C is a single photoinitiator 651, the mass percentage of the component C is 0.8-2%.
7. The light-curable resin for wind power generation as defined in claim 2, wherein: when the component C is a single photoinitiator 1173, the mass percent of the component C is 1-2%.
8. The light-cured resin for wind power generation as claimed in claim 4, wherein the overall properties of the light-cured resin for wind power generation are as follows:
the viscosity at 25 ℃ is 1000 to 1500 cps; the tensile strength is more than or equal to 40 MPa; the transverse tensile strength of the glass fiber resin combined with a compatible system is more than or equal to 30 MPa; tg in a DMA test is more than or equal to 80 ℃; fatigue performance R under wind power tension and compression fatigue test is-1; m is more than or equal to 10 in the S-N curve.
9. The preparation method of the photocuring resin for wind power is characterized by comprising the following specific steps of:
a, placing epoxy acrylate and modified epoxy acrylate in corresponding mass percentage into an oven, heating to 70-80 ℃, and using the epoxy acrylate and modified epoxy acrylate for heating raw materials to reduce viscosity;
b, adding the component A and the component B in corresponding mass percentages into a stirring kettle in sequence, heating the reaction kettle to 70-75 ℃, and keeping the constant temperature of the diluted monomer for 10-15 minutes;
c, sequentially adding the heated epoxy acrylate and the modified epoxy acrylate into the reaction kettle, and starting the stirring blade, wherein the speed of the blade is controlled at 60-70 rpm;
d, after the four components are fully mixed, adding the photoinitiator 819 and the component C into the reaction kettle according to the corresponding mass percent, and stirring for 60-70 minutes at constant temperature;
and e, carrying out qualitative detection on the prepared resin.
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CN115449033A (en) * | 2022-10-14 | 2022-12-09 | 深圳市郎搏万先进材料有限公司 | Photo-thermal dual-curing system resin and preparation method and application thereof |
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