CN113369674A - Parallel laser processing system - Google Patents
Parallel laser processing system Download PDFInfo
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- CN113369674A CN113369674A CN202110736990.5A CN202110736990A CN113369674A CN 113369674 A CN113369674 A CN 113369674A CN 202110736990 A CN202110736990 A CN 202110736990A CN 113369674 A CN113369674 A CN 113369674A
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- internal reflection
- total internal
- spatial light
- light modulator
- reflection prism
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention is suitable for the laser processing field, and discloses a parallel laser processing system, which comprises a laser, a beam expander, a half-wave plate, a total internal reflection prism system, a spatial light modulator, a reflector and a scanning processing unit which are sequentially arranged along a light path, wherein the total internal reflection prism system comprises a first total internal reflection prism and a second total internal reflection prism, the binding surface of the first total internal reflection prism and the second total internal reflection prism forms an inclined incident surface, a light beam emitted by the laser is expanded by the beam expander and is incident to the incident surface of the total internal reflection prism system after being deflected by the half-wave plate, and is emitted to the spatial light modulator after being totally reflected at the incident surface, the incident angle between the light beam totally reflected to the spatial light modulator and the spatial light modulator is 0-5 degrees, a diffracted light beam modulated by the spatial light modulator is incident to the reflector through the total internal reflection prism system and is reflected to the scanning processing unit, the system can achieve the purpose of flexibly regulating and controlling the small-angle incident laser beams by using a more simplified light path.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a parallel laser processing system suitable for small-angle incidence.
Background
In laser micromachining application, parallel machining of multiple beams is realized by splitting laser beams, so that the laser machining efficiency can be greatly improved; by shaping the light beam, the processing effect of specific processing can be effectively improved. The parallel laser processing system based on the spatial light modulator can flexibly regulate and control the phase of a light beam, and the characteristics of high processing efficiency and high precision are more and more paid attention and paid attention; different two-dimensional and three-dimensional target light fields can be obtained by loading different algorithm holograms into the system, such as aberration correction, a structured light field, pulse space-time shaping and the like, so that laser processing under various application scenes is realized.
However, due to the performance limitations of the spatial light modulator itself, the current spatial light modulator-based parallel laser processing apparatus or system mainly involves two disadvantages: 1. in the small-angle oblique-incidence system, the light path is long and the system structure is redundant due to the fact that the device structure relates to factors such as light installation and the like; 2. the direct projection system has compact light path, but has the defects of complex structure, multiple optical devices, high cost and the like.
Disclosure of Invention
The invention aims to provide a parallel laser processing system, which aims to solve the technical problems of long optical path and system structure redundancy caused by the fact that the device structure of the existing small-angle oblique incidence system relates to factors such as optical installation and the like.
In order to achieve the purpose, the invention provides the following scheme:
a parallel laser processing system comprises a laser, a beam expander, a half-wave plate, a total internal reflection prism system, a spatial light modulator, a reflector and a scanning processing unit, wherein the laser, the beam expander, the half-wave plate, the total internal reflection prism system, the spatial light modulator, the reflector and the scanning processing unit are sequentially arranged along a light path, the total internal reflection prism system comprises a first total internal reflection prism and a second total internal reflection prism, an attaching surface of the first total internal reflection prism and the second total internal reflection prism forms an inclined incident surface, a light beam emitted by the laser is expanded by the beam expander and is incident to the incident surface of the total internal reflection prism system after being deflected by the half-wave plate, and is totally reflected to the spatial light modulator at the incident surface, the incident angle between the light beam totally reflected to the spatial light modulator and the spatial light modulator is 0-5 degrees, and the light beam modulated by the spatial light modulator sequentially penetrates through the first total internal reflection prism and the second total internal reflection prism And the incidence prism is incident to the reflecting mirror and is reflected to the scanning processing unit through the reflecting mirror.
Preferably, the refractive index of the first TIR prism is defined as n1, and the refractive index of the second TIR prism is defined as n2, wherein 1.4 < n1 < 1.5, 1.4 < n2 < 1.5, and n1 > n 2.
Preferably, the incident angle of the laser beam after being modulated and deflected by the half-wave plate to the total internal reflection prism system is defined as theta, and then theta is larger than or equal to arcsin (n1/n 2).
Preferably, the first TIR prism is 20J/cm or more2@10ns, damage threshold of the second TIR prism being greater than or equal to 20J/cm2@10ns。
Preferably, the first total internal reflection prism and the second total internal reflection prism are all total internal reflection prisms made of fused silica materials.
Preferably, the laser is a fiber femtosecond laser with the wavelength of 1030 nm.
Preferably, the beam expander adopts a 1-8x multiplying power adjustable beam expander, and the damage threshold of the beam expander is more than or equal to 10J/cm2@10ns。
Preferably, the wavelength of the half-wave plate is 1030nm, and the damage threshold value of the half-wave plate is more than or equal to 10J/cm2@10ns。
Preferably, the spatial light modulator adopts a reflective silicon-based liquid crystal spatial light modulator, the applicable waveband of the spatial light modulator is 1000nm-1100nm, and the peak power damage threshold of the spatial light modulator is more than or equal to 50GW/cm2@200fs 100Hz。
Preferably, the scanning processing unit comprises a galvanometer and a field lens, and diffracted light beams emitted from the reflecting mirror pass through the galvanometer and the field lens and then are focused on the surface of a product to be processed to realize the processing of relevant requirements.
The parallel laser processing system provided by the invention effectively combines the spatial light modulator with the total internal reflection prism system, and realizes flexible regulation and control of small-angle incident beams; the parallel laser processing system provided by the invention avoids the method of reflecting the incident beam to the spatial light modulator by using the reflector, and selects the total internal reflection prism system with a compact structure to be matched with the spatial light modulator, so as to realize the purpose of flexibly regulating and controlling the small-angle incident laser beam by using a simpler light path, and reduce part of optical devices on the basis, thereby improving the reliability of the system and reducing the cost.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a side-by-side laser processing system provided by an embodiment of the present invention;
FIG. 2 is a partial schematic view of a prior art parallel laser processing system.
The reference numbers illustrate:
1. a laser; 2. a beam expander; 3. a half-wave plate; 4. a spatial light modulator; 5. a total internal reflection prism system; 51. a first total internal reflection prism; 52. a second total internal reflection prism; 6. a mirror; 7. a galvanometer; 8. a field lens; 9. and (5) products to be processed.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
It will also be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Fig. 1 shows a parallel laser processing system according to an embodiment of the present invention, which is implemented based on a tir prism, and is particularly suitable for a parallel laser processing system with a small angle of beam incidence. As shown in fig. 2, in the existing laser processing system with small-angle light beam incidence, the light beam incident on the spatial light modulator 101 needs to be reflected twice by two reflectors 102 at different angles and positions to enter the spatial light modulator, the positions between the two reflectors and the spatial light modulator occupy a larger space, and the two reflectors are not small in size, and need additional auxiliary parts for supporting when being placed, which results in long light path and redundant system structure. Further, the smaller the incidence angle of the laser beam, the more complicated the optical path structure. Therefore, the parallel laser processing system of the embodiment of the invention adjusts the light path structure, avoids the method of reflecting the incident beam to the spatial light modulator by using a reflector, and adopts the purpose of matching the total internal reflection prism system with a compact structure with the spatial light modulator, so as to realize the flexible regulation and control of the small-angle incident laser beam by using a more simplified light path.
Referring to fig. 1, a parallel laser processing system according to an embodiment of the present invention includes a laser 1, a beam expander 2, a half-wave plate 3, a total internal reflection prism system 5, a spatial light modulator 4, a reflector 6 and a scanning processing unit, which are sequentially disposed along a light path, the total internal reflection prism system 5 includes a first total internal reflection prism 51 and a second total internal reflection prism 52, an engaging surface of the first total internal reflection prism 51 and the second total internal reflection prism 52 forms an inclined incident surface, a light beam emitted by the laser 1 is expanded by the beam expander 2 and is incident on the incident surface of the total internal reflection prism system 5 after being deflected by the half-wave plate 3, and is totally reflected at the incident surface and then emitted to the spatial light modulator 4, an incident angle between the light beam totally reflected to the spatial light modulator 4 and the spatial light modulator 4 is 0-5 degrees, the light beam modulated by the spatial light modulator 4 is sequentially incident on the reflector 6 through the first total internal reflection prism 51 and the second total, and is reflected to a scanning processing unit by a reflecting mirror 6, and the scanning processing unit is used for processing a product 9 to be processed.
It is to be understood that fig. 1 is only a schematic diagram, and in the diagram, the incident angle between the light beam totally reflected to the spatial light modulator 4 and the spatial light modulator is 5 degrees, and the angle between the light beam reflected to the spatial light modulator 4 and the diffracted light beam reflected from the spatial light modulator 4 is 10 degrees.
The parallel laser processing system of the embodiment of the invention effectively combines the spatial light modulator 4 and the total internal reflection prism system 5 to realize flexible regulation and control of small-angle incident beams; in addition, the parallel laser processing system of the embodiment of the invention avoids the method of reflecting the incident beam to the spatial light modulator 4 by the reflector 6, and selects the total internal reflection prism system 5 with a compact structure to be matched with the spatial light modulator, so as to realize the purpose of flexibly regulating and controlling the small-angle incident laser beam by using a more simplified light path, and reduce part of optical devices on the basis, thereby improving the reliability of the system and reducing the cost.
Preferably, the refractive index of the first tir prism 51 is different from that of the second tir prism 52, the refractive index of the first tir prism 51 is defined as n1, and the refractive index of the second tir prism 52 is defined as n2, where n1 is greater than 1.4 and less than 1.5, n2 is greater than 1.4 and less than 1.5, and n1 is greater than n2, for example, when n1 is 1.5, n2 may be 1.4, or may be 1.3, and the refractive index of the first tir prism 51 and the refractive index of the second tir prism 52 are set to different values, which can improve the reflectivity of the tir prism system 5 and achieve the purpose of total reflection as much as possible.
Furthermore, the incident angle of the laser beam after being deflected by the half-wave plate 3 to the incident surface of the total internal reflection prism system 5 is defined as theta, and then theta is larger than or equal to arcsin (n1/n2), and the position of the total internal reflection prism system 5 can be adjusted according to the theta.
Optionally, the damage threshold of each of the first TIR prism 51 and the second TIR prism 52 is greater than or equal to 20J/cm2@10ns, so that the first and second tir prisms 51 and 52 have good laser damage resistance.
Further, the first and second TIR prisms 51 and 52 are fabricated from fused silica material.
Preferably, the laser 1 is a fiber femtosecond laser 1 with the wavelength of 1030nm, which has the advantages of miniaturization, portability, low cost, high stability and the like.
Specifically, the beam expander 2 is used to expand the fine laser beam emitted from the laser 1 into the coarse laser beam required by the spatial light modulator 4.
Optionally, the beam expander 2 is a 1-8x magnification adjustable beam expander 2.
Further, the damage threshold of the beam expander 2 is more than or equal to 10J/cm2@10ns, so that the beam expander 2 has good laser damage resistance.
Specifically, the half-wave plate 3 is used to adjust and polarize the polarization direction of the coarse laser beam expanded by the beam expander 2 to the polarization direction required by the spatial light modulator 4, for example, to adjust the polarization direction of the coarse laser beam expanded by the beam expander 2 to the polarization light which is consistent with the light valve long axis direction of the spatial light modulator 4.
Optionally, the wavelength of the half-wave plate 3 is 1030 nm.
Optionally, the damage threshold of the half-wave plate 3 is greater than or equal to 10J/cm2@10ns, so that the half-wave plate 3 has good laser damage resistance.
In particular, the spatial light modulator 4 is used for controllable phase modulation of an incident light beam (e.g., generating a beam splitting array, beam shaping, etc.).
Optionally, the spatial light modulator 4 is a reflective liquid crystal on silicon spatial light modulator 4 of a pure phase type and having a high damage threshold; the spatial light modulator 4 has the advantages of high energy utilization rate, high diffraction efficiency, high filling factor and the like in the aspect of modulating the light field.
Further, the spatial light modulator 4 is adapted to a wavelength band of 1000nm to 1100 nm.
Further, the peak power damage threshold of the spatial light modulator 4 is 50GW/cm or more2@200fs 100Hz, so that the spatial light modulator 4 has good resistance to laser damage.
Preferably, the reflector 6 is coated with a near infrared light reflection increasing film, so that the reflectivity of the reflector 6 can be improved.
Optionally, the mirror 6 has a high damage threshold, so that the mirror 6 has good resistance to laser damage.
Preferably, the scanning processing unit comprises a galvanometer 7 and a field lens 8, the diffracted light beam emitted from the reflector 6 passes through the galvanometer 7 and the field lens 8 and then is focused on the surface of a product 9 to be processed to realize the processing of relevant requirements, and the product 9 to be processed is arranged at the position of a focal plane of the field lens 8.
Optionally, near-infrared light antireflection films are plated on the surfaces of the galvanometer 7 and the field lens 8, so that reflection of the lens interface can be reduced, and light transmittance can be increased.
Further, the galvanometer 7 and the field lens 8 both have high damage thresholds, so that the galvanometer 7 and the field lens 8 have good laser damage resistance.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A parallel laser processing system is characterized by comprising a laser, a beam expander, a half-wave plate, a total internal reflection prism system, a spatial light modulator, a reflector and a scanning processing unit which are sequentially arranged along a light path, wherein the total internal reflection prism system comprises a first total internal reflection prism and a second total internal reflection prism, the binding surface of the first total internal reflection prism and the second total internal reflection prism forms an inclined incident surface, a light beam emitted by the laser is expanded by the beam expander and is incident to the incident surface of the total internal reflection prism system after being deflected by the half-wave plate, and is emitted to the spatial light modulator after being totally reflected at the incident surface, and the incident angle between the light beam totally reflected to the spatial light modulator and the spatial light modulator is 0-5 degrees, and the diffracted light beams modulated by the spatial light modulator sequentially penetrate through the first total internal reflection prism and the second total internal reflection prism to enter the reflecting mirror, and are reflected to the scanning processing unit through the reflecting mirror.
2. The parallel laser processing system of claim 1, wherein the first tir prism is defined to have a refractive index n1, and the second tir prism is defined to have a refractive index n2, wherein 1.4 < n1 ≦ 1.5, 1.4 ≦ n2 ≦ 1.5, and n1 > n 2.
3. The parallel laser processing system of claim 2, wherein the half-wave plate is used to adjust the incident angle of the laser beam incident on the TIR prism system to theta, which is greater than or equal to arcsin (n1/n 2).
4. The parallel laser processing system of claim 1, wherein the first tir prism is 20J/cm or more2@10ns, damage threshold of the second TIR prism being greater than or equal to 20J/cm2@10ns。
5. The parallel laser processing system of claim 1, wherein the first tir prism and the second tir prism are tir prisms fabricated from fused silica material.
6. The parallel laser processing system of claim 1, wherein the laser is a fiber femtosecond laser with a wavelength of 1030 nm.
7. The parallel laser processing system of claim 1, wherein the beam expander is a 1-8x magnification adjustable beam expander, and a damage threshold of the beam expander is greater than or equal to 10J/cm2@10ns。
8. The parallel laser processing system of claim 1 wherein the half-wave plate has a wavelength of 1030nm and a damage threshold of 10J/cm or greater2@10ns。
9. The parallel laser processing system of claim 1, wherein the spatial light modulator is a reflective liquid crystal on silicon spatial light modulator, and wherein the spatial light modulator is a reflective liquid crystal on silicon spatial light modulatorThe applicable wave band of the spatial light modulator is 1000nm-1100nm, and the peak power damage threshold of the spatial light modulator is more than or equal to 50GW/cm2@200fs 100Hz。
10. The parallel laser processing system of claim 1, wherein the scanning processing unit comprises a galvanometer and a field lens, and diffracted beams emitted from the mirror pass through the galvanometer and the field lens and are focused on the surface of a product to be processed to achieve the processing of the relevant requirements.
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| CN202110736990.5A CN113369674A (en) | 2021-06-30 | 2021-06-30 | Parallel laser processing system |
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| CN202110736990.5A CN113369674A (en) | 2021-06-30 | 2021-06-30 | Parallel laser processing system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117506120A (en) * | 2023-12-25 | 2024-02-06 | 剑芯光电(苏州)有限公司 | Ultrafast laser processing device and use method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117506120A (en) * | 2023-12-25 | 2024-02-06 | 剑芯光电(苏州)有限公司 | Ultrafast laser processing device and use method |
| CN117506120B (en) * | 2023-12-25 | 2024-05-24 | 剑芯光电(苏州)有限公司 | Ultrafast laser processing device and use method |
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