CN113363168A - Packaging structure of wafer layered electromagnetic shielding circuit - Google Patents
Packaging structure of wafer layered electromagnetic shielding circuit Download PDFInfo
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- CN113363168A CN113363168A CN202110632359.0A CN202110632359A CN113363168A CN 113363168 A CN113363168 A CN 113363168A CN 202110632359 A CN202110632359 A CN 202110632359A CN 113363168 A CN113363168 A CN 113363168A
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- frame body
- linkage
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- electromagnetic shielding
- groove
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 22
- 238000005520 cutting process Methods 0.000 claims abstract description 28
- 238000003825 pressing Methods 0.000 claims abstract description 28
- 229920006280 packaging film Polymers 0.000 claims abstract description 18
- 239000012785 packaging film Substances 0.000 claims abstract description 18
- 244000309464 bull Species 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 12
- 238000005457 optimization Methods 0.000 description 9
- 239000012528 membrane Substances 0.000 description 8
- 230000002441 reversible effect Effects 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 4
- 230000001360 synchronised effect Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000010415 tropism Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/143—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis
- B26D1/1435—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis for thin material, e.g. for sheets, strips or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/143—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis
- B26D1/15—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis with vertical cutting member
- B26D1/151—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis with vertical cutting member for thin material, e.g. for sheets, strips or the like
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a packaging structure of a wafer layering electromagnetic shielding circuit, which comprises a fixing frame body, a packaging film, a counterweight pressing block, a connecting frame, a linkage mechanism and a positioning mechanism, wherein an operation cavity is formed in the front surface of the fixing frame body, a bearing plate is sleeved at the bottom of the fixing frame body, a placing groove is formed in the upper surface of the bearing plate, a wafer body is sleeved in the placing groove, the packaging film penetrates through the bottom of the fixing frame body, four cutting blades are arranged on two sides of the counterweight pressing block in an annular equidistant array mode, a reciprocating mechanism is arranged in the connecting frame body, the linkage mechanism is arranged in the operation cavity, and the positioning mechanism is arranged on the back surface of the fixing frame body. The invention has the beneficial effects that: according to the invention, by utilizing the design of the reciprocating mechanism, the support rod can reciprocate in the vertical direction under the action of the reciprocating mechanism, and the action of the return spring is matched, so that the return spring can pull the right pull rope to drive the linkage rotating rod to rotate reversely, and the cutting blade reversely cuts the packaging film for the second time.
Description
Technical Field
The invention relates to a wafer-level packaging structure, in particular to a packaging structure of a wafer layered electromagnetic shielding circuit, and belongs to the technical field of semiconductor packaging.
Background
Along with the rapid development of electronic components, people tend to be miniaturized when producing the electronic components, but the distance between the miniaturized electronic components is relatively short, so an electromagnetic shielding circuit mechanism is often used when wafer-level packaging is carried out on the electronic components, so that the electromagnetic interference between the electronic components is eliminated, and a packaging film is required to be covered after the electromagnetic shielding circuit is installed, so that the electromagnetic interference between the electronic components and adjacent semiconductor materials can be avoided when the electronic components are used.
The packaging mechanism of current wafer level electromagnetic shield circuit need cut the processing when carrying out the cover of encapsulation membrane, but need extrusion processing when the encapsulation membrane covers, thereby encapsulation membrane covers and cuts and needs twice operation side ability to realize, and the encapsulation membrane does not receive outside extrusion when cutting, so cut the sword and probably take the encapsulation membrane perk together, and then there is the bubble between messenger's encapsulation membrane and the electromagnetic shield circuit, it only can once cut the work to the encapsulation membrane to cut the sword simultaneously, and then just lead to partial encapsulation membrane to cut insufficient phenomenon to take place easily, often need carry out the secondary and cut work, the encapsulation process of indirect extension electromagnetic shield circuit.
Disclosure of Invention
The present invention is directed to a package structure of a wafer layered electromagnetic shielding circuit to solve the above problems.
The invention achieves the above purpose through the following technical scheme, and the packaging structure of the wafer layered electromagnetic shielding circuit comprises:
the wafer fixing device comprises a fixing frame body, wherein an operation cavity is formed in the front surface of the fixing frame body, a through hole is formed in the bottom end inside the operation cavity, a bearing plate is sleeved at the bottom of the fixing frame body, a placing groove corresponding to the through hole is formed in the upper surface of the bearing plate, and a wafer body is sleeved inside the placing groove;
the packaging film penetrates through the bottom of the fixed frame body and is arranged above the wafer body;
the counterweight pressing block is arranged inside the operation cavity, and four cutting blades are arranged on two sides of the counterweight pressing block in an annular equidistant array;
the connecting frame is fixedly arranged on the upper surface of the fixed frame body, a reciprocating mechanism is arranged inside the connecting frame, and the reciprocating mechanism drives the counterweight pressing block to reciprocate up and down;
the linkage mechanism is arranged inside the operation cavity;
and the positioning mechanism is arranged on the back surface of the fixed frame body.
Preferably, the annular has been seted up to the bottom of counter weight briquetting, the inside cover of annular is equipped with four carrier bars, four the equal thread bush in one side of carrier bar bottom is equipped with the set screw, just the set screw runs through cutting blade's top.
Preferably, two guide grooves, two are seted up to the inside of annular the inside of guide groove all is equipped with four guide posts, eight the relative one end of guide post is located fixed connection with the axle center at four carrier bars both ends respectively.
Preferably, reciprocating mechanism includes driving motor, linkage frame, latch, semi-gear and initiative bull stick, driving motor fixed mounting is in one side of link frame, the inside of link frame is located to the linkage frame cover, the latch sets up to two sets of, and is two sets of latch symmetry fixed connection is in the inside both sides of linkage frame, the semi-gear sets up in the inside of linkage frame, one side of semi-gear axle center department is passed through the bearing and is connected with the internal rotation of link frame, the opposite side fixed connection of initiative bull stick and semi-gear axle center department, the one end through connection frame one side of initiative bull stick and with driving motor's output fixed connection.
Preferably, the inside of operation chamber is provided with the connecting rod with linkage frame bottom end fixed connection, the annular cavity has been seted up to the inside of connecting rod, the inside cover of annular cavity is equipped with the linkage bull stick, the linkage bull stick runs through the upper surface of counter weight briquetting.
Preferably, the inside of counter weight briquetting is seted up with the circular slot of one of them guide way intercommunication, the inside cover of circular slot is equipped with the cross bar, the middle part of cross bar upper surface and the bottom fixed connection of linkage bull stick, the avris of cross bar lower surface respectively with the top fixed connection of four guide posts among them.
Preferably, the link gear includes left stay cord, lug, right stay cord, supporting shoe and reset spring, the inside one side of fixed framework is located to the left stay cord cover, the one end of left stay cord and one side fixed connection of bracing piece, the side fixed connection of lug and linkage bull stick, the right stay cord runs through one side of operation intracavity wall, the right stay cord with the relative one end of left stay cord respectively with the both sides fixed connection of lug, the supporting shoe sets up in the inside of fixed framework, reset spring fixed mounting is in the inside of fixed framework, just reset spring's one end and one side fixed connection of supporting shoe.
Preferably, two limiting grooves are formed in the fixing frame body, and the two limiting grooves are respectively sleeved on the outer sides of the two end portions of the supporting block.
Preferably, one side of the lower surface of the bearing plate is fixedly connected with a sliding block, an inner cavity at the bottom of the fixed frame body is provided with a sliding groove which is sleeved outside the sliding block, a pull rod is inserted in the middle of the bearing plate in a penetrating manner, and one side of the bearing plate is provided with a handle fixedly connected with one end of the pull rod.
Preferably, positioning mechanism includes return spring, the spacing lantern ring, extension groove, driven plate, joint groove, joint piece and transverse groove, return spring fixed mounting is in the inside of loading board, the spacing lantern ring rotates and cup joints in the outside of pull rod, just one side of the spacing lantern ring and return spring's one end fixed connection, the extension groove is seted up in the inside of loading board, just the extension groove cup joints in the outside of the spacing lantern ring, the driven plate sets up in the back of fixed framework, just one side of driven plate and the one end fixed connection of pull rod, the joint groove is seted up in the back of fixed framework, joint piece fixed connection is in one side of driven plate, just joint piece and joint groove mutually support, the transverse groove is seted up in the back of fixed framework, transverse groove and driven plate correspond each other.
The invention has the beneficial effects that: firstly, the invention utilizes the design of the linkage mechanism, when the linkage frame moves downwards, the counterweight pressing block can be automatically pressed above the wafer body under the self gravity, at the moment, the linkage frame can still continuously descend, and the linkage rotating rod is fixed at the moment, so that the supporting rod can continuously slide downwards along the outer wall of the linkage rotating rod, thereby driving the left pull rope to pull the linkage rotating rod, enabling the linkage rotating rod to automatically rotate, and finally realizing the cutting of the packaging film by the cutting blade.
Secondly, the invention utilizes the design of the reciprocating mechanism, the support rod can carry out reciprocating motion in the vertical direction under the action of the reciprocating mechanism, and then the action of the reset spring is matched, when the support rod rises, the reset spring can pull the right pull rope, and the right pull rope pulls the linkage rotating rod to rotate reversely, so that the cutting blade reversely carries out secondary cutting on the packaging film, and the packaging film covered on the wafer body is cut more fully.
Thirdly, the design of the balance weight pressing block and the linkage rotating rod is utilized, the balance weight pressing block can independently descend under the self gravity while the linkage frame descends, the linkage rotating rod is limited by the supporting rod, the balance weight pressing block cannot apply a vertical extrusion force to the wafer body, the wafer body can be protected from being damaged due to impact, the linkage rotating rod rotates inside the balance weight pressing block, and the balance weight pressing block cannot be separated from the upper surface of the wafer body when the packaging film is cut, so that the packaging film cannot be tilted in the cutting process.
The design of the limiting lantern ring is utilized, the limiting lantern ring is used for rotatably connecting the pull rod and the bearing plate together, so that the bearing plate and the pull rod can synchronously enter and exit from the inside of the fixed frame body, the pull rod cannot be hindered by the bearing plate when rotating, the bearing plate can be correspondingly fixed in the fixed frame body after the pull rod is fixed, workers can press or rotate the handle in the whole process, and the novel telescopic handle fixing device has good convenience.
Fifthly, the design of the positioning mechanism is utilized, the positioning mechanism can fix the bearing plate inserted into the fixed frame, so that the wafer body in the placing groove can be aligned with the counterweight pressing block, the counterweight pressing block can pass through the through hole and be completely attached above the wafer body, the cutting blade can rotate around the side of the wafer body during cutting, and the outer surface of the wafer body can be completely packaged.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the ring groove of the present invention;
FIG. 3 is a schematic view of the overall front view internal cross-section of the present invention;
FIG. 4 is an enlarged view of the structure at A in FIG. 3 according to the present invention;
FIG. 5 is an enlarged view of the structure at B in FIG. 3 according to the present invention;
FIG. 6 is a schematic view of the internal structure of the connection frame according to the present invention;
FIG. 7 is a schematic cross-sectional view of the connection between the fixing frame and the carrier plate according to the present invention;
FIG. 8 is an enlarged view of the structure of FIG. 7 at C according to the present invention;
FIG. 9 is a schematic view of the back structure of the fixing frame of the present invention;
FIG. 10 is an enlarged view of the structure shown in FIG. 9 at D according to the present invention.
In the figure: 1. fixing the frame body; 2. an operating chamber; 3. a through hole; 4. a carrier plate; 5. a handle; 6. a placement groove; 7. a wafer body; 8. packaging the film; 9. a counterweight pressing block; 10. a cutting blade; 11. fixing screws; 12. a ring groove; 13. a carrier bar; 14. a guide groove; 15. a guide post; 16. a cross bar; 17. a linkage rotating rod; 18. a support bar; 19. an annular cavity; 20. a connecting frame; 21. a drive motor; 22. a linkage frame; 23. clamping teeth; 24. a half gear; 25. an active rotating rod; 26. a connecting rod; 27. a left pull rope; 28. a bump; 29. a right pull rope; 30. a support block; 31. a return spring; 32. a limiting groove; 33. a pull rod; 34. a chute; 35. a slider; 36. a return spring; 37. a limiting lantern ring; 38. an extension groove; 39. a driven plate; 40. a clamping groove; 41. a clamping block; 42. a transverse groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-10, a packaging structure of a wafer layered electromagnetic shielding circuit includes a fixing frame 1, the fixing frame 1 is an existing alloy frame, an operation cavity 2 is formed in a front surface of the fixing frame 1, an opening of the operation cavity 2 is convenient for a worker to observe a packaging condition of a wafer body 7 in real time, a through hole 3 is formed in a bottom end inside the operation cavity 2, a bearing plate 4 is sleeved at a bottom of the fixing frame 1, a placing groove 6 corresponding to the through hole 3 is formed in an upper surface of the bearing plate 4, the wafer body 7 is sleeved inside the placing groove 6, and an outer diameter of the wafer body 7 is matched with an inner diameter of the through hole 3;
the packaging film 8 penetrates through the bottom of the fixing frame body 1, the packaging film 8 is arranged above the wafer body 7, and the electromagnetic shielding circuit can be packaged after the packaging film 8 covers the wafer body 7;
the counterweight pressing block 9 is arranged inside the operation cavity 2, four cutting blades 10 are arranged on two sides of the counterweight pressing block 9 in an annular equidistant array, included angles among the four cutting blades 10 are all ninety degrees, and the movement of the four cutting blades 10 is synchronous;
connecting frame 20, connecting frame 20 fixed mounting is in the upper surface of fixed frame body 1, the inside of connecting frame 20 is provided with reciprocating mechanism, connecting frame 20 provides a fore-and-aft restriction for reciprocating mechanism, with this guarantee that reciprocating mechanism can only carry out the motion of vertical direction, reciprocating mechanism drives counter weight briquetting 9 reciprocating motion from top to bottom, counter weight briquetting 9's stroke is less than reciprocating mechanism's one-way stroke, and then counter weight briquetting 9 compresses tightly encapsulation film 8 behind wafer body 7's top, reciprocating mechanism still can continue the one end distance that descends, when this supplementary follow-up cutting work goes on, the laminating that encapsulation film 8 can be stable is in wafer body 7's top.
As a technical optimization scheme of the invention, referring to fig. 2, fig. 3 and fig. 4, a ring groove 12 is formed at the bottom of a counterweight pressing block 9, four bearing rods 13 are sleeved inside the ring groove 12, the bearing rods 13 are processed into a cylinder shape, and the outer walls of the bearing rods 13 and the inner wall of the ring groove 12 are processed into smooth surfaces, so that the bearing rods 13 can more smoothly rotate along the inside of the ring groove 12;
further, the equal thread bush in one side of four carrier bars 13 bottoms is equipped with set screw 11, and set screw 11 runs through cutting blade 10's top, and set screw 11 is used for fixing cutting blade 10 in carrier bars 13's the outside to set screw 11 is convenient for dismantle, makes things convenient for the staff to carry out real-time change to cutting blade 10.
As a technical optimization scheme of the invention, referring to fig. 2 and fig. 3, two guide grooves 14 are formed in the annular groove 12, the guide grooves 14 are annular, four guide posts 15 are sleeved in the two guide grooves 14, the guide posts 15 can only perform circular motion under the limitation of the guide grooves 14, opposite ends of the eight guide posts 15 are respectively and fixedly connected with the axes of two ends of four bearing rods 13, each bearing rod 13 is provided with two guide posts 15, and the bearing rods 13 are more stable when rotating along the annular groove 12, so that the cutting blade 10 can stably cut the packaging film 8.
As a technical optimization scheme of the present invention, referring to fig. 1, fig. 3 and fig. 6, the reciprocating mechanism includes a driving motor 21, a linkage frame 22, latches 23, a half gear 24 and a driving rotating rod 25, the driving motor 21 is fixedly installed at one side of the connection frame 20, the driving motor 21 is electrically connected to an external power source through an external switch, the linkage frame 22 is sleeved inside the connection frame 20, the latches 23 are provided in two groups, the two groups of latches 23 are symmetrically and fixedly connected to two sides inside the linkage frame 22, the half gear 24 is arranged inside the linkage frame 22, and one end of the driving rotating rod 25 penetrates through one side of the connection frame 20 and is fixedly connected to an output end of the driving motor 21;
furthermore, one side of the axle center of the half gear 24 is rotatably connected with the inside of the connecting frame 20 through a bearing, the half gear 24 is fixedly connected with the inner ring of the bearing, the inside of the connecting frame 20 is fixedly connected with the outer ring of the bearing, the driving rotating rod 25 is fixedly connected with the other side of the axle center of the half gear 24, the driving rotating rod 25 and the half gear 24 rotate synchronously, and the half gear 24 does not move eccentrically;
furthermore, when the half gear 24 is engaged with one of the latch teeth 23 and rotates one hundred eighty degrees, the other latch tooth 23 is engaged, and the other latch tooth 23 can drive the linkage frame 22 to move in the direction opposite to the previous direction, and the linkage frame 22 is restricted by the connection frame 20, so that the reciprocating movement of the linkage frame 22 in the vertical direction can be realized.
As a technical optimization scheme of the invention, referring to fig. 3, a connecting rod 26 fixedly connected with the bottom end of the linkage frame 22 is arranged inside the operation cavity 2, an annular cavity 19 is formed inside the connecting rod 26, a linkage rotating rod 17 is sleeved inside the annular cavity 19, the cross section of the linkage rotating rod 17 is in a T shape, the T-shaped end of the linkage rotating rod 17 is located inside the annular cavity 19, the T-shaped end of the linkage rotating rod 17 can also rotate inside the annular cavity 19, and the linkage rotating rod 17 penetrates through the upper surface of the counterweight pressing block 9.
As a technical optimization scheme of the invention, referring to fig. 3, a circular groove communicated with one of the guide grooves 14 is formed in the counterweight pressing block 9, a cross rod 16 is sleeved in the circular groove, the middle of the upper surface of the cross rod 16 is fixedly connected with the bottom end of a linkage rotating rod 17, the cross rod 16 and the linkage rotating rod 17 always have synchronous tropism in moving or rotating, the side of the lower surface of the cross rod 16 is fixedly connected with the top ends of four of the guide posts 15, the cross rod 16 can synchronously drive the four of the guide posts 15 to rotate along the inside of one of the guide grooves 14, so that the four bearing rods 13 synchronously move along the inside of the ring groove 12, and finally, the synchronous operation of the four cutting blades 10 can be realized.
As a technical optimization scheme of the invention, referring to fig. 2, fig. 3 and fig. 5, a linkage mechanism is arranged in the operation cavity 2 and can drive a linkage rotating rod 17 to rotate through the linkage mechanism;
further, the linkage mechanism comprises a left pull rope 27, a convex block 28, a right pull rope 29, a supporting block 30 and a return spring 31, the left pull rope 27 is sleeved on one side inside the fixed frame 1, one end of the left pull rope 27 is fixedly connected with one side of the supporting rod 18, the convex block 28 is fixedly connected with the side surface of the linkage rotating rod 17, the right pull rope 29 penetrates through one side of the inner wall of the operation cavity 2, the supporting block 30 is arranged inside the fixed frame 1, the return spring 31 is fixedly arranged inside the fixed frame 1, one end of the return spring 31 is fixedly connected with one side of the supporting block 30, the return spring 31 is in an initial extending state, the supporting block 30 is always pulled by the return spring 31, and similarly, the right pull rope 29 is always pulled by the supporting block 30;
furthermore, the right rope 29 and the left rope 27 do not have elasticity, the opposite ends of the right rope 29 and the left rope 27 are respectively fixedly connected with the two sides of the lug 28, the right rope 29 and the left rope 27 can also be processed into an integrally formed structure, but the contact part of the lug 28 and the rope must be fixedly connected, so that the linkage rotating rod 17 can synchronously rotate along with the ropes;
according to the above structure, the support bar 18 is initially lowered, and simultaneously, both end portions of the left pulling rope 27 are simultaneously lowered, so that the interlocking rotating bar 17 is not pulled by the left pulling rope 27 to rotate, and similarly, the right pulling rope 29 is lowered and simultaneously pulled by the return spring 31, so that the stress of the protrusion 28 is balanced, and the interlocking rotating bar 17 is further prevented from rotating.
As a technical optimization scheme of the present invention, two limiting grooves 32 are formed in the fixing frame 1, the two limiting grooves 32 are respectively sleeved outside the two end portions of the supporting block 30, the limiting grooves 32 can limit the moving range of the supporting block 30, prevent the reset spring 31 from extending too much to generate irreversible deformation, and prevent the reset spring 31 from driving the supporting block 30 to move excessively when resetting, so as to balance the stress on the two sides of the bump 28.
As a technical optimization scheme of the invention, one side of the lower surface of the bearing plate 4 is fixedly connected with a sliding block 35, an inner cavity at the bottom of the fixed frame body 1 is provided with a sliding groove 34 sleeved outside the sliding block 35, the sliding block 35 slides along the inner part of the sliding groove 34, so that the bearing plate 4 has directivity in movement, a pull rod 33 is inserted in the middle of the bearing plate 4, the outer wall of the pull rod 33 is processed into a rough shape, so that the friction force between the bearing plate 4 and the pull rod 33 can be increased, one side of the bearing plate 4 is provided with a handle 5 fixedly connected with one end of the pull rod 33, the handle 5 can be set into any shape, and the drawing is only shown by a player.
As a technical optimization scheme of the invention, referring to fig. 7-10, the positioning mechanism is arranged on the back of the fixed frame 1, the positioning mechanism comprises a return spring 36, a limiting collar 37, an extending groove 38, a driven plate 39, a clamping groove 40, a clamping block 41 and a transverse groove 42, the return spring 36 is fixedly arranged in the bearing plate 4, the limiting collar 37 is rotatably sleeved on the outer side of the pull rod 33, the extending groove 38 is arranged in the bearing plate 4, the driven plate 39 is arranged on the back of the fixed frame 1, the clamping groove 40 is arranged on the back of the fixed frame 1, the clamping block 41 is fixedly connected to one side of the driven plate 39, the clamping block 41 is matched with the clamping groove 40, and the transverse groove 42 is arranged on the back of the fixed frame 1;
furthermore, one side of a limiting collar 37 is fixedly connected with one end of a return spring 36, an extension groove 38 is sleeved outside the limiting collar 37, the limiting collar 37 rotatably connects the pull rod 33 and the bearing plate 4 together, and the pull rod 33 can drive the limiting collar 37 to move a certain distance in the extension groove 38 under the action of the extension groove 38;
furthermore, one side of the driven plate 39 is fixedly connected with one end of the pull rod 33, the transverse groove 42 corresponds to the driven plate 39, the driven plate 39 and the pull rod 33 have synchronism, after the driven plate 39 rotates along with the pull rod 33, the driven plate 39 drives the clamping block 41 to synchronously rotate, and then the driven plate 39 can drive the clamping block 41 to be clamped into the clamping groove 40 under the action of the return spring 36, so that the pull rod 33 can be limited, and similarly, after the driven plate 39 rotates to correspond to the port of the transverse groove 42, the pull rod 33 can transversely move in the fixed frame 1.
When the handle 5 is pressed and rotated by a worker, the handle 5 drives the pull rod 33 to move towards the outer side of the fixed frame 1, the pull rod 33 drives the driven plate 39 to move synchronously, the driven plate 39 drives the clamping block 41 to move towards the outer part of the clamping groove 40, when the clamping block 41 is completely separated from the inner part of the clamping groove 40, the worker rotates the handle 5, the handle 5 drives the pull rod 33 to rotate, and the pull rod 33, the driven plate 39 and the clamping block 41 rotate synchronously.
After driven plate 39 aligns with the inside of horizontal slot 42, the staff removes the outside application force of handle 5, then the staff drags handle 5 to the outside of fixed frame 1, handle 5 pulls pull rod 33 synchronous motion, pull rod 33 drives spacing lantern ring 37 and slides along the inside of extending groove 38, after spacing lantern ring 37 hugs closely with the inner wall of extending groove 38, spacing lantern ring 37 extrudes loading board 4, loading board 4 drives slider 35 and slides to the outside of fixed frame 1 along spout 34, finally loading board 4 drives standing groove 6 from the inside roll-off of fixed frame 1.
After the loading board 4 takes out, the staff will treat the inside that the wafer body 7 of encapsulation placed standing groove 6, then reverse promotion handle 5, handle 5 drives pull rod 33 and the reverse motion of the spacing lantern ring 37, the tensile return spring 36 of the spacing lantern ring 37, then the spacing lantern ring 37 extrudes loading board 4, and loading board 4 drives the inside reverse slip of slider 35 along spout 34, enters into the inside of fixed frame body 1 completely until loading board 4.
After loading board 4 got into the inside of fixed frame 1, the staff pressed handle 5 and exerted the revolving force, and then the pull rod 33 of crossing in handle 5 area rotates along the inside of spacing lantern ring 37, pull rod 33 drives driven plate 39 and rotates in step, driven plate 39 drives joint piece 41 and rotates, after joint piece 41 rotates to the mutual parallel and level with the port department of joint groove 40, the staff removes the additional effort of handle 5, return spring 36 kick-backs this moment, return spring 36 drives spacing lantern ring 37 and slides in the inside of extending groove 38, spacing lantern ring 37 extrusion pull rod 33 reverse movement, pull rod 33 drives driven plate 39 and removes to the direction that is close to fixed frame 1, final driven plate 39 drives the inside that joint piece 41 block got into joint groove 40, and then loading board 4 just is fixed in the inside of fixed frame 1.
After the position of wafer body 7 is confirmed, the staff first operates driving motor 21, driving motor 21's output drives initiative bull stick 25 and rotates, initiative bull stick 25 drives half gear 24 and rotates, half gear 24 can mesh latch 23 when rotating, and then latch 23 drives linkage frame 22 and removes, and half gear 24 just can mesh latch 23 once in reverse direction for every hundred eighty degrees of rotation, and then make the reciprocating motion of linkage frame 22 in the inside vertical direction of connection frame 20.
When the linkage frame 22 descends, the linkage frame 22 drives the connecting rod 26 to move towards the inside of the operation cavity 2, the connecting rod 26 drives the supporting rod 18 to descend, the balance weight pressing block 9 descends synchronously under the gravity of the balance weight pressing block at the moment until the balance weight pressing block 9 is completely pressed above the wafer body 7, at the moment, the connecting rod 26 can continue to drive the supporting rod 18 to descend, and the supporting rod 18 drives the annular cavity 19 to slide downwards along the outer wall of the linkage rotating rod 17.
When the supporting rod 18 continues to slide downwards, the position of the linkage rotating rod 17 is fixed, and then the supporting rod 18 continues to descend by pulling one end of the left pulling rope 27, the left pulling rope 27 applies a pulling force to the bump 28, and then the bump 28 drives the linkage rotating rod 17 to rotate, the linkage rotating rod 17 drives the cross rod 16 to rotate in the circular groove, the cross rod 16 drives the guide post 15 to rotate along the inside of the guide groove 14, the guide post 15 drives the bearing rod 13 to rotate along the inside of the circular groove 12, and finally the bearing rod 13 can drive the cutting blade 10 to cut the packaging film 8 above the wafer body 7.
When the lug 28 drives the linkage rotating rod 17 to rotate, the lug 28 also pulls the right pull rope 29, the right pull rope 29 pulls the supporting block 30 to slide along the inner part of the limiting groove 32, and the supporting block 30 pulls the return spring 31 to continue to extend and accumulate force.
When the half gear 24 rotates one hundred eighty degrees and then engages the latch 23 and drives the linkage frame 22 to ascend, the connecting rod 26 first drives the supporting rod 18 to slide upwards along the outside of the linkage rotating rod 17, and then the traction force of the left pulling rope 27 gradually disappears, the return spring 31 rebounds and pulls the right pulling rope 29 at the moment, the right pulling rope 29 provides a reverse pulling force for the bump 28, and then the bump 28 drives the linkage rotating rod 17 to reversely rotate, so that the cross rod 16, the guide post 15, the bearing rod 13 and the cutting blade 10 all reversely rotate, and then the cutting blade 10 can perform secondary cutting processing on the packaging film 8.
After the supporting rod 18 drives the annular cavity 19 to be tightly attached to the end portion of the linkage rotating rod 17, the linkage rotating rod 17 is subjected to upward traction force, the linkage rotating rod 17 can drive the cross rod 16 to upwards extrude the counterweight pressing block 9, the counterweight pressing block 9 is forced to upwards move, finally the counterweight pressing block 9 can be moved away from the upper portion of the wafer body 7, finally the driving motor 21 stops running, the steps are repeated to take out the bearing plate 4, and finally the packaged wafer body 7 is taken out from the interior of the placing groove 6.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. The packaging structure of the wafer layered electromagnetic shielding circuit is characterized in that: the method comprises the following steps:
the wafer fixing device comprises a fixing frame body (1), wherein an operation cavity (2) is formed in the front face of the fixing frame body (1), a through hole (3) is formed in the bottom end inside the operation cavity (2), a bearing plate (4) is sleeved at the bottom of the fixing frame body (1), a placing groove (6) corresponding to the through hole (3) is formed in the upper surface of the bearing plate (4), and a wafer body (7) is sleeved inside the placing groove (6);
the packaging film (8) penetrates through the bottom of the fixing frame body (1), and the packaging film (8) is arranged above the wafer body (7);
the balance weight pressing block (9) is arranged inside the operation cavity (2), and four cutting blades (10) are arranged on two sides of the balance weight pressing block (9) in an annular equidistant array;
the connecting frame (20) is fixedly arranged on the upper surface of the fixed frame body (1), a reciprocating mechanism is arranged inside the connecting frame (20), and the reciprocating mechanism drives the counterweight pressing block (9) to reciprocate up and down;
a linkage mechanism arranged inside the operating chamber (2);
and the positioning mechanism is arranged on the back surface of the fixed frame body (1).
2. The wafer layering electromagnetic shielding circuit packaging structure of claim 1, wherein: annular (12) have been seted up to the bottom of counter weight briquetting (9), the inside cover of annular (12) is equipped with four carrier bars (13), four the equal thread bush in one side of carrier bar (13) bottom is equipped with fixed screw (11), just fixed screw (11) run through the top of cutting blade (10).
3. The wafer layering electromagnetic shielding circuit packaging structure of claim 2, wherein: two guide way (14), two have been seted up to the inside of annular (12) the inside of guide way (14) all is equipped with four guide post (15), eight the one end that guide post (15) is relative is located fixed connection with the axle center at four carrier bar (13) both ends respectively.
4. The wafer layering electromagnetic shielding circuit packaging structure of claim 1, wherein: reciprocating mechanism includes driving motor (21), linkage frame (22), latch (23), half gear (24) and initiative bull stick (25), driving motor (21) fixed mounting is in one side of connection frame (20), the inside of connection frame (20) is located to linkage frame (22) cover, latch (23) set up to two sets of, two sets of latch (23) symmetry fixed connection is in the inside both sides of linkage frame (22), half gear (24) set up in the inside of linkage frame (22), the inside rotation that bearing and connection frame (20) were passed through to one side of half gear (24) axle center department is connected, the opposite side fixed connection of initiative bull stick (25) and half gear (24) axle center department, the one end of initiative bull stick (25) run through one side of connection frame (20) and with the output fixed connection of driving motor (21).
5. The wafer layering electromagnetic shielding circuit packaging structure of claim 1, wherein: the inside of operation chamber (2) is provided with connecting rod (26) with linkage frame (22) bottom fixed connection, toroidal cavity (19) have been seted up to the inside of connecting rod (26), the inside cover of toroidal cavity (19) is equipped with linkage bull stick (17), the upper surface of counter weight briquetting (9) is run through in linkage bull stick (17).
6. The wafer layering electromagnetic shielding circuit packaging structure of claim 1, wherein: the inside of counter weight briquetting (9) is seted up with the circular slot of one of them guide way (14) intercommunication each other, the inside cover of circular slot is equipped with cross bar (16), the bottom fixed connection of the middle part of cross bar (16) upper surface and linkage bull stick (17), the avris of cross bar (16) lower surface respectively with the top fixed connection of wherein four guide posts (15).
7. The wafer layering electromagnetic shielding circuit packaging structure of claim 1, wherein: the linkage mechanism comprises a left pull rope (27), a convex block (28), a right pull rope (29), a supporting block (30) and a reset spring (31), wherein the left pull rope (27) is sleeved on one side of the inside of the fixed frame body (1), one end of the left pull rope (27) is fixedly connected with one side of the supporting rod (18), the convex block (28) is fixedly connected with the side face of the linkage rotating rod (17), the right pull rope (29) penetrates through one side of the inner wall of the operation cavity (2), one end, opposite to the left pull rope (27), of the right pull rope (29) is fixedly connected with the two sides of the convex block (28) respectively, the supporting block (30) is arranged inside the fixed frame body (1), the reset spring (31) is fixedly installed inside the fixed frame body (1), and one end of the reset spring (31) is fixedly connected with one side of the supporting block (30).
8. The wafer layering electromagnetic shielding circuit packaging structure of claim 1, wherein: two limiting grooves (32) are formed in the fixing frame body (1), and the limiting grooves (32) are respectively sleeved on the outer sides of two end portions of the supporting block (30).
9. The wafer layering electromagnetic shielding circuit packaging structure of claim 1, wherein: one side fixedly connected with slider (35) of loading board (4) lower surface, spout (34) in the slider (35) outside of cup jointing are seted up to the inner chamber of fixed frame body (1) bottom, pull rod (33) have been alternate in the middle part of loading board (4), one side of loading board (4) is provided with handle (5) with pull rod (33) one end fixed connection.
10. The wafer layering electromagnetic shielding circuit packaging structure of claim 1, wherein: the positioning mechanism comprises a return spring (36), a limiting sleeve ring (37), an extension groove (38), a driven plate (39), a clamping groove (40), a clamping block (41) and a transverse groove (42), the return spring (36) is fixedly installed inside the bearing plate (4), the limiting sleeve ring (37) is rotatably sleeved on the outer side of the pull rod (33), one side of the limiting sleeve ring (37) is fixedly connected with one end of the return spring (36), the extension groove (38) is arranged inside the bearing plate (4), the extension groove (38) is sleeved on the outer side of the limiting sleeve ring (37), the driven plate (39) is arranged on the back of the fixed frame body (1), one side of the driven plate (39) is fixedly connected with one end of the pull rod (33), the clamping groove (40) is arranged on the back of the fixed frame body (1), the clamping block (41) is fixedly connected with one side of the driven plate (39), and the clamping block (41) is matched with the clamping groove (40), the transverse groove (42) is arranged on the back surface of the fixed frame body (1), and the transverse groove (42) corresponds to the driven plate (39).
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| CN202110632359.0A CN113363168B (en) | 2021-06-07 | 2021-06-07 | Packaging structure of wafer layered electromagnetic shielding circuit |
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| CN202828235U (en) * | 2012-07-16 | 2013-03-27 | 北京和利康源医疗科技有限公司 | Film cutting device |
| CN209533488U (en) * | 2019-01-24 | 2019-10-25 | 广西交通科学研究院有限公司 | A kind of excision forming auxiliary device of bitumen mixture specimen |
| CN211967620U (en) * | 2020-05-02 | 2020-11-20 | 王晓亮 | Device is cut to polymer resin barrier film with waste recovery function |
| CN112476547A (en) * | 2020-09-17 | 2021-03-12 | 桑枫(温州)信息科技发展有限公司 | PVC (polyvinyl chloride) stable cutting device for semiconductor new material production |
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2021
- 2021-06-07 CN CN202110632359.0A patent/CN113363168B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202828235U (en) * | 2012-07-16 | 2013-03-27 | 北京和利康源医疗科技有限公司 | Film cutting device |
| CN209533488U (en) * | 2019-01-24 | 2019-10-25 | 广西交通科学研究院有限公司 | A kind of excision forming auxiliary device of bitumen mixture specimen |
| CN211967620U (en) * | 2020-05-02 | 2020-11-20 | 王晓亮 | Device is cut to polymer resin barrier film with waste recovery function |
| CN112476547A (en) * | 2020-09-17 | 2021-03-12 | 桑枫(温州)信息科技发展有限公司 | PVC (polyvinyl chloride) stable cutting device for semiconductor new material production |
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